Water distributor for semiconductor heat dissipating device and semiconductor heat dissipating device

Abstract

The application provides a water distributor for a semiconductor heat dissipation device and the semiconductor heat dissipation device, the water distributor comprising: a cooling water inlet channel, the cooling water inlet channel comprising at least one cooling water outlet hole, the at least one cooling water outlet hole having a first shielding part, the first shielding part blocking a part of the radial cross section of the cooling water outlet hole; a backwater channel, the backwater channel comprising at least one backwater inlet hole; and a semiconductor heat dissipation device, the semiconductor heat dissipation device comprising at least one cooling channel, two ends of the cooling channel being respectively connected with the cooling water outlet hole and the backwater inlet hole; the area of the radial cross section of the first shielding part is determined by the depth or angle of the cooling water outlet hole; and the area of the radial cross section of the first shielding part is negatively related to the heat carried by the cooling channel connected with the cooling water outlet hole, and the water distributor provided by the application can improve the uniformity and effectiveness of heat dissipation of the semiconductor heat dissipation device.

Description

Technical Field

[0001] The present invention relates to a water distributor and a semiconductor heat dissipation device configured with such a water distributor. Background Technology

[0002] Currently, semiconductor integrated modules integrate a large number of semiconductor devices, thus placing high demands on semiconductor heat dissipation devices. Circulating cooling water into the semiconductor heat dissipation device is an efficient and direct heat dissipation method. However, the cooling water supply device is usually directly connected to the semiconductor heat dissipation device through pipes. This makes it impossible to effectively adjust the cooling water flow rate in a timely manner according to the heat dissipation needs of the semiconductor integrated module, resulting in uneven heat dissipation of the semiconductor integrated module. In areas with high integration density, insufficient heat dissipation often damages semiconductor devices, causing them to malfunction.

[0003] Existing technologies have also included solutions that use obstruction to change the flow rate of cooling water, but these solutions are mostly bulky, unsuitable for semiconductor integrated modules, and cannot be fine-tuned. Summary of the Invention

[0004] The purpose of this invention is to provide a water distributor and a semiconductor heat dissipation device to solve the problems of uneven heat dissipation and low heat dissipation efficiency of semiconductor element heat dissipation devices.

[0005] The present invention also aims to provide a water distributor and a semiconductor heat dissipation device to solve the problem that the water flow rate cannot be finely adjusted after the product is formed.

[0006] In a first aspect, the present invention provides a water distributor for a semiconductor heat dissipation device, comprising: A cooling water inlet channel, the cooling water inlet channel including at least one cooling water outlet, the at least one cooling water outlet having a first blocking portion, the first blocking portion blocking a portion of the radial cross-section of the cooling water outlet; A return water channel, wherein the return water channel includes at least one return water inlet hole; The semiconductor heat dissipation device includes at least one cooling channel, with both ends of the cooling channel connected to the cooling water outlet and the return water inlet, respectively. The area of ​​the radial section of the first shielding part is determined by the depth or angle of the cooling water outlet hole; and the area of ​​the radial section of the first shielding part is negatively correlated with the heat carried by the cooling channel connected to the cooling water outlet hole.

[0007] Secondly, the present invention provides a water distributor for a semiconductor heat dissipation device, comprising a cooling water inlet channel, the cooling water inlet channel including at least one cooling water outlet, the at least one cooling water outlet having a first shielding portion; a return water channel, the return water channel including at least one return water inlet; the semiconductor heat dissipation device including at least one cooling channel, the two ends of the cooling channel being respectively connected to the corresponding cooling water outlet and the return water inlet; at least one cooling channel having a second shielding portion at one end connected to the cooling water outlet, the water output of the cooling water outlet being determined by the degree of overlap between the second shielding portion and the first shielding portion, the water output being positively correlated with the heat carried by the cooling channel corresponding to the cooling water outlet.

