Workpiece holding mechanism, workpiece processing device, and workpiece holding method

Abstract

The object of the present invention is to provide a workpiece holding mechanism that can hold a workpiece at a desired interval relative to the surface of the lower processing section. One aspect of the present invention relates to a workpiece holding mechanism (10) that holds a plate-shaped or sheet-shaped workpiece (P) on a lower processing section (2) at a distance from the surface (2c) of the lower processing section (2). The workpiece holding mechanism (10) includes: a frame (11) configured to at least partially surround the periphery of the workpiece (P) when viewed from above; a plurality of gripping parts (12) disposed in the frame (11) for gripping the periphery of the workpiece (P); a first sensor (13) capable of acquiring height information of each of the plurality of gripping parts (12); a calculation unit (14) that calculates the distance between each gripping part (12) and the lower processing section (2) based on the height information acquired by the first sensor (13); and a height adjustment unit (15) that adjusts the height of the plurality of gripping parts (12) from the lower processing section (2) based on the distance calculated by the calculation unit (14).

Description

Technical Field

[0001] This invention relates to a workpiece holding mechanism, a workpiece processing device, and a workpiece holding method. Background Technology

[0002] Known workpiece processing apparatuses include a punching apparatus for blanking plate-shaped or sheet-shaped workpieces and an electrical inspection apparatus for checking the electrical characteristics of the workpieces. These workpiece processing apparatuses position the workpiece at a predetermined position on a lower processing section, and then perform the desired processing on the workpiece. In these workpiece processing apparatuses, it is desirable to be able to easily hold the workpiece relative to the lower processing section at a desired interval, so that the desired processing can be performed on the workpiece.

[0003] Patent document 1 describes a high-speed CNC punching machine that can repeatedly perform punching and NC positioning of the workpiece by a punch while the die is held in a descending position with a small gap between the die and the lower mold.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2003-25284 Summary of the Invention

[0005] Patent Document 1 describes a technique in which a reference hole is made in the workpiece by means of a punch while the workpiece plate is elastically pressed against the upper surface of the mold plate by means of a release template.

[0006] However, according to the structure described in Patent Document 1, since the sheet to be processed is positioned by pressing through the template, a load is applied to the sheet to be processed, and it is not easy to adjust the overall height of the sheet to be processed.

[0007] The present invention is proposed based on the above situation. The object of the present invention is to provide a workpiece holding mechanism, a workpiece processing device and a workpiece holding method that can hold a workpiece at a desired interval relative to the surface of the lower processing section.

[0008] One aspect of the present invention relates to a workpiece holding mechanism that holds a plate-shaped or sheet-shaped workpiece on a lower processing section at a distance from the surface of the lower processing section. The workpiece holding mechanism comprises: a frame configured to at least partially surround the periphery of the workpiece when viewed from above; a plurality of gripping portions disposed in the frame for gripping the periphery of the workpiece; a first sensor capable of acquiring height information of each of the plurality of gripping portions; a calculation unit that calculates the distance between each of the gripping portions and the lower processing section based on the height information acquired by the first sensor; and a height adjustment unit that adjusts the height of the plurality of gripping portions from the lower processing section based on the distance calculated by the calculation unit. Attached Figure Description

[0009] Figure 1 This is a schematic perspective view showing the main parts of a workpiece holding mechanism and a workpiece processing apparatus having the workpiece holding mechanism according to an embodiment of the present invention.

[0010] Figure 2 It means Figure 1 A schematic front view of the workpiece holding mechanism.

[0011] Figure 3 It means to use Figure 1 A flowchart of the workpiece holding method of the workpiece holding mechanism.

[0012] Figure 4 It means Figure 3 A schematic front view of the process for measuring the vertical distance between the second sensor and the first sensor in a workpiece holding method.

[0013] Figure 5 It means Figure 3 A schematic front view of the process for measuring the vertical distance between the second sensor and the surface of the lower processing unit in a workpiece holding method.

[0014] Figure 6 It means Figure 3 A schematic front view of the process for obtaining height information of the holding part in a workpiece holding method.

[0015] Figure 7 It means having the same as Figure 1 A schematic perspective view of the main parts of a workpiece handling device involving different types of workpiece holding mechanisms.

[0016] Figure 8 It means to use Figure 7 A flowchart of the workpiece holding method of the workpiece holding mechanism.

[0017] Figure 9It means having the same as Figure 1 and Figure 7 A schematic perspective view of the main parts of a workpiece handling device involving different workpiece handling mechanisms and workpiece holding mechanisms.

[0018] Figure 10 yes Figure 1 , Figure 7 and Figure 9 A variation of the frame. Detailed Implementation

[0019] One aspect of the present invention relates to a workpiece holding mechanism that holds a plate-shaped or sheet-shaped workpiece on a lower processing section at a distance from the surface of the lower processing section. The workpiece holding mechanism comprises: a frame configured to at least partially surround the periphery of the workpiece when viewed from above; a plurality of gripping portions disposed in the frame for gripping the periphery of the workpiece; a first sensor capable of acquiring height information of each of the plurality of gripping portions; a calculation unit that calculates the distance between each of the gripping portions and the lower processing section based on the height information acquired by the first sensor; and a height adjustment unit that adjusts the height of the plurality of gripping portions from the lower processing section based on the distance calculated by the calculation unit.

