A semiconductor chip sorting and taping machine

Abstract

The application relates to the technical field of braiding machines, in particular to a sorting and braiding machine for semiconductor chips, which comprises a workbench, a supporting plate, a display screen, a feeding guide rail, a feeding assembly, a detection assembly and a braiding assembly; the upper end face of the workbench is used for connecting the supporting plate; the upper end face of the supporting plate is connected with the display screen; the feeding assembly comprises a material taking assembly and a rotating assembly; the material taking assembly is arranged in parallel in two; the rotating assembly is connected on the workbench; and the feeding guide rail is connected at the upstream position of the workbench. In the application, the rotating assembly can rotate in the circumferential direction in the use state; the vibration assembly arranged on the rotating assembly collides with the vessel carrying the semiconductor chip to produce vibration when the rotating assembly drives the semiconductor chip to rotate in the circumferential direction; the position of the semiconductor chip in the vessel is corrected through the vibration to facilitate the detection assembly to shoot a clear image; meanwhile, the subsequent shaking of the semiconductor chip can be reduced through the component to prevent the shaking from affecting the shooting image quality.

Description

Technical Field

[0001] This invention relates to the field of tape and reel machine technology, and more specifically to a semiconductor chip sorting and tape and reel machine. Background Technology

[0002] Tape and reel machines can be divided into two main categories: semi-automatic and fully automatic. They take loose components, process them through inspection, reversing, and testing, and then place them into carrier tape. With the continuous upgrading, refinement, and high integration of electronic products, electronic components have also been transformed from plug-in type to surface mount type to save circuit board installation space and expand product functionality.

[0003] A search revealed Chinese Patent Publication No. CN113649307A, which describes a rapid sorting and taping machine for semiconductor chips. The rotating assembly includes a rotating disk for feeding materials; multiple transparent feeding platforms are spaced apart on the rotating disk; a testing assembly is positioned above and below the rotating disk, directly opposite the feeding platforms; the feeding end of the taping assembly is connected to the dispensing assembly; and a picking assembly is also included, comprising a first picking assembly for picking up materials between the feeding assembly and the rotating disk, and a second picking assembly for picking up materials between the dispensing assembly and the rotating disk. By using a chip-placement feeding platform instead of the existing adsorption turntable, stable and rapid chip transfer and testing are ensured, preventing chips from falling. Furthermore, the feeding platform is transparent, with testing cameras positioned above and below it, enabling bidirectional testing without flipping or reversing the chips. This effectively reduces testing steps, improves testing efficiency, and is convenient and practical.

[0004] However, the above technical solution only prevents the semiconductor chip from falling into the test slot correctly by installing a vibration motor on the rotating disk. Although the vibration motor can assist the semiconductor chip in its placement through vibration, the chip vibration causes the image to become blurred, reducing the clarity and resolution of the image, thereby reducing the accuracy of the camera in recognizing the chip. Summary of the Invention

[0005] The purpose of this invention is to address the problems existing in the background art by proposing a semiconductor chip sorting and packaging machine.

[0006] The technical solution of this invention: A semiconductor chip sorting and taping machine includes a worktable with a support plate connected above it and a display screen connected to the support plate; a feeding guide rail connected to the worktable; a feeding assembly connected to the worktable, the feeding assembly including a pick-up assembly and a rotating assembly, the rotating assembly being connected to the worktable and driving multiple evenly distributed chips to rotate in use; pick-up assemblies symmetrically arranged on both sides of the rotating assembly; the pick-up assemblies driving the chips to move horizontally in use; a detection assembly connected to the worktable; the detection assembly capturing images of the front and back of the semiconductor chips in use; and a taping assembly connected to the end of the worktable away from the feeding assembly, the taping assembly driving the chips to move horizontally in use.

[0007] Preferably, the rotating assembly includes a drive device connected to the worktable; a support shaft, one end of which passes through the worktable and is connected to the output end of the drive device; a rotating disk connected to the support shaft, the rotating disk having multiple circumferentially distributed through holes; a feeding disk having multiple feeding disks evenly distributed circumferentially around the central axis of the rotating disk, the feeding disk being positioned above the rotating disk and corresponding to the positions of the through holes; and a vibration assembly connected to the worktable, the vibration assembly being slidably connected to the rotating disk in use.

[0008] Preferably, the vibration assembly includes fixed teeth, which are evenly distributed in a circle around the central axis of the feeding tray, and the fixed teeth are connected to the outside of the feeding tray; connecting blocks, which are symmetrically connected to both sides of the feeding tray; damping shock absorbers, the number of which corresponds to the connecting blocks, and the two ends of the damping shock absorbers are respectively connected to the connecting blocks and the rotating disk; support rods, which are connected to the worktable; and elastic elements, which are connected to one end of the support rods.

