Packaging material and method for producing the same

Abstract

The application provides a packaging material and a preparation method thereof, relates to the technical field of packaging, and aims to improve the anti-static ability of the packaging material. The packaging material comprises a substrate, a first conductive layer, a second conductive layer and a conductive sticker. The substrate comprises a first surface and a second surface opposite to each other, and a side surface connecting the first surface and the second surface. The first conductive layer is arranged on the first surface, and part of the first conductive layer is embedded in the substrate. The second conductive layer is arranged on the second surface, and part of the second conductive layer is embedded in the substrate. The conductive sticker is arranged on the first surface, the side surface and the second surface, and the conductive sticker connects the first conductive layer and the second conductive layer. The packaging material can be used for packaging electronic equipment.

Description

Technical Field

[0001] This application relates to the field of packaging technology, and in particular to a packaging material and its preparation method. Background Technology

[0002] Because semiconductor electronic devices require high precision, high surface cleanliness, and high levels of antistatic properties, the packaging materials must have antistatic properties.

[0003] Therefore, how to improve the antistatic capability of packaging materials has become an urgent problem to be solved in the field. Summary of the Invention

[0004] This application proposes a packaging material and a method for preparing the same, with the aim of improving the antistatic capability of the packaging material.

[0005] To achieve the above objectives, embodiments of this application provide the following technical solutions:

[0006] On one hand, a packaging material is provided, comprising a substrate, a first conductive layer, a second conductive layer, and a conductive sticker. The substrate includes a first surface and a second surface opposite to each other, and a side surface connecting the first surface and the second surface. The first conductive layer is disposed on the first surface, and a portion of the first conductive layer is embedded within the substrate. The second conductive layer is disposed on the second surface, and a portion of the second conductive layer is embedded within the substrate. The conductive sticker is disposed on the first surface, the side surface, and the second surface, and the conductive sticker connects the first conductive layer and the second conductive layer.

[0007] The packaging material provided in the embodiments of this application has a first conductive layer and a second conductive layer respectively disposed on both sides of the substrate, and both the first conductive layer and the second conductive layer are partially embedded in the substrate, thereby increasing the connection strength between the first conductive layer, the second conductive layer and the substrate.

[0008] Furthermore, a conductive sticker connects the first and second conductive layers located on both sides of the substrate, forming an equipotential body. When an electronic device is placed on the first surface of the substrate, the first conductive layer can discharge static electricity from the electronic device, and the equipotential body formed by the first and second conductive layers can quickly and uniformly diffuse static electricity. When the second surface of the substrate is in contact with the support, static electricity can be released through the support via the second conductive layer, thus improving the antistatic capability of the packaging material.

[0009] In some embodiments, the conductive sticker includes a substrate, an colloid layer, and a conductive film. The conductive film is electrically connected to a first conductive layer and a second conductive layer. The colloid layer and the substrate are sequentially disposed on the outside of the conductive film, and the colloid layer and the substrate encapsulate the conductive film.

[0010] In some embodiments, both the first conductive layer and the second conductive layer are metal mesh lines. The metal mesh lines include multiple first traces and multiple second traces. The first traces extend along a first direction, the multiple first traces are arranged along a second direction, the second traces extend along a second direction, the multiple second traces are arranged along the first direction, and the second direction intersects the first direction.

[0011] The substrate has two first side surfaces opposite each other along a first direction and two second side surfaces opposite each other along a second direction. A conductive film is located on the first side surface. The conductive film is electrically connected to at least two adjacent first traces and at least one adjacent second trace of the first conductive layer, and the conductive film is also electrically connected to at least two adjacent first traces and at least one adjacent second trace of the second conductive layer. Alternatively, the conductive film is located on the second side surface. The conductive film is electrically connected to at least two adjacent second traces and at least one adjacent first trace of the first conductive layer, and the conductive film is also electrically connected to at least two adjacent second traces and at least one adjacent first trace of the second conductive layer.

[0012] In some embodiments, the conductive film includes a first portion located on a first surface, a second portion located on a side surface, and a third portion located on a second surface, the first portion, the second portion, and the third portion being connected sequentially. The dimensions of the first portion along a third direction are equal to the dimensions of the third portion along a third direction, the third direction being parallel to the first surface and perpendicular to the connection line between the first surface and the surface.