[0020] The first sensor can be configured in the lower processing unit.

[0021] The workpiece holding mechanism may also have a second sensor that can detect the height position of the first sensor by using the surface of the lower processing section as a reference.

[0022] The frame may have a pair of arms facing each other across the workpiece, and the gripping portion extends retractably from the opposite side of the arms.

[0023] Each of the arms may be provided with a pair of gripping parts spaced apart.

[0024] The workpiece holding mechanism may also have a third sensor that can detect the amount of deflection of the workpiece.

[0025] The height adjustment unit can be configured to adjust the height of the frame as a whole or in parts.

[0026] Another aspect of the invention relates to a workpiece handling apparatus having the workpiece holding mechanism.

[0027] Another aspect of the present invention relates to a workpiece holding method that holds a plate-shaped or sheet-shaped workpiece on a lower processing section at a distance from the surface of the lower processing section. This workpiece holding method is performed using a workpiece holding mechanism comprising: a frame configured to at least partially surround the periphery of the workpiece when viewed from above; and a plurality of gripping portions disposed in the frame to grip the periphery of the workpiece. In the workpiece holding method, height information of each of the plurality of gripping portions is obtained; based on the obtained height information, the distance between each of the gripping portions and the lower processing section is calculated; and based on the calculated distance, the height of the plurality of gripping portions from the lower processing section is adjusted.

[0028] Furthermore, in this invention, there is no clear distinction between "plate-like" and "sheet-like," but a workpiece that does not substantially flex due to its own weight can be called "plate-like," while a workpiece that is flexible and flexes due to its own weight can be called "sheet-like." In this invention, "sheet-like" includes the concept of "film-like."

[0029] One aspect of the present invention relates to a workpiece holding mechanism that calculates the distance between the plurality of gripping parts and the lower processing part for each of the plurality of gripping parts by the calculation unit. Based on this, the height adjustment unit adjusts the height of the plurality of gripping parts from the lower processing part, thereby enabling the workpiece to be held easily at a desired interval relative to the surface of the lower processing part.

[0030] Hereinafter, embodiments of the present invention will be described in detail with appropriate reference to the accompanying drawings.

[0031] [First Implementation]

[0032] <Workpiece Processing Device>

[0033] Figure 1 The workpiece processing apparatus 1 has a lower processing section 2 and an upper processing section 3 opposite to the lower processing section 2, separated from the workpiece P. The lower processing section 2 has a main body 2a disposed below the workpiece P at a distance from it, and a base 2b supporting the main body 2a. The upper surface of the main body 2a is configured to be horizontal (in the XY plane). The upper surface of the main body 2a constitutes the surface 2c of the lower processing section 2. In addition, "upper," "lower," and "horizontal" refer to the "upper," "lower," and "horizontal" states of normal use of the workpiece processing apparatus, and are not intended to limit the structure of the workpiece processing apparatus 1.

[0034] Examples of workpiece processing apparatus 1 include a punching apparatus for blanking workpiece P and an electrical inspection apparatus for checking the electrical characteristics of workpiece P. When the workpiece processing apparatus 1 is a punching apparatus, a punch for opening holes is provided in the upper processing section 3. Furthermore, a hole for inserting the punch is provided in the lower processing section 2. On the other hand, when the workpiece processing apparatus 1 is an electrical inspection apparatus, multiple probes capable of contacting workpiece P are provided in both the upper processing section 3 and the lower processing section 2. Moreover, the specific structure of the lower processing section 2 can be designed corresponding to the type of workpiece processing apparatus 1. For example, the lower processing section 2 may only have the function of supporting workpiece P from below.

[0035] The workpiece processing apparatus 1 includes a workpiece holding mechanism 10, which holds a plate-shaped or sheet-shaped workpiece P on the lower processing section 2 at a distance from the surface 2c of the lower processing section 2. The workpiece holding mechanism 10 itself is one aspect of the present invention. Hereinafter, the workpiece holding mechanism 10 will be described in detail.

[0036] <Workpiece Holding Mechanism>

[0037] like Figure 1 and Figure 2 As shown, the workpiece holding mechanism 10 includes: a frame 11 configured to at least partially surround the periphery of the workpiece P when viewed from above; a plurality of gripping parts 12 disposed in the frame 11 to grip the periphery of the workpiece P; a first sensor 13 capable of acquiring height (Z-direction position) information of each of the gripping parts 12; a calculation unit 14 that calculates the distance (Z-direction distance) between each gripping part 12 and the lower processing unit 2 based on the height information acquired by the first sensor 13; and a height adjustment unit 15 that adjusts the height of the gripping parts 12 from the lower processing unit 2 based on the distance calculated by the calculation unit 14. Furthermore, the workpiece holding mechanism 10 includes a second sensor 16 capable of detecting the height position of the first sensor 13 using the surface 2c of the lower processing unit 2 as a reference. The workpiece holding mechanism 10 also includes a 2D movement mechanism 17 capable of moving the frame 11 in a horizontal plane (XY plane).

