Display substrate, preparation method thereof and display device

Abstract

A display substrate is provided, comprising: a substrate; a plurality of light-emitting devices arranged in an array on the substrate, each light-emitting device including a first electrode portion located on the substrate, a light-emitting functional portion located on the side of the first electrode portion away from the substrate, and a second electrode portion located on the side of the light-emitting functional portion away from the substrate; a plurality of partition portions located on the substrate, with at least one partition portion between adjacent light-emitting devices; wherein the display substrate further includes at least one second electrode overlap portion located between the partition portion and the substrate, the orthographic projection of the second electrode overlap portion on the substrate covering the orthographic projection of the partition portion on the substrate, and adjacent second electrode portions being electrically connected through the second electrode overlap portion.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display substrate, a method for preparing the substrate, and a display device. Background Technology

[0002] With the continuous development of display technology, organic light-emitting diode (OLED) display devices have become a research hotspot and technological development direction for major manufacturers due to their advantages such as wide color gamut, high contrast, thin and light design, self-illumination, and wide viewing angle.

[0003] The information disclosed in this section is only for understanding the background of the inventive concept of this disclosure, and therefore may include information that does not constitute prior art. Summary of the Invention

[0004] In one aspect, a display substrate is provided, comprising:

[0005] Substrate;

[0006] A plurality of light-emitting devices are arranged in an array on the substrate. Each light-emitting device includes a first electrode portion located on the substrate, a light-emitting functional portion located on the side of the first electrode portion away from the substrate, and a second electrode portion located on the side of the light-emitting functional portion away from the substrate.

[0007] Multiple partitions are provided, the partitions being located on the substrate, and at least one partition is provided between two adjacent light-emitting devices;

[0008] The display substrate further includes at least one second electrode overlap portion, which is located between the partition portion and the substrate. The orthographic projection of the second electrode overlap portion on the substrate covers the orthographic projection of the partition portion on the substrate. Two adjacent second electrode portions are electrically connected through the second electrode overlap portion.

[0009] According to some exemplary embodiments, the display substrate further includes a pixel defining layer located between the first electrode portion and the light-emitting functional portion, the pixel defining layer including an opening that exposes at least a portion of the first electrode portion, and the light-emitting functional portion being connected to the first electrode portion through the opening;

[0010] The second electrode overlap portion is located between the partition portion and the pixel defining layer, and the orthographic projection of the second electrode overlap portion on the substrate is located within the orthographic projection of the pixel defining layer on the substrate.

[0011] According to some exemplary embodiments, the orthographic projection of the second electrode overlaps with the orthographic projection of the first electrode on the substrate.

[0012] According to some exemplary embodiments, the material of the second electrode overlap portion is different from the material of the partition portion.

[0013] According to some exemplary embodiments, the partition portion includes a first partition portion and a second partition portion located on the side of the first partition portion near the substrate, wherein the material of the first partition portion includes an insulating material, and the material of the second partition portion includes an insulating material and / or a conductive material;

[0014] The material of the second electrode overlap portion is different from the material of the second partition portion.

[0015] According to some exemplary embodiments, the material of the second electrode overlap is selected from at least one of metallic conductive materials and metallic oxide conductive materials.

[0016] According to some exemplary embodiments, the second electrode overlap includes a side surface and a plane, the extension surface of the side surface intersects the substrate, and the plane is the surface of the second electrode overlap away from the substrate.

[0017] Wherein, at least a portion of the side surface of the second electrode portion is directly connected to the second electrode overlap portion; and / or

[0018] At least a portion of the plane of the second electrode portion is directly connected to the second electrode overlap portion.

[0019] According to some exemplary embodiments, the light-emitting functional part has a break located on the side of the second electrode overlap, the break exposing a portion of the side of the second electrode overlap, and the second electrode part is electrically connected to the second electrode overlap through the break.

[0020] According to some exemplary embodiments, the edge of the orthogonal projection of the second electrode portion on the substrate is located within the edge of the orthogonal projection of the light-emitting functional portion on the substrate.

[0021] According to some exemplary embodiments, the material of the second partition portion is selected from transparent insulating material and transparent conductive material, and the material of the second electrode overlap portion is selected from transparent conductive material.

[0022] According to some exemplary embodiments, the material of the second partition portion is selected from a transparent conductive material, the material of the second electrode overlap portion is selected from a transparent conductive material, and the materials of the second partition portion and the second electrode overlap portion are different.

[0023] According to some exemplary embodiments, the material of the second partition portion is selected from a transparent conductive material, the material of the second electrode overlap portion is selected from a metallic material, and the thickness of the second electrode overlap portion is less than or equal to one-fifth of the thickness of the second partition portion.

[0024] According to some exemplary embodiments, the transparent conductive material includes indium tin oxide, indium gallium zinc oxide, indium zinc oxide, and zinc aluminum oxide.

[0025] According to some exemplary embodiments, the second partition portion includes a first partition sub-part located on the side of the first partition portion near the substrate and a second partition sub-part located on the side of the first partition sub-part near the substrate, wherein the orthographic projection of the second partition sub-part on the substrate is located within the orthographic projection of the first partition sub-part on the substrate.

[0026] According to some exemplary embodiments, the orthographic projection of the second partition portion on the substrate is located within the orthographic projection of the first partition portion on the substrate.

[0027] In another aspect, a display device is provided, including the aforementioned display substrate.

[0028] In another aspect, a method for preparing a display substrate is provided, the method comprising:

[0029] Multiple first electrode portions are formed on the substrate.

[0030] A pixel defining layer is formed on the side of the plurality of first electrode portions away from the substrate, wherein the pixel defining layer includes a plurality of openings, the plurality of openings respectively exposing at least a portion of the plurality of first electrode portions;

[0031] A plurality of second electrode overlap portions are formed on the side of the pixel defining layer away from the substrate.

[0032] A plurality of partition portions are formed on the side of the plurality of second electrode overlap portions away from the substrate, wherein at least one partition portion is provided between two adjacent openings;

[0033] Under the cover of an open photomask, a light-emitting functional film and a second electrode film are formed on the side of the plurality of partitions away from the substrate using a vapor deposition process; and

[0034] A patterning process is performed on the light-emitting functional film layer and the second electrode film layer to form multiple light-emitting functional parts and multiple second electrode parts.

[0035] Wherein, the orthographic projection of the second electrode overlap portion on the substrate covers the orthographic projection of the partition portion on the substrate, and two adjacent second electrode portions are electrically connected through the second electrode overlap portion.

[0036] According to some exemplary embodiments, forming a plurality of partition portions includes:

[0037] A plurality of second partition portions are formed on the side of the plurality of second electrode overlap portions away from the substrate; and

[0038] A plurality of first partitions are formed on the side of the plurality of second partitions away from the substrate, wherein the orthographic projection of the second partition on the substrate is located within the orthographic projection of the first partition on the substrate.

[0039] According to some exemplary embodiments, forming a plurality of partition portions includes:

[0040] A plurality of second partition portions are formed on the side of the plurality of second electrode overlap portions away from the substrate. Each second partition portion includes a third partition sub-part formed on the side of the second electrode overlap portion away from the substrate, a second partition sub-part formed on the side of the third partition sub-part away from the substrate, and a first partition sub-part formed on the side of the second partition sub-part away from the substrate. The orthographic projection of the second partition sub-part on the substrate lies within the orthographic projection of the first partition sub-part on the substrate.

[0041] A plurality of first partition portions are formed on the side of the plurality of second partition portions away from the substrate. Attached Figure Description

[0042] Other objects and advantages of this disclosure will become apparent from the following description of the disclosure with reference to the accompanying drawings, and will help to provide a comprehensive understanding of the disclosure.

