A three-dimensional chip packaging structure

Abstract

The present invention relates to the technical field of chip packaging technology, and specifically provides a three-dimensional chip packaging structure, including: a bottom substrate, a top cover plate is arranged above the bottom substrate, and a packaging outer frame is fixedly connected between the top cover plate and the bottom substrate; a heat dissipation component is located in the middle between the bottom substrate and the top cover plate. The heat dissipation component is composed of multiple heat dissipation blocks stacked up and down. The heat dissipation blocks are in a "cross" shape structure, and a ventilation groove is penetrated through the middle. An air inlet is arranged at the end of the heat dissipation block; a radiator housing is installed on the surface of the top cover plate and is communicated with the inner cavity of the heat dissipation component; The beneficial effects are as follows: By arranging a heat dissipation component between the bottom substrate and the top cover plate, the heat dissipation component is composed of multiple heat dissipation blocks stacked up and down, the heat dissipation blocks are in a "cross" shape structure, and a heat dissipation fan blade is built in the radiator housing, and air can flow inside the packaging outer frame. This device can make better use of space, increase components, and improve heat dissipation capacity and electrical performance.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and specifically to a three-dimensional chip packaging structure. Background Art

[0002] Chip packaging is to fix an integrated circuit chip on a carrier, connect it to an external circuit through leads, solder balls, etc., provide mechanical protection, electrical connection and heat dissipation channels for it, and finally form an independent component that is convenient to install on a circuit board.

[0003] In the prior art, three-dimensional chip packaging realizes vertical interconnection by stacking multiple chips and applying technologies such as through-silicon vias (TSV) to reduce volume, improve integration and performance.

[0004] However, currently, due to the increase in the number of stacked chips, the overall heat dissipation effect of the packaging structure is poor, the chip performance is difficult to fully play due to heat dissipation, and the overall electrical performance of the packaging is insufficient. Therefore, the present invention proposes a three-dimensional chip packaging structure to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a three-dimensional chip packaging structure to solve the problems raised in the above background art.

[0006] To achieve the above purpose, the present invention provides the following technical solution: A three-dimensional chip packaging structure, the three-dimensional chip packaging structure includes:

[0007] A bottom substrate, a top cover plate is arranged above the bottom substrate, a packaging outer frame is fixedly connected between the top cover plate and the bottom substrate, a transfer board and an upper substrate are sequentially arranged in the inner cavity of the packaging outer frame from bottom to top, a flip chip, a face-up chip and a small chip are respectively arranged on the upper surface of the bottom substrate, the upper surface of the transfer board and the upper surface of the upper substrate;

[0008] A heat dissipation member, the heat dissipation member is located in the middle between the bottom substrate and the top cover plate, the heat dissipation member is composed of a plurality of heat dissipation blocks stacked up and down, the heat dissipation blocks are in a "cross" shape structure, and an air vent groove is penetrated through the middle, an air suction port is opened at the end of the heat dissipation block, and an air suction filter plate corresponding to the air suction port is arranged on the side surface of the packaging outer frame;

[0009] A radiator housing, the radiator housing is installed on the surface of the top cover plate and communicates with the inner cavity of the heat dissipation member, a heat dissipation fan blade is rotatably installed in the inner cavity of the radiator housing, and an exhaust pipe is communicated with the outside of the radiator housing.

[0010] Preferably, a radiator cover is fixedly connected to the upper side of the radiator housing, a main exhaust hole is opened at the end surface of the exhaust pipe, and a secondary exhaust groove is opened on the side wall of the end of the exhaust pipe.

[0011] Preferably, four exhaust pipes are provided and distributed in an annular array around the radiator housing, and the axis of the exhaust pipe is tangent to the inner wall of the radiator housing.

[0012] Preferably, a porous filter plate is provided in the middle of the surface of the top sealing plate. The porous filter plate communicates the inner cavity of the radiator housing and the inner cavity of the ventilation groove. A heat dissipation groove plate is installed at the edge of the lower surface of the top sealing plate. A connecting pipe is fixedly connected to the surface of the top sealing plate, and the connecting pipe communicates the inner cavity of the heat dissipation groove plate and the auxiliary exhaust groove.

[0013] Preferably, a plurality of diversion partition plates are fixedly connected at equal intervals on the inner wall of the heat dissipation groove plate, and adjacent two of the diversion partition plates are mutually offset. The air in the inner cavity of the heat dissipation groove plate is guided by the diversion partition plates to flow along an "S"-shaped path. A communication port is opened on the end surface of the heat dissipation groove plate, and a circulating side suction port is opened on the side surface of the end of the heat dissipation block and is communicated with the communication port.

