Sputter coating system

Abstract

The present disclosure relates to the technical field of vacuum equipment, and discloses a sputtering coating system, which comprises a vacuum transfer chamber, at least one sputtering coating device, a sample transfer arm mechanism and a vacuum driving mechanism. The sputtering coating device comprises a vacuum coating chamber, a substrate carrying mechanism and a cathode target. The vacuum coating chamber is in communication with the vacuum transfer chamber. The substrate carrying mechanism is located at the top of the vacuum coating chamber and is used for carrying a substrate. The cathode target is in vacuum sealing connection with the vacuum coating chamber and is arranged opposite to the substrate carrying mechanism. The sample transfer arm mechanism is at least partially arranged in the vacuum transfer chamber. The vacuum driving mechanism is connected with the sample transfer arm mechanism and is used for driving the sample transfer arm mechanism to transfer the substrate between the at least one sputtering coating device.

Description

Technical Field

[0001] This disclosure relates to the field of vacuum equipment technology, and in particular to a sputtering coating system. Background Technology

[0002] In industrial manufacturing, wafer magnetron sputtering is a commonly used sputtering technology. Traditional techniques employ a top-down sputtering method, with the target gun mounted at the top and the substrate at the bottom. This method allows particles to easily accumulate on the silicon wafer surface, contaminating the thin film and severely impacting device quality and yield. Summary of the Invention

[0003] This disclosure provides a sputtering coating system, comprising:

[0004] Vacuum transfer chamber;

[0005] At least one sputtering coating apparatus, the sputtering coating apparatus comprising:

[0006] The vacuum coating chamber is connected to the vacuum transfer chamber;

[0007] A substrate support mechanism, located at the top of the vacuum coating chamber and used to support the substrate; and

[0008] The cathode target is vacuum-sealed to the vacuum coating chamber and is positioned opposite to the substrate support mechanism.

[0009] The sample transfer arm mechanism is at least partially disposed within the vacuum transfer chamber; and

[0010] A vacuum drive mechanism, connected to a sample transfer arm mechanism, is used to drive the sample transfer arm mechanism to transfer a substrate between at least one sputtering coating apparatus. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only one embodiment of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 A schematic diagram of a sputtering coating system according to some embodiments of the present disclosure is shown.

[0013] Figure 2 A schematic diagram of a sputtering coating apparatus according to some embodiments of the present disclosure is shown.

[0014] Figure 3 A schematic diagram of the structure of a vacuum transfer cavity according to some embodiments of the present disclosure is shown.

[0015] Figure 4 A partial structural schematic diagram of a sputtering coating apparatus according to some embodiments of the present disclosure is shown.

[0016] Figure 5 A schematic diagram of the structure of a protective cover according to some embodiments of the present disclosure is shown.

[0017] Figure 6 A schematic diagram of the structure of a protective platform according to some embodiments of the present disclosure is shown.

[0018] Figure 7 A schematic diagram of the structure of at least one inner liner plate of a sputtering coating apparatus according to some embodiments of the present disclosure is shown.

[0019] Figure 8 A schematic diagram of the structure of a tray according to some embodiments of the present disclosure is shown.

[0020] Figure 9 A partial structural schematic diagram of a sputtering coating apparatus according to some embodiments of the present disclosure is shown during a coating process.

[0021] Figure 10 A schematic diagram of the structure of a lifting slide according to some embodiments of the present disclosure is shown.

[0022] Figure 11 A schematic diagram of the structure of a first buffer rod according to some embodiments of the present disclosure is shown.

[0023] Figure 12 A schematic diagram of the structure of a buffer platform according to some embodiments of the present disclosure is shown.

[0024] Figure 13 A schematic diagram of the structure of a lifting assembly according to some embodiments of the present disclosure is shown.

[0025] Figure 14 A partial structural schematic diagram of a sputtering coating apparatus according to some embodiments of the present disclosure is shown.

[0026] In the above figures, the reference numerals represent:

[0027] 100-Sputtering Coating System

[0028] 110-Vacuum Transfer Chamber

[0029] 120 - Sputtering coating apparatus; 120A - Reusable coating apparatus; 120Aa - First reusable coating apparatus; 120Ab - Second reusable coating apparatus; 120Ac - Third reusable coating apparatus; 120B, 120C, 120D - Dedicated coating apparatus

[0030] 121-Vacuum Coating Chamber

[0031] 122-Base Support Mechanism

[0032] 123-Protective cover, 1231-Protective platform, 12311-Top opening, 12312-Bottom opening, 12313-Side, 123131-Through hole, 1232-Top cover, 12321-Top cover flange, 1233-Bottom cover, 12331-Slot, 12332-Bottom cover flange

[0033] 124-Inner lining plate, 1241-First inner lining plate, 1242-Second inner lining plate

[0034] 125 - Installation and Maintenance Shutter

[0035] 126 - Matcher, 1261 - Insertion end

[0036] 127-Heating device

[0037] 128-Drive Mechanism

[0038] 130-Cathode Target

[0039] 131-Snap

[0040] 132-Target Rifle

[0041] 140-Vacuum Drive Mechanism

[0042] 150-Injection Chamber

[0043] 151 - Pallet, 1511 - Pallet flange

[0044] 160-Sampling Chamber

[0045] 170-Wafer Handling System

[0046] 180-substrate sensor

[0047] 190-Lifting Slide Table

[0048] 191-Base, 1911-Sliding assembly

[0049] 192 - Lifting assembly; 1921 - Lifting drive device; 1922 - Gear transmission mechanism; 19221, 19221a, 19221b - Worm gear; 1923, 1923a, 1923b - Worm wheel; 1924, 1924a, 1924b - Lead screw; 1925, 1925a, 1925b - Lead screw nut

[0050] 193 - Lifting platform, 1931 - Lifting platform through hole

[0051] 194-Support frame, 1941-Frame body, 1942-First buffer assembly, 19421-First buffer rod, 194211-First buffer tube, 194212-First guide shaft, 194213-First linear bearing, 1943-Support platform, 1944-Positioning rod

[0052] 195-Buffer platform, 1951-Fixing plate, 1952-Second buffer assembly, 19521-Second buffer rod, 1953-Buffer plate, 1954-Connecting plate

[0053] 196 - Car body, 1961 - Track

[0054] 200-base Detailed Implementation

[0055] Some embodiments of this disclosure will now be described with reference to the accompanying drawings. Obviously, the described embodiments are merely exemplary embodiments of this disclosure, and not all embodiments.

