Temporary board joining method and apparatus

Abstract

A temporary board joining method includes dip coating a temporary joining layer 200 on a first board 100 by dipping the first board into a joining solution containing a surfactant and temporarily joining a second board 300 to the first board through the temporary joining layer. The surfactant includes cetyltrimethylammonium bromide or poly[(chloro-3-methyl-1-vinylimidazolium)-co-(1-vinylpyrrolidinone)]. A board dip coating apparatus includes a joining solution bath 410 in which a joining solution containing a surfactant is contained, a cassette 430 into which a plurality of first boards are loaded, and a driver configured to move the cassette up / down. The driver sequentially moves the cassette down to immerse the first boards in the joining solution, moves the cassette up until the first boards are removed from the joining solution, and moves the cassette up and away from a surface of the joining solution.

Description

[0001] priority

[0002] This application claims priority under the Patent Act to Korean Patent Application No. 10-2021-0178813, filed on December 14, 2021, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] This disclosure relates to embodiments of methods and apparatus for joining plates, and more particularly to temporary plate joining methods and apparatus for temporarily joining plates such that, after the process has been completed, the temporarily joined plates can be separated without damage. Background Technology

[0004] Plates, especially glass plates, are used as substrates in various devices such as lighting and display devices. The thickness of the glass plate directly affects the overall thickness and weight of the display device, etc. Therefore, thinner glass plates are needed. Specifically, due to the recent increase in demand for portable devices, interest in thinner, flexible glass plates is rapidly increasing for the manufacture of flexible devices.

[0005] However, flexible glass sheets present a problem because they are difficult to transfer during processing due to the sagging and bending characteristics of thin glass sheets. Therefore, a method has been proposed to facilitate the transfer of glass sheets during processing using existing process conditions established for rigid glass sheets. The method involves temporarily bonding the flexible glass sheet to a carrier glass sheet, subjecting the bonded structure to a predetermined process, and then separating the carrier glass sheet from the flexible glass sheet after the process is complete.

[0006] The bond strength between the flexible glass panel and the carrier glass panel should be sufficient to maintain the bond throughout the entire manufacturing process of the lighting device, display device, etc., while allowing the flexible glass panel and carrier glass panel to be separated after the device's manufacturing process is completed. Once separated, the carrier glass panel can be reused to reduce manufacturing costs.

[0007] Therefore, a temporary plate bonding method is needed that can provide optimal bonding energy and has reduced bonding energy differences across the entire area of ​​the bonded structure. Summary of the Invention

[0008] The first aspect of this disclosure provides a temporary plate joining method having a reduction in the joining energy over the entire area of ​​the joined structure.

[0009] This disclosure also includes various embodiments relating to a temporary plate joining method that can maintain the surface cleanliness of the plate.

[0010] This disclosure also includes various embodiments relating to a temporary plate joining method that can improve alignment accuracy and the quality of the joining between plates and can facilitate plate transfer during joining.

[0011] This disclosure also includes various embodiments relating to a temporary plate bonding method that minimizes the problem of degassing of the self-bonded structure during subsequent manufacturing processes of devices such as lighting devices or display devices.

[0012] This disclosure also includes various embodiments relating to a temporary plate bonding method that eliminates the need for post-bonding heat treatment, thereby reducing processing time and costs.

[0013] In one or more embodiments, the temporary plate bonding method may include: applying a temporary bonding layer to the first plate by immersing the first plate in a bonding solution comprising a surfactant; and temporarily bonding a second plate to the first plate through the temporary bonding layer.

[0014] In some embodiments, the surfactant may include hexadecyltrimethylammonium bromide or poly[(3-methyl-1-vinylimidazolium chloride)-co-(1-vinylpyrrolidone)].

[0015] In some alternative embodiments, the surfactant may include poly[(chloro-3-methyl-1-vinylimidazolium)-co-(1-vinylpyrrolidone)].

[0016] In some embodiments, the concentration of the surfactant in the bonding solution is in the range of 0.1 mM to 5.0 mM.

[0017] In some embodiments, the dip coating may include performing a first movement to move the first plate downward to immerse the first plate in the bonding solution; performing a second movement to move the first plate upward until the first plate is removed from the bonding solution; and performing a third movement to move the first plate upward and away from the surface of the bonding solution.

[0018] In one or more embodiments, the second movement may include moving the first plate upward at a speed in the range of 5 mm / sec to 5.0 mm / sec.

[0019] In one or more embodiments, the temporary engagement between the second plate and the first plate may include: initiating the temporary engagement between the second plate and the first plate by bringing one side of the second plate into contact with the temporary engagement layer; gradually extending the temporary engagement between the second plate and the first plate by gradually extending the contact between the second plate and the temporary engagement layer from the one side to the other side of the second plate; and completing the temporary engagement between the second plate and the first plate on the other side of the second plate.

[0020] In one or more embodiments, the first plate may be thicker than the second plate.

[0021] In one or more embodiments, each of the first plate and the second plate may be a glass plate. The difference in the coefficients of thermal expansion between the first plate and the second plate may be at least or less than ±2.0 x 10⁻⁶. -6 / ℃.

