A poor marking device

Abstract

The present application relates to a kind of bad marking device, including first deviation rectifying mechanism, laser cutting mechanism, first CCD detection mechanism, second CCD detection mechanism, second deviation rectifying mechanism, cutting mechanism, third CCD detection mechanism, fourth CCD detection mechanism, first marking mechanism, second marking mechanism, first winding mechanism and second winding mechanism, above-mentioned bad marking device, can identify the position of pole piece by ccd detection mechanism, can real-time adjust the position of sensor on deviation rectifying mechanism, make the size accurate when pole piece die cutting, cutting, avoid the abnormal cutting size due to coating misplacement on both sides of pole piece, CCD detection mechanism can adjust the position and angle of light source and CCD detector, meet the detection demand of each width size, marking machine is adjusted by marking movement component and marking rotating component regulator angle and position, can adapt to different requirements of marking situation, while facilitating staff to replace label paper quickly, provide staff efficiency.

Description

Technical Field

[0001] This invention relates to the field of lithium battery production technology, and in particular to a defect marking device. Background Technology

[0002] The new energy vehicle industry has experienced rapid development and market growth in recent years. As a core component of new energy vehicles, lithium-ion power batteries have seen explosive growth. Simultaneously, the market is continuously demanding higher standards for lithium-ion batteries in terms of energy density, lifespan, and safety. Therefore, battery manufacturers must pay closer attention to quality and cost control during the production process, striving to improve product quality and consistency while reducing production costs. Lithium-ion battery electrode manufacturing is a crucial process in battery production, specifically including slurry preparation, electrode coating and drying, electrode rolling and compaction, and electrode slitting and cutting.

[0003] Currently, more and more online inspection technologies are being used in the manufacturing process of battery electrodes to effectively identify manufacturing defects, eliminate defective products, and provide timely feedback to the production line. This allows for automatic or manual adjustments to the production process, thereby reducing the defect rate.

[0004] The speed requirements for lithium battery equipment in the front, middle and rear stages are becoming increasingly stringent. High-speed roller pressing and slitting integrated machines and high-speed slitting machines generally have a production speed of 60 km / h. A speed of 100 m / min places higher demands on the defect detection and quality control of electrode sheets during the production process. CCD vision is used for real-time detection of surface defects in the electrode sheets. This involves using a linear CCD to scan the object under test, processing and analyzing the images in real time to classify defects, achieving non-destructive online detection of surface defects. Defective electrode sheet areas are then marked, typically using methods such as labeling or inkjet printing. However, these marking methods have poor accuracy and are prone to problems such as missed markings and mislabeling, resulting in either missed detection or over-detection of defective electrode sheets. Summary of the Invention