[0056] In the description of this disclosure, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," "top," and "bottom," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this disclosure, it should be noted that unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "coupling" should be interpreted broadly, for example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two elements. In the description of this disclosure, "distal" or "farside" refers to one end or side that extends into a vacuum environment (e.g., a vacuum chamber), while "proximal" or "proximal" is the end or side opposite to "distal" or "farside" (e.g., one end or side away from the vacuum chamber, or one end or side within the vacuum chamber that is closer to the vacuum chamber wall, etc.). Alternatively, the end or side closer to the drive device is called the proximal or proximal end, and the end or side farther from the drive device is called the distal or distal end. Those skilled in the art will understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0057] Figure 1 A schematic diagram of the structure of a sputtering coating system 100 according to some embodiments of the present disclosure is shown. Figure 2 A schematic diagram of the structure of a sputtering coating apparatus 120 according to some embodiments of the present disclosure is shown. Figure 3 A schematic diagram of the structure of a vacuum transfer chamber 110 according to some embodiments of the present disclosure is shown. Figure 4 A partial structural schematic diagram of a sputtering coating apparatus 120 according to some embodiments of the present disclosure is shown.

[0058] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, in some embodiments of this disclosure, the sputtering coating system 100 may include a vacuum transfer chamber 110, at least one sputtering coating device 120, a sample transfer arm mechanism (not shown), and a vacuum drive mechanism 140. At least one sputtering coating device 120 is connected to the vacuum transfer chamber 110. Figure 2 and Figure 4 As shown, the sputtering coating apparatus 120 may include a vacuum coating chamber 121, a cathode target 130, and a substrate support mechanism 122. For example... Figure 1 As shown, the vacuum coating chamber 121 of the sputtering coating apparatus 120 is connected to the vacuum transfer chamber 110. A substrate support mechanism 122 is located at the top of the vacuum coating chamber 121 and is used to support the substrate. A cathode target 130 is vacuum-sealed to the vacuum coating chamber 121 and is disposed opposite to the substrate support mechanism 122. A transfer arm mechanism is at least partially disposed within the vacuum transfer chamber 110. A vacuum drive mechanism 140 is connected to the transfer arm mechanism and is used to drive the transfer arm mechanism to transfer the substrate 200 between at least one sputtering coating apparatus 120. Those skilled in the art will understand that the transfer arm mechanism and the vacuum drive mechanism 140 can employ any suitable structure and arrangement.

[0059] In some embodiments of this disclosure, the substrate support mechanism 122 is located at the top of the vacuum coating chamber 121, and the cathode target 130 is disposed opposite to the substrate support mechanism 122, thereby enabling coating to be performed in a bottom-up sputtering manner, reducing the accumulation of particles on the substrate, such as the silicon wafer surface, thereby improving device quality and yield.

[0060] like Figure 1 As shown, in some embodiments of this disclosure, the sputtering coating system 100 may further include an injection chamber 150 and a sampling chamber 160. The injection chamber 150 is vacuum-sealed to a vacuum transfer chamber 110. The sampling chamber 160 is vacuum-sealed to the vacuum transfer chamber 110. A transfer arm mechanism is used to transfer the substrate 200 between the injection chamber 150, the sampling chamber 160, and at least one sputtering coating apparatus 120.

[0061] like Figure 1As shown, in some embodiments of this disclosure, the sputtering coating system 100 may further include a wafer transport system 170 connected to the sample inlet chamber 150 and the sample outlet chamber 160. The wafer transport system 170 is used to pick up the substrate 200, flip the substrate 200 so that the coating surface of the substrate 200 faces downward, and transport the substrate 200 onto the tray 151 of the sample inlet chamber 150. A transfer arm mechanism is used to transfer the tray 151 between the sample inlet chamber 150, the sample outlet chamber 160, and at least one sputtering coating device 120 to transfer the substrate 200.

[0062] In some embodiments, the wafer handling system 170 may include an EFEM (Equipment Front End Module). The EFEM's mechanism flips the substrate, engaging with the sample inlet tray to achieve wafer flipping and ensure the coated side faces downwards. This allows the coated side of the substrate, such as a silicon wafer, to face downwards, preventing contamination.

[0063] like Figure 1 As shown, in some embodiments of this disclosure, at least one sputtering coating apparatus 120 may include at least one reused coating apparatus 120A and multiple dedicated coating apparatuses (e.g., dedicated coating apparatuses 120B, 120C, 120D). At least one reused coating apparatus 120A is used for reusable coating processes. Multiple dedicated coating apparatuses (e.g., dedicated coating apparatuses 120B, 120C, 120D) are used for non-reusable coating processes. The non-reusable coating processes require more time than the reusable coating processes. Coordinating the coating processes using at least one reused coating apparatus 120A and multiple dedicated coating apparatuses (e.g., dedicated coating apparatuses 120B, 120C, 120D) can significantly improve productivity. At least one sputtering coating apparatus 120 (e.g., at least one reused coating apparatus 120A, and standalone coating apparatuses 120B, 120C, and 120D) can be transferred and connected through the vacuum transfer chamber 110, enabling multiple sputtering coating apparatuses 120 (e.g., at least one reused coating apparatus 120A, and standalone coating apparatuses 120B, 120C, and 120D) to operate independently without interference. Those skilled in the art will understand that valves can be respectively provided between at least one sputtering coating apparatus 120 (e.g., at least one reused coating apparatus 120A, and standalone coating apparatuses 120B, 120C, and 120D) and the vacuum transfer chamber 110. During sample transfer, the valve of the corresponding sputtering coating apparatus can be opened, and during coating, the valve of the corresponding sputtering coating apparatus can be closed.

[0064] In some embodiments of this disclosure, the sputtering coating system 100 may further include a control device (not shown) connected to the vacuum drive mechanism 140 for controlling the vacuum drive mechanism 140 to drive the sample transfer arm mechanism to transfer the substrate 200 between the sample inlet chamber 150, the sample outlet chamber 160, at least one reused coating device 120A, and multiple independent coating devices (e.g., independent coating devices 120B, 120C, 120D), thereby achieving sputtering coating of the substrate 200 when at least one reused coating device 120A is reused.

[0065] like Figure 1 As shown, in some embodiments of this disclosure, at least one multiplexed coating apparatus 120A may include multiple multiplexed coating apparatuses 120A, such as a first multiplexed coating apparatus 120Aa, a second multiplexed coating apparatus 120Ab, and a third multiplexed coating apparatus 120Ac. The first multiplexed coating apparatus 120Aa is used for a first sputtering process. The second multiplexed coating apparatus 120Ab is used for a second sputtering process. The third multiplexed coating apparatus 120Ac is used for a third sputtering process. Multiple dedicated coating apparatuses may include three dedicated coating apparatuses 120B, 120C, and 120D for a fourth sputtering process, wherein the time required for the fourth sputtering process is more than twice the sum of the times required for the first, second, and third sputtering processes. This arrangement facilitates the staggered operation of the three sets of sputtering processes, improving coating process efficiency.

[0066] Those skilled in the art will understand that at least one reused coating apparatus 120A may include three reused coating apparatuses performing three sputtering processes respectively; this is merely exemplary, and at least one reused coating apparatus may also include other suitable numbers of reused coating apparatuses to perform different sputtering processes respectively. Similarly, multiple independent coating apparatuses may include three independent coating apparatuses 120B, 120C, and 120D, also merely exemplary. Multiple independent coating apparatuses may also include other suitable numbers of independent coating apparatuses for coordination and integration with at least one reused coating apparatus 120A.