[0043] Figure 1 A schematic cross-sectional view of a display substrate in the related art is shown.

[0044] Figure 2 A schematic plan view of a display substrate according to an embodiment of the present disclosure is shown.

[0045] Figure 3 Schematic illustration along Figure 2 A schematic diagram of a cross-section taken by line AA' in the diagram.

[0046] Figure 4 schematically shown Figure 3 A magnified view of the central region C1.

[0047] Figure 5 Schematic illustration along Figure 2 Another schematic diagram of a cross section taken by line AA' in the diagram.

[0048] Figure 6 Schematic illustration along Figure 2 Another schematic diagram of a cross section taken by line AA' in the diagram.

[0049] Figure 7 A flowchart illustrating a method for fabricating a display substrate according to an embodiment of the present disclosure is shown schematically.

[0050] Figures 8A-8K A schematic diagram illustrating the formation process of a display substrate according to some embodiments of the present disclosure is shown.

[0051] Figures 9A-9K The diagram schematically illustrates the formation process of a display substrate according to other embodiments of the present disclosure.

[0052] It should be noted that, for clarity, the dimensions of layers, structures, or regions in the accompanying drawings used to describe embodiments of this disclosure may be enlarged or reduced; that is, these drawings are not drawn to actual scale. Detailed Implementation

[0053] In the following description, numerous specific details are set forth for illustrative purposes to provide a comprehensive understanding of various exemplary embodiments. However, it will be apparent that various exemplary embodiments may be implemented without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and apparatuses are shown in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. Furthermore, the various exemplary embodiments may be different, but not necessarily exclusive. For example, specific shapes, configurations, and characteristics of exemplary embodiments may be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0054] In the accompanying drawings, the dimensions and relative dimensions of the elements may be enlarged for clarity and / or descriptive purposes. Thus, the dimensions and relative dimensions of the individual elements are not necessarily limited to those shown in the drawings. When exemplary embodiments can be implemented differently, the specific process sequence may be performed differently than the order described. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of description. Furthermore, the same reference numerals denote the same elements.

[0055] When an element is described as being "on" another element, "connected to" another element, or "attached to" another element, the element may be directly on, directly connected to, or directly attached to the other element, or there may be intermediate elements present. However, when an element is described as being "directly on" another element, "directly connected to" another element, or "directly attached to" another element, there are no intermediate elements. Other terms and / or expressions used to describe relationships between elements should be interpreted in a similar manner, such as "between" versus "directly between," "adjacent" versus "directly adjacent," or "on" versus "directly on," etc. Furthermore, the term "connection" can refer to a physical connection, an electrical connection, a communication connection, and / or a fluid connection. Additionally, the X-axis, Y-axis, and Z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z such as XYZ, XY, YZ, and XZ. As used herein, the term “and / or” includes any and all combinations of one or more of the listed related items.

[0056] It should be understood that although the terms first, second, etc., may be used herein to describe different elements, these elements should not be limited by these terms. These terms are merely used to distinguish one element from another. For example, without departing from the scope of the exemplary embodiments, a first element may be named a second element, and similarly, a second element may be named a first element.

[0057] Currently, as mobile phone products demand increasingly higher pixel aperture ratios, the existing evaporation method using high-precision metal masks (FMMs) is insufficient to meet the requirements for high aperture ratios. Against this backdrop, a new generation of evaporation technology that uses organic light-emitting materials for full-surface evaporation and then patterns the film layer formed by the full-surface evaporation through photolithography and etching processes helps to achieve higher aperture ratio requirements.

[0058] Figure 1 A schematic cross-sectional view of a display substrate in the related art is shown. (Refer to...) Figure 1The display substrate includes a substrate 100, a first electrode portion 210, a pixel defining layer 500, a partition portion 300, an organic light-emitting portion 220, and a second electrode portion 230. The first electrode portion 210 is located on the substrate 100, and the pixel defining layer 500 is located on the side of the first electrode portion 210 away from the substrate 100. The pixel defining layer 500 has an opening exposing at least a portion of the first electrode portion 210. The partition portion 300 is located on the side of the pixel defining layer 500 away from the substrate, and includes a first partition portion 310 and a second partition portion 320 located between the first partition portion 310 and the pixel defining layer 500. The second partition portion 320 includes a first partition sub-part 321 located on the side of the first partition portion 310 near the substrate 100, a second partition sub-part 322 located on the side of the first partition sub-part 321 near the substrate 100, and a third partition sub-part 323 located on the side of the second partition sub-part 322 near the substrate 100. The orthographic projection of the second partition sub-part 322 on the substrate 100 lies within the orthographic projection of the first partition sub-part 321 on the substrate 100, and the orthographic projection of the second partition sub-part 322 on the substrate 100 lies within the orthographic projection of the third partition sub-part 323 on the substrate 100. The organic light-emitting part 220 is located on the side of the first electrode part 210 away from the substrate 100, and the second electrode part 230 is located on the side of the organic light-emitting part 220 away from the substrate 100. The first electrode part 210, the organic light-emitting part 220, and the second electrode part 230 constitute a light-emitting device EL.

[0059] In the fabrication process of this display substrate, a partition portion 300 is formed first, followed by an organic light-emitting portion 220 and a second electrode portion 230. By controlling the evaporation angle of the evaporation source for the organic light-emitting portion 220 and the evaporation angle of the evaporation source for the second electrode portion 230, adjacent organic light-emitting portions 220 are completely isolated by the partition portion 300 to improve the crosstalk problem of adjacent light-emitting devices (EL devices), while also ensuring that the second electrode portion 230 and the second partition portion 322 overlap. In this display substrate, the edge of the second partition portion 322 is concave compared to the edges of the first partition portion 321 and the first partition portion 310. Precise control of the evaporation angle of the evaporation source for the second electrode portion 230 is required to achieve the overlap between the second electrode portion 230 and the second partition portion 322. However, research and verification have shown that the stability of the overlap between the second electrode portion 230 and the second partition portion 322 is poor when the vapor deposition angle is controlled alone. That is, it is difficult to ensure that each second electrode portion 230 overlaps with the adjacent second partition portion 322, so that a continuous overlap structure cannot be formed on the whole surface. As a result, the uniformity of the second power signal in different second electrode portions 230 is low, which will eventually affect the uniformity of the display brightness of the display substrate.

[0060] Figure 2 A schematic plan view of a display substrate according to an embodiment of the present disclosure is shown. Figure 3 Schematic illustration along Figure 2 A schematic diagram of a cross-section taken by line AA' in the diagram.

[0061] Reference Figure 2 The display substrate includes a substrate 100 and a plurality of light-emitting devices (ELs), with an array of ELs arranged on the substrate 100. For example, the plurality of light-emitting devices (ELs) includes a plurality of first light-emitting devices (EL1), a plurality of second light-emitting devices (EL2), and a third light-emitting device (EL3). The first light-emitting devices (EL1) are configured to emit red light, the second light-emitting devices (EL2) are configured to emit green light, and the third light-emitting devices (EL3) are configured to emit blue light, thereby enabling the display substrate to display color images. Figure 2 The diagram schematically illustrates an arrangement of a first light-emitting device EL1, a second light-emitting device EL2, and a third light-emitting device EL3, but the embodiments disclosed herein are not limited thereto.

[0062] Reference Figure 3 The light-emitting device EL includes a first electrode portion 210, a light-emitting functional portion 220, and a second electrode portion 230. The first electrode portion 210 is located on the substrate 100, the light-emitting functional portion 220 is located on the side of the first electrode portion 210 away from the substrate 100, and the second electrode portion 230 is located on the side of the light-emitting functional portion 220 away from the substrate 100.

