Wafer sealing apparatus and method of operation thereof

Abstract

A wafer sealing apparatus includes a carrier table, an upper sealing member, a lower sealing member, a clamp, a connector, a sealing bag, and a nitride-based semiconductor wafer. The upper sealing member and the lower sealing member are disposed at one end of a carrier surface of the carrier table. The clamp is disposed on the carrier surface. One connector connects one clamp and the lower sealing member, and another connector connects another clamp and the lower sealing member. The sealing bag is clamped by the clamps. The nitride-based semiconductor wafer is disposed in the sealing bag. The sealing members extend in a first direction. The connectors are configured to move the clamps in a second direction. The clamps are configured to clamp in a third direction. The first direction is perpendicular to the second direction, and the third direction is perpendicular to the first direction and the second direction.

Description

Technical Field

[0001] Generally, the present invention relates to a sealing device. More specifically, the present invention relates to a wafer sealing device for a nitride-based wafer having a high electron mobility transistor (HEMT). Background Technology

[0002] In recent years, in-depth research on high electron mobility transistors (HEMTs) has led to their widespread application in semiconductor devices, such as high-power switches and high-frequency applications. Group III nitride-based HEMTs utilize a heterojunction interface between two materials with different band gaps to form a quantum well-like structure that houses a two-dimensional electron gas (2DEG) region to meet the demands of high-power / frequency devices. Besides HEMTs, examples of devices with heterostructures include heterojunction bipolar transistors (HBTs), heterojunction field-effect transistors (HFETs), and modulation-doped FETs (MODFETs). To protect HEMT wafers, a heat-sealing process is required. This process requires operators to hold the bag containing the wafer by hand, which can cause wrinkles to form on the bag, potentially scratching the wafer. Furthermore, wrinkles can cause leakage. Additionally, contact with the heat-sealing rod can result in operator injury and may affect yield. Currently, there is a need to improve the yield of HEMT devices to suit large-scale production. Summary of the Invention

[0003] In one aspect, the present invention provides a wafer sealing device. The wafer sealing device includes a carrier stage, an upper sealing member, a lower sealing member, a first clamp, a second clamp, a first connector, a second connector, a sealing bag, and a nitride-based semiconductor wafer. The carrier stage has a carrier surface. The upper and lower sealing members are disposed at one end of the carrier surface. The first clamp is disposed on the carrier surface, and the second clamp is disposed on the carrier surface. A first connector connects the first clamp and the lower sealing member, and a second connector connects the second clamp and the lower sealing member. The sealing bag is clamped by the first and second clamps. The nitride-based semiconductor wafer is disposed within the sealing bag. The upper sealing member is disposed directly above the lower sealing member. The upper and lower sealing members are configured to clamp and heat one end of the sealing bag. The first and second clamps clamp different sides of the sealing bag. The upper and lower sealing members extend along a first direction. The first and second connectors are configured to move the first and second clamps respectively along a second direction. The first and second clamps are configured to clamp along a third direction. The first direction is perpendicular to the second direction, and the third direction is perpendicular to both the first and second directions.

[0004] In another aspect, the present invention provides a method for operating a wafer sealing device. The method includes the steps of: placing a nitride-based semiconductor wafer in a sealing bag; clamping different sides of the sealing bag with a first clamp and a second clamp; heat-sealing the bag with an upper sealing member and a lower sealing member; and removing the sealing bag from the first clamp and the second clamp. The wafer sealing device includes a support stage, an upper sealing member, a lower sealing member, a first clamp, and a second clamp. The support stage has a support surface, and the upper and lower sealing members are disposed at one end of the support surface. The first clamp and the second clamp are disposed on the support surface.

[0005] In another aspect, the present invention provides a wafer sealing device. The wafer sealing device includes a sealing apparatus, a first clamp, a second clamp, a sealing bag, and a nitride-based semiconductor wafer. The sealing apparatus is located at one end of a support surface. The first clamp is disposed on the support surface, and the second clamp is disposed on the support surface. The sealing bag is clamped by the first clamp and the second clamp. The nitride-based semiconductor wafer is disposed within the sealing bag. The first clamp and the second clamp clamp different sides of the opening of the sealing bag. The portion of the sealing bag between the first clamp and the second clamp is wrinkle-free. The sealing apparatus is configured to heat-seal the opening of the sealing bag.

[0006] With the above configuration, nitride-based semiconductor wafers can be properly sealed in a sealed bag. This provides high-quality protection for the nitride-based semiconductor wafers. Attached Figure Description

[0007] Various aspects of the invention can be readily understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that the various features may not be drawn to scale. That is, for clarity, the dimensions of the various features may be arbitrarily increased or decreased. Embodiments of the invention are described in more detail below with reference to the accompanying drawings, wherein:

[0008] Figure 1 and Figure 2 This is a perspective view of a wafer sealing device according to some embodiments of the present invention;

[0009] Figure 3 , Figure 5 , Figure 7 and Figure 9 This is a front view of a wafer sealing device according to some embodiments of the present invention;

[0010] Figure 4 , Figure 6 , Figure 8 and Figure 10 This is a top view of a wafer sealing device according to some embodiments of the present invention;

[0011] Figure 11 It is along Figure 4 Side section view of cutting plane line L1 in the diagram;

[0012] Figure 12 It is along Figure 4 Side section view of cutting plane line L2 in the diagram;

[0013] Figure 13 It is along Figure 6 Side section view of cutting plane line L3 in the diagram;

[0014] Figure 14 It is along Figure 6 Side section view of cutting plane line L4 in the diagram;

[0015] Figure 15 It is along Figure 4 Side section view of cutting plane line L5 in the diagram;

[0016] Figure 16 It is along Figure 8 The side section view of the cutting plane line L6 in the diagram; and

[0017] Figure 17 This is a front view of a wafer sealing device according to some embodiments of the present invention. Detailed Implementation

[0018] The same reference numerals are used in the accompanying drawings and detailed description to denote the same or similar parts. Embodiments of the invention will be readily understood from the following detailed description in conjunction with the accompanying drawings.

[0019] Spatial descriptions such as "up," "down," "left," "right," "top," "bottom," "vertical," "horizontal," "side," "higher," and "lower" are specified relative to a component or group of components, or a plane of a component or group of components, for the orientation of the components shown in the figures. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and specific implementations of the structures described herein can be arranged in space in any orientation or manner, as long as such arrangement does not depart from the spirit of the invention.

[0020] In the following description, the wafer sealing device and the method for operating it are presented as preferred examples. It will be apparent that modifications, including additions and / or substitutions, can be made without departing from the scope and spirit of the invention. Specific details may be omitted to avoid confusion. However, the purpose of this invention is to enable those skilled in the art to practice its teachings without excessive experimentation.