[0005] The main objective of this invention is to provide a defect marking device to solve the above-mentioned technical problems. It can identify the position of the electrode through the CCD detection mechanism, and can adjust the position of the sensor on the correction mechanism in real time to ensure accurate dimensions during electrode die-cutting and slitting, avoid abnormal slitting dimensions caused by coating misalignment on both sides of the electrode, and mark the defective products detected by the CCD detection mechanism through the marking mechanism.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A defective marking device, comprising: The first correction mechanism receives electrode position signals from the first CCD detection mechanism, the second CCD detection mechanism, the third CCD detection mechanism, and the fourth CCD detection mechanism and performs correction to ensure the consistency of the electrode tab size after laser laser treatment. Laser cutting mechanism, used to cut electrode sheets to form electrode tabs; The first CCD detection mechanism is used to detect the electrode forming size, and feeds back the detected electrode position to the first correction mechanism. The detection result is fed back to the first marking mechanism and the second marking mechanism. The second CCD inspection mechanism is used to detect the electrode forming size, feed back the detected electrode position to the first correction mechanism, and perform defect detection on the electrode. The inspection results are fed back to the first marking mechanism and the second marking mechanism. The second correction mechanism receives position signals from the third and fourth CCD detection mechanisms and performs correction to ensure the extreme width dimension of the electrode sheet after slitting. The slitting mechanism cuts the electrode sheet into two segments; The third CCD inspection mechanism is used to inspect the ultra-wide dimensions, feed back the detected electrode position to the first and second correction mechanisms, and perform defect inspection on the electrode. The inspection results are fed back to the first and second marking mechanisms. The fourth CCD inspection mechanism is used to inspect the ultra-wide dimensions, feed back the detected electrode position to the first and second correction mechanisms, and perform defect inspection on the electrode. The inspection results are fed back to the first and second marking mechanisms. The first marking organization is used for defect detection marking. The second marking agency is used for defect detection marking; The first winding mechanism is used to wind up the slit electrode sheets; The second winding mechanism is used to wind up the slit electrode sheets; The electrode sheet includes an aluminum foil, a positive electrode, and a ceramic. A coating machine coats the positive electrode slurry onto one side of the aluminum foil and coats the ceramic slurry onto both sides of the positive electrode slurry. The electrode sheet is then dried to form a first positive electrode and a first ceramic. After drying, the coating machine coats the positive electrode slurry onto the other side of the aluminum foil and coats the ceramic slurry onto both sides of the positive electrode slurry on that side. Finally, the electrode sheet is dried to form a second positive electrode and a second ceramic. The correction steps of the first correction agency mentioned above are as follows: A1. Simultaneously, the first ceramic heights collected by the first and second CCD detection mechanisms are taken as Ta1 and Ta2, respectively, and the second ceramic heights collected by the third and fourth CCD detection mechanisms are taken as Tb1 and Tb2. Ta1, Ta2, Tb1, and Tb2 are sent to the PLC, and n sets of data are taken respectively: Ta11, Ta12, ..., Ta1n; Ta21, Ta22, ..., Ta2n; Tb11, Tb12, ..., Tb1n; Tb21, Tb22, ..., Tb2n; A2. Subtract the height of the first ceramic on the outer side from the height of the first ceramic on the inner side of the first group to obtain the difference in the first group: △Ta1=Ta11-Ta21. Similarly, the difference in the data of the Nth group is: △Tan=Ta1n-Ta2n. A3. Add up the differences of n sets of data and divide by n to get the average difference of the first ceramic △TA=(△Ta1+△Ta2+△Ta3+...△Tan) / n; A4. Similarly, the average difference of the second ceramic can be obtained as △TB=(△Tb1+△Tb2+△Tb3+...△Tbn) / n; A5. Calculate the die-cutting correction value: △T = (average difference of the first ceramic + average difference of the second ceramic) / 4 = (△TA + △TB) / 4; A6. The PLC feeds back the die-cutting correction value to the first correction mechanism for correction. The corrective actions of the second corrective agency mentioned above are as follows: B1. At the same time, the coating widths of the two segments of the electrode sheet after slicing are collected by the third CCD detection agency and the fourth CCD detection agency respectively, and the data of W1 and W2 are sent to the PLC. B2. Take n sets of data respectively: W11, W12, ..., W1n; W21, W22, ..., W2n; B3. Add up the differences of n sets of data and divide by n to get the average difference of the inner side △W_inner side = (△W11 + △W12 + △W13 + ... + △W1n) / n; B4. Similarly, the average difference on the outer side can be obtained as △W_outer_side = (△W21 + △W22 + △W23 + ... + △W2n) / n; B5. Calculate the slitting correction value: △W = (average difference on the inner side + average difference on the outer side) / 2 = (△W inner side + △W outer side) / 2; B6. The PLC feeds back the cutting correction value to the second correction mechanism for correction.

[0007] As a preferred technical solution, the first correction mechanism includes a correction bracket, a correction drive component, a sensing component, and a limiting component. The sensing component is installed at both ends of the correction bracket, the correction drive component drives the correction bracket to move, and the limiting component is used to determine the reference position, left limit, and right limit of the movement of the correction bracket.

[0008] As a preferred technical solution, the sensing component includes a sensor, a sensor mounting base, and a sensing adjustment unit. The sensing adjustment unit is mounted on the correction bracket, the sensor is mounted on the sensor mounting base, and the sensor mounting base is connected to the sensing adjustment unit.

[0009] As a preferred technical solution, the sensing adjustment unit includes a sensing adjustment base, a sensing adjustment handle, a sensing adjustment screw, and a sensing adjustment slider. The sensing adjustment screw meshes with the sensing adjustment slider, the sensing adjustment handle is fixed to both ends of the sensing adjustment screw, the sensing adjustment screw is rotatably mounted on the sensing adjustment base, and the sensing adjustment slider is fixed to the sensor mounting base.

[0010] As a preferred technical solution, the first CCD detection mechanism includes a light source assembly and a CCD detection assembly. The light source assembly is aligned with the electrode sheet, the illumination position of the light source assembly is the tangent point of the roller that transmits the electrode sheet, and the electrode sheet is driven along the tangential direction of the roller. The detection position of the CCD detection assembly is the tangent point of the roller that transmits the electrode sheet.