[0063] Reference Figure 3 The display substrate also includes a plurality of partition portions 300 located on the substrate 100, with at least one partition portion 300 between two adjacent light-emitting devices (ELs). Specifically, the light-emitting functional structures in two adjacent light-emitting devices (ELs) are partitioned into two light-emitting functional portions 220 by at least one partition portion 300, thereby cutting off the lateral leakage current transmission path between the light-emitting functional structures of the two adjacent light-emitting devices (ELs) and effectively improving the crosstalk problem between the two adjacent light-emitting devices (ELs). Similarly, the second electrode structures in two adjacent light-emitting devices (ELs) are partitioned into two second electrode portions 230 by at least one partition portion 300. That is, the light-emitting functional portions and second electrode portions in two adjacent light-emitting devices (ELs) are both partitioned by partition portions 300, making each light-emitting device (EL) independent of the others.

[0064] Reference Figure 3The display substrate further includes at least one second electrode overlap portion 400, which is located between the partition portion 300 and the substrate 100. The orthographic projection of the second electrode overlap portion 400 on the substrate 100 covers the orthographic projection of the partition portion 300 on the substrate 100. Two adjacent second electrode portions 230 are electrically connected through the second electrode overlap portion 400. With this configuration, the second electrode portions 230 that are separated by the partition portion 300 are reconnected electrically through the second electrode overlap portion 400, that is, a plurality of second electrode portions 230 arranged at intervals are electrically connected into a whole by a plurality of second electrode overlap portions 400. On the other hand, since the orthographic projection of the second electrode overlap portion 400 on the substrate 100 covers the orthographic projection of the partition portion 300 on the substrate 100, that is, the edge of the second electrode overlap portion 400 protrudes outward from the edge of the partition portion 300, the electrical connection between the second electrode portion 230 and the second electrode overlap portion 400 can be achieved without precisely controlling the vapor deposition angle when the second electrode portion 230 is formed by vapor deposition. This ensures the success rate of the overlap between the second electrode portion 230 and the second electrode overlap portion 400, thereby helping to improve the uniformity of the second power signal in different second electrode portions 230, and thus improving the uniformity of the display brightness of the display substrate.

[0065] According to some exemplary embodiments, the substrate can be a rigid substrate, such as a glass substrate or a silicon substrate, or it can be formed of a flexible material with excellent heat resistance and durability, such as polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), polyethylene, polyacrylate, polyaryl compounds, polyetherimide, polyethersulfone, polyethylene glycol terephthalate (PET), polyethylene (PE), polypropylene (PP), polysulfone (PSF), polymethyl methacrylate (PMMA), cellulose triacetate (TAC), cyclic olefin polymers (COP), and cyclic olefin copolymers (COC). However, the embodiments disclosed herein are not limited in this respect.

[0066] According to some exemplary embodiments, the light-emitting device can specifically be an organic light-emitting diode (OLED). For example, the light-emitting device can be a top-emitting OLED, which can emit red, green, blue, or white light, etc. For example, the light-emitting device is a micro OLED. The embodiments of this disclosure do not limit the specific structure of the light-emitting device. For example, the first electrode portion of the light-emitting device is the anode of the OLED, and the second electrode portion is the cathode of the OLED.

[0067] According to some exemplary embodiments, the light-emitting device can be a tandem organic light-emitting diode (OLED) device. A tandem OLED device is formed by stacking and connecting multiple individual OLED light-emitting structures in series with one or more charge-generating layers. A tandem OLED device can contain two, three, or more light-emitting structures. The number of light-emitting structures is closely related to the efficiency and lifespan of the tandem OLED device. Through stacking technology, the efficiency of OLED devices can be further improved, which is beneficial for achieving high-brightness displays in OLED panels and also for extending the lifespan of OLED display panels.

[0068] According to some exemplary embodiments, the light-emitting device can be a single-layer organic light-emitting diode device, and the light-emitting functional part can include a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer stacked together.

[0069] According to some exemplary embodiments, refer to Figure 3 The display substrate also includes a pixel defining layer 500 located between the first electrode portion 210 and the light-emitting functional portion 220. The pixel defining layer 500 includes an opening KK that exposes at least a portion of the first electrode portion 210, and the light-emitting functional portion 220 is connected to the first electrode portion 210 through the opening KK. A second electrode overlapping portion 400 is located between the partition portion 300 and the pixel defining layer 500, and the orthographic projection of the second electrode overlapping portion 400 on the substrate 100 lies within the orthographic projection of the pixel defining layer 500 on the substrate. This is to prevent display defects caused by short circuits between the second electrode overlapping portion 400 and the first electrode portion 210.

[0070] According to some illustrative embodiments, the pixel delimiting layer is composed of inorganic materials. Compared to pixel delimiting layers composed of organic materials, pixel delimiting layers composed of inorganic materials have higher fabrication precision and are better able to meet the requirements of high resolution.

[0071] According to some illustrative embodiments, the pixel defining layer is made of a light-transmitting inorganic material, such as silicon nitride and silicon oxide, to meet the transmittance requirements of the display substrate.

[0072] According to some exemplary embodiments, refer to Figure 3 The orthographic projection of the second electrode overlap portion 400 on the substrate 100 overlaps with the orthographic projection of the first electrode portion 210 on the substrate 100. That is, the edge of the second electrode overlap portion 400 protrudes a certain distance from the edge of the partition portion 300 to ensure the success rate of the overlap between the second electrode portion 230 and the second electrode overlap portion 400.

[0073] According to some exemplary embodiments, refer to Figure 3The second electrode overlap 400 includes a side surface 400a and a plane 400b. The extended surface of the side surface 400a intersects with the substrate 100, and the plane 400b is the surface of the second electrode overlap 400 away from the substrate 100. The second electrode portion 230 can be electrically connected to at least a portion of the side surface 400a of the second electrode overlap 400, or the second electrode portion 230 can be electrically connected to at least a portion of the plane 400b of the second electrode overlap 400, or the second electrode portion 230 can be electrically connected to at least a portion of both the plane 400b and the side surface 400a of the second electrode overlap 400. Here, "direct connection" should be understood as at least a portion of the surface of one structure being in direct contact with at least a portion of the surface of another structure.

[0074] Figure 4 schematically shown Figure 3 A magnified view of the central region C1.

[0075] According to some exemplary embodiments, in conjunction with reference to Figure 3 and Figure 4 The light-emitting functional part 220 is thinner, for example, the thickness of the light-emitting functional part 220 is less than the thickness of the second electrode overlap part 400. The light-emitting functional part 220 cannot completely cover the side surface 400a of the second electrode overlap part 400. The light-emitting functional part 220 will form a break 220a on the side surface 400a of the second electrode overlap part 400. The break 220a exposes a part of the side surface 400a of the second electrode overlap part 400. The second electrode part 230 is electrically connected to the side surface 400a of the second electrode overlap part 400 through the break 220a.

[0076] According to some exemplary embodiments, refer to Figure 3 The edge of the orthographic projection of the second electrode portion 230 on the substrate 100 is located within the edge of the orthographic projection of the light-emitting functional portion 220 on the substrate 100, that is, the orthographic projection of the second electrode portion 230 on the substrate 100 is located within the area defined by the edge of the orthographic projection of the light-emitting functional portion 220 on the substrate 100. Since the second electrode portion 230 is already connected to the side surface 400a of the two-electrode overlap portion 400 through the break 220a of the light-emitting functional portion 220, it is no longer necessary to precisely control the vapor deposition angle when forming the second electrode portion 230 so that the edge of the second electrode portion 230 extends beyond the edge of the light-emitting functional portion 220, greatly reducing the difficulty of adjusting the vapor deposition angle of the second electrode portion 230.

