Laser processing method and related apparatus

Abstract

The application relates to a laser processing method and a related device, and relates to the technical field of laser processing. A specific implementation of the method comprises the following steps: obtaining processing information of a target product, determining target incidence angle information corresponding to a laser beam according to the processing information; wherein the processing information comprises any one or more of a processing shape, a processing depth and a processing size; performing angle adjustment on the laser beam emitted by a laser device according to the target incidence angle information, and performing focusing processing on the laser beam after the angle adjustment to generate a focal spot with a target inclination angle; and placing the target product under the focal spot to perform laser processing on the target product through the focal spot. The implementation achieves the effects of flexible adjustment of a taper, improvement of laser processing efficiency and expansion of applicable scenarios of laser processing.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and in particular to a laser processing method and related equipment. Background Technology

[0002] Laser processing is a modern manufacturing technology that utilizes a focused laser beam to interact with materials, enabling a series of processing operations such as cutting, welding, marking, engraving, drilling, surface modification, and micromachining. This processing method is widely used in various industries, including aerospace, automotive manufacturing, electronics, medical devices, jewelry manufacturing, and scientific research, due to its high precision, high speed, low heat-affected zone, and flexibility.

[0003] During laser processing, because the laser beam is conical, especially when cutting thicker materials, it will produce a certain taper (i.e., the diameter of the cutting surface changes from the top to the bottom), which will cause the bottom of the cut to be wider than the top.

[0004] In related technologies, the taper generated by laser processing is generally adjusted by using four optical wedges, the taper generated by laser drilling is adjusted based on the Dowell prism, or the taper of laser processing is adjusted by using a 5D galvanometer. However, these technologies have problems such as poor taper adjustment flexibility, many processing size limitations, high equipment assembly precision, high processing cost, high equipment operation difficulty, high parameter design difficulty, low laser processing efficiency, and narrow applicable scenarios for laser processing.

[0005] There is currently no effective solution to the above problems. Summary of the Invention

[0006] The laser processing method and related equipment provided in this invention at least solve the problems existing in related laser processing technologies, such as poor taper adjustment flexibility, many processing size limitations, high equipment assembly precision, high processing cost, high equipment operation difficulty, high parameter design difficulty, low laser processing efficiency, and narrow applicable scenarios for laser processing.

[0007] To address the above problems, one aspect of this invention provides a laser processing method, comprising: Obtain the processing information of the target product, and determine the target incident angle information of the laser beam based on the processing information; wherein, the processing information includes any one or more of the processing shape, processing depth and processing size; The laser beam emitted by the laser is adjusted according to the target incident angle information, and the adjusted laser beam is focused to produce a focal spot with the target tilt angle. The target product is placed under the focal spot so that it can be laser-processed through the focal spot.

[0008] In some embodiments, if the target incident angle information determined based on the processing information indicates multiple target incident angle values, the method further includes: Obtain the material information of the target product in order to determine the processing efficiency of the laser beam's focal spot on the target product based on the material information; Based on processing information and processing efficiency, determine the adjustment sequence and frequency corresponding to multiple target incident angle values; During the laser processing of the target product through the focal spot, the angle of the laser beam emitted by the laser is adjusted according to the adjustment sequence, adjustment frequency and target incident angle information.

[0009] In some embodiments, the method further includes: Configure the movement trajectory of the target product during laser processing based on the processing information; During the laser processing of the target product using a focused spot, the target product is moved according to the movement trajectory, the adjustment sequence of the laser beam's incident angle value, and the adjustment frequency.

[0010] In some embodiments, the steps of controlling the movement of the target product according to the movement trajectory, the adjustment sequence of the target incident angle value corresponding to the laser beam, and the adjustment frequency include: The target product is placed on a moving platform. The moving trajectory and moving speed of the moving platform are controlled according to the moving trajectory, the adjustment sequence and adjustment frequency of the target incident angle value corresponding to the laser beam, so as to realize laser processing of the target product through the focal spot.

[0011] In some embodiments, prior to the step of adjusting the angle of the laser beam emitted by the laser based on the target incident angle information, the method further includes: The laser's emission power is obtained, and the beam expansion factor is determined based on the processing information and emission power, so that the laser beam can be expanded according to the beam expansion factor.

[0012] In some embodiments, prior to the step of adjusting the angle of the laser beam emitted by the laser based on the target incident angle information, the method further includes: The propagation direction of the laser beam is adjusted at least once so that the laser beam enters the angle adjustment module horizontally; wherein, the angle adjustment module is used to adjust the angle of the laser beam.

[0013] To address the above problems, one aspect of the present invention provides a laser processing system, comprising: The control module is used to acquire the processing information of the target product and determine the target incident angle information of the laser beam based on the processing information; wherein, the processing information includes any one or more of the processing shape, processing depth and processing size; An angle adjustment module is used to adjust the angle of the laser beam emitted by the laser according to the target incident angle information, and to focus the angle-adjusted laser beam to produce a focal spot with the target tilt angle. The processing module is used to place the target product under the focal spot so as to perform laser processing on the target product through the focal spot.