[0009] Preferably, the feeding tray has several evenly distributed ventilation holes.

[0010] Preferably, the material handling assembly includes two linear motors arranged side by side, which are connected to a support plate; a support member, the number of which corresponds to the number of linear motors, which is connected to the linear motors; a telescopic device connected to the support member; and a vacuum nozzle connected to the telescopic end of the telescopic device.

[0011] Preferably, the static elimination component includes a first ion fan connected to the support member, with the air outlet of the first ion fan located on the side of the feeding guide rail; and a second ion fan connected to the support plate, with the air outlet of the second ion fan located on the outside of the discharge tray.

[0012] Preferably, the test assembly includes a support platform with multiple fixed rods connected below it, the fixed rods being connected to a worktable; a first camera connected to the support platform, the first camera being located above the through hole of the rotating disk; and a second camera connected to the worktable, the second camera being arranged parallel to the first camera.

[0013] Preferably, the tape assembly includes a feeding track connected to the worktable; two feeding rollers arranged parallel to each other, with a fixed frame connected to the side of the feeding rollers and the fixed frame connected to the worktable; and a take-up roller with a support frame connected to its side and the support frame connected to the worktable.

[0014] Compared with the prior art, the above-mentioned technical solution of the present invention has the following beneficial technical effects: In this invention, the rotating component can rotate circumferentially in use. When the rotating component drives the semiconductor chip to rotate circumferentially, the vibration component on the rotating component collides with the container carrying the semiconductor chip to generate vibration. The vibration corrects the position of the semiconductor chip in the container to facilitate the detection component to capture clear images. At the same time, the component can also reduce the subsequent shaking of the semiconductor chip to prevent the shaking from affecting the quality of the captured image. Attached Figure Description

[0015] Figure 1 This is a perspective view of the present invention; Figure 2 for Figure 1 A sectional plan view; Figure 3 for Figure 1 A cross-sectional three-dimensional schematic diagram; Figure 4 This is a schematic diagram of the feeding tray structure.

[0016] Reference numerals: 1. Workbench; 2. Support plate; 3. Display screen; 4. Feeding guide rail; 5. Drive device; 6. Support shaft; 7. Rotary disk; 8. Discharge disk; 9. Fixed tooth; 10. Connecting block; 11. Damping shock absorber; 12. Support rod; 13. Elastic element; 14. Vent hole; 15. Linear motor; 16. Support component; 17. Telescopic device; 18. Vacuum nozzle; 19. First ion fan; 20. Second ion fan; 21. Support platform; 22. Fixed rod; 23. First camera; 24. Second camera; 25. Feeding track; 26. Feeding wheel; 27. Fixed frame; 28. Receiving wheel; 29. ​​Support frame. Detailed Implementation

[0017] Example 1 like Figures 1-4As shown, the present invention proposes a semiconductor chip sorting and taping machine, comprising a worktable 1, a support plate 2, a display screen 3, a feeding guide rail 4, a feeding assembly, a detection assembly, and a taping assembly. The lower end face of the worktable 1 is connected to multiple support legs, and the upper end face of the worktable 1 is connected to the support plate 2. A miscellaneous storage box is connected to the side wall of the support plate 2, and the upper end face of the support plate 2 is connected to the display screen 3. The feeding assembly is connected to the middle position of the worktable 1 and includes a picking assembly and a rotating assembly. Two picking assemblies are arranged in parallel, with the rotating assembly positioned between them. The picking assembly can move horizontally to pick up semiconductor chips during use. The rotating assembly is connected to the worktable. 1. The rotating component can rotate circumferentially during use. The vibration component on the rotating component vibrates as it drives the semiconductor chip to rotate circumferentially, causing them to collide and vibrate. This vibration corrects the position of the semiconductor chip and also reduces subsequent shaking of the semiconductor chip to prevent it from affecting the quality of the captured image. The feeding guide rail 4 is connected to the upstream position of the worktable 1. The detection component and the tape assembly are connected to the middle and downstream positions of the worktable 1. The detection component captures images of the front and back of the semiconductor chip during use to detect its appearance damage. The tape assembly is set parallel to the feeding guide rail 4. During use, the tape assembly rotates, causing the carrier tape and chip to move horizontally.

[0018] Example 2 like Figures 2-3 As shown, the present invention proposes a semiconductor chip sorting and taping machine. Compared with Embodiment 1, this embodiment describes the detailed structure of the rotating assembly. The rotating assembly includes a driving device 5, a support shaft 6, a rotating disk 7, a feeding disk 8, and a vibration assembly. The driving device 5 is connected to the lower end face of the worktable 1. The driving device 5 is selected from, but is not limited to, a servo motor. One end of the support shaft 6 passes through a through hole opened on the worktable 1 and is connected to the output end of the driving device 5. The other end of the support shaft 6 is used to connect to the rotating disk 7. The rotating disk 7 has through holes distributed circumferentially around the support shaft 6 as the central axis. The number of feeding disks 8 corresponds to the number of through holes and is arranged above the through holes.

