Ceramic packaging structure for pulse igniter and preparation method thereof

Abstract

This invention provides a ceramic packaging structure and preparation method for a pulse igniter, belonging to the field of chip technology. The ceramic packaging structure for the pulse igniter includes an outer shell and a first ceramic shell, a second ceramic shell, and a third ceramic shell disposed inside the outer shell. The first ceramic shell, the second ceramic shell, and the third ceramic shell are connected sequentially from bottom to top. The third ceramic shell is perpendicular to the second ceramic shell. The top of the outer shell is provided with a discharge port, and the top of the third ceramic shell is provided with a discharge pin corresponding to the discharge port. The bottom of the first ceramic shell is provided with a charging pin corresponding to the charging port. The first ceramic shell is provided with a transition circuit and a first pad group located on the top. The second ceramic shell is provided with a low-voltage charging circuit and a second pad group located on the top and bottom. The third ceramic shell is provided with a high-voltage charging circuit and a third pad group located on the left and right sides.

Description

Technical Field

[0001] This invention belongs to the field of chip technology, specifically relating to a ceramic packaging structure and preparation method for a pulse igniter. Background Technology

[0002] A pulse igniter, or pulse igniter for short, is an electronic product that uses the principle of pulses to generate a continuous, instantaneous electric spark, thereby igniting the flame of a gas appliance. Early pulse igniters mostly used dry-cell batteries as their power source, but most recent products have switched to AC power. With advancements in industrial technology, the production cost of pulse igniters has decreased, and they are now widely used in mid-to-high-end gas appliances, greatly simplifying customer use and improving product automation. Compared to earlier piezoelectric ignition devices, pulse ignition offers higher stability and simpler operation. In conventional pulse igniters, the high-voltage and low-voltage sections of the ceramic-encapsulated structure are in separate compartments connected by cables, resulting in a larger footprint. Summary of the Invention

[0003] This invention provides a ceramic packaging structure and preparation method for a pulse igniter, aiming to solve the technical problem of the large volume of existing ceramic packaging structures for pulse igniters.

[0004] In a first aspect, embodiments of the present invention provide a ceramic encapsulation structure for a pulse igniter, including an outer shell and a first ceramic shell, a second ceramic shell, and a third ceramic shell disposed inside the outer shell. The first ceramic shell, the second ceramic shell, and the third ceramic shell are connected sequentially from bottom to top. The third ceramic shell is perpendicular to the second ceramic shell. The top of the outer shell is provided with a discharge port and the bottom is provided with a charging port. The top of the third ceramic shell is provided with a discharge pin corresponding to the discharge port, and the bottom of the first ceramic shell is provided with a charging pin corresponding to the charging port.

[0005] The first ceramic housing is provided with a switching circuit and a first pad group located on the top. The second ceramic housing is provided with a low-voltage charging circuit and a second pad group located on the top and bottom. The third ceramic housing is provided with a high-voltage charging circuit and a third pad group located on the left and right sides. The switching circuit, the low-voltage charging circuit and the high-voltage charging circuit are interconnected.

[0006] In conjunction with the first aspect, in one possible implementation, the top surface of the first ceramic housing is recessed to form a first receiving groove, the portion of the second pad group located at the bottom of the second ceramic housing is located within the first receiving groove, and the first pad group is arranged on the outer periphery of the first receiving groove.

[0007] In conjunction with the first aspect, in one possible implementation, the bottom surface of the second ceramic housing is recessed to form a second receiving groove, the portion of the second pad group located at the bottom of the second ceramic housing is located within the second receiving groove, the shape of the second receiving groove is adapted to the shape of the first receiving groove, and is located directly above the first receiving groove.

[0008] In conjunction with the first aspect, in one possible implementation, the charging pin penetrates the first ceramic housing, and the bottom of the second ceramic housing is provided with a positioning hole corresponding to the charging pin.

[0009] In conjunction with the first aspect, in one possible implementation, the third pad group includes a plurality of third pads located at the bottom of the left and right sides of the third ceramic housing, the plurality of third pads being spaced apart in the front-back direction, and the second pad group includes a plurality of second pads located at the top of the second ceramic housing, the plurality of second pads being soldered one-to-one with the plurality of third pads.

