A method for laser surface treatment of a ceramic wedge

Abstract

The present application belongs to the technical field of ceramic material surface treatment, and particularly relates to a laser surface treatment method for ceramic split knives. The treatment steps comprise: 1) ceramic split knife surface pretreatment; 2) laser treatment of the tip surface of the ceramic split knife; 3) laser treatment of the inner chamfer area of the ceramic split knife; 4) measurement of the surface roughness Sa and the protrusion height difference of the first layer and the second layer; and 5) heat treatment of the ceramic split knife. Compared with the prior art, the technical advantages of the present application are that the present application achieves the effect of multi-layer and form superposition through laser treatment of the tip surface of the ceramic split knife and laser treatment of the inner chamfer area of the ceramic split knife, and that by controlling the appropriate first layer spot diameter, first layer laser power, second layer spot diameter and second layer laser power, the surface performance of the ceramic split knife is optimized, the MTBA of the nickel-palladium-gold frame wire bonding machine reaches 0.96 hours or more, and the occurrence of the first point disconnection and the second solder point wire lifting problems in the bonding process is greatly reduced.

Description

Technical Field

[0001] This invention belongs to the field of ceramic material surface treatment technology, and specifically relates to a method for laser surface treatment of ceramic cleaving tools. Background Technology

[0002] In the wire bonding process, due to the high hardness of the nickel-palladium-gold frame, it is necessary to increase the process parameters to achieve the bonding purpose. Conventional ceramic wedges not only wear out quickly and have a short lifespan, but are also prone to technical problems such as second solder joint lifting and first solder joint breakage, resulting in a mean uptime MTBA ≤ 0.5 hours.

[0003] In response, this invention proposes a laser surface treatment method for ceramic cleavers, which uses laser to treat the surface of the ceramic cleaver. Different surface treatment methods are used for different functional areas of the ceramic cleaver to significantly reduce the occurrence of the first point break and the second weld point warping problem. Summary of the Invention

[0004] This invention addresses the technical problems existing in the background art by proposing a method for laser surface treatment of ceramic cleavers.

[0005] The technical solution adopted to achieve the purpose of this invention is: a method for laser surface treatment of ceramic chopping tools, the specific processing steps of which are as follows: 1) Surface pretreatment of ceramic chopping blade First, the surface of the ceramic chopping knife is polished using a fine-grained diamond polishing slurry while the ceramic chopping knife is rotating at high speed. Then the surface of the ceramic chopping knife is cleaned by ultrasonic immersion cleaning followed by high-pressure water cleaning. The treated chopping knife products are then bottled and protected in a cleanroom environment. 2) Laser treatment of the tip surface of the ceramic chopping knife A nano-laser device and a coaxial optical system are selected to position the laser source and the image lens in the same location. The diameter of the laser spot is adjusted, and the focal length of the optical lens is adjusted after the ceramic chopping knife is fixed in place to ensure that the tip surface of the ceramic chopping knife is in the clearest position. The corresponding drawing design is called to obtain the corresponding pattern on the surface of the ceramic chopping knife. The drawing design is a pattern with intervals in the inner rings, with the spacing between the rings being 2-6 μm and the spacing within the rings being controlled at 10-20 μm. The power of the laser generator is adjusted to obtain different differences in the height of the protrusions and different surface roughness Sa on the surface of the ceramic chopping knife in the first layer, thus completing the laser surface treatment of the tip surface of the ceramic chopping knife. 3) Laser treatment of the inner chamfer area of ​​the ceramic chamfering tool Using femtosecond equipment and a coaxial light system ensures concentricity and prevents shape shift when layers are stacked. After adjusting the laser spot diameter, fix the ceramic chamfer processed in step 2) and adjust the focal length of the optical lens. Use the junction of the inner chamfer and the tip as the reference point to adjust the focal length. Call up the corresponding drawing design to obtain the corresponding pattern on the surface of the ceramic chamfer. The drawing design is a scattering line with a spacing of 0.5 to 3 μm between the lines. Adjust the power of the laser generator to obtain different convex height differences and different surface roughness Sa on the surface of the ceramic chamfer in the second layer, thus completing the laser processing of the inner chamfer area of ​​the ceramic chamfer. 4) Remove the ceramic chopping knife and check the laser morphology under a microscope to see if it is normal. At the same time, measure the surface roughness Sa and the difference in protrusion height between the first and second layers under a 3D laser scanning microscope. 5) Perform heat treatment on the ceramic chopping knife. The heat treatment temperature is between 500 and 1500℃, and the heat treatment time is between 1 and 10 hours.

