An integrated high temperature sensor and method of assembly thereof

Abstract

The application relates to the field of temperature sensors in high-temperature environments, in particular to an integrated high-temperature sensor and an assembling method thereof, which comprises a temperature sensor shell with an integrated structure, the inside of the temperature sensor shell is packaged with a temperature sensor element and a temperature sensor element support structure, the temperature sensor element is located at the shell head of the temperature sensor shell and is electrically connected with a temperature sensor element pin and an electrical lead in sequence; the temperature sensor element support structure comprises a support structure upper cover and a support structure lower cover which are coupled with each other, the support structure upper cover and the support structure lower cover are assembled through ceramic adhesive, and the T-shaped ends of the temperature sensor element, the temperature sensor element pin and the electrical lead are all packaged and fixed between the support structure upper cover and the support structure lower cover. The application adopts the integrated sensor shell and the assembled packaging structure, greatly simplifies the technological process, improves the production efficiency, and can well control the production cost of the high-temperature sensor.

Description

Technical Field

[0001] This invention relates to the field of temperature sensors for high-temperature environments, specifically to an integrated high-temperature sensor and its assembly method. Background Technology

[0002] The high-temperature sensors in this topic are mainly used in engine aftertreatment systems, i.e., temperature monitoring of engine emission control systems.

[0003] Typically, high-temperature sensors are exposed to engine exhaust gases for extended periods. The outer protective cover of the high-temperature sensor is in direct contact with the exhaust gases, and the heat flux is conducted from the outside to the internal medium through the outer protective cover, and further transferred to the internal temperature sensing element. The internal temperature sensing element can be a positive temperature coefficient (PTC) resistor, such as a platinum resistance thermometer.

[0004] Typically, engine exhaust systems exhibit rapidly fluctuating ambient temperatures due to changes in engine operating conditions. High-temperature sensors are subjected to extremely high heating and cooling temperature gradients over extended periods. These rapid temperature gradients cause alternating tensile and compressive thermal stresses between different materials, including the sensor's protective casing, internal components, and connecting wires. Therefore, the temperature sensing element inside the high-temperature sensor is protected by an external protective casing, an internal support structure, and a body encapsulation.

[0005] Sensata's patents CN106323495A and CN114878024A disclose a high-temperature sensing device. The temperature sensor housing is formed by a bottomed metal tube (metal protective cover) and a cylindrical metal tube mechanically connected together, housing a temperature sensor element within a support structure. The temperature sensor element and electrical wiring are reinforced and connected by a filling material (alumina, zirconium oxide, magnesium oxide, or other metal oxide ceramics or cement compounds) encapsulated within the metal protective cover (filling mold).

[0006] Currently, most published patents employ a separate housing and filling technology to manufacture high-temperature sensors. After the temperature sensor element undergoes a filling process, a metal protective cover is then welded on.

[0007] In summary, the existing temperature sensor housing uses a discrete design, which increases the number of components and welding processes, introducing the risk of poor sealing during manufacturing. Furthermore, the existing "filling technology" is complex, requiring steps such as "filling with cement" -> "installing a metal protective cover" -> "centrifugation" -> "drying" -> "high-temperature removal of organic matter" -> "welding the metal protective cover." The "drying" process is time-consuming, impacting production efficiency. Summary of the Invention

[0008] The purpose of this invention is to provide an integrated high-temperature sensor and its assembly method to solve the problems mentioned in the background art.

[0009] To achieve the above objectives, the present invention provides the following technical solution: an integrated high-temperature sensor, comprising an integrated temperature sensor housing, wherein a temperature sensor element and a temperature sensor element support structure are encapsulated inside the temperature sensor housing, the temperature sensor element is located at the head of the temperature sensor housing and is electrically connected in sequence to temperature sensor element pins and electrical wires, the "T"-shaped ends of the electrical wires being electrically connected to the temperature sensor element pins; the temperature sensor element support structure comprises a support structure upper cover and a support structure lower cover coupled to each other, the support structure upper cover and the support structure lower cover being assembled by ceramic adhesive, and the temperature sensor element, temperature sensor element pins and the "T"-shaped ends of the electrical wires are all encapsulated and fixed between the support structure upper cover and the support structure lower cover.