[0008] Furthermore, the cooling channel includes at least one cooling water inlet and at least one return water outlet; The cooling water outlet is connected to the corresponding cooling water inlet via a cooling water connecting pipe, and the cooling water connecting pipe has the second shielding part; the return water inlet is connected to the corresponding return water outlet via a return water connecting pipe.

[0009] Furthermore, the cooling water inlet channel has at least one cooling water inlet hole, which is used to supply cooling water to the cooling water inlet channel, and the water inlet direction of the cooling water inlet hole is perpendicular to or at an angle to the water flow direction of the cooling water inlet channel.

[0010] Furthermore, the number of cooling water inlet holes is at least two, and the cooling water inlet channel is divided to form at least two cooling water inlet sub-channels. Each cooling water inlet sub-channel is provided with a cooling water inlet hole, and the cooling water inlet hole provides cooling water to its corresponding cooling water inlet sub-channel.

[0011] Furthermore, on each of the cooling water inlet channels, the sum of the cross-sectional areas of the cooling water outlet holes is less than or equal to the sum of the cross-sectional areas of the cooling water inlet holes.

[0012] Furthermore, within the cooling water inlet channel, the inner wall where the cooling water outlet is located is an arc surface, and the water outlet direction of the cooling water outlet is basically parallel to the water inlet direction of the cooling water inlet channel.

[0013] Furthermore, within the cooling water inlet channel, the inner wall where the cooling water outlet is located is an arc surface, and the angle between the outlet direction of the cooling water outlet and the inlet direction of the cooling water inlet channel is an acute angle.

[0014] Furthermore, the angle between the water outlet direction of at least two of the cooling water outlet holes and the water inlet direction of the cooling water inlet channel is not equal.

[0015] Furthermore, within the cooling water inlet channel, the inner wall where the cooling water outlet is located is a plane, and the angle between the outlet direction of the cooling water outlet and the inlet direction of the cooling water inlet channel is an acute angle.

[0016] Furthermore, the angle between the water outlet direction of at least two of the cooling water outlet holes and the water inlet direction of the cooling water inlet channel is not equal. Furthermore, the degree of overlap is achieved by rotating the cooling water connecting pipe about its axial direction.

[0017] Furthermore, the area of ​​the radial cross-section of the first shielding part is determined by the depth or angle of the cooling water outlet hole.

[0018] On the other hand, the present invention provides a semiconductor heat dissipation device, including the above-mentioned water distributor.

[0019] This invention has at least the following advantages and superior effects: The water distributor provided by this invention can adjust the flow rate of cooling water according to the area requiring heat dissipation in each cooling channel of the semiconductor heat dissipation device, thereby improving the uniformity and effectiveness of heat dissipation. The cooling water outlet portion of the water distributor provided by this invention has a first shielding part, which can adjust the water distribution pressure balance, ensure the uniformity of heat dissipation and improve heat dissipation performance. The depth and angle of the cooling water outlet can be accurately calculated based on the pipe diameter, pipe wall thickness, cooling channel diameter and the heat it carries, which facilitates precise manufacturing. The cooling water outlet portion of the water distributor provided by this invention has a first shielding part, and the cooling water connecting pipe has a second shielding part. Subsequently, the shielding area of ​​the cooling water outlet can be adjusted in a timely manner according to the change in the heat carried by the semiconductor heat dissipation device, thereby improving the temperature uniformity of the semiconductor heat dissipation device. The coolant flow rate of each cooling channel is related to the heat carried by that cooling channel, realizing the overall temperature uniformity of the semiconductor heat dissipation device. Attached Figure Description