[0006] Preferably, in step 1) of the present invention, the diamond polishing fluid has diamond particles with a particle size ≤0.2μm, the ceramic cleaver rotates at high speed with a speed of 10000~15000RPM, and the polishing time is 30~60 minutes.

[0007] Preferably, the ultrasonic immersion cleaning described in step 1) of the present invention uses an ultrasonic frequency of 40-80 kHz, is immersed in a hydrocarbon cleaning agent, is immersed at a temperature of 60-80°C, and is immersed for more than 3 hours.

[0008] Preferably, the hydrocarbon cleaning agent of the present invention comprises the following components and their weight percentages: C 12 H 26 60-80%, C3H3F5 10-20% and oxalic acid 10-20%.

[0009] Preferably, after ultrasonic cleaning, the sample is rinsed under high-pressure water with a water pressure ≥10 Bar for 30-40 minutes, and then placed on a centrifuge for spin drying at a speed of 6000-10000 RPM for 5-20 minutes.

[0010] Preferably, in step 2) of the present invention, the diameter of the laser spot is 3 to 10 μm and the power of the laser generator is 0.5 to 5 W.

[0011] Preferably, in step 2) of the present invention, the height difference of the protrusions is 0.2 to 6 μm and the roughness is 0.2 to 5 μm.

[0012] Preferably, in step 3) of the present invention, the diameter of the laser spot is 1 to 3 μm and the power of the laser generator is 0.5 to 1.5 W.

[0013] Preferably, in step 3) of the present invention, the height difference of the protrusions is 0.2 to 5 μm, and the roughness is 0.1 to 3 μm.

[0014] Compared with the prior art, the technical advantages of the present invention are as follows: This invention achieves the effect of multi-layer and morphological superposition through laser treatment of the ceramic wedge tip surface and the inner chamfer area of ​​the ceramic wedge. By controlling the appropriate first layer spot diameter, first layer laser power, second layer spot diameter, and second layer laser power, superior ceramic wedge surface performance is obtained, and the MTBA of the nickel-palladium-gold frame wire bonding machine reaches more than 0.96 hours, significantly reducing the occurrence of first-point wire breakage and second-point wire lifting problems during the bonding process. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the layer obtained by laser processing of the surface of the ceramic chopping tool tip of the present invention.

[0016] Figure 2 This is a schematic diagram of the layer obtained by laser processing of the inner chamfer area of ​​the ceramic chopping tool of the present invention.

[0017] Figure 3 This is a schematic diagram of the ceramic chopping knife after laser surface treatment according to Embodiment 1 of the present invention. Detailed Implementation

[0018] The present invention will be further described below with reference to embodiments.

[0019] Example 1

[0020] 1) Surface pretreatment of ceramic chopping blade First, the surface of the ZTA ceramic cleaver doped with chromium oxide is polished using a fine-grained diamond polishing slurry with diamond particles ≤0.2μm in diameter. The ceramic cleaver is rotated at a high speed of 15000RPM, and the surface of the ceramic cleaver is polished by the diamond polishing slurry for 30 minutes.