[0077] According to some exemplary embodiments, refer to Figure 3In the fabrication process of the display substrate, a second electrode overlap portion 400 is first formed, and then a partition portion 300 is formed on the side of the second electrode overlap portion 400 away from the substrate 100. The fabrication process of the partition portion 300 may include a thin film deposition process, an exposure process, and an etching process. In order to avoid the second electrode overlap portion 400 being etched and damaged during the etching process of the partition portion 300, the material of the second electrode overlap portion 400 and the material of the partition portion 300 are set to be different materials, so that the second electrode overlap portion 400 and the partition portion 300 have a high etching selectivity ratio, and the second electrode overlap portion 400 is basically not etched and damaged when the partition portion 300 is etched and formed.

[0078] According to some exemplary embodiments, refer to Figure 3 The partition portion 300 includes a first partition portion 310 and a second partition portion 320 located on the side of the first partition portion 310 near the substrate 100. The material of the first partition portion 310 includes an insulating material, and the material of the second partition portion 320 includes an insulating material and / or a conductive material. By setting the material of the second electrode contact portion to be different from the material of the connected second partition portion, it can be substantially ensured that the second electrode contact portion 400 will not be etched and damaged during the etching process of the partition portion 300.

[0079] According to some exemplary embodiments, the material of the second electrode overlap is selected from at least one of a metallic conductive material and a metal oxide conductive material to meet the conductivity requirements of the second electrode overlap.

[0080] According to some exemplary embodiments, refer to Figure 3 The second partition portion 320 includes a first partition sub-part 321 located on the side of the first partition portion 310 near the substrate 100, a second partition sub-part 322 located on the side of the first partition sub-part 321 near the substrate 100, and a third partition sub-part 323 located on the side of the second partition sub-part 322 near the substrate 100. The orthographic projection of the second partition sub-part 322 on the substrate 100 lies within the orthographic projection of the first partition sub-part 321 on the substrate 100, and the orthographic projection of the second partition sub-part 322 on the substrate 100 lies within the orthographic projection of the third partition sub-part 323 on the substrate 100. That is, the edge of the first partition sub-part 321 protrudes beyond the edge of the second partition sub-part 322, and the first partition sub-part 321 and the second partition sub-part 322 form an undercut structure for separating the light-emitting functional part 220 of the adjacent light-emitting device from the second electrode part 230.

[0081] According to some exemplary embodiments, refer to Figure 3The orthographic projection of the first partition portion 310 on the substrate 100 is substantially coincident with the orthographic projection of the first partition sub-part 321 on the substrate 100. The orthographic projection of the first partition portion 310 on the substrate 100 is located within the orthographic projection of the third partition sub-part 323 on the substrate 100. The orthographic projection of the third partition sub-part 323 on the substrate 100 is located within the orthographic projection of the second electrode overlap portion 400 on the substrate 100.

[0082] According to some exemplary embodiments, the material of the first partition sub-part 321 includes titanium, the material of the second partition sub-part 322 includes aluminum, and the material of the third partition sub-part 323 includes titanium. In the wet etching process for forming the second partition sub-part 320, the reaction rate of the etchant with aluminum is significantly higher than the reaction rate of the etchant with titanium. Therefore, the etching rate of the film layer containing the second partition sub-part 322 is higher than the etching rate of the film layer containing the first partition sub-part 321, resulting in the edge of the second partition sub-part 322 being located within the edge of the first partition sub-part 321 after etching.

[0083] Figure 5 Schematic illustration along Figure 2 Another schematic diagram of a cross section taken by line AA' in the diagram.

[0084] According to some exemplary embodiments, refer to Figure 5 The orthographic projection of the second partition portion 320 on the substrate 100 is located within the orthographic projection of the first partition portion 310 on the substrate 100. That is, the edge of the first partition portion 310 protrudes beyond the edge of the second partition portion 320. The first partition portion 310 and the second partition portion 320 form an undercut structure to separate the light-emitting functional portion 220 and the second electrode portion 230 of adjacent light-emitting devices.

[0085] According to some exemplary embodiments, refer to Figure 5 The orthographic projection of the first partition portion 310 on the substrate 100 is located within the orthographic projection of the second electrode overlapping portion 400 on the substrate 100, so as to ensure that the second electrode overlapping portion 400 can overlap with the second electrode portion 230.

[0086] According to some exemplary embodiments, the first partition portion 310 and the second partition portion 320 are made of different materials.

[0087] According to some exemplary embodiments, a photosensitive element is disposed on the side of the display substrate opposite to the light-emitting surface. In order to meet the light-sensing requirements of the photosensitive element, at least a portion of the display substrate needs to have light-transmitting properties. For example, the area located between the light-emitting devices (ELs) can be designated as a light-transmitting area.

[0088] According to some exemplary embodiments, refer to Figure 5The material of the first partition portion 310 is selected from transparent insulating materials, for example, the material of the first partition portion 310 is selected from at least one of silicon nitride and silicon oxide.

[0089] According to some exemplary embodiments, refer to Figure 5 The material of the second partition portion 320 is selected from transparent insulating materials and transparent conductive materials. For example, the material of the second partition portion 320 is selected from transparent insulating materials; exemplarily, the material of the second partition portion 320 is selected from at least one of silicon nitride and silicon oxide. Alternatively, the material of the second partition portion 320 is selected from transparent conductive materials; exemplarily, the material of the second partition portion 320 is selected from at least one of indium tin oxide, indium gallium zinc oxide, indium zinc oxide, and zinc aluminum oxide.

[0090] According to some exemplary embodiments, refer to Figure 5 The material of the second electrode overlap portion 400 is selected from a transparent conductive material. For example, the material of the second electrode overlap portion 400 is selected from a metal oxide conductive material with high transmittance. Exemplarily, the material of the second electrode overlap portion 400 is selected from at least one of indium tin oxide, indium gallium zinc oxide, indium zinc oxide, and zinc aluminum oxide. According to some exemplary embodiments, refer to... Figure 5 Both the material of the second electrode overlap portion 400 and the material of the second partition portion 320 are selected from transparent conductive materials. That is, the second partition portion 320 and the second electrode overlap portion 400 are connected in parallel, which helps to improve the electrical connection effect between adjacent second electrode portions 230. When both the material of the second electrode overlap portion 400 and the material of the second partition portion 320 are selected from transparent conductive materials, but the materials of the second electrode overlap portion 400 and the second partition portion 320 are different, the second electrode overlap portion 400 will not be etched and damaged during the etching process to form the second partition portion 320. For example, the material of the second partition portion 320 includes indium tin oxide, and the material of the second electrode overlap portion 400 includes indium gallium zinc oxide.

[0091] According to some exemplary embodiments, refer to Figure 5The material of the second partition portion 320 is selected from a transparent conductive material, and the material of the second electrode overlap portion 400 is selected from a metallic material. The thickness of the second electrode overlap portion is less than or equal to one-fifth of the thickness of the second partition portion. That is, the second electrode overlap portion 400 is relatively thin, allowing the metallic second electrode overlap portion 400 to still possess a certain transmittance, thereby meeting the photosensitive requirements of the photosensitive element located on the side of the display substrate away from the light-emitting surface. On the other hand, the metallic second electrode overlap portion 400 has high electrical conductivity, which can improve the electrical connection effect between adjacent second electrode portions 230. For example, the material of the second partition portion 320 includes at least one of indium tin oxide, indium gallium zinc oxide, indium zinc oxide, and zinc aluminum oxide, and the material of the second electrode overlap portion 400 includes at least one of molybdenum, aluminum, titanium, copper, niobium, and silver. The thickness of the second partition portion 320 is greater than or equal to 3000 angstroms, and the thickness of the second electrode overlap portion 400 is less than or equal to 500 angstroms. For example, the thickness of the second partition 320 is 4000 angstroms, and the thickness of the second electrode overlap 400 is 200 angstroms.