[0011] As a preferred technical solution, the light source assembly includes a light source rotation shaft, a light source adjustment block, a light source fixing block, and a light source. The light source fixing block is installed at both ends of the light source and is movably disposed on the light source adjustment block. The light source fixing block is locked onto the light source adjustment block by bolts. The light source adjustment block is clamped onto the light source rotation shaft and can rotate along the light source rotation shaft.

[0012] As a preferred technical solution, the CCD detection assembly includes a CCD mounting base, a CCD rotating shaft, a CCD clamping block, a CCD adjustment unit, and a CCD detector. The CCD mounting base is fixed on the frame, the CCD rotating shaft is fixed on the CCD mounting base, the CCD clamping block is clamped on the CCD rotating shaft, the CCD detector is mounted on the CCD adjustment unit, and the CCD clamping block is fixed on the CCD adjustment unit and can rotate along the CCD rotating shaft.

[0013] As a preferred technical solution, the CCD adjustment unit includes a CCD adjustment mounting base, a CCD adjustment screw, a CCD adjustment handle, and a CCD adjustment slider. The CCD adjustment mounting base is fixed to the CCD clamping block, the CCD adjustment handle is fixed to the end of the CCD adjustment screw, the CCD adjustment screw is rotatably mounted on the CCD adjustment mounting base, the CCD adjustment slider engages with the CCD adjustment screw, and the CCD adjustment slider is fixed to the CCD detector.

[0014] As a preferred technical solution, the first marking mechanism includes a marking base, a marking moving component, a marking rotating component, and a marking machine. The marking moving component is mounted on the marking base, and the marking moving component drives the marking rotating component to rotate. The marking machine is mounted on the marking rotating component.

[0015] As a preferred technical solution, the marking moving assembly includes a marking guide rail, a marking timing belt, a marking drive wheel, a marking driven wheel, a marking adjustment handwheel, and a marking slider. The marking guide rail is fixed on the marking base. The marking drive wheel and the marking driven wheel are installed at both ends of the marking base. The marking drive wheel is connected to the marking driven wheel through the marking timing belt. The marking adjustment handwheel is fixed to the marking drive wheel. The marking slider moves along the marking guide rail. The marking timing belt is connected to the marking machine. The marking slider is fixed to the marking rotating assembly.