[0014] To address the aforementioned problems, one aspect of this invention provides a non-transitory machine-readable medium storing computer instructions for causing a computer to execute any of the laser processing methods described above.

[0015] To address the aforementioned problems, one aspect of this invention provides a computer program product, including a computer program / instructions, which, when executed by a processor, implement any of the laser processing methods described above.

[0016] The beneficial effects of this invention are as follows: by determining the target incident angle information of the laser beam through processing information, adjusting the laser beam angle based on the target incident angle, and then generating a focal spot with a target tilt angle through focusing processing, the laser processing operation on the target product is realized. This achieves the technical effects of flexibly adjusting the taper, reducing processing size limitations, reducing processing costs, reducing equipment operation difficulty and equipment assembly accuracy, reducing parameter design difficulty, improving laser processing efficiency, and expanding the applicable scenarios of laser processing.

[0017] Details of one or more embodiments of the present invention are set forth in the following drawings and description, so that other features, objects and advantages of the invention will be more readily understood. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other embodiments can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the main process of a laser processing method according to one embodiment of the present invention.

[0020] Figure 2 This is a schematic diagram showing the distance between the center point of the focal spot and the center point of the moving platform, determined for different aperture structures.

[0021] Figure 3 This is a schematic diagram of the hole structure obtained after processing a product based on the focal spot of different incident angles.

[0022] Figure 4 This is a schematic diagram of the main framework of a laser processing system according to one embodiment of the present invention.

[0023] Figure 5 This is a schematic diagram of a laser processing device provided in an embodiment of the present invention.

[0024] Figure 6 This is a schematic diagram of the electronic device of the present invention.

[0025] Figure label: 1--Laser; 2--Variable magnification beam expander; 3--First reflecting mirror; 4--Second reflecting mirror; 5--Beam tilt control module; 6--Focusing mirror; 7--Target product (i.e., product to be processed); 8--Moving platform; 9--Motor; 10--Central control system. Detailed Implementation

[0026] Embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While some embodiments of the invention are shown in the drawings, it should be understood that the invention can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the invention. It should be understood that the accompanying drawings and embodiments are for illustrative purposes only and are not intended to limit the scope of protection of the invention.

[0027] Laser processing, especially laser cutting and laser drilling, is prone to producing taper due to the focusing characteristics and thermal effects of the laser beam. When the laser beam is not precisely focused on the product surface or its stability is insufficient during processing, taper will occur on the cut surface or in the hole, affecting the processing accuracy and the adaptability of the processed parts. To effectively adjust the taper generated during laser processing, related technologies offer solutions from multiple perspectives, considering equipment performance, process parameter optimization, and post-processing strategies.

[0028] For example, in a scheme using four optical wedges to adjust the taper generated by laser processing, two large-angle optical wedges are used to translate the incident beam. The taper of the processed micro-hole is adjusted by changing the distance between the two large-angle optical wedges. Then, two small-angle optical wedges are combined to deflect the angle of the incident beam, causing the focused spot to deviate from the optical axis of the focusing lens. During operation, the four optical wedges rotate synchronously using servo motors, enabling the focal spot to rotate and scan around the optical axis of the focusing lens, while simultaneously feeding slightly along the optical axis, ultimately achieving the processing of micro-circular holes with different diameters, tapers, and depths. However, this scheme can only be used to process micro-circular holes, limiting the processing size. Another example is a scheme based on adjusting the taper generated by laser drilling using a Dowell prism. The Dowell prism is mounted on a high-speed rotating torque motor; one rotation of the prism allows the laser to rotate and scan twice. After collimation, the laser beam enters the Daowei prism after being deflected and translated laterally at the front end. Finally, it is focused onto the working plane by the focusing lens, realizing circumferential scanning drilling with different tapers. However, the Daowei prism in this solution requires extremely high assembly precision, and there are very few devices on the market that can truly be used for industrial processing, making the applicable scenarios for laser processing of this solution relatively narrow. Another example is the solution of using a 5D galvanometer to adjust the taper of laser processing. The galvanometer is rotated by a motor to control the lateral translation, tilt, and feed of the beam, thereby achieving continuous adjustment of the processing taper, depth, and size. However, the 5D galvanometer equipment in this solution is expensive and difficult to operate. When it is necessary to change the product to be processed or change the processing pattern, the software development and parameter design are more difficult.

[0029] In addition, a secondary processing scheme is provided in the related technology, which eliminates or reduces taper by performing additional finishing operations such as grinding, polishing or CNC (Computer Numerical Control, which uses computer numerical control technology to control laser processing equipment to perform precise operations) on the laser-processed product. This not only increases the cost of laser processing, but also prolongs the entire manufacturing cycle, resulting in low efficiency of laser processing.

[0030] To address the above problems, embodiments of the present invention provide a laser processing method, such as... Figure 1 As shown, this laser processing method mainly includes: Step S101: Obtain the processing information of the target product, and determine the target incident angle information corresponding to the laser beam based on the processing information; wherein, the processing information includes any one or more of the processing shape, processing depth and processing size.