[0021] Figure 1 and Figure 2 This is a perspective view of a wafer sealing device according to some embodiments of the present invention. Figure 1 The sealed bag and nitride-based semiconductor wafer are not shown, but Figure 2The sealing bag, nitride-based semiconductor wafer, and fixture are not shown. The wafer sealing device 1 includes a stage 10, a sealing device 11, a fixture 12, a fixture 13, a connector 14, and a connector 15. The sealing device 11 includes an upper sealing component 110 and a lower sealing component 111.

[0022] The support platform 10 has a support surface 100. The sealing device 11 is located at one end of the support surface 100. Specifically, the upper sealing member 110 and the lower sealing member 111 are disposed at one end of the support surface 100, and the upper sealing member 110 is disposed directly above the lower sealing member 111.

[0023] Clamp 12 is disposed on bearing surface 100, and clamp 13 is disposed on bearing surface 100. Connector 14 connects clamp 12 and lower sealing component 111, and connector 15 connects clamp 13 and lower sealing component 111.

[0024] Upper sealing member 110 and lower sealing member 111 extend along direction d1. Connectors 14 and 15 are configured to move clamps 12 and 13 along direction d2, respectively. Clamps 12 and 13 are configured to clamp along direction d3. Direction d1 is perpendicular to direction d2, and direction d3 is perpendicular to both directions d1 and d2. Therefore, clamps 12 and 13 are adapted to hold an object, and clamps 12 and 13 can move the object toward sealing device 11. The upper sealing member 110 and lower sealing member 111 of sealing device 11 are adapted to seal the end of an object. In particular, the upper sealing member 110 and lower sealing member 111 of sealing device 11 are adapted to seal the end of an object having an opening.

[0025] Figure 3 , Figure 5 , Figure 7 and Figure 9 This is a front view of a wafer sealing device 1 according to some embodiments of the present invention. Figure 4 , Figure 6 , Figure 8 and Figure 10 This is a top view of a wafer sealing device 1 according to some embodiments of the present invention. (Refer to...) Figure 6 The wafer sealing device 1 includes a sealing bag 16 and a nitride-based semiconductor wafer 17. The nitride-based semiconductor wafer 17 is disposed in the sealing bag 16, and the sealing bag 16 is clamped by clamps 12 and 13. Clamps 12 and 13 clamp different sides of the sealing bag 16. Specifically, the sealing bag 16 has an opening located at its end 160, and clamps 12 and 13 clamp different sides of the opening of the sealing bag 16. In other words, clamps 12 and 13 hold different sides of the sealing bag 16.

[0026] Connectors 14 and 15 move clamps 12 and 13 and sealing bag 16 towards sealing device 11 along direction d2, and sealing device 11 is configured to heat-seal the opening of the sealing bag. Specifically, after clamps 12 and 13 clamp the sealing bag 16 along direction d3, the end 160 of the sealing bag 16 located between clamps 12 and 13 remains flat. The portion of the sealing bag 16 between clamps 12 and 13 is wrinkle-free and, as... Figure 5 The upper sealing member 110 shown is configured together with the lower sealing member 111 to clamp and heat the end 160 of the sealed bag 16.

[0027] Reference Figure 7 The upper sealing member 110 and the lower sealing member 111 clamp and heat the end of the sealing bag 16, and the nitride-based semiconductor wafer 17 is sealed in the sealing bag 16.

[0028] During the sealing process, the operator only contacts the clamps 12 and 13, and can seal the sealing bag 16 without contacting the upper sealing member 110 or the lower sealing member 111 of the sealing device 11. Therefore, the sealing process is safe. Furthermore, the clamps 12 and 13 can properly hold the sealing bag 16, and the end 160 of the sealing bag 16 remains flat throughout the sealing process. Therefore, the sealing bag 16 can be sealed without wrinkles, and the nitride-based semiconductor wafer 17 can be properly sealed.

[0029] Below, we will refer to Figures 3-10 The operation method of the wafer sealing device 1 according to some embodiments of the present invention is described.

[0030] Reference Figure 3 and Figure 4 The operation method of the wafer sealing device 1 includes placing a nitride-based semiconductor wafer 17 in a sealing bag 16.

[0031] In this embodiment, the nitride-based semiconductor wafer 17 has a plurality of HEMT devices. Specifically, the nitride-based semiconductor wafer 17 has a first nitride layer and a second nitride layer. The second nitride layer is disposed on the first nitride layer, the band gap of the second nitride layer is larger than that of the first nitride layer, and a 2DEG region is formed near the interface between the first nitride layer and the second nitride layer. The first nitride layer and the second nitride layer form the HEMT device. For example, the first nitride layer may include gallium nitride (GaN), and the second nitride layer may include aluminum gallium nitride (AlGaN).

[0032] Specifically, exemplary materials for the nitride layer may include, but are not limited to, nitrides or group III-V compounds such as GaN, AlN, InN, and In x Al y Ga (1-x-y)N (where x + y ≤ 1), or Al y Ga (1-y) N (where y ≤ 1).

[0033] An exemplary material for the nitride layers is chosen such that the band gap (i.e., bandgap width) of the second nitride layer is larger than that of the first nitride layer, thereby creating different electron affinities and forming a heterojunction therebetween. In this way, the nitride layers can be used as both a channel layer and a barrier layer. A triangular well potential is generated at the bonding interface between the channel layer and the barrier layer, allowing electrons to accumulate in the triangular well potential, thereby creating a two-dimensional electron gas (2DEG) region adjacent to the heterojunction.

[0034] The sealed bag 16 has an opening located at end 160. The nitride-based semiconductor wafer 17 is disposed in the sealed bag through the opening at end 160.

[0035] Reference Figure 5 and Figure 6 After the nitride-based semiconductor wafer 17 is placed in the sealed bag 16, the wafer sealing device 1 is operated by clamping different sides of the sealed bag 16 with clamps 12 and 13.

[0036] Reference Figure 1 Clamp 13 is located near clamp 12, and a gap g1 is left between them. For example, in direction d1, the gap g1 ranges from 41 cm to 54 cm. Therefore, as... Figure 6 As shown, clamps 12 and 13 can properly hold a sealed bag 16 containing a nitride-based semiconductor wafer 17.

[0037] Furthermore, in some embodiments, clamps 12 and 13 simultaneously clamp the sealed bag 16. Clamps 12 and 13 clamp the sealed bag 16 simultaneously without creating wrinkles, and the operator can effectively hold the sealed bag 16 using clamps 12 and 13.

[0038] Reference Figure 7 and Figure 8 After the sealed bag 16 is clamped, the operation method of the wafer sealing device 1 includes heat sealing the sealed bag 16 with the upper sealing member 110 and the lower sealing member 111.

[0039] like Figure 6 As shown, the sealing device 11 clamps and heats the end 160 of the sealing bag 16 using the upper sealing member 110 and the lower sealing member 111. The sealing bag 16 held by the clamps 12 and 13 is wrinkle-free, so the sealing device 11 can properly heat seal the sealing bag 16.

