Temperature control methods and devices for mold temperature controllers

Abstract

This invention provides a temperature control method and apparatus for a mold temperature controller. The method involves matching the control temperature of the mold temperature controller to the operating stage of the equipment; adjusting the water circuit temperature and oil circuit temperature based on the control temperature of the mold temperature controller, wherein the mold temperature controller integrates water and oil circuits; acquiring the temperature protection curve of the mold temperature controller and automatically correcting it along the temperature protection curve and the current temperature trigger temperature. At this time, the mold temperature controller integrates water and oil circuits, and adjusts the water and oil circuit temperatures based on the control temperature of the mold temperature controller, so as to integrate water and oil circuit temperature control within the mold temperature controller, and combine water and oil circuit temperature control for overall management, facilitating coordinated temperature control. Simultaneously, the automatic correction along the temperature protection curve and the current temperature trigger temperature ensures early warning protection of the current temperature of the mold temperature controller, and enables automatic correction, facilitating timely early warning regulation and coordinated temperature control.

Description

Technical Field

[0001] This invention relates to the technical field of temperature control for mold temperature controllers, and more particularly to a temperature control method and apparatus for a mold temperature controller. Background Technology

[0002] With the development of technology, mold temperature controllers, also known as mold temperature control machines, were initially used in the injection mold temperature control industry. Later, with the development of the machinery industry, their applications became more and more widespread, and mold temperature controllers are now widely used in various industries such as plastic molding, die casting, rubber tires, rollers, chemical reactors, bonding, and mixing. In existing technology, current mold temperature controllers generally use water circuits for temperature control, and rely on water in the water circuit for cooling or heating. However, existing mold temperature controllers only use a single water circuit for temperature control and cannot perform coordinated temperature control. Summary of the Invention

[0003] One objective of this invention is to provide a temperature control method and apparatus for a mold temperature controller. In this method, the mold temperature controller integrates a water circuit and an oil circuit. The water circuit temperature and oil circuit temperature are adjusted based on the control temperature of the mold temperature controller. This allows for the integration of water circuit temperature control and oil circuit temperature control within the mold temperature controller, and the combined control of these two systems enables coordinated temperature management. Simultaneously, the system automatically corrects itself along the temperature protection curve and the current temperature trigger temperature, ensuring early warning protection for the current temperature of the mold temperature controller and enabling automatic correction. This facilitates timely early warning and coordinated temperature management, ensuring the operational stability of the mold temperature controller.

[0004] To achieve the above objectives, some embodiments of the present invention provide a temperature control method for a mold temperature controller, applied to a mold temperature controller, the temperature control method comprising:

[0005] Collect the docking signal of the mold temperature controller and determine the equipment to which the mold temperature controller is docked based on the docking signal;

[0006] Associate the mold temperature controller and its connected equipment, and define the operating phases of the equipment;

[0007] Match the mold temperature controller to the operating stage of the equipment;

[0008] The temperature control of the mold temperature controller regulates the water and oil circuit temperatures, where the mold temperature controller integrates both water and oil circuits.

[0009] Collect the temperature protection curve of the mold temperature controller and automatically correct it along the temperature protection curve and the current temperature trigger temperature.

[0010] Optionally, the step of acquiring the docking signal of the mold temperature controller and determining the device to which the mold temperature controller is docked based on the docking signal includes:

[0011] Find the location of the mold temperature controller;

[0012] The mold temperature controller is determined based on its location, and the mold temperature controllers are traversed.

[0013] During the process of traversing the mold temperature controller, the docking signal of the mold temperature controller is collected;

[0014] Docking information is defined based on the signal analysis of the docking signals;

[0015] Based on the docking information, determine the equipment that the mold temperature controller is docked with, and define the model of the equipment and the model of the mold temperature controller;

[0016] Performance matching is triggered based on the equipment model and the mold temperature controller model to define the performance level;

[0017] Adjust the control path of the mold temperature controller according to the performance level, and use the mold temperature controller to assist the equipment in temperature control.

[0018] Optionally, the associated mold temperature controller and its docked equipment, and the definition of the equipment's operating phases, include:

[0019] Related mold temperature controllers and their connected equipment;

[0020] Monitor the equipment in real time and collect its operating parameters;

[0021] Define the device's operating status and operating path based on its operating parameters.

