Marble automatic polishing and repairing method and system

Abstract

The application provides a marble automatic polishing and repairing method and system. The method comprises the following steps: acquiring a to-be-repaired image corresponding to a to-be-repaired marble, and identifying and determining each defect area; controlling a machine end to scan each defect area, and when the scanning result is that any defect area includes an intact sub-area, controlling the machine end to perform surface polishing on the intact sub-area with a preset depth; establishing a polishing fence with a preset width based on the defect contour of each defect area, and controlling the machine end to perform contour polishing on the defect contour based on the polishing fence; after the machine end sends a polishing completion signal, controlling the machine end to perform repair material injection on each defect area to obtain a repaired marble including each repair area; and controlling the machine end to perform image acquisition on the repaired marble to obtain a repaired image, and marking the repaired image based on a terminal number corresponding to the machine end. The application at least improves the repairing efficiency of the marble.

Description

Technical Field

[0001] This invention relates to data processing technology, and more particularly to an automatic marble polishing and repair method and system. Background Technology

[0002] Marble possesses high compressive strength and excellent physical and chemical properties, and is easy to process. With economic development, its application scope is constantly expanding, and its usage is increasing, playing a vital role in people's lives. Especially in the last decade or so, large-scale mining, industrial processing, and international trade have led to a massive influx of decorative marble into the building decoration industry, used not only in luxurious public buildings but also in home decoration. However, imperfections such as dents or cracks may occur due to daily use, requiring timely repair.

[0003] The inventors discovered during their research that before repairing marble with imperfections such as dents or cracks, it is necessary to polish it first. The polishing process plays a crucial role in the overall repair effect of the marble. Some existing polishing techniques cannot polish the imperfect areas to a very smooth finish, which will affect the subsequent grouting and filling, or require manual polishing and repair of the imperfect areas, wasting a certain amount of manpower. Summary of the Invention

[0004] In view of the above problems, the present invention is proposed to provide an automatic marble polishing and repair method and system that overcomes or at least partially solves the above problems.

[0005] According to one aspect of the present invention, an automatic polishing and repair method for marble is provided, comprising the following steps:

[0006] Obtain the image to be repaired corresponding to the marble to be repaired, and identify the defective areas in the image to be repaired;

[0007] The machine is controlled to scan each of the defective areas, and when the scan result shows that any of the defective areas includes an intact sub-area, the machine is controlled to perform surface polishing on the intact sub-area to a preset depth.

[0008] Based on the defect contour of each defect area, a polishing fence with a preset width is established, and the machine is controlled to perform contour polishing on the defect contour based on the polishing fence.

[0009] In response to the polishing completion signal sent by the machine, the machine is controlled to inject repair material into each of the defective areas to obtain repaired marble including each repaired area.

[0010] The machine terminal is controlled to acquire images of the repaired marble, obtain a repaired image corresponding to the repaired marble, and mark the repaired image based on the terminal number corresponding to the machine terminal.

[0011] Optionally, in the method according to the present invention, identifying the image to be repaired and determining each defective region in the image to be repaired includes:

[0012] Determine the base color of the marble to be repaired, and set the base color as the base color;

[0013] The pixel values ​​corresponding to each image pixel in the image to be repaired are obtained, and the image pixels with pixel value differences within a preset range and adjacent pixels are divided into the same pixel region to obtain each pixel region;

[0014] The mean value of each pixel value corresponding to each image pixel point located in the same pixel region is calculated to obtain the mean value of each pixel corresponding to each pixel region.

[0015] The average value of each pixel is compared with the pixel value of the reference color, and the pixel region corresponding to the average value of the pixel value that is different from the reference color is determined as the region to be determined, thus obtaining each region to be determined;

[0016] The machine is controlled to scan each of the areas to be determined, and based on the scanning results, each defective area in the image to be repaired is determined.

[0017] Optionally, in the method according to the present invention, controlling the machine terminal to scan each of the regions to be determined, and determining each defect region in the image to be repaired based on the scanning results, includes:

[0018] A two-dimensional coordinate system is established with any vertex of the image to be repaired as the origin;

[0019] First dividing lines with a preset interval are generated in a direction perpendicular to the X-axis of the two-dimensional coordinate system, and second dividing lines with a preset interval are generated in a direction perpendicular to the Y-axis of the two-dimensional coordinate system.

[0020] The intersections of each first dividing line and each second dividing line are obtained to form the intersection points, and the intersection points located in each region to be determined are determined as region scanning points;

[0021] The machine terminal is controlled to perform infrared point scanning on all area scanning points located in each area to be determined, so as to obtain the scanning depth corresponding to each area scanning point;

[0022] Obtain the reference depth of the marble to be repaired, and compare the scanning depth corresponding to each scanning point with the reference depth;

[0023] When the scanning depth corresponding to any region scanning point in any region to be determined is greater than the reference depth, the region to be determined is determined as a marked region.

[0024] Based on the relative positions of all the marked regions, the defective regions in the image to be repaired are determined.

[0025] Optionally, in the method according to the invention, obtaining the reference depth of the marble to be repaired includes:

[0026] A reference contour is generated by extending the defect contour outward by a predetermined distance along any of the defect areas, and the area between the defect contour and the reference contour is defined as the reference area.

[0027] Three reference points are selected in the reference area, and the three reference points are connected to obtain a reference surface located outside the other defect areas;

[0028] The machine is controlled to perform an infrared array scan on the reference surface to obtain the reference depth corresponding to the reference surface.