[0040] Reference Figure 1 and Figure 2The wafer sealing device 1 includes a vacuum nozzle 18, and the step of heat-sealing the sealing bag 16 includes evacuating the sealing bag 16 using the vacuum nozzle 18. The vacuum nozzle 18 is disposed between the upper sealing member 110 and the lower sealing member 111. The vacuum nozzle 18 is configured to insert into the sealing bag 16 and evacuate it, such as... Figure 8 As shown. Therefore, the sealed bag 16 containing the nitride-based semiconductor wafer 17 can be evacuated before sealing to properly seal and protect the nitride-based semiconductor wafer 17.

[0041] In one aspect, clamps 12 and 13 are configured to move along direction d2, and the method of operation includes moving clamps 12 and 13 toward the upper sealing member 110 and the lower sealing member 111. After clamping different sides of the sealing bag 16, clamps 12 and 13 are moved to reduce the distance between clamps 12 and 13 and the sealing device 11, so that the end of the sealing bag 16 is located between the upper sealing member 110 and the lower sealing member 111, and the sealing bag 16 can be sealed by the upper sealing member 110 and the lower sealing member 111 of the sealing device 11.

[0042] Specifically, connectors 14 and 15 control the movement of clamps 12 and 13, so clamps 12 and 13 can only move along direction d2. When the upper sealing member 110 and the lower sealing member 111 extend in direction d1 and direction d1 is perpendicular to direction d2, the sealing device 11 can properly seal the sealing bag 16.

[0043] In one aspect, after heat-sealing the bag 16, the method of operation includes using connectors 14 and 15 to push clamps 12 and 13 away from the upper sealing member 110 and the lower sealing member 111.

[0044] In this embodiment, connector 14 is configured to push clamp 12 away from sealing device 11 along direction d2, and connector 15 is configured to push clamp 13 away from sealing device 11 along direction d2. After heat-sealing the sealing bag 16, connectors 14 and 15 can move the sealing bag 16 away from sealing device 11, so that the operator can easily remove the sealing bag 16 from clamps 12 and 13 without the sealing bag 16 coming into contact with sealing device 11 again.

[0045] refer to Figure 9 and Figure 10 After sealing the sealing bag 16, the operation method of the wafer sealing device 1 includes removing the sealing bag 16 from the clamps 12 and 13. By releasing the sealing bag 16 from the clamps 12 and 13, the sealing process of the nitride-based semiconductor wafer 17 in the sealing bag 16 is completed, and the nitride-based semiconductor wafer 17 is properly sealed.

[0046] In this method, the operator does not need to hold the sealing bag with their hands or touch the heat-sealed area. This method can safely seal the nitride-based semiconductor wafer 17.

[0047] Reference Figure 3 In this embodiment, clamp 12 includes a lower part 120, an upper part 121 and a clamp connector 122, and clamp 13 includes a lower part 130, an upper part 131 and a clamp connector 132.

[0048] The lower part 120 is disposed on the bearing surface 100, and the upper part 121 is disposed on the lower part 120. A clamp connector 122 connects the upper part 121 and the lower part 120. The upper part 121 is configured to move towards the lower part 120 along direction d3, and the clamp connector 122 is configured to adjust the distance between the upper part 121 and the lower part 120. In other words, the clamp connector 122 can hold the upper part 121 at a certain height, keeping the clamp 12 in an open state. Furthermore, the clamp connector 122 can hold the upper part 121 at a lower height, with the upper part 121 contacting the lower part 120, keeping the clamp 12 in a closed state, thus securely holding the sealed bag 16, such as... Figure 5 As shown.

[0049] A lower part 130 is disposed on a bearing surface 100, and an upper part 131 is disposed on the lower part 130. A clamp connector 132 connects the upper part 131 and the lower part 130. The upper part 131 is configured to move towards the lower part 130 in the direction d3, and the clamp connector 132 is configured to adjust the distance between the upper part 131 and the lower part 130. In other words, the clamp connector 132 can hold the upper part 131 at a certain height, so that the clamp 13 is in the open state. Furthermore, the clamp connector 132 can hold the upper part 131 at a lower height, and the upper part 131 contacts the lower part 130, so that the clamp 13 is in the closed state, which can securely hold the sealed bag 16, such as... Figure 5 As shown.

[0050] Adjusting the upper parts 131 and 121 via clamp connectors 122 and 132, clamps 12 and 13 can hold the sealed bag 16 in place. Figure 5 As shown, it will not form wrinkles on the sealed bag 16. Furthermore, see reference... Figure 2 and Figure 3 The lower part 120 is connected to connector 14, and the lower part 130 is connected to connector 15. By pushing the lower parts 120 and 130, the operator can move the sealing bag 16 toward the sealing device 11, and the end 160 of the sealing bag 16 can be moved to a position between the upper sealing member 110 and the lower sealing member 111. The operator will not contact the sealing device 11, and the sealing process is safe and effective because no wrinkles are formed during the process.

[0051] Reference Figure 3In this embodiment, the bearing surface 100 of the support platform 10 is made of a paramagnetic or ferromagnetic material. The clamp 12 includes at least one clamp magnet 123, which is embedded in the bottom of the lower portion 120. The lower surface of the clamp magnet 123 is coplanar with the lower surface of the lower portion 120, and the clamp magnet 123 is connected to the lower portion 120. The bearing surface 100 is attracted by the clamp magnet 123 in the lower portion 120; therefore, the clamp 12 is attracted by the bearing surface 100. When the clamp 12 is attracted by the bearing surface 100, the clamp 12 can move along the bearing surface 100 as shown... Figure 2 Move in the direction d2 shown.

[0052] Reference Figure 3 The clamp 13 includes at least one clamp magnet 133, which is embedded in the bottom of the lower portion 130. The lower surface of the clamp magnet 133 is coplanar with the lower surface of the lower portion 130, and the clamp magnet 133 is connected to the lower portion 130. The bearing surface 100 is attracted by the clamp magnet 133 in the lower portion 130, therefore, the clamp 13 is attracted by the bearing surface 100. When the clamp 13 is attracted by the bearing surface 100, the clamp 13 can move along the bearing surface 100 as shown in the figure. Figure 2 Move in the direction d2 shown.

[0053] Because the lower parts 120 and 130 are attracted by the bearing surface 100, therefore... Figure 4 As shown, clamps 12 and 13 can clamp and hold the sealed bag 16 containing the nitride-based semiconductor wafer 17 without moving or tilting.

[0054] Figure 11 It is along Figure 4 The side section view of the cutting plane line L1 in the diagram. Figure 12 It is along Figure 4 A cross-sectional view of the other side of the cutting plane line L2. In this embodiment, the clamp connector 122 includes a handle 1220, a locking member 1221, and a connecting member 1222.

[0055] In the clamp connector 122, a handle 1220 is disposed on the top of the upper part 121. A locking member 1221 includes at least one protrusion 1223 disposed on its side. A connecting member 1222 connects the handle 1220 and the locking member 1221.