[0038] (Frame)

[0039] The frame 11 has a pair of arms 20 (first arm 20a and second arm 20b) facing each other across a workpiece P, and a connecting portion 21 connecting the first arm 20a and the second arm 20b. The first arm 20a and the second arm 20b are arranged in parallel. The first arm 20a, the second arm 20b, and the connecting portion 21 together form a U-shape when viewed from above. A holding portion 12 is provided on each of the first arm 20a and the second arm 20b. The first arm 20a and the second arm 20b can be configured to move in the length direction (X direction) of the connecting portion 21. The ability of the first arm 20a and the second arm 20b to move in the length direction of the connecting portion 21 makes it easy to adjust the spacing between the first arm 20a and the second arm 20b to accommodate the size of the workpiece P. In addition, according to this structure, tension is applied to the workpiece P in the length direction of the connecting portion 21, thereby easily suppressing the deflection of the workpiece P.

[0040] (Control Department)

[0041] The gripping part 12 is disposed above the lower processing part 2, separate from the lower processing part 2. The gripping part 12 protrudes retractably from the opposite sides of the first arm 20a and the second arm 20b. As described above, by configuring the gripping part 12 as retractable, tension can be applied relative to the workpiece P in the horizontal direction, and deflection of the workpiece P can be easily suppressed. In addition, by suppressing the deflection of the workpiece P, it is easy to arrange the workpiece P as a whole parallel to the surface 2c of the lower processing part 2. The extension direction of the gripping part 12 can be, for example, one direction relative to the pair of arms 20 (X direction). In addition, the gripping part 12 can be configured to be retractable in directions other than the X direction, such as the length direction (Y direction) of the pair of arms 20. By making the gripping part 12 retractable in directions other than the X direction, it is easy to apply tension relative to the workpiece P in the desired direction. In addition, the gripping part 12 can also be configured to be movable in the length direction of the pair of arms 20 so as to accommodate the size of the workpiece P.

[0042] The gripping part 12 has a fixed part 12a fixed to the arm 20 and a movable part 12b slidably disposed relative to the fixed part 12a. A claw 12c capable of gripping the workpiece P is provided at the front end of the movable part 12b (the front end of the arm 20 protruding from the opposite side). Furthermore, each gripping part 12 has a fixed part 12a and a movable part 12b, and the claw 12c is provided at the front end of the movable part 12b, thereby facilitating the application of tension to the workpiece P. On the other hand, according to this structure, if the protruding length of the movable part 12b from the fixed part 12a increases, the movable part 12b becomes more prone to flexing, and this flexing of the movable part 12b affects the height of the claw 12c. Regarding this, as will be described later, when the height of the claw 12c changes due to the deflection of the movable part 12b, the workpiece holding mechanism 10 can adjust the height of the holding part 12 in accordance with the changed height of the claw 12c, so that the workpiece P can be easily held at a desired interval relative to the surface 2c of the lower processing part 2.

[0043] A guide rail extending in the opposite direction (X direction) of the pair of arms 20 is provided in the fixed part 12a. The movable part 12b is slidably provided along the guide rail in the opposite direction of the pair of arms 20. The jaw 12c has an upper jaw that contacts the workpiece P from above and a lower jaw that contacts the workpiece P from below. The jaw 12c is configured, for example, to be able to hold the workpiece P by being driven by an actuator (not shown).

[0044] The workpiece holding mechanism 10 has a pair of gripping parts 12 arranged at intervals on the arm 20. This arrangement suppresses the deflection of the workpiece P and makes it easy to arrange the workpiece P parallel to the surface 2c of the lower processing part 2.

[0045] The spacing between the pair of gripping portions 12 provided on the first arm 20a and the spacing between the pair of gripping portions 12 provided on the second arm 20b are equal. Furthermore, the pair of gripping portions 12 provided on the first arm 20a and the pair of gripping portions 12 provided on the second arm 20b are opposite each other in the extension direction (X direction). Thus, the workpiece holding mechanism 10 is configured to grip the four corners of the workpiece P using the four gripping portions 12.

[0046] (Sensor 1)

[0047] The first sensor 13 is disposed on the lower processing unit 2. By being disposed as described above, the first sensor 13 can easily acquire height information of the lower surfaces of the plurality of gripping portions 12, with the lower processing unit 2 as a reference. The height of the workpiece P being gripped by the gripping portions 12 is highly correlated with the height of the lower surface of the gripping portion 12; therefore, by acquiring the height information of the lower surface of the gripping portion 12, the workpiece P can be easily held relative to the surface 2c of the lower processing unit 2 at a desired interval.