[0013] In some embodiments, both the first surface and the second surface include an intermediate region and a peripheral region surrounding the intermediate region, with multiple conductive stickers disposed in the peripheral region of the first surface and the peripheral region of the second surface.

[0014] In some embodiments, the first surface has reinforcing ribs disposed in the peripheral region of the first surface, the reinforcing ribs being recessed toward the central region, and conductive stickers being disposed in the recessed portion of the reinforcing ribs.

[0015] In some embodiments, a first conductive layer is disposed over the entire surface of a first surface, and a second conductive layer is disposed over the entire surface of a second surface. Alternatively, the first conductive layer is disposed in a peripheral region of the first surface, and the second conductive layer is disposed in a peripheral region of the second surface.

[0016] In some embodiments, the first conductive layer extends to the edge of the first surface, and the second conductive layer extends to the edge of the second surface. Alternatively, the orthographic projection of the first conductive layer on the first surface lies within the contour of the first surface and does not intersect with the edge of the first surface. The orthographic projection of the second conductive layer on the second surface lies within the contour of the second surface and does not intersect with the edge of the second surface.

[0017] In some embodiments, the first conductive layer is a metal thin film, and the second conductive layer is a metal thin film.

[0018] On the other hand, a method for preparing a packaging material is provided, the method comprising: sequentially stacking a first conductive layer, a substrate, and a second conductive layer, wherein the substrate includes a first surface adjacent to the first conductive layer, a second surface adjacent to the second conductive layer, and a side surface connecting the first surface and the second surface; pressing the first conductive layer, the substrate, and the second conductive layer together, wherein a portion of the first conductive layer is embedded within the substrate, and a portion of the second conductive layer is embedded within the substrate; and affixing a conductive sticker, wherein the conductive sticker is located on the first surface, the side surface, and the second surface, and the conductive sticker connects the first conductive layer and the second conductive layer.

[0019] The preparation method provided in the embodiments of this application involves sequentially stacking a first conductive layer, a substrate, and a second conductive layer, and then pressing the first conductive layer, the substrate, and the second conductive layer together, so that a portion of the first conductive layer is embedded in the substrate and a portion of the second conductive layer is embedded in the substrate, thereby increasing the connection strength between the first conductive layer, the second conductive layer, and the substrate.

[0020] Then, conductive stickers are attached to the first surface, side surface, and second surface of the substrate. The conductive stickers connect the first conductive layer and the second conductive layer, forming an equipotential body. When an electronic device is placed on the first surface of the substrate, the first conductive layer can discharge static electricity from the electronic device, and the equipotential body formed by the first and second conductive layers can quickly and uniformly diffuse static electricity. The second surface of the substrate is in contact with the support, and static electricity can be released through the support via the second conductive layer. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in some embodiments of this application will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not actual dimensions of the products or actual processes of the methods involved in the embodiments of this application.

[0022] Figure 1 A top view of a packaging material provided in an embodiment of this application;

[0023] Figure 2 for Figure 1 A magnified view of the packaging material at point M;

[0024] Figure 3 for Figure 2 A sectional view of the packaging material along section line AA';

[0025] Figure 4 A partial enlarged view of point M for another packaging material provided in an embodiment of this application;

[0026] Figure 5 A top view of another packaging material provided in an embodiment of this application;

[0027] Figure 6 A cross-sectional view along section line AA' of another packaging material provided in an embodiment of this application;

[0028] Figures 7A to 7F The diagram shows the steps involved in preparing the packaging material as provided in the embodiments of this application. Detailed Implementation

[0029] The technical solutions in some embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application are within the scope of protection of this application.

[0030] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and encompassing, that is, "including, but not limited to".

[0031] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0032] In describing some embodiments, the term "connection" and its derivative expressions may be used. The term "connection" should be interpreted broadly; for example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. For example, in describing some embodiments, the term "connection" may be used to indicate that two or more components have direct physical or electrical contact with each other.

[0033] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0034] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0035] This document describes exemplary embodiments with reference to cross-sectional views, which are intended as idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations caused, for example, by manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0036] This application provides a packaging material that can be used for packaging electronic devices such as displays and chips. For example, electronic devices may include thin-film transistor liquid crystal displays (TFT-LCDs), mini light-emitting diode displays (Mini LEDs), micro light-emitting diode displays (MicroLEDs), virtual reality (VR) devices, augmented reality (AR) devices, medical flat panel X-ray detectors (FPXDs), gene sequencing equipment, smart windows, molecular antennas, electronic paper (EPDs), industrial control (MM) devices, semi-transparent and semi-reflective devices, micro-electro-mechanical systems (MEMS), etc. This application does not limit the scope of the application.