[0021] The ceramic chopping blade surface is then cleaned, first with ultrasonic immersion cleaning followed by high-pressure water cleaning. The ultrasonic frequency is 60kHz. It is then immersed in a hydrocarbon cleaning agent at 70℃ for 3 hours. The hydrocarbon cleaning agent has the following composition by mass percentage: C 12 H 26 70%, C3H3F5 10% and oxalic acid 20%, ultrasonically cleaned and then rinsed under high pressure water pressure ≥10 Bar for 35 minutes. Then, it was placed on a centrifuge to spin dry at 8000 RPM for 15 minutes. Finally, the treated cleaver product was bottled and protected in a cleanroom environment. 2) Laser treatment of the tip surface of the ceramic chopping knife A nano-laser device and a coaxial optical system were selected to position the laser source and the image lens in the same location. The laser spot diameter was adjusted to 3μm. After fixing the ceramic chopping knife, the focal length of the optical lens was adjusted to ensure that the tip surface of the ceramic chopping knife was in the clearest position. The corresponding drawing design was retrieved to obtain the corresponding pattern on the surface of the ceramic chopping knife. The drawing design consisted of interlocking patterns within circular rings, with a spacing of 4μm between the rings and a spacing of 15μm within each ring. The power of the laser generator was adjusted to 0.5W to obtain different differences in the height of the protrusions and different surface roughness Sa on the first layer of the ceramic chopping knife surface, thus completing the laser surface treatment of the tip surface of the ceramic chopping knife. 3) Laser treatment of the inner chamfer area of ​​the ceramic chamfering tool Using a femtosecond laser and a coaxial optical system, concentricity is ensured to prevent shape shifts during layer overlay. The laser spot diameter is adjusted to 2μm. After fixing the ceramic chamfer processed in step 2), the focal length of the optical lens is adjusted, using the junction of the inner chamfer and the tip as a reference point. The corresponding drawing design is retrieved to obtain the corresponding pattern on the surface of the ceramic chamfer. The drawing design consists of scattering lines with a spacing of 2μm between the lines. The power of the laser generator is adjusted to 1W to obtain different differences in the height of the protrusions and different surface roughness Sa on the surface of the ceramic chamfer in the second layer, thus completing the laser processing of the inner chamfer area of ​​the ceramic chamfer. 4) Remove the ceramic chopping knife and check the laser morphology under a microscope to see if it is normal. At the same time, measure the surface roughness Sa of the first layer (0.2μm) and the height difference of the protrusions (0.5μm) under a 3D laser scanning microscope, and the surface roughness Sa of the second layer (0.6μm) and the height difference of the protrusions (1.6μm). 5) The ceramic chopping knife is heat-treated at 1200℃ for 5 hours.

[0022] Example 2

[0023] 1) Surface pretreatment of ceramic chopping blade First, the surface of the ZTA ceramic cleaver doped with chromium oxide is polished using a fine-grained diamond polishing slurry with diamond particles ≤0.2um in diameter. The ceramic cleaver is rotated at a high speed of 12000RPM, and the surface of the ceramic cleaver is polished by the diamond polishing slurry for 45 minutes.

[0024] The ceramic chopping blade surface is then cleaned, first with ultrasonic immersion cleaning followed by high-pressure water cleaning. The ultrasonic frequency is 40kHz. It is then immersed in a hydrocarbon cleaning agent at 60℃ for 5 hours. The hydrocarbon cleaning agent has the following composition by mass percentage: C 12 H 2670%, C3H3F5 10% and oxalic acid 20%, ultrasonically cleaned and then rinsed under high pressure water pressure ≥10 Bar for 40 minutes. Then it was placed on a centrifuge to spin dry at 800 RPM for 20 minutes. Finally, the treated cleaver product was bottled and protected in a cleanroom environment. 2) Laser treatment of the tip surface of the ceramic chopping knife A nano-laser device and a coaxial optical system were selected to position the laser source and the image lens in the same location. The laser spot diameter was adjusted to 6μm. After fixing the ceramic chopping knife, the focal length of the optical lens was adjusted to ensure that the tip surface of the ceramic chopping knife was in the clearest position. The corresponding drawing design was retrieved to obtain the corresponding pattern on the surface of the ceramic chopping knife. The drawing design consisted of interlocking patterns within circular rings, with a spacing of 4μm between the rings and a spacing of 15μm within each ring. The power of the laser generator was adjusted to 2.5W to obtain different differences in the height of the protrusions and different surface roughness Sa on the first layer of the ceramic chopping knife surface, thus completing the laser surface treatment of the tip surface of the ceramic chopping knife. 3) Laser treatment of the inner chamfer area of ​​the ceramic chamfering tool Using a femtosecond laser and a coaxial optical system, concentricity is ensured to prevent shape shifts during layer overlay. The laser spot diameter is adjusted to 2μm. After fixing the ceramic chamfer processed in step 2), the focal length of the optical lens is adjusted, using the junction of the inner chamfer and the tip as a reference point. The corresponding drawing design is retrieved to obtain the corresponding pattern on the surface of the ceramic chamfer. The drawing design consists of scattering lines with a spacing of 2μm between the lines. The power of the laser generator is adjusted to 1W to obtain different differences in the height of the protrusions and different surface roughness Sa on the surface of the ceramic chamfer in the second layer, thus completing the laser processing of the inner chamfer area of ​​the ceramic chamfer. 4) Remove the ceramic chopping knife and check the laser morphology under a microscope to see if it is normal. At the same time, measure the surface roughness Sa of the first layer (0.7μm) and the height difference of the protrusions (2.8μm) under a 3D laser scanning microscope, and the surface roughness Sa of the second layer (0.8μm) and the height difference of the protrusions (1.5μm). 5) The ceramic chopping knife is heat-treated at 1000℃ for 6 hours.