[0048] The number of first sensors 13 in the workpiece holding mechanism 10 is not particularly limited; for example, multiple first sensors 13 can be provided in such a way that they correspond one-to-one with the number of gripping parts 12. However, the workpiece holding mechanism 10 preferably has only one first sensor 13. In other words, the workpiece holding mechanism 10 is preferably configured to obtain height information of multiple gripping parts 12 through a single first sensor 13. To explain in more detail, the workpiece holding mechanism 10 is preferably configured to use a 2D moving mechanism 17 to move multiple gripping parts 12 above a single first sensor 13, and obtain height information of each gripping part 12 through the first sensor 13. By configuring it in the above manner, height errors between multiple gripping parts 12 can be suppressed, and the overall cost of the device can be reduced.

[0049] The type of the first sensor 13 is not particularly limited; for example, contact sensors and non-contact sensors can be cited. Among them, a contact sensor is preferred as the first sensor 13. The first sensor 13 is a contact sensor, which allows for easy and high-precision acquisition of the height information of multiple gripping parts 12. For example, a 2D moving mechanism 17 can be used to move the gripping part 12, more specifically, the claw 12c of the gripping part 12, above the detection part of the first sensor 13. Based on this, the gripping part 12 can be continuously lowered to obtain the height information of the lower surface of the claw 12c (the contact surface with the first sensor 13) at the moment when the claw 12c contacts the detection part.

[0050] When the first sensor 13 is a contact sensor, the detection section of the first sensor 13 preferably protrudes upwards compared to the surface 2c of the lower processing section 2. Furthermore, the detection section is preferably configured to move back and forth between a first position upwards compared to the surface 2c of the lower processing section 2 and a second position downwards compared to the first position.

[0051] (Computer Department)

[0052] The computing unit 14 includes an arithmetic processing unit such as a CPU (Central Processing Unit) and a storage unit such as a semiconductor memory or a fixed disk for temporarily or permanently storing various information. In this embodiment, the computing unit 14 is configured to calculate the vertical distance between the lower processing unit 2 and the fixing unit 12a at the moment when the claw 12c contacts the first sensor 13 when the gripping unit 12 descends toward the first sensor 13, based on the position information in the XYZ coordinate system.

[0053] The workpiece holding mechanism 10 is configured as described above to acquire the height information of the claw 12c via the first sensor 13. Therefore, the calculation unit 14 can calculate the change in the height of the claw 12c relative to the fixed part 12a based on the deflection of the movable part 12b by subtracting the height of the claw 12c from the vertical distance of the fixed part 12a. As a result, by also taking this change into account, the height positions of the plurality of gripping parts 12 can be appropriately adjusted using the height adjustment unit 15, which will be described later.

[0054] (Height Adjustment Department)

[0055] The height adjustment unit 15 is configured to adjust the height of the frame 11 either entirely or partially. The height adjustment unit 15 includes: a first moving unit 15a, which is connected to the frame 11 and the 2D moving mechanism 17 to enable the frame 11 to move in the vertical direction; and a control unit 15b, which controls the movement of the first moving unit 15a, etc. The control unit 15b can be integrally formed with the aforementioned calculation unit 14. By utilizing the height adjustment unit 15 to adjust the height of the frame 11 entirely or partially, the workpiece holding mechanism 10 can easily optimize the vertical distance between the surface 2c of the lower processing unit 2 and the plurality of holding parts 12.

[0056] The first moving unit 15a is configured to connect to the connecting part 21 of the frame 11 and the 2D moving mechanism 17, enabling the frame 11 to move relative to the 2D moving mechanism 17 in the vertical direction. The specific structure of the first moving unit 15a is not particularly limited; for example, it can be configured to have a guide rail and a slider that moves along the guide rail by rotating a ball screw (the specific structure of the first moving unit 15a is not shown).

[0057] The control unit 15b adjusts the height of the frame 11 based on the distance between each gripping part 12 and the lower processing part 2, calculated by the calculation unit 14. The control unit 15b controls the height of the frame 11 numerically to ensure that the distance between the multiple gripping parts 12 from the surface 2c of the lower processing part 2 is appropriate. The control unit 15b can adjust the height of the multiple gripping parts 12 by controlling only the movement of the first moving unit 15a. In this case, the control unit 15b can, for example, control the distance between the gripping part 12 with the smallest distance from the lower processing part 2 and the surface 2c of the lower processing part 2. Furthermore, the control unit 15b can, for example, control the protrusion length of the movable part 12b of the gripping part 12, thereby adjusting the deflection of the movable part 12b, and thus adjusting the gripping height of the workpiece P for each gripping part 12. Furthermore, the control unit 15b can be configured to control the height and tilt of the first arm 20a and the second arm 20b, or it can be configured to control the tilt of the entire frame 11.

[0058] (Second sensor)

[0059] The second sensor 16 is disposed on the frame 11. More specifically, the second sensor 16 is disposed on the connection portion 21 of the frame 11. The second sensor 16 is a non-contact sensor. Examples of the second sensor 16 include distance sensors such as laser distance sensors and ultrasonic distance sensors. The second sensor 16 is configured to detect, for example, the distance between the frame 11 and the detection portion of the first sensor 13, and the distance between the frame 11 and the surface 2c of the lower processing portion 2.

