A method, apparatus and process for polishing the surface of a plurality of thin-walled hollow microspheres

Abstract

The application discloses a kind of multiple thin-walled hollow microsphere surface polishing method, device and process, including setting polishing disc and pedestal, with polishing disc corresponding polishing hemisphere head, polished ball, rotating motor, swing rod, support;Polishing hemisphere head diameter matches with polishing disc, and a circle or several circles of holes with the size matching with the polished ball diameter are arranged in parallel along the central axis of polishing hemisphere head in the lower part of polishing hemisphere head, rotating motor is connected with polishing hemisphere head by setting rod body, front and back or left and right swing in horizontal direction are set, and swing rod of connecting rod body, rotating motor and swing rod are arranged on support.The thin-walled microsphere surface polishing method, device and process can be realized, and the technology can be applied to micro-nano machining technology field.

Description

Technical Field

[0001] This invention belongs to the field of micromachining, and in particular relates to a method, apparatus and process for polishing the surface of multiple thin-walled hollow microspheres. Background Technology

[0002] The micro- and nano-structures of materials can alter their physicochemical properties, greatly expanding their applications and scenarios. The 21st century is the century of materials; whoever masters advanced materials manufacturing processes controls the market. Therefore, developing advanced methods and processes for microfabrication with new structures and functions is a crucial task for engineers. Microspheres made of different materials can be used in many ways; for example, microspheres in coatings can absorb waves, achieving stealth capabilities. In laser fusion research experiments, microspheres serve as fuel targets, requiring extremely high quality. This invention is designed to address the issue of excessively high surface roughness of the target spheres.

[0003] Microsphere polishing machines exist on the market, specifically designed for particular industries, but each has its advantages and disadvantages. For example, a four-axis polishing machine solves the rotation of the microsphere along the ωx, ωy, and ωz axes (x, y, z), but it cannot address the linear motion along these axes, and can only polish one ball at a time, failing to address the issue of quantity. Another type, planar polishing, solves the XY axis motion and the rotational motion along the ωx and ωy axes, allowing for the polishing of multiple balls simultaneously, but it doesn't address the Z and ωz motions. At high roughness levels, the balls are easily prevented from rotating and may break. This invention is designed to solve these two problems. Summary of the Invention

[0004] This application designs a method, apparatus, and process for polishing the surface of multiple thin-walled hollow microspheres.

[0005] This application proposes a method for polishing the surface of multiple thin-walled hollow microspheres. The method includes setting a polishing disk and a base, a polishing hemispherical head corresponding to the polishing disk, a ball to be polished, a rotary motor, a rocking rod, and a support. The diameter of the polishing hemispherical head matches that of the polishing disk. One or more holes matching the diameter of the ball to be polished are arranged parallel to the central axis of the polishing hemispherical head at the lower part of the polishing hemispherical head. A rotary motor is set and connected to the polishing hemispherical head through a rod. A rocking rod is set to swing back and forth or left and right in the horizontal direction and connected to the rod. The rotary motor and the rocking rod are set on the support.

[0006] Furthermore, the polishing disc is set as a spherical crown disc with an appropriate diameter. Combined with the oscillation of the polishing hemispherical head, the polished ball moves up and down along the Z-axis during the polishing process, changing the pressure on the surface of the polished ball to prevent the polished ball from getting stuck during rotation.

[0007] Furthermore, the polishing ball to be polished is placed into the hole of the polishing hemisphere head, and the weight of the polishing ball is supported by the surface of the polishing disc, so that multiple balls can be polished simultaneously.

[0008] Furthermore, one or more polished balls of the same diameter are placed on top of the polished ball inside each hole to increase the pressure on the polished balls, enhance the force at the friction point, and increase the polishing efficiency.

[0009] Furthermore, the rotary motor drives the polishing hemispherical head to rotate, causing the polished ball to rotate 360 ​​degrees on the horizontal plane.

[0010] Furthermore, the rocker arm causes the polished ball to swing back and forth or left and right, moving it on the polishing disc and causing it to move up and down along the horizontal x-axis, y-axis and vertical z-axis.

[0011] Furthermore, the rocker arm drives the polishing hemispherical head to swing back and forth or left and right, and the motor drives the polishing hemispherical head to rotate. The friction between the surface of the polishing disc and the surface of the polished microsphere achieves linear motion of the polished microsphere along the x, y, and z axes and rotational motion in the ωx, ωy, and ωz directions.

[0012] Furthermore, the movement path of the polishing ball is a complex polishing process curve.

[0013] This application proposes an apparatus for polishing the surface of multiple thin-walled hollow microspheres, which operates using the aforementioned method.