[0020] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 A perspective view of the water distributor provided in an embodiment of the present invention; Figure 2 A front view of the water distributor provided in an embodiment of the present invention; Figure 3A radial sectional view of a water distributor provided in an embodiment of the present invention; Figure 4 A rear view of a semiconductor heat dissipation device provided in an embodiment of the present invention; Figure 5 A front view of a semiconductor heat dissipation device provided in an embodiment of the present invention; Figure (6a) is a schematic diagram showing that the angle between the drilling direction and the water inlet direction of the cooling water inlet channel is zero degrees. Figure (6b) is a schematic diagram showing the first acute angle between the drilling direction and the water inlet direction of the cooling water inlet channel; Figure (6c) is a second schematic diagram in which the angle between the drilling direction and the water inlet direction of the cooling water inlet channel is acute. Figure 7 This is a cross-sectional view of the water distributor provided in Embodiment 2 of the present invention; Figure (8a) is a schematic diagram of the second shielding part of the cooling water connection pipe; Figure (8b) is a schematic diagram of the structure of the first shielding part of the cooling water outlet; Figure (8c) is a first schematic diagram showing the structural overlap between the first shielding part of the cooling water outlet and the second shielding part of the cooling water connecting pipe; Figure (8d) is a second schematic diagram showing the structural overlap between the first shielding part of the cooling water outlet and the second shielding part of the cooling water connecting pipe.

[0022] Icons: 1-Water distributor; 11-Cooling water outlet; 111-First shield; 112-First cooling water outlet; 113-Second cooling water outlet; 12-Return water inlet; 121-First return water inlet; 13-Cooling water inlet; 14-Cooling water inlet channel; 141-Inlet direction of cooling water inlet channel; 15-Return water channel; 16-Through hole; 2-Semiconductor heat dissipation device; 21-Cooling water inlet; 22-Return water outlet; 23-Area requiring cooling; 31-Second shield; 32-Thread. Detailed Implementation

[0023] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] Example 1 This invention provides a water distributor 1 for a semiconductor heat dissipation device, wherein the water distributor 1 is as follows: Figure 1-2As shown, the water distributor 1 is used to provide cooling water to the connected semiconductor heat dissipation device 2. Of course, those skilled in the art can also provide other similar cooling media to replace the cooling water, thereby improving the heat dissipation efficiency and uniformity of the semiconductor heat dissipation device 2. First, refer to... Figure 4-5 The diagram shows a rear view and a front view of the semiconductor heat dissipation device 2 of the present invention. The water distributor 1 can be fixed to one side of the semiconductor heat dissipation device 2 by a bracket. On the other side of the semiconductor heat dissipation device 2, there are multiple areas 23 that need to be cooled. Each area 23 that needs to be cooled is provided with one or more heating elements (multiple in this embodiment), such as a laser. The multiple areas 23 that need to be cooled can be arranged in an array or other irregular arrangement. If the multiple areas 23 that need to be cooled are not uniformly distributed on the surface of the entire semiconductor heat dissipation device 2, then different heat dissipation capabilities need to be provided for different areas according to the heat of the area 23 that needs to be cooled. Corresponding to each cooling area 23, a cooling channel is provided in the semiconductor heat dissipation device 2.

[0025] like Figure 4 As shown, the cooling channel of the semiconductor heat dissipation device 2 includes at least one (multiple in this embodiment) cooling water inlet 21 and at least one (multiple in this embodiment) return water outlet 22. The cooling water outlet 11 of the water distributor 1 is connected to the corresponding cooling water inlet 21 of the semiconductor heat dissipation device through a cooling water connecting pipe. The return water inlet 12 of the water distributor 1 is connected to the corresponding return water outlet 22 of the semiconductor heat dissipation device 2 through a return water connecting pipe, thereby effectively connecting the water distributor 1 and the semiconductor heat dissipation device 2. Cooling water flows out from the cooling water outlet 11 of the water distributor 1 and enters the semiconductor heat dissipation device 2 through the corresponding cooling water inlet 21 of the semiconductor heat dissipation device 2 to dissipate heat from the multiple areas 23 that need to be cooled. The cooling water that absorbs heat and rises in temperature then flows out through the multiple return water outlets 22 of the semiconductor heat dissipation device 2 and is discharged to the return water inlet 12 of the water distributor 1.