[0060] As described above, the second sensor 16 can detect the height position of the first sensor 13, which uses the surface 2c of the lower processing section 2 as a reference. Specifically, the second sensor 16 is configured to measure the vertical distance between the upper end portion 13a of the detection portion of the first sensor 13 and the vertical distance between the second sensor 16 and the surface 2c of the lower processing section 2, while keeping the height position of the frame 11 constant. By subtracting the vertical distance between the second sensor 16 and the upper end portion 13a of the first sensor 13 from the vertical distance between the second sensor 16 and the surface 2c of the lower processing section 2, the height position of the first sensor 13, which uses the surface 2c of the lower processing section 2 as a reference, and more specifically, the protrusion distance of the upper end portion 13a of the detection portion of the first sensor 13, is detected. The workpiece holding mechanism 10 has the second sensor 16, which allows it to be used as a contact sensor, similar to the first sensor 13, and facilitates easy adjustment of the height of the multiple holding portions 12.

[0061] (2D moving mechanism)

[0062] As a 2D movement mechanism 17, for example, a movement mechanism that allows free movement in two orthogonal axes (X and Y directions) in the horizontal plane can be used. The 2D movement mechanism 17 is configured to control the position of the frame 11 in the horizontal plane via numerical control.

[0063] <Workpiece Holding Method>

[0064] Next, refer to Figures 3 to 6 For those who used Figure 1 and Figure 2 The workpiece holding mechanism 10 and its workpiece holding method will be described.

[0065] This workpiece holding method holds a plate-shaped or sheet-shaped workpiece P on the lower processing section 2 at a distance from the surface 2c of the lower processing section 2. This workpiece holding method is performed using a workpiece holding mechanism 10, which has: a frame 11 configured to at least partially surround the periphery of the workpiece P when viewed from above; and a plurality of gripping portions 12 disposed in the frame 11 to grip the periphery of the workpiece P. Figure 3 As shown, the workpiece holding method derives the protrusion distance of the first sensor 13 from the lower processing unit 2 (S1), obtains the height information of the gripping part 12 (S2), calculates the distance between the gripping part 12 and the lower processing unit 2 (S3), and adjusts the height of the gripping part 12 (S4).

[0066] (S1)

[0067] In S1, using the second sensor 16, the protrusion distance of the upper end portion 13a of the detection section of the first sensor 13 from the surface 2c of the lower processing section 2 is determined. In S1, firstly as follows... Figure 4 As shown, with the height of the frame 11 fixed, the frame 11 is moved horizontally so that the upper end portion 13a of the detection section of the second sensor 16 and the first sensor 13 are vertically aligned. Then, in this state, the vertical distance A between the second sensor 16 and the upper end portion 13a of the detection section of the first sensor 13 is measured by the second sensor 16.

[0068] Next, in S1, as Figure 5 As shown, with the height of the frame 11 fixed, the frame 11 is moved horizontally so that the second sensor 16 is vertically aligned with the surface 2c of the lower processing unit 2. Then, in this state, the vertical distance B between the second sensor 16 and the surface 2c of the lower processing unit 2 is measured using the second sensor 16.

[0069] Next, in S1, the vertical distance A is subtracted from the vertical distance B, thereby deriving the protrusion distance C of the upper end portion 13a of the detection section of the first sensor 13 from the surface 2c of the lower processing section 2. The protrusion distance C can be derived, for example, by the calculation unit 14.

[0070] (S2)

[0071] In S2, the height information of each of the multiple gripping parts 12 is obtained. In this embodiment, in S2, the height information of the lower surface of the claw 12c of each gripping part 12 is obtained. In S2, as... Figure 6 As shown, the claw 12c is moved to above the first sensor 13, and then the claw 12c is continuously lowered to obtain the height information of the lower surface (contact surface with the first sensor 13) of the claw 12c at the moment when the claw 12c comes into contact with the detection part of the first sensor 13.

[0072] (S3)

[0073] In S3, based on the height information obtained in S2, the distance between each gripping part 12 and the lower processing part 2 is calculated. More specifically, in S3, the vertical distance D of the fixing part 12a, with the lower processing part 2 as a reference, is obtained at the moment when the claw 12c contacts the first sensor 13 in S2. i (i = 1 to 4). In S3, for example, the vertical distance D can be calculated by obtaining the height position of the fixed part 12a according to the XYZ coordinate system. i .

[0074] (S4)

[0075] In S4, based on the distance calculated in S3 (vertical distance D) i The height of the multiple gripping parts 12 from the lower processing part 2 is adjusted. In S4, firstly, the height is adjusted from the vertical distance D. i The absolute value of the protrusion distance C obtained in S1 is subtracted, and the height position of the lower surface of the claw 12c when it contacts the surface 2c of the lower processing part 2 is calculated. Then, in S4, the height of the frame 11 is adjusted by CNC so that the interval between the lower surface of the claw 12c of the plurality of gripping parts 12 and the surface 2c of the lower processing part 2 becomes the desired interval.