[0029] Optionally, in the method according to the invention, determining each defect region in the image to be repaired based on the relative positional relationship between all the obtained marked regions includes:

[0030] Based on the two-dimensional coordinate system, the coordinate points of each region located in each marked region are obtained and formed into a region coordinate group, thus obtaining the region coordinate group corresponding to each marked region.

[0031] Perform pairwise comparisons on each region coordinate group, and determine whether there is an enclosing relationship between the region coordinate groups based on the comparison results;

[0032] The coordinates of regions with an enclosing relationship are combined into a single defect region, and the coordinates of regions without an enclosing relationship are determined as different defect regions, thus identifying each defect region in the image to be repaired.

[0033] Optionally, in the method according to the present invention, controlling the machine end to scan the defective area, and when the scanning result shows that the defective area includes an intact sub-area, controlling the machine end to perform surface polishing on the intact sub-area to a preset depth, includes:

[0034] The control machine performs an infrared array scan on the defective area to obtain the infrared distance distribution of the defective area, and determines the areas with the same infrared distance and formed in one piece as planar sub-regions based on the infrared distance distribution.

[0035] The infrared distance corresponding to each planar sub-region is compared with the reference depth, and the defective region is determined based on the comparison result to determine whether the intact sub-region is included.

[0036] When the infrared distance corresponding to any planar sub-region is the same as the reference depth, the planar sub-region is determined as an intact sub-region, the center point of the intact sub-region is obtained, and the machine is controlled to perform surface grinding based on a preset depth with the center point of the sub-region as the grinding reference point.

[0037] Optionally, in the method according to the present invention, establishing a polishing fence with a preset width based on the defect contour of the defect area, and controlling the machine end to perform contour polishing on the defect contour based on the polishing fence, includes:

[0038] Determine the half-width value of the preset width, and generate a fence outline that surrounds the defect outline and is spaced from the defect outline by half-width value;

[0039] The area located between the fence outlines is defined as the initial fence, and it is determined whether there are intersecting parts of other defective outlines in the initial fence;

[0040] When there are intersecting parts of other defect contours in the initial fence, the intersecting contour of the intersecting parts is determined, and the fence contour of the initial fence is updated based on the intersecting contour to obtain the polished fence.

[0041] Optionally, in the method according to the invention, controlling the machine end to perform contour grinding on the defect contour based on the grinding fence includes:

[0042] The machine is controlled to perform contour grinding on the defect contour, and the real-time position of the grinding point on the machine is determined.

[0043] When the grinding point of the machine end is located on the outline of the fence, grinding intervention measures are applied to the machine end, wherein the grinding intervention measures include at least one of the following:

[0044] Control the machine to stop polishing until the polishing point moves toward the defect outline and remains there for a preset time; and

[0045] The machine is controlled to gradually reduce the polishing speed until the polishing point moves toward the defect outline and is maintained for a preset time.

[0046] Optionally, in the method according to the present invention, controlling the machine terminal to acquire images of the repaired marble to obtain a repaired image corresponding to the repaired marble, and marking the repaired image based on a terminal number corresponding to the machine terminal, includes:

[0047] The machine is controlled to retrieve a preset shooting plugin and to capture images of the repaired marble based on the preset shooting plugin, thereby obtaining a repaired image corresponding to the repaired marble.

[0048] In response to the shooting completion signal sent by the machine, the terminal number corresponding to the machine and the repaired image are obtained;

[0049] The workload statistics table corresponding to the terminal number is retrieved, and the current repair count corresponding to the repaired image is determined based on the historical repair count in the workload statistics table.

[0050] A bounding box is created around the edge of the repaired image, and the terminal number is marked at the first position of the bounding box and the current repair count is marked at the second position of the bounding box to obtain a repaired marked image;

[0051] Add the current repair count and the repair marker image to the workload statistics table.

[0052] According to another aspect of the present invention, an automatic marble polishing and repair system is provided, comprising:

[0053] The recognition module is configured to acquire an image of the marble to be repaired corresponding to the marble to be repaired, and to recognize the image of the marble to be repaired to determine the defective areas in the image of the marble to be repaired;

[0054] The surface polishing module is configured to control the machine to scan the defective area, and when the defective area includes an intact sub-area, control the machine to perform surface polishing on the intact sub-area to a preset depth.

[0055] The contour polishing module is configured to establish a polishing fence with a preset width based on the defect contour of the defect area, and control the machine end to perform contour polishing on the defect contour based on the polishing fence.

[0056] The infusion module is configured to respond to a polishing completion signal sent by the machine end, and control the machine end to infuse the defective area with repair material to obtain repaired marble including the repaired area.

[0057] The marking module is configured to control the machine to acquire images of the repaired marble, obtain a repaired image corresponding to the repaired marble, and mark the repaired image based on the terminal number corresponding to the machine.