[0022] A second aspect of this disclosure relates to a plate dip coating apparatus, which may include: a bonding solution bath containing a bonding solution of a surfactant; a cartridge into which a plurality of first plates are loaded; and a drive configured to move the cartridge upwards / downwards. In one or more embodiments, the drive may be configured to sequentially perform: a first movement to move the cartridge downwards to immerse the first plates in the bonding solution; a second movement to move the cartridge upwards until the first plates are removed from the bonding solution; and a third movement to move the cartridge upwards and away from the surface of the bonding solution.

[0023] The third aspect relates to a temporary plate bonding apparatus for temporarily bonding a second plate to a first plate via a temporary bonding layer. In one or more embodiments, the temporary plate bonding apparatus may include: a support on which the second plate and the first plate are positioned, wherein a vacuum suction orifice is provided in the surface of the support; a position guide configured to align the second plate in a second alignment position when positioned in a second alignment position and to align the first plate in a first alignment position when positioned in a first alignment position; a vacuum suction unit configured to apply a vacuum to the vacuum suction orifice; and a driver configured to drive the position guide. The driver may drive the position guide to be positioned in the second alignment position, and after the second plate is positioned in the second position, drive the position guide to be positioned in the first alignment position. After the second plate is positioned in the second position, the vacuum suction unit may clamp the second plate onto the support by applying a vacuum to the vacuum suction orifice.

[0024] In some embodiments, the second alignment position and the first alignment position of the position guide can be set such that the edge of the first plate located in the first position is positioned outside the edge of the second plate located in the second position.

[0025] Based on the configuration described above, a temporary plate bonding method can be provided that can form a uniform coating of bonding material to reduce the difference in bonding energy across the entire area of ​​the bonded structure and facilitate processing. By optimizing the concentration of the bonding solution and the coating speed, a coating can be formed without concentration differences. Due to the reduction in coating concentration differences, a bonded structure with a uniform bonding energy distribution can be prepared. Furthermore, there is an advantage when dip coating is performed by immersing a cartridge loaded with multiple plates (e.g., 20 to 30 plates) in the bonding solution and then removing the cartridge from the bonding solution, as it is easy to coat multiple plates with the bonding material.

[0026] Furthermore, this disclosure provides embodiments of a temporary board bonding method capable of maintaining the surface cleanliness of the boards. In one or more embodiments, a first board that serves only as a carrier substrate may be coated with a bonding material, and the surface of a second board that serves as a substrate for a device such as a lighting device or a display device may be kept clean, thereby maintaining a suitable level of cleanliness.

[0027] Furthermore, this disclosure provides various embodiments of a temporary board joining method that can improve alignment accuracy and the quality of bonding between boards and facilitate the transfer of boards during bonding. To join a first board and a second board, a bonding jig can be used, the jig including a positioning guide that aligns the first board and the second board in a bonding position; and a support that uses vacuum suction to hold the second board, which would otherwise be easily movable during the bonding operation, and releases the second board after bonding. When the first board and the second board are joined using a bonding jig, the alignment accuracy of the bonding can be improved, and the loading / unloading transfer of the second board and the first board during bonding can be facilitated. Therefore, the generation of bubbles or warping that may occur on the bonding surface can be minimized. Additionally, manual transfer of boards during the bonding operation can be minimized, thereby reducing stains such as fingerprints and scratches and edge cracks that may occur on the board surface.

[0028] Furthermore, this disclosure provides various embodiments of a temporary plate bonding method capable of minimizing degassing problems that occur during subsequent manufacturing processes of the device. In subsequent device manufacturing processes, the bonded structure may be exposed to high-temperature environments, and degassing problems can occur when the bonding material evaporates at this time. In this disclosure, a heat-stable material that is stable at high temperatures and therefore can withstand processing without the risk of degassing can be selected as the bonding material.

[0029] Furthermore, this disclosure provides various embodiments of a temporary plate bonding method that eliminates the need for post-bonding heat treatment, thereby reducing processing time and costs. Bonding energy suitable for subsequent device manufacturing processes can be provided, and thus the bonded structure can be used in device manufacturing processes without additional heat treatment operations. Therefore, processing time and costs can be advantageously reduced.

[0030] Various embodiments of the methods and apparatus disclosed herein have other features and advantages that are obvious from the accompanying drawings or set forth in more detail in the drawings, the disclosure of which is incorporated herein by reference, and which, in the following embodiments, are described in detail in the accompanying drawings. Figure 1 It is used to explain certain principles of this disclosure. Attached Figure Description

[0031] Figure 1 A diagram illustrating, for the purpose of schematically illustrating, a connection structure in which the first plate and the second plate are temporarily joined according to an embodiment of the present disclosure;

[0032] Figure 2 A flowchart illustrating a temporary plate joining method according to one embodiment of the present disclosure;

[0033] Figure 3 A diagram illustrating the sequence of bonding layers applied to a first plate according to one embodiment of the present disclosure;

[0034] Figure 4 A diagram illustrating the process in which the bonding layer is formed as a single-layer coating film is shown;

[0035] Figure 5 A graph illustrating the results of thermal pyrolysis GC / MS analysis of the first plate on which the bonding layer is formed is shown as an example;