[0022] Optionally, the association of the mold temperature controller and its connected equipment, and the definition of the equipment's operating stages, further includes:

[0023] Collect temperature parameters from the mold temperature controller;

[0024] The working stages of the equipment are defined based on the temperature parameters of the mold temperature controller, the working status of the equipment, and the working path.

[0025] Optionally, matching the control temperature of the mold temperature controller according to the operating stage of the equipment includes:

[0026] During the equipment's operation phase, define the various working areas of the equipment and mark temperature parameters based on each working area;

[0027] The temperature parameters of each working area and the temperature parameters of the mold temperature controller are used to trigger the adjustment of each temperature path in the mold temperature controller.

[0028] Traverse each temperature path and collect the path shape of each temperature path.

[0029] Path parameters are defined based on the path shape of the temperature path;

[0030] Define the control temperature for each temperature path based on the path parameters and temperature parameters.

[0031] Optionally, the temperature control of the water circuit and oil circuit based on the mold temperature controller includes:

[0032] Collect the control temperature of the mold temperature controller;

[0033] The temperature control based on the mold temperature controller is divided into multiple sub-temperatures;

[0034] Associativity levels between each sub-temperature and the water circuit temperature control or oil circuit temperature definition.

[0035] Optionally, the temperature control of the water circuit and oil circuit based on the mold temperature controller, wherein the mold temperature controller integrates the water circuit and oil circuit, further includes:

[0036] The pipeline control modes are based on the correlation level and correspond to the temperature of each sub-temperature. The pipeline control modes include water temperature control and oil temperature control.

[0037] The water circuit temperature and oil circuit temperature are adjusted according to each sub-temperature and the corresponding pipeline control mode. The mold temperature controller integrates water circuit and oil circuit.

[0038] Optionally, the acquisition of the temperature protection curve of the mold temperature controller, and the automatic correction along the temperature protection curve and the current temperature trigger temperature, includes:

[0039] Monitor the overall temperature of the mold temperature controller in real time and define the current temperature curve based on the overall temperature at each time period;

[0040] Collect the temperature protection curve of the mold temperature controller and correlate the temperature protection curve with the current temperature curve;

[0041] Compare the temperature protection curve and the current temperature curve, and define the curve change range;

[0042] Temperature change levels are defined based on the amplitude of curve changes.

[0043] Collect the current temperature of the mold temperature controller and trigger a temperature warning based on the temperature change level, the current temperature of the mold temperature controller, and the temperature protection curve;

[0044] Automatic temperature correction is triggered by temperature early warning;

[0045] In the automatic temperature correction, the temperature reference value is determined based on the current temperature of the mold temperature controller and the warning level. The temperature control value is defined based on the temperature reference value and the corresponding temperature warning value in the temperature protection curve. The temperature control value triggers the temperature regulation of the mold temperature controller.

[0046] Optionally, the method of acquiring the temperature protection curve of the mold temperature controller and automatically correcting along the temperature protection curve and the current temperature trigger temperature further includes:

[0047] In the spontaneous temperature correction process, the temperature change of the mold temperature controller is introduced.

[0048] Define the temperature change of the mold temperature controller;

[0049] The priority of temperature control for water circuit temperature and oil circuit temperature is determined based on the amount of temperature change.

[0050] Define primary and secondary piping based on temperature control priority;

[0051] If the main pipeline is a water pipeline and the secondary pipeline is an oil pipeline, then a pipeline coordination system should be established based on the water pipeline.

[0052] Based on the pipeline coordination system, the coordination ratio between water circuit temperature and oil circuit temperature is matched, and temperature coordination control is carried out along the coordination ratio between water circuit temperature and oil circuit temperature.

[0053] Some embodiments of the present invention also provide a temperature control device for a mold temperature controller, comprising:

[0054] The data acquisition module is used to acquire the docking signal of the mold temperature controller and determine the device to which the mold temperature controller is docked based on the docking signal;

[0055] The association module is used to associate the mold temperature controller with the connected equipment and define the working stages of the equipment;

[0056] The temperature control module is used to match the control temperature of the mold temperature controller according to the working stage of the equipment.

[0057] The temperature control module is used to regulate the water circuit temperature and oil circuit temperature based on the temperature control of the mold temperature controller, which integrates the water circuit and oil circuit.