[0025] Example 3

[0026] 1) Surface pretreatment of ceramic chopping blade First, the surface of the ZTA ceramic cleaver doped with chromium oxide is polished using a fine-grained diamond polishing slurry with diamond particles ≤0.2μm in diameter. The ceramic cleaver is rotated at a high speed of 10000RPM, and the surface of the ceramic cleaver is polished by the diamond polishing slurry for 60 minutes.

[0027] The ceramic chopping blade surface is then cleaned, first with ultrasonic immersion cleaning followed by high-pressure water cleaning. The ultrasonic frequency is 80kHz. It is then immersed in a hydrocarbon cleaning agent at 80℃ for 3 hours. The hydrocarbon cleaning agent has the following composition by mass percentage: C 12 H 26 70%, C3H3F5 10% and oxalic acid 20%, ultrasonically cleaned and then rinsed under high pressure water pressure ≥10 Bar for 30 minutes. Then it was placed on a centrifuge to spin dry at 10000 RPM for 5 minutes. Finally, the treated cleaver product was bottled and protected in a cleanroom environment. 2) Laser treatment of the tip surface of the ceramic chopping knife A nano-laser device and a coaxial optical system were selected to position the laser source and the image lens in the same location. The laser spot diameter was adjusted to 10μm. After fixing the ceramic chopping knife, the focal length of the optical lens was adjusted to ensure that the tip surface of the ceramic chopping knife was in the clearest position. The corresponding drawing design was retrieved to obtain the corresponding pattern on the surface of the ceramic chopping knife. The drawing design consisted of interlocking patterns within circular rings, with a spacing of 4μm between the rings and a spacing of 15μm within each ring. The power of the laser generator was adjusted to 5W to obtain different differences in the height of the protrusions and different surface roughness Sa on the first layer of the ceramic chopping knife surface, thus completing the laser surface treatment of the tip surface of the ceramic chopping knife. 3) Laser treatment of the inner chamfer area of ​​the ceramic chamfering tool Using a femtosecond laser and a coaxial optical system, concentricity is ensured to prevent shape shifts during layer overlay. The laser spot diameter is adjusted to 2μm. After fixing the ceramic chamfer processed in step 2), the focal length of the optical lens is adjusted, using the junction of the inner chamfer and the tip as a reference point. The corresponding drawing design is retrieved to obtain the corresponding pattern on the surface of the ceramic chamfer. The drawing design consists of scattering lines with a spacing of 2μm between the lines. The power of the laser generator is adjusted to 1W to obtain different differences in the height of the protrusions and different surface roughness Sa on the surface of the ceramic chamfer in the second layer, thus completing the laser processing of the inner chamfer area of ​​the ceramic chamfer. 4) Remove the ceramic chopping knife and check the laser morphology under a microscope to see if it is normal. At the same time, measure the surface roughness Sa of the first layer (2.3 μm) and the difference in protrusion height (5.1 μm) under a 3D laser scanning microscope, and the surface roughness Sa of the second layer (0.7 μm) and the difference in protrusion height (1.6 μm). 5) Perform heat treatment on the ceramic chopping knife at a temperature of 1500℃ for 1 hour.