[0026] Secondly, a first shielding part 111 is provided inside the cooling water outlet hole 11. The area of ​​the radial cross section of the first shielding part 111 (referring to the maximum radial cross section area of ​​the first shielding part 111, that is, the area of ​​the radial cross section blocked inside the cooling water outlet hole 11, hereinafter referred to as "the area of ​​the first shielding part 111") is determined by the heat of the area 23 that needs to be cooled by the cooling channel connected to the cooling water outlet hole 11.

[0027] by Figure 5For example, along the paper from top to bottom, the area 23 on the surface of the semiconductor heat sink 2 that needs cooling is largest in the middle and gradually decreases on both sides. However, the present invention is not limited to this situation. That is to say, in order to ensure the uniformity of heat dissipation of the semiconductor heat sink 2, the area 23 that needs cooling in the middle is the largest, so the amount of water that needs to be introduced is the largest. As the areas that need cooling on both sides gradually decrease, the amount of water that needs to be introduced can be gradually reduced. Therefore, if the area 23 that needs cooling is small, the amount of water that needs to be introduced is small, so the area of ​​the first shielding part 111 of the cooling water outlet hole 11 on the corresponding water distributor 1 can be set to be larger. Conversely, if the area 23 that needs cooling is large, the amount of water that needs to be introduced is large, so the area of ​​the first shielding part 111 of the cooling water outlet hole 11 on the corresponding water distributor 1 can be set to be smaller, or even set to be in a fully open state (that is, without the first shielding part 111) to provide the maximum water flow.

[0028] The detailed structure of water distributor 1 is as follows: Figure 1-2 As shown, the water distributor 1 includes: The cooling water inlet channel 14 includes a plurality of cooling water outlet holes 11, wherein the plurality of cooling water outlet holes 11 have a first shielding part 111, which is used to shield part of the cross-sectional area of ​​the cooling water outlet hole 11, thereby adjusting the water distribution pressure balance and adjusting the water flow rate of the cooling water outlet hole 11.

[0029] It also includes a return water channel 15, which includes multiple return water inlet holes 12. The return water inlet holes 12 are all through holes, and can also be equipped with a shielding part as needed.

[0030] In particular, along the radial direction of the cooling water outlet 11, the area of ​​the first blocking portion 111 of the cooling water outlet 11 is determined by the different drilling depths of the cooling water outlet 11, such as... Figure 3 As shown, the inner wall of the cooling water inlet channel 14 is an arc surface. D1 and D2 are the drilling depths. The area of ​​the first blocking part 111 is different depending on the drilling depth. The cooling water inlet channel 14 is symmetrically provided with a first cooling water outlet hole 112 and a second cooling water outlet hole 113 on both sides of the axial direction. The areas of the first blocking parts 111 corresponding to the first cooling water outlet hole 112 and the second cooling water outlet hole 113 are the same, and their corresponding drilling depths D1 are the same. There is no first blocking part 111 in the first return water inlet hole 121, and its corresponding drilling depth is D2. The drilling depth D1 is less than the drilling depth D2. It is also known that a larger area of ​​the first obstruction portion 111 inside the cooling water outlet hole 11 results in a smaller drilling depth for the outlet hole, while a smaller area of ​​the first obstruction portion 111 results in a larger drilling depth. When the cooling water outlet hole 11 has no first obstruction portion 111, the cooling water outlet hole 11 is completely drilled through during drilling. Preferably, a thread 32 is provided on the inner surface of the outlet hole for connecting a cooling water connecting pipe (see...). Figure 3 More preferably, threads 32 can be provided on the entire inner surface of the water outlet hole.

[0031] In addition, such as Figure 1 As shown, the cooling water inlet channel 14 has at least one cooling water inlet hole 13, which is used to supply cooling water to the cooling water inlet channel 14. The cross-sectional area (diameter of water passage) of the cooling water inlet channel 14 is greater than or equal to the sum of the cross-sectional areas of all cooling water outlet holes, thereby ensuring that the water output requirements of the cooling water outlet hole 11 are met.