[0058] The correction module is used to collect the temperature protection curve of the mold temperature controller and automatically correct along the temperature protection curve and the current temperature trigger temperature.

[0059] Some embodiments of the present invention also provide a computer-readable medium having computer program instructions stored thereon, which can be executed by a processor to implement the temperature control method of the mold temperature controller described above.

[0060] Compared to existing technologies, the solution provided in this invention involves: acquiring the docking signal of the mold temperature controller and determining the device docked to by the mold temperature controller based on the docking signal; associating the mold temperature controller with its docked device and defining the working stage of the device; matching the control temperature of the mold temperature controller according to the working stage of the device; regulating the water circuit temperature and oil circuit temperature based on the control temperature of the mold temperature controller, wherein the mold temperature controller integrates water circuit and oil circuit; acquiring the temperature protection curve of the mold temperature controller and automatically correcting along the temperature protection curve and the current temperature trigger temperature. At this time, the mold temperature controller integrates water circuit and oil circuit, and regulates the water circuit temperature and oil circuit temperature based on the control temperature of the mold temperature controller, so that water circuit temperature control and oil circuit temperature control are integrated in the mold temperature controller, and the overall management is combined with the water circuit temperature control and oil circuit temperature control to facilitate coordinated temperature management. Simultaneously, the automatic correction along the temperature protection curve and the current temperature trigger temperature ensures the early warning protection of the current temperature of the mold temperature controller and enables automatic correction, so as to timely adjust the current temperature and coordinate temperature management, ensuring the working stability of the mold temperature controller. Attached Figure Description

[0061] Figure 1 A schematic flowchart illustrating a temperature control method for a mold temperature controller provided in an embodiment of the present invention;

[0062] Figure 2 It shows Figure 1 Flowchart of S110 in China;

[0063] Figure 3 It shows Figure 1 Flowchart of S120 in China;

[0064] Figure 4 It shows Figure 1 Flowchart of S130 in China;

[0065] Figure 5 It shows Figure 1 Flowchart of S140 in China;

[0066] Figure 6 It shows Figure 1 Flowchart of S150 in China;

[0067] Figure 7 This is a schematic diagram of the various modules of a temperature control device for a mold temperature controller provided in an embodiment of the present invention. Detailed Implementation

[0068] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0069] refer to Figures 1 to 7 This invention also provides a temperature control method for a mold temperature controller, applied to a mold temperature controller, the temperature control method comprising:

[0070] Step S110: Collect the docking signal of the mold temperature controller and determine the device to which the mold temperature controller is docked based on the docking signal;

[0071] Step S120: Associate the mold temperature controller and its connected equipment, and define the operating phase of the equipment;

[0072] Step S130: Match the control temperature of the mold temperature controller according to the working stage of the equipment;

[0073] Step S140: Adjust the water circuit temperature and oil circuit temperature based on the temperature control of the mold temperature controller, wherein the mold temperature controller integrates water circuit and oil circuit.

[0074] Step S150: Collect the temperature protection curve of the mold temperature controller and automatically correct it along the temperature protection curve and the current temperature trigger temperature.

[0075] In the solution provided by this invention, the mold temperature controller integrates water and oil circuits, and adjusts the water and oil circuit temperatures based on the control temperature of the mold temperature controller. This allows for the integration of water and oil circuit temperature control within the mold temperature controller, and the combined control of water and oil circuit temperatures enables overall management and coordinated temperature control. Simultaneously, it automatically corrects itself along the temperature protection curve and the current temperature trigger temperature, ensuring early warning protection for the current temperature of the mold temperature controller and enabling automatic correction. This facilitates timely early warning and coordinated temperature control, ensuring the operational stability of the mold temperature controller.

[0076] refer to Figure 2 In step S110, the docking signal of the mold temperature controller is acquired, and the device to which the mold temperature controller is docked is determined based on the docking signal.

[0077] The specific steps are as follows:

[0078] Step S111: Obtain the location of the mold temperature controller;

[0079] Step S112: Determine the mold temperature controller based on its location and iterate through all mold temperature controllers;

[0080] Step S113: During the process of traversing the mold temperature controller, collect the docking signal of the mold temperature controller;

[0081] Step S114: Define docking information based on the signal analysis of the docking signal;

[0082] Step S115: Determine the equipment to which the mold temperature controller is connected based on the docking information, and define the model of the equipment and the model of the mold temperature controller;

[0083] Step S116: Trigger performance matching based on the equipment model and the mold temperature controller model to define the performance level;

[0084] Step S117: Adjust the control path of the mold temperature controller according to the performance level, and perform temperature control based on the mold temperature controller assisting the equipment.