[0058] According to the present invention, the server can acquire and identify the image of the marble to be repaired, thereby determining each defective area in the image; then, the server controls the machine to scan each defective area. When the scan result shows that any defective area includes an intact sub-area, the server controls the machine to perform surface grinding of the intact sub-area to a preset depth; next, a grinding enclosure with a preset width is established based on the defect contour of each defective area, and the server controls the machine to perform contour grinding of the defect contour within the grinding enclosure; when the server receives a grinding completion signal from the machine, it controls the machine to inject repair material into each defective area, thereby obtaining a repaired marble including each repaired area; then, the server controls the machine to perform image acquisition on the repaired marble, obtaining a repaired image corresponding to the repaired marble, and marking the repaired image based on the terminal number corresponding to the machine. This invention can accurately determine the location of defective areas and perform detailed grinding, and repair the defective areas after grinding, improving the efficiency and effect of marble repair. Attached Figure Description

[0059] Figure 1 A flowchart of an automatic marble polishing and repair method according to an embodiment of the present invention is shown;

[0060] Figure 2 This diagram shows the structure of the machine end in this embodiment;

[0061] Figure 3 A structural block diagram of an automatic marble polishing and repair system according to another embodiment of the present invention is shown. Detailed Implementation

[0062] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0063] Marble possesses high compressive strength and excellent physical and chemical properties, and is easy to process. With economic development, its application scope is constantly expanding, and its usage is increasing, playing a vital role in people's lives. Especially in the last decade or so, large-scale mining, industrial processing, and international trade have led to a massive influx of decorative marble into the building decoration industry, used not only in luxurious public buildings but also in home decoration. However, imperfections such as dents or cracks may occur due to daily use, requiring timely repair.

[0064] The inventors discovered during their research that before repairing marble with imperfections such as dents or cracks, it is necessary to polish it first. The polishing process plays a crucial role in the overall repair effect of the marble. Some existing polishing techniques cannot polish the imperfect areas to a very smooth finish, which will affect the subsequent grouting and filling, or require manual polishing and repair of the imperfect areas, wasting a certain amount of manpower.

[0065] To address the problems existing in the prior art, the inventors proposed the solution of this invention. One embodiment of this invention provides an automatic marble polishing and repair method, which can be executed in a computing device.

[0066] Figure 1 A flowchart of an automated marble polishing and repair method according to an embodiment of the present invention is shown, which is suitable for execution in a computing device.

[0067] like Figure 1 As shown, the automatic marble polishing and repair method in this embodiment begins with step S102, which includes the following steps:

[0068] Obtain the image to be repaired corresponding to the marble to be repaired, and identify the defective areas in the image to be repaired.

[0069] For example, in this embodiment, the server can control the machine to acquire images of the marble to be repaired, thereby obtaining an image of the marble to be repaired, i.e., the image to be repaired, and identify the image to be repaired. After identification, each defective area in the image to be repaired can be determined, thereby realizing the corresponding automated remote operation.

[0070] For example, Figure 2 This diagram illustrates the structure of the machine side in this embodiment. Figure 2 As shown, the machine includes a machine body 201 and a movable pulley 202. The movable pulley 202 can drive the machine body 201 to move and complete the corresponding repair work.

[0071] Furthermore, the aforementioned "identifying the image to be repaired and determining each defective region in the image to be repaired" also includes the following steps:

[0072] Determine the base color of the marble to be repaired, and set the base color as the base color;

[0073] The pixel values ​​corresponding to each image pixel in the image to be repaired are obtained, and the image pixels with pixel value differences within a preset range and adjacent pixels are divided into the same pixel region to obtain each pixel region;

[0074] The mean value of each pixel value corresponding to each image pixel point located in the same pixel region is calculated to obtain the mean value of each pixel corresponding to each pixel region.

[0075] The average value of each pixel is compared with the pixel value of the reference color, and the pixel region corresponding to the average value of the pixel value that is different from the reference color is determined as the region to be determined, thus obtaining each region to be determined;

[0076] The machine is controlled to scan each of the areas to be determined, and based on the scanning results, each defective area in the image to be repaired is determined.

[0077] It can be explained that common marbles are all the same base color, such as white, gray, brown, black, etc. Under normal circumstances, when marble is damaged and forms corresponding defective areas, the pixel values ​​corresponding to the defective areas may be different from the pixel values ​​of the base color because the defective areas have uneven surfaces. Based on this characteristic, the base color of the marble can be used to determine the defective areas in the marble.

[0078] For example, in this embodiment, the server obtains the pixel values ​​corresponding to each image pixel in the image to be repaired, and calculates the difference between the pixel values ​​of adjacent image pixels to obtain the pixel difference. When the pixel value difference is within a preset range, it indicates that the pixel value difference between the two adjacent image pixels is too small, that is, the color difference is not significant, and they can be regarded as a pixel region. The server can then divide adjacent image pixels with pixel value differences within the preset range into the same pixel region, thereby obtaining each pixel region. Then, the server calculates the average pixel value of each image pixel in the same pixel region to obtain the pixel average value of each pixel region. The pixel average value obtained in this way is very objective and can ensure the accuracy of subsequent calculations.

[0079] After obtaining the average pixel value for each pixel region, the server compares each average pixel value with the pixel value of the reference color. When the average pixel value of a pixel region differs from the pixel value of the reference color, it indicates that there is a defective area within that pixel region. The server then identifies this pixel region as a region to be determined, thus obtaining the regions to be determined. The server then controls the machine to scan each region to be determined separately, and uses the scan results to identify the defective areas in the image to be repaired.

[0080] Furthermore, the aforementioned "controlling the machine to scan each of the areas to be determined, and determining each defective area in the image to be repaired based on the scanning results" also includes the following steps:

[0081] A two-dimensional coordinate system is established with any vertex of the image to be repaired as the origin;

[0082] First dividing lines with a preset interval are generated in a direction perpendicular to the X-axis of the two-dimensional coordinate system, and second dividing lines with a preset interval are generated in a direction perpendicular to the Y-axis of the two-dimensional coordinate system.