[0010] In conjunction with the first aspect, in one possible implementation, the outer shell includes a base plate and a cover coaxially fixed to the top of the base plate. The inner circumferential surface of the cover and the base plate enclose a cavity for mounting the first ceramic shell, the second ceramic shell, and the third ceramic shell. The top of the cover is also provided with a grouting port, the discharge port is located at the top of the cover, and the charging port is located at the base plate.

[0011] In conjunction with the first aspect, in one possible implementation, the bottom of the base plate is provided with an annular first surrounding plate, the outer peripheral surface of the first surrounding plate is flush with the outer peripheral surface of the base plate, the first surrounding plate is wrapped around the outer periphery of the charging pin, and the bottom surface of the first surrounding plate is lower than the bottom end of the charging pin.

[0012] The top of the cover is provided with an annular second enclosure plate. The outer diameter of the second enclosure plate is smaller than the outer diameter of the cover plate. The second enclosure plate is wrapped around the outer periphery of the discharge needle, and the top surface of the second enclosure plate is higher than the top of the discharge needle.

[0013] In conjunction with the first aspect, in one possible implementation, the outer periphery of the second enclosure is provided with a foolproof protrusion.

[0014] In conjunction with the first aspect, in one possible implementation, the top of the third ceramic housing is provided with a positioning plate, the positioning plate is provided with a mounting hole, and the discharge needle is located in the mounting hole.

[0015] Compared with the prior art, the solution shown in this application embodiment achieves the connection between the low-voltage and high-voltage charging circuits by vertically mounting the second ceramic housing with the low-voltage charging circuit and the third ceramic housing with the high-voltage charging circuit, and directly welding the part connecting the second ceramic housing and the third ceramic housing, replacing the traditional cable connection. Furthermore, due to the vertical arrangement of the second ceramic housing and the third ceramic housing, the integration is high and the size is smaller.

[0016] Secondly, embodiments of the present invention also provide a method for preparing a ceramic encapsulation structure for a pulse igniter, comprising the following steps:

[0017] S10: Select a raw ceramic strip of a preset shape, and process it according to the steps of punching / cavity, filling holes, printing, stacking, positioning, laminating, hot cutting, sintering, and nickel plating to obtain the first ceramic shell and the second ceramic shell respectively. Add a side wall printing process between the hot cutting and sintering steps to obtain the third ceramic shell.

[0018] S20: Welding and assembling parts on the surfaces of the first ceramic shell and the third ceramic shell;

[0019] S30: The first ceramic shell, the second ceramic shell, and the third ceramic shell are welded together in a single structure from bottom to top.

[0020] S40: Place the integrated structure into the metal casing;

[0021] S50: Pour slurry into the metal shell, and after solidification, form a ceramic encapsulation structure.

[0022] Compared with the prior art, the solution shown in this application uses the same processing technology for the first and second ceramic shells, while the third ceramic shell adds sidewall printing. The sidewall printing involves aligning and firing the ceramic slurry until it is no longer noticeable and has no impact on the appearance. The second ceramic shell has no parts that can be directly plated with gold. The first and third ceramic shells require brazing to install parts, and the third ceramic shell requires high-precision welding. First, solder is pre-applied to the positions of the discharge needles using a mold, then high-precision sidewall welding is achieved using an array brazing mold. Finally, the first, second, and third ceramic shells are assembled and placed into a metal casing. After potting and solidification, a ceramic encapsulation structure is formed. The ceramic encapsulation structure prepared by the method of this invention has high quality, and the first, second, and third ceramic shells can be further fixed by slurry pouring, resulting in a stable internal structure. Attached Figure Description

[0023] Figure 1 A three-dimensional structural diagram of the ceramic encapsulation structure for a pulse igniter provided in an embodiment of the present invention. Figure 1 ;

[0024] Figure 2 A three-dimensional structural diagram of the ceramic encapsulation structure for a pulse igniter provided in an embodiment of the present invention. Figure 2 ;

[0025] Figure 3 This is a schematic diagram of the assembly structure of the first ceramic shell, the second ceramic shell, and the third ceramic shell used in an embodiment of the present invention;

[0026] Figure 4 This is a three-dimensional structural diagram of the first ceramic shell used in an embodiment of the present invention;

[0027] Figure 5 This is a three-dimensional structural diagram of the second ceramic shell used in an embodiment of the present invention.