[0067] like Figure 1As shown, in some embodiments of this disclosure, the wafer transport system 170 picks up the substrate 200 and flips it so that the coated surface of the substrate 200 faces downwards, then delivers it to the tray 151 of the sample inlet chamber 150. The sample transfer arm mechanism transfers the tray 151 and the substrate 200 from the sample inlet chamber 150 to the first multiplexed coating apparatus 120Aa for a first sputtering process, for example, a coating time of 7.5 minutes. After the first sputtering process is completed, the sample transfer arm mechanism transfers the tray 151 and the substrate 200 from the first multiplexed coating apparatus 120Aa to the second multiplexed coating apparatus 120Ab for a second sputtering process, for example, a coating time of 7.5 minutes. After the second sputtering process is completed, the sample transfer arm mechanism transfers the substrate 200 from the second multiplexed coating apparatus 120Ab to the third multiplexed coating apparatus 120Ac for a third sputtering process, for example, a coating time of 15 minutes. After the third sputtering process is completed, the sample transfer arm mechanism transfers the substrate 200 from the third multiplexing coating apparatus 120Ac to the dedicated coating apparatus 120B for the fourth sputtering process, for example, the coating time can be 120 minutes. Before or during the fourth sputtering process in the dedicated coating apparatus 120B, the sample transfer arm mechanism can take a sample from the sample inlet chamber 150 and repeat the above process until the third sputtering process is completed. Then, the sample transfer arm mechanism transfers the substrate 200 from the third multiplexing coating apparatus 120Ac to the dedicated coating apparatus 120C. Before or during the fourth sputtering process in the dedicated coating apparatus 120C, the sample transfer arm mechanism can take a sample from the sample inlet chamber 150 and repeat the above process until the third sputtering process is completed. Then, the sample transfer arm mechanism transfers the substrate 200 from the third multiplexing coating apparatus 120Ac to the dedicated coating apparatus 120D.

[0068] After the fourth sputtering process in the dedicated coating apparatus 120B, 120C, or 120D is completed, the sample transfer arm mechanism transfers the substrate 200 from the dedicated coating apparatus 120B, 120C, or 120D to the sampling chamber 160, and the wafer transport system 170 removes the substrate 200 from the sampling chamber 160. After the substrate 200 in the dedicated coating apparatus 120B, 120C, or 120D is removed, a new substrate 200, after passing through the first reused coating apparatus 120Aa, the second reused coating apparatus 120Ab, and the third reused coating apparatus 120Ac, can be sent back to the dedicated coating apparatus 120B, 120C, or 120D for the fourth sputtering process.

[0069] Those skilled in the art will understand that the overall planning and coordination of the above-described sputtering coating apparatuses are merely exemplary, and the required number of coating process steps can be arranged according to actual needs. Similarly, the coating time for the first process, the second process, the third process, and the fourth process can be selected according to actual needs, and a reasonable overall plan can be made according to the actual coating process requirements. Furthermore, multiple reused coating apparatuses (e.g., the first reused coating apparatus 120Aa, the second reused coating apparatus 120Ab, and the third reused coating apparatus 120Ac) can be the same or different, and the first sputtering process, the second sputtering process, and the third sputtering process can be the same or different. Similarly, in some embodiments, multiple dedicated coating apparatuses (e.g., dedicated coating apparatus 120B, dedicated coating apparatus 120C, or dedicated coating apparatus 120D) can be the same or different, and different dedicated coating apparatuses can each perform different fourth sputtering processes.

[0070] like Figure 3 As shown, in some embodiments of this disclosure, the sputtering coating system 100 may further include at least one substrate sensor 180, mounted on the vacuum transfer chamber 110, for tracking the position of the substrate 200. Figure 3 As shown, in some embodiments of this disclosure, the sputtering coating system 100 may further include multiple substrate sensors 180. The substrate sensors 180 are through-beam sensors, and the transmitting end and receiving end of the through-beam sensors 180 are located on both sides of the transmission path of the substrate 200 between the vacuum transfer chamber 110 and the sputtering coating apparatus 120, the sample inlet chamber 150 and the sampling chamber 160, respectively, for example, installed on the upper and lower sides of the transmission path of the substrate 200.

[0071] like Figure 1 As shown, in some embodiments of this disclosure, at least one substrate sensor 180 includes eight sets of through-beam sensors. The transmitting and receiving ends of the eight sets of through-beam sensors 180 are respectively located on the upper and lower sides of the transmission path of the substrate 200 between the vacuum transfer cavity 110 and the first multiplexed coating device 120Aa, the vacuum transfer cavity 110 and the second multiplexed coating device 120Ab, the vacuum transfer cavity 110 and the third multiplexed coating device 120Ac, the vacuum transfer cavity 110 and the single coating device 120B, the vacuum transfer cavity 110 and the single coating device 120C, the vacuum transfer cavity 110 and the single coating device 120C, the vacuum transfer cavity 110 and the sample injection cavity 150, and the vacuum transfer cavity 110 and the sampling cavity 160.

[0072] In some embodiments, the through-beam sensor 180 is connected to a control device. When the substrate 200 passes between the transmitting and receiving ends of the through-beam sensor 180, it blocks signal propagation, thereby triggering the output signal of the through-beam sensor 180. Based on the signals from each through-beam sensor 180 and the signal triggering sequence, position tracking of the substrate 200 is achieved.

[0073] In some embodiments of this disclosure, the substrate 200 is coated using a bottom-up sputtering method, which can reduce the accumulation of particles on the silicon wafer surface. For example, when using the sputtering coating system 100 of some embodiments of this disclosure to coat an eight-inch silicon wafer, after sequentially performing a first sputtering process, a second sputtering process, a third sputtering process, and a fourth sputtering process, the increase in particles larger than 0.2 μm in diameter is significantly reduced, for example, to less than 10 particles. However, after prolonged sputtering process operation, particles may fall onto the cathode target and contaminate the target material, requiring periodic target replacement.

[0074] Therefore, in some embodiments of this disclosure, the sputtering coating apparatus 120 may also include a protective cover 123.

[0075] Figure 5 A schematic diagram of the structure of a protective cover 123 according to some embodiments of the present disclosure is shown. Figure 6 A schematic diagram of the structure of a protective platform 1231 according to some embodiments of the present disclosure is shown.