[0083] The intersections of each first dividing line and each second dividing line are obtained to form the intersection points, and the intersection points located in each region to be determined are determined as region scanning points;

[0084] The machine terminal is controlled to perform infrared point scanning on all area scanning points located in each area to be determined, so as to obtain the scanning depth corresponding to each area scanning point;

[0085] Obtain the reference depth of the marble to be repaired, and compare the scanning depth corresponding to each scanning point with the reference depth;

[0086] When the scanning depth corresponding to any region scanning point in any region to be determined is greater than the reference depth, the region to be determined is determined as a marked region.

[0087] Based on the relative positions of all the marked regions, the defective regions in the image to be repaired are determined.

[0088] In this embodiment, since the surface of marble is usually patterned, after determining the area to be determined from the pixel value dimension, the area to be determined may include defective areas and intact areas with patterns. Therefore, the server will further determine each defective area in the area to be determined based on the depth dimension; for example, the specific implementation method is as follows:

[0089] First, the server establishes a two-dimensional coordinate system with any vertex of the image to be repaired as the origin. Within this coordinate system, lines are generated on both sides of the X-axis and Y-axis, respectively. Specifically, multiple first dividing lines with preset intervals are generated perpendicular to the X-axis, and multiple second dividing lines with preset intervals are generated perpendicular to the Y-axis. These preset intervals can be set by the management system based on actual conditions. In other words, the first and second dividing lines divide the image to be repaired into equal parts according to the preset intervals. Then, the server obtains the intersection points formed by the first and second dividing lines, determines the position of each intersection point, and identifies the intersection points located within the area to be determined as the region scanning points.

[0090] Next, after the area scanning points are determined, the server will control the machine to perform infrared point scanning on all area scanning points located in the area to be determined, and obtain the scanning depth of each area scanning point.

[0091] Then, the server obtains the depth of the intact area in the marble to be repaired, i.e. the reference depth, and compares the scanning depth of each area scanning point with the reference depth. When the comparison result is that the scanning depth of the area scanning point is greater than the reference depth, the area to be determined where the area scanning point is located is determined as the marked area.

[0092] Finally, after obtaining all the marked areas, the defective areas in the image to be repaired can be further determined based on the relative positions of all the marked areas.

[0093] In this embodiment, since the scanning points of each region are determined based on the intersection between the first dividing line and the second dividing line, the scanning points of each region are uniformly distributed in the region to be determined. By performing infrared scanning on each region scanning point, the depth distribution in the region to be determined can be roughly determined. Compared with the existing technology of scanning the entire region to be determined, this can save a certain amount of data calculation and improve the corresponding work efficiency. Furthermore, when the scanning depth of any region scanning point is greater than the reference depth, it indicates that the region to be determined where the region scanning point is located includes a defective region. At this time, it can be determined as a marked region, thereby realizing the rapid determination of the marked region and improving the corresponding work efficiency.

[0094] Furthermore, the aforementioned "determining each defect region in the image to be repaired based on the relative positional relationship between all the marked regions" also includes the following steps:

[0095] Based on the two-dimensional coordinate system, the coordinate points of each region located in each marked region are obtained and formed into a region coordinate group, thus obtaining the region coordinate group corresponding to each marked region.

[0096] Perform pairwise comparisons on each region coordinate group, and determine whether there is an enclosing relationship between the region coordinate groups based on the comparison results;

[0097] The coordinates of regions with an enclosing relationship are combined into a single defect region, and the coordinates of regions without an enclosing relationship are determined as different defect regions, thus identifying each defect region in the image to be repaired.

[0098] For example, in this embodiment, the server can obtain the coordinate points of each region located in each marked area based on the two-dimensional coordinate system, and form a region coordinate group to obtain the region coordinate group of each marked area. Then, the region coordinate groups are compared pairwise to determine whether there is an enclosing relationship between the region coordinate groups. When the region coordinate groups have an enclosing relationship, for example, two region coordinate groups are [3, 7] and [5, 8], then these two region coordinate groups have an enclosing relationship. At this time, the server will combine the region coordinates with the enclosing relationship into a defect area, and then determine the region coordinates without the enclosing relationship as different defect areas, thereby determining each defect area in the image to be repaired.

[0099] Furthermore, the aforementioned "obtaining the reference depth of the marble to be repaired" also includes the following steps:

[0100] A reference contour is generated by extending the defect contour outward by a predetermined distance along any of the defect areas, and the area between the defect contour and the reference contour is defined as the reference area.

[0101] Three reference points are selected in the reference area, and the three reference points are connected to obtain a reference surface located outside the other defect areas;

[0102] The machine is controlled to perform an infrared array scan on the reference surface to obtain the reference depth corresponding to the reference surface.

[0103] For example, in this embodiment, the server extends outward by a preset distance along the flaw outline of the flawed area to generate a contour surrounding the flaw outline, i.e., a reference contour, and defines the area between the flaw outline and the reference contour as the reference area. Then, the server selects three points within the reference area, i.e., reference points, and connects these three reference points to form a reference surface. It should be noted that the reference surface is located in the intact area of ​​the marble to be repaired, i.e., not within the flawed area. The server then controls the machine to perform an infrared array scan on the reference surface. Infrared array scanning has a more comprehensive scanning area than infrared point scanning, enabling more accurate reference depth of the obtained reference surface. In this embodiment, the server selects three points within the reference area to form the reference surface and performs a depth scan, ensuring accuracy of the reference depth while reducing the scanning area and data processing volume.