[0014] Preferably, four heat dissipation groove plates and four connecting pipes are provided, and are respectively located on the upper and lower sides at the four corners of the top sealing plate. The two ends of the heat dissipation groove plate are respectively fixedly connected to the side surfaces of the two ends of the heat dissipation block at the corresponding height positions.

[0015] Preferably, through cross-shaped slot holes adapted to the heat dissipation blocks are respectively formed through the middle parts of the adapter plate and the upper layer substrate. A convex block is fixedly connected to the middle of the surface of the bottom layer substrate, and an internal thread is formed in the middle of the convex block. A screw sleeve for a bolt to pass through is fixedly installed in the middle of the heat dissipation block located on the upper surface of the upper layer substrate, and the lower end of the bolt passes through the screw sleeve and is inserted and fixed to the convex block.

[0016] Preferably, the upper layer substrate and the adapter plate have the same size, and there are gaps between them and the inner wall of the encapsulation outer frame. A flange outer frame is fixedly connected to the edge of the upper layer substrate. The flange outer frame is made of a hard non-metallic heat-conducting material, and the heat dissipation groove plate is attached to the upper surface of the flange outer frame.

[0017] Preferably, the flip chip is inverted and buckled on the upper surface of the bottom layer substrate and is electrically connected thereto. Pins are provided on the surfaces of the front-mounted chip and the small chip. The front-mounted chip is electrically connected to the bottom layer substrate, and the small chip is electrically connected to the upper layer substrate.

[0018] Compared with the prior art, the beneficial effects of the present invention are:

[0019] In the present invention, a heat dissipation component is provided between a bottom substrate and a top sealing plate. The heat dissipation component is composed of a plurality of heat dissipation blocks stacked up and down. The heat dissipation blocks are in a "cross" shape structure, and an air vent groove is opened in the middle. An air suction port is opened at the end of the heat dissipation block. An air suction filter plate corresponding to the air suction port is arranged on the side surface of the packaging outer frame. A radiator housing is installed on the upper surface of the top sealing plate. A heat dissipation fan blade is built in the radiator housing. When it works, air can be sucked into the air vent groove from the outside of the packaging outer frame, and finally pass through the inner cavity of the radiator housing and be discharged to the outside. The air can flow inside the packaging outer frame, thereby improving the heat dissipation effect on each chip. This device can make better use of space, increase components, and improve heat dissipation capacity and electrical performance. Description of the Drawings

[0020] Figure 1 is a schematic cross-sectional view of the overall structure of the present invention;

[0021] Figure 2 is a schematic three-dimensional view of the overall structure of the present invention;

[0022] Figure 3 is an exploded schematic view of the overall structure of the present invention;

[0023] Figure 4 is a schematic three-dimensional view of the structure of the radiator housing of the present invention;

[0024] Figure 5 is a separated schematic view of the structures of the top sealing plate and the heat dissipation groove plate of the present invention;

[0025] Figure 6 is an exploded schematic view of the structure of the heat dissipation component of the present invention;

[0026] Figure 7 is a schematic three-dimensional view of the structure of the adapter board of the present invention.

[0027] In the figure: 1, bottom substrate; 2, top sealing plate; 21, porous filter plate; 22, connecting pipe; 3, adapter board; 31, cross slot hole; 4, upper substrate; 41, flange outer frame; 5, flip chip; 6, face-up chip; 7, small chip; 8, heat dissipation component; 81, heat dissipation block; 82, air vent groove; 83, air suction port; 84, circulating side suction port; 9, radiator housing; 91, heat dissipation fan blade; 92, radiator cover; 93, exhaust pipe; 94, main exhaust hole; 95, auxiliary exhaust groove; 10, heat dissipation groove plate; 101, guide partition; 102, communication port; 11, packaging outer frame; 111, air suction filter plate. Detailed Embodiments

[0028] In order to clearly and completely describe the purpose, technical solution of the present invention, and make the advantages more clear, the following further details the embodiments of the present invention with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present invention, rather than all of the embodiments, and are only used to explain the embodiments of the present invention, not to limit the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

[0029] Embodiment 1, please refer to Figures 1-7 , the present invention provides a technical solution: a three-dimensional chip packaging structure, the three-dimensional chip packaging structure includes: a bottom substrate 1, a heat dissipation member 8 and a radiator housing 9.