[0076] like Figure 4 , Figure 5 and Figure 6As shown, in some embodiments of this disclosure, the sputtering coating apparatus 120 may further include a protective cover 123. The protective cover 123 is disposed within the vacuum coating chamber 121. The protective cover 123 may include a protective stage 1231, a top cover 1232, and a bottom cover 1233. The protective stage 1231 is hollow and may include an upper opening 12311, a lower opening 12312, and a side surface 12313. The upper opening 12311 faces the substrate 200. The lower opening 12312 faces the cathode target 130, and the area of ​​the lower opening 12312 is larger than the area of ​​the upper opening 12311. The side surface 12313 extends from the upper opening 12311 to the lower opening 12312 and includes a plurality of through holes 123131 for blocking particulate matter. A top cover 1232 is disposed at the upper end of the protective platform 1231. The top cover 1232 may include a top cover through hole communicating with the upper opening 12311 of the protective platform 1231 and a top cover flange 12321 extending outward from the top cover through hole (not shown in the figure). A bottom cover 1233 is disposed at the lower end of the protective platform 1231. The bottom cover 1233 may include a bottom cover through hole (not shown in the figure) communicating with the lower opening 12312 of the protective platform 1231 and a bottom cover flange 12332 extending outward from the bottom cover through hole. Those skilled in the art will understand that the size of the top cover through hole of the top cover 1232 may be equal to or smaller than the upper opening 12311, and the size of the bottom cover through hole of the bottom cover 1233 may be equal to or smaller than the lower opening 12312. Those skilled in the art will understand that, for clarity, Figure 4 Only a portion of the protective shield 123 is shown, and it is in a state of separation from other structures.

[0077] like Figure 4 , Figure 5 and Figure 6 As shown, in some embodiments of this disclosure, the hollow structure inside the protective platform 1231 of the protective shield 123 can serve as a channel for sputtered particles (e.g., molecules, atoms, plasma, etc.) formed after the target material is sputtered to be transferred to the substrate 200. Some sputtered particles transferred to the periphery of the substrate 200 will deposit on the lower surface of the top shield flange 12321. If particles are formed, they will fall onto the bottom shield flange 12332 or roll down along the side 12313 of the protective platform 1231 onto the bottom shield flange 12332, thereby avoiding contamination of the coating material. Figure 6 As shown, in some embodiments of this disclosure, the diameter of the through-hole 123131 on the side 12313 of the protective platform 1231 is less than or equal to 2 mm. The through-hole 123131 allows sputtered particles to pass through but does not allow particulate matter (such as sputtering slag formed after long-term deposition of sputtered material) to pass through.

[0078] In some embodiments of this disclosure, when the sputtering coating apparatus 120 performs the coating process, the target material is sputtered from the lower opening 12312 of the protective stage 1231 to the upper opening 12311 of the protective stage 1231. The upper opening 12312 of the protective stage 1231 faces the substrate 200 material. Part of the sputtered material will be deposited on the substrate 200, and another part of the upwardly sputtered material will pass through the through hole 123131 on the side 12313 of the protective stage 1231. Because of the presence of the top shield 1232, it will not directly bombard, for example, the tray 200, but will bombard the top shield flange 12321. If the sputtered material forms particles on the lower surface of the top shield flange 12321, they will be intercepted by the through holes 123131 on the side 12313 of the shield platform 1231, and fall onto the bottom shield flange 12332 or roll down along the side 12313 of the shield platform 1231 onto the bottom shield flange 12332, thereby avoiding contamination of the target material.

[0079] In some embodiments of this disclosure, the shield 123 may be grounded to stabilize the potential within the sputtering coating apparatus 120. When the sputtering coating apparatus 120 is used to sputter insulating materials, the grounded shield 123 can effectively alleviate potential buildup, thereby resulting in a more uniform plasma distribution. This allows the target material to be sputtered more uniformly, further improving the uniformity of the thin film and achieving stable batch coating results.

[0080] In some embodiments of this disclosure, the cathode target 130 can be grounded, and both the protective cover 123 and the cathode target 130 are conductive materials. The protective cover 123 is grounded by grounding the cathode target 130.

[0081] Figure 7 A schematic diagram of the structure of at least one inner liner plate 124 of a sputtering coating apparatus 120 according to some embodiments of the present disclosure is shown.

[0082] like Figure 7 As shown, in some embodiments of this disclosure, the sputtering coating apparatus 120 may further include at least one inner liner plate 124. The at least one inner liner plate 124 may include a first inner liner plate 1241 and / or a second inner liner plate 1242. The first inner liner plate 1241 is disposed on the inner wall of the vacuum coating chamber 121. The second inner liner plate 1242 is disposed around the protective cover 123, with its upper end above the upper end of the protective cover 123 and its lower end below the lower end of the protective cover 123. The height of the upper end of the second inner liner plate 1242 is greater than or equal to the height of the upper end of the protective cover 123, and the height of the lower end of the second inner liner plate 1242 is less than or equal to the height of the lower end of the protective cover 123. The at least one inner liner plate 124 can prevent contamination of the inner wall of the vacuum coating chamber 121. After plating with precious metal materials, the precious metal can also be conveniently scraped off and collected through the at least one inner liner plate 124.

[0083] like Figure 7 As shown, in some embodiments of this disclosure, at least one inner liner 124 may be grounded. For example... Figure 1 and Figure 2 As shown, in some embodiments, the sputtering coating apparatus 120 is grounded, and the main body of the sputtering coating apparatus 120 (e.g., the vacuum coating chamber 121) is made of a conductive material. At least one inner liner 124 can also be made of a conductive material. The first inner liner 1241 can be fixed to the inner wall of the vacuum coating chamber 121 by screws. The second inner liner 1242 can be disposed around the protective cover 123 and closely attached to the inner wall of the vacuum coating chamber 121, and its ends can be provided with snap-fit ​​fasteners for fixation. At least one inner liner 124 is grounded by grounding the sputtering coating apparatus 120.

[0084] Figure 8 A schematic diagram of the structure of a tray 151 according to some embodiments of the present disclosure is shown.

[0085] like Figure 8 As shown, in some embodiments of this disclosure, the tray 151 has a circular structure, and the inner ring of the tray 151 is provided with an inwardly extending tray flange 1511 for supporting the base 200. The area of ​​the upper opening 12311 of the protective platform 1231 matches (e.g., is equal to or slightly smaller than) the area of ​​the inner ring of the tray 151 (e.g., inside the tray flange 1511), and their centers are aligned.

[0086] To achieve bottom-up sputtering, a tray 151 or similar structure is necessary to support the substrate 200. However, the tray 151 is also the mechanism most prone to accumulating particulate matter and contaminating the target. The protective cover 123 effectively reduces the formation of particulate matter on the tray 151 that contaminates the target. In some embodiments, the tray 500 supports the substrate 600 during the coating process. The contact area between the tray 500 and the substrate 600 is larger than the point contact area between a conventional support claw and the tray 500, which also helps to make the temperature of the substrate 600 more uniform and improves the coating quality.

[0087] like Figure 5 As shown, in some embodiments of this disclosure, the distance L1 from the outer edge of the top shield flange 12321 to the central axis of the protective platform 1231 is greater than or equal to the distance L2 from the edge of the lower opening 12312 of the protective platform 1231 to the central axis of the protective platform 1231. This better prevents sputtered particles from depositing onto the structure above the substrate 200, for example, onto... Figure 8 On tray 151 as shown.