[0056] The connecting member 1222 extends along direction d3. The locking member 1221 is inserted into the lower part 120 and is adapted to hold the position of the clamp connector 122 in direction d3.

[0057] Specifically, the height of the clamp connector 122 is controlled by the orientation of the protrusion 1223 of the locking component 1221. When the protrusion 1223 protrudes along the direction d1, the clamp connector 122 can move to a height h1.

[0058] Figure 13 It is along Figure 6 The side section view of the cutting plane line L3 in the diagram. Figure 14 It is along Figure 6 The cross-sectional view on the other side of the cutting plane line L4. When the protruding structure 1223 protrudes along direction d2, the clamp connector 122 can move to height h2. Height h1 is greater than height h2.

[0059] The connecting member 1222 of the clamp connector 122 is inserted into the upper part 121, and the connecting member 1222 is rotatably connected to the upper part 121. Specifically, the clamp 12 includes a connecting member 126 disposed between the connecting groove of the upper part 121 and the connecting groove of the connecting member 1222. The connecting groove of the upper part 121 and the connecting groove of the connecting member 1222 form a receiving space for accommodating the connecting member 126. For example, the connecting member 126 includes a plurality of balls, and the connecting member 126 connects the upper part 121 and the connecting member 1222, and the connecting member 1222 is rotatable in the upper part 121 while simultaneously limiting the position of the upper part 121 in the direction d3.

[0060] In some embodiments, the connecting member 126 may be an O-ring or any other component adapted to rotate the connecting member 1222.

[0061] Reference Figure 11 When the clamp connector 122 has a height h1, the connecting member 1222 moves the upper part 121 away from the lower part 120. A space is left between the upper part 121 and the lower part 120, and as... Figure 4 The sealed bag 16 shown can be easily inserted into the space.

[0062] Reference Figure 14 When the clamp connector 122 has a height h2, the connecting member 1222 moves the upper part 121 toward the lower part 120. There is no space between the upper part 121 and the lower part 120, and as... Figure 4 The sealed bag 16 shown can be securely clamped.

[0063] Therefore, the clamp connector 122 connects the upper part 121 and the lower part 120, and the clamp connector 122 can adjust and maintain the distance between the upper part 121 and the lower part 120, so that the clamp 12 can remain open or closed. Furthermore, by pushing the upper part 121 and rotating the clamp connector 122, the operator can change the clamp 12 to the closed state. By rotating the clamp connector 122 again, the operator can release the clamp 12 and change it to the open state. Therefore, the clamp 12 can be easily controlled via the clamp connector 122.

[0064] In this embodiment, the clamp connector 132 also includes a handle, a locking component, and a connecting component, similar to the handle 1220, locking component 1221, and connecting component 1222. The components of the clamp connector 132 and their connections are similar to those of the clamp connector 122. The construction of the clamp connector 122 can be applied to the clamp connector 132. For example, the relationship between the handle 1220, locking component 1221, and connecting component 1222 can be applied to the relationship between the handle, locking component, and connecting component of the clamp connector 132; therefore, their relationships can be similar or identical, and specific details will not be repeated here.

[0065] Reference Figure 12 In this embodiment, the lower portion 120 has a guide hole 1200. The guide hole 1200 includes a rotating portion 1201 and a vertical movement portion 1202. The vertical movement portion 1202 is disposed on the rotating portion 1201.

[0066] The locking member 1221 of the clamp connector 122 is inserted into the guide hole 1200. The locking member 1221 is configured to rotate in the rotating portion 1201 and to move in the vertical movement portion 1202 along the direction d3 without rotating.

[0067] Reference Figure 14 The horizontal cross-section of the rotating portion 1201 of the guide hole 1200 is circular, and the diameter of this circle is the same as the longest horizontal width w1 of the locking member 1221. Therefore, the locking member 1221 can rotate horizontally in the rotating portion 1201.

[0068] In this embodiment, the horizontal cross-section of the vertically moving portion 1202 of the guide hole 1200 is a rounded rectangle (or a square-oval shape), and the shape of this cross-section is similar to the horizontal cross-section of the protrusion structure 1223 of the locking member 1221. Therefore, the locking member 1221 cannot rotate in the vertically moving portion 1202, and the locking member 1221 can only move along direction d3 without rotating.

[0069] In this embodiment, the lower portion 130 also includes a guide hole similar to the guide hole 1200. The components of the lower portion 130 and their connections are similar to those of the lower portion 120. The configuration of the lower portion 120 can be applied to the lower portion 130. For example, the relationship between the rotating portion 1201 and the vertically moving portion 1202 can be applied to the relationship between the rotating portion and the vertically moving portion of the guide hole in the lower portion 130, so their relationships can be similar or identical, and specific details will not be repeated here.

[0070] Reference Figure 3 The lower part 120 can control the position of the clamp connector 122 through the guide hole 1200, and can adjust the height of the clamp connector 122, thereby easily and effectively changing the clamp 12 between the open and closed states. Furthermore, the lower part 130 can control the position of the clamp connector 132 through the guide hole, and can adjust the height of the clamp connector 132, thereby easily and effectively changing the clamp 13 between the open and closed states.

[0071] Reference Figure 11 In this embodiment, the lower part 120 includes a guide rod 1203 and a helical spring 1204. The guide rod 1203 is disposed at the bottom of the guide hole 1200, and the helical spring 1204 surrounds the guide rod 1203.

[0072] The locking member 1221 of the clamp connector 122 has a receiving hole 1224, and the guide rod 1203 is inserted into the receiving hole 1224. A coil spring 1204 supports the bottom of the locking member 1221.

[0073] The guide rod 1203 can be guided and moved into the locking member 1221 of the clamp connector 122. Therefore, the clamp connector 122 will move in the direction d3. In addition, the guide rod 1203 also guides the helical spring 1204, so that the helical spring 1204 can push the clamp connector 122 in the direction d3.

[0074] Specifically, refer to Figure 14 When the clamp connector 122 moves to the lower position, the helical spring 1204 is compressed, the guide rod 1203 moves into the locking member 1221, and the height of the clamp connector 122 decreases. Therefore, the clamp 12 can be in a closed state. Due to the pushing force of the helical spring 1204, the bottom of the locking member 1221 with the protruding structure 1223 is pushed to the top of the rotating portion 1201 of the guide hole 1200. Therefore, the clamp connector 122 can be held at a certain height.

[0075] refer to Figure 11After rotation, the protrusion 1223 of the locking component 1221 is released from the rotating portion 1201, and the clamp connector 122 is pushed to the top of the vertical movement portion 1202, as... Figure 12 As shown, the height of the clamp connector 122 is increased. Therefore, the clamp 12 can be in the open state, and the clamp connector 122 can be held at a certain height.