[0031] The laser processing method provided in this embodiment of the invention is mainly used to adjust the taper generated during laser processing. Since taper is primarily generated during laser cutting and laser drilling, the processing information provided in this embodiment mainly includes the shape, depth, and size information of the hole to be processed. It is understood that other processing shapes, depths, and dimensions that may cause taper issues are also within the scope of protection claimed in this application.

[0032] By adjusting the laser beam's incident angle according to the specific requirements of the processing shape, depth, and size, the laser energy can be more precisely concentrated in the area to be processed. This allows for effective and flexible adjustment of the taper, improving laser processing accuracy, avoiding limitations on the size that can be processed, increasing laser processing efficiency, and expanding the applicable scenarios for laser processing. Simultaneously, different incident angles affect the material's absorption efficiency and heat conduction mode. Selecting the most suitable incident angle can increase material removal speed and reduce energy consumption. Precise control of the incident angle can effectively manage the size and shape of the heat-affected zone, helping to maintain the properties of surrounding materials or ensure the smooth progress of subsequent processing steps.

[0033] In some of these embodiments, machine learning and artificial intelligence technologies can also be used to automatically optimize laser processing parameters, including the incident angle, based on a large amount of processing data to achieve optimal processing results.

[0034] In some of these embodiments, the shape and distribution of the laser beam can also be altered using optical elements such as variable apertures and beam shapers.

[0035] In some embodiments, if the target incident angle information determined based on the processing information indicates multiple target incident angle values, the method further includes: obtaining the material information of the target product to determine the processing efficiency of the focal spot generated by the laser beam on the target product based on the material information; determining the adjustment order and adjustment frequency corresponding to the multiple target incident angle values ​​based on the processing information and processing efficiency; and adjusting the angle of the laser beam emitted by the laser according to the adjustment order, adjustment frequency and target incident angle information during the laser processing of the target product through the focal spot.

[0036] By analyzing the material of the target product, the focal spot energy efficiency (corresponding to the processing efficiency of the focal spot) under different materials can be determined, ensuring efficient utilization of laser energy, precise control, improved flexibility of taper adjustment, and enhanced processing accuracy and efficiency. Simultaneously, for complex workpieces with multi-dimensional features (corresponding to multiple target incident angle values), the laser incident angle can be adjusted as needed to meet the processing requirements of different areas, further expanding the applicable scenarios for laser processing. Furthermore, these settings also help reduce processing preparation time and intermediate adjustment steps, improving parameter design efficiency and thus increasing laser processing efficiency.

[0037] In some embodiments, multiple lasers at different angles can be set. After determining multiple target incident angles, the above effect can be achieved simply by determining the activation sequence of the lasers at different angles.

[0038] In some of these embodiments, an alternative is also provided, in which the angle of the laser beam is controlled by a preset program: a fixed processing path and angle sequence are set by software simulation before processing, in order to adapt to processing tasks that are highly repetitive but not flexible enough.

[0039] Step S102: Adjust the angle of the laser beam emitted by the laser according to the target incident angle information, and focus the laser beam after angle adjustment to generate a focal spot with the target tilt angle.

[0040] By precisely adjusting the incident angle of the laser beam, the distribution of laser energy can be optimized for different parts of the target product and processing requirements, reducing the heat-affected zone and avoiding deformation or damage caused by overheating (which also helps reduce costs), ensuring clear processing edges and precise dimensions. Simultaneously, there is a correspondence between the target tilt angle and the target incident angle; dynamically adjusting the incident angle can change the tilt angle of the focused spot, thereby flexibly adjusting the taper of the laser processing, improving processing flexibility and applicability. Furthermore, by focusing the laser beam to create a focal spot, laser energy can be concentrated in a very small area, forming a high-energy-density focal spot, which is beneficial for quickly and efficiently completing material removal, melting, or modification, improving processing efficiency.

[0041] In some embodiments, prior to the step of adjusting the angle of the laser beam emitted by the laser based on the target incident angle information, the method further includes: acquiring the emission power of the laser, determining the beam expansion factor based on the processing information and the emission power, and performing beam expansion processing on the laser beam according to the beam expansion factor.

[0042] By adjusting the beam expansion factor according to different processing information (such as material thickness, processing depth, speed, etc.) and laser emission power, the flexibility and adaptability of the processing process are enhanced, ensuring processing results under different conditions. Specifically, beam expansion can adjust the diameter and energy distribution of the laser beam to better suit specific processing needs. This helps to obtain a more uniform energy distribution on the processed surface, improves processing efficiency, avoids localized overheating, and reduces the heat-affected zone. At the same time, proper beam expansion can improve the precision and quality of laser processing, especially in applications requiring fine machining or large-scale uniform machining.

[0043] In some embodiments, the laser's emission power can be adjusted to meet processing requirements, without needing to adjust the beam expansion factor separately. It should be noted that while this method is simpler and faster, it may not be as effective as beam expansion in certain precision machining processes.

[0044] In some of these embodiments, the shape and energy distribution of the laser beam can be automatically adjusted to adapt to changes during the processing by using more sophisticated optical components, such as adaptive optics systems.