[0036] Figures 6A to 6C A diagram illustrating, for example, a sequence of joining the first plate and the second plate according to one embodiment of the present disclosure;

[0037] Figure 7A and Figure 7B The diagram illustrates the bonding energy distribution of the bonded structure produced by a method according to an embodiment of this disclosure, and compares it with a graph of a prior art immersion and rinsing method; and

[0038] Figure 8 The image illustrates a crack that occurs in the second plate when a first plate and a second plate with different compositions and CTE are joined together and then baked at 250°C for 30 minutes. Detailed Implementation

[0039] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0040] This disclosure includes aspects and embodiments of a fabrication process for a bonding substrate having thermal stability and bonding strength, the bonding substrate being suitable for device manufacturing processes to produce an intended device, such as a lighting device or a display device. Bonding materials, coating methods, and bonding methods suitable for device manufacturing processes will be described. In the following, an organic light-emitting diode (OLED) device is described as an intended device, but this disclosure is not limited thereto.

[0041] In one or more embodiments, the material used to join the first plate and the second plate, which serve as a carrier, should be a material that allows for easy joining of the first plate and the second plate, and is stable at a high temperature of about 300°C so that it can be used during processing without degassing problems.

[0042] Furthermore, various embodiments include simplified processes and coatings that can be performed uniformly without differences in coating concentration within or between plates, as well as various methods for coating the surface of plates with bonding materials. Without being theoretically limited, it should be believed that when the coating concentration on the plate is uneven, some areas of the plate may have strong bonding forces, while other areas may have weak bonding forces. In this situation, in areas with weak bonding forces, the second plate may unintentionally separate from the first plate during subsequent device manufacturing processes. Conversely, in areas with strong bonding forces, the second plate may not easily separate from the first plate after the device manufacturing process is completed. In some cases, the bonding structure may be exposed to high-temperature environments during the device manufacturing process, and thus the first and second plates may become permanently bonded, making them inseparable.

[0043] Regarding the quality of the bonding structure, one surface of the second plate, on which subsequent device manufacturing processes will be performed (e.g., on the surface where an OLED device will be formed), should have a surface quality suitable for the device, ensuring that neither organic contaminants nor surface defects can occur. Furthermore, when bonding the first and second plates, the bonding method should prevent air bubbles from being trapped between the first and second plates or warping from occurring between the first and second plates.

[0044] As described above, various embodiments of this disclosure relate to bonding materials suitable for subsequent high-temperature device manufacturing processes, coating methods and concentrations for achieving uniform and appropriate bonding forces, and temporary plate bonding methods for maintaining the quality of a surface of a second plate on which subsequent processing will be performed and the quality of the plate bonding.

[0045] Additional embodiments involve cleaning the board, applying the bonding layer, and bonding the board, and will describe a temporary board bonding method.

[0046] Figure 1A diagram illustrating a temporary connection structure of the first plate 100 and the second plate 300 according to one embodiment of the present disclosure.

[0047] like Figure 1 As illustrated, the bonding structure may include a first plate 100, a bonding layer 200 coating the first plate 100, and a second plate 300. The first plate 100 and the second plate 300 may be bonded to each other via the bonding layer 200. The first plate 100 may have a first surface 110 and a second surface 120 opposite to the first surface 110. The first plate 100 may have a thickness corresponding to the distance between the first surface 110 and the second surface 120. The bonding layer 200 may be formed on the second surface 120 of the first plate 100. The second plate 300 may have a third surface 310 and a fourth surface 320 opposite to the third surface 310. The third surface 310 of the second plate 300 may face the second surface 120 of the first plate 100. The second plate 300 may have a thickness corresponding to the distance between the third surface 310 and the fourth surface 320. The bonding layer 200 may be interposed between the second surface 120 of the first plate 100 and the third surface 310 of the second plate 300, such that the first plate 100 and the second plate 300 are bonded to each other. The fourth surface 320 of the second plate 300 may be the surface on which subsequent processes will be performed. For example, when the bonding structure is used for the manufacture of an organic light-emitting diode (OLED) lighting device, the OLED device may be stacked on the fourth surface 320 of the second plate 300, and after the manufacturing process of the OLED lighting device has been performed, the first plate 100 may be separated from the second plate 300, with the substrate of the OLED lighting device stacked on the second plate.

[0048] Each of the first plate 100 and the second plate 300 may be a thin plate compared to the lateral and longitudinal lengths of its first surface 110 or fourth surface 320. Furthermore, each of the first surface 110 and fourth surface 320 of the first plate 100 and the second plate 300 may have a polygonal shape, specifically a rectangular shape. However, this disclosure is not limited thereto. The thickness and shape of the first plate 100 or the second plate 300 may vary depending on the device to which the joining structure will be used. The first plate 100 and the second plate 300 may have the same shape or different shapes depending on the embodiment. For example, the first plate 100 may be larger than the second plate 300, such as when the edge of the first plate 100 is located outside the edge of the second plate 300 in the joined state.

[0049] In some embodiments, the first plate 100 and the second plate 300 may be glass plates. The first plate 100 and the second plate 300 may, depending on the embodiment, be plates formed of the same material or plates formed of different materials. In some embodiments, the first plate and the second plate may be glass plates, wherein the difference in the coefficient of thermal expansion (CTE) between the first plate and the second plate is ±2.0 x 10⁻⁶. -6 / ℃.