[0076] In this embodiment, the lower part 130 also includes a guide rod and a coil spring, similar to guide rod 1203 and coil spring 1204. The components of the lower part 130 and their connections are similar to those of the lower part 120. The construction of the lower part 120 can be applied to the lower part 130. For example, the relationship between guide rod 1203 and coil spring 1204 can be applied to the relationship between guide rod and coil spring in the lower part 130, so their relationships can be similar or identical, and specific details will not be repeated here.

[0077] In one respect, refer to Figure 3 The clamp 12 includes an upper elastic layer 124, and the clamp 13 includes an upper elastic layer 134. The upper elastic layer 124 is disposed on the upper pressure surface 1210 of the upper part 121, and the upper elastic layer 134 is disposed on the upper pressure surface 1310 of the upper part 131.

[0078] The upper pressure surface 1210 faces the lower part 120, and the upper pressure surface 1310 faces the lower part 130. The upper pressure surface 1210 is located near the side 1211 of the upper part 121 of the clamp 13, and the upper pressure surface 1310 is located near the side 1311 of the upper part 131 of the clamp 12.

[0079] The upper pressure surface 1210 is horizontal and configured to move toward the lower portion 120. Therefore, the upper elastic layer 124 can be compressed between the upper portion 121 and the lower portion 120, and one side of the sealed bag can be securely held between the upper elastic layer 124 and the lower portion 120. In some embodiments, a thinner gap can be maintained between the upper elastic layer 124 and the lower portion 120 when the upper elastic layer 124 moves to a lower position, but the invention is not limited thereto.

[0080] Reference Figure 3 The upper pressure surface 1310 is horizontal and configured to move downwards towards the lower portion 130. Therefore, the upper elastic layer 134 can be compressed between the upper portion 131 and the lower portion 130, and one side of the sealed bag can be securely held between the upper elastic layer 134 and the lower portion 130. In some embodiments, a thinner gap can be maintained between the upper elastic layer 134 and the lower portion 130 when the upper elastic layer 134 moves to a lower position, but the invention is not limited thereto.

[0081] For example, the materials of the upper elastic layer 124 and the upper elastic layer 134 may include sponge. In some embodiments, the materials of the upper elastic layer 124 and the upper elastic layer 134 may include vulcanized rubber.

[0082] In one aspect, the clamp 12 of this embodiment includes a lower elastic layer 125, and the clamp 13 includes a lower elastic layer 135. The lower elastic layer 125 is disposed on the lower pressure surface 1205 of the lower portion 120, and the lower elastic layer 135 is disposed on the lower pressure surface 1305 of the lower portion 130.

[0083] In this embodiment, the projection of the upper pressure surface 1210 onto the lower portion 120 is close to the lower pressure surface 1205, and the projection of the upper pressure surface 1310 onto the lower portion 130 is close to the lower pressure surface 1305. Specifically, when the upper portion 121 is in a lower position, the upper elastic layer 124 is exactly next to the lower elastic layer 125, and the lower elastic layer 125 is adjacent to the upper elastic layer 124. Moreover, when the upper portion 131 is in a lower position, the upper elastic layer 134 is exactly next to the lower elastic layer 135, and the lower elastic layer 135 is adjacent to the upper elastic layer 134.

[0084] In this embodiment, the upper pressure surface 1210 and the lower pressure surface 1205 are parallel. When the clamp 12 is in the closed state, the upper elastic layer 124 and the lower elastic layer 125 are aligned. Therefore, when the upper part 121 presses against the lower part 120 through the upper elastic layer 124, the lower elastic layer 125 can provide support, and the upper part 121 will not tilt. In other words, the clamp 12 can properly clamp one side of the sealed bag through the support of the lower elastic layer 125.

[0085] Furthermore, the upper pressure surface 1310 and the lower pressure surface 1305 are parallel. When the clamp 13 is in the closed state, the upper elastic layer 134 and the lower elastic layer 135 are aligned. Therefore, when the upper part 131 presses against the lower part 130 through the upper elastic layer 134, the lower elastic layer 135 can provide support, and the upper part 131 will not tilt. In other words, the clamp 13 can properly clamp one side of the sealed bag through the support of the lower elastic layer 135.

[0086] In one aspect, in this embodiment, the top surface 1206 of the lower portion 120 and the top surface 1112 of the lower sealing member 111 are coplanar, and the top surface 1206 of the lower portion 120 is close to the clamp 13. The top surface 1306 of the lower portion 130 and the top surface 1112 of the lower sealing member 111 are coplanar, and the top surface 1306 of the lower portion 130 is close to the clamp 12.

[0087] In this embodiment, the top surface 1206 of the lower portion 120, the top surface 1306 of the lower portion 130, and the top surface 1112 of the lower sealing member 111 are coplanar. Therefore, when the sealing bag is placed on the top surfaces 1206 and 1306, the sealing bag will be held at the appropriate height, and the sealing bag can be easily inserted between the upper sealing member 110 and the lower sealing member 111. In other words, the sealing bag will be aligned with the space between the upper sealing member 110 and the lower sealing member 111 without needing to be held by hand, and the sealing bag can be effectively sealed.

[0088] Figure 15 It is along Figure 4 The image shows a side cross-sectional view of the cutting plane line L5. In this embodiment, the connector 14 includes a cover 140, a coil spring 141, a cover 142, a coil spring 143, and a retaining member 144. The cover 140 is embedded in the clamp 12, and the coil spring 141 is disposed in the cover 140. The cover 142 is embedded in the lower sealing member 111, and the coil spring 143 is disposed in the cover 142. The retaining member 144 is disposed between the cover 140 and the cover 142. The coil spring 141 contacts the retaining member 144, and the coil spring 143 contacts the retaining member 144.

[0089] A coil spring 141 pushes open the cover 140 and the retaining member 144, and a coil spring 143 pushes open the cover 142 and the retaining member 144. The cover 140 is connected to the lower part 120 of the clamp 12, and the cover 142 is connected to the lower sealing member 111. Therefore, without external force, the connector 14 can maintain a gap g2 along direction d2 between the clamp 12 and the lower sealing member 111. For example, the gap g2 can be 5 cm. In some embodiments of the invention, the gap g2 falls within the range of 3 cm to 8 cm. Therefore, when the operator loads the sealing bag onto the clamp 12, the clamp 12 and the lower sealing member 111 can maintain a safe distance.

[0090] In this embodiment, connector 15 also includes two covers, two coil springs, and a retaining member, similar to covers 140, 142, coil springs 141, 143, and retaining member 144. The components of connector 15 and their connections are similar to the components of connector 14 and their connections. The construction of connector 14 can be applied to connector 15. For example, the relationship between covers 140, 142, coil springs 141, 143, and retaining member 144 can be applied to the relationship between the covers, coil springs, and retaining member of connector 15; therefore, their relationships can be similar or identical, and specific details are not repeated here.