[0088] like Figure 5As shown, in some embodiments of this disclosure, the distance L3 from the outer edge of the bottom protective flange 12332 to the central axis of the hollow protective platform 1231 is greater than or equal to the distance L1 from the outer edge of the top protective flange 12321 to the central axis of the protective platform 1231. This allows particles falling from the lower surface of the top protective flange 12321 to fall onto the bottom protective flange 12332, which not only avoids contamination of the target material and the vacuum coating chamber 121, but also facilitates the collection and cleaning of particles.

[0089] In some embodiments of this disclosure, the distance from the outer edge of the top cover flange 12321 to the central axis of the protective platform 1231 is greater than or equal to the distance from the edge of the tray 151 to the central axis of the protective platform 1231.

[0090] Those skilled in the art will understand that, although Figure 4 and Figure 5 The protective platform 1231 is shown to have a circular cross-section, but this is merely exemplary. In some embodiments of this disclosure, the cross-section of the protective platform 1231 may include any of the following: square, circular, elliptical, polygonal, etc.

[0091] like Figure 2 , Figure 4 and Figure 7 As shown, in some embodiments of this disclosure, the sputtering coating apparatus 120 may further include a heating device 127 and a driving mechanism 128. The heating device 127 is disposed within the vacuum coating chamber 121, and the substrate 200 is located between the heating device 127 and the protective cover 123. The heating device 127 is used to heat the substrate 200 on the substrate support mechanism 122. The driving mechanism 128 is used to drive the substrate support mechanism 122 and the heating device 127 to move up and down together. The driving mechanism 128 may also be used to drive the substrate support mechanism 122 to rotate relative to the heating device 127. The lifting and lowering of the substrate support mechanism 122 and the heating device 127, as well as the rotational movement of the substrate support mechanism 122, can be achieved by existing technology, and will not be described in detail here.

[0092] Figure 9 A partial structural schematic diagram of a sputtering coating apparatus 120 performing a coating process according to some embodiments of the present disclosure is shown.

[0093] like Figure 9 As shown, in some embodiments of this disclosure, the area of ​​the upper opening 12311 of the protective platform 1231 can be equal to the area of ​​the inner ring of the tray 151, and their centers are aligned. When the substrate 200 is transferred to the sputtering coating apparatus 120, the substrate support mechanism 122 is located at a relatively high position (e.g., as shown). Figure 7 (as shown in the image). Figure 9As shown, the drive mechanism 128 drives the substrate support mechanism 122 to descend. During the coating process, the substrate 200 is as close as possible to the top cover 1232 of the protective cover 123 to better carry out the coating process and enable the protective cover 123 to better perform its protective function.

[0094] like Figure 9 As shown, in some embodiments of this disclosure, the distal end of the cathode target 130 may include at least one snap 131. The bottom cover 1233 may include at least one slot 12331 that engages with at least one snap 131 of the cathode target 130 to restrict movement of the bottom cover 1233 on the cathode target 130, but allows the bottom cover 1233 to move upward.

[0095] like Figure 9 As shown, in some embodiments of this disclosure, at least one snap-fit ​​131 may be, for example, a bolt. At least one slot 12331 may be, for example, an arc-shaped slot 12331 provided on the edge of the bottom cover flange 12332. When installing the protective cover 123, the protective cover 123 is inserted from above the cathode target 130, and the snap-fit ​​131 on the cathode target 130 falls into the slot 12331 on the bottom cover 1233. The engagement between the snap-fit ​​131 and the slot 12331 is not a tight fit. The engagement between the snap-fit ​​131 and the slot 12331 is mainly to restrict the horizontal movement of the protective cover 123, while allowing the protective cover 123 to move upward relative to the slot 12331, so as to facilitate the installation, replacement, etc. of the protective cover 123.

[0096] In some embodiments of this disclosure, at least one snap fastener 131 may include eight snap fasteners 131 evenly distributed on the cathode target 130 and arranged in a circumferential pattern, and at least one slot 12331 may include a slot 12331 disposed on the edge of the bottom cover flange 12332 corresponding to at least one of the eight snap fasteners 131. However, this is only exemplary, and other suitable numbers of snap fasteners 131 and slots 12331 may also be selected.

[0097] like Figure 2 As shown, in some embodiments of this disclosure, the vacuum coating chamber 121 may also include a maintenance shutter 125, and the protective cover 123 can be installed and / or replaced by installing the protective shutter.

[0098] In some embodiments of this disclosure, to facilitate the insertion or removal of the protective cover 123 from the mounting protective shutter 125, the bottom protective flange 12332 of the protective cover 123 can be adaptively adjusted, for example as follows: Figure 9As shown, the bottom flange 12332 of the circular coated protective cover 100 is symmetrically cut off on both sides to form a symmetrical cross-section. Correspondingly, at least one slot 12331 may include six slots 12331 arranged circumferentially along the edge of the bottom flange 12332.

[0099] In some embodiments, the installation and maintenance shutter 125 can also be used for the installation and / or replacement of at least one inner liner plate 124.

[0100] Figure 10 A schematic diagram of the structure of a lifting slide 190 according to some embodiments of the present disclosure is shown.

[0101] like Figure 1 , Figure 2 and Figure 10 As shown, in some embodiments of this disclosure, the sputtering coating apparatus 120 may further include at least one lifting slide 190. The lifting slide 190 may include a base 191, a lifting assembly 192, a lifting platform 193, and a support frame 194. The lifting assembly 192 is disposed on the base 191. The lifting platform 193 is connected to the lifting assembly 192 and is used for lifting and lowering under the drive of the lifting assembly 192. The support frame 194 is disposed on the lifting platform 193. The support frame 194 may include a frame body 1941, a first buffer assembly 1942, and a support platform 1943. The first buffer assembly 1942 is disposed on the frame body 1941. The support platform 1943 is disposed on the first buffer assembly 1942, the first buffer assembly 1942 allowing for installation errors and / or movement offsets of the support platform 1943, which is used to support the cathode target 130.

[0102] The lifting slide 190 of some embodiments of this disclosure can not only drive the cathode target 130 disposed on the lifting platform 193 to move up and down, but also dampen the cathode target 130 disposed on the lifting platform 193, thereby allowing for installation errors and / or movement offsets of the support platform 1943, and avoiding damage to the cathode target 130 disposed on the lifting platform 193 and / or the mechanism that docks with the mechanism on the lifting platform 193 (e.g., ...). Figure 2 , Figure 14 The rigidity of the matcher 126 shown is damaged.

[0103] like Figure 10 As shown, in some embodiments of this disclosure, the first buffer assembly 1942 may include a plurality of first buffer rods 19421, which are spaced apart between the frame 1941 and the support platform 1943, and the first buffer rods 19421 are used to provide buffering to the support platform 1943.

[0104] Those skilled in the art will understand that the term "supporting platform 1943" should be interpreted broadly, and can be implemented using any suitable structure and method. For example, as... Figure 10 As shown, the support platform 1943 may include multiple support members, which are respectively disposed on multiple first buffer rods 19421. For example, in some embodiments, the support platform 1943 may include a support structure such as a support bracket or support plate, disposed on multiple first buffer rods 19421 of the first buffer assembly 1942.