[0032] Furthermore, the water inlet direction of the cooling water inlet hole 13 is set perpendicular to or at an angle to the water flow direction of the cooling water inlet channel 14. When set perpendicularly, the water inlet direction of the cooling water inlet hole 13 is perpendicular to the water flow direction of the cooling water inlet channel 14, allowing the cooling water to first reach the pipe wall of the cooling water inlet channel 14 vertically, and then flow laterally to each cooling water inlet hole 13, thus ensuring that the water flow velocity and pressure next to the different cooling water outlet holes 11 are consistent. If the cooling water inlets are directly set on the left and right sides of the cooling water channel 14, the water inlet direction of the cooling water inlet hole 13 is parallel to the water flow direction of the cooling water inlet channel 14. In this case, due to the different distances between the different cooling water outlet holes 11 and the cooling water inlet holes 13, the water flow velocity and pressure next to the different cooling water outlet holes 11 will be different.

[0033] The cooling water outlet hole 11 is formed by drilling a hole in the cooling water inlet channel 14. When the inner wall of the cooling water inlet channel 14 where the cooling water outlet hole 11 is located is an arc surface, it is preferable that the radial cross-section of the cooling water inlet channel 14 is circular or elliptical. The drilling angle can also be adjusted within a certain range, for example, the drilling angle can be adjusted between 0 degrees and less than 90 degrees. Figure 6 As shown, the water inlet direction of the cooling water inlet channel 14 is 141, and the drilling direction is as indicated by the arrow in the figure. Figure 6 As shown in Figure a, the angle between the drilling direction and the water inlet direction 141 of the cooling water inlet channel (hereinafter referred to as the drilling angle) can be zero, that is, the drilling direction is basically parallel to the water inlet direction 141 of the cooling water inlet channel. The cooling water outlet holes 11 can be configured in multiple rows, such as... Figure 6 The drilling angle shown in b can also be an acute angle. Multiple cooling water outlet holes 11 can be set at the same angle or different angles. The acute-angled inclined drilling allows for increasing the thickness of the first shielding part 111 when its area is small, thus preventing damage during use. By utilizing the curved inner cavity surface, different drilling depths can adjust the size of the first shielding surface of the cooling water outlet hole 11, ensuring consistent and balanced water distribution pressure. Figure 6 In the diagram, d1, d2, and d3 represent the drilling depth, such as... Figure 6As shown in a-6c, with Figure 6 Taking a as an example, along the direction of the drilling arrow (that is, from the outside to the inside of the water inlet channel), the cooling water outlet 11 formed by drilling from the outside to the inside of the water inlet channel has two intersection points P1 and P2 with the inner wall of the water inlet channel, and two intersection points P3 and P4 with the outer wall of the water inlet channel. Along the direction of the drilling arrow ( Figure 6 The drilling depth is the distance d1 between the projections of the points P1 (closer to the inner side of the inner wall of the inlet pipe) and P4 (closer to the outer side of the outer wall of the inlet pipe) onto the drilling direction (in the direction of the arrow in "a"). A larger drilling depth results in a smaller area of ​​the first shielding portion 111 in the cooling water outlet 11, while a smaller drilling depth results in a larger area of ​​the first shielding portion 111 in the cooling water outlet 11. This ingenious use of drilling depth to change the size of the first shielding portion 111 in the case of an arc-shaped inner cavity does not increase the volume of the water distributor 1, nor does it require additional positioning of the cooling water inlet channel 14, thus increasing versatility.