[0028] Example 4 1) Surface pretreatment of ceramic chopping blade First, the surface of the ZTA ceramic cleaver doped with chromium oxide is polished using a fine-grained diamond polishing slurry with diamond particles ≤0.2μm in diameter. The ceramic cleaver is rotated at a high speed of 15000RPM, and the surface of the ceramic cleaver is polished by the polishing slurry for 30 minutes.

[0029] The ceramic chopping blade surface is then cleaned, first with ultrasonic immersion cleaning followed by high-pressure water cleaning. The ultrasonic frequency is 60kHz. It is then immersed in a hydrocarbon cleaning agent at 60℃ for 4 hours. The hydrocarbon cleaning agent has the following composition by mass percentage: C 12 H 26 70%, C3H3F5 10% and oxalic acid 20%, ultrasonically cleaned and then rinsed under high pressure water pressure ≥10 Bar for 40 minutes. Then it was placed on a centrifuge to spin dry at 6000 RPM for 20 minutes. Finally, the treated cleaver product was bottled and protected in a cleanroom environment. 2) Laser treatment of the tip surface of the ceramic chopping knife A nano-laser device and a coaxial optical system were selected to position the laser source and the image lens in the same location. The laser spot diameter was adjusted to 6μm. After fixing the ceramic chopping knife, the focal length of the optical lens was adjusted to ensure that the tip surface of the ceramic chopping knife was in the clearest position. The corresponding drawing design was retrieved to obtain the corresponding pattern on the surface of the ceramic chopping knife. The drawing design consisted of interlocking patterns within circular rings, with a spacing of 4μm between the rings and a spacing of 15μm within each ring. The power of the laser generator was adjusted to 2.5W to obtain different differences in the height of the protrusions and different surface roughness Sa on the first layer of the ceramic chopping knife surface, thus completing the laser surface treatment of the tip surface of the ceramic chopping knife. 3) Laser treatment of the inner chamfer area of ​​the ceramic chamfering tool Using a femtosecond laser and a coaxial optical system, concentricity is ensured to prevent shape shifts during layer overlay. The laser spot diameter is adjusted to 1 μm. After fixing the ceramic chamfer processed in step 2), the focal length of the optical lens is adjusted, using the junction of the inner chamfer and the tip as a reference point. The corresponding drawing design is retrieved to obtain the corresponding pattern on the surface of the ceramic chamfer. The drawing design consists of scattering lines with a spacing of 2 μm between the lines. The power of the laser generator is adjusted to 0.5W to obtain different differences in the height of the protrusions and different surface roughness Sa on the surface of the ceramic chamfer in the second layer, thus completing the laser processing of the inner chamfer area of ​​the ceramic chamfer. 4) Remove the ceramic chopping knife and check the laser morphology under a microscope to see if it is normal. At the same time, measure the surface roughness Sa of the first layer (0.9 μm) and the height difference of the protrusions (3.2 μm) under a 3D laser scanning microscope, and the surface roughness Sa of the second layer (0.2 μm) and the height difference of the protrusions (0.4 μm). 5) The ceramic chopping knife is heat-treated at 500℃ for 10 hours.

[0030] Example 5

[0031] 1) Surface pretreatment of ceramic chopping blade First, the surface of the ZTA ceramic cleaver doped with chromium oxide is polished using a fine-grained diamond polishing slurry with diamond particles ≤0.2μm in diameter. The ceramic cleaver is rotated at a high speed of 12000RPM, and the surface of the ceramic cleaver is polished by the polishing slurry for 45 minutes.