[0105] like Figure 10 As shown, in some embodiments, the plurality of first buffer bars 19421 may include seven first buffer bars 19421. Those skilled in the art will understand that, although... Figure 10 Only seven first buffer rods 19421 are shown in the diagram, but this is only an example. The first buffer assembly 1942 may also include other suitable numbers of first buffer rods 19421, such as three, nine, etc.

[0106] Figure 11 A schematic diagram of the structure of a first buffer rod 19421 according to some embodiments of the present disclosure is shown.

[0107] like Figure 11 As shown, in some embodiments of this disclosure, the first buffer rod 19421 may include a first buffer tube 194211, a first guide shaft 194212, and a first linear bearing 194213. The first buffer tube 194211 may include an elastic tube body and an axially extending hollow cavity within the tube body. The upper end portion of the first guide shaft 194212 is axially sleeved within the hollow cavity of the first buffer tube 194211, and the upper end of the first guide shaft 194212 is connected to the support platform 1943. The first linear bearing 194213 is fixedly connected to the frame 1941 and sleeved outside the lower end portion of the first guide shaft 194212. The upper end of the first linear bearing 194213 is connected to the lower end of the first buffer tube 194211, and the first guide shaft 194212 is capable of sliding within the first linear bearing 194213.

[0108] like Figure 11 As shown, in some embodiments, the elastic tube may include a tube with springs at its upper and / or lower ends. The elastic tube may also include other elastic tubes capable of providing cushioning, such as bellows.

[0109] like Figure 11 As shown, in some embodiments of this disclosure, the hollow cavity of the first buffer tube 194211 penetrates the elastic tube of the first buffer tube 194211, and the upper end of the elastic tube of the first buffer tube 194211 can abut against the support platform 1943, and the lower end of the first buffer tube 194211 can abut against the upper end of the first linear bearing 194213.

[0110] In some embodiments, the upper end of the first guide shaft 194212 is provided with a threaded hole, and the support platform 1943 is provided with a bolt hole. The upper end of the first guide shaft 194212 and the support platform 1943 can be connected by, for example, bolts.

[0111] Figure 12 A schematic diagram of the structure of a buffer platform 195 according to some embodiments of the present disclosure is shown.

[0112] like Figure 12 As shown, in some embodiments of this disclosure, the lifting slide 190 may further include a buffer platform 195. The buffer platform 195 may include a fixed plate 1951, a second buffer assembly 1952, and a buffer plate 1953. The fixed plate 1951 is fixedly connected to the lifting platform 193. The lower end of the second buffer assembly 1952 is connected to the fixed plate 1951. The buffer plate 1953 is connected to the upper end of the second buffer assembly 1952 to provide cushioning.

[0113] The lifting slide 190 in some embodiments of this disclosure includes a dual shock-absorbing platform, such as a support platform 1943 and a buffer platform 195, both of which have shock-absorbing functions, capable of damping the mechanism (e.g., such as...) mounted on these two platforms. Figure 14 The cathode target 130 set on the lifting platform 193 and the matcher 126 set on the buffer platform 195 are individually damped to ensure that the two mechanisms are in a stable and relatively flexible state, and to avoid rigid damage when the mechanisms set on these two platforms dock or perform other movements or displacements.

[0114] like Figure 12 As shown, in some embodiments of this disclosure, the second buffer assembly 1952 may include a plurality of second buffer rods 19521, which are spaced apart between the fixed plate 1951 and the buffer plate 1953, for providing buffering to the buffer plate 1953.

[0115] like Figure 12 As shown, in some embodiments, the plurality of second buffer rods 19521 may include six second buffer rods 19521. Those skilled in the art will understand that, although... Figure 12 Only six or more second buffer rods 19521 are shown in the diagram, but this is merely an example, and the second buffer assembly 1952 may also include other suitable numbers of second buffer rods 19521.

[0116] In some embodiments of this disclosure, the lifting platform 193 may include a lifting platform through hole 1931 (e.g., Figure 13 The lifting platform shown has a through hole 1931. Figure 12As shown, the fixing plate 1951 is disposed on the lower side of the through hole 1931 of the lifting platform and there is a gap between it and the lower end face of the lifting platform 193. The buffer plate 1953 is disposed in the through hole 1931 of the lifting platform, and the upper end face of the buffer plate 1953 is aligned with the upper end face of the lifting platform 193 or the upper end face of the buffer plate 1953 is higher than the upper end face of the lifting platform 193.

[0117] like Figure 12 As shown, in some embodiments, the fixing plate 1951 and the lifting platform 193 can be fixedly connected by two connecting plates 1954. The connecting plates 1954 have a certain height so that there is a gap between the fixing plate 1951 and the lower end face of the lifting platform 193.

[0118] In some embodiments, the multiple second buffer rods 19521 may include a second buffer tube, a second guide shaft, and a second linear bearing. The second buffer tube may include an elastic tube body and an axially extending hollow cavity within the tube body. The upper portion of the second guide shaft is axially sleeved within the hollow cavity of the second buffer tube, and the upper end of the second guide shaft is connected to the buffer plate 1953. The second linear bearing is fixedly connected to the fixed plate 1951 and sleeved outside the lower portion of the second guide shaft. The upper end of the second linear bearing may be connected to the lower end of the second buffer tube, and the second guide shaft may slide within the second linear bearing.

[0119] In some embodiments, the hollow cavity of the second buffer tube extends through the elastic tube of the second buffer tube, and the upper end of the elastic tube of the second buffer tube can abut against the buffer plate 1953, and the lower end can abut against the upper end of the second linear bearing.

[0120] Those skilled in the art will understand that, in some embodiments, the multiple second buffer bars 19521 may include the same or similar structure as the first buffer bar 19421.

[0121] Figure 13 A schematic diagram of the structure of a lifting assembly 192 according to some embodiments of the present disclosure is shown.

[0122] like Figure 13As shown, in some embodiments of this disclosure, the lifting assembly 192 may include a lifting drive device 1921 and a gear transmission mechanism 1922. The gear transmission mechanism 1922 is connected to the output end of the lifting drive device 1921 to receive driving force. The gear transmission mechanism 1922 may include at least two worms 19221, at least two worm wheels 1923, at least two lead screws 1924, and at least two lead screw nuts 1925. The at least two worms 19221 include worm 19221a and worm 19221b, wherein one end of worm 19221a is connected to the output end of the lifting drive device 1921, and the other end of worm 19221a is connected to worm 19221b. The at least two worm wheels 1923 include worm wheel 1923a and worm wheel 1923b, which mesh with worm 19221a and worm 19221b, respectively. At least two lead screws 1924, including lead screw 1924a and lead screw 1924b, are respectively threaded through the inner rings of worm gears 1923a and worm gear 1923b. At least two lead screw nuts 1925, including lead screw nuts 1925a and lead screw nuts 1925b, are respectively threadedly connected to lead screws 1924a and lead screw 1924b. The lifting platform 193 is fixedly connected to the lead screw nuts 1925a and lead screw nuts 1925b. The lifting drive device 1921 drives the lifting platform 193 to move up and down through the transmission of at least two worm gears 19221, at least two worm gears 1923, at least two lead screws 1924, and at least two lead screw nuts 1925.