[0030] A top cover plate 2 is arranged above the bottom substrate 1, and a packaging outer frame 11 is fixedly connected between the top cover plate 2 and the bottom substrate 1. The bottom substrate 1, the top cover plate 2 and the packaging outer frame 11 form a hollow structure for installing a plurality of chips. A transfer board 3 and an upper substrate 4 are sequentially arranged in the inner cavity of the packaging outer frame 11 from bottom to top. The upper surface of the bottom substrate 1, the upper surface of the transfer board 3 and the upper surface of the upper substrate 4 are respectively provided with a flip chip 5, a front-mounted chip 6 and a small chip 7. The surface of the flip chip 5 is provided with bumps for electrical connection and is buckled upside down on the surface of the bottom substrate 1. The surfaces of the front-mounted chip 6 and the small chip 7 are provided with pins;

[0031] Secondly, the heat dissipation member 8 is located in the middle between the bottom substrate 1 and the top cover plate 2. The heat dissipation member 8 is composed of a plurality of heat dissipation blocks 81 stacked up and down. Combining Figure 6 and Figure 7 as shown, the heat dissipation block 81 has a "cross" structure, and a ventilation groove 82 is formed through the middle. The ventilation grooves 82 on the plurality of heat dissipation blocks 81 are kept in a mutually connected state in the up and down direction. In this embodiment, the number of heat dissipation blocks 81 is set to three layers, mainly used to correspond to the flip chip 5, the front-mounted chip 6 and the small chip 7 respectively, and can exchange heat at the side edges of the flip chip 5, the front-mounted chip 6 and the small chip 7 to reduce the temperature of the chip surface and ensure that the chip can fully exert its own performance. An air inlet 83 is opened at the end of the heat dissipation block 81, and an air inlet filter plate 111 corresponding to the air inlet 83 is arranged on the side surface of the packaging outer frame 11. As Figure 6 and Figure 2 shown, external air can pass through the air inlet filter plate 111 and enter the inner cavity of the ventilation groove 82 to realize air cooling of the heat dissipation block 81;

[0032] In addition, the radiator housing 9 is installed on the surface of the top cover plate 2 and is communicated with the inner cavity of the heat dissipation member 8. A heat dissipation fan blade 91 is rotatably installed in the inner cavity of the radiator housing 9. The outer side of the radiator housing 9 is communicated with an exhaust pipe 93. The heat dissipation fan blade 91 is driven by a motor to rotate. The blades of the heat dissipation fan blade 91 are inclined. When rotating, it can absorb the air in the ventilation groove 82 and discharge it to the outside through the exhaust pipe 93. Therefore, the air flow path of this device is: from the outside of the encapsulation outer frame 11 through the air intake filter plate 111 into the inner cavity of the ventilation groove 82, then through the top cover plate 2 into the inner cavity of the radiator housing 9 and into the exhaust pipe 93, and finally discharged from the end of the exhaust pipe 93, so as to be able to dissipate heat from the heat dissipation block 81 in real time and ensure that the heat dissipation block 81 can exchange heat and dissipate heat from each chip inside the encapsulation outer frame 11 in time.

[0033] In order to discharge the air in the inner cavity of the exhaust pipe 93, the present application also has a radiator cover 92 fixedly connected to the upper side of the radiator housing 9. A main exhaust hole 94 is opened on the end face of the exhaust pipe 93, and a secondary exhaust groove 95 is opened on the side wall of the end of the exhaust pipe 93. Both the main exhaust hole 94 and the secondary exhaust groove 95 can be used to discharge the air in the inner cavity of the exhaust pipe 93.

[0034] In order to discharge the air in time, four exhaust pipes 93 are provided in the present application and are distributed in a circular array around the radiator housing 9. The axis of the exhaust pipe 93 is tangent to the inner wall of the radiator housing 9. As Figure 4 shown, when the heat dissipation fan blade 91 rotates, the air in the inner cavity of the radiator housing 9 can be quickly thrown into the inner cavity of the exhaust pipe 93 under the action of centrifugal force and thus quickly discharged.

[0035] In order to communicate the radiator housing 9 with the inner cavity of the ventilation groove 82, the present application also has a porous filter plate 21 provided in the middle of the surface of the top cover plate 2. The porous filter plate 21 communicates the inner cavity of the radiator housing 9 and the inner cavity of the ventilation groove 82 to ensure that the heat dissipation fan blade 91 can extract the air in the inner cavity of the ventilation groove 82 when rotating. A heat dissipation groove plate 10 is installed at the edge of the lower surface of the top cover plate 2. A communication pipe 22 is fixedly connected to the surface of the top cover plate 2. The communication pipe 22 communicates the inner cavity of the heat dissipation groove plate 10 and the secondary exhaust groove 95. As Figure 5 shown, the air discharged from the secondary exhaust groove 95 can pass through the communication pipe 22 and enter the inner cavity of the heat dissipation groove plate 10, which is used to form a circulating air flow inside the encapsulation outer frame 11 and increase the heat dissipation area of the upper substrate 4.