[0050] In some embodiments, the second plate 300 may be a flexible glass plate having a thickness of, for example, 300 μm or less, 200 μm or less, or 100 μm or less, and the first plate 100 may be thicker than the second plate 300. Thus, the first plate 100 can act as a carrier to facilitate the transport of the second plate 300. However, this disclosure is not limited to this, and the first plate 100 may have the same thickness as or be thinner than the second plate 300. For example, even when the first plate 100 is thinner than the second plate 300, the transportability of the bonded structure of the first plate 100 to the second plate 300 may be improved compared to the transportability of the second plate 300. In some embodiments, the thickness of the first plate 100 may be in the range of 0.25 mm to 1 mm.

[0051] The bonding layer 200 ensures a temporary bond between the first plate 100 and the second plate 300. When the first plate 100 and the second plate 300 are glass plates, it will be understood that in positions where the first plate 100 and the second plate 300 are in contact with each other without the bonding layer 200 of this disclosure, there is a risk that the first plate 100 and the second plate 300 may permanently bond together when exposed to a high-temperature environment. Furthermore, it will also be understood that in this disclosure, the bonding layer 200 should provide a bonding force of sufficient strength, and providing a bonding force weaker or stronger than required is undesirable.

[0052] Figure 2 A flowchart illustrating a temporary plate joining method according to one embodiment of the present disclosure is provided.

[0053] In some embodiments, the temporary plate bonding method may include: a coating operation S200 of applying a temporary bonding layer 200 onto the first plate 100 by immersing the first plate 100 in a bonding solution including a surfactant; and a temporary bonding operation S300 of temporarily bonding the second plate 300 to the first plate 100 through the temporary bonding layer 200. In some of these embodiments, a cleaning operation S100 of cleaning the first plate 100 and the second plate 300 may be performed prior to the coating operation S200 and the temporary bonding operation S300.

[0054] In some embodiments, the first plate 100, which serves only as a carrier, may be coated with the bonding layer 200, and the fourth surface 320 of the second plate 300 may not be coated with organic matter and may be free from any physical contact with contaminated surfaces, so that the fourth surface 320 can maintain a surface quality suitable for the device.

[0055] In some embodiments, cleaning can be performed by placing the first plate 100 and the second plate 300 in a cassette and using a bath-type ultrasonic cleaner or an in-line cleaner. The second plate 300 may only undergo cleaning, and the first plate 100 may be additionally dipped in a coating bath after cleaning to coat with the bonding layer 200.

[0056] In some embodiments, cleaning the first plate 100 using a bath-type ultrasonic cleaner may include loading a plurality of first plates 100 into a cartridge, immersing the cartridge containing the plurality of first plates 100 in a bath containing a cleaning solution, and cleaning the plurality of first plates 100 by applying ultrasound (e.g., vibrations from a vibrator transmitted to the first plates 100 through the cleaning solution). In some embodiments, cleaning the second plate 300 may include loading a plurality of second plates 300 into a cartridge, immersing the cartridge containing the plurality of second plates 300 in a bath containing a cleaning solution, and cleaning the plurality of second plates 300 by applying ultrasound to the plurality of second plates.

[0057] Alternatively, in some embodiments, at least one of the first plate 100 and the second plate 300 may be cleaned using a glass line cleaning machine having brushing, water spraying, and air knife drying sections. In some embodiments, the glass line cleaning machine may have at least one of a plasma cleaning section and an ultrasonic cleaning section.

[0058] The methods for cleaning the first plate 100 and the second plate 300 may be largely the same or different from each other. Specifically, when the first plate 100 and the second plate 300 are made of different materials, different cleaning methods (e.g., different cleaning solutions) may be used.

[0059] Figure 3 To illustrate, in one embodiment of this disclosure, the bonding layer 200 is coated onto the first plate 100 in a sequence, and Figure 4 A diagram illustrating the process in which bonding layer 200 is formed as a single-layer coating film is shown.

[0060] In some embodiments, the bonding solution 411 used in a coating method according to an embodiment of this disclosure may include a surfactant. In some of these embodiments, the surfactant may include cetyltrimethylammonium bromide (CTAB), a type of quaternary ammonium surfactant. Cetyltrimethylammonium bromide is stable at high temperatures and therefore can advantageously withstand processing without degassing during the fabrication process of OLED devices at about 300°C. Alternatively, in some alternative embodiments, the surfactant may include known surfactants such as... The poly[(3-methyl-1-vinylimidazolium chloride)-co-(1-vinylpyrrolidone)] is stable at temperatures ranging from 300°C to 500°C, and is therefore suitable when the first plate is subjected to a process performed at temperatures ranging from 300°C to 500°C. The coating conditions and the resulting bonding energy levels are similar for both CTAB and poly[(3-methyl-1-vinylimidazolium chloride)-co-(1-vinylpyrrolidone)].

