Electron beam size measuring device and method

Abstract

This disclosure relates to the field of vacuum electronic equipment technology, and discloses an electron beam size measuring device and method. The electron beam size measuring device includes an electron beam source, an anode target, a driving device, and a detection device. The electron beam source is used to emit an electron beam. The anode target includes a bombardment surface for receiving the electron beam, and the bombardment surface includes a first material surface and a second material surface arranged side-by-side. The driving device is connected to the electron beam source and / or the anode target, and is used to drive the electron beam source and / or the anode target to move relative to each other, so that the electron beam scans the first material surface and the second material surface. The detection device is used to detect the signal generated after the bombardment surface is bombarded by the electron beam, and the signal is used to determine the electron beam size.

Description

Technical Field

[0001] This disclosure relates to the field of vacuum electronic equipment technology, and in particular to an electron beam size measuring device and method. Background Technology

[0002] An electron beam is a stream of electrons moving directionally with a small divergence, typically emitted from an electron beam source. In recent years, electron beams have been widely used in materials evaporation, vacuum welding, surface modification, coating preparation, wastewater treatment, and X-ray sources. In most applications (such as X-ray sources), the size of the electron beam is crucial.

[0003] Precise measurement of electron beam dimensions helps improve the structural design and operating parameters of electron beam sources. However, there is still a lack of an electron beam size measurement method that combines the advantages of simple design, easy operation, reliable results, and economic practicality. Summary of the Invention

[0004] This disclosure provides an electron beam size measuring device, comprising: An electron beam source is used to emit an electron beam. An anode target includes a bombardment surface for receiving an electron beam, the bombardment surface comprising a first material surface and a second material surface side by side; A driving device, connected to an electron beam source and / or an anode target, is used to drive relative movement between the electron beam source and / or the anode target, so that the electron beam scans the first material surface and the second material surface; and The detection device is used to detect the signal generated after the bombardment surface is bombarded by an electron beam, and the signal is used to determine the size of the electron beam.

[0005] This disclosure provides a method for measuring electron beam dimensions, including the following steps: The electron beam scans the bombardment surface of the anode target, so that the electron beam scans through the first material surface and the second material surface of the bombardment surface; Detect the signal generated after the surface is bombarded by an electron beam; The electron beam size is determined based on the signal. Attached Figure Description

[0006] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only one embodiment of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0007] Figure 1A schematic diagram of the structure of an electron beam size measuring device according to some embodiments of the present disclosure is shown; Figure 2 A schematic diagram illustrating an electron beam size measurement method according to some embodiments of the present disclosure is shown; Figure 3 A schematic diagram of the structure of a drive device according to some embodiments of the present disclosure is shown; Figure 4 An exploded schematic diagram of an electron beam size measuring apparatus according to some embodiments of the present disclosure is shown; Figure 5 A schematic diagram of the structure of the base of the anode target according to some embodiments of the present disclosure is shown; Figure 6 A framework diagram of an electron beam size measurement method according to some embodiments of the present disclosure is shown; Figure 7 Simulation results of electron beam size measurement methods according to some embodiments of the present disclosure are shown.

[0008] In the above figures, the reference numerals represent: 100-Electron Beam Size Measurement Device 110-Electron Beam Source 120-Anode Target 121-Surface bombardment 1211-First Material Surface 1212-Second material surface 1213-Linear Interface 122-Base 1221-Cooling medium inlet pipe 12211-Longitudinal Inlet Pipe 12212-Horizontal Inlet Pipe 1222-Cooling medium return pipe 12221-Longitudinal reflux pipe 12222-Horizontal Reflux Pipe 123-Sealing ring 124-Cover Plate 130-Detection Device 131-Photoelectric Sensor 132-Electronic Signal Detection Device 140-Drive unit 141-Motor 142-Sealing Flange 143-Corrugated Pipe 144-Support Frame 1441-Support Frame Flange 145-lead screw 146-Slider 147-Fixing Plate 148-Installation Flange 150 water cooling system 151-Coaxial cooling pipe 1511-Inner Tube 1512 - Outer tube. Detailed Implementation

[0009] Some embodiments of this disclosure will now be described with reference to the accompanying drawings. Obviously, the described embodiments are merely exemplary embodiments of this disclosure, and not all embodiments.