[0045] In some embodiments, prior to the step of adjusting the angle of the laser beam emitted by the laser based on the target incident angle information, the method further includes: adjusting the propagation direction of the laser beam at least once so that the laser beam enters the angle adjustment module horizontally; wherein the angle adjustment module is used to adjust the angle of the laser beam.

[0046] By pre-adjusting the propagation direction of the laser beam, it is ensured that the laser enters the angle adjustment module in the correct orientation. This is the foundation for subsequent precise angle control and avoids cumulative errors caused by initial directional deviations. Specifically, adjusting the laser beam to a horizontal direction before angle adjustment (i.e., pre-correcting the laser beam propagation direction) makes the angle adjustment module design simpler and more efficient, facilitates precise control, reduces mechanical or optical complexity, and helps improve the processing quality of the final product and the stability of the processing process. On the other hand, adjusting the propagation direction of the laser beam allows the angle adjustment module to focus more on its core function—angle adjustment—achieving a higher degree of freedom in laser processing taper adjustment, making the entire laser processing system more adaptable to different processing tasks.

[0047] In some of these embodiments, an integrated angle adjustment system may also be used: that is, an integrated module that can simultaneously correct the horizontal direction and perform specific angle adjustments is designed to further reduce the difficulty of equipment assembly and parameter design.

[0048] In some of these embodiments, dynamic optical path control technology may also be introduced: software-controlled dynamic optical path adjustment, such as using fast-response mirrors or fiber Bragg gratings, can be performed directly on the laser path in real time.

[0049] Step S103: Place the target product under the focal spot to perform laser processing on the target product through the focal spot.

[0050] By setting the target product at the focal spot (where energy density is highest), laser processing efficiency can be significantly improved, energy loss can be avoided, and efficient, precise, and high-quality processing operations can be achieved. Furthermore, in this state, the focal spot diameter is smaller, enabling micro-processing and helping to expand the precision and applicable scenarios of laser processing. Simultaneously, the focused focal spot can also limit the heat-affected zone, reducing thermal damage to surrounding materials and preserving their original properties.

[0051] It should be noted that in some cases, such as when a wider processing area is required or when heat impact needs to be reduced, the focus can be placed above or below the surface of the target product to form a larger processing area.

[0052] This invention also provides a specific implementation method for laser processing of a target product. By adjusting the incident angle of the laser beam emitted by the laser, the tilt of the focal spot generated by the laser beam is changed. When the target product rotates at high speed with the moving platform, the focal spot with a certain tilt angle forms a relatively high-speed rotating scan with the surface of the target product, thereby processing a micro-hole with a certain taper on the target product. The aperture R is equal to the sum of the focal spot diameter (φ) and the distance (r) between the center point of the moving platform and the center point of the focal spot, i.e., R = φ + r.

[0053] Figure 2 This diagram illustrates the distance *r* between the center point of the laser beam's focal spot and the center point of the moving platform, determined for different hole structures (i.e., machining shapes, including conical holes, conical holes with different slopes, flared holes, non-conical holes, and inverted conical holes). Figure 2 As can be seen, the focal spot is tilted (i.e., the aforementioned target tilt angle), and multiple laser beams converge at the focal point, which coincides with the surface of the target product. When the tilt of the focal spot is different, different hole structures can be formed during the processing as the target product rotates or moves up and down. A schematic diagram of the hole structures finally obtained based on different focal spots is shown below. Figure 3 As shown.

[0054] In some embodiments, the method further includes: configuring the movement trajectory of the target product during laser processing according to the processing information; and controlling the target product to move according to the movement trajectory, the adjustment sequence and adjustment frequency of the target incident angle value corresponding to the laser beam during the laser processing of the target product through the focal spot.

[0055] By configuring the movement trajectory corresponding to the target product based on the processing information, the laser spot at the focal point can be processed uniformly and accurately along the predetermined path, improving the flexibility of taper adjustment and increasing processing precision. Simultaneously, automated and precise movement control can be achieved, thereby reducing the impact of manual intervention on processing stability and improving the stability and batch processing efficiency of laser processing.

[0056] In some embodiments, the step of controlling the target product to move according to the adjustment order and adjustment frequency of the moving trajectory, the target incident angle value corresponding to the laser beam, includes: placing the target product on the moving platform, and controlling the moving trajectory and moving speed of the moving platform according to the adjustment order and adjustment frequency of the moving trajectory, the target incident angle value corresponding to the laser beam, so as to realize laser processing of the target product through the focal spot.

[0057] By placing the target product on the moving platform, the continuous and stable processing can be ensured because the moving speed of the platform matches the order and frequency of the adjustment of the focal spot angle. This avoids processing defects caused by inconsistency, improves the automation level of laser processing, helps optimize the processing flow, and further expands the applicable scenarios of laser processing.

[0058] To meet the requirements for the processing shape, depth, and size of the target product, it is necessary to move the target product during processing. It is understandable that the target product can also be kept stationary, and laser processing operations can be performed on the target product by moving the focal spot generated after the laser beam is focused (such as by moving the focal spot beam generated by moving the laser beam through a high-speed mirror array or beam deflector).