[0091] Specifically, the retaining member 144 includes an insertion portion 1440, an insertion portion 1441, and a retaining ring 1442. Insertion portion 1440 is inserted into cover 140, and insertion portion 1441 is inserted into cover 142. The retaining ring 1442 connects insertion portions 1440 and 1441. The cross-sectional area of ​​the retaining ring 1442 is larger than the cross-sectional areas of insertion portions 1440 and 1441. Furthermore, cover 140 has an opening 1400, and cover 142 has an opening 1420. Insertion portion 1440 is inserted into cover 140 through opening 1400, and insertion portion 1441 is inserted into cover 142 through opening 1420. The vertical cross-sectional area of ​​the retaining ring 1442 is larger than the vertical cross-sectional areas of openings 1400 and 1420, while insertion portions 1440 and 1441 are inserted into cover 140 and 142 respectively along the horizontal direction d2.

[0092] Figure 16 It is along Figure 8 The diagram shows a side cross-section of the cutting plane line L6. When connector 14 is compressed along direction d2, coil spring 141 is compressed by insertion portion 1440 and cover 140, and coil spring 143 is compressed by insertion portion 1441 and cover 142. Cover 140 and cover 142 abut against retaining ring 1442, thus retaining ring 1442 can maintain gap g3 between lower sealing member 111 and clamp 12. When clamp 12 clamps the sealing bag, gap g3 can determine the sealing position of the sealing bag. In other words, the sealing position can be properly controlled by connector 14.

[0093] Reference Figure 15 In this embodiment, cover 140 has a stop structure 1401 located at its end, and the stop structure 1401 surrounds opening 1400. Cover 142 has a stop structure 1421 located at its end, and the stop structure 1421 surrounds opening 1420. Retaining member 144 has a stop structure 1443 and a stop structure 1444, the stop structure 1443 being inserted into cover 140 and the stop structure 1444 being inserted into cover 142. When coil spring 141 is not compressed, retaining member 144 is pushed by coil spring 141, and stop structure 1401 abuts against stop structure 1443. Therefore, stop structure 1401 and stop structure 1443 maintain the connection between retaining member 144 and cover 140. When coil spring 143 is not compressed, retaining member 144 is pushed by coil spring 143, and stop structure 1421 abuts against stop structure 1444. Therefore, stop structures 1421 and 1444 maintain the connection between retaining member 144 and cover 142. Connector 14 can hold clamp 12 at an appropriate distance away from lower sealing member 111, and the sealing bag can be loaded without contacting lower sealing member 111.

[0094] In this embodiment, the retaining member of connector 15 further includes two insertion portions and a retaining ring, similar to insertion portions 1440, 1441 and retaining ring 1442. The components and connections of the retaining member of connector 15 are similar to the components and connections of the retaining member 144 of connector 14. The construction of the retaining member 144 of connector 14 can be applied to the retaining member of connector 15. For example, the relationship between insertion portions 1440, 1441 and retaining ring 1442 can be applied to the relationship between the insertion portions and retaining ring of the retaining member of connector 15; therefore, their relationships can be similar or identical, and specific details will not be repeated here.

[0095] Reference Figure 2 In this embodiment, the upper sealing member 110 includes a base 1100 and an upper sealing strip 1101. The upper sealing strip 1101 is configured to be heated during the sealing process, and is disposed on the base 1100, thus allowing the upper sealing strip 1101 to be connected to other devices via the base 1100. Furthermore, the lower sealing member 111 includes a base 1110 and a lower sealing strip 1111. The lower sealing strip 1111 is configured to be heated during the sealing process, and is disposed on the base 1110, thus allowing the lower sealing strip 1111 to be connected to other devices via the base 1110.

[0096] Reference Figure 15 The lower sealing component 111 includes a connecting base 1113 and a connecting plate 1114. The connecting base 1113 is embedded in the base 1110, and the connecting plate 1114 is connected to the connecting base 1113. A portion of the connector 14 is inserted into the connecting base 1113 through the connecting plate 1114. Specifically, the cover 142 of the connector 14 is inserted into the connecting base 1113 through the connecting plate 1114. Therefore, the connector 14 can connect the clamp 12 and the lower sealing component 111.

[0097] The connecting plate 1114 includes a connecting surface 1116 and at least one base magnet 1115, which is embedded in the periphery of the connecting surface 1116. The connecting surface 1116 faces the base 1110, and the connecting base 1113 is connected to the middle portion of the connecting surface 1116. Specifically, the base magnet 1115 is embedded in the connecting surface 1116 that is not connected to the connecting base 1113. The base 1110 surrounding the connecting base 1113 can be attracted by the base magnet 115, thus the base 1110 can securely hold the connector 14.

[0098] In this embodiment, the lower sealing component 111 also includes another connecting base and another connecting plate inserted by the connector 15, which are similar to the connecting base 1113 and the connecting plate 1114. The connecting base, the connecting plate, and their connections are similar to those of the connecting base 1113, the connecting plate 1114, and their connections. The construction of the connecting base 1113 and the connecting plate 1114 can be applied to connecting bases and connecting plates near the connector 15, and specific details will not be repeated here.

[0099] Figure 17 This is a front view of a wafer sealing device according to some embodiments of the present invention. Wafer sealing device 1A is similar to wafer sealing device 1. Wafer sealing device 1A includes a support stage 10, an upper sealing member 110, a lower sealing member 111, a clamp 12, and a clamp 13. Clamp 12 has a lower portion 120, an upper portion 121, and a clamp connector 122. Clamp 13 has a lower portion 130, an upper portion 131, and a clamp connector 132. The connections between these components are as described above and will not be repeated here.

[0100] In this embodiment, the wafer sealing device 1A includes a drive shaft 19, a drive shaft 20, and a drive motor 21. Drive shaft 19 is connected to a handle 1220 of a clamp connector 122, and drive shaft 20 is connected to a handle 1320 of a clamp connector 132. Drive motor 21 is connected to drive shafts 19 and 20. Drive motor 21 is configured to synchronously rotate handles 1220 and 1320 via drive shafts 19 and 20, respectively.

[0101] Therefore, clamps 12 and 13 can switch synchronously between closed and open states. By driving motor 21, clamps 12 and 13 can properly clamp the sealed bag and easily release it.

[0102] The operation method of the wafer sealing device 1A is similar to that of the wafer sealing device 1, and the operation method of the wafer sealing device 1A includes: Figure 4 As shown, clamps 12 and 13 are used to clamp the sealed bag 16 simultaneously.

[0103] The above description provided in this invention is for illustrative purposes and is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Many modifications and alterations will be apparent to those skilled in the art.

[0104] These embodiments were chosen and described in order to best explain the principles of the invention and its practical application, thereby enabling others skilled in the art to understand the various embodiments of the invention and the various modifications suitable for the intended particular use.