[0010] In the description of this disclosure, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," "top," and "bottom," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this disclosure, it should be noted that unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "coupling" should be interpreted broadly, for example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two elements. In the description of this disclosure, "distal" or "farside" refers to one end or side that extends into a vacuum environment (e.g., a vacuum chamber), while "proximal" or "proximal" is the end or side opposite to "distal" or "farside" (e.g., one end or side away from the vacuum chamber, or one end or side within the vacuum chamber that is closer to the vacuum chamber wall, etc.). Alternatively, the end or side closer to the drive device is called the proximal or proximal end, and the end or side farther from the drive device is called the distal or distal end. Those skilled in the art will understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0011] Therefore, the following methods are typically chosen to measure the size of high power density electron beams: I. Water-cooled Faraday cup. This method uses water to cool the receiving electrode, which effectively prevents drastic material evaporation, allowing the electron beam source to operate continuously during measurement. However, since the receiving electrode needs to conduct current signals, it must be insulated from other components, which increases the design difficulty of water cooling and makes such measuring devices often complex in structure and expensive.

[0012] II. Pulse Cutoff. This method adds a grid to the electron beam source, which is connected to an external pulsed high-voltage power supply. When the negative voltage output by the power supply is higher than the electron energy, electrons cannot pass through, thus achieving beam cutoff. The high voltage of the power supply is pulsed, and the duty cycle can be 99% or even higher, which reduces the average power of the electron beam to below 1%, allowing it to be used with a Faraday cup to measure the beam spot. However, this method has high requirements for the power supply and requires modification of the electron beam source, making it uncommon.

[0013] III. Thin Film Ablation. This method places a micrometer-thick thin film in the path of an electron beam. The high-power-density electron beam ablates the film, creating holes. The diameter of these holes is then observed and measured using a microscope, and is considered the size of the electron beam. However, because the energy deposited on the thin film cannot be quickly conducted away, the film at the edge of the holes continues to ablate, resulting in a significantly larger measured electron beam size and very low accuracy.

[0014] IV. X-ray Cameras. Since X-rays are generated when a high-energy electron beam interacts with a target, and the X-ray generation area largely coincides with the electron beam bombardment area, X-ray cameras can be used to observe and measure the size of the light source area, thereby obtaining the electron beam size. However, the design and construction of X-ray focusing optical paths are complex, and high-resolution X-ray cameras are often expensive, limiting their applicability.

[0015] This disclosure relates to a novel electron beam size measurement device and method, which is low in cost, high in accuracy, and widely applicable.

[0016] Figure 1 A schematic diagram of the structure of an electron beam size measuring device 100 according to some embodiments of the present disclosure is shown.

[0017] like Figure 1 As shown, in some embodiments of this disclosure, the electron beam size measuring device 100 may include an electron beam source 110, an anode target 120, and a driving device 140 (see [reference]). Figure 3 The anode target 120 includes a detection device 130. An electron beam source 110 is used to emit an electron beam. The anode target 120 includes a bombardment surface 121 for receiving the electron beam. The bombardment surface 121 includes a first material surface 1211 and a second material surface 1212 arranged side-by-side. In this disclosure, "side-by-side" means that the first material surface 1211 and the second material surface 1212 are laid flat on the plane of the bombardment surface 121. The first material surface 1211 and the second material surface 1212 may have an interface, which may have various suitable shapes, such as linear, curved, polygonal, etc.

[0018] The driving device 140 is connected to the electron beam source 110 and / or the anode target 120, and is used to drive the electron beam source 110 and / or the anode target 120 to move relative to each other, so that the electron beam scans the first material surface 1211 and the second material surface 1212. The detection device 130 is used to detect the signal generated after the bombardment surface 121 is bombarded by the electron beam, and the signal is used to determine the electron beam size. The electron beam size measuring device 100 of some embodiments of this disclosure has a simple structure, low cost, and is highly efficient and practical.

[0019] Those skilled in the art will understand that the electron beam source 110 can be implemented in various suitable ways. For example, in some embodiments, the electron beam source 110 may include an electron gun.

[0020] like Figure 1 As shown, in some embodiments of this disclosure, the first material surface 1211 and the second material surface 1212 have a generally linear interface 1213. In some embodiments, a generally linear interface refers to an interface with straight and clear boundaries. The boundaries of the first material surface 1211 and the second material surface 1212 may be straight and clear.