[0104] Step S104 includes the following:

[0105] The machine is controlled to scan each of the defective areas, and when the scan result shows that any of the defective areas includes an intact sub-area, the machine is controlled to perform surface polishing on the intact sub-area to a preset depth.

[0106] For example, in this embodiment, the server controls the machine to perform infrared scanning on each defective area. When it is determined during the scanning process that the scanning depth of a portion of a defective area is the same as the reference depth, that is, when the scanning result shows that any defective area includes an intact sub-area, the server controls the machine to perform surface grinding on the intact sub-area to a preset depth. Here, it should be noted that the main purpose of grinding the intact sub-area is to create a certain height difference between the marble portion located in the defective area and the marble portion located in the intact area, which is beneficial for subsequent grouting and filling of the defective area during the repair process.

[0107] Furthermore, the aforementioned "controlling the machine to scan the defective area, and when the scanning result shows that the defective area includes an intact sub-area, controlling the machine to perform surface polishing on the intact sub-area to a preset depth" also includes the following steps:

[0108] The control machine performs an infrared array scan on the defective area to obtain the infrared distance distribution of the defective area, and determines the areas with the same infrared distance and formed in one piece as planar sub-regions based on the infrared distance distribution.

[0109] The infrared distance corresponding to each planar sub-region is compared with the reference depth, and the defective region is determined based on the comparison result to determine whether the intact sub-region is included.

[0110] When the infrared distance corresponding to any planar sub-region is the same as the reference depth, the planar sub-region is determined as an intact sub-region, the center point of the intact sub-region is obtained, and the machine is controlled to perform surface grinding based on a preset depth with the center point of the sub-region as the grinding reference point.

[0111] For example, in this embodiment, the server first controls the machine to perform an infrared array scan on the defective area. Based on the scan results, the infrared distance distribution of the defective area is obtained. When the infrared distances are the same in a single-piece area, this area can be identified as a plane. That is, based on the infrared distance distribution, areas with the same infrared distance and formed in one piece are identified as planar sub-regions. Next, the server compares the infrared distance of each planar sub-region with a reference depth. Based on the comparison results, it determines whether the defective area includes intact marble parts, i.e., intact sub-regions.

[0112] When the infrared distance of a planar sub-region is the same as the reference depth, it indicates that the defective area containing the planar sub-region includes a healthy sub-region. Therefore, the planar sub-region is identified as a healthy sub-region, and its center point is obtained. The machine is then controlled to perform surface polishing on the healthy sub-region using this center point as the polishing reference point. The polishing depth can be preset by the management system.

[0113] Step S106 includes the following:

[0114] A polishing fence with a preset width is established based on the defect contour of each defect area, and the machine is controlled to perform contour polishing on the defect contour based on the polishing fence.

[0115] For example, in this embodiment, since the defect outline may have burrs or other defects, the machine needs to perform contour grinding on the defect outline to smooth it out and avoid hollow areas during subsequent grouting of the defect area. Before this, the server will first establish grinding fences on both sides of the defect outline in the defect area. These grinding fences can limit the grinding position of the machine, that is, the machine should grind the defect outline within the grinding fence. Here, the management terminal can pre-set the distance between the grinding fence and the defect outline according to actual needs. That is, a grinding fence with a preset width is established based on the defect outline of the defect area, and then the server will control the machine to perform contour grinding on the defect outline within the area defined by the grinding fence.

[0116] Furthermore, the aforementioned "establishing a polishing fence with a preset width based on the defect contour of the defect area, and controlling the machine end to perform contour polishing on the defect contour based on the polishing fence" also includes the following steps:

[0117] Determine the half-width value of the preset width, and generate a fence outline that surrounds the defect outline and is spaced from the defect outline by half-width value;

[0118] The area located between the fence outlines is defined as the initial fence, and it is determined whether there are intersecting parts of other defective outlines in the initial fence;

[0119] When there are intersecting parts of other defect contours in the initial fence, the intersecting contour of the intersecting parts is determined, and the fence contour of the initial fence is updated based on the intersecting contour to obtain the polished fence.

[0120] For example, in this embodiment, before establishing the polishing fence, the server first sets a preset width for the polishing fence based on the actual situation and calculates half of the width. Then, based on the location of the defect contour, a fence contour surrounding the defect contour is generated, wherein the fence contour and the defect contour are spaced by the calculated half of the width. Next, the server determines the area between the fence contours as the initial fence and determines whether the area of ​​the initial fence intersects with other defect contours. When there is an intersection with other defect contours in the initial fence, the server determines the intersection contour of the intersection and updates the fence contour of the initial fence according to the intersection contour. The updated fence area will not have any intersection with other defect contours, thus obtaining the polishing fence. This can avoid the situation where other defect contours are polished while polishing one defect contour.

[0121] Furthermore, the aforementioned "controlling the machine end to perform contour grinding on the defect contour based on the grinding fence" also includes the following steps:

[0122] The machine is controlled to perform contour grinding on the defect contour, and the real-time position of the grinding point on the machine is determined.

[0123] When the grinding point of the machine is located on the first or second edge of the grinding enclosure, grinding intervention measures are applied to the machine, wherein the grinding intervention measures include at least one of the following:

[0124] Control the machine to stop polishing until the polishing point moves toward the defect outline and remains there for a preset time; and

[0125] The machine is controlled to gradually reduce the polishing speed until the polishing point moves toward the defect outline and is maintained for a preset time.