[0105] As used herein and unless otherwise defined, the terms “substantially,” “essentially,” “approximately,” and “about” are used to describe and indicate small variations. When used in conjunction with an event or situation, the term can include both cases where the event or situation occurred precisely and cases where the event or situation occurred approximately. For example, when used in conjunction with a numerical value, these terms can cover a range of variation less than or equal to ±10% of that value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term “substantially coplanar” can refer to two surfaces placed within a micrometer-scale distance along the same plane, such as two surfaces placed within a 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm distance along the same plane.

[0106] As used herein, the singular terms “an,” “an,” and “the” may include plural indicators unless the context clearly indicates otherwise. In the description of some embodiments, a component positioned “on another component” or “above another component” may cover a situation where the preceding component is directly positioned on the following component (e.g., in physical contact with the following component), and a situation where one or more intermediate components are located between the preceding and following components.

[0107] While the invention has been described and illustrated with reference to specific embodiments thereof, such descriptions and illustrations are not limiting. Those skilled in the art will understand that various changes and substitutions may be made without departing from the true spirit and scope of the invention as defined by the appended claims. Illustrations are not necessarily drawn to scale. Artistic representations of the invention may differ from actual devices due to manufacturing processes and tolerances. Furthermore, it should be understood that actual devices and layers may deviate from the rectangular layer depicted in the drawings due to manufacturing processes such as conformal deposition, etching, etc., and may include corner surfaces or edges, rounded corners, etc. Other embodiments of the invention may exist that are not specifically shown. The specification and drawings are intended to be illustrative rather than limiting. Modifications may be made to adapt particular circumstances, materials, compositions, methods, or processes to the objectives, spirit, and scope of the invention. All such modifications are included within the scope of the appended claims. While the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations may be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of the invention. Therefore, unless specifically indicated herein, the order and grouping of operations are not limiting.

Claims

1. A wafer sealing device, characterized in that, include: A support platform, which has a support surface; Upper sealing component; A lower sealing component, which together with the upper sealing component, is disposed at one end of the bearing surface; A first clamp is disposed on the bearing surface; A second clamp is disposed on the bearing surface; A first connector connects the first clamp and the lower sealing component; The second connector connects the second clamp and the lower sealing component; A sealed bag, held in place by a first clamp and a second clamp; and Nitride-based semiconductor wafers, which are housed in a sealed bag. The upper sealing member is disposed directly above the lower sealing member, and the upper sealing member is configured to clamp and heat one end of the sealed bag together with the lower sealing member; The first clamp and the second clamp clamp different sides of the sealed bag; The upper sealing member and the lower sealing member extend in a first direction, the first connector and the second connector are configured to move the first clamp and the second clamp in a second direction, respectively, and the first clamp and the second clamp are configured to clamp in a third direction, the first direction being perpendicular to the second direction, and the third direction being perpendicular to both the first direction and the second direction; The first connector includes: The first cover is embedded in the first clamp; A third helical spring is disposed in the first cover; The second cover is embedded in the lower sealing component; A fourth helical spring, which is disposed in the second cover; and A first retaining member is disposed between the first cover and the second cover. The third helical spring contacts the first retaining member, and the fourth helical spring contacts the first retaining member. The second connector includes: The third cover is embedded in the second clamp; A fifth helical spring is disposed in the third cover; The fourth cover is embedded in the lower sealing component; A sixth helical spring, which is disposed in the fourth cover; and A second retaining component is disposed between the third cover and the fourth cover. The fifth helical spring contacts the second retaining member, and the sixth helical spring contacts the second retaining member.

2. The wafer sealing device according to claim 1, characterized in that, It also includes a vacuum nozzle, wherein the vacuum nozzle is disposed between the upper sealing member and the lower sealing member, and the vacuum nozzle is configured to be inserted into the sealing bag and to evacuate it.

3. The wafer sealing device according to claim 1, characterized in that, The first fixture includes: The first lower part is disposed on the bearing surface; A first upper part, which is disposed on the first lower part; and A first clamp connector connects the first upper part and the first lower part. The second clamp includes: The second lower part is disposed on the bearing surface; The second upper part is disposed on the second lower part; The second clamp connector connects the second upper part and the second lower part. The first upper part is configured to move toward the first lower part along the third direction, and the second upper part is configured to move toward the second lower part along the third direction. The first clamp connector is configured to adjust the distance between the first upper part and the first lower part, and the second clamp connector is configured to adjust the distance between the second upper part and the second lower part.

4. The wafer sealing device according to claim 3, characterized in that, The bearing surface is made of paramagnetic or ferromagnetic material. The first clamp includes at least one first clamp magnet, and the first clamp magnet is embedded in the bottom of the first lower part. The second clamp includes at least one second clamp magnet, and the second clamp magnet is embedded in the bottom of the second lower part.

5. The wafer sealing device according to claim 3, characterized in that, The first clamp connector includes: A first handle is disposed on the top of the first upper part; A first locking component includes at least one first protrusion structure disposed on a side surface; and The first connecting component connects the first handle and the first locking component. The second clamp connector includes: The second handle is disposed on the top of the second upper part; The second locking component includes at least one second protrusion structure disposed on a side surface; and The second connecting component connects the second handle and the second locking component. The first connecting component and the second connecting component extend along the third direction. The first locking component is inserted into the first lower part, and the second locking component is inserted into the second lower part. The first locking component is adapted to hold the position of the first clamp connector in the third-party upward direction, and the second locking component is adapted to hold the position of the second clamp connector in the third-party upward direction.

6. The wafer sealing device according to claim 5, characterized in that, The first lower part has a first guide hole, and the first locking member is inserted into the first guide hole; the second lower part has a second guide hole, and the second locking member is inserted into the second guide hole. The first guide hole includes: The first rotating part; and The first vertical movement section is disposed on the first rotating section. The second guide hole includes: The second rotating part; and The second vertical movement section is disposed on the second rotating section. The first locking member is configured to rotate in the first rotating portion and move along the third direction in the first vertical moving portion, and the second locking member is configured to rotate in the second rotating portion and move along the third direction in the second vertical moving portion.

7. The wafer sealing device according to claim 6, characterized in that, The first lower part includes: A first guide rod is disposed at the bottom of the first guide hole; and A first helical spring surrounds the first guide rod. The second lower part includes: A second guide rod is disposed at the bottom of the second guide hole; and A second helical spring surrounds the second guide rod. The first locking component of the first clamp connector has a first receiving hole, the first guide rod is inserted into the first receiving hole, and the first helical spring supports the bottom of the first locking component. The second locking component of the second clamp connector has a second receiving hole, the second guide rod is inserted into the second receiving hole, and the second helical spring carries the bottom of the second locking component.

8. The wafer sealing device according to claim 5, characterized in that, Also includes: A first drive shaft is connected to the first handle; A second drive shaft is connected to the second handle; as well as The drive motor is connected to the first drive shaft and the second drive shaft. The drive motor is configured to synchronously rotate the first handle and the second handle via the first drive shaft and the second drive shaft, respectively.