[0032] The ceramic chopping blade surface is then cleaned, first with ultrasonic immersion cleaning followed by high-pressure water cleaning. The ultrasonic frequency is 60kHz. It is then immersed in a hydrocarbon cleaning agent at 80℃ for 3 hours. The hydrocarbon cleaning agent has the following composition by mass percentage: C 12 H 26 70%, C3H3F5 10% and oxalic acid 20%, ultrasonically cleaned and then rinsed under high pressure water pressure ≥10 Bar for 35 minutes. Then, it was placed on a centrifuge to spin dry at 8000 RPM for 15 minutes. Finally, the treated cleaver product was bottled and protected in a cleanroom environment. 2) Laser treatment of the tip surface of the ceramic chopping knife A nano-laser device and a coaxial optical system were selected to position the laser source and the image lens in the same location. The laser spot diameter was adjusted to 6μm. After fixing the ceramic chopping knife, the focal length of the optical lens was adjusted to ensure that the tip surface of the ceramic chopping knife was in the clearest position. The corresponding drawing design was retrieved to obtain the corresponding pattern on the surface of the ceramic chopping knife. The drawing design consisted of interlocking patterns within circular rings, with a spacing of 4μm between the rings and a spacing of 15μm within each ring. The power of the laser generator was adjusted to 2.5W to obtain different differences in the height of the protrusions and different surface roughness Sa on the first layer of the ceramic chopping knife surface, thus completing the laser surface treatment of the tip surface of the ceramic chopping knife. 3) Laser treatment of the inner chamfer area of ​​the ceramic chamfering tool Using a femtosecond laser and a coaxial optical system, concentricity is ensured to prevent shape shifts during layer overlay. The laser spot diameter is adjusted to 3μm. After fixing the ceramic chamfer processed in step 2), the focal length of the optical lens is adjusted, using the junction of the inner chamfer and the tip as a reference point. The corresponding drawing design is retrieved to obtain the corresponding pattern on the surface of the ceramic chamfer. The drawing design consists of scattering lines with a spacing of 2μm between the lines. The power of the laser generator is adjusted to 1.5W to obtain different differences in the height of the protrusions and different surface roughness Sa on the surface of the ceramic chamfer in the second layer, thus completing the laser processing of the inner chamfer area of ​​the ceramic chamfer. 4) Remove the ceramic chopping knife and check the laser morphology under a microscope to see if it is normal. At the same time, measure the surface roughness Sa of the first layer (1.1 μm) and the difference in protrusion height (3.5 μm) under a 3D laser scanning microscope, and measure the surface roughness Sa of the second layer (2.6 μm) and the difference in protrusion height (3.9 μm). 5) Perform heat treatment on the ceramic chopping knife at a temperature of 1500℃ for 1 hour.

[0033] Comparative Example 1: No laser treatment, otherwise the same as Example 3.

[0034] Comparative Example 2: No first layer, i.e. no laser treatment of the ceramic chopping tip surface is performed, otherwise the same as Example 2.

[0035] Comparative Example 3: No second layer, i.e. no laser processing of the inner chamfer area of ​​the ceramic chamfering tool is performed, the rest is the same as Example 2.

[0036] Comparative Example 4: The diameter of the light spot in the first layer was changed to 2μm, and the rest was the same as in Example 2.

[0037] Comparative Example 5: The diameter of the light spot in the first layer was changed to 12μm, and the rest was the same as in Example 2.

[0038] Comparative Example 6: The laser power of the first layer was changed to 0.2W, and the rest was the same as in Example 2.

[0039] Comparative Example 7: The laser power of the first layer was changed to 7W, and the rest was the same as in Example 2.

[0040] Comparative Example 8: The diameter of the light spot in the second layer was changed to 0.5 μm, and the rest was the same as in Example 2.

[0041] Comparative Example 9: The diameter of the light spot in the second layer was changed to 4μm, and the rest was the same as in Example 2.

[0042] Comparative Example 10: The laser power of the second layer was changed to 0.2W, and the rest was the same as in Example 2.

[0043] Comparative Example 11: The laser power of the second layer was changed to 3W, and the rest was the same as in Example 2.

[0044] Table 1 shows the MTBA performance evaluation of the nickel-palladium-gold frame wire bonding machines under different conditions in Examples 1-5 and Comparative Examples 1-11.

[0045] Table 1

[0046] As shown in Table 1, the morphology of Comparative Examples 4, 5, 8, and 9 changed. This may be due to changes in the friction between the wire / frame and the ceramic wedge during wire bonding, leading to increased wear on the ceramic wedge and resulting in a lower MTBA. Comparative Examples 6 and 10 had low laser power; during the first layer application, the laser energy received by the ceramic wedge surface was low, and the temperature was insufficient to achieve melting and vaporization, meaning the surface morphology was not formed, similar to Comparative Example 2. Similarly, Comparative Examples 7 and 11 had low laser power; during the second layer application, the laser energy received by the ceramic wedge surface was low, and the temperature was insufficient to achieve melting and vaporization, meaning the surface morphology was not formed, similar to Comparative Example 3.