[0021] In some embodiments of this disclosure, the first material surface 1211 may include a first metallic material, and the second material surface 1212 may include a second metallic material, which is different from the first metallic material. In this disclosure, the first material in the first material surface 1211 and the second material in the second material surface 1212 can be made of any suitable material. For example, the first material in the first material surface 1211 and the second material in the second material surface 1212 can each be made of two different metallic materials. When the two metallic materials are bombarded by an electron beam, they generate different X-ray signals, which the detection device 130 can detect and determine the size of the electron beam based on these signals.

[0022] Figure 2 A schematic diagram of an electron beam size measurement method according to some embodiments of the present disclosure is shown.

[0023] like Figure 1 and Figure 2As shown, in some embodiments, the anode target 120 has a first material surface 1211 and a second material surface 1212 side by side. A high-energy electron beam emitted from the electron beam source 110 bombards the bombardment surface 121 of the anode target, generating X-rays. These X-rays irradiate the photoelectric sensor 131 (e.g., a photodiode), generating a photocurrent. The electrical signal (e.g., current) is ultimately recorded by the electrical signal detection device 132 (e.g., an ammeter). Since the intensity of the generated X-rays is related to the target material, after laterally moving the electron beam source 110 and / or the anode target 120, the electron beam sweeps across the side-by-side first material surface 1211 and second material surface 1212, and the electrical signal recorded by the electrical signal detection device 132 will exhibit, for example… Figure 2 The pattern shown. Figure 2 The horizontal axis represents the moving distance of the electron beam source 110 and / or the anode target 120, and the vertical axis represents the photoelectric signal intensity. When 0 < x < x At time 1, the electron beam hits the second material surface 1212 completely, and the photocurrent remains at a weak level; when x 1< x < x At time 2, the surface 1211 of the first material gradually enters the electron beam bombardment range, and the photocurrent gradually increases; when x > x At time 2, the electron beam hits the surface 1211 of the first material completely, resulting in the strongest and constant photocurrent. Therefore, ∆ x = x 2- x 1. It can calculate the full width of the electron beam.

[0024] Those skilled in the art will understand that Figure 2 The curve variation pattern in the schematic diagram of the electron beam size measurement method shown is only an example. When the electrical signal on the second material surface 1212 is stronger than the electrical signal on the first material surface 1211, the electrical signal will first be maintained at a stronger level, then gradually weaken, and after weakening to a certain extent, it will remain constant.

[0025] In some embodiments of this disclosure, the first material in the first material surface 1211 may include any one of, for example, lithium, beryllium, sodium, magnesium, aluminum, copper, chromium, titanium, zinc, platinum, gold, tin, lead, or silver. The second material in the second material surface 1212 may include any one of, for example, lithium, beryllium, sodium, magnesium, aluminum, copper, chromium, titanium, zinc, platinum, gold, tin, lead, or silver other than the first material. Those skilled in the art will understand that the types of first and second materials exemplified herein are merely exemplary, and the first and second materials may also include other metallic materials not listed herein.

[0026] In some embodiments of this disclosure, the drive device 140 is connected to the anode target 120 and is used to drive the anode target 120 to move linearly in a direction perpendicular to the propagation direction of the electron beam, so that the electron beam scans the first material surface 1211 and the second material surface 1212.

[0027] In some embodiments of this disclosure, the direction of linear motion of the anode target 120 is perpendicular to the linear interface 1213 of the first material surface 1211 and the second material surface 1212.

[0028] Figure 3 A schematic diagram of the structure of a drive device 140 according to other embodiments of the present disclosure is shown. Figure 4 An exploded schematic diagram of an electron beam size measuring device 100 according to some embodiments of the present disclosure is shown.