[0085] In an embodiment of the present invention, the mold temperature controller and the equipment connected to the mold temperature controller are controlled. At this time, the location of the mold temperature controller is obtained so as to determine the mold temperature controller based on its location. The target mold temperature controller is defined according to its location and model, thereby realizing the control of the mold temperature controller and further processing of the mold temperature controller.

[0086] At this point, the temperature controllers are traversed, and signals are acquired from them to collect their docking signals. These docking signals are then analyzed to determine the equipment served by the temperature controllers. Based on the signal analysis of the docking signals, docking information is defined. The equipment docked to by the temperature controllers is determined based on the docking information, and the model of the equipment and the model of the temperature controllers are defined, thereby further associating the temperature controllers and the equipment.

[0087] Simultaneously, the model numbers of the equipment and the mold temperature controller are introduced to facilitate performance matching based on these models. This allows for the adjustment of the coordination parameters between the equipment and the mold temperature controller. In this case, performance matching is triggered based on the equipment and mold temperature controller models to define performance levels. The control path of the mold temperature controller is adjusted according to the performance level, and the mold temperature controller assists the equipment in temperature control. This ensures that the mold temperature controller can perform temperature control on the equipment under optimal performance, thereby guaranteeing the operational stability between the mold temperature controller and the equipment.

[0088] refer to Figure 3 In step S120, the mold temperature controller and its connected equipment are associated, and the working phase of the equipment is defined.

[0089] The specific steps are as follows:

[0090] Step S121: Connect the mold temperature controller and its connected equipment;

[0091] Step S122: Monitor the equipment in real time and collect the equipment's operating parameters;

[0092] Step S123: Define the working status and working path of the equipment according to the equipment's working parameters;

[0093] Step S124: Collect the temperature parameters of the mold temperature controller;

[0094] Step S125: Define the working stage of the equipment based on the temperature parameters of the mold temperature controller, the working status of the equipment, and the working path.

[0095] In an embodiment of the present invention, a mold temperature controller and its connected devices are introduced, and the mold temperature controller and its connected devices are associated. At this time, the mold temperature controller and its connected devices are associated, and the temperature controller assists the devices in temperature control. At the same time, the devices are monitored in real time, and the working parameters of the devices are collected, so as to define the working status and working path of the devices according to the working parameters of the devices. Thus, the working status and working path of the devices are defined, and the temperature parameters of the mold temperature controller are introduced.

[0096] At this point, the working status and working path of the equipment are introduced. The current status of the equipment is presented based on the working status and working path to facilitate the control of the working parts of the equipment. At the same time, the temperature parameters of the mold temperature controller are introduced to facilitate the control of the temperature parameters of the mold temperature controller. Furthermore, based on the temperature parameters of the mold temperature controller, the working status of the equipment, and the working path, the working stages of the equipment are defined, thereby clarifying the working stages of the equipment so as to facilitate targeted control of the working stages of the equipment and ensure that each working stage of the equipment can be controlled.

[0097] refer to Figure 4 In step S130, the control temperature of the mold temperature controller is matched according to the working stage of the equipment.

[0098] The specific steps are as follows:

[0099] Step S131: During the operation phase of the equipment, define each working area of ​​the equipment and mark the temperature parameters based on each working area of ​​the equipment;

[0100] Step S132: Trigger the adjustment of each temperature path in the mold temperature controller according to the temperature parameters of each working area and the temperature parameters of the mold temperature controller;

[0101] Step S133: Traverse each temperature path and collect the path shape of each temperature path;

[0102] Step S134: Define path parameters based on the path shape of the temperature path;

[0103] Step S135: Define the control temperature of each temperature path according to the path parameters and temperature parameters.

[0104] In an embodiment of the present invention, control is implemented for the working phase of the device. During the working phase of the device, various working areas of the device are defined, and temperature parameters are marked based on each working area of ​​the device, so as to mark the temperature parameters in each working area and thereby control each working area.