[0037] Figure 1 A top view of a packaging material provided in an embodiment of this application; Figure 2 for Figure 1 A magnified view of the packaging material at point M; Figure 3 for Figure 2 The sectional view of the packaging material along section line AA'.

[0038] See Figures 1-3 The packaging material 1 includes a substrate 10, a first conductive layer 11, a second conductive layer 12, and a conductive sticker 13.

[0039] Along direction Z, substrate 10 includes a first surface P1 and a second surface P2 opposite to each other. The first surface P1 may be the upper surface of substrate 10, and the second surface P2 may be the lower surface of substrate 10. Substrate 10 also includes a side surface P3, which may be located between the first surface P1 and the second surface P2, and the side surface P3 connects the first surface P1 and the second surface P2.

[0040] The substrate 10 is a tray, which is a material tray used to carry electronic devices. The first surface P1 of the substrate 10 is in contact with the electronic devices, and the second surface P2 of the substrate 10 serves as a support surface and is in contact with the support.

[0041] For example, the substrate 10 is made of a resin sheet, which may include one or more of polyethylene terephthalate (PET), polyethylene (PE), polystyrene (PS), and acrylonitrile butadiene styrene plastic (ABS), or may include a combination of resin materials with high adhesion compatibility, such as a combination of amino resin and epoxy resin.

[0042] For example, the dimension of the substrate 10 along the Z direction is the thickness of the substrate 10, and the thickness of the substrate 10 ranges from 1 mm to 3 mm.

[0043] See Figure 3 The first conductive layer 11 is disposed on the first surface P1 of the substrate 10, and a portion of the first conductive layer 11 is embedded in the substrate 10 to increase the connection strength between the first conductive layer 11 and the substrate 10.

[0044] For example, the first conductive layer 11 can be a metal mesh line, and the material of the metal mesh line can include one or more of Al, Al2O3 or Cu, so that the first conductive layer 11 has high ductility. The metal mesh line is formed by the intersection of multiple metal traces, wherein the diameter of each metal trace is 5% to 35% of the thickness of the substrate 10.

[0045] See Figure 3 The second conductive layer 12 is disposed on the second surface P2 of the substrate 10, and a portion of the second conductive layer 12 is embedded in the substrate 10 to increase the connection strength between the second conductive layer 12 and the substrate 10.

[0046] For example, the second conductive layer 12 may also be a metal mesh line, and the material of the metal mesh line may include one or more of Al, Al2O3 or Cu, so that the second conductive layer 12 has high ductility. The metal mesh line is formed by the intersection of multiple metal traces, wherein the diameter of each metal trace is 5% to 35% of the thickness of the substrate 10.

[0047] See also Figure 3 Conductive sticker 13 is disposed on the first surface P1, side surface P3, and second surface P2 of substrate 10. Conductive sticker 13 connects the first conductive layer 11 and the second conductive layer 12. That is, conductive sticker 13 is pasted on the first surface P1, side surface P3, and second surface P2 of substrate 10. Conductive sticker 13 is electrically connected to the first conductive layer 11 located on the first surface P1, and conductive sticker 13 extends from the first surface P1, passes through side surface P3, and wraps around to the second surface P2, where it is electrically connected to the second conductive layer 12 located on the second surface P2.

[0048] The packaging material 1 provided in the embodiments of this application has a first conductive layer 11 and a second conductive layer 12 respectively disposed on both sides of the substrate 10. For example, the first conductive layer 11 is located on the upper surface of the substrate 10, and the second conductive layer 12 is located on the lower surface of the substrate 10. Both the first conductive layer 11 and the second conductive layer 12 are partially embedded in the substrate 10, which increases the connection strength between the first conductive layer 11 and the second conductive layer 12 and the substrate 10.

[0049] Furthermore, the first conductive layer 11 and the second conductive layer 12 located on both sides of the substrate 10 are connected by conductive stickers 13, forming an equipotential body. When the electronic device is placed on the upper surface of the substrate 10, the first conductive layer 11 can discharge static electricity from the electronic device, and the equipotential body formed by the first conductive layer 11 and the second conductive layer 12 can quickly and uniformly diffuse static electricity. The lower surface of the substrate 10 is in contact with the support, and static electricity can be released through the support via the second conductive layer 12, thus improving the antistatic capability of the packaging material 1.