[0010] Preferably, the temperature sensor element includes a bottom and a top, with a sensing chip encapsulated inside the bottom and a temperature sensor pin electrically connected to the top.

[0011] Preferably, the upper and lower support structures are separate coupling components with identical structures, both made from two-stage materials through calcination. The upper support structure includes a lower end and an upper end, while the lower support structure includes a lower end and an upper end. The lower and lower ends are made of a compound material with excellent thermal conductivity, corresponding to the bottom of the temperature sensor element. The upper and lower ends are made of an inert material with excellent insulation, corresponding to the top of the temperature sensor element. This design ensures that the sensing chip encapsulated at the bottom of the temperature sensor element responds quickly to ambient temperature, while also ensuring that the top of the temperature sensor element, its pins, and electrical wires maintain good and stable electrical characteristics while being reinforced.

[0012] Preferably, the device also includes an insulating support material, which is encapsulated inside the temperature sensor housing and located at the rear of the housing. The insulating support material is fitted with a bottom seal and a top seal at both ends. The insulating support material provides temperature isolation, electrical insulation, and spatial positioning of the electrical wires. The two seals isolate the insulating support material from the atmospheric environment, preventing it from failing due to moisture or contamination.

[0013] To achieve the above objectives, the present invention also provides the following technical solution: an assembly method for an integrated high-temperature sensor: an integrated high-temperature sensor is manufactured through the following steps;

[0014] Step 1: Assemble the temperature sensor component pins by soldering them to the "T"-shaped ends of the electrical wires;

[0015] Step 2: Adhere and assemble the upper and lower covers of the support structure, and encapsulate and fix the temperature sensor element, temperature sensor element pins, and the "T"-shaped terminals of electrical wires;

[0016] Step 3: Assemble the upper support cover, lower support cover, and electrical wires into the temperature sensor housing;

[0017] Step 4: Install the bottom sealing body into the temperature sensor housing;

[0018] Step 5: Pre-fix the spatial position of the electrical wires, insert the insulating support material into the temperature sensor housing, and pre-compress the insulating support material;

[0019] Step 6: Install the top sealing body into the temperature sensor housing;

[0020] Step 7: Calcination and sealing; calcination is performed on localized areas of the bottom and top sealing bodies at temperatures above 1000℃, or electromagnetic heating can be used.

[0021] In summary, the present invention has the following beneficial effects: the use of an "integrated" sensor housing and an "assembled" packaging structure greatly simplifies the process flow, improves production efficiency, and can effectively control the production cost of high-temperature sensors; at the same time, the temperature sensor element support structure is made of "two-stage" material calcination, which takes into account both heat transfer efficiency and product response performance, as well as the stability of product electrical characteristics and improves product consistency. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of an integrated high-temperature sensor proposed in this invention;

[0023] Figure 2 for Figure 1 Schematic diagram of the cross-section of the planed surface;

[0024] Figure 3 This is a partial structural diagram of an integrated high-temperature sensor proposed in this invention;

[0025] Figure 4 for Figure 3 Schematic diagram of the cross-section of the planed surface;

[0026] Figure 5 This is a flowchart of an assembly method for an integrated high-temperature sensor proposed in this invention.

[0027] Figure label:

[0028] 1. Temperature sensor element; 11. Bottom of temperature sensor element; 12. Top of temperature sensor element;

[0029] 2. Temperature sensor component pins;

[0030] 3. Electrical wires;

[0031] 4. Temperature sensor housing; 41. Housing head; 42. Housing tail;

[0032] 5. Bottom sealing body;

[0033] 6. Insulating support materials;

[0034] 7. Top sealing body;

[0035] 8. Support structure cover; 81. Lower end of cover; 82. Upper end of cover;

[0036] 9. Support structure lower cover; 91. Lower end of the lower cover; 92. Upper end of the lower cover;

[0037] 10. Ceramic adhesives. Detailed Implementation

[0038] An integrated high-temperature sensor is disclosed in this embodiment of the invention. Please refer to [link / reference]. Figure 1 and Figure 2 The high-temperature sensor includes a temperature sensor housing 4, a temperature sensor element 1 encapsulated inside the temperature sensor housing 4, a temperature sensor element support structure, and an insulating support material 6.