[0028] Explanation of reference numerals in the attached figures:

[0029] 10-Outer shell; 11-Base plate; 12-Cover shell; 13-First enclosure plate; 14-Second enclosure plate; 15-Anti-mistake protrusion; 16-Grouting port;

[0030] 20-First ceramic housing; 21-Charging pin; 22-First solder pad group; 23-First receiving groove;

[0031] 30 - Second ceramic housing; 31 - Second solder pad; 32 - Second receiving groove; 33 - Positioning hole;

[0032] 40 - Third ceramic housing; 41 - Third solder pad; 42 - Discharge pin; 43 - Positioning plate. Detailed Implementation

[0033] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0034] In the claims, description, and accompanying drawings of this invention, unless otherwise expressly specified, the terms "first," "second," or "third," etc., are used to distinguish different objects, not to describe a specific order. In the claims, description, and accompanying drawings of this invention, the terms "upper," "lower," "top," and "bottom," etc., are used in conjunction with... Figure 3 The vertical direction indicated in the text is the same, and the terms "front" and "back" are the same. Figure 3 The directions indicated in the text are the same, and the terms "left" and "right" are the same. Figure 3The directions indicated in the figures are the same. Other directional terms, unless otherwise expressly defined, are based on the orientation and positional relationships shown in the accompanying drawings, and are only for the purpose of facilitating the description of the invention and simplifying the description. They are not intended to indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the specific scope of protection of the invention.

[0035] Unless otherwise expressly defined, the terms "fixed connection" or "fixed connection" used in the claims, description and drawings of this invention should be interpreted broadly to refer to any connection in which there is no displacement or relative rotation relationship between the two parties, including non-removable fixed connection, detachable fixed connection, integral connection and fixed connection by other means or components.

[0036] In the claims, description and accompanying drawings of this invention, the terms "comprising," "having," and variations thereof are used to mean "including but not limited to."

[0037] Please refer to the following: Figures 1 to 5 The ceramic encapsulation structure for a pulse igniter provided by the present invention will now be described. The ceramic encapsulation structure for a pulse igniter includes an outer shell 10 and a first ceramic shell 20, a second ceramic shell 30, and a third ceramic shell 40 disposed inside the outer shell 10. The first ceramic shell 20, the second ceramic shell 30, and the third ceramic shell 40 are connected sequentially from bottom to top. The third ceramic shell 40 is perpendicular to the second ceramic shell 30. The top of the outer shell 10 has a discharge port and the bottom has a charging port. The top of the third ceramic shell 40 has a discharge pin 42 corresponding to the discharge port, and the bottom of the first ceramic shell 20 has a charging pin 21 corresponding to the charging port.

[0038] The first ceramic housing 20 is provided with a transfer circuit and a first pad group 22 located on the top. The second ceramic housing 30 is provided with a low-voltage charging circuit and a second pad group 31 located on the top and bottom. The third ceramic housing 40 is provided with a high-voltage charging circuit and a third pad group 41 located on the left and right sides. The transfer circuit, the low-voltage charging circuit and the high-voltage charging circuit are interconnected.

[0039] It should be noted that after the first ceramic housing 20, the second ceramic housing 30 and the third housing are assembled, the solder pads between them can be connected to realize the interconnection of the low-voltage charging circuit, the high-voltage charging circuit and the transfer circuit, so as to realize their use as important components of the pulse igniter.

[0040] Compared with the prior art, the ceramic packaging structure for pulse igniters provided in this embodiment achieves the connection of low-voltage and high-voltage charging circuits by vertically mounting the second ceramic housing 30 with a low-voltage charging circuit and the third ceramic housing 40 with a high-voltage charging circuit, and directly welding the part connecting the second ceramic housing 30 and the third ceramic housing 40, replacing the traditional cable connection. Furthermore, due to the vertical arrangement of the second ceramic housing 30 and the third ceramic housing 40, the integration is high and the size is smaller.

[0041] In some embodiments, an improved implementation of the first ceramic housing 20 may employ, as follows: Figure 4 The structure shown. See also Figure 4 The top surface of the first ceramic housing 20 is recessed to form a first receiving groove 23. The second pad group 31 is located in part of the first receiving groove 23 at the bottom of the second ceramic housing 30. The first pad group 22 is arranged on the outer periphery of the first receiving groove 23.