[0050] Furthermore, compared to current packaging materials, which contain a certain proportion of antistatic liquid mixed in the sheet material, the solubility coefficient of the antistatic liquid in the packaging material varies with seasonal temperature fluctuations, especially in summer. This can lead to the antistatic liquid easily precipitating out and contaminating electronic devices. However, in the above embodiments of this application, the substrate 10 of the packaging material 1 does not need to be filled with antistatic liquid, thus avoiding the problem of antistatic liquid precipitation under temperature fluctuations and improving the surface cleanliness of electronic devices placed in the packaging material 1.

[0051] In some embodiments, see Figure 1The first conductive layer 11 is disposed on the entire first surface P1 of the substrate 10, which facilitates the rapid and uniform diffusion of static electricity in the first conductive layer 11. The second conductive layer 12 can also be disposed on the entire second surface P2 of the substrate 10, which facilitates the rapid and uniform diffusion of static electricity in the second conductive layer 12.

[0052] In some embodiments, see Figure 3 The conductive sticker 13 includes a substrate 131, an adhesive layer 132, and a conductive film 133.

[0053] The conductive film 133 is disposed on the first surface P1, the side surface P3, and the second surface P2 of the substrate 10. The conductive film 133 is electrically connected to the first conductive layer 11 and the second conductive layer 12. That is, the conductive film 133 is electrically connected to the first conductive layer 11 located on the first surface P1, and the conductive film 133 extends from the first surface P1, passes through the side surface P3, and wraps around to the second surface P2, where it is electrically connected to the second conductive layer 12 located on the second surface P2.

[0054] For example, the material of the conductive film 133 may include at least one of Al or Cu, and the thickness of the conductive film 133 is in the range of 50 μm to 200 μm.

[0055] See also Figure 3 The colloidal layer 132 and the substrate 131 are sequentially disposed on the outer side of the conductive film 133. The substrate 131 is used to increase the structural strength of the conductive sticker 13, and the colloidal layer 132 is used to bond the conductive film 133 and the substrate 131 to the substrate 10. Furthermore, the colloidal layer 132 and the substrate 131 encapsulate the conductive film 133, thereby sealing the conductive film 133 and preventing oxidation of the conductive film 133, which would affect the connection stability between the first conductive layer 11 and the second conductive layer 12.

[0056] For example, the material of the substrate 131 may include at least one of polyethylene or polypropylene (PP), and the thickness of the substrate 131 is in the range of 50 μm to 100 μm.

[0057] For example, the thickness of the colloidal layer 132 ranges from 20 μm to 100 μm.

[0058] In some embodiments, see Figures 1-3 The first conductive layer 11 and the second conductive layer 12 can both be metal mesh lines. The metal mesh lines include multiple first traces 21 and multiple second traces 22. Each first trace 21 extends along a first direction X, and the multiple first traces 21 are arranged along a second direction Y. Each second trace 22 extends along a second direction Y, and the multiple second traces 21 are arranged along a first direction X. That is, the metal mesh lines are formed by the intersection of multiple first traces 21 and multiple second traces 22.

[0059] For example, the second direction Y intersects the first direction X, or for instance, the second direction Y is perpendicular to the first direction X.

[0060] See also Figures 1-3 The side surface P3 of the substrate 10 includes two first side surfaces P4 opposite each other along the first direction X, and two second side surfaces P5 opposite each other along the second direction Y. The conductive sticker 13 can be pasted on the first side surface P4 of the substrate 10, or the conductive sticker 13 can also be pasted on the second side surface P5 of the substrate 10, or the conductive sticker 13 can be pasted on both the first side surface P4 and the second side surface P5 of the substrate 10.

[0061] When the conductive sticker 13 is pasted on the first side P4 of the substrate 10, the conductive film 133 of the conductive sticker 13 is electrically connected to at least two adjacent first traces 21 and at least one second trace 22 of the first conductive layer 11, and the conductive film 133 is electrically connected to at least two adjacent first traces 21 and at least one second trace 22 of the second conductive layer 12, thereby ensuring the connection stability