[0016] The beneficial effects of the present invention are as follows: The above-mentioned defective marking device can identify the position of the electrode sheet through the CCD detection mechanism, and can adjust the position of the sensor on the correction mechanism in real time to ensure the accuracy of the electrode sheet die-cutting and slitting dimensions, avoiding abnormal slitting dimensions caused by coating misalignment on both sides of the electrode sheet. The marking mechanism marks the defective products detected by the CCD detection mechanism. The CCD detection mechanism can adjust the position and angle of the light source and the CCD detector to meet the detection requirements of various width sizes. The marking machine can adapt to different marking requirements by adjusting the angle and position of the marking moving component and the marking rotating component, while also facilitating quick label replacement by employees and improving employee efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the defective marking device involved in the present invention; Figure 2 This is a cross-sectional view of the electrode sheet involved in the present invention; Figure 3 This is a top view of the electrode sheet involved in the present invention; Figure 4 This is a schematic diagram of the first correction mechanism involved in the present invention; Figure 5 This is a schematic diagram of the structure of the first CCD detection mechanism involved in this invention; Figure 6 This is a schematic diagram of the use of the first CCD inspection mechanism involved in this invention; Figure 7 This is a schematic diagram of the structure of the first marking mechanism involved in the present invention. Figure 1 ; Figure 8 This is a schematic diagram of the structure of the first marking mechanism involved in the present invention. Figure 2 . Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0019] like Figure 1-3 As shown, a defective marking device includes a first correction mechanism 2, a laser cutting mechanism 1, a first CCD detection mechanism 3, a second CCD detection mechanism 4, a second correction mechanism 5, a slitting mechanism 6, a third CCD detection mechanism 7, a fourth CCD detection mechanism 10, a first marking mechanism 8, a second marking mechanism 11, a first winding mechanism 9, and a second winding mechanism 12. The first correction mechanism 2 is used to receive the electrode position signals of the first CCD detection mechanism 3, the second CCD detection mechanism 4, the third CCD detection mechanism 7, and the fourth CCD detection mechanism 10 and perform correction. To ensure the consistency of electrode tab dimensions after laser cutting; laser cutting mechanism 1 is used to cut the electrode to form tabs; first CCD detection mechanism 3 is used to detect the tab forming dimensions, and feeds back the detected electrode position to first correction mechanism 2, and the detection result is fed back to first marking mechanism 8 and second marking mechanism 11; second CCD detection mechanism 4 is used to detect the tab forming dimensions, feed back the detected electrode position to first correction mechanism 2, and perform defect detection on the electrode, and feeds back the detection result to first marking mechanism 8 and second marking mechanism 11; second correction mechanism 5 receives from third CCD detection mechanism 7. The fourth CCD detection mechanism 10 is used to detect the position signal and perform correction to ensure the extreme width dimension of the electrode a after slicing; the slicing mechanism 6 is used to slice the electrode into two segments; the third CCD detection mechanism 7 is used to detect the extreme width dimension, feed back the detected electrode position to the first correction mechanism 2 and the second correction mechanism 5, and perform defect detection on the electrode, and the detection result is fed back to the first marking mechanism 8 and the second marking mechanism 11; the fourth CCD detection mechanism 10 is used to detect the extreme width dimension, feed back the detected electrode position to the first correction mechanism 2 and the second correction mechanism 5, and perform defect detection on the electrode, and the detection result is fed back to the first marking mechanism 8 and the second marking mechanism 11; The test results are fed back to the first marking mechanism 8 and the second marking mechanism 11; the first marking mechanism 8 is used to mark the defective electrode sheets identified by the first CCD detection mechanism 3, the second CCD detection mechanism 4, the third CCD detection mechanism 7 and the fourth CCD detection mechanism 10; the second marking mechanism 11 is used to mark the defective electrode sheets identified by the first CCD detection mechanism 3, the second CCD detection mechanism 4, the third CCD detection mechanism 7 and the fourth CCD detection mechanism 10; the first winding mechanism 9 is used to wind up the slit electrode sheets; the second winding mechanism 12 is used to wind up the slit electrode sheets.

[0020] Electrode a includes aluminum foil a1, a first positive electrode a11, a first ceramic a12, a second positive electrode a21, and a second ceramic a22. A coating machine coats the positive electrode slurry onto one side of the aluminum foil a1 and coats the ceramic slurry onto both sides of the positive electrode slurry. The electrode is then dried to form the first positive electrode a11 and the first ceramic a12. After drying, the coating machine coats the positive electrode slurry onto the other side of the aluminum foil a1 and coats the ceramic slurry onto both sides of the positive electrode slurry on that side. Finally, the electrode is dried to form the second positive electrode a21 and the second ceramic a22. The correction steps of the first correction mechanism 2 mentioned above are as follows: A1. At the same time, the first ceramic heights Ta1 and Ta2 collected by the first CCD detection mechanism 3 and the second CCD detection mechanism 4, respectively, and the second ceramic heights Tb1 and Tb2 collected by the third CCD detection mechanism 7 and the fourth CCD detection mechanism 10, respectively, are sent to the PLC. Then, n sets of data are collected respectively: Ta11, Ta12, ..., Ta1n; Ta21, Ta22, ..., Ta2n; Tb11, Tb12, ..., Tb1n; Tb21, Tb22, ..., Tb2n; A2. Subtract the height of the outer first ceramic a12 from the height of the inner first ceramic a12 in the first group to obtain the first group's difference: △Ta1=Ta11-Ta21. Similarly, the difference of the Nth group's data is: △Tan=Ta1n-Ta2n. A3. Add up the differences of n sets of data and divide by n to get the average difference of the first ceramic a12, △TA=(△Ta1+△Ta2+△Ta3+...△Tan) / n; A4. Similarly, the average difference △TB of the second ceramic a22 can be obtained as △Tb1+△Tb2+△Tb3+...△Tbn) / n; A5. Calculate the die-cutting correction value: △T = (average difference of the first ceramic + average difference of the second ceramic) / 4 = (△TA + △TB) / 4; A6. The PLC feeds back the die-cutting correction value to the first correction mechanism 2 for correction. The correction steps of the second correction mechanism 5 mentioned above are as follows: B1. At the same time, the coating widths of the two segments of the electrode sheet after the splitting are collected by the third CCD detection mechanism 7 and the fourth CCD detection mechanism 10 respectively, and the data of W1 and W2 are sent to the PLC. B2. Take n sets of data respectively: W11, W12, ..., W1n; W21, W22, ..., W2n; B3. Add up the differences of n sets of data and divide by n to get the average difference of the inner side △W_inner side = (△W11 + △W12 + △W13 + ... + △W1n) / n; B4. Similarly, the average difference on the outer side can be obtained as △W_outer_side = (△W21 + △W22 + △W23 + ... + △W2n) / n; B5. Calculate the slitting correction value: △W = (average difference on the inner side + average difference on the outer side) / 2 = (△W inner side + △W outer side) / 2; B6. The PLC feeds back the cutting correction value to the second correction mechanism for correction.