[0014] This application proposes a process for polishing the surface of multiple thin-walled hollow microspheres, which employs the aforementioned method for process operation.

[0015] The beneficial effects of this invention are that it enables the polishing method, apparatus and process for the surface of thin-walled microspheres, and its technology can be applied to the field of micro-nano processing technology. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the device in the embodiments of this application;

[0017] In the diagram: 1. Polishing disc with base 2. Polishing hemispherical head 3. Polished ball 4. Rotary motor 5. Rocking arm 6. Support. Detailed Implementation

[0018] Those skilled in the art will recognize that the embodiments described herein are intended to help the reader understand the principles of the invention, and should be understood that the scope of protection of the invention is not limited to such specific statements and embodiments. Those skilled in the art can make various other specific modifications and combinations based on the technical teachings disclosed in this invention without departing from the spirit of the invention, and these modifications and combinations are still within the scope of protection of this invention.

[0019] The following is in conjunction with the appendix Figure 1 The present invention will be described in detail with reference to specific embodiments.

[0020] This invention relates to a principle, apparatus, and process for realizing six-axis motion (x, y, z, ωx, ωy, ωz) of thin-walled hollow microspheres. A diagram of the apparatus is shown below. Figure 1 As shown in the image.

[0021] like Figure 1 As shown, the device includes a polishing disc 1 with a base, a polishing hemispherical head 2 corresponding to the polishing disc, a polished ball 3, a rotary motor 4, a rocker arm 5, and a bracket 6.

[0022] The working principle diagram of the device is as follows:

[0023] A base is placed horizontally, on which a spherical polishing disc 1 of suitable diameter is mounted. A hemispherical polishing head 2 is suspended from the polishing disc, its axis serving as the rotation axis of a rotary motor 4. The hemispherical polishing head 2 has one or more concentric holes of the same diameter as the polished sphere 3 to accommodate it. The spherical polishing disc 1 and the hemispherical polishing head 2 are clearance-fitted. The rotary motor 4 and the rocker arm 5 are both mounted on a support 6. The support 6 is installed on the edge of the base 1. During the polishing experiment, the rotary motor 4 rotates, driving the hemispherical polishing head 2 to rotate. The rocker arm causes the hemispherical polishing head to rock back and forth or left and right. The polished sphere 3, placed in the small holes of the hemispherical polishing head 2, performs a six-axis motion under the influence of the hemispherical polishing head 2, achieving the polishing purpose. Multiple thin-walled hollow microspheres can be processed at once.

[0024] This invention is not limited to the specific embodiments described above. Any modifications made by those skilled in the art based on the above concept without creative effort are within the protection scope of this invention.

Claims

1. A method for polishing the surface of multiple thin-walled hollow microspheres, characterized in that, A polishing disc (1) with a base is provided, a polishing hemispherical head (2) corresponding to the polishing disc (1), a rotary motor (4), a rocker arm (5), and a bracket (6); the diameter of the polishing hemispherical head (2) matches that of the polishing disc (1), and the lower part of the polishing hemispherical head (2) is provided with one or more holes that match the diameter of the polished ball (3) along the central axis of the polishing hemispherical head. The rotary motor (4) is connected to the polishing hemispherical head (2) through a rod. The rocker arm (5) is provided so that it can swing back and forth or left and right in the horizontal direction and is connected to the rod. The rotary motor (4) and the rocker arm (5) are provided on the bracket (6). The polishing disk (1) is configured as a spherical crown disk; The rocker arm (5) drives the polishing hemispherical head (2) to swing back and forth or left and right. The rotary motor (4) drives the polishing hemispherical head (2) to rotate. The friction between the surface of the polishing disc (1) and the surface of the polished ball (3) realizes the linear motion of the polished ball (3) along the x, y, and z axes and the rotational motion in the ωx, ωy, and ωz directions.

2. According to the method of claim 1, the polished ball (3) to be polished is placed in the hole of the polishing hemisphere head (2), and the weight of the polished ball (3) is supported by the surface of the polishing disk (1).

3. The method according to claim 2, wherein one or more polished balls (3) of the same diameter are placed on the polished ball (3) in each hole.

4. According to the method of claim 1, the rotary motor (4) drives the polishing hemispherical head (2) to rotate, thereby driving the polished ball (3) to rotate 360 ​​degrees on the horizontal plane.

5. According to the method of claim 1, the movement path of the polished ball (3) is a complex polishing process curve.

6. An apparatus for polishing the surface of multiple thin-walled hollow microspheres, characterized in that, The operation is carried out using any one of the methods described in claims 1-5.

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