[0076] <Advantages>

[0077] The workpiece holding mechanism 10 calculates the distance between the multiple holding parts 12 and the lower processing part 2 through the calculation unit 14. Based on this, the height of the multiple holding parts 12 from the lower processing part 2 is adjusted by the height adjustment unit 15. Therefore, the workpiece P can be easily held at a desired interval relative to the surface 2c of the lower processing part 2.

[0078] The workpiece holding mechanism 10 can control the height of the holding part 12 by using the lower surface of the claw 12c of each holding part 12 as a reference, thus making it easier to hold the workpiece P as a whole relative to the surface 2c of the lower processing part 2 at a desired interval.

[0079] The workpiece processing apparatus 1 has the workpiece holding mechanism 10, so it can easily hold the workpiece P as a whole at a desired interval relative to the surface 2c of the lower processing section 2.

[0080] This workpiece holding method calculates the distance between each of the multiple holding parts 12 and the lower processing part 2. Based on this, the height of the multiple holding parts 12 from the lower processing part 2 is adjusted. Therefore, the workpiece P can be easily held at a desired interval relative to the surface 2c of the lower processing part 2.

[0081] [Second Implementation]

[0082] <Workpiece handling device and workpiece holding mechanism>

[0083] Figure 7 The workpiece processing apparatus 31 has a lower processing section 2 and an upper processing section 3 opposite to the lower processing section 2, separated by a workpiece P. Furthermore, the workpiece processing apparatus 31 has a workpiece holding mechanism 30, which holds the plate-shaped or sheet-shaped workpiece P on the lower processing section 2 at a distance from the surface 2c of the lower processing section 2. In this workpiece processing apparatus 31, a flexible sheet-shaped workpiece P is preferably used. The workpiece holding mechanism 30 has a third sensor 32 capable of detecting the amount of deflection of the workpiece P. In addition to the third sensor 32, the workpiece holding mechanism 30 has... Figure 1 and Figure 2 The workpiece holding mechanism 10 has the same structure. Therefore, only the third sensor 32 will be described below.

[0084] (Third sensor)

[0085] The third sensor 32 is positioned above the workpiece P. The third sensor 32 is a non-contact sensor. Examples of distance sensors for the third sensor 32 include laser distance sensors and ultrasonic distance sensors. The third sensor 32 measures, for example, the vertical distance between itself and the workpiece P, and detects the amount of deflection of the workpiece P by subtracting the vertical distance of the workpiece P in its undeflected state from this vertical distance. Alternatively, the third sensor 32 can be configured to directly detect the amount of deflection of the workpiece P using light or ultrasonic waves reflected from it.

[0086] <Workpiece Holding Method>

[0087] Next, refer to Figure 8 The workpiece holding method using the workpiece holding mechanism 30 is described.

[0088] This workpiece holding method holds a plate-shaped or sheet-shaped workpiece P on the lower processing section 2 at a distance from the surface 2c of the lower processing section 2. The method involves detecting the deflection of the workpiece P (S11), adjusting the deflection of the workpiece P (S12), deriving the protrusion distance of the first sensor 13 from the lower processing section 2 (S13), obtaining the height information of the holding section 12 (S14), calculating the distance between the holding section 12 and the lower processing section 2 (S15), and adjusting the height of the holding section 12 (S16). In this workpiece holding method, steps S13 and thereafter can be adjusted by... Figure 3 The process is carried out in the same way as the workpiece holding method. Therefore, only S11 and S12 will be described below.

[0089] (S11)

[0090] In S11, the deflection of workpiece P is detected using the third sensor 32. For example, in S11, the frame 11 is moved by the 2D moving mechanism 17 so that the center portion of workpiece P, when viewed from above, is located below the third sensor 32. Then, in S11, the deflection of the center portion is detected.

[0091] (S12)

[0092] In S12, the movable part 12b of the gripping part 12 is moved in the horizontal direction so that the deflection detected in S11 is reduced.

[0093] <Advantages>

[0094] The workpiece holding mechanism 30 can detect the amount of deflection of the workpiece P using the third sensor 32. Therefore, by moving the movable part 12b of the holding part 12 in the horizontal direction based on the detection result, the tension applied to the workpiece P can be adjusted to reduce the amount of deflection of the workpiece P. As a result, the workpiece P can be held more parallel to the surface 2c of the lower processing part 2.

[0095] The workpiece processing apparatus 31 has the workpiece holding mechanism 30, so it can hold the workpiece P more parallel to the surface 2c of the lower processing section 2.

[0096] In S12, the movable part 12b of the holding part 12 moves horizontally so that the deflection detected in S11 is reduced, thereby enabling the workpiece P to be held more parallel to the surface 2c of the lower processing part 2.