[0029] like Figure 3 and Figure 4 As shown, in some embodiments of this disclosure, the drive device 140 may include a motor 141, a sealing flange 142, a bellows 143, a support frame 144, a lead screw 145, and a slider 146. The proximal end of the bellows 143 is vacuum-sealed to the sealing flange 142. The support frame 144 may include a support frame flange 1441, which is vacuum-sealed to the sealing flange 142. The distal end of the support frame 144 passes through the sealing flange 142 and the bellows 143, and the anode target 120 is disposed at the distal end of the support frame 144. The lead screw 145 is connected to the output end of the motor 141. The proximal end of the slider 146 is threadedly connected to the lead screw 145, and the distal end is fixedly connected to the sealing flange 142. The motor 141 drives the lead screw 145 to move the slider 146 linearly, thereby moving the anode target 120 linearly. In some embodiments, the drive device 140 may further include a fixed plate 147, on which a track for the linear motion of the slider 146 is provided, so that the slider 146 can move linearly along the fixed plate 147, thereby driving the anode target 120 to move linearly.

[0030] like Figure 3 and Figure 4 As shown, in some embodiments of this disclosure, the drive device 140 may further include a mounting flange 148 connected to the distal end of the bellows 143, the mounting flange 148 being used for a sealed connection with the vacuum chamber.

[0031] Those skilled in the art will understand that Figure 3The illustrated drive unit 140 is merely exemplary, and other structures may also be employed. For example, in some embodiments, the drive unit 140 may include a motor, a sealing flange, a bellows, and a support frame. The proximal end of the bellows is vacuum-sealed to the sealing flange, and the distal end of the bellows is provided with a cover. The output end of the motor passes through the sealing flange and the bellows, and is threadedly connected to the proximal end of the cover, enabling it to drive the cover to perform linear motion. The proximal end of the support frame is fixedly connected to the distal end of the cover, enabling it to perform linear motion under the drive of the motor. The anode target is disposed at the distal end of the support frame, and under the drive of the motor, the support frame drives the anode target to perform linear motion.

[0032] In some embodiments of this disclosure, the detection device 130 may include a photoelectric sensor 131 and an electrical signal detection device 132. The photoelectric sensor 131 generates a photocurrent after the high-energy electron beam emitted from the electron beam source 110 bombards the bombardment surface 121 of the anode target, and the electrical signal detection device 132 is used to detect and record the generated photocurrent.

[0033] In some embodiments of this disclosure, the electron beam size measuring device 100 may further include a controller (not shown in the figure), which is connected to the detection device 130 and is used to receive the detection signal from the detection device 130 and determine the size of the electron beam.

[0034] In some embodiments of this disclosure, the controller is connected to the drive device 140 and is used to control the drive device 140 to drive the electron beam source 110 and / or the anode target 120 to move, and to obtain motion data (e.g., movement distance) of the electron beam source 110 and / or the anode target 120; the controller determines the size of the electron beam based on the inflection point of the detection signal relative to the motion data.

[0035] In some embodiments of this disclosure, the controller generates a detection signal curve based on motion data and determines the size of the electron beam based on the first derivative of the curve. For example, the size of the electron beam is determined based on the range between points on both sides of the curve where the first derivative is zero.

[0036] In some embodiments of this disclosure, the electron beam size measuring device 100 may further include a cooling system thermally coupled to the anode target 120 for cooling the anode target 120. Those skilled in the art will understand that the cooling system can be implemented in various suitable ways, such as an electronic cooling system, a water cooling system, etc.

[0037] like Figure 4As shown, in some embodiments of this disclosure, the cooling system may be a water-cooling system 150 disposed below the anode target. The water-cooling system 150 may include a coaxial cooling pipe 151. The anode target 120 is disposed at the distal end of the coaxial cooling pipe 151. The coaxial cooling pipe 151 may include an inner pipe 1511 and an outer pipe 1512. The inner pipe 1511 is a cooling medium inlet pipe, with a cooling medium inlet at its proximal end and a cooling medium outlet at its distal end. The outer pipe 1512 is a cooling medium return pipe, with a cooling medium outlet at its proximal end and a cooling medium return inlet at its distal end. The cooling medium outlet is disposed relative to the lower surface of the anode target 120 so that the cooling medium can flow across the lower surface of the anode target 120. The coaxial cooling pipe 151 also serves as a support frame 144, making the electron beam size measuring device 100 not only more compact and space-saving but also providing better cooling performance.

[0038] Figure 5 A schematic diagram of the structure of the base 122 of the anode target 120 according to some embodiments of the present disclosure is shown.