[0061] In some embodiments, the concentration of the surfactant in the bonding solution 411 may be in the range of 0.1 mM to 5.0 mM. For example, the bonding solution 411 may be prepared by adding CTAB or poly[(3-methyl-1-vinylimidazole chloride)-co-(1-vinylpyrrolidone)] as a solute to distilled water as a solvent at a molar concentration of 0.125 mM and dissolving CTAB or poly[(3-methyl-1-vinylimidazole chloride)-co-(1-vinylpyrrolidone)] in distilled water as a solvent at a molar concentration of 0.125 mM.

[0062] The coating method can be a dip coating method. Specifically, the concentration of the bonding solution 411 and the coating speed can be optimized to achieve bonding energy suitable for OLED device manufacturing processes and to achieve uniform coating. The concentration of the bonding solution 411 and the coating speed (specifically, the first rise rate, which will be described later) constitute an important feature of this disclosure. When these coating conditions are not met, the bonding layer intended by this disclosure cannot be obtained. The bonding structure obtained using these coating conditions can be used in OLED device manufacturing processes without additional heat treatment (e.g., pre-baking). In some embodiments, dip coating can be performed at room temperature, for example, at a temperature in the range of 10°C to 40°C.

[0063] In some embodiments, the dip coating of the bonding layer 200 may include performing a first downward movement to move the first plate 100 downward to immerse the first plate 100 in the bonding solution 411, performing a first upward movement to move the first plate 100 upward until the first plate 100 is removed from the bonding solution 411, and performing a second upward movement to move the first plate 100 upward and away from the surface of the bonding solution 411.

[0064] Performing a first downward movement to move the first plate 100 downward includes moving the first plate 100 downward at a speed ranging from 5 mm / sec to 20 mm / sec. Performing a first upward movement to move the first plate 100 upward may include moving the first plate 100 upward at a speed ranging from 0.5 mm / sec to 5.0 mm / sec. As described above, the speed of the first upward movement is important to achieve at least one of the objectives of this disclosure. Performing a second upward movement to move the first plate 100 upward may include moving the first plate 100 upward at a speed ranging from 5 mm / sec to 20 mm / sec.

[0065] In some embodiments, the first upward movement may be performed to the point where the bottom end of the first plate 100 is just removed from the top surface of the bonding solution 411.

[0066] In some embodiments, multiple first plates 100 can be simultaneously impregnated when they are loaded into a cartridge. When the multiple first plates 100 are loaded into the cartridge 430, they can be spaced apart from each other, such that gaps are formed between adjacent plates. These gaps between the first plates 100 can be uniform.

[0067] In some embodiments, when dip coating is performed, the first plate 100 may be in a vertical position, that is, the first surface 110 and the second surface 120 to be coated are vertical surfaces, but this disclosure is not limited thereto.

[0068] In some embodiments, the first upward movement and the second upward movement, specifically the first upward movement, may generally be performed in the vertical direction, but this disclosure is not limited thereto.

[0069] This disclosure provides a plate dip coating apparatus for use in a temporary plate bonding method according to embodiments of this disclosure. In some embodiments, the plate dip coating apparatus may include: a bonding solution bath 410, in which a bonding solution 411 comprising a surfactant is contained; a cartridge 430 in which a plurality of first plates 100 are loaded; and a driver (not shown) that causes the cartridge 430 to move up and down. The driver may perform a first downward movement to move the cartridge 430 downward to immerse the first plates 100 in the bonding solution 411, a first upward movement to move the cartridge 430 upward until the first plates 100 are removed from the bonding solution 411, and a second upward movement to move the cartridge 430 upward and away from the surface of the bonding solution 411. In some embodiments, the first downward movement is performed at a speed in the range of 5 mm / sec to 20 mm / sec, the first upward movement is performed at a speed in the range of 0.5 mm / sec to 5.0 mm / sec, and the second upward movement is performed at a speed in the range of 5 mm / sec to 20 mm / sec. In some implementations, the first downward movement, the first upward movement, and the second upward movement, especially the first upward movement, can be performed at a constant speed.

[0070] The drying of the bonding layer 200 can be performed after the bonding layer 200 has been coated onto the first plate 100. In some embodiments, the bonding layer 200 can be dried by: i) subjecting the bonding layer 200 to infrared radiation (IR) heating at 150°C for 400 to 600 seconds in a drying bath in which an infrared radiation (IR) lamp is placed, or ii) blowing hot air onto the bonding layer 200.

[0071] Reference numeral 420, which has not yet been described, indicates the loading arm that transmits driving force from the drive to the cassette 430.

[0072] Figure 5 The following is a graph showing the results of thermal pyrolysis GC / MS analysis of the first plate 100 on which the bonding layer 200 is formed.

[0073] In the context of CTAB being used as a bonding material as described above, it should be understood that when thermal decomposition GC / MS analysis is performed at the same temperature conditions as the manufacturing process of OLED lighting devices (i.e., a maximum temperature of 300°C), no CTAB component degassed from the CTAB-coated glass plate is detected. In the case of CTAB-coated glass, no degassed material is detected, in the same manner as in uncoated bare glass. No peaks appear where the Br component of CTAB is detected. This means that thermal decomposition of CTAB at temperatures of 300°C or lower does not cause degassed gas. Therefore, it will be understood that when CTAB is used as a bonding material, for example, the manufacturing process of OLED devices can be performed without the risk of degassed gas.