[0059] The laser processing method provided in this invention overcomes the problems of limited processing size, high equipment assembly precision, high processing cost, difficult equipment operation, difficult parameter design, low laser processing efficiency, and narrow applicable scenarios in related laser processing technologies by obtaining processing information of the target product, determining the target incident angle information of the laser beam based on the processing information, determining the target incident angle information of the laser beam based on the target incident angle, and then determining the target incident angle information of the laser beam based on the target incident angle information, and then determining the target incident angle information of the laser beam based on the target incident angle ... finally determining the target incident angle information of the laser beam based on the target incident angle, and then determining the target incident angle information of the laser beam based on the target incident angle, and finally determining the target incident angle information of the laser beam based on the target incident angle, and then determining the target incident angle information of the laser beam based on the target incident angle, and finally determining the target incident angle information of the laser beam based on the target incident angle, and then determining the target incident angle information of the laser beam based on the target incident angle, and finally determining the target incident angle information of the laser beam, and then determining the target incident angle information of the laser beam based on the target incident angle, and finally determining the target incident angle information

[0060] Based on the laser processing method provided in the embodiments of the present invention, the embodiments of the present invention also provide a laser processing system, such as... Figure 4 As shown, the laser processing system 400 mainly includes: The control module 401 is used to acquire the processing information of the target product and determine the target incident angle information corresponding to the laser beam based on the processing information; wherein, the processing information includes any one or more of the processing shape, processing depth and processing size.

[0061] By adjusting the laser beam's incident angle according to the specific requirements of the processing shape, depth, and size, the laser energy can be more precisely concentrated in the area to be processed. This allows for effective and flexible taper adjustment, improving laser processing accuracy, avoiding limitations on the size that can be processed, increasing laser processing efficiency, and expanding the applicable scenarios for laser processing. Simultaneously, different incident angles affect the material's absorption efficiency and heat conduction mode. Selecting the most suitable incident angle can increase material removal speed and reduce energy consumption. Precise control of the incident angle can effectively manage the size and shape of the heat-affected zone, helping to maintain the properties of surrounding materials or ensure the smooth progress of subsequent processing steps.

[0062] In some embodiments, if the target incident angle information determined based on the processing information indicates multiple target incident angle values, the control module 401 is further configured to: acquire the material information of the target product, so as to determine the processing efficiency of the laser beam's focal spot on the target product based on the material information; determine the adjustment order and adjustment frequency corresponding to the multiple target incident angle values ​​based on the processing information and processing efficiency; and adjust the angle of the laser beam emitted by the laser according to the adjustment order, adjustment frequency and target incident angle information during the laser processing of the target product through the focal spot.

[0063] By analyzing the material of the target product, the focal spot energy efficiency (corresponding to the processing efficiency of the focal spot) under different materials can be determined, ensuring efficient utilization of laser energy, precise control, improved flexibility of taper adjustment, and enhanced processing accuracy and efficiency. Simultaneously, for complex workpieces with multi-dimensional features (corresponding to multiple target incident angle values), the laser incident angle can be adjusted as needed to meet the processing requirements of different areas, further expanding the applicable scenarios for laser processing. Furthermore, these settings also help reduce processing preparation time and intermediate adjustment steps, improving parameter design efficiency and thus increasing laser processing efficiency.

[0064] Angle adjustment module 402 is used to adjust the angle of the laser beam emitted by the laser according to the target incident angle information, and to focus the laser beam after angle adjustment to generate a focal spot with the target tilt angle.

[0065] By precisely adjusting the incident angle of the laser beam, the distribution of laser energy can be optimized for different parts of the target product and processing requirements, reducing the heat-affected zone and avoiding deformation or damage caused by overheating (which also helps reduce costs), ensuring clear processing edges and precise dimensions. Simultaneously, there is a correspondence between the target tilt angle and the target incident angle; dynamically adjusting the incident angle can change the tilt angle of the focused spot, thereby flexibly adjusting the taper of the laser processing, improving processing flexibility and applicability. Furthermore, by focusing the laser beam to create a focal spot, laser energy can be concentrated in a very small area, forming a high-energy-density focal spot, which is beneficial for quickly and efficiently completing material removal, melting, or modification, improving processing efficiency.

[0066] In some embodiments, the laser processing system 400 further includes a beam expansion module. Before the step of adjusting the angle of the laser beam emitted by the laser according to the target incident angle information, the beam expansion module is used to: obtain the emission power of the laser, determine the beam expansion factor according to the processing information and the emission power, and perform beam expansion processing on the laser beam according to the beam expansion factor.

[0067] By adjusting the beam expansion factor according to different processing information (such as material thickness, processing depth, speed, etc.) and laser emission power, the flexibility and adaptability of the processing process are enhanced, ensuring processing results under different conditions. Specifically, beam expansion can adjust the diameter and energy distribution of the laser beam to better suit specific processing needs. This helps to obtain a more uniform energy distribution on the processed surface, improves processing efficiency, avoids localized overheating, and reduces the heat-affected zone. At the same time, proper beam expansion can improve the precision and quality of laser processing, especially in applications requiring fine machining or large-scale uniform machining.