[0092] It should be further explained that the first electrode portion 210 is a stacked structure of indium tin oxide / silver / indium tin oxide, that is, the surface of the first electrode portion 210 away from the substrate 100 is an indium tin oxide layer. However, even if the material of the second partition portion 320 or the second electrode overlap portion 400 includes indium tin oxide, the indium tin oxide layer on the surface of the first electrode portion 210 will not be etched and damaged during the etching process of the second partition portion 320 or the second electrode overlap portion 400. The reason is that after the first electrode portion 210 is etched, it will undergo a thermal annealing process, which causes the indium tin oxide to crystallize. The crystallized indium tin oxide has high stability and basically does not react with the etchant.

[0093] Figure 6 Schematic illustration along Figure 2 Another schematic diagram of a cross section taken by line AA' in the diagram.

[0094] According to some exemplary embodiments, refer to Figure 6 The display substrate also includes an encapsulation structure, which may include a first encapsulation layer 610, a second encapsulation layer 620, and a third encapsulation layer 630. The first encapsulation layer 610 includes a plurality of first encapsulation portions 611, each covering the surface of the light-emitting device EL away from the substrate 100, and at least one partition portion 300 is provided between adjacent first encapsulation portions 611. The second encapsulation layer 620 covers the surfaces of the plurality of first encapsulation portions 611 and the plurality of partition portions 300 away from the substrate 100, and the third encapsulation layer 630 covers the surface of the second encapsulation layer 620 away from the substrate 100.

[0095] According to some exemplary embodiments, the materials of the first encapsulation layer 610 and the third encapsulation layer 630 are inorganic materials, and the material of the second encapsulation layer 620 is an organic material.

[0096] According to some exemplary embodiments, the display substrate further includes a driving circuit layer located between the substrate and the plurality of first electrode portions. The driving circuit layer includes a plurality of driving circuit units arranged in an array on the substrate, and one driving circuit is electrically connected to a first electrode portion of a light-emitting device. One driving circuit unit includes a plurality of transistors and at least one storage capacitor.

[0097] Figure 7 A flowchart illustrating a method for fabricating a display substrate according to an embodiment of the present disclosure is shown schematically.

[0098] Reference Figure 7 The method for preparing the display substrate includes the following steps S10 to S60.

[0099] In step S10, a plurality of first electrode portions are formed on the substrate.

[0100] In step S20, a pixel defining layer is formed on the side of the plurality of first electrode portions away from the substrate, wherein the pixel defining layer includes a plurality of openings, the plurality of openings exposing at least a portion of the plurality of first electrode portions respectively.

[0101] In step S30, a plurality of second electrode overlap portions are formed on the side of the pixel defining layer away from the substrate.

[0102] In step S40, a plurality of partition portions are formed on the side of the plurality of second electrode overlap portions away from the substrate, wherein at least one partition portion is provided between two adjacent openings.

[0103] In step S50, under the cover of an open mask, a light-emitting functional film layer and a second electrode film layer are formed on the side of the multiple partitions away from the substrate by a vapor deposition process.

[0104] In step S60, a patterning process is performed on the light-emitting functional film layer and the second electrode film layer to form a plurality of light-emitting functional parts and a plurality of second electrode parts, wherein the orthographic projection of the second electrode overlapping part on the substrate covers the orthographic projection of the partition part on the substrate, and two adjacent second electrode parts are electrically connected through the second electrode overlapping part.

[0105] Figures 8A-8K A schematic diagram illustrating the formation process of a display substrate according to some embodiments of the present disclosure is shown.

[0106] According to some exemplary embodiments, the process of fabricating a display substrate includes the following steps.

[0107] Reference Figure 8AA substrate 100 is provided, on which a plurality of first electrode portions 210 are formed, and a pixel defining layer 500 is formed on the side of the plurality of first electrode portions 210 away from the substrate 100. The pixel defining layer 500 has a plurality of openings KK, which expose at least a portion of the first electrode portions 210. The plurality of openings KK includes a plurality of first openings KK1, a plurality of second openings KK2, and a plurality of third openings KK3.

[0108] For example, the substrate 100 is a glass substrate or a polyimide substrate.

[0109] Reference Figure 8B A plurality of second electrode overlap portions 400 are formed on the side of the pixel defining layer 400 away from the substrate 100.

[0110] For example, the orthographic projection of the second electrode overlap portion 400 on the substrate 100 is located within the orthographic projection of the pixel defining layer 400 on the substrate 100, and the orthographic projection of the second electrode overlap portion 400 on the substrate 100 overlaps with the orthographic projection of the first electrode portion 210 on the substrate 100.

[0111] Reference Figure 8C A second isolation film layer 320a is formed on the side of the second electrode overlap portion 400 away from the substrate 100, a first isolation film layer 310a is formed on the side of the second isolation film layer 320a away from the substrate 100, and a first photoresist layer PR1 is formed on the side of the first isolation film layer 310a away from the substrate 100. The first photoresist layer PR1 has a predetermined pattern.

[0112] For example, the second isolation film layer 320a is an indium tin oxide thin film formed by physical vapor deposition, and the first isolation film layer 310a is a silicon oxide thin film formed by chemical vapor deposition.

[0113] Combined with reference Figure 8C and Figure 8D Under the shielding of the first photoresist layer PR1, the first isolation film layer 310a is etched to form multiple first isolation portions 310. Then, the second isolation film layer 320a is etched to form multiple second isolation portions 320. By controlling the etching endpoint of the second isolation film layer 320a, the edges of the second isolation portions 320 are concave compared to the edges of the first isolation portions 310. That is, the orthographic projection of the second isolation portion 320 on the substrate 100 lies within the orthographic projection of the first isolation portion 310 on the substrate 100. The isolation portion 300 formed by the first isolation portion 310 and the second isolation portion 320 has an undercut structure.

[0114] For example, the first isolation film layer 310a is etched by a dry etching process, and the second isolation film layer 320a is etched by a wet etching process.

[0115] Reference Figure 8E The first photoresist layer PR1 is peeled off.

[0116] Reference Figure 8F A first light-emitting functional film layer 221a and a second electrode film layer 230a are formed on the side of the multiple partition portions 300 away from the substrate 100. A first encapsulation film layer 610a is formed on the side of the second electrode film layer 230a away from the substrate 100. Since the partition portion 300 has an undercut structure, the first light-emitting functional film layer 221a, the second electrode film layer 230a and the first encapsulation film layer 610a will be disconnected at the sidewall of the partition portion 300.

[0117] For example, the first light-emitting functional film layer 221a and the second electrode film layer 230a are formed sequentially by a vapor deposition process. During the vapor deposition process, an open mask is used to block the area located on the periphery of the display area, so that the first light-emitting functional film layer 221a and the second electrode film layer 230a formed by vapor deposition cover the display area and can be slightly larger than the display area.

[0118] For example, the first light-emitting functional film layer 221a may include a hole transport film layer, a first light-emitting film layer located on the side of the hole transport film layer away from the substrate, and an electron transport film layer located on the side of the first light-emitting film layer away from the substrate.