[0036] In order to communicate the heat dissipation groove plate 10 with the inner cavity of the ventilation groove 82, the present application also has a plurality of flow guiding partitions 101 fixedly connected to the inner wall of the heat dissipation groove plate 10 at equal intervals, and adjacent two flow guiding partitions 101 are mutually displaced. The air in the inner cavity of the heat dissipation groove plate 10 is guided by the flow guiding partitions 101 to flow in an "S" - shaped path. As Figure 5As shown, after the connecting pipe 22 sends air into the inner cavity of the heat dissipation slot plate 10, it will be guided by the diversion partition 101, so as to flow along a longer path in the inner cavity of the heat dissipation slot plate 10. A communication port 102 is opened on the end face of the heat dissipation slot plate 10, and a circulating side suction port 84 is opened on the end side of the heat dissipation block 81 and is kept in communication with the communication port 102. When the air in the inner cavity of the heat dissipation slot plate 10 flows to the end of the heat dissipation slot plate 10, the air can pass through the communication port 102 and the circulating side suction port 84 and enter the end of the heat dissipation block 81. Due to the negative pressure state in the inner cavity of the ventilation slot 82 affected by the rotation of the heat dissipation fan blade 91, the end of the heat dissipation block 81 can not only absorb air from the outside, but also suck the air in the inner cavity of the heat dissipation slot plate 10. On the basis of ensuring the air circulation inside the packaging outer frame 11, it can also absorb fresh air from the outside, thus avoiding the over-high temperature of the circulating air.

[0037] To improve the heat dissipation effect, four heat dissipation slot plates 10 and four connecting pipes 22 are provided in this application, and they are respectively located on the upper and lower sides at the four corners of the top sealing plate 2. The two ends of the heat dissipation slot plate 10 are respectively fixedly connected to the two end sides of the heat dissipation block 81 at the corresponding height positions, as Figure 5 shown. The four connecting pipes 22 respectively correspond to the four exhaust pipes 93. The four heat dissipation slot plates 10 can exchange heat with the heat inside the packaging outer frame 11 to the greatest extent, so as to improve the heat dissipation effect of this device.

[0038] To press the heat dissipation block 81, cross slot holes 31 adapted to the heat dissipation block 81 are respectively penetrated through the middle parts of the adapter plate 3 and the upper layer substrate 4 in this application, so as to ensure that the multiple heat dissipation blocks 81 can be kept in a tightly fitting state. A convex block is fixedly connected to the middle part of the surface of the bottom layer substrate 1, and an internal thread is opened in the middle of the convex block. A screw sleeve for the bolt to pass through is fixedly installed in the middle of the heat dissipation block 81 located on the upper surface of the upper layer substrate 4. The lower end of the bolt passes through the screw sleeve and is inserted and fixed to the convex block. This device can press the heat dissipation block 81 through the bolt, avoiding the air flowing in the inner cavity of the ventilation slot 82 from directly contacting the chips inside the packaging outer frame 11, thus avoiding the water vapor in the air adhering to the chip surface and causing chip damage.

[0039] To exchange heat with the upper layer substrate 4, the upper layer substrate 4 and the adapter plate 3 in this application have the same size, and there are gaps between them and the inner wall of the packaging outer frame 11. A flange outer frame 41 is fixedly connected to the edge of the upper layer substrate 4. The flange outer frame 41 is made of a hard non-metallic heat-conducting material. The heat dissipation slot plate 10 is attached to the upper surface of the flange outer frame 41. The heat dissipation slot plate 10 can exchange heat with the flange outer frame 41, so as to reduce the surface temperature of the upper layer substrate 4.

[0040] In order to install the flip - chip 5, the front - mounted chip 6, and the die 7, the flip - chip 5 of the present application is inverted and placed on the upper surface of the bottom substrate 1 and electrically connected thereto. Pins are provided on the surfaces of both the front - mounted chip 6 and the die 7. The front - mounted chip 6 is electrically connected to the bottom substrate 1, and the die 7 is electrically connected to the upper substrate 4, ensuring that the flip - chip 5, the front - mounted chip 6, and the die 7 can all operate normally.