[0123] Those skilled in the art will understand that, although Figure 10 The lifting drive device 1921 shown includes a handwheel that is manually driven, but this is only exemplary and the lifting drive device 1921 may also include other drive mechanisms, such as a motor.

[0124] like Figure 10 As shown, in some embodiments of this disclosure, the lifting slide 190 may further include a vehicle body 196 (for clarity, Figure 10 The main body of the vehicle body 196 (not shown) is used to support the lifting slide 190. The vehicle body 196 includes at least one rail 1961. The base 191 may include a sliding assembly 1911 disposed at the bottom of the base 191. The sliding assembly 1911 cooperates with the at least one rail 1961 so that the lifting slide 190 can slide on the vehicle body 196.

[0125] like Figure 10 As shown, in some embodiments, the vehicle body 196 may include two tracks 1961, and the sliding assembly 1911 may include multiple sliders or rollers that cooperate with the two tracks 1961 respectively, so that the lifting slide 190 can slide on the vehicle body 196.

[0126] Figure 14A partial structural schematic diagram of a sputtering coating apparatus 120 according to some embodiments of the present disclosure is shown.

[0127] like Figure 2 and Figure 14 As shown, in some embodiments of this disclosure, the sputtering coating apparatus 120 may include a vacuum coating chamber 121, a cathode target 130, a lifting slide 190 according to any embodiment of this disclosure, and a matching device 126. The upper end of the cathode target 130 is sealed to the vacuum coating chamber 121, and the cathode target 130 includes a target gun 132. The support platform 1943 of the lifting slide 190 is used to support the cathode target 130. The matching device 126 is disposed on the lifting platform 193, and the matching device 126 includes an insertion end 1261 for insertion into the matching port of the target gun 132.

[0128] In some embodiments of this disclosure, the lower end of the matcher 126 is disposed as follows: Figure 10 The buffer plate 1953 of the buffer platform 195 shown.

[0129] like Figure 14 As shown, in some embodiments of this disclosure, the cathode target 130 includes at least one positioning hole (not shown in the figures). Figure 10 and Figure 14 As shown, the support frame 194 may also include at least one positioning rod 1944, the lower end of which is connected to the frame 1941, and the upper end of which is accommodated in at least one positioning hole to position the matching port of the target gun 132 and the insertion end 1261 of the matching device 126.

[0130] During installation, the matching device 126 is securely placed on the buffer plate 1953 of the buffer platform 195. The matching port of the target gun 132 of the cathode target 130 is precisely inserted into the insertion end 1261 of the matching device 126, and the target gun 132 is placed on the flexible buffer plane support platform 1943 of the support frame 194. The drive body 196 is used to send the target gun 132 into the lifting position, and the lifting drive device 1921 is driven to extend the target gun 132 to the installation position of the cavity flange. The mounting bolts after the cathode target 130 and the vacuum coating cavity 121 flange are connected are tightened. Since both the buffer platform 195 and the support platform 1943 are flexible platforms with elasticity (e.g., springs), the springs will compensate for the height of movement during the tightening process, so that no stress will be generated that will affect the matching plug.

[0131] In some embodiments of this disclosure, the support platform 1943 of the lifting slide 190 is used to support the cathode target 130. The cathode target 130 can not only be raised and lowered with the lifting slide 190, but also slide horizontally with the lifting slide 190, thereby making the installation and replacement of the target material more labor-saving, convenient and quick.

[0132] It should be noted that the above are merely exemplary embodiments of this disclosure and are not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A sputtering coating system, characterized in that, include: Vacuum transfer chamber; At least one sputtering coating apparatus, the sputtering coating apparatus comprising: The vacuum coating chamber is connected to the vacuum transfer chamber; A substrate support mechanism, located at the top of the vacuum coating chamber and used to support the substrate; and The cathode target is vacuum-sealed to the vacuum coating chamber and is positioned opposite to the substrate support mechanism. The sample transfer arm mechanism is at least partially disposed within the vacuum transfer chamber; A vacuum drive mechanism, connected to the sample transfer arm mechanism, for driving the sample transfer arm mechanism to transfer the substrate between the at least one sputtering coating apparatus; and A protective cover, disposed within the vacuum coating chamber, comprises: A protective platform, the protective platform being hollow and comprising: The top opening is for facing the base; The lower opening faces the cathode target, and the area of ​​the lower opening is larger than that of the upper opening; The side extends from the upper opening to the lower opening and includes a plurality of through holes for blocking particulate matter; A top cover, disposed at the upper end of the protective platform, includes a top cover through hole communicating with the upper opening of the protective platform and a top cover flange extending outward from the top cover through hole; and A bottom cover is disposed at the lower end of the protective platform. The bottom cover includes a bottom cover through hole communicating with the lower opening of the protective platform and a bottom cover flange extending outward from the bottom cover through hole.

2. The sputtering coating system according to claim 1, characterized in that, Also includes: The sample inlet chamber is vacuum-sealed and connected to the vacuum transfer chamber. The sampling chamber is vacuum-sealed and connected to the vacuum transfer chamber. The sample transfer arm mechanism is used to transfer the substrate between the sample inlet chamber, the sample outlet chamber, and the at least one sputtering coating device.

3. The sputtering coating system according to claim 2, characterized in that, Also includes: The wafer transport system is connected to the sample inlet chamber and the sample outlet chamber. The wafer handling system is used to pick up the substrate, flip the substrate so that the coated surface of the substrate is facing down, and transport the substrate to the tray of the sample inlet chamber. The sample transfer arm mechanism is used to transfer the tray between the sample inlet chamber, the sample picking chamber and the at least one sputtering coating device to transfer the substrate.

4. The sputtering coating system according to claim 2, characterized in that, The at least one sputtering coating apparatus includes: At least one reusable coating apparatus for performing reusable coating processes; and Multiple dedicated coating apparatuses are used for non-reusable coating processes, the time required for which the non-reusable coating processes exceed the time required for the reusable coating processes.

5. The sputtering coating system according to claim 4, characterized in that, Also includes: A control device, connected to the vacuum drive mechanism, is used to control the vacuum drive mechanism to drive the sample transfer arm mechanism to transfer the substrate between the sample inlet chamber, the sample outlet chamber, the at least one reused coating device, and the plurality of independent coating devices, so as to achieve sputter coating on the substrate when the at least one reused coating device is reused.