Claims

1. A method for laser surface treatment of ceramic cleavers, characterized in that: The specific processing steps are as follows: 1) Surface pretreatment of ceramic chopping blade First, the surface of the ceramic chopping knife is polished using a fine-grained diamond polishing slurry while the ceramic chopping knife is rotating at high speed. Then the surface of the ceramic chopping knife is cleaned by ultrasonic immersion cleaning followed by high-pressure water cleaning. The treated chopping knife products are then bottled and protected in a cleanroom environment. 2) Laser treatment of the tip surface of the ceramic chopping knife A nano-laser device and a coaxial optical system are selected to position the laser source and the image lens in the same location. The diameter of the laser spot is adjusted, and the focal length of the optical lens is adjusted after the ceramic chopping knife is fixed in place to ensure that the tip surface of the ceramic chopping knife is in the clearest position. The corresponding drawing design is called to obtain the corresponding pattern on the surface of the ceramic chopping knife. The drawing design is a pattern with intervals in the inner rings, with the spacing between the rings being 2-6 μm and the spacing within the rings being controlled at 10-20 μm. The power of the laser generator is adjusted to obtain different differences in the height of the protrusions and different surface roughness Sa on the surface of the ceramic chopping knife in the first layer, thus completing the laser surface treatment of the tip surface of the ceramic chopping knife. 3) Laser treatment of the inner chamfer area of ​​the ceramic chamfering tool Using femtosecond equipment and a coaxial light system ensures concentricity and prevents shape shift when layers are stacked. After adjusting the laser spot diameter, fix the ceramic chamfer processed in step 2) and adjust the focal length of the optical lens. Use the junction of the inner chamfer and the tip as the reference point to adjust the focal length. Call up the corresponding drawing design to obtain the corresponding pattern on the surface of the ceramic chamfer. The drawing design is a scattering line with a spacing of 0.5 to 3 μm between the lines. Adjust the power of the laser generator to obtain different convex height differences and different surface roughness Sa on the surface of the ceramic chamfer in the second layer, thus completing the laser processing of the inner chamfer area of ​​the ceramic chamfer. 4) Remove the ceramic chopping knife and check the laser morphology under a microscope to see if it is normal. At the same time, measure the surface roughness Sa and the difference in protrusion height between the first and second layers under a 3D laser scanning microscope. 5) Perform heat treatment on the ceramic chopping knife. The heat treatment temperature is between 500 and 1500℃, and the heat treatment time is between 1 and 10 hours.

2. The method according to claim 1, characterized in that: The diamond polishing slurry described in step 1) has diamond particles with a diameter ≤0.2μm, and the ceramic cleaver rotates at a high speed of 10000~15000RPM for 30~60 minutes.

3. The method according to claim 1, characterized in that: The ultrasonic immersion cleaning described in step 1) involves an ultrasonic frequency of 40–80 kHz, immersion in a hydrocarbon cleaning agent at a temperature of 60–80°C, and an immersion time of at least 3 hours.

4. The method according to claim 3, characterized in that: The hydrocarbon cleaning agent has the following components and their weight percentages: C 12 H 26 60-80%, C3H3F5 10-20% and oxalic acid 10-20%.

5. The method according to claim 3, characterized in that: After ultrasonic cleaning, rinse under high pressure water (≥10 Bar) for 30–40 minutes. Then, place the product in a centrifuge for spin drying at 6000–10000 RPM for 5–20 minutes or more.

6. The method according to claim 1, characterized in that: In step 2), the diameter of the laser spot is 3 to 10 μm, and the power of the laser generator is 0.5 to 5 W.

7. The method according to claim 5, characterized in that: In step 2), the height difference of the protrusions is 0.2–6 μm, and the roughness is 0.2–5 μm.

8. The method according to claim 1, characterized in that: In step 3), the diameter of the laser spot is 1–3 μm, and the power of the laser generator is 0.5–1.5 W.

9. The method according to claim 1, characterized in that: In step 3), the height difference of the protrusions is 0.2–5 μm, and the roughness is 0.1–3 μm.

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