[0039] like Figure 5 As shown, in some embodiments of this disclosure, the anode target 120 may further include a base 122. The base 122 may include a transverse hole (not shown) and an anode target mounting groove. The transverse hole is used to accommodate at least a portion of the coaxial cooling conduit 151. The anode target mounting groove is disposed at the top of the base 122, and the anode target 120 is sealed to the anode target mounting groove, for example, by means of a sealing ring 123. In some embodiments, the anode target 120 may further include a cover plate 124, which is disposed at the top of the base 122 for fixing the anode target 120.

[0040] like Figure 5As shown, in some embodiments of this disclosure, the base 122 may further include a cooling medium inlet pipe 1221 and a cooling medium return pipe 1222. The cooling medium inlet pipe 1221 may include a longitudinal inlet pipe 12211 and a transverse inlet pipe 12212. The upper end of the longitudinal inlet pipe 12211 is disposed relative to the lower surface of the anode target 120, so that the cooling medium can flow through the lower surface of the anode target 120. The distal end of the transverse inlet pipe 12212 is connected to the lower end of the longitudinal inlet pipe 12211, and the proximal end of the transverse inlet pipe 12212 is connected to the inner pipe 1511 of the coaxial cooling conduit 151. The cooling medium return pipe 1222 may include a longitudinal return pipe 12221 and a transverse return pipe 12222. The longitudinal return pipe 12221 is coaxially disposed outside the longitudinal inlet pipe 12211, so that the cooling medium flows back into the longitudinal return pipe 12221 after flowing through the lower surface of the anode target. The transverse return pipe 12222 is coaxially arranged outside the transverse inlet pipe 12212. The far end of the transverse return pipe 12222 is connected to the lower end of the longitudinal return pipe 12221, and the near end of the transverse return pipe 12222 is connected to the outer pipe 1512 of the coaxial cooling pipe.

[0041] Figure 6 A framework diagram of an electron beam size measurement method according to some embodiments of the present disclosure is shown.

[0042] like Figure 6 As shown, in some embodiments of this disclosure, the electron beam size measurement method may include the following steps: An electron beam is scanned on the bombardment surface 121 of the anode target 120, such that the electron beam scans through the first material surface 1211 and the second material surface 1212 of the bombardment surface 121. Detect the signal generated after the bombarded surface 121 is bombarded by an electron beam; The electron beam size is determined based on the signal.

[0043] In some embodiments of this disclosure, scanning the bombardment surface 121 of the anode target 120 with an electron beam includes: driving the electron beam source 110 and / or the anode target 120 to move relative to each other, so that the electron beam scans the first material surface 1211 and the second material surface 1212. For example, a driving device 140 may be connected to the electron beam source 110 and / or the anode target 120 that emits the electron beam, for driving the electron beam source 110 and / or the anode target 120 to move relative to each other, so that the electron beam scans the first material surface 1211 and the second material surface 1212. A detection device 130 is used to detect the signal generated after the bombardment surface 121 is bombarded by the electron beam, and the signal is used to determine the electron beam size.

[0044] In some embodiments of this disclosure, determining the electron beam size based on a signal may include: determining the electron beam size based on inflection points of motion data of the detection signal relative to the electron beam scan. In some embodiments, the controller generates a detection signal curve based on the motion data and determines the electron beam size based on the range between points where the first derivative of the curve is zero on both sides of the curve.

[0045] Figure 7 Simulation results of electron beam size measurement methods according to some embodiments of the present disclosure are shown.

[0046] The electron beam size measurement method of some embodiments of this disclosure can be simulated using the Geant4 program. A 1 mm electron beam with uniform intensity distribution is used to scan the bombardment surface 121 of the anode target 120, such that the electron beam scans through a first material surface 1211 and a second material surface 1212 of the bombardment surface 121, wherein the first material surface 1211 is made of aluminum (Al) and the second material surface is made of gold (Au). X-ray events generated throughout the entire space are counted. When the anode target 120 moves from the Al region to the Au region in 100 μm steps, the trend of the counted photon number change is as follows: Figure 7 As shown. Figure 7 The points where the first derivative is zero on both sides of the curve are located at -0.5 mm and 0.5 mm, respectively, thus determining the electron beam size to be 1 mm, which matches the initial setup conditions. The electron beam size measurement method of some embodiments of this disclosure avoids complex structural design and high equipment costs, and has advantages such as simple operation, high efficiency and practicality, and accurate results.