[0126] For example, in this embodiment, when the server controls the machine to perform contour grinding on the defect outline, it can determine the real-time position of the grinding point on the machine. When the grinding point on the machine reaches the first or second edge of the grinding enclosure, the server will intervene in the grinding process. One way to intervene is for the server to control the machine to stop grinding until the grinding point moves toward the defect outline and maintain this position for a preset time, such as 2 seconds. After the grinding point moves toward the defect outline for 2 seconds, the server will control the machine to continue grinding. Another way to intervene is for the server to control the machine to gradually reduce the grinding speed until the grinding point moves toward the defect outline and maintain this position for a preset time. Both methods ensure that the grinding point on the machine remains within the enclosure area during subsequent grinding.

[0127] Step S108 includes the following:

[0128] In response to the polishing completion signal sent by the machine, the machine is controlled to inject repair material into each of the defective areas to obtain repaired marble including each repaired area.

[0129] For example, in this embodiment, when the machine finishes polishing, it sends a polishing completion signal. After receiving the polishing completion signal, the server controls the machine to inject repair material into each defective area. After the injection is completed, the repaired marble including each repaired area will be obtained.

[0130] Step S110 includes the following:

[0131] The machine terminal is controlled to acquire images of the repaired marble, obtain a repaired image corresponding to the repaired marble, and mark the repaired image based on the terminal number corresponding to the machine terminal.

[0132] Furthermore, the aforementioned "controlling the machine to acquire images of the repaired marble, obtaining a repaired image corresponding to the repaired marble, and marking the repaired image based on the terminal number corresponding to the machine" also includes the following steps:

[0133] The machine is controlled to retrieve a preset shooting plugin and to capture images of the repaired marble based on the preset shooting plugin, thereby obtaining a repaired image corresponding to the repaired marble.

[0134] In response to the shooting completion signal sent by the machine, the terminal number corresponding to the machine and the repaired image are obtained;

[0135] The workload statistics table corresponding to the terminal number is retrieved, and the current repair count corresponding to the repaired image is determined based on the historical repair count in the workload statistics table.

[0136] A bounding box is created around the edge of the repaired image, and the terminal number is marked at the first position of the bounding box and the current repair count is marked at the second position of the bounding box to obtain a repaired marked image;

[0137] Add the current repair count and the repair marker image to the workload statistics table.

[0138] For example, in this embodiment, each machine has a number, namely a terminal number. The server has a pre-set workload statistics table corresponding to each terminal number, in which the historical number of repairs for that machine can be seen.

[0139] After obtaining the repaired marble, including each repair area, the server controls the terminal to retrieve a preset imaging plugin to capture images of the repaired marble. After image acquisition, a repaired image of the marble is obtained. At this point, the terminal sends an imaging completion signal. Upon receiving the signal, the server retrieves the terminal ID of the terminal and the acquired repaired image.

[0140] The server can retrieve the workload statistics table for the machine based on its terminal ID, and determine the current repair count of the repaired image based on the historical repair count in the workload statistics table. For example, if the historical repair count in the workload statistics table is 5, then the current repair count of the repaired image is 6. The server then creates a marker box around the edge of the repaired image to mark the terminal ID and the current repair count. For example, the terminal ID is marked in the upper left corner of the marker box (position 1), and the current repair count is marked in the upper right corner (position 2). After marking, the repaired marked image is obtained. The current repair count and the repaired marked image are then added to the workload statistics table for future viewing by the management end.

[0141] According to the present invention, the server can acquire and identify the image of the marble to be repaired, thereby determining each defective area in the image; then, the server controls the machine to scan each defective area. When the scan result shows that any defective area includes an intact sub-area, the server controls the machine to perform surface grinding of the intact sub-area to a preset depth; next, a grinding enclosure with a preset width is established based on the defect contour of each defective area, and the server controls the machine to perform contour grinding of the defect contour within the grinding enclosure; when the server receives a grinding completion signal from the machine, it controls the machine to inject repair material into each defective area, thereby obtaining a repaired marble including each repaired area; then, the server controls the machine to perform image acquisition on the repaired marble, obtaining a repaired image corresponding to the repaired marble, and marking the repaired image based on the terminal number corresponding to the machine. This invention can accurately determine the location of defective areas and perform detailed grinding, and repair the defective areas after grinding, improving the efficiency and effect of marble repair.

[0142] Another embodiment of the present invention provides an automatic marble polishing and repair system. Figure 3 Its corresponding system block diagram includes:

[0143] The recognition module is configured to acquire an image of the marble to be repaired corresponding to the marble to be repaired, and to recognize the image of the marble to be repaired to determine the defective areas in the image of the marble to be repaired;

[0144] The surface polishing module is configured to control the machine to scan the defective area, and when the defective area includes an intact sub-area, control the machine to perform surface polishing on the intact sub-area to a preset depth.

[0145] The contour polishing module is configured to establish a polishing fence with a preset width based on the defect contour of the defect area, and control the machine end to perform contour polishing on the defect contour based on the polishing fence.

[0146] The infusion module is configured to respond to a polishing completion signal sent by the machine end, and control the machine end to infuse the defective area with repair material to obtain repaired marble including the repaired area.