[0074] Figure 6 is a diagram schematically illustrating a sequence for joining the first plate 100 and the second plate 300 according to one embodiment of the present disclosure.

[0075] In some embodiments, the temporary engagement operation of temporarily engaging the second plate 300 to the first plate 100 may include positioning the second plate 300 on the support 510 and positioning the first plate 100 coated with the temporary engagement layer 200 on the second plate 300, such that the temporary engagement layer 200 is disposed between the second plate 300 and the first plate 100.

[0076] In some embodiments, the support 510 may be a worktable that supports the second plate 300 and the first plate 100 by allowing the second plate 300 and the first plate 100 to be positioned on its top surface. The contact surface of the support 510 may be formed of polytetrafluoroethylene (PTFE) to prevent scratches that may occur through contact with the second plate 300. In some embodiments, the support 510 may have vacuum suction holes in its surface to clamp the second plate 300 positioned on the support 510 by vacuum suction.

[0077] The joining sequence according to one embodiment will be described sequentially.

[0078] First, the second position guide 523 is positioned in the second alignment position.

[0079] Then, the second plate 300 is moved to and positioned in the second position determined by the second position guide 523 positioned in the second alignment position.

[0080] Subsequently, the first position guide 521 is positioned in the first alignment position.

[0081] Then, the first plate 100 is moved to and positioned in the first position determined by the first position guide 521 positioned in the first alignment position.

[0082] In some embodiments, a second alignment position of the second position guide 523 and a first alignment position of the first position guide 521 may be set such that the edge of the first plate 100 positioned in the first position is positioned outside the edge of the second plate 300 positioned in the second position. In some of these embodiments, the second alignment position of the second position guide 523 and the first alignment position of the first position guide 521 may be set such that the edge of the first plate 100 positioned in the first position is positioned outside the edge of the second plate 300 positioned in the second position by, for example, 1 mm to 5 mm. However, these values ​​are merely illustrative, and this disclosure is not limited to these specific values.

[0083] In some embodiments, the second position guide 523 and the first position guide 521 may be identical position guides, which can move from the second alignment position to the first alignment position, such that the identical position guides are positioned in the first alignment position.

[0084] In some embodiments, at least two edges of the second plate 300 positioned in the second position may contact the second position guide 523, while at least two edges of the first plate 100 positioned in the first position may contact the first position guide 521.

[0085] In some embodiments, the temporary bonding operation of temporarily bonding the second plate 300 to the first plate 100 may include: initiating the temporary bonding between the second plate 300 and the first plate 100 by bringing one side of the second plate 300 into contact with the temporary bonding layer 200; gradually extending the temporary bonding between the second plate 300 and the first plate 100 by gradually extending the contact between the second plate 300 and the temporary bonding layer 200 from one side to the other side of the second plate 300; and completing the temporary bonding between the second plate 300 and the first plate 100 on the other side of the second plate 300.

[0086] The assembly sequence according to one embodiment will be described sequentially.

[0087] First, the position guide is moved inward by 2 mm so that the second plate 300 will engage in the appropriate position inside the first plate 100, for example, 2 mm inside the first plate 100.

[0088] Then, place the second plate 300 on top of the support 510.

[0089] Subsequently, the second plate 300 is moved to the second position to align it in the precise engagement position. For example, the second plate 300 can be smoothly pushed from the upper left corner of the support 510 along the diagonal direction to align it in the second position. Then, the vacuum suction unit is activated to clamp the second plate 300 onto the support 510 by vacuum suction, thereby preventing the second plate 300 from moving.

[0090] Then, when the second plate 300 is fixed to the support 510, the position guide is moved to the first alignment position, which is 2 mm outside the second alignment position.

[0091] Subsequently, the bonding process involves placing a first plate 100 coated with bonding layer 200 onto the second plate 300. Here, the first plate 100 is slowly placed onto the second plate 300, such that the bonding begins at a corner and the bonding area gradually expands toward the opposite corner. Referring to FIG6, for example, the bonding between the first plate 100 and the second plate 300 may begin at the lower right corner, expand diagonally toward the upper left corner, and be completed at the upper left corner. In this respect, the lower right corner of the first plate 100 (the lower right corner of the temporary bonding layer 200) first contacts the second plate 300, and then the upper left corner is slowly placed downwards, such that the upper left corner finally contacts the second plate 300.

[0092] When the bonding is performed in this manner, the generation of bubbles and warping during bonding can be minimized. In addition, the fourth surface 320 of the second plate 300 remains fixed to the support 510 and does not contact it during bonding, so that the surface of the fourth surface 320 can maintain its original quality.

[0093] This disclosure provides a temporary plate joining device that will be used in a temporary plate joining method.

[0094] In some embodiments, the temporary plate joining device may include: a support 510 on which a second plate 300 and a first plate 100 are positioned, wherein a vacuum suction hole is provided in the surface of the support 510; and a positioning guide that aligns the second plate 300 in a second position when positioned in a second alignment position and aligns the first plate 100 in a first alignment position when positioned in a first alignment position.