[0042] The second set of pads 31 is distributed at the top and bottom of the second ceramic housing 30. The first ceramic housing 20 and the second ceramic housing 30 are arranged horizontally, so the top surface of the first ceramic housing 20 is opposite to the bottom surface of the second ceramic housing 30. By setting the first receiving groove 23 at the top of the first ceramic housing 20, the portion of the second set of pads 31 located at the bottom of the second ceramic housing 30 can be accommodated. This not only allows the top surface of the first ceramic housing 20 located on the outer periphery of the first receiving groove 23 to fit with the bottom surface of the second ceramic housing 30, making the connection structure more stable, but also reduces the gap between the first ceramic housing 20 and the second ceramic housing 30 by using the first receiving groove 23, making full use of space and further reducing the overall volume.

[0043] In some embodiments, an improved implementation of the second ceramic housing 30 may employ, as follows: Figure 5 The structure shown. See also Figure 5 The bottom surface of the second ceramic housing 30 is recessed to form a second receiving groove 32. The portion of the second set of solder pads 31 located at the bottom of the second ceramic housing 30 is located within the second receiving groove 32. The shape of the second receiving groove 32 is adapted to the shape of the first receiving groove 23 and is located directly above the first receiving groove 23. The second receiving groove 32 opens downwards, and the first receiving groove 23 opens upwards. When joined together, they form a closed cavity that can accommodate the portion of the second set of solder pads 31 located at the bottom of the second ceramic housing 30. With this structure, the thickness of both the first ceramic housing 20 and the second ceramic housing 30 can be further reduced, resulting in a smaller volume.

[0044] In some embodiments, an improved implementation of the second ceramic housing 30 may employ, as follows: Figures 4 to 5 The structure shown. See also Figures 4 to 5The charging pin 21 penetrates the first ceramic housing 20, and the bottom of the second ceramic housing 30 is provided with a positioning hole 33 corresponding to the charging pin 21. When the first ceramic housing 20 and the second ceramic housing 30 are connected, the charging pin 21 extends into the positioning hole 33, which facilitates the positioning of the first receiving groove 23 and the second receiving groove 32, avoids the deformation of the solder pads, and improves the product yield. The positioning is achieved by the positioning pin cooperating with the positioning hole 33, which can quickly make the outer peripheral surfaces of the first ceramic housing 20 and the second ceramic housing 30 flush, ensuring the appearance quality. Moreover, this structure is convenient to connect and simple to operate.

[0045] In some embodiments, a specific connection method between the second ceramic housing 30 and the third ceramic housing 40 can be as follows: Figure 3 The structure shown. See also Figure 3 The third pad group 41 includes multiple third pads 41 located at the bottom of the left and right sides of the third ceramic housing 40, with the multiple third pads 41 spaced apart along the front-to-back direction. The second pad group 31 includes multiple second pads 31 located at the top of the second ceramic housing 30, and the multiple second pads 31 are soldered in the same manner as the multiple third pads 41. In order to realize the connection between the low-voltage charging circuit and the high-voltage charging circuit, the connection between the second pads 31 and the third pads 41 is completed simultaneously by soldering the second pads 31 and the third ceramic housing 40, as well as the connection between the low-voltage charging circuit and the high-voltage charging circuit, making the connection simpler; and the second pads 31 and the third pads 41 correspond one-to-one, which facilitates the alignment of the second ceramic housing 30 and the third ceramic housing 40 during assembly.

[0046] In some embodiments, a specific implementation of the housing 10 described above may employ, as follows: Figures 1 to 2 The structure shown. See also Figures 1 to 2 The outer shell 10 includes a base plate 11 and a cover coaxially fixed to the top of the base plate 11. The inner circumferential surface of the cover and the base plate 11 enclose a cavity for installing the first ceramic shell 20, the second ceramic shell 30 and the third ceramic shell 40. The top of the cover is also provided with a grouting port 16, a discharge port is provided on the top of the cover, and a charging port is provided on the base plate 11.

[0047] The first ceramic shell 20, the second ceramic shell 30, and the third ceramic shell 40 are assembled separately and placed inside the cover after assembly. Then, the base plate 11 is sealed on. The base plate 11 and the cover can be connected by welding to ensure that there are no gaps. The first ceramic shell 20 and the second ceramic shell 30 are attached to the inner circumferential surface of the cover. Then, grout is injected into the inside of the cover through the grouting port 16. After the grout solidifies, the vertically set third ceramic shell 40 can be further fixed to prevent it from shaking inside and breaking the connection with the second ceramic shell 30, thereby improving product quality.