[0068] In some embodiments, the laser processing system 400 further includes a reflector module. Before the step of adjusting the angle of the laser beam emitted by the laser according to the target incident angle information, the reflector module is used to: adjust the propagation direction of the laser beam at least once so that the laser beam enters the angle adjustment module horizontally; wherein the angle adjustment module is used to adjust the angle of the laser beam.

[0069] By pre-adjusting the propagation direction of the laser beam, it is ensured that the laser enters the angle adjustment module in the correct orientation. This is the foundation for subsequent precise angle control and avoids cumulative errors caused by initial directional deviations. Specifically, adjusting the laser beam to a horizontal direction before angle adjustment (i.e., pre-correcting the laser beam propagation direction) makes the angle adjustment module design simpler and more efficient, facilitates precise control, reduces mechanical or optical complexity, and helps improve the processing quality of the final product and the stability of the processing process. On the other hand, adjusting the propagation direction of the laser beam allows the angle adjustment module to focus more on its core function—angle adjustment—achieving a higher degree of freedom in laser processing taper adjustment, making the entire laser processing system more adaptable to different processing tasks.

[0070] The processing module 403 is used to place the target product under the focal spot so as to perform laser processing on the target product through the focal spot.

[0071] By setting the target product at the focal spot (where energy density is highest), laser processing efficiency can be significantly improved, energy loss can be avoided, and efficient, precise, and high-quality processing operations can be achieved. Furthermore, in this state, the focal spot diameter is smaller, enabling micro-processing and helping to expand the precision and applicable scenarios of laser processing. Simultaneously, the focused focal spot can also limit the heat-affected zone, reducing thermal damage to surrounding materials and preserving their original properties.

[0072] In some embodiments, the processing module 403 is further configured to: configure the movement trajectory of the target product during laser processing according to the processing information; and control the target product to move according to the movement trajectory, the adjustment order and adjustment frequency of the target incident angle value corresponding to the laser beam during the laser processing of the target product through the focal spot.

[0073] By configuring the movement trajectory corresponding to the target product based on the processing information, the laser spot at the focal point can be processed uniformly and accurately along the predetermined path, improving the flexibility of taper adjustment and increasing processing precision. Simultaneously, this enables automated and precise movement control, thereby reducing the impact of manual intervention on processing stability and improving the stability and batch processing efficiency of laser processing.

[0074] In some embodiments, the processing module 403 is further configured to: place the target product on the moving platform, and control the moving trajectory and moving speed of the moving platform according to the moving trajectory, the adjustment order and adjustment frequency of the target incident angle value corresponding to the laser beam, so as to realize laser processing of the target product through the focal spot.

[0075] Placing the target product on a moving platform ensures a continuous and stable processing flow, as the platform's movement speed matches the sequence and frequency of focal spot angle adjustments. This avoids processing defects caused by inconsistencies, improves the automation level of laser processing, helps optimize the processing flow, and further expands the applicable scenarios for laser processing. Alternatively, the target product can be kept stationary, and laser processing can be performed on the target product by moving the focal spot generated after the laser beam is focused (e.g., by moving the focal spot beam generated by a high-speed mirror array or beam deflector).

[0076] The laser processing system provided in this embodiment of the invention employs a control module for acquiring processing information of the target product and determining the target incident angle information of the laser beam based on the processing information; wherein the processing information includes any one or more of the processing shape, processing depth, and processing dimensions; an angle adjustment module for adjusting the angle of the laser beam emitted by the laser according to the target incident angle information and focusing the angle-adjusted laser beam to generate a focal spot with a target tilt angle; and a processing module for placing the target product under the focal spot to perform laser processing on the target product through the focal spot, thus overcoming the limitations of related laser processing technologies. The existing problems include numerous limitations on processing size, high equipment assembly precision, high processing cost, high equipment operation difficulty, high parameter design difficulty, low laser processing efficiency, and narrow application scenarios for laser processing. This paper addresses these issues by determining the target incident angle of the laser beam based on processing information, adjusting the laser beam angle based on this angle, and then generating a focal spot with a target tilt angle through focusing processing. This enables laser processing of the target product, achieving the technical effects of flexible taper adjustment, reduced processing size limitations, lower processing costs, reduced equipment operation difficulty and assembly precision, reduced parameter design difficulty, improved laser processing efficiency, and expanded application scenarios for laser processing.

[0077] like Figure 5 As shown in the diagram, an embodiment of the present invention also provides a schematic diagram of a laser processing apparatus. This laser processing apparatus includes: Laser 1 is used to emit a laser beam. Variable magnification beam expander 2 is used to expand the laser beam emitted by laser 1 to improve the divergence angle of the laser beam and adjust the diameter of the laser beam to meet different processing requirements.

[0078] The first reflecting mirror 3 and the second reflecting mirror 4 are used to change the propagation direction of the laser beam (it should be noted that the first and second reflecting mirrors mentioned above are not intended to limit the invention. The number of reflecting mirrors can be increased or decreased depending on the arrangement of the components in the laser processing apparatus), so that the laser beam can enter the beam tilt control module 5 horizontally.