[0147] The marking module is configured to control the machine to acquire images of the repaired marble, obtain a repaired image corresponding to the repaired marble, and mark the repaired image based on the terminal number corresponding to the machine.

[0148] In the specification provided herein, the algorithms and displays are not inherently related to any particular computer, virtual system, or other device. Various general-purpose systems can also be used with the examples of this invention. The required structure for constructing such systems is apparent from the above description. Furthermore, this invention is not directed to any particular programming language. It should be understood that the contents of the invention described herein can be implemented using various programming languages, and the above description of specific languages ​​is for the purpose of disclosing preferred embodiments of the invention.

[0149] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0150] Similarly, it should be understood that, in order to streamline this disclosure and aid in understanding one or more of the various aspects of the invention, in the above description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof. However, this method of disclosure should not be interpreted as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as reflected in the following claims, inventive aspects lie in fewer than all features of a single foregoing disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into this detailed description, wherein each claim itself is a separate embodiment of the invention.

[0151] Those skilled in the art will understand that modules, units, or components of the devices disclosed in the examples herein can be arranged in the devices described in this embodiment, or alternatively, can be located in one or more devices different from the devices in this example. The modules in the foregoing examples can be combined into a single module or, in addition, can be divided into multiple sub-modules.

[0152] Those skilled in the art will understand that modules in the device of the embodiments can be adaptively changed and placed in one or more devices different from that embodiment. Modules, units, or components in the embodiments can be combined into a single module, unit, or component, and further, they can be divided into multiple sub-modules, sub-units, or sub-components. Except where at least some of such features and / or processes or units are mutually exclusive, any combination can be used to combine all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all processes or units of any method or device so disclosed. Unless expressly stated otherwise, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature that serves the same, equivalent, or similar purpose.

[0153] Furthermore, those skilled in the art will understand that although some embodiments described herein include certain features but not others included in other embodiments, combinations of features from different embodiments are intended to be within the scope of the invention and form different embodiments. For example, in the following claims, any of the claimed embodiments can be used in any combination.

[0154] Furthermore, some of the embodiments described herein are methods or combinations of method elements that can be implemented by a processor of a computer system or by other means of performing the functions. Therefore, a processor having the necessary instructions for implementing the methods or method elements forms means for implementing the methods or method elements. Furthermore, the elements described herein in the apparatus embodiments are examples of means for implementing the functions performed by elements for the purposes of carrying out the invention.

[0155] As used herein, unless otherwise specified, the use of ordinal numbers such as “first,” “second,” “third,” etc., to describe ordinary objects merely indicates different instances of similar objects and is not intended to imply that the objects being described must have a given order in time, space, ordering, or any other manner.

[0156] Although the invention has been described with respect to a limited number of embodiments, those skilled in the art will understand from the foregoing description that other embodiments are conceivable within the scope of the invention described herein. Furthermore, it should be noted that the language used in this specification has been chosen primarily for readability and edibility purposes, and not for the purpose of interpreting or limiting the subject matter of the invention. Therefore, many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the appended claims. The disclosure of the invention is illustrative rather than restrictive, and the scope of the invention is defined by the appended claims.

Claims

1. An automatic polishing and repair method for marble, characterized in that, Includes the following steps: Obtain the image to be repaired corresponding to the marble to be repaired, and identify the defective areas in the image to be repaired; The machine is controlled to scan each of the defective areas, and when the scan result shows that any of the defective areas includes an intact sub-area, the machine is controlled to perform surface polishing on the intact sub-area to a preset depth. Based on the defect contour of each defect area, a polishing fence with a preset width is established, and the machine is controlled to perform contour polishing on the defect contour based on the polishing fence. In response to the polishing completion signal sent by the machine, the machine is controlled to inject repair material into each of the defective areas to obtain repaired marble including each repaired area. The machine terminal is controlled to acquire images of the repaired marble, obtain a repaired image corresponding to the repaired marble, and mark the repaired image based on the terminal number corresponding to the machine terminal. The process of identifying the image to be repaired and determining the defective regions within the image includes: Determine the base color of the marble to be repaired, and set the base color as the base color; The pixel values ​​corresponding to each image pixel in the image to be repaired are obtained, and the image pixels with pixel value differences within a preset range and adjacent pixels are divided into the same pixel region to obtain each pixel region; The mean value of each pixel value corresponding to each image pixel point located in the same pixel region is calculated to obtain the mean value of each pixel corresponding to each pixel region. The average value of each pixel is compared with the pixel value of the reference color, and the pixel region corresponding to the average value of the pixel value that is different from the reference color is determined as the region to be determined, thus obtaining each region to be determined; The machine is controlled to scan each of the areas to be determined, and based on the scanning results, each defective area in the image to be repaired is determined. Based on the defect contour of the defect area, a polishing fence with a preset width is established, and the machine is controlled to perform contour polishing on the defect contour based on the polishing fence, including: Determine the half-width value of the preset width, and generate a fence outline that surrounds the defect outline and is spaced from the defect outline by half-width value; The area located between the fence outlines is defined as the initial fence, and it is determined whether there are intersecting parts of other defective outlines in the initial fence; When there are intersecting parts of other defect contours in the initial fence, the intersecting contour of the intersecting parts is determined, and the fence contour of the initial fence is updated based on the intersecting contour to obtain the polished fence. Controlling the machine to perform contour grinding on the defect contour based on the grinding fence includes: The machine is controlled to perform contour grinding on the defect contour, and the real-time position of the grinding point on the machine is determined. When the grinding point of the machine end is located on the outline of the fence, grinding intervention measures are applied to the machine end, wherein the grinding intervention measures include at least one of the following: Control the machine to stop polishing until the polishing point moves toward the defect outline and remains there for a preset time; and The machine is controlled to gradually reduce the polishing speed until the polishing point moves toward the defect outline and is maintained for a preset time.