[0039] The entire temperature sensor housing 4 is an "integrated" structure. The temperature sensor housing 4 includes a housing head 41 and a housing tail 42. The housing head 41 is conical and the housing tail 42 is cylindrical. The end face of the housing head 41 is round or flat.

[0040] Temperature sensor element 1 is an ambient temperature sampling unit located at the head 41 of the housing. Temperature sensor element 1 includes a bottom 11 and a top 12. A sensing chip is encapsulated within the bottom 11. The top 12 is electrically connected to a pin 2, and the pin 2 is electrically connected to an electrical wire 3, with the "T"-shaped end of the electrical wire 3 directly connected to the pin 2. Temperature sensor element 1 outputs the sampled temperature value to an external control system via the pin 2 and the electrical wire 3.

[0041] See Figure 3 and Figure 4 The temperature sensor element support structure is also located at the head of the housing 41. The temperature sensor element 1, the temperature sensor element pin 2, and the “T”-shaped end of the electrical wire 3 are all encapsulated and reinforced in the temperature sensor element support structure.

[0042] The temperature sensor element support structure consists of two coupling components: an upper support cover 8 and a lower support cover 9. These two components are separate coupling parts and can be pre-fabricated. The upper support cover 8 is made of a two-section material through calcination. It includes a lower end 81 and an upper end 82, where the lower end 81 is made of a compound material with excellent thermal conductivity, and the upper end 82 is made of an inert material with excellent insulation. The lower support cover 9, as the coupling component to the upper support cover 8, is identical to the pre-fabricated upper support cover 8, including a lower end 91 with excellent thermal conductivity and an upper end 92 with excellent insulation. The lower end 91 corresponds to the lower end 81 of the upper cover, and the upper end 92 corresponds to the upper end 82.

[0043] The upper cover 8 and lower cover 9 of the support structure are assembled using ceramic adhesive 10. During assembly, the "T"-shaped ends of the temperature sensor element 1, temperature sensor element pins 2, and electrical wires 3 are all encapsulated and fixed between the upper cover 8 and lower cover 9. Simultaneously, the bottom 11 of the temperature sensor element is encapsulated between the lower end 81 of the upper cover and the lower end 91 of the lower cover, and the top 12 of the temperature sensor element is encapsulated between the upper end 82 of the upper cover and the upper end 92 of the lower cover. This design ensures that the sensing chip encapsulated at the bottom 11 of the temperature sensor element responds quickly to ambient temperature, while also ensuring that the top 12 of the temperature sensor element, the temperature sensor element pins 2, and the electrical wires 3 maintain good and stable electrical characteristics while being reinforced.

[0044] The insulating support material 6 is located at the tail end 42 of the housing. Two sealing components are assembled at both ends of the insulating support material 6, namely the bottom sealing body 5 and the top sealing body 7. The insulating support material 6 has the functions of temperature isolation, electrical insulation and fixing the spatial position of the electrical wires 3. The sealing components have the function of isolating the atmospheric environment and preventing the insulating support material 6 from failing due to moisture or contamination.

[0045] See Figure 5 The temperature sensor of the present invention can be manufactured using a component "assembly" process, and the assembly steps are as follows:

[0046] Step 1: Assemble the temperature sensor element pin 2 by soldering it to the "T"-shaped end of the electrical wire 3;

[0047] Step 2: The upper cover 8 and the lower cover 9 of the support structure are bonded and assembled to encapsulate and fix the "T"-shaped ends of the temperature sensor element 1, the temperature sensor element pin 2 and the electrical wire 3.