9. The wafer sealing device according to claim 3, characterized in that, The first clamp includes a first upper elastic layer, which is disposed on the first upper pressure surface of the first upper part; The second clamp includes a second upper elastic layer, which is disposed on the second upper pressure surface of the second upper part; The first upper pressure surface faces the first lower part, the second upper pressure surface faces the second lower part, the first upper pressure surface is located near one side of the first upper part near the second clamp, and the second upper pressure surface is located near one side of the second upper part near the first clamp.

10. The wafer sealing device according to claim 9, characterized in that, The first clamp includes a first lower elastic layer, which is disposed on the first lower pressure surface of the first lower part; The second clamp includes a second lower elastic layer, which is disposed on the second lower pressure surface of the second lower part. The first downward pressure surface faces the first upper part, and the second downward pressure surface faces the second upper part; The projection of the first upper pressure surface on the first lower part is close to the first lower pressure surface, and the projection of the second upper pressure surface on the second lower part is close to the second lower pressure surface.

11. The wafer sealing device according to claim 3, characterized in that, The top surface of the first lower part near the second clamp is coplanar with the top surface of the lower sealing member, and the top surface of the second lower part near the first clamp is coplanar with the top surface of the lower sealing member.

12. The wafer sealing device according to claim 1, characterized in that, The first retaining component includes: The first insertion portion is inserted into the first cover; The second insertion portion is inserted into the second cover; and A first retaining ring connects the first insertion portion and the second insertion portion. The second retaining component includes: The third insertion portion is inserted into the third cover; The fourth insertion portion is inserted into the fourth cover; and A second retaining ring connects the third insertion portion and the fourth insertion portion. Wherein, the cross-sectional area of ​​the first retaining ring is greater than the cross-sectional area of ​​the first insertion portion and the second insertion portion, and the cross-sectional area of ​​the second retaining ring is greater than the cross-sectional area of ​​the third insertion portion and the fourth insertion portion.

13. The wafer sealing device according to claim 1, characterized in that, The lower sealing component includes: Base; A lower sealing strip is disposed on the base; A first connecting base is embedded in the base; A first connecting plate is connected to the first connecting base; A second connecting base, which is embedded in the base; and The second connecting plate is connected to the second connecting base. In this configuration, a portion of the first connector is inserted into the first connecting base via a first connecting plate, and a portion of the second connector is inserted into the second connecting base via a second connecting plate.

14. The wafer sealing device according to claim 13, characterized in that, The first connecting plate includes: First connecting surface; and At least one first base magnet is embedded in the periphery of the first connecting surface. The second connecting plate includes: Second connecting surface; and At least one second base magnet is embedded in the periphery of the second connecting surface. The first connecting base is connected to the middle portion of the first connecting surface, and the second connecting base is connected to the middle portion of the second connecting surface.

15. A method for operating a wafer sealing device, characterized in that, The wafer sealing device is the wafer sealing device as described in any one of claims 1-14, and the operation method of the wafer sealing device includes: Nitride-based semiconductor wafers are placed in sealed bags; Clamp the sealed bag on different sides using the first clamp and the second clamp; The sealing bag is heat-sealed using an upper sealing component and a lower sealing component; and Remove the sealed bag from the first clamp and the second clamp. The wafer sealing device includes a support platform, an upper sealing component, a lower sealing component, a first clamp, and a second clamp. The carrier platform has a carrier surface, the upper sealing component and the lower sealing component are disposed at one end of the carrier surface, and the first clamp and the second clamp are disposed on the carrier surface.

16. The method of operating the wafer sealing device according to claim 15, characterized in that, The step of heat-sealing the sealed bag includes evacuating the sealed bag using a vacuum nozzle, wherein the vacuum nozzle is disposed between the upper sealing component and the lower sealing component.

17. The method of operating the wafer sealing device according to claim 15, characterized in that, After clamping different sides of the sealed bag, the method of operation includes moving the first clamp and the second clamp toward the upper sealing member and the lower sealing member, wherein the upper sealing member and the lower sealing member extend in a first direction, the first clamp and the second clamp are configured to move in a second direction, and the first direction is perpendicular to the second direction.

18. The method of operating the wafer sealing device according to claim 15, characterized in that, After heat-sealing the sealed bag, the operation method includes pushing the first clamp and the second clamp away from the upper sealing member and the lower sealing member respectively using a first connector and a second connector, wherein the wafer sealing device includes the first connector and the second connector, the first connector connecting the first clamp and the lower sealing member, and the second connector connecting the second clamp and the lower sealing member.

19. The method of operating the wafer sealing device according to claim 15, characterized in that, The first clamp and the second clamp simultaneously clamp the sealed bag.

20. A wafer sealing device, characterized in that, include: A sealing device located at one end of the bearing surface; A first clamp is disposed on the bearing surface; A second clamp is disposed on the bearing surface; A sealed bag, held in place by the first clamp and the second clamp; and Nitride-based semiconductor wafers are disposed in the sealed bag. The first clamp and the second clamp clamp different sides of the opening of the sealed bag, the portion of the sealed bag between the first clamp and the second clamp is wrinkle-free, and the sealing device is configured to heat seal the opening of the sealed bag; The sealing device includes an upper sealing component and a lower sealing component, wherein the upper sealing component is disposed directly above the lower sealing component, and the upper sealing component is configured to clamp and heat the sealing bag together with the lower sealing component; A first connector connects the first clamp and the lower sealing component; The second connector connects the second clamp and the lower sealing component; The first connector includes: The first cover is embedded in the first clamp; A third helical spring is disposed in the first cover; The second cover is embedded in the lower sealing component; A fourth helical spring, which is disposed in the second cover; and A first retaining member is disposed between the first cover and the second cover. The third helical spring contacts the first retaining member, and the fourth helical spring contacts the first retaining member. The second connector includes: The third cover is embedded in the second clamp; A fifth helical spring is disposed in the third cover; The fourth cover is embedded in the lower sealing component; A sixth helical spring, which is disposed in the fourth cover; and A second retaining component is disposed between the third cover and the fourth cover. The fifth helical spring contacts the second retaining member, and the sixth helical spring contacts the second retaining member.

21. The wafer sealing device according to claim 20, characterized in that, The sealing device includes a vacuum nozzle disposed between the upper sealing component and the lower sealing component, and the vacuum nozzle is configured to be inserted into the sealing bag and evacuate it.

22. The wafer sealing device according to claim 20, characterized in that, The sealing device extends along a first direction, the first clamp and the second clamp are configured to move only along a second direction, and the first direction is perpendicular to the second direction.

23. The wafer sealing device according to claim 20, characterized in that, Also includes: A first drive shaft is connected to the first clamp; A second drive shaft is connected to the second clamp; as well as A drive motor is connected to the first drive shaft and the second drive shaft. The drive motor is configured to synchronously control the first clamp and the second clamp via the first drive shaft and the second drive shaft, respectively.

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