[0105] Therefore, temperature parameters of each working area and temperature parameters of the mold temperature controller are introduced and correlated to facilitate position comparison based on the temperature pipes of the working area and the mold temperature controller. This allows for the triggering of the adjustment of each temperature path in the mold temperature controller based on the temperature parameters of each working area and the mold temperature controller, thereby adjusting the temperature of the temperature path of the mold temperature controller and feeding back to the temperature of each working area, thus realizing passive temperature control of each working area.

[0106] Simultaneously, each temperature path is traversed, and the path shape of each temperature path is collected. Path parameters are defined based on the path shape of the temperature path, so that the control temperature of each temperature path can be defined according to the path parameters and temperature parameters. Thus, the temperature of each working area is controlled according to the control temperature of each temperature path, ensuring precise control.

[0107] refer to Figure 5 In step S140, the water circuit temperature and oil circuit temperature are adjusted based on the control temperature of the mold temperature controller, wherein the mold temperature controller integrates the water circuit and the oil circuit.

[0108] The specific steps are as follows:

[0109] Step S141: Collect the control temperature of the mold temperature controller;

[0110] Step S142: Divide the temperature into multiple sub-temperatures based on the control temperature of the mold temperature controller;

[0111] Step S143: Define the association level between each sub-temperature and the water circuit temperature control or oil circuit temperature;

[0112] Step S144: Based on the magnitude of the correlation level, the pipeline control mode corresponds to each sub-temperature. The pipeline control mode includes water circuit temperature control and oil circuit temperature control.

[0113] Step S145: Adjust the water circuit temperature and oil circuit temperature according to each sub-temperature and the corresponding pipeline control mode. The mold temperature controller integrates water circuit and oil circuit.

[0114] In an embodiment of the present invention, the control temperature of the mold temperature controller is collected. At the same time, the mold temperature controller integrates water circuit and oil circuit. At this time, the control temperature of the mold temperature controller is divided into multiple sub-temperatures so as to facilitate the control of multiple sub-temperatures and then feed back to the control temperature of the mold temperature controller. The control of multiple sub-temperatures is relatively simple.

[0115] At this point, each sub-temperature is defined, and an association level is defined between each sub-temperature and the water circuit temperature control or oil circuit temperature. This facilitates the association between the sub-temperature and the water circuit temperature control or oil circuit temperature, and the pipeline control mode corresponding to each sub-temperature is determined based on the magnitude of the association level. This allows for the definition of the use and focus of the water circuit temperature control or oil circuit temperature based on the sub-temperature, thereby enabling appropriate and efficient regulation of the sub-temperature. Furthermore, the water circuit temperature and oil circuit temperature are regulated according to each sub-temperature and its corresponding pipeline control mode.

[0116] refer to Figure 6 In step S150, the temperature protection curve of the mold temperature controller is acquired, and automatic correction is performed along the temperature protection curve and the current temperature trigger temperature.

[0117] The specific steps are as follows:

[0118] Step S151: Monitor the overall temperature of the mold temperature controller in real time, and define the current temperature curve based on the overall temperature of each time period;

[0119] Step S152: Collect the temperature protection curve of the mold temperature controller and correlate the temperature protection curve with the current temperature curve;

[0120] Step S153: Compare the temperature protection curve and the current temperature curve, and define the curve change range;

[0121] Step S154: Define the temperature change level based on the curve change amplitude;

[0122] Step S155: Collect the current temperature of the mold temperature controller, and trigger a temperature warning based on the temperature change level, the current temperature of the mold temperature controller, and the temperature protection curve.

[0123] Step S156: Trigger spontaneous temperature correction based on temperature warning;

[0124] Step S157: In the automatic temperature correction, determine the temperature reference value based on the current temperature of the mold temperature controller and the warning level, and define the temperature control value based on the temperature reference value and the corresponding temperature warning value in the temperature protection curve, and trigger the temperature control of the mold temperature controller according to the temperature control value.

[0125] In an embodiment of the present invention, the overall temperature of the mold temperature controller is monitored in real time, and an early warning protection is provided for the overall temperature of the mold temperature controller. At this time, the current temperature curve is defined based on the overall temperature of each time period, so as to introduce the current temperature curve and the temperature protection curve of the mold temperature controller, thereby comparing the current temperature curve and the temperature protection curve.