[0119] For example, the first encapsulation film layer 610a can be formed by a chemical vapor deposition process.

[0120] Reference Figure 8G A second photoresist layer PR2 is formed on the side of the first encapsulation film layer 610a away from the substrate 100. The second photoresist layer PR2 covers the area between adjacent isolation pillars 300 on the first opening KK1.

[0121] Combined with reference Figure 8G and Figure 8HUnder the cover of the second photoresist layer PR2, the first light-emitting functional film layer 221a, the second electrode film layer 230a, and the first encapsulation film layer 610a are etched, leaving only the portion on the first electrode portion 210 exposed by the first opening KK1. After etching, the second photoresist layer PR2 is peeled off. This forms the first light-emitting functional portion 221, the second electrode portion 230, and the first encapsulation portion 611. The first light-emitting functional portion 211 covers the surface of the first electrode portion 210 exposed by the first opening KK1. The second electrode portion 230 is located on the side of the first light-emitting functional portion 211 away from the substrate 100, and the first encapsulation portion 611 is located on the side of the second electrode portion 230 away from the substrate 100. The first electrode portion 210, the first light-emitting functional portion 221, and the second electrode portion 230 constitute the first light-emitting device EL1.

[0122] Reference Figure 8I Following similar steps to forming the first light-emitting functional portion 221, the second electrode portion 230, and the first encapsulation portion 611, a second light-emitting functional portion 222, a second electrode portion 230, and a first encapsulation portion 611 are formed on the first electrode portion 210 exposed by the second opening KK2. For example, a second light-emitting functional film layer, a second electrode film layer, and a first encapsulation film layer are formed sequentially, and then the second light-emitting functional film layer, the second electrode film layer, and the first encapsulation film layer are etched, leaving only the portion located on the first electrode portion 210 exposed by the second opening KK2, that is, forming the second light-emitting functional portion 222, the second electrode portion 230, and the first encapsulation portion 611. The second light-emitting functional portion 222 covers the surface of the first electrode portion 210 exposed by the second opening KK2, the second electrode portion 230 is located on the side of the second light-emitting functional portion 222 away from the substrate 100, and the first encapsulation portion 611 is located on the side of the second electrode portion 230 away from the substrate 100. The first electrode section 210, the second light-emitting functional section 222, and the second electrode section 230 constitute the second light-emitting device EL2.

[0123] For example, the second light-emitting functional film layer is formed by a vapor deposition process, and the second electrode film layer is formed by a vapor deposition process. During the vapor deposition process of the second light-emitting functional film layer and the second electrode film layer, an open mask is used to block the area located on the periphery of the display area.

[0124] For example, the first encapsulation film layer is formed by chemical vapor deposition.

[0125] Reference Figure 8JFollowing similar steps to forming the first light-emitting functional portion 221, the second electrode portion 230, and the first encapsulation portion 611, a third light-emitting functional portion 223, a second electrode portion 230, and a first encapsulation portion 611 are formed on the first electrode portion 210 exposed by the third opening KK3. For example, a third light-emitting functional film layer, a second electrode film layer, and a first encapsulation film layer are formed sequentially, and then the third light-emitting functional film layer, the second electrode film layer, and the first encapsulation film layer are etched, leaving only the portion located on the first electrode portion 210 exposed by the third opening KK3, that is, forming the third light-emitting functional portion 223, the second electrode portion 230, and the first encapsulation portion 611. The third light-emitting functional portion 223 covers the surface of the first electrode portion 210 exposed by the third opening KK3, the second electrode portion 230 is located on the side of the third light-emitting functional portion 223 away from the substrate 100, and the first encapsulation portion 611 is located on the side of the second electrode portion 230 away from the substrate 100. The first electrode section 210, the third light-emitting functional section 223, and the second electrode section 230 constitute the third light-emitting device EL3.

[0126] For example, the third light-emitting functional film layer is formed by a vapor deposition process, and the second electrode film layer is formed by a vapor deposition process. During the vapor deposition process of the third light-emitting functional film layer and the second electrode film layer, an open mask is used to block the area located on the periphery of the display area.

[0127] For example, the first encapsulation film layer is formed by chemical vapor deposition.

[0128] Reference Figure 8K A second encapsulation layer 620 is formed on the side of the partition portion 300 and the first encapsulation portion 611 away from the substrate 100, and a third encapsulation layer 630 is formed on the side of the second encapsulation layer 620 away from the substrate 100.

[0129] For example, the second encapsulation layer 620 is an organic encapsulation film formed by a coating process, and the third encapsulation layer 630 is an inorganic encapsulation film formed by a chemical vapor deposition process. The first encapsulation portion 611, the second encapsulation layer 620, and the third encapsulation layer 630, stacked along a direction perpendicular to the substrate 100, are used together to encapsulate the light-emitting device. The second encapsulation layer 620 is relatively thick, and it can also provide a certain planarization effect for the underlying film layers.

[0130] In the embodiments of this disclosure, during the evaporation process of the light-emitting functional film layer and the second electrode film layer, an open mask is used to block the area located on the periphery of the display area. With the cooperation of multiple partitions 300, the light-emitting functional film layer can be broken at multiple partitions 300. That is, multiple broken light-emitting functional parts can be formed without the need to use a fine mask (i.e., an FMM mask).

[0131] Figures 9A-9K The diagram schematically illustrates the formation process of a display substrate according to other embodiments of the present disclosure.

[0132] According to some exemplary embodiments, the process of fabricating a display substrate includes the following steps.

[0133] Reference Figure 9A A substrate 100 is provided, on which a plurality of first electrode portions 210 are formed, and a pixel defining layer 500 is formed on the side of the plurality of first electrode portions 210 away from the substrate 100. The pixel defining layer 500 has a plurality of openings KK, which expose at least a portion of the first electrode portions 210. The plurality of openings KK includes a plurality of first openings KK1, a plurality of second openings KK2, and a plurality of third openings KK3.

[0134] For example, the substrate 100 is a glass substrate or a polyimide substrate.

[0135] Reference Figure 9B A plurality of second electrode overlap portions 400 are formed on the side of the pixel defining layer 400 away from the substrate 100.

[0136] For example, the orthographic projection of the second electrode overlap portion 400 on the substrate 100 is located within the orthographic projection of the pixel defining layer 400 on the substrate 100, and the orthographic projection of the second electrode overlap portion 400 on the substrate 100 overlaps with the orthographic projection of the first electrode portion 210 on the substrate 100.

[0137] Reference Figure 9C A third isolation sub-film layer 323a is formed on the side of the second electrode overlap portion 400 away from the substrate 100. A second isolation sub-film layer 322a is formed on the side of the third isolation sub-film layer 323a away from the substrate 100. A first isolation sub-film layer 321a is formed on the side of the second isolation sub-film layer 322a away from the substrate 100. A first isolation film layer 310a is formed on the side of the first isolation film layer 310a away from the substrate 100. The first photoresist layer PR1 has a predetermined pattern.

[0138] For example, the third isolation sub-film layer 323a is a titanium thin film formed by physical vapor deposition, the second isolation sub-film layer 322a is an aluminum thin film formed by physical vapor deposition, and the first isolation sub-film layer 321a is a titanium thin film formed by physical vapor deposition. The first isolation film layer 310a is a silicon oxide thin film formed by chemical vapor deposition.

