一种晶圆上下料设备及控制方法
By combining the lateral extension of the heat sink detection device and the wafer-level aging test device with the clamping and adsorption of the adsorption mechanism, the problem of cumbersome wafer loading steps and large equipment size is solved, achieving the effect of simplified loading and improved stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- STELIGHT INSTR CO LTD
- Filing Date
- 2024-04-18
- Publication Date
- 2026-07-17
AI Technical Summary
Existing technologies involve cumbersome wafer loading steps and bulky loading equipment. Directly clamping wafers can easily lead to bending, deformation, or breakage. Traditional portable wafer jigs present challenges in handling large-size wafers, resulting in reduced accuracy and difficulty.
The mounting platform of the heat sink detection device and the pressure-bearing platform of the wafer-level aging test device extend laterally, and together with the movement of the adsorption mechanism, the heat sink is clamped and adsorbed by the adsorption mechanism, which simplifies the feeding steps, shortens the conveying distance, and improves stability.
It simplifies the wafer loading and unloading process and makes the equipment more compact, avoiding wafers from falling, curling or being damaged during handling, and improving handling stability.
Smart Images
Figure CN118387607B_ABST