[0079] The beam tilt control module 5 (which performs the same function as the angle adjustment module 402 mentioned above) is used to adjust the tilt angle (also known as the incident angle) of the laser beam so that the laser beam can enter the focusing lens 6 at a predetermined tilt angle.

[0080] The focusing lens 6 is used to focus a laser beam with a tilt angle to generate a focal spot with a diameter smaller than a preset diameter threshold and tilted (i.e. with a target tilt angle) at the focal point, and then irradiate the surface of the target product with the focal spot.

[0081] The target product 7 is placed on the moving platform 8. The movement of the moving platform 8 can be controlled by the motor 9 (the motor 9 is also used to precisely move the center point of the moving platform to a position that coincides with the focal spot, and to control the size and shape of the hole structure processed by the axis movement). The moving platform 8 is rotated so that the target product is processed into a hole structure with a predetermined taper under the action of the focal spot. The focal spot then laser processes the target product 7 to produce a hole with a set taper.

[0082] During the operation of the aforementioned device, the central control system 10 controls the laser 1 (controlling its laser beam emission), the beam tilt control module 5 (controlling its adjustment of the laser beam to the target incident angle), the moving platform 8 (controlling its movement according to a preset trajectory and speed), and the motor 9 (controlling its power supply to the moving platform). The beam tilt control module 5 in the laser processing device performs the same function as the angle adjustment module 402. The combined function of the target product 7, the moving platform 8, and the motor 9 is the same as the function of the processing module 403. The central control system 10 performs the same function as the control module 401. Therefore, before the laser processing operation, the central control system 10 is also used to: acquire processing information of the target product, determine the target incident angle information corresponding to the laser beam based on the processing information, so as to control the beam tilt control module 5 to adjust the laser beam according to the target incident angle during laser processing; wherein, the processing information includes one or more of the following: processing shape, processing depth, and processing dimensions.

[0083] This invention also provides a non-transitory machine-readable medium storing a computer program, wherein the computer program, when executed by a computer's processor, is used to cause the computer to perform a method according to an embodiment of this invention.

[0084] This invention also provides a computer program product, including a computer program, wherein the computer program, when executed by a computer's processor, is used to cause the computer to perform the methods of embodiments of this invention. The computer program product should be understood as a software product that primarily implements the methods described above through a computer program.

[0085] This invention also provides an electronic device, including: at least one processor; and a memory communicatively connected to the at least one processor. The memory stores a computer program executable by the at least one processor, which, when executed by the at least one processor, causes the electronic device to perform the method of this invention.

[0086] refer to Figure 6The present invention will now be described in the form of a structural block diagram of an electronic device that can serve as an embodiment of the present invention, which is an example of a hardware device that can be applied to various aspects of the present invention. The electronic device is intended to represent various forms of digital electronic computer devices, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.

[0087] like Figure 6 As shown, the electronic device includes a computing unit 601, which can perform various appropriate actions and processes based on a computer program stored in a read-only memory (ROM) 602 or a computer program loaded from a storage unit 608 into a random access memory (RAM) 603. The RAM 603 may also store various programs and data required for the operation of the electronic device. The computing unit 601, ROM 602, and RAM 603 are interconnected via a bus 604. An input / output (I / O) interface 605 is also connected to the bus 604.

[0088] Multiple components in the electronic device are connected to I / O interface 605, including: input unit 606, output unit 607, storage unit 608, and communication unit 609. Input unit 606 can be any type of device capable of inputting information into the electronic device. Input unit 606 can receive input digital or character information and generate key signal inputs related to user settings and / or function control of the electronic device. Output unit 607 can be any type of device capable of presenting information and may include, but is not limited to, a display, speaker, video / audio output terminal, vibrator, and / or printer. Storage unit 608 may include, but is not limited to, disks and optical discs. Communication unit 609 allows the electronic device to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks, and may include, but is not limited to, modems, network cards, infrared communication devices, and / or wireless communication transceivers, such as Bluetooth devices, WiFi devices, WiMax devices, cellular communication devices, and / or the like.

[0089] The computing unit 601 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the computing unit 601 include, but are not limited to, CPUs, graphics processing units (GPUs), various special-purpose artificial intelligence (AI) computing units, various computing units running machine learning model algorithms, digital signal processors (DSPs), and any suitable processor, controller, microcontroller, etc. The computing unit 601 performs the various methods and processes described above. For example, in some embodiments, the method embodiments of the present invention can be implemented as a computer program tangibly contained in a machine-readable medium, such as storage unit 608. In some embodiments, part or all of the computer program can be loaded and / or installed on an electronic device via ROM 602 and / or communication unit 609. In some embodiments, the computing unit 601 can be configured to perform the methods described above by any other suitable means (e.g., by means of firmware).

[0090] Computer programs for implementing the methods of embodiments of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus, such that when executed by the processor or controller, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be implemented. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0091] In the context of embodiments of the present invention, a machine-readable medium can be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, apparatus, or device. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable signal medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, or infrared systems, apparatus, or devices, or any suitable combination of the foregoing. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0092] It should be noted that the term "comprising" and its variations used in the embodiments of the present invention are open-ended, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". The modifications of "one" and "multiple" mentioned in the embodiments of the present invention are illustrative and not restrictive. Those skilled in the art should understand that, unless explicitly indicated otherwise in the context, they should be understood as "one or more".