[0097] [Third Implementation Method]

[0098] <Workpiece handling device and workpiece holding mechanism>

[0099] Figure 9 The workpiece processing apparatus 41 has a lower processing section 2 and an upper processing section 3 opposite to the lower processing section 2, separated from the workpiece P. Additionally, the workpiece processing apparatus 41 has a workpiece holding mechanism 40, which holds the plate-shaped or sheet-shaped workpiece P on the lower processing section 2 at a distance from the surface 2c of the lower processing section 2. The workpiece holding mechanism 40 has a second moving unit 45a capable of independently moving each gripping part 12 relative to the frame 11 in the vertical direction. The second moving unit 45a is connected to the frame 11 and the gripping parts 12. The second moving unit 45a is provided in a one-to-one correspondence with each gripping part 12. The second moving unit 45a is configured to be controllable by the control unit 15b. The specific structure of the second moving unit 45a is not particularly limited; for example, it can be configured as having a guide rail and a slider that moves along the guide rail by the rotation of a ball screw (the specific structure of the second moving unit 45a is not shown).

[0100] <Workpiece Holding Method>

[0101] After using Figure 9 In the workpiece holding method of the workpiece holding mechanism 40, the height of the multiple holding parts 12 is adjusted by controlling the second moving unit 45a so that the height of each holding part 12 from the lower processing part 2 is the same.

[0102] <Advantages>

[0103] The workpiece holding mechanism 40 has a second moving unit 45a that is arranged in a one-to-one correspondence with the gripping parts 12 and connected to each gripping part 12 and the frame 11. Therefore, the height of the multiple gripping parts 12 can be easily adjusted so that the height of the multiple gripping parts 12 from the lower processing part 2 is the same. As a result, the workpiece P can be easily and reliably held parallel to the surface 2c of the lower processing part 2.

[0104] The workpiece processing apparatus 41 has the workpiece holding mechanism 40, so it can easily and reliably hold the workpiece P parallel to the surface 2c of the lower processing section 2.

[0105] This workpiece holding method allows for easy adjustment of the height of the multiple holding parts 12 so that the height of the multiple holding parts 12 from the lower processing part 2 is the same. Therefore, the workpiece P can be held parallel to the surface 2c of the lower processing part 2 easily and reliably.

[0106] [Fourth Implementation Method]

[0107] <Examples of variations of the frame>

[0108] Reference Figure 10 right Figure 1 , Figure 7 and Figure 9 The following is an example of a variation of frame 11. Figure 10 The frame 51 can replace Figure 1 , Figure 7 and Figure 9 The frame 51 is used with a frame 11. The frame 51 has a pair of arms 52 (first arm 52a and second arm 52b) facing each other across a workpiece P, and a pair of connecting portions 53 (first connecting portion 53a and second connecting portion 53b) connecting the first arm 52a and the second arm 52b. The first connecting portion 53a connects the ends of one side of the pair of arms 52 to each other. The second connecting portion 53b connects the ends of the other side of the pair of arms 52 to each other. The frame 51 has... Figure 1 , Figure 7 and Figure 9 The frame 51 has a structure in which the free ends of a pair of arms 20 are connected to each other by a second connecting portion 53b. The pair of arms 52 and the pair of connecting portions 53, when viewed as a whole, are ring-shaped in plan view, or more specifically, square ring-shaped in plan view. The frame 51's rigidity is improved by connecting the pair of arms 52 to each other by the second connecting portion 53b. Furthermore, the frame 51 has the second connecting portion 53b, thereby connecting with... Figure 1 , Figure 7 and Figure 9 The weight may increase compared to the frame 11. Therefore, regarding the second connecting part 53b, it is preferable to suppress the increase in weight by reducing its volume compared to the first connecting part 53a.

[0109] [Other Implementation Methods]

[0110] The embodiments described do not limit the structure of the present invention. Therefore, the embodiments may omit, substitute, or add structural elements of each part of the embodiments based on the description in this specification and common technical knowledge, and these should all be interpreted as falling within the scope of the present invention.

[0111] The structures described in each embodiment can be used in any combination. For example, they can also be used in... Figure 1 and Figure 2 The workpiece processing device 1 and the workpiece holding mechanism 10 are configured Figure 7 The third sensor, 32.

[0112] In the described embodiment, a structure is explained that adjusts the height of the gripping part to correspond to the changed height of the claw when the height of the claw changes due to the deflection of the movable part of the gripping part. On the other hand, this workpiece holding mechanism can also be used to adjust the height of multiple gripping parts when their heights differ due to factors such as the tilt of the frame. For example, in S2 described above, the workpiece holding mechanism continuously lowers the frame from a predetermined position, calculates the vertical movement distance of the claw until its lower surface contacts the first sensor for each gripping part, and adjusts the height of multiple gripping parts taking into account the difference in this movement distance. This allows for correction of height differences among multiple gripping parts caused by factors such as the tilt of the frame. Furthermore, if the movable part does not deflect, or if the deflection of the movable part can be ignored, then in S2 described above, the portion of the gripping part other than the claw (e.g., the fixed part) can also contact the first sensor.

[0113] Furthermore, the workpiece holding mechanism can use a distance sensor such as a laser distance sensor or an ultrasonic distance sensor as the first sensor. Using the height information of each gripping part (the vertical distance between the first sensor and each gripping part) obtained by the first sensor, the height difference between the multiple gripping parts is calculated, and the height of the multiple gripping parts is adjusted to eliminate the difference. Alternatively, a reference position of the frame can be predetermined, and the height position of each gripping part can be adjusted to be close to the vertical distance between this reference position and the lower processing unit.