6. The sputtering coating system according to claim 5, characterized in that, The at least one reusable coating apparatus includes: A first reusable coating apparatus is used to perform a first sputtering process; A second reuse coating apparatus is used for performing a second sputtering process; and The third reusable coating apparatus is used for the third sputtering process; The plurality of dedicated coating apparatuses include three dedicated coating apparatuses for performing a fourth sputtering process, wherein the time required for the fourth sputtering process is more than twice the sum of the times required for the first sputtering process, the second sputtering process, and the third sputtering process.

7. The sputtering coating system according to claim 2, characterized in that, Also includes: At least one substrate sensor is mounted on the vacuum transfer chamber for tracking the position of the substrate; and / or Multiple substrate sensors, wherein the substrate sensors are through-beam sensors, and the transmitting and receiving ends of the multiple through-beam sensors are respectively located on both sides of the transmission path of the substrate between the vacuum transfer cavity and the sputtering coating device, between the vacuum transfer cavity and the sample injection cavity, and between the vacuum transfer cavity and the sampling cavity.

8. The sputtering coating system according to claim 1, characterized in that, The protective cover is grounded to stabilize the electrical potential within the sputtering coating apparatus.

9. The sputtering coating system according to claim 1, characterized in that, The sputtering coating apparatus further includes at least one inner liner plate, the at least one inner liner plate comprising: A first inner liner plate is disposed on the inner wall of the vacuum coating chamber; and / or A second inner lining plate is disposed around the protective cover, with the upper end of the second inner lining plate above the upper end of the protective cover and the lower end of the second inner lining plate below the lower end of the protective cover; and / or At least one inner liner plate is grounded.

10. The sputtering coating system according to claim 3, characterized in that, The tray has a circular ring structure, and the inner ring of the tray is provided with an inwardly extending flange for supporting the base; The area of ​​the upper opening of the protective platform matches the area of ​​the inner ring of the tray, and their centers are aligned; and / or The distance from the outer edge of the top protective flange to the central axis of the protective platform is greater than or equal to the distance from the edge of the lower opening of the protective platform to the central axis of the protective platform; and / or The distance from the outer edge of the bottom protective flange to the central axis of the hollow protective platform is greater than or equal to the distance from the outer edge of the top protective flange to the central axis of the protective platform; and / or The distance from the outer edge of the top cover flange to the central axis of the protective platform is greater than or equal to the distance from the edge of the tray to the central axis of the protective platform.

11. The sputtering coating system according to claim 1, characterized in that, The distal end of the cathode target includes at least one latch. The bottom cover includes at least one slot that engages with at least one snap fastener of the cathode target to restrict movement of the bottom cover on the cathode target, but allows the bottom cover to move upward.

12. The sputtering coating system according to claim 1, characterized in that, The sputtering coating apparatus further includes at least one lifting slide, the at least one lifting slide comprising: Base A lifting assembly is mounted on the base; A lifting platform, connected to the lifting assembly, is used to lift and lower under the drive of the lifting assembly; A support frame, disposed on the lifting platform, includes: Frame; The first buffer assembly is mounted on the frame. A support platform is disposed on the first buffer assembly, the first buffer assembly allowing for installation errors and / or movement offsets of the support platform, the support platform being used to support the cathode target.

13. The sputtering coating system according to claim 12, characterized in that, The first buffer assembly includes multiple first buffer rods, spaced apart between the frame and the support platform, for providing buffering to the support platform. The first buffer rods include: The first buffer tube includes an elastic tube body and an axially extending hollow cavity within the tube body; A first guide shaft, the upper part of which is axially sleeved within the hollow cavity of the first buffer tube, is connected at its upper end to the support platform; and The first linear bearing is fixedly connected to the frame and sleeved on the outside of the lower part of the first guide shaft. The upper end of the first linear bearing is connected to the lower end of the first buffer tube, and the first guide shaft can slide inside the first linear bearing.

14. The sputtering coating system according to claim 13, characterized in that, The hollow cavity of the first buffer tube extends through the elastic tube body of the first buffer tube, and the upper end of the elastic tube body of the first buffer tube abuts against the support platform, and the lower end abuts against the upper end of the first linear bearing.

15. The sputtering coating system according to claim 12, characterized in that, The at least one lifting slide further includes a buffer platform, the buffer platform comprising: A fixed plate is fixedly connected to the lifting platform; The second buffer assembly is connected at its lower end to the fixed plate; and A buffer plate, connected to the upper end of the second buffer assembly, provides cushioning to the buffer plate. The sputtering coating apparatus further includes a matching device, the lower end of which is disposed on the buffer plate of the buffer platform. The matching device includes an insertion end for inserting into the matching port of the target gun of the cathode target; and / or The cathode target includes at least one positioning hole. The support frame further includes at least one positioning rod, the lower end of which is connected to the support frame, and the upper end of which is accommodated in at least one positioning hole to position the matching port of the target gun of the cathode target and the insertion end of the matching device.

16. The sputtering coating system according to claim 15, characterized in that, The second buffer assembly includes multiple second buffer rods spaced apart between the fixed plate and the buffer plate, for providing cushioning to the buffer plate; and / or The lifting platform includes a lifting platform through hole, the fixing plate is disposed near the lifting platform through hole and has a gap with the lower end face of the lifting platform, the buffer plate is disposed in the lifting platform through hole, and the upper end face of the buffer plate is aligned with the upper end face of the lifting platform or the upper end face of the buffer plate is higher than the upper end face of the lifting platform.

17. The sputtering coating system according to claim 16, characterized in that, The second buffer bar includes: The second buffer tube includes an elastic tube body and an axially extending hollow cavity within the tube body; The upper part of the second guide shaft is axially sleeved within the hollow cavity of the second buffer tube, and the upper end of the second guide shaft is connected to the buffer plate; and A second linear bearing is fixedly connected to the fixed plate and sleeved outside the lower end portion of the second guide shaft. The upper end of the second linear bearing is connected to the lower end of the second buffer tube. The second guide shaft can slide within the second linear bearing; and / or The hollow cavity of the second buffer tube extends through the elastic tube body of the second buffer tube, and the upper end of the elastic tube body of the second buffer tube abuts against the buffer plate, and the lower end abuts against the upper end of the second linear bearing.

18. The sputtering coating system according to claim 12, characterized in that, The lifting assembly includes: Lifting drive device; A gear transmission mechanism is connected to the output end of the lifting drive device to receive driving force. The gear transmission mechanism includes: At least two worm gears; At least two worm gears, each meshing with one of the at least two worms; At least two lead screws are respectively threaded through the inner rings of the at least two worm gears; At least two lead screw nuts are threadedly connected to the at least two lead screws respectively. The lifting platform is fixedly connected to the lead screw nuts of the at least two lead screws. The lifting drive device drives the lifting platform to move up and down through the transmission of the at least two worm gears, the at least two worm wheels, the at least two lead screws, and the at least two lead screw nuts; and / or The lifting slide also includes a vehicle body for supporting the lifting slide, and the vehicle body includes at least one track. The base includes a sliding assembly disposed at the bottom of the base, the sliding assembly cooperating with the at least one track to enable the lifting slide to slide on the vehicle body.

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