[0126] At this point, during the comparison between the current temperature curve and the temperature protection curve, the curve change amplitude is defined based on the path of the current temperature curve, and the curve change amplitude is compared with the temperature protection curve to define the temperature change level based on the curve change amplitude, thereby determining the temperature change level and triggering subsequent control based on the temperature change level.

[0127] Furthermore, the current temperature of the mold temperature controller is collected, and a temperature warning is triggered based on the temperature change level, the current temperature of the mold temperature controller, and the temperature protection curve; a temperature self-correction is triggered based on the temperature warning; in the temperature self-correction, a temperature reference value is determined based on the current temperature of the mold temperature controller and the warning level, and a temperature control value is defined based on the temperature reference value and the temperature warning value corresponding to the temperature protection curve, and the temperature control of the mold temperature controller is triggered based on the temperature control value.

[0128] Therefore, the mold temperature controller integrates water and oil circuits, and adjusts the water and oil circuit temperatures based on the controller's temperature control. This allows for integrated water and oil circuit temperature control, enabling comprehensive and coordinated temperature management. Furthermore, it features automatic correction along the temperature protection curve and the current temperature trigger temperature, ensuring early warning protection and automatic correction for timely temperature control and coordinated temperature management, thus guaranteeing the stability of the mold temperature controller.

[0129] In addition, the method of acquiring the temperature protection curve of the mold temperature controller and automatically correcting the temperature along the temperature protection curve and the current temperature trigger temperature also includes: introducing the temperature change of the mold temperature controller in the automatic temperature correction; defining the temperature change of the mold temperature controller; determining the temperature control priority of the water circuit temperature and the oil circuit temperature based on the temperature change; defining the main pipeline and the secondary pipeline according to the temperature control priority; if the main pipeline is the water circuit and the secondary pipeline is the oil circuit, then establishing a pipeline coordination system based on the water circuit; matching the coordination ratio between the water circuit temperature and the oil circuit temperature based on the pipeline coordination system, and performing temperature coordination control along the coordination ratio between the water circuit temperature and the oil circuit temperature, thereby realizing the introduction of a temperature coordination mechanism in the mold temperature controller, and thus realizing the establishment of a pipeline coordination system based on the water circuit.

[0130] refer to Figure 7Some embodiments of the present invention also provide a temperature control device 200 for a mold temperature controller, characterized in that it includes:

[0131] The acquisition module 210 is used to acquire the docking signal of the mold temperature controller and determine the device to which the mold temperature controller is docked based on the docking signal;

[0132] The association module 220 is used to associate the mold temperature controller with the connected equipment and define the working stages of the equipment;

[0133] Temperature control module 230 is used to match the control temperature of the mold temperature controller according to the working stage of the equipment;

[0134] Temperature control module 240 is used to control the water circuit temperature and oil circuit temperature based on the temperature control of the mold temperature controller, wherein the mold temperature controller integrates the water circuit and the oil circuit.

[0135] The correction module 250 is used to acquire the temperature protection curve of the mold temperature controller and automatically correct along the temperature protection curve and the current temperature trigger temperature.

[0136] The methods and / or embodiments of the present invention can be implemented as computer software programs. For example, embodiments of this disclosure include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowchart. When the computer program is executed by a processing unit, it performs the functions defined above in the methods of the present invention.

[0137] It should be noted that the computer-readable medium described in this invention can be a computer-readable signal medium or a computer-readable storage medium, or any combination thereof. A computer-readable medium can be, for example,—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of a computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this invention, a computer-readable medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0138] In this invention, the computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave, carrying computer-readable program code. This propagated data signal may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. The computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium, which can send, propagate, or transmit a program for use by or in connection with an instruction execution system, apparatus, or device. The program code contained on the computer-readable medium can be transmitted using any suitable medium, including but not limited to: wireless, wireline, optical fiber, RF, etc., or any suitable combination thereof.

[0139] Computer program code for performing the operations of this invention can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, as well as conventional procedural programming languages ​​such as "C" or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0140] The flowcharts or block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of devices, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented using a dedicated hardware-specific system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0141] In another aspect, embodiments of the present invention also provide a computer-readable medium, which may be included in the device described in the above embodiments; or it may exist independently and not assembled into the device. The computer-readable medium carries one or more computer-readable instructions, which may be executed by a processor to implement the steps of the methods and / or technical solutions of the various embodiments of the present invention described above.