[0048] In some embodiments, an improved implementation of the housing 10 described above may employ, as follows: Figures 1 to 2The structure shown. See also Figures 1 to 2 The bottom of the base plate 11 is provided with an annular first surrounding plate 13. The outer peripheral surface of the first surrounding plate 13 is flush with the outer peripheral surface of the base plate 11. The first surrounding plate 13 is wrapped around the outer periphery of the charging pin 21, and the bottom surface of the first surrounding plate 13 is lower than the bottom end of the charging pin 21. The top of the cover is provided with an annular second surrounding plate 14. The outer diameter of the second surrounding plate 14 is smaller than the outer diameter of the cover. The second surrounding plate 14 is wrapped around the outer periphery of the discharge pin 42, and the top surface of the second surrounding plate 14 is higher than the top end of the discharge pin 42.

[0049] By setting the first enclosure 13 and the second enclosure 14, the charging needle 21 and the discharging needle 42 can be protected, avoiding damage to the charging needle 21 and the discharging needle 42 during transportation. Furthermore, when this ceramic encapsulation structure is installed into the pulse igniter, it can be connected to other structures by plugging in, making the operation simple.

[0050] To achieve a fast and accurate insertion process, the outer periphery of the second enclosure 14 is provided with a foolproof protrusion 15. Correspondingly, the structure that inserts into the second enclosure 14 needs to be provided with a corresponding groove. Thus, during insertion, the foolproof protrusion 15 can be aligned with the groove to achieve fast insertion and prevent the discharge pin 42 from being pushed out of place.

[0051] In some embodiments, an improved implementation of the third ceramic housing 40 may employ, as follows: Figure 1 and Figure 3 The structure shown. See also Figure 1 and Figure 3 The top of the third ceramic housing 40 is provided with a positioning plate 43, and the positioning plate is provided with a mounting hole, and the discharge needle 42 is located in the mounting hole.

[0052] Before the discharge needle 42 is installed on the top of the third ceramic housing 40, a positioning plate 43 is first installed on the third ceramic housing 40. The discharge needle 42 can be quickly installed by directly fixing it in the mounting hole on the positioning plate 43.

[0053] Optionally, the discharge pin 42 and the charging pin 21 can be arranged in an array and both can be fixed by welding.

[0054] Based on the same inventive concept, this application also provides a method for preparing a ceramic encapsulation structure for a pulse igniter, which includes the following steps:

[0055] S10: Select a raw ceramic strip of a preset shape and process it according to the steps of punching / cavity, filling holes, printing, stacking, positioning, laminating, hot cutting, sintering, and nickel plating to obtain the first ceramic shell 20 and the second ceramic shell 30 respectively. Add a side wall printing process between the hot cutting and sintering steps to obtain the third ceramic shell 40.

[0056] S20: Welding and assembling parts on the surfaces of the first ceramic housing 20 and the third ceramic housing 40;

[0057] S30: The first ceramic shell 20, the second ceramic shell 30 and the third ceramic shell 40 are welded together in a single structure from bottom to top;

[0058] S40: Place the integrated structure inside the metal casing 10;

[0059] S50: Pour slurry into the metal casing 10, and after solidification, form a ceramic encapsulation structure.

[0060] The method for preparing a ceramic encapsulation structure for a pulse igniter provided in this embodiment differs from existing technologies in that the first ceramic shell 20 and the second ceramic shell 30 employ the same processing technology, while the third ceramic shell 40 includes sidewall printing. The sidewall printing involves aligning and firing a ceramic slurry until it is no longer noticeable and has no impact on the appearance. Since the second ceramic shell 30 has no parts, it can be directly gold-plated. The first ceramic shell 20 and the third ceramic shell 40 require brazing to install parts, and the third ceramic shell 40 requires high-precision welding. First, solder is pre-applied to the position of the discharge needle 42 using a mold, then high-precision sidewall welding is achieved using an array brazing mold. Finally, the first ceramic shell 20, the second ceramic shell 30, and the third ceramic shell 40 are assembled and placed into a metal casing 10. After potting and solidification, a ceramic encapsulation structure is formed. The ceramic encapsulation structure prepared by this invention has high quality, and the first ceramic shell 20, the second ceramic shell 30, and the third ceramic shell 40 can be further fixed by potting, resulting in a stable internal structure.