[0021] like Figure 4 As shown, the first correction mechanism 2 and the second correction mechanism 5 have the same structure. In this embodiment, only the first correction mechanism 2 is used as an example for explanation. The first correction mechanism 2 includes a correction bracket 21, a correction drive component 22, a first sensing component 23 and a second sensing component 24, and a limiting component 25. The first sensing component 23 and the second sensing component 24 are installed at both ends of the correction bracket 21. The correction drive component 22 drives the correction bracket 21 to move. The limiting component 25 is used to determine the reference position, left limit, and right limit of the movement of the correction bracket 21.

[0022] The first sensing component 23 and the second sensing component 24 have the same structural dimensions. In this embodiment, only the first sensing component 23 is described as an example. The first sensing component 23 includes a sensor 231, a sensor mounting base 232, a sensing adjustment unit 233, a limit handle 238, and an adjustment pointer 239. The sensing adjustment unit 233 is mounted on the correction bracket 21, and the sensor 231 is mounted on the sensor mounting base 232. The sensor mounting base 232 is connected to the sensing adjustment unit 233. The sensing adjustment unit 233 includes a sensing adjustment... The system comprises a mounting base 234, a sensor adjustment handle 235, a sensor adjustment screw 236, and a sensor adjustment slider 237. The sensor adjustment screw 236 engages with the sensor adjustment slider 237. The sensor adjustment handle 235 is fixed at both ends of the sensor adjustment screw 236, which is rotatably mounted on the sensor adjustment base 234. The sensor adjustment slider 237 is fixed to the sensor mounting base 232. Operating the sensor adjustment handle 235 causes the sensor adjustment screw 236 to rotate, which in turn moves the sensor adjustment slider 237, thereby moving the sensor 231. A correction scale 211 is provided on the correction bracket 21. An adjustment pointer 239 is fixed on the sensor adjustment slider 237 and points to the correction scale 211 for precise adjustment of the position of the long-term device 231. A limit handle 238 is fixed to the upper end of the sensor adjustment base 234 to limit the adjustment distance of the sensor adjustment slider 237.

[0023] The limiting component 25 includes a reference position sensor 252, a left limit sensor 251, a right limit sensor 253, and a sensing plate 254. The reference position sensor 252, the left limit sensor 251, and the right limit sensor 253 are mounted on the correction drive component 22, and the sensing plate 254 is fixed on the correction bracket 21 for setting the reference position, left limit, and right limit of the correction bracket 21.

[0024] like Figure 5 and Figure 6 As shown, the first CCD detection mechanism 3, the second CCD detection mechanism 4, the third CCD detection mechanism 7, and the fourth CCD detection mechanism 10 have the same structure. In this embodiment, only the first CCD detection mechanism 3 is used as an example for explanation. The first CCD detection mechanism 3 includes a light source assembly 31 and a CCD detection assembly 32. The light source assembly 31 is aligned with the electrode sheet. The illumination position of the light source assembly 31 is the tangent point of the roller that transmits the electrode sheet, and the electrode sheet is driven along the tangential direction of the roller. The light source range of the light source assembly 31 is 60°. The detection position of the CCD detection assembly 32 is the tangent point of the roller that transmits the electrode sheet. The detection range of the CCD detection assembly 32 is 60°. The intersection of the light source range of the light source assembly 31 and the detection range of the CCD detection assembly 32 is the normal line.

[0025] The light source assembly 31 includes a light source rotation shaft 311, a light source adjustment block 312, a light source fixing block 313, and a light source 314. The light source fixing block 313 is installed at both ends of the light source 314 and is movably mounted on the light source adjustment block 312. The light source fixing block 313 is locked onto the light source adjustment block 312 by bolts, and the distance between the light source 314 and the electrode can be adjusted. The light source adjustment block 312 is clamped onto the light source rotation shaft 311 and can rotate along the light source rotation shaft 311 to adjust the illumination angle of the light source 314. The light source adjustment block 312 is locked onto the light source rotation shaft 311 by bolts, so that the light source adjustment block 312 clamps the light source rotation shaft 311, thereby fixing the light source adjustment block 312 and the light source rotation shaft 311 to meet the requirements of light sources with different widths.