[0139] Combined with reference Figure 9C and Figure 9DUnder the shielding of the first photoresist layer PR1, the first isolation film layer 310a is etched to form the first isolation portion 310. The first isolation sub-film layer 321a is etched to form the first isolation sub-portion 321. The second isolation sub-film layer 322a is etched to form the second isolation sub-portion 322. The third isolation sub-film layer 323a is etched to form the third isolation sub-portion 323. The first isolation sub-portion 321, the second isolation sub-portion 322, and the third isolation sub-portion 323 constitute the second isolation portion 320. The second isolation portion 320 and the first isolation portion 310 constitute the isolation portion 300. By selecting materials for the first partition sub-film layer 321a and the second partition sub-film layer 322a, the etching rate of the second partition sub-film layer 322a is made greater than that of the first partition sub-film layer 321a. Consequently, the edge of the second partition sub-part 322 is concave compared to the edge of the first partition sub-part 321, and the orthographic projection of the second partition sub-part 322 on the substrate 100 lies within the orthographic projection of the first partition sub-part 321 on the substrate 100. That is, the partition portion 300, including the second partition sub-part 322 and the first partition sub-part 321, has an undercut structure.

[0140] For example, the first isolation film layer 310a is etched by a dry etching process, and the first isolation sub-film layer 321a, the second isolation sub-film layer 322a and the third isolation sub-film layer 323a are etched by a wet etching process.

[0141] Reference Figure 9E The first photoresist layer PR1 is peeled off.

[0142] Reference Figure 9F A first light-emitting functional film layer 221a and a second electrode film layer 230a are formed on the side of the multiple partition portions 300 away from the substrate 100. A first encapsulation film layer 610a is formed on the side of the second electrode film layer 230a away from the substrate 100. Since the partition portion 300 has an undercut structure, the first light-emitting functional film layer 221a, the second electrode film layer 230a and the first encapsulation film layer 610a will be disconnected at the sidewall of the partition portion 300.

[0143] For example, the first light-emitting functional film layer 221a and the second electrode film layer 230a are formed sequentially by a vapor deposition process. During the vapor deposition process, an open mask is used to block the area located on the periphery of the display area, so that the first light-emitting functional film layer 221a and the second electrode film layer 230a formed by vapor deposition cover the display area and can be slightly larger than the display area.

[0144] For example, the first light-emitting functional film layer 221a may include a hole transport film layer, a first light-emitting film layer located on the side of the hole transport film layer away from the substrate, and an electron transport film layer located on the side of the first light-emitting film layer away from the substrate.

[0145] For example, the first encapsulation film layer 610a can be formed by a chemical vapor deposition process.

[0146] Reference Figure 9G A second photoresist layer PR2 is formed on the side of the first encapsulation film layer 610a away from the substrate 100. The second photoresist layer PR2 covers the area between adjacent isolation pillars 300 on the first opening KK1.

[0147] Combined with reference Figure 9G and Figure 9H Under the cover of the second photoresist layer PR2, the first light-emitting functional film layer 221a, the second electrode film layer 230a, and the first encapsulation film layer 610a are etched, leaving only the portion on the first electrode portion 210 exposed by the first opening KK1. After etching, the second photoresist layer PR2 is peeled off. This forms the first light-emitting functional portion 221, the second electrode portion 230, and the first encapsulation portion 611. The first light-emitting functional portion 211 covers the surface of the first electrode portion 210 exposed by the first opening KK1. The second electrode portion 230 is located on the side of the first light-emitting functional portion 211 away from the substrate 100, and the first encapsulation portion 611 is located on the side of the second electrode portion 230 away from the substrate 100. The first electrode portion 210, the first light-emitting functional portion 221, and the second electrode portion 230 constitute the first light-emitting device EL1.

[0148] Reference Figure 9I Following similar steps to forming the first light-emitting functional portion 221, the second electrode portion 230, and the first encapsulation portion 611, a second light-emitting functional portion 222, a second electrode portion 230, and a first encapsulation portion 611 are formed on the first electrode portion 210 exposed by the second opening KK2. For example, a second light-emitting functional film layer, a second electrode film layer, and a first encapsulation film layer are formed sequentially, and then the second light-emitting functional film layer, the second electrode film layer, and the first encapsulation film layer are etched, leaving only the portion located on the first electrode portion 210 exposed by the second opening KK2, that is, forming the second light-emitting functional portion 222, the second electrode portion 230, and the first encapsulation portion 611. The second light-emitting functional portion 222 covers the surface of the first electrode portion 210 exposed by the second opening KK2, the second electrode portion 230 is located on the side of the second light-emitting functional portion 222 away from the substrate 100, and the first encapsulation portion 611 is located on the side of the second electrode portion 230 away from the substrate 100. The first electrode section 210, the second light-emitting functional section 222, and the second electrode section 230 constitute the second light-emitting device EL2.

[0149] For example, the second light-emitting functional film layer is formed by a vapor deposition process, and the second electrode film layer is formed by a vapor deposition process. During the vapor deposition process of the second light-emitting functional film layer and the second electrode film layer, an open mask is used to block the area located on the periphery of the display area.

[0150] For example, the first encapsulation film layer is formed by chemical vapor deposition.

[0151] Reference Figure 9J Following similar steps to forming the first light-emitting functional portion 221, the second electrode portion 230, and the first encapsulation portion 611, a third light-emitting functional portion 223, a second electrode portion 230, and a first encapsulation portion 611 are formed on the first electrode portion 210 exposed by the third opening KK3. For example, a third light-emitting functional film layer, a second electrode film layer, and a first encapsulation film layer are formed sequentially, and then the third light-emitting functional film layer, the second electrode film layer, and the first encapsulation film layer are etched, leaving only the portion located on the first electrode portion 210 exposed by the third opening KK3, that is, forming the third light-emitting functional portion 223, the second electrode portion 230, and the first encapsulation portion 611. The third light-emitting functional portion 223 covers the surface of the first electrode portion 210 exposed by the third opening KK3, the second electrode portion 230 is located on the side of the third light-emitting functional portion 223 away from the substrate 100, and the first encapsulation portion 611 is located on the side of the second electrode portion 230 away from the substrate 100. The first electrode section 210, the third light-emitting functional section 223, and the second electrode section 230 constitute the third light-emitting device EL3.

[0152] For example, the third light-emitting functional film layer is formed by a vapor deposition process, and the second electrode film layer is formed by a vapor deposition process. During the vapor deposition process of the third light-emitting functional film layer and the second electrode film layer, an open mask is used to block the area located on the periphery of the display area.

[0153] For example, the first encapsulation film layer is formed by chemical vapor deposition.

[0154] Reference Figure 9K A second encapsulation layer 620 is formed on the side of the partition portion 300 and the first encapsulation portion 611 away from the substrate 100, and a third encapsulation layer 630 is formed on the side of the second encapsulation layer 620 away from the substrate 100.

[0155] For example, the second encapsulation layer 620 is an organic encapsulation film formed by a coating process, and the third encapsulation layer 630 is an inorganic encapsulation film formed by a chemical vapor deposition process. The first encapsulation portion 611, the second encapsulation layer 620, and the third encapsulation layer 630, stacked along a direction perpendicular to the substrate 100, are used together to encapsulate the light-emitting device. The second encapsulation layer 620 is relatively thick, and it can also provide a certain planarization effect for the underlying film layers.

[0156] In this embodiment, during the evaporation process of the light-emitting functional film layer and the second electrode film layer, an open mask is used to block the area located on the periphery of the display area. With the cooperation of multiple partitions 300, the light-emitting functional film layer can be broken at multiple partitions 300. That is, multiple broken light-emitting functional parts can be formed without the need to use a fine mask (i.e., an FMM mask).