[0142] In a typical configuration of this invention, the terminal and the service network devices each include one or more processors (CPUs), input / output interfaces, network interfaces, and memory.

[0143] Memory may include non-persistent storage in computer-readable media, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM. Memory is an example of computer-readable media.

[0144] Computer-readable media include both permanent and non-permanent, removable and non-removable media, which can store information using any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, read-only optical disc (CD-ROM), digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transfer medium that can be used to store information accessible by a computing device.

[0145] Furthermore, embodiments of the present invention also provide a computer program stored in a computer device, which causes the computer device to execute the method for executing the control code.

[0146] It should be noted that the present invention can be implemented in software and / or a combination of software and hardware, for example, using an application-specific integrated circuit (ASIC), a general-purpose computer, or any other similar hardware device. In some embodiments, the software program of the present invention can be executed by a processor to implement the steps or functions described above. Similarly, the software program of the present invention (including associated data structures) can be stored in a computer-readable recording medium, such as RAM memory, a magnetic or optical drive, a floppy disk, or similar devices. Furthermore, some steps or functions of the present invention can be implemented in hardware, for example, as circuitry that cooperates with a processor to perform the various steps or functions.

[0147] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be embraced within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims. Furthermore, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices recited in the apparatus claims may also be implemented by a single unit or device in software or hardware. The terms "first," "second," etc., are used to indicate names and do not indicate any particular order.

Claims

1. A temperature control method for a mold temperature controller, characterized in that, Applied to mold temperature controllers, the temperature control method of the mold temperature controller The law includes: Collect the docking signal of the mold temperature controller and determine the equipment to which the mold temperature controller is docked based on the docking signal; Associate the mold temperature controller and its connected equipment, and define the operating phases of the equipment; Match the mold temperature controller to the operating stage of the equipment; The temperature control of the mold temperature controller regulates the water and oil circuit temperatures, where the mold temperature controller integrates both water and oil circuits. The system acquires the temperature protection curve of the mold temperature controller and triggers automatic temperature correction along the temperature protection curve and the current temperature. This includes: real-time monitoring of the overall temperature of the mold temperature controller and defining the current temperature curve based on the overall temperature at various time periods; acquiring the temperature protection curve of the mold temperature controller and correlating it with the current temperature curve; comparing the temperature protection curve and the current temperature curve and defining the curve change range; defining the temperature change level based on the curve change range; acquiring the current temperature of the mold temperature controller and triggering a temperature warning based on the temperature change level, the current temperature of the mold temperature controller, and the temperature protection curve; triggering automatic temperature correction based on the temperature warning; and in the automatic temperature correction, based on the mold temperature protection curve... The current temperature and warning level of the mold temperature controller determine the temperature reference value. Based on the temperature reference value and the corresponding temperature warning value in the temperature protection curve, the temperature control value is defined, and the temperature control of the mold temperature controller is triggered according to the temperature control value. The temperature change of the mold temperature controller is introduced; the temperature change of the mold temperature controller is defined; the temperature control priority of the water circuit temperature and oil circuit temperature is determined according to the temperature change; the main pipeline and secondary pipeline are defined according to the temperature control priority; if the main pipeline is the water circuit and the secondary pipeline is the oil circuit, a pipeline coordination system is established based on the water circuit; the coordination ratio between the water circuit temperature and the oil circuit temperature is matched based on the pipeline coordination system, and temperature coordination and control are carried out along the coordination ratio between the water circuit temperature and the oil circuit temperature.

2. The temperature control method for the mold temperature controller according to claim 1, characterized in that, The process of acquiring the docking signal of the mold temperature controller and determining the device to which the mold temperature controller is docked based on the docking signal includes: Find the location of the mold temperature controller; The mold temperature controller is determined based on its location, and the mold temperature controllers are traversed. During the process of traversing the mold temperature controller, the docking signal of the mold temperature controller is collected; Defining docking information based on signal analysis of docking signals; Determine the equipment that the mold temperature controller is connected to based on the docking information, and define the model of the equipment and the model of the mold temperature controller; Performance matching is triggered based on the equipment model and the mold temperature controller model to define the performance level; Adjust the control path of the mold temperature controller according to the performance level, and use the mold temperature controller to assist the equipment in temperature control.