[0041] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A three-dimensional chip packaging structure, characterized in that: The three-dimensional chip packaging structure includes: A bottom substrate (1), with a top cover plate (2) arranged above the bottom substrate (1). A packaging outer frame (11) is fixedly connected between the top cover plate (2) and the bottom substrate (1). In the inner cavity of the packaging outer frame (11), a transfer board (3) and an upper substrate (4) are arranged in sequence from bottom to top. A flip-chip (5), a front-mounted chip (6), and a small chip (7) are respectively arranged on the upper surface of the bottom substrate (1), the upper surface of the transfer board (3), and the upper surface of the upper substrate (4); A heat dissipation member (8), which is located in the middle between the bottom substrate (1) and the top cover plate (2). The heat dissipation member (8) is composed of a plurality of heat dissipation blocks (81) stacked up and down. The heat dissipation block (81) has a "cross" structure, and a ventilation groove (82) is penetrated in the middle. An air suction port (83) is opened at the end of the heat dissipation block (81). An air suction filter plate (111) corresponding to the air suction port (83) is arranged on the side surface of the packaging outer frame (11); A radiator housing (9), which is installed on the surface of the top cover plate (2) and communicated with the inner cavity of the heat dissipation member (8). A heat dissipation fan blade (91) is rotatably installed in the inner cavity of the radiator housing (9), and an exhaust pipe (93) is communicated with the outside of the radiator housing (9); Cross-shaped slot holes (31) adapted to the heat dissipation blocks (81) are penetrated in the middle of both the transfer board (3) and the upper substrate (4). A convex block is fixedly connected to the middle of the surface of the bottom substrate (1), and an internal thread is opened in the middle of the convex block. A bushing for the bolt to pass through is fixedly installed in the middle of the heat dissipation block (81) located on the upper surface of the upper substrate (4). The lower end of the bolt passes through the bushing and is inserted and fixed to the convex block.

2. The three-dimensional chip packaging structure according to claim 1, wherein: A radiator cover (92) is fixedly connected to the upper side of the radiator housing (9). A main exhaust hole (94) is opened at the end surface of the exhaust pipe (93), and a secondary exhaust groove (95) is opened on the side wall of the end of the exhaust pipe (93).

3. The three-dimensional chip packaging structure according to claim 2, wherein: Four exhaust pipes (93) are provided and distributed in a circular array around the radiator housing (9). The axis of the exhaust pipe (93) is tangent to the inner wall of the radiator housing (9).

4. The three-dimensional chip packaging structure according to claim 2, wherein: A porous filter plate (21) is arranged in the middle of the surface of the top cover plate (2). The porous filter plate (21) communicates the inner cavity of the radiator housing (9) and the inner cavity of the ventilation groove (82). A heat dissipation groove plate (10) is installed at the edge of the lower surface of the top cover plate (2). A communication pipe (22) is fixedly connected to the surface of the top cover plate (2). The communication pipe (22) communicates the inner cavity of the heat dissipation groove plate (10) and the secondary exhaust groove (95).

5. A three-dimensional chip packaging structure according to claim 4, characterized in that: A plurality of flow guide baffles (101) are fixedly connected to the inner wall of the heat dissipation slot plate (10) at equal intervals, and two adjacent flow guide baffles (101) are mutually offset. Air in the inner cavity of the heat dissipation slot plate (10) is guided by the flow guide baffles (101) to flow in an "S"-shaped path. A connecting port (102) is provided on the end surface of the heat dissipation slot plate (10), and a circulation side suction port (84) is provided on the side surface of the end of the heat dissipation block (81) and is kept in communication with the connecting port (102).

6. The three-dimensional chip packaging structure according to claim 5, wherein: Four heat dissipation slot plates (10) and connecting pipes (22) are provided and are respectively located at the upper and lower sides of the four corners of the top sealing plate (2), and the two ends of the heat dissipation slot plates (10) are respectively fixedly connected to the two end side surfaces of the heat dissipation block (81) at the corresponding height position.

7. A three-dimensional chip packaging structure according to claim 4, characterized in that: The upper substrate (4) and the adapter plate (3) have the same size and a gap is left between them and the inner wall of the packaging outer frame (11); a flange outer frame (41) is fixedly connected to the edge of the upper substrate (4); the flange outer frame (41) is made of a hard non-metallic heat-conducting material; and the heat dissipation slot plate (10) is attached to the upper surface of the flange outer frame (41).

8. A three-dimensional chip packaging structure according to claim 1, characterized in that: The flip chip (5) is inverted on the upper surface of the bottom substrate (1) and is electrically connected thereto; pins are provided on the surfaces of the upright chip (6) and the small chip (7); the upright chip (6) is electrically connected to the bottom substrate (1), and the small chip (7) is electrically connected to the upper substrate (4).

Images