[0026] The CCD detection assembly 32 includes a CCD mounting base 321, a CCD rotating shaft 322, a CCD clamping block 323, a CCD adjustment unit 324, and a CCD detector 325. The CCD mounting base 321 is fixed to the frame, the CCD rotating shaft 322 is fixed to the CCD mounting base 321, and the CCD clamping block 323 is clamped onto the CCD rotating shaft 322. The CCD detector 325 is mounted on the CCD adjustment unit 324, and the CCD clamping block 323 is fixed to the CCD adjustment unit 324. The CCD clamping block 323 can rotate along the CCD rotating shaft 321 to adjust the detection angle of the CCD detector 325. The CCD clamping block 323 is locked with bolts to clamp the CCD rotating shaft 322, thus fixing the CCD clamping block 323 to the CCD rotating shaft 322. The CCD adjustment unit 324 can be operated to adjust the CCD detector 325. The distance between the CCD detector 325 and the electrode is determined by the CCD adjustment unit 324, which includes a CCD adjustment mounting base 3241, a CCD adjustment screw 3242, a CCD adjustment handle 3243, and a CCD adjustment slider 3244. The CCD adjustment mounting base 3241 is fixed to the CCD clamping block 323. The CCD adjustment handle 3243 is fixed to the end of the CCD adjustment screw 3242. The CCD adjustment screw 3242 is rotatably mounted on the CCD adjustment mounting base 3241. The CCD adjustment slider 3244 engages with the CCD adjustment screw 3242 and is fixed to the CCD detector 325. Operating the CCD adjustment handle 3243 causes the CCD adjustment screw 3242 to rotate, thereby causing the CCD adjustment slider 3244 to move, thereby adjusting the distance between the CCD detector 325 and the electrode, so that the CCD detector 325 moves to the optimal detection distance to meet the detection requirements of different widths.

[0027] like Figure 7 and Figure 8 As shown, the first marking mechanism 8 and the second marking mechanism 11 have the same structure. In this embodiment, only the first marking mechanism 8 is used as an example for explanation. The first marking mechanism 8 includes a marking base 81, a marking moving component 82, a marking rotating component 83, and a marking machine 84. The marking moving component 82 is installed on the marking base 81 and drives the marking rotating component 83 to rotate. The marking machine 84 is installed on the marking rotating component 83. The marking moving component 82 can adjust the position of the marking machine 84, and the marking rotating component 83 can adjust the angle of the marking machine 84. When the label paper in the marking machine 84 is finished, the marking machine 84 can be quickly moved out by the marking moving component 82, thereby realizing quick replacement of the label paper.

[0028] The marking moving assembly 82 includes a marking guide rail 821, a marking timing belt 822, a marking drive wheel 823, a marking driven wheel 824, a marking adjustment handwheel 825, and a marking slider 826. The marking guide rail 821 is fixed on the marking base 81. The marking drive wheel 823 and the marking driven wheel 824 are installed at both ends of the marking base 81. The marking drive wheel 823 is connected to the marking driven wheel 824 through the marking timing belt 822. Next, the marking adjustment handwheel 825 is fixed to the marking drive wheel 823, the marking slider 826 moves along the marking guide rail 821, the marking timing belt 822 is connected to the marking machine 84, and the marking slider 826 is fixed to the marking rotating assembly 83. Operating the adjustment handwheel 825 causes the marking drive wheel 823 to rotate, driving the marking timing belt 822 to move the marking machine 84 along the marking guide rail 821 via the marking slider 826. The marking base 81 is equipped with a scale 811 for precise adjustment of the marking machine 84's position. Limit blocks 812 are also provided at both ends of the marking base 81 to limit the movement distance of the marking rotating assembly 83.

[0029] The marking rotation assembly 83 includes a marking rotation seat 831 and a marking rotation arm 833. The marking rotation seat 831 is fixedly mounted to the marking slider 826. The marking machine 84 is fixedly mounted on the marking rotation arm 833. The marking rotation arm 833 is mounted on the marking rotation seat 831 and can rotate relative to the marking rotation seat 831. The marking rotation seat 831 is provided with an arc-shaped limiting groove 832. Bolts pass through the limiting groove 832 and are fixed to the marking rotation arm 833, thereby fixing the marking rotation arm 833 to adjust the angle of the marking machine 84.