[0093] The steps described in the method embodiments provided by this invention can be performed in different orders and / or in parallel. Furthermore, the method embodiments may include additional steps and / or omit the steps shown. The scope of protection of this invention is not limited in this respect.

[0094] The term "embodiment" in this specification refers to a specific feature, structure, or characteristic described in connection with an embodiment that may be included in at least one embodiment of the invention. The appearance of this phrase in various places in the specification does not necessarily imply the same embodiment, nor does it imply independence or alternativeity from other embodiments. The various embodiments in this specification are described in a related manner, with reference to each other for similar or identical parts. In particular, for apparatus, device, and system embodiments, since they are substantially similar to method embodiments, the description is relatively simple, and relevant details are referred to in the description of the method embodiments.

[0095] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of protection. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.

Claims

1. A laser processing method, characterized in that, include: Obtain the processing information of the target product, and determine the target incident angle information corresponding to the laser beam based on the processing information; wherein, the processing information includes any one or more of the processing shape, processing depth, and processing dimensions; The laser beam emitted by the laser is adjusted according to the target incident angle information, and the laser beam after angle adjustment is focused to generate a focal spot with a target tilt angle. The target product is placed under the focal spot so that the target product can be laser-processed through the focal spot; If the target incident angle information determined based on the processing information indicates multiple target incident angle values, the method further includes: Obtain the material information of the target product, and determine the processing efficiency of the laser beam's focal spot on the target product based on the material information; The processing efficiency corresponds to the focal spot energy efficiency. By analyzing the material of the target product, the focal spot energy efficiency under different materials is determined. Based on the processing information and the processing efficiency, determine the adjustment sequence and adjustment frequency corresponding to multiple target incident angle values; During the laser processing of the target product through the focal spot, the angle of the laser beam emitted by the laser is adjusted according to the adjustment sequence, the adjustment frequency, and the target incident angle information.

2. The method according to claim 1, characterized in that, The method further includes: Configure the movement trajectory of the target product during laser processing based on the processing information; During the laser processing of the target product through the focal spot, the target product is controlled to move according to the movement trajectory, the adjustment sequence and adjustment frequency of the target incident angle value corresponding to the laser beam.

3. The method according to claim 2, characterized in that, The step of controlling the target product to move according to the movement trajectory, the adjustment sequence and adjustment frequency of the target incident angle value corresponding to the laser beam, includes: The target product is placed on a moving platform. The moving trajectory and moving speed of the moving platform are controlled according to the moving trajectory, the adjustment order and adjustment frequency of the target incident angle value corresponding to the laser beam, so as to realize laser processing of the target product through the focal spot.

4. The method according to claim 1, characterized in that, Before the step of adjusting the angle of the laser beam emitted by the laser based on the target incident angle information, the method further includes: The emission power of the laser is obtained, and the beam expansion factor is determined based on the processing information and the emission power, so as to expand the laser beam according to the beam expansion factor.

5. The method according to claim 1, characterized in that, Before the step of adjusting the angle of the laser beam emitted by the laser based on the target incident angle information, the method further includes: The propagation direction of the laser beam is adjusted at least once so that the laser beam enters the angle adjustment module horizontally; wherein the angle adjustment module is used to adjust the angle of the laser beam.

6. A laser processing system, characterized in that, include: A control module is used to acquire processing information of the target product and determine the target incident angle information corresponding to the laser beam based on the processing information. The processing information includes one or more of the following: processing shape, processing depth, and processing size. If the target incident angle information determined based on the processing information indicates multiple target incident angle values, the module acquires the material information of the target product to determine the processing efficiency of the laser beam's focal spot on the target product based on the material information. The processing efficiency corresponds to the focal spot energy efficiency of the focal spot; by analyzing the material of the target product, the focal spot energy efficiency under different materials is determined. Based on the processing information and the processing efficiency, the module determines the adjustment order and adjustment frequency corresponding to the multiple target incident angle values. An angle adjustment module is used to adjust the angle of the laser beam emitted by the laser according to the target incident angle information, and to focus the angle-adjusted laser beam to generate a focal spot with a target tilt angle. A processing module is configured to place the target product under the focal spot for laser processing of the target product through the focal spot; and, during the laser processing of the target product through the focal spot, to adjust the angle of the laser beam emitted by the laser according to the adjustment sequence, the adjustment frequency, and the target incident angle information.

7. An electronic device, comprising: A processor and a memory storing a program, characterized in that the program includes instructions that, when executed by the processor, cause the processor to perform the method according to any one of claims 1-5.

8. A non-transitory machine-readable medium storing computer instructions, characterized in that, The computer instructions are used to cause the computer to perform the method according to any one of claims 1-5.

9. A computer program product comprising a computer program / instructions, characterized in that, When the computer program / instructions are executed by the processor, they implement the method of any one of claims 1-5.

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