[0157] On the other hand, a display device is provided, which includes the aforementioned display substrate. The display device can be a liquid crystal display, electronic paper, OLED (Organic Light-Emitting Diode) display, or any product or component with touch and display functions, including such display devices as televisions, digital cameras, mobile phones, watches, tablet computers, laptops, navigators, etc.

[0158] It should be understood that the display device according to some exemplary embodiments of this disclosure has all the features and advantages of the display substrate described above, which can be referred to in the above description of the display substrate and will not be repeated here.

[0159] As used herein, the terms “substantially,” “approximately,” “about,” and other similar terms are used as terms of approximation rather than as terms of degree, and they are intended to account for inherent deviations in measured or calculated values ​​that would be recognized by one of ordinary skill in the art. Taking into account factors such as process variations, measurement problems, and errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), “approximately” or “about” as used herein includes the stated value and indicates that the particular value is within an acceptable range of deviation for one of ordinary skill in the art. For example, “approximately” may mean within one or more standard deviations, or within ±10% or ±5% of the stated value.

[0160] While some embodiments based on the general inventive concept of this disclosure have been illustrated and described, those skilled in the art will understand that changes may be made to these embodiments without departing from the principles and spirit of the general inventive concept of this disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. A display substrate, wherein, The display substrate includes: Substrate; A plurality of light-emitting devices are arranged in an array on the substrate. Each light-emitting device includes: a first electrode portion located on the substrate, a light-emitting functional portion located on the side of the first electrode portion away from the substrate, and a second electrode portion located on the side of the light-emitting functional portion away from the substrate; and Multiple partitions are located on the substrate, with at least one partition between two adjacent light-emitting devices. The display substrate further includes at least one second electrode overlap portion, which is located between the partition portion and the substrate. The orthographic projection of the second electrode overlap portion on the substrate covers the orthographic projection of the partition portion on the substrate. Two adjacent second electrode portions are electrically connected through the second electrode overlap portion. The second electrode overlap includes a side surface and a plane. The extended surface of the side surface intersects the substrate. The plane is the surface of the second electrode overlap away from the substrate. The light-emitting functional part has a break located on the side surface of the second electrode overlap. The break exposes a portion of the side surface of the second electrode overlap. The second electrode part is electrically connected to the second electrode overlap through the break.

2. The display substrate according to claim 1, wherein, The display substrate further includes a pixel defining layer located between the first electrode portion and the light-emitting functional portion. The pixel defining layer includes an opening that exposes at least a portion of the first electrode portion. The light-emitting functional portion is connected to the first electrode portion through the opening. The second electrode overlap portion is located between the partition portion and the pixel defining layer, and the orthographic projection of the second electrode overlap portion on the substrate is located within the orthographic projection of the pixel defining layer on the substrate.

3. The display substrate according to claim 1 or 2, wherein, The orthographic projection of the second electrode overlaps with the orthographic projection of the first electrode on the substrate.

4. The display substrate according to claim 1 or 2, wherein, The material of the second electrode overlap portion is different from the material of the partition portion.

5. The display substrate according to claim 4, wherein, The partition portion includes a first partition portion and a second partition portion located on the side of the first partition portion near the substrate. The material of the first partition portion includes an insulating material, and the material of the second partition portion includes an insulating material and / or a conductive material. The material of the second electrode overlap portion is different from the material of the second partition portion.

6. The display substrate according to claim 4, wherein, The material of the second electrode overlap portion is selected from at least one of metallic conductive materials and metallic oxide conductive materials.

7. The display substrate according to any one of claims 1-2 and 5-6, wherein, The second electrode portion is directly connected to at least a portion of the side surface of the second electrode overlap portion; and / or At least a portion of the plane of the second electrode portion is directly connected to the second electrode overlap portion.

8. The display substrate according to claim 7, wherein, The edge of the orthogonal projection of the second electrode portion onto the substrate is located within the edge of the orthogonal projection of the light-emitting functional portion onto the substrate.

9. The display substrate according to claim 5, wherein, The material of the second partition is selected from transparent insulating material and transparent conductive material, and the material of the second electrode overlap is selected from transparent conductive material.

10. The display substrate according to claim 9, wherein, The material of the second partition is selected from transparent conductive material, the material of the second electrode overlap is selected from transparent conductive material, and the materials of the second partition and the second electrode overlap are different.

11. The display substrate according to claim 5, wherein, The material of the second partition is selected from transparent conductive material, the material of the second electrode overlap is selected from metal material, and the thickness of the second electrode overlap is less than or equal to one-fifth of the thickness of the second partition.

12. The display substrate according to claim 10, wherein, The transparent conductive material includes indium tin oxide, indium gallium zinc oxide, indium zinc oxide, and zinc aluminum oxide.

13. The display substrate according to any one of claims 5, 9-12, wherein, The second partition portion includes a first partition sub-part located on the side of the first partition portion near the substrate and a second partition sub-part located on the side of the first partition sub-part near the substrate, wherein the orthographic projection of the second partition sub-part on the substrate is located within the orthographic projection of the first partition sub-part on the substrate.

14. The display substrate according to any one of claims 5, 9-12, wherein, The orthographic projection of the second partition portion on the substrate is located within the orthographic projection of the first partition portion on the substrate.

15. A display device, wherein, The display device includes a display substrate according to any one of claims 1-14.

16. A method for preparing a display substrate, wherein, The preparation method includes: Multiple first electrode portions are formed on the substrate. A pixel defining layer is formed on the side of the plurality of first electrode portions away from the substrate, wherein the pixel defining layer includes a plurality of openings, the plurality of openings respectively exposing at least a portion of the plurality of first electrode portions; A plurality of second electrode overlap portions are formed on the side of the pixel defining layer away from the substrate. A plurality of partition portions are formed on the side of the plurality of second electrode overlap portions away from the substrate, wherein at least one partition portion is provided between two adjacent openings; Under the cover of an open photomask, a light-emitting functional film and a second electrode film are formed on the side of the plurality of partitions away from the substrate using a vapor deposition process; and A patterning process is performed on the light-emitting functional film layer and the second electrode film layer to form multiple light-emitting functional parts and multiple second electrode parts. Wherein, the orthographic projection of the second electrode overlap portion on the substrate covers the orthographic projection of the partition portion on the substrate. Two adjacent second electrode portions are electrically connected through the second electrode overlap portion. The second electrode overlap portion includes a side surface and a plane. The extension surface of the side surface intersects the substrate. The plane is the surface of the second electrode overlap portion away from the substrate. The light-emitting functional portion has a break located on the side surface of the second electrode overlap portion. The break exposes a portion of the side surface of the second electrode overlap portion. The second electrode portion is electrically connected to the second electrode overlap portion through the break.

17. The preparation method according to claim 16, wherein, The formation of multiple partitions includes: A plurality of second partition portions are formed on the side of the plurality of second electrode overlap portions away from the substrate; and A plurality of first partitions are formed on the side of the plurality of second partitions away from the substrate, wherein the orthographic projection of the second partition on the substrate is located within the orthographic projection of the first partition on the substrate.

18. The preparation method according to claim 16, wherein, The formation of multiple partitions includes: A plurality of second partition portions are formed on the side of the plurality of second electrode overlap portions away from the substrate. Each second partition portion includes a third partition sub-part formed on the side of the second electrode overlap portion away from the substrate, a second partition sub-part formed on the side of the third partition sub-part away from the substrate, and a first partition sub-part formed on the side of the second partition sub-part away from the substrate. The orthographic projection of the second partition sub-part on the substrate lies within the orthographic projection of the first partition sub-part on the substrate. A plurality of first partition portions are formed on the side of the plurality of second partition portions away from the substrate.

Images