[0034] In another embodiment, see Appendix Figure 6 c. Within the cooling water inlet channel 14, the inner wall where the cooling water outlet 11 is located is flat. Preferably, the radial cross-section of the cooling water inlet channel 14 is rectangular or square, etc. Therefore, inclined drilling is required to change the area of ​​the first blocking part 111. The drilling angle can be adjusted within a certain range, for example, greater than 0 degrees and less than 90 degrees. Multiple cooling water outlets 11 can be set at the same angle or different angles. Figure 6 As shown in c, the drilling angle is an acute angle.

[0035] In addition, such as Figure 1 As shown, a central through hole 16 can be provided between the cooling water inlet channel 14 and the cooling water return channel 15 of the water distributor. The central through hole 16 can structurally separate the cooling water inlet channel 14 and the cooling water return channel 15 to avoid thermal crosstalk between them. In addition, the central through hole 16 can further reduce the weight of the water distributor 1 while increasing the structural strength of the water distributor 1.

[0036] Example 2 like Figure 7 As shown, there are two cooling water inlet holes 13 (or more, as those skilled in the art can know), located on both sides of the cooling water inlet channel 14. The cooling water inlet channel 14 is divided to form two cooling water inlet sub-channels (or more than two, such as three or four, etc.). The cooling water inlet holes 13 located on both sides of the cooling water inlet channel 14 provide cooling water to their respective cooling water inlet sub-channels.

[0037] The technical solutions in the above-described embodiments of this application have at least the following technical effects or advantages: By setting two cooling water inlet holes 13 (or more, such as three or five), and dividing the cooling water inlet channel 14 into two (or more, such as three or five) sub-channels, the circulation speed of the cooling water can be increased, thereby further improving the heat dissipation efficiency of the semiconductor heat dissipation device 2; in addition, two rows of cooling water outlet holes 11 and return water inlet holes 12 are set on both the left and right sides, which can reduce the volume of the water distributor 1 and further improve the consistency of water flow rate and pressure in different cooling water outlet holes 11.

[0038] Example 3 See Figure 1 , 2 8. Based on Embodiments 1 and 2, at least one of the aforementioned cooling water connecting pipes (see Figure 8 a) One end connected to the cooling water outlet 11 has a second shielding part 31, such as Figure 8 As shown in Figure a, the amount of water flowing out of the cooling water outlet 11 is adjusted by the degree of overlap between the second shielding part 31 and the first shielding part 111 of the cooling water outlet 11.

[0039] The technical solutions described in the above embodiments of this application have at least the following technical effects or advantages: They can solve the problem that after the cooling water outlet hole 11 is formed by drilling, the size of the shielding area cannot be further adjusted according to the adjustment of the semiconductor heat dissipation device 2. A small shielding area (i.e., a second shielding part 31) is also made at the port of the cooling water connecting pipe (quick-connect pipe) corresponding to each cooling water outlet hole 11. After the cooling water connecting pipe is sealed and connected to the cooling water outlet hole 11, the cooling water connecting pipe can still rotate but not move axially. The water flow rate can be finely adjusted by utilizing the rotation of its own second shielding part 31 and the overlapping area of ​​the first shielding part 111 of the cooling water outlet hole 11. Of course, those skilled in the art can also utilize the elasticity of the sealing gasket between the cooling water connecting pipe and the cold water outlet hole to adjust the overlapping area by rotating the cooling water connecting pipe slightly more or less while ensuring a seal. In short, those skilled in the art can achieve the rotation of the cooling water connecting pipe according to various existing connection methods between the cooling water connecting pipe and the cold water outlet hole. According to the above embodiments, when the area 23 that needs to be cooled on the subsequent semiconductor heat dissipation device changes, or when the first shielding part 111 is damaged, the flow rate of the cold water outlet can be further adjusted, thus expanding the applicability of the water distributor.