3. The temperature control method for the mold temperature controller according to claim 2, characterized in that, The associated mold temperature controller and its connected equipment are defined, and the working stages of the equipment are defined, including: Related mold temperature controllers and their connected equipment; Monitor the equipment in real time and collect its operating parameters; Define the device's operating status and operating path based on its operating parameters.

4. The temperature control method for the mold temperature controller according to claim 3, characterized in that, The associated mold temperature controller and its connected equipment, and the definition of the equipment's operating stages, also include: Collect temperature parameters from the mold temperature controller; The working stages of the equipment are defined based on the temperature parameters of the mold temperature controller, the working status of the equipment, and the working path.

5. The temperature control method for the mold temperature controller according to claim 4, characterized in that, The method of matching the mold temperature controller to the operating stage of the equipment includes: During the equipment's operation phase, define the various working areas of the equipment and mark temperature parameters based on each working area; The temperature parameters of each working area and the temperature parameters of the mold temperature controller are used to trigger the adjustment of each temperature path in the mold temperature controller. Traverse each temperature path and collect the path shape of each temperature path. Path parameters are defined based on the path shape of the temperature path; Define the control temperature for each temperature path based on the path parameters and temperature parameters.

6. The temperature control method for a mold temperature controller according to claim 5, characterized in that, The temperature control system based on the mold temperature controller regulates the water and oil circuit temperatures. The mold temperature controller integrates both water and oil circuits, including: Collect the control temperature of the mold temperature controller; The temperature control based on the mold temperature controller is divided into multiple sub-temperatures; Associativity levels between each sub-temperature and the water circuit temperature control or oil circuit temperature definition.

7. The temperature control method for a mold temperature controller according to claim 6, characterized in that, The control based on the mold temperature controller Temperature control includes both water and oil circuit temperatures. The mold temperature controller integrates both water and oil circuits, and also includes: The pipeline control modes are based on the correlation level and correspond to the temperature of each sub-temperature. The pipeline control modes include water temperature control and oil temperature control. The water circuit temperature and oil circuit temperature are adjusted according to each sub-temperature and the corresponding pipeline control mode. The mold temperature controller integrates water circuit and oil circuit.

8. A temperature control device for a mold temperature controller, comprising: The data acquisition module is used to acquire the docking signal of the mold temperature controller and determine the device to which the mold temperature controller is docked based on the docking signal; The association module is used to associate the mold temperature controller with the connected equipment and define the working stages of the equipment; The temperature control module is used to match the control temperature of the mold temperature controller according to the working stage of the equipment. The temperature control module is used to regulate the water circuit temperature and oil circuit temperature based on the temperature control of the mold temperature controller, which integrates the water circuit and oil circuit. The correction module is used to acquire the temperature protection curve of the mold temperature controller and trigger automatic temperature correction along the temperature protection curve and the current temperature. This includes: real-time monitoring of the overall temperature of the mold temperature controller and defining the current temperature curve based on the overall temperature at various time periods; acquiring the temperature protection curve of the mold temperature controller and associating it with the current temperature curve; comparing the temperature protection curve and the current temperature curve and defining the curve change amplitude; defining the temperature change level based on the curve change amplitude; acquiring the current temperature of the mold temperature controller and triggering a temperature warning based on the temperature change level, the current temperature of the mold temperature controller, and the temperature protection curve; triggering automatic temperature correction based on the temperature warning; and in the automatic temperature correction... The system determines a temperature reference value based on the current temperature and warning level of the mold temperature controller, and defines a temperature control value based on the temperature reference value and the corresponding temperature warning value in the temperature protection curve. The system then triggers temperature control of the mold temperature controller based on the temperature control value. It introduces the temperature change of the mold temperature controller, defines the temperature change amount, determines the temperature control priority of the water circuit temperature and oil circuit temperature based on the temperature change amount, defines the main and secondary pipelines based on the temperature control priority, and establishes a pipeline coordination system based on the water circuit if the main pipeline is a water circuit and the secondary pipeline is an oil circuit. Based on the pipeline coordination system, it matches the coordination ratio between the water circuit temperature and the oil circuit temperature, and performs coordinated temperature control along this coordination ratio.

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