[0030] The embodiments described above are merely preferred examples of the present invention and are not intended to limit the scope of the present invention. Therefore, all equivalent changes or modifications made to the structure, features and principles described in the claims of the present invention should be included within the scope of the present invention patent application.

Claims

1. A defective marking device, characterized in that, Including The first correction mechanism receives electrode position signals from the first CCD detection mechanism, the second CCD detection mechanism, the third CCD detection mechanism, and the fourth CCD detection mechanism and performs correction to ensure the consistency of the electrode tab size after laser laser treatment. Laser cutting mechanism, used to cut electrode sheets to form electrode tabs; The first CCD detection mechanism is used to detect the electrode forming size, and feeds back the detected electrode position to the first correction mechanism. The detection result is fed back to the first marking mechanism and the second marking mechanism. The second CCD inspection mechanism is used to detect the electrode forming size, feed back the detected electrode position to the first correction mechanism, and perform defect detection on the electrode. The inspection results are fed back to the first marking mechanism and the second marking mechanism. The second correction mechanism receives position signals from the third and fourth CCD detection mechanisms and performs correction to ensure the extreme width dimension of the electrode sheet after slitting. The slitting mechanism cuts the electrode sheet into two segments; The third CCD inspection mechanism is used to inspect the ultra-wide dimensions, feed back the detected electrode position to the first and second correction mechanisms, and perform defect inspection on the electrode. The inspection results are fed back to the first and second marking mechanisms. The fourth CCD inspection mechanism is used to inspect the ultra-wide dimensions, feed back the detected electrode position to the first and second correction mechanisms, and perform defect inspection on the electrode. The inspection results are fed back to the first and second marking mechanisms. The first marking organization is used for defect detection marking. The second marking agency is used for defect detection marking; The first winding mechanism is used to wind up the slit electrode sheets; The second winding mechanism is used to wind up the slit electrode sheets; The electrode sheet includes an aluminum foil, a positive electrode, and a ceramic. A coating machine coats the positive electrode slurry onto one side of the aluminum foil and coats the ceramic slurry onto both sides of the positive electrode slurry. The electrode sheet is then dried to form a first positive electrode and a first ceramic. After drying, the coating machine coats the positive electrode slurry onto the other side of the aluminum foil and coats the ceramic slurry onto both sides of the positive electrode slurry on that side. Finally, the electrode sheet is dried to form a second positive electrode and a second ceramic. The correction steps of the first correction agency mentioned above are as follows: A1. At the same time, take the first ceramic heights Ta1 and Ta2 collected by the first CCD detection mechanism and the second CCD detection mechanism, respectively, and the second ceramic heights Tb1 and Tb2 collected by the third CCD detection mechanism and the fourth CCD detection mechanism, respectively, and send Ta1, Ta2, Tb1, and Tb2 to the PLC, and take n sets of data respectively: Ta11, Ta12, ..., Ta1n; Ta21, Ta22, ....Ta2n; Tb11, Tb12, ....Tb1n; Tb21, Tb22, ....Tb2n; A2. Subtract the height of the first ceramic on the outer side from the height of the first ceramic on the inner side of the first group to obtain the first group's difference: △Ta1=Ta11-Ta21. Similarly, the difference of the Nth group's data is: △Tan=Ta1n-Ta2n. A3. Add up the differences of n sets of data and divide by n to get the average difference of the first ceramic △TA=(△Ta1+△Ta2+△Ta3+...△Tan) / n; A4. Similarly, the average difference of the second ceramic can be obtained as △TB=(△Tb1+△Tb2+△Tb3+...△Tbn) / n; A5. Calculate the die-cutting correction value: △T = (average difference of the first ceramic + average difference of the second ceramic) / 4 = (△TA + △TB) / 4; A6. The PLC feeds back the die-cutting correction value to the first correction mechanism for correction. The corrective actions of the second corrective agency mentioned above are as follows: B1. At the same time, the coating widths of the two segments of the electrode sheet after slicing are collected by the third CCD detection mechanism and the fourth CCD detection mechanism respectively, and the data of W1 and W2 are sent to the PLC. B2. Take n sets of data respectively: W11, W12, ..., W1n; W21, W22, ..., W2n; B3. Add up the differences of n sets of data and divide by n to get the average difference of the inner side △W_inner side = (△W11 + △W12 + △W13 + ... + △W1n) / n; B4. Similarly, the average difference on the outer side can be obtained as △W_outer_side = (△W21 + △W22 + △W23 + ... + △W2n) / n; B5. Calculate the slitting correction value: △W = (average difference on the inner side + average difference on the outer side) / 2 = (△W inner side + △W outer side) / 2; B6. The PLC feeds back the cutting correction value to the second correction mechanism for correction.