[0114] In this workpiece holding mechanism, from the viewpoint of obtaining height information of the lower surface of the gripping part, it is preferable that the first sensor is disposed in the lower processing part. However, if it is sufficient to detect the height difference between the multiple gripping parts, the first sensor may also be disposed in a location other than the lower processing part.

[0115] For the workpiece holding mechanism, if the protrusion distance of the first sensor from the lower processing section is known, a structure without a second sensor can also be adopted.

[0116] In this workpiece holding mechanism, the specific structure for holding the workpiece is not particularly limited. For example, the holding part may not be configured such that the movable part can slide relative to the fixed part. In this case, the height adjustment part may not need to adjust for height changes caused by the deflection of the movable part.

[0117] The number and arrangement of the gripping parts configured in the frame can be set in accordance with the shape of the workpiece.

[0118] Industrial applicability

[0119] As described above, one aspect of the present invention relates to a workpiece holding mechanism adapted to hold a workpiece at a desired interval relative to the surface of the lower processing section.

[0120] Explanation of the label

[0121] 1, 31, 41 Workpiece processing device

[0122] 2. Lower processing section

[0123] 2a Main body

[0124] 2b base

[0125] 2c surface

[0126] 3. Upper processing section

[0127] 10, 30, 40 workpiece holding mechanism

[0128] 11, 51 frame

[0129] 12 Controlling Department

[0130] 12a Fixing part

[0131] 12b Movable part

[0132] 12c claw

[0133] 13 First Sensor

[0134] 13a Upper end

[0135] 14. Computing Department

[0136] 15 Height Adjustment Section

[0137] 15a First Moving Unit

[0138] 15b control unit

[0139] 16. Second sensor

[0140] 17 2D mobile mechanism

[0141] 20, 52 arms

[0142] 20a, 52a, first arm

[0143] 20b, 52b, second arm

[0144] 21, 53 connecting parts

[0145] 32 Third sensor

[0146] 45a Second Moving Unit

[0147] 53a First connecting part

[0148] 53b Second Connecting Part

[0149] The vertical distance between the upper ends of the detection sections of the second and first sensors A

[0150] The vertical distance between the second sensor and the surface of the lower processing unit.

[0151] The upper end of the detection section of sensor C has a protrusion that rises from the surface of the lower processing section.

[0152] Out of distance

[0153] D i The lower processing section is fixed at the time point when the claw contacts the first sensor.

[0154] Vertical distance based on

[0155] P workpiece

Claims

1. A workpiece holding mechanism that holds a plate-shaped or sheet-shaped workpiece on a lower processing section at a distance from the surface of the lower processing section. The workpiece holding mechanism has the following features: A frame, configured to at least partially surround the periphery of the workpiece when viewed from above; Multiple gripping parts are disposed in the frame to grip the periphery of the workpiece; The first sensor is capable of acquiring the height information of each of the plurality of gripping parts; The calculation unit calculates the distance between each of the gripping parts and the lower processing unit based on the height information obtained from the first sensor; and The height adjustment unit adjusts the height of the plurality of gripping units from the lower processing unit based on the distance calculated by the calculation unit.

2. The workpiece holding mechanism according to claim 1, wherein, The first sensor is a contact sensor.

3. The workpiece holding mechanism according to claim 1 or 2, wherein, The first sensor is disposed in the lower processing unit.

4. The workpiece holding mechanism according to claim 3, wherein, It also has a second sensor that can detect the height position of the first sensor by using the surface of the lower processing unit as a reference.

5. The workpiece holding mechanism according to claim 1 or 2, wherein, The frame has a pair of arms that are opposite each other and separated from the workpiece. The gripping part extends retractably from the opposite side of the arm.

6. The workpiece holding mechanism according to claim 5, wherein, Each of the arms is provided with a pair of gripping parts spaced apart.

7. The workpiece holding mechanism according to claim 1 or 2, wherein, It also has a third sensor that can detect the amount of deflection of the workpiece.

8. The workpiece holding mechanism according to claim 1 or 2, wherein, The height adjustment unit is configured to adjust the height of the frame either as a whole or partially.

9. A workpiece processing apparatus, comprising: The workpiece holding mechanism according to any one of claims 1 to 8.

10. A workpiece holding method, wherein a plate-shaped or sheet-shaped workpiece is held on a lower processing section at a distance from the surface of the lower processing section. The workpiece holding method utilizes a workpiece holding mechanism comprising: a frame configured to at least partially surround the periphery of the workpiece when viewed from above; and a plurality of gripping portions disposed within the frame for gripping the periphery of the workpiece. In the workpiece holding method, Obtain the height information of each of the multiple gripping parts. Based on the obtained height information, the distance between each of the gripping parts and the lower processing unit is calculated. Based on the calculated distance, the height of the plurality of gripping parts from the lower processing part is adjusted.

Images