[0095] Additionally, the temporary plate bonding device may include a vacuum suction unit that applies a vacuum to a vacuum suction orifice to clamp or release the second plate 300. In some embodiments, after the second plate 300 is positioned in the second position, the vacuum suction unit may clamp the second plate 300 onto the support 510 by applying a vacuum to the vacuum suction orifice.

[0096] Additionally, the temporary plate bonding device may include a driver (not shown) that moves a positioning guide. In some embodiments, the driver may move the positioning guide to be positioned in a second alignment position, and after the second plate is positioned in the second position, move the positioning guide to be positioned in a first alignment position. In some embodiments, the second alignment position and the first alignment position of the positioning guide may be set such that the edge of the first plate 100 positioned in the first position is positioned outside the edge of the second plate 300 positioned in the second position. In some of these embodiments, the second alignment position and the first alignment position of the positioning guide may be set such that the edge of the first plate 100 positioned in the first position is positioned in the second position by, for example, 1 mm to 5 mm. In some embodiments, when the positioning guide is in the second alignment position, the positioning guide may contact at least two edges of the second plate 300 positioned in the second position. When the positioning guide is in the first alignment position, the positioning guide may contact at least two edges of the first plate 100 positioned in the first position.

[0097] Additionally, the temporary plate bonding device may include a carrier (not shown) that moves the plate.

[0098] In some implementations, the position guide may include a plurality of position guide bodies configured to move separately and independently. (See reference...) Figures 6A to 6C For example, the position guide may include two position guide bodies. The first position guide body may contact the long side of the first plate 100 or the second plate 300 and move in the Y-axis direction perpendicular to the long side. In addition, the second position guide body may contact the short side of the first plate 100 or the second plate 300 and move in the X-axis direction perpendicular to the short side.

[0099] In some embodiments, each of the position guide bodies may include at least one tip configured to contact the first plate 100 and the second plate 300. Figures 6A to 6C An example is an embodiment in which the first position guide body has two tips and the second position guide body has one tip.

[0100] The temporary board joining device described above can be used to effectively transfer and join the second board 300 and the first board 100.

[0101] Figure 7A and Figure 7B The diagram illustrates the bonding energy distribution of the bonding structure produced by a method according to an embodiment of this disclosure, and the immersion and rinsing methods of the prior art.

[0102] According to a coating method according to an embodiment of the present disclosure, the plate may be uniformly coated with the bonding layer 200 and the difference in bonding energy may be reduced.

[0103] According to existing coating methods, the plate is immersed in a bonding solution, removed from the bonding solution, and then rinsed. In this case, during the rinsing operation, the bonding solution flows from top to bottom. This reduces the coating concentration on the upper part of the plate and increases the coating depth on the lower part, where the bonding solution accumulates, thereby creating a difference in bonding energy. This situation is problematic.

[0104] Conversely, when the concentration and speed are optimized using the dip-coating method according to an example of this disclosure, the bonding layer 200 can be uniformly coated on the plate. In some embodiments, the concentration of the bonding solution in this disclosure may be lower than the concentration of the bonding solution in prior art immersion and rinsing methods.

[0105] The analysis examines the bonding energy distribution in a board coated with bonding layer 200 using a dip-coating method according to an example of this disclosure and prior art immersion and rinsing methods. For example... Figure 7A As illustrated, it will be understood that the bonding energy distribution throughout the bonded structure prepared by the dip-coating method is uniform. Conversely, in bonded structures prepared by prior art immersion and rinsing methods, the upper portion of the plate has higher bonding energy and the lower portion has lower bonding energy because the bonding solution is enriched and the coating concentration on the lower portion is increased. In some cases, the coating concentration on the lower portion is twice that on the higher portion.

[0106] In a bonding structure prepared by a temporary bonding method according to an example of this disclosure, the bonding energy between the first plate 100 and the second plate 300 can be 90 mJ / m 2 Up to 150mJ / m 2 Within this range. For example, the dip-coating speed and the concentration of the coating solution can be optimized to 1 mm / sec and 0.125 mM, respectively. When the bonded structure is prepared under these coating conditions, the bonding energy is approximately 100 mJ / m. 2 .

[0107] Figure 8 The image shows a crack that occurs in the second plate 300 when a first plate 100 and a second plate 300 with different compositions and CTE are joined together and then baked at 250°C for 30 minutes.

[0108] When there is a CTE mismatch between the first plate 100 and the second plate 300, cracking can occur during high-temperature processes at 100°C or higher. Therefore, to prevent this problem, the difference in CTE between the first plate 100 and the second plate 300 can be ±2.0 x 10⁻⁶. -6 / ℃.

Claims

1. A temporary plate bonding method, comprising: A temporary bonding layer is dip-coated onto the first plate by immersing it in a bonding solution containing a surfactant, wherein the dip-coating comprises: Perform a first movement that moves the first plate downward to immerse the first plate in the bonding solution; Perform a second movement that moves the first plate upward until the first plate is removed from the bonding solution; and A third movement is performed to move the first plate upward and away from the surface of the bonding solution, wherein the first movement includes moving the first plate downward at a speed in the range of 5 mm / sec to 20 mm / sec, wherein the second movement includes moving the first plate upward at a speed in the range of 0.5 mm / sec to 5.0 mm / sec, and wherein the third movement includes moving the first plate upward at a speed in the range of 5 mm / sec to 20 mm / sec; and The second plate is temporarily bonded to the first plate using a temporary bonding layer, and The concentration of the surfactant in the bonding solution is in the range of 0.1 mM to 5.0 mM.