2. The defective marking device according to claim 1, characterized in that, The first correction mechanism includes a correction bracket, a correction drive assembly, a sensing assembly, and a limiting assembly. The sensing assembly is installed at both ends of the correction bracket. The correction drive assembly drives the correction bracket to move. The limiting assembly is used to determine the reference position, left limit, and right limit of the movement of the correction bracket.

3. The defective marking device according to claim 2, characterized in that, The sensing assembly includes a sensor, a sensor mounting base, and a sensing adjustment unit. The sensing adjustment unit is mounted on the correction bracket, the sensor is mounted on the sensor mounting base, and the sensor mounting base is connected to the sensing adjustment unit.

4. The defective marking device according to claim 3, characterized in that, The sensing adjustment unit includes a sensing adjustment base, a sensing adjustment handle, a sensing adjustment screw, and a sensing adjustment slider. The sensing adjustment screw meshes with the sensing adjustment slider. The sensing adjustment handle is fixed to both ends of the sensing adjustment screw. The sensing adjustment screw is rotatably mounted on the sensing adjustment base. The sensing adjustment slider is fixed to the sensor mounting base.

5. The defective marking device according to claim 1, characterized in that, The first CCD detection mechanism includes a light source assembly and a CCD detection assembly. The light source assembly is aligned with the electrode sheet, and the illumination position of the light source assembly is the tangent point of the roller that transmits the electrode sheet. The electrode sheet is driven along the tangent direction of the roller. The detection position of the CCD detection assembly is the tangent point of the roller that transmits the electrode sheet.

6. The defective marking device according to claim 5, characterized in that, The light source assembly includes a light source rotation shaft, a light source adjustment block, a light source fixing block, and a light source. The light source fixing block is installed at both ends of the light source and is movably disposed on the light source adjustment block. The light source fixing block is locked onto the light source adjustment block by bolts. The light source adjustment block is clamped onto the light source rotation shaft and can rotate along the light source rotation shaft.

7. The defective marking device according to claim 5, characterized in that, The CCD detection assembly includes a CCD mounting base, a CCD rotating shaft, a CCD clamping block, a CCD adjustment unit, and a CCD detector. The CCD mounting base is fixed to the frame, the CCD rotating shaft is fixed to the CCD mounting base, the CCD clamping block is clamped to the CCD rotating shaft, the CCD detector is mounted on the CCD adjustment unit, and the CCD clamping block is fixed to the CCD adjustment unit. The CCD clamping block can rotate along the CCD rotating shaft.

8. The defective marking device according to claim 7, characterized in that, The CCD adjustment unit includes a CCD adjustment mounting base, a CCD adjustment screw, a CCD adjustment handle, and a CCD adjustment slider. The CCD adjustment mounting base is fixed to the CCD clamping block, the CCD adjustment handle is fixed to the end of the CCD adjustment screw, the CCD adjustment screw is rotatably mounted on the CCD adjustment mounting base, the CCD adjustment slider engages with the CCD adjustment screw, and the CCD adjustment slider is fixed to the CCD detector.

9. The defective marking device according to claim 1, characterized in that, The first marking mechanism includes a marking base, a marking moving component, a marking rotating component, and a marking machine. The marking moving component is mounted on the marking base and drives the marking rotating component to rotate. The marking machine is mounted on the marking rotating component.

10. The defective marking device according to claim 9, characterized in that, The marking moving assembly includes a marking guide rail, a marking timing belt, a marking drive wheel, a marking driven wheel, a marking adjustment handwheel, and a marking slider. The marking guide rail is fixed on the marking base. The marking drive wheel and the marking driven wheel are installed at both ends of the marking base. The marking drive wheel is connected to the marking driven wheel through the marking timing belt. The marking adjustment handwheel is fixed to the marking drive wheel. The marking slider moves along the marking guide rail. The marking timing belt is connected to the marking machine. The marking slider is fixed to the marking rotating assembly.

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