[0048] Step 3: Assemble the upper support cover 8, lower support cover 9, and electrical wires 3 into the temperature sensor housing 4;

[0049] Step 4: The bottom sealing body 5 is installed into the temperature sensor housing 4;

[0050] Step 5: Pre-fix the spatial position of the electrical wire 3, insert the insulating support material 6 into the temperature sensor housing 4, and pre-tighten the insulating support material 6;

[0051] Step 6: The top sealing body 7 is installed into the temperature sensor housing 4;

[0052] Step 7: Calcination and sealing; calcination is carried out locally on the bottom sealing body 5 and the top sealing body 7 at a temperature above 1000℃, or electromagnetic heating can be used.

[0053] In summary, the present invention adopts an "integrated" temperature sensor housing 4 and an "assembled" packaging structure, which greatly simplifies the process flow, improves production efficiency, and can effectively control the production cost of high-temperature sensors. At the same time, the temperature sensor element support structure in the present invention is made of "two-stage" material calcination, which takes into account both heat transfer efficiency and product response performance, as well as the stability of product electrical characteristics and improves product consistency.

[0054] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An integrated high-temperature sensor, characterized in that: The temperature sensor housing (4) includes an integrated structure. The housing contains a temperature sensor element (1) and a temperature sensor element support structure. The temperature sensor element (1) is located at the head (41) of the housing and is electrically connected to a temperature sensor element pin (2) and an electrical wire (3). The "T"-shaped end of the electrical wire (3) is electrically connected to the temperature sensor element pin (2). The temperature sensor element support structure includes a mutually coupled upper support cover (8) and a lower support cover (9). The upper and lower support covers are assembled using a ceramic adhesive (10). The upper and lower support covers are separate coupling components with identical structures, both made from two-stage materials. The temperature sensor element (1) and temperature sensor... The "T"-shaped ends of the component pins (2) and electrical wires (3) are encapsulated and fixed between the upper cover (8) and the lower cover (9) of the support structure; the temperature sensor component (1) includes the bottom (11) and the top (12) of the temperature sensor component. The bottom (11) of the temperature sensor component is encapsulated with a sensing chip, and the top (12) of the temperature sensor component is electrically connected to the pins (2) of the temperature sensor component; the upper cover (8) of the support structure includes the lower end (81) and the upper end (82) of the upper cover, and the lower cover (9) of the support structure includes the lower end (91) and the upper end (92) of the lower cover; the lower end (81) and the lower end (91) of the upper cover are made of a compound material with excellent thermal conductivity, corresponding to the bottom (11) of the encapsulated temperature sensor component; the upper end (82) of the upper cover and the upper end (92) of the lower cover are made of an inert material with excellent insulation, corresponding to the top (12) of the encapsulated temperature sensor component.

2. The high-temperature sensor according to claim 1, characterized in that: It also includes an insulating support material (6), which is encapsulated inside the temperature sensor housing (4) and located at the tail (42) of the temperature sensor housing (4). The insulating support material (6) is fitted with a bottom seal (5) and a top seal (7) at both ends.

3. A method for assembling an integrated high-temperature sensor, characterized in that: The integrated high-temperature sensor as described in claim 2 is manufactured through the following steps; Step 1: The temperature sensor element pin (2) is soldered and assembled with the "T"-shaped end of the electrical wire (3); Step 2: The upper cover (8) and lower cover (9) of the support structure are bonded together to encapsulate and fix the "T"-shaped ends of the temperature sensor element (1), the temperature sensor element pins (2) and the electrical wires (3); Step 3: Assemble the upper cover (8), lower cover (9), and electrical wires (3) into the temperature sensor housing (4); Step 4: The bottom sealing body (5) is installed into the temperature sensor housing (4); Step 5: Pre-fix the spatial position of the electrical wire (3), insert the insulating support material (6) into the temperature sensor housing (4), and pre-tighten the insulating support material (6); Step 6: The top sealing body (7) is installed into the temperature sensor housing (4); Step 7: Calcination and sealing; calcination is carried out locally on the bottom sealing body (5) and the top sealing body (7) at a temperature above 1000℃.

4. The assembly method according to claim 3, characterized in that: Step 7 employs electromagnetic heating treatment.

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