2. The temporary plate bonding method of claim 1, wherein the surfactant comprises hexadecyltrimethylammonium bromide or poly[(3-methyl-1-vinylimidazolium chloride)-co-(1-vinylpyrrolidone)].

3. The temporary plate joining method according to any one of claims 1-2, wherein the joining force between the first plate and the second plate, which are temporarily joined to each other, is 95 mJ / m. 2 Up to 105 mJ / m 2 Within the range.

4. The temporary plate joining method according to any one of claims 1-2, wherein the temporary joining of the second plate to the first plate comprises: Position the second plate on the support; and The first plate coated with the temporary bonding layer is positioned on the second plate such that the temporary bonding layer is disposed between the second plate and the first plate, thereby temporarily bonding the second plate to the first plate.

5. The temporary plate joining method of claim 4, wherein the positioning of the second plate on the support comprises: Position the second position guide in the second alignment position; as well as The second plate is moved to a second position determined by the second position guide positioned in the second alignment position, thereby positioning the second plate in the second position, and The positioning of the first plate on the second plate includes: Position the first position guide in the first alignment position; as well as The first plate is moved to a first position determined by the first position guide positioned in the first alignment position, thereby positioning the first plate in the first position.

6. The temporary plate joining method of claim 5, wherein at least two edges of the second plate positioned in the second position contact the second position guide positioned in the second alignment position, and At least two edges of the first plate, positioned in the first position, contact the first position guide, positioned in the first alignment position.

7. The temporary plate joining method according to any one of claims 1-2, wherein the first plate is thicker than the second plate.

8. The temporary plate bonding method according to any one of claims 1-2, wherein the thickness of the second plate is equal to or less than 300 μm.

9. The temporary plate joining method according to any one of claims 1-2, wherein each of the first plate and the second plate is a glass plate.

10. The temporary plate bonding method of claim 9, wherein the difference in the coefficients of thermal expansion between the first plate and the second plate is ±2.0 x 10⁻⁶. -6 / ℃.

11. A plate dip coating apparatus, comprising: A bonding solution bath, wherein a bonding solution containing a surfactant is contained in the bonding solution bath; A box, in which multiple first plates will be loaded; as well as The actuator is configured to move the cartridge up / down. The driver is configured to execute sequentially: A first movement that moves the cartridge downward to immerse the first plate in the bonding solution, wherein the first movement is performed at a speed in the range of 5 mm / sec to 20 mm / sec; A second movement that moves the cartridge upward until the plurality of first plates are removed from the bonding solution, wherein the second movement is performed at a speed in the range of 0.5 mm / sec to 5 mm / sec; as well as A third movement that moves the cartridge upward and away from the surface of the bonding solution, wherein the third movement is performed at a speed in the range of 5 mm / sec to 20 mm / sec, and The concentration of the surfactant in the bonding solution is in the range of 0.1 mM to 5.0 mM.

12. The plate dip coating apparatus of claim 11, wherein the surfactant comprises hexadecyltrimethylammonium bromide.

13. The plate dip coating apparatus of claim 11, wherein the first plate is a glass plate.

14. A temporary board bonding apparatus for temporarily bonding a second board to a first board via a temporary bonding layer, the temporary board bonding apparatus comprising: A support member, wherein the second plate and the first plate are positioned on the support member, wherein a vacuum suction hole is provided in the surface of the support member; A positioning guide is configured to align the second plate in a second alignment position when positioned in a second alignment position and to align the first plate in a first alignment position when positioned in a first alignment position; A vacuum suction unit is configured to apply a vacuum to the vacuum suction orifice; as well as A driver is configured to drive the position guide. The temporary bonding layer is applied to the first plate by means of the following steps: Perform a first movement that moves the first plate downward to immerse the first plate in a bonding solution containing a surfactant; Perform a second movement that moves the first plate upward until the first plate is removed from the bonding solution; as well as A third movement is performed that moves the first plate upward and away from the surface of the bonding solution, wherein the first movement includes moving the first plate downward at a speed in the range of 5 mm / sec to 20 mm / sec, wherein the second movement includes moving the first plate upward at a speed in the range of 0.5 mm / sec to 5.0 mm / sec, and wherein the third movement includes moving the first plate upward at a speed in the range of 5 mm / sec to 20 mm / sec. The driver drives the position guide to be positioned in the second alignment position, and after the second plate is positioned in the second position, drives the position guide to be positioned in the first alignment position. After the second plate is positioned in the second position, the vacuum suction unit clamps the second plate onto the support by applying a vacuum to the vacuum suction hole, and The concentration of the surfactant in the bonding solution is in the range of 0.1 mM to 5.0 mM.

15. The temporary plate bonding device of claim 14, wherein the difference in the coefficient of thermal expansion between the first plate and the second plate is ±2.0 x 10⁻⁶. -6 / ℃.

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