[0019] The vibration assembly includes fixed teeth 9, connecting blocks 10, damping shock absorbers 11, support rods 12, and elastic elements 13. The connecting blocks 10 are connected to the outer wall of the feeding tray 8 and are symmetrically arranged. The lower end face of the connecting blocks 10 is used to connect one end of the damping shock absorber 11, and the other end of the damping shock absorber 11 is connected to the rotating disk 7. The lower end face of the support rod 12 is connected to the worktable 1, and the upper end face of the support rod 12 is used to connect with the elastic element 13. The elastic element 13 is selected from, but is not limited to, spring sheets. The fixed teeth 9 are circumferentially distributed and connected to the outer side of the feeding tray 8, and the elastic element 13 is slidably connected to the fixed teeth 9.

[0020] The material handling assembly includes a linear motor 15, a support member 16, a telescopic device 17, and a vacuum nozzle 18. Two linear motors 15 are connected in parallel to each other on the side wall of the support plate 2, and the support member 16 is connected to the linear motors 15. The support member 16 may be, but is not limited to, an electric push rod. The telescopic end of the electric push rod is connected to the telescopic device 17. The telescopic device 17 may be, but is not limited to, a cylinder. The telescopic end of the telescopic device 17 is connected to the vacuum nozzle 18. The vacuum nozzle 18 is connected to an external air pump or vacuum pump through a pipe.

[0021] Example 3 like Figure 1 , Figure 4 As shown, the present invention proposes a semiconductor chip sorting and taping machine. Compared with Embodiment 2, this embodiment describes the detailed structure of the static electricity removal component. The static electricity removal component includes a first ion fan 19 and a second ion fan 20. The first ion fan 19 is connected to the support member 16. The air outlet of the first ion fan 19 is located on the side of the feeding guide rail 4. When the support member 16 moves and grasps the chip, the first ion fan 19 removes static electricity from it. The second ion fan 20 is connected to the side wall of the support plate 2. The air outlet of the second ion fan 20 is located on the outside of the feeding tray 8. In an optional embodiment, the feeding tray 8 has a plurality of evenly distributed ventilation holes 14; the air blown out by the second ion fan 20 can contact the semiconductor chip through the ventilation holes 14 to remove static electricity.

[0022] Example 4 like Figure 3 As shown, the present invention proposes a semiconductor chip sorting and taping machine. Compared with Embodiment 3, this embodiment describes the detailed structure of the test component. The test component includes a support platform 21, a fixing rod 22, a first camera 23, and a second camera 24. The two fixing rods 22 are connected to the upper surface of the worktable 1. The top of the fixing rod 22 is used to connect to the support platform 21. The lower surface of the support platform 21 is used to connect to the first camera 23. The second camera 24, which is connected to the worktable 1, is set directly below the first camera 23.

[0023] Example 5 like Figures 2-3As shown, this invention proposes a semiconductor chip sorting and taping machine. Compared to Embodiment 4, this embodiment describes the detailed structure of the taping assembly. The taping assembly includes a feeding track 25, feeding rollers 26, a fixing frame 27, a take-up roller 28, and a support frame 29. The lower end face of the feeding track 25 is connected to multiple support legs, which are connected to the upper end face of the worktable 1. Two parallel feeding rollers 26 are set on the upper and lower sides of the feeding track 25. One side of each feeding roller 26 is connected to the fixing frame 27, which is connected to the worktable 1. One of the two feeding rollers 26 is used to place the carrier tape, and the other is used to place the cover tape. One side of the take-up roller 28 is connected to the support frame 29. The support frame 29 is equipped with a motor as a power source, and the motor is electrically connected to the control components on the worktable 1.