[0061] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A ceramic encapsulation structure for a pulse igniter, characterized in that, The device includes an outer shell and a first ceramic shell, a second ceramic shell, and a third ceramic shell disposed inside the outer shell. The first ceramic shell, the second ceramic shell, and the third ceramic shell are connected sequentially from bottom to top. The third ceramic shell is perpendicular to the second ceramic shell. The top of the outer shell is provided with a discharge port and the bottom is provided with a charging port. The top of the third ceramic shell is provided with a discharge pin corresponding to the discharge port, and the bottom of the first ceramic shell is provided with a charging pin corresponding to the charging port. The first ceramic housing is provided with a switching circuit and a first pad group located on the top; the second ceramic housing is provided with a low-voltage charging circuit and a second pad group located on the top and bottom; the third ceramic housing is provided with a high-voltage charging circuit and a third pad group located on the left and right sides; the switching circuit, the low-voltage charging circuit and the high-voltage charging circuit are interconnected. The third pad group includes multiple third pads located at the bottom of the left and right sides of the third ceramic housing, and the multiple third pads are spaced apart in the front-back direction. The second pad group includes multiple second pads located at the top of the second ceramic housing, and the multiple second pads are welded to the multiple third pads one by one.

2. The ceramic encapsulation structure for a pulse igniter as described in claim 1, characterized in that, The top surface of the first ceramic shell is recessed to form a first receiving groove, and the portion of the second pad group located at the bottom of the second ceramic shell is located within the first receiving groove, with the first pad group arranged on the outer periphery of the first receiving groove.

3. The ceramic encapsulation structure for a pulse igniter as described in claim 2, characterized in that, The bottom surface of the second ceramic housing is recessed to form a second receiving groove. The portion of the second pad group located at the bottom of the second ceramic housing is located within the second receiving groove. The shape of the second receiving groove is adapted to the shape of the first receiving groove and is located directly above the first receiving groove.

4. The ceramic encapsulation structure for a pulse igniter as described in claim 2 or 3, characterized in that, The charging pin passes through the first ceramic housing, and the bottom of the second ceramic housing is provided with a positioning hole corresponding to the charging pin.

5. The ceramic encapsulation structure for a pulse igniter as described in claim 1, characterized in that, The outer shell includes a base plate and a cover coaxially fixed to the top of the base plate. The inner circumferential surface of the cover and the base plate enclose a cavity for installing the first ceramic shell, the second ceramic shell and the third ceramic shell. The top of the cover is also provided with a grouting port, the discharge port is located at the top of the cover, and the charging port is located at the base plate.

6. The ceramic encapsulation structure for a pulse igniter as described in claim 5, characterized in that, The bottom of the base plate is provided with an annular first surrounding plate, the outer peripheral surface of the first surrounding plate is flush with the outer peripheral surface of the base plate, the first surrounding plate is wrapped around the outer periphery of the charging pin, and the bottom surface of the first surrounding plate is lower than the bottom end of the charging pin. The top of the cover is provided with an annular second enclosure plate. The outer diameter of the second enclosure plate is smaller than the outer diameter of the cover plate. The second enclosure plate is wrapped around the outer periphery of the discharge needle, and the top surface of the second enclosure plate is higher than the top of the discharge needle.

7. The ceramic encapsulation structure for a pulse igniter as described in claim 6, characterized in that, The outer periphery of the second enclosure is provided with anti-fouling protrusions.

8. The ceramic encapsulation structure for a pulse igniter as described in claim 1, characterized in that, The top of the third ceramic housing is provided with a positioning plate, and the positioning plate is provided with a mounting hole, and the discharge needle is located in the mounting hole.

9. A method for preparing a ceramic encapsulation structure for a pulse igniter, used to prepare the ceramic encapsulation structure for a pulse igniter as described in any one of claims 1-8, characterized in that, Includes the following steps: S10: Select a raw ceramic strip of a preset shape, and process it according to the steps of punching / cavity, filling holes, printing, stacking, positioning, laminating, hot cutting, sintering, and nickel plating to obtain the first ceramic shell and the second ceramic shell respectively. Add a side wall printing process between the hot cutting and sintering steps to obtain the third ceramic shell. S20: Welding and assembling parts on the surfaces of the first ceramic shell and the third ceramic shell; S30: The first ceramic shell, the second ceramic shell, and the third ceramic shell are welded together in a single structure from bottom to top. S40: Place the integrated structure into the metal casing; S50: Pour slurry into the metal shell, and after solidification, form a ceramic encapsulation structure.

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