[0040] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A water distributor for a semiconductor heat dissipation device, comprising: A cooling water inlet channel, the cooling water inlet channel including at least one cooling water outlet, the at least one cooling water outlet having a first blocking portion, the first blocking portion blocking a portion of the radial cross-section of the cooling water outlet; A return water channel, wherein the return water channel includes at least one return water inlet hole; The semiconductor heat dissipation device includes at least one cooling channel, and the two ends of the cooling channel are respectively connected to the corresponding cooling water outlet and the return water inlet. The feature is that: the area of ​​the radial cross section of the first shielding part is determined by the depth or angle of the cooling water outlet hole; and the area of ​​the radial cross section of the first shielding part is negatively correlated with the heat carried by the cooling channel connected to the cooling water outlet hole.

2. A water distributor for a semiconductor heat dissipation device, comprising: A cooling water inlet channel, the cooling water inlet channel including at least one cooling water outlet, the at least one cooling water outlet having a first blocking portion, the first blocking portion blocking a portion of the radial cross-section of the cooling water outlet; a return water channel, the return water channel including at least one return water inlet; a semiconductor heat dissipation device, including at least one cooling channel, the two ends of the cooling channel being respectively connected to the corresponding cooling water outlet and the return water inlet; characterized in that: at least one cooling channel has a second blocking portion at one end connected to the cooling water outlet, the water output of the cooling water outlet is determined by the degree of overlap between the second blocking portion and the first blocking portion, the water output is positively correlated with the heat carried by the cooling channel corresponding to the cooling water outlet.

3. The water distributor according to claim 2, characterized in that, The cooling channel includes at least one cooling water inlet and at least one return water outlet; The cooling water outlet is connected to the corresponding cooling water inlet via a cooling water connecting pipe, and the cooling water connecting pipe has the second shielding part; the return water inlet is connected to the corresponding return water outlet via a return water connecting pipe.

4. The water distributor according to claim 1 or 2, characterized in that, The cooling water inlet channel has at least one cooling water inlet hole, which is used to supply cooling water to the cooling water inlet channel, and the water inlet direction of the cooling water inlet hole is perpendicular to or at an angle to the water flow direction of the cooling water inlet channel.

5. The water distributor according to claim 4, characterized in that, The number of cooling water inlet holes is at least two, and the cooling water inlet channel is divided to form at least two cooling water inlet sub-channels. Each cooling water inlet sub-channel is provided with a cooling water inlet hole, and the cooling water inlet hole provides cooling water to its corresponding cooling water inlet sub-channel.

6. The water distributor according to claim 4, characterized in that, On each of the cooling water inlet channels, the sum of the cross-sectional areas of the cooling water outlet holes is less than or equal to the sum of the cross-sectional areas of the cooling water inlet holes.

7. The water distributor according to claim 1 or 2, characterized in that, The inner wall of the cooling water outlet is curved, and the water outlet direction is basically parallel to the water inlet direction of the cooling water inlet channel.

8. The water distributor according to claim 1 or 2, characterized in that, The inner wall of the cooling water outlet is an arc surface within the cooling water inlet channel, and the angle between the outlet direction of the cooling water outlet and the inlet direction of the cooling water inlet channel is an acute angle.

9. The water distributor according to claim 8, characterized in that, The angle between the water outlet direction of at least two of the cooling water outlet holes and the water inlet direction of the cooling water inlet channel is not equal.

10. The water distributor according to claim 1 or 2, characterized in that, The inner wall of the cooling water outlet is a plane, and the angle between the outlet direction of the cooling water outlet and the inlet direction of the cooling water inlet is an acute angle.

11. The water distributor according to claim 10, characterized in that, The angle between the water outlet direction of at least two of the cooling water outlet holes and the water inlet direction of the cooling water inlet channel is not equal.

12. The water distributor according to claim 2 or 3, characterized in that, The degree of overlap is achieved by rotating the cooling water connecting pipe about its axial direction.

13. The water distributor according to claim 1 or 2, characterized in that, The area of ​​the radial cross section of the first shielding part is determined by the depth or angle of the cooling water outlet hole.

14. A semiconductor heat dissipation device, characterized in that, Includes the water distributor as described in any one of claims 1-13.

Images