[0024] In summary, when using this invention, the operator uses a vibratory feeder to transport the semiconductor chip onto the feeding guide rail 4. At this time, the first ion fan 19 blows out airflow to remove static electricity. The control component on the workbench 1 controls the linear motor 15 near the feeding guide rail 4 to start. The linear motor 15 drives the support member 16 and the telescopic device 17 to move horizontally. The telescopic end of the telescopic device 17 drives the vacuum nozzle 18 to approach the chip. The negative pressure is formed by the external equipment's suction to adsorb the chip. Then, the linear motor 15 places the chip into the feeding tray 8. The output end of the drive device 5 drives the support shaft 6 and the rotating disk 7 to rotate. The feeding tray 8 rotates synchronously with the rotating disk 7 and gradually comes into contact with the elastic member 13. The elastic member 13 comes into contact with the material on the fixed teeth 9 on the feeding tray 8, causing collision and vibration. The vibration will cause the chip to vibrate. The chip slides into the groove at the top of the feeding tray 8 for easy inspection. As the rotating disk 7 continues to move, the chip gradually moves between the second camera 24 and the first camera 23. The two cameras take pictures of the chip to inspect its appearance. The inspection results are transmitted to the control component, which controls the linear motor 15, which is away from the feeding guide rail 4, to start. Based on whether the chip is qualified, the electric push rod on the linear motor 15, which forms the support member 16, is controlled to extend and retract to place the chip into the feeding track 25 or the miscellaneous box. At the same time, the second ion fan 20 is started to perform secondary destatic treatment on the chip to prevent static electricity from being generated by friction between the chip and the feeding tray 8. Qualified products fall onto the carrier tape. The cover tape and the carrier tape are bonded together by heat sealing technology. The motor drives the take-up wheel 28 to wind up the packaged semiconductor chip.

[0025] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited thereto. Various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention.

Claims

1. A semiconductor chip sorting and packaging machine, characterized in that, include A workbench (1) is connected to a support plate (2) above it, and a display screen (3) is connected to the support plate (2). The feeding guide rail (4) is connected to the worktable (1); The feeding component is connected to the worktable (1). The feeding component includes a picking component and a rotating component. The rotating component is connected to the worktable (1). When in use, the rotating component drives multiple evenly distributed chips to rotate. The picking component is symmetrically arranged on both sides of the rotating component. When in use, the picking component drives the chips to move horizontally. The detection component is connected to the worktable (1); the detection component is used to photograph and detect the front and back of the semiconductor chip. The tape and reel assembly is connected to the end of the worktable (1) away from the feeding assembly. When in use, the tape and reel assembly drives the chip to move horizontally. Rotating components include A drive unit (5) is connected to the worktable (1); The support shaft (6) has one end passing through the worktable (1) and connected to the output end of the drive device (5); A rotating disk (7) is connected to a support shaft (6), and the rotating disk (7) has multiple circumferentially distributed through holes; The feeding tray (8) has multiple trays evenly distributed around the central axis of the rotating disk (7). The feeding tray (8) is positioned above the rotating disk (7) and corresponds to the position of the through hole. A vibration assembly, which is connected to the worktable (1), includes... Fixed teeth (9) are evenly distributed around the central axis of the feeding plate (8), and the fixed teeth (9) are connected to the outside of the feeding plate (8); Connecting blocks (10) are symmetrically connected to both sides of the feeding tray (8); Damping shock absorbers (11) are numbered in relation to connecting blocks (10), and both ends of the damping shock absorbers (11) are connected to the connecting blocks (10) and the rotating disk (7) respectively. Support rod (12), which is connected to the workbench (1); The elastic element (13) is connected to one end of the support rod (12).

2. The semiconductor chip sorting and packaging machine according to claim 1, characterized in that, The feeding tray (8) has several evenly distributed ventilation holes (14).

3. The semiconductor chip sorting and packaging machine according to claim 1, characterized in that, Material handling components include There are two linear motors (15) arranged side by side, and the linear motors (15) are connected to the support plate (2); Support members (16) are provided in a number corresponding to the linear motor (15), and the support members (16) are connected to the linear motor (15). Telescopic device (17), which is connected to support member (16); Vacuum nozzle (18) is connected to the telescopic end of telescopic device (17).

4. A semiconductor chip sorting and packaging machine according to claim 2, characterized in that, It also includes anti-static components; the anti-static components include The first ion fan (19) is connected to the support (16), and the air outlet of the first ion fan (19) is located on the side of the feeding guide rail (4). The second ion fan (20) is connected to the support plate (2), and the outlet of the second ion fan (20) is located outside the discharge plate (8).

5. A semiconductor chip sorting and packaging machine according to claim 1, characterized in that, Test components include A support platform (21) is provided, with multiple fixed rods (22) connected below it. The fixed rods (22) are connected to the worktable (1). The first camera (23) is connected to the support platform (21) and is located above the through hole of the rotating disk (7); The second camera (24) is connected to the worktable (1) and is set parallel to the first camera (23).

6. A semiconductor chip sorting and packaging machine according to claim 1, characterized in that, Tape and reel assembly includes Feeding track (25), which is connected to the worktable (1); There are two feeding wheels (26) arranged in parallel on the top and bottom. A fixed frame (27) is connected to the side of the feeding wheel (26), and the fixed frame (27) is connected to the worktable (1). The receiving wheel (28) has a support frame (29) connected to its side, and the support frame (29) is connected to the workbench (1).

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