2. The automatic marble polishing and repair method according to claim 1, characterized in that, The machine terminal is controlled to scan each of the regions to be determined, and based on the scanning results, each defective region in the image to be repaired is determined, including: A two-dimensional coordinate system is established with any vertex of the image to be repaired as the origin; First dividing lines with a preset interval are generated in a direction perpendicular to the X-axis of the two-dimensional coordinate system, and second dividing lines with a preset interval are generated in a direction perpendicular to the Y-axis of the two-dimensional coordinate system. The intersections of each first dividing line and each second dividing line are obtained to form the intersection points, and the intersection points located in each region to be determined are determined as region scanning points; The machine terminal is controlled to perform infrared point scanning on all area scanning points located in each area to be determined, so as to obtain the scanning depth corresponding to each area scanning point; Obtain the reference depth of the marble to be repaired, and compare the scanning depth corresponding to each scanning point with the reference depth; When the scanning depth corresponding to any region scanning point in any region to be determined is greater than the reference depth, the region to be determined is determined as a marked region. Based on the relative positions of all the marked regions, the defective regions in the image to be repaired are determined.

3. The automatic marble polishing and repair method according to claim 2, characterized in that, Obtaining the reference depth of the marble to be repaired includes: A reference contour is generated by extending the defect contour outward by a predetermined distance along any of the defect areas, and the area between the defect contour and the reference contour is defined as the reference area. Three reference points are selected in the reference area, and the three reference points are connected to obtain a reference surface located outside the other defect areas; The machine is controlled to perform an infrared array scan on the reference surface to obtain the reference depth corresponding to the reference surface.

4. The automatic marble polishing and repair method according to claim 2, characterized in that, Based on the relative positional relationships between all the marked regions, the defective regions in the image to be repaired are determined, including: Based on the two-dimensional coordinate system, the coordinate points of each region located in each marked region are obtained and formed into a region coordinate group, thus obtaining the region coordinate group corresponding to each marked region. Perform pairwise comparisons on each region coordinate group, and determine whether there is an enclosing relationship between the region coordinate groups based on the comparison results; The coordinates of regions with an enclosing relationship are combined into a single defect region, and the coordinates of regions without an enclosing relationship are respectively determined as different defect regions, thus identifying each defect region in the image to be repaired.

5. The automatic marble polishing and repair method according to claim 2, characterized in that, The machine is controlled to scan the defective area, and when the scan result indicates that the defective area includes an intact sub-area, the machine is controlled to perform surface polishing on the intact sub-area to a preset depth, including: The control machine performs an infrared array scan on the defective area to obtain the infrared distance distribution of the defective area, and determines the areas with the same infrared distance and formed in one piece as planar sub-regions based on the infrared distance distribution. The infrared distance corresponding to each planar sub-region is compared with the reference depth, and the defective region is determined based on the comparison result to determine whether the intact sub-region is included. When the infrared distance corresponding to any planar sub-region is the same as the reference depth, the planar sub-region is determined as an intact sub-region, the center point of the intact sub-region is obtained, and the machine is controlled to perform surface grinding based on a preset depth with the center point of the sub-region as the grinding reference point.

6. The automatic marble polishing and repair method according to claim 1, characterized in that, The system controls the machine to acquire images of the repaired marble, obtaining a repaired image corresponding to the repaired marble, and labels the repaired image based on the terminal number corresponding to the machine, including: The machine is controlled to retrieve a preset shooting plugin and to capture images of the repaired marble based on the preset shooting plugin, thereby obtaining a repaired image corresponding to the repaired marble. In response to the shooting completion signal sent by the machine, the terminal number corresponding to the machine and the repaired image are obtained; The workload statistics table corresponding to the terminal number is retrieved, and the current repair count corresponding to the repaired image is determined based on the historical repair count in the workload statistics table. A bounding box is created around the edge of the repaired image, and the terminal number is marked at the first position of the bounding box and the current repair count is marked at the second position of the bounding box to obtain a repaired marked image; Add the current repair count and the repair marker image to the workload statistics table.

7. An automatic marble polishing and repair system, used to implement the automatic marble polishing and repair method as described in any one of claims 1-6, characterized in that, include: The recognition module is configured to acquire an image of the marble to be repaired corresponding to the marble to be repaired, and to recognize the image of the marble to be repaired to determine the defective areas in the image of the marble to be repaired; The surface polishing module is configured to control the machine to scan the defective area, and when the defective area includes an intact sub-area, control the machine to perform surface polishing on the intact sub-area to a preset depth. The contour polishing module is configured to establish a polishing fence with a preset width based on the defect contour of the defect area, and control the machine end to perform contour polishing on the defect contour based on the polishing fence. The infusion module is configured to respond to a polishing completion signal sent by the machine end, and control the machine end to infuse the defective area with repair material to obtain repaired marble including the repaired area. The marking module is configured to control the machine to acquire images of the repaired marble, obtain a repaired image corresponding to the repaired marble, and mark the repaired image based on the terminal number corresponding to the machine.

Images