[0047] It should be noted that the above are merely exemplary embodiments of this disclosure and are not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. An electron beam size measuring device, characterized in that, include: An electron beam source is used to emit an electron beam. An anode target includes a bombardment surface for receiving the electron beam. The bombardment surface includes a first material surface and a second material surface that are laid flat on a plane of the bombardment surface. The first material surface and the second material surface are laterally joined along the plane without overlapping or covering in the thickness direction. The first material surface and the second material surface have a generally linear interface. The first material surface includes a first metallic material, and the second material surface includes a second metallic material that is different from the first metallic material. A driving device, connected to the electron beam source and / or anode target, is used to drive the electron beam source and / or anode target to move relative to each other, so that the electron beam scans the first material surface and the second material surface; as well as A detection device is used to detect the signal generated after a surface is bombarded by an electron beam, and the signal is used to determine the size of the electron beam.

2. The electron beam size measuring device according to claim 1, characterized in that, The driving device is connected to the anode target and is used to drive the anode target to move linearly in a direction perpendicular to the propagation direction of the electron beam, so that the electron beam scans the first material surface and the second material surface; and / or The drive unit includes: Electric motor; Sealing flange; The bellows is connected to the sealing flange at the near end via a vacuum seal. The support frame includes a support frame flange, which is vacuum-sealed to a sealing flange. The distal end of the support frame passes through the sealing flange and a bellows. The anode target is located at the distal end of the support frame. The lead screw is connected to the output end of the motor; and The slider, with its proximal end threadedly connected to the lead screw and its distal end fixedly connected to the sealing flange, can move linearly under the drive of the lead screw, thereby driving the anode target to move linearly.

3. The electron beam size measuring device according to claim 2, characterized in that, The direction of the linear motion of the anode target is perpendicular to the linear interface between the first material surface and the second material surface.

4. The electron beam size measuring device according to claim 1, characterized in that, The detection device includes a photoelectric sensor and an electrical signal detection device.

5. The electron beam size measuring device according to claim 1, characterized in that, It also includes a controller connected to the detection device for receiving detection signals from the detection device and determining the size of the electron beam.

6. The electron beam size measuring device according to claim 5, characterized in that, The controller is connected to the driving device and is used to control the driving device to drive the electron beam source and / or anode target to move, and to obtain motion data of the electron beam source and / or anode target; the controller determines the size of the electron beam based on the inflection point of the detection signal relative to the motion data.

7. The electron beam size measuring device according to claim 6, characterized in that, The controller generates a detection signal curve based on the motion data, and determines the size of the electron beam based on the first derivative of the curve.

8. The electron beam size measuring device according to claim 1 or 2, characterized in that, Also includes: A cooling system, thermally coupled to the anode target, is used to cool the anode target; and / or A water-cooling system is disposed below the anode target. The water-cooling system includes a coaxial cooling pipe. The anode target is disposed at the distal end of the coaxial cooling pipe. The coaxial cooling pipe includes an inner pipe and an outer pipe. The inner pipe is a cooling medium inlet pipe, with a cooling medium inlet at its proximal end and a cooling medium outlet at its distal end. The outer pipe is a cooling medium return pipe, with a cooling medium outlet at its proximal end and a cooling medium return inlet at its distal end. The cooling medium outlet is disposed relative to the lower surface of the anode target so that the cooling medium can flow across the lower surface of the anode target.

9. A method for measuring electron beam dimensions using the electron beam dimension measuring device as described in any one of claims 1-8, characterized in that, Includes the following steps: An electron beam is scanned on the bombardment surface of an anode target such that the electron beam scans through a first material surface and a second material surface that are paved on the plane of the bombardment surface. The first material surface and the second material surface have a generally linear interface. The first material surface includes a first metallic material, and the second material surface includes a second metallic material that is different from the first metallic material. Detect the signal generated after the bombarded surface is bombarded by an electron beam; as well as The electron beam size is determined based on the signal.

10. The electron beam size measurement method according to claim 9, characterized in that, Scanning the surface of the anode target with an electron beam includes: The electron beam source and / or anode target are driven to move relative to each other so that the electron beam scans the first material surface and the second material surface.

11. The electron beam size measurement method according to claim 9, characterized in that, Determining the electron beam size based on the signal includes: The size of the electron beam is determined based on the inflection point of the motion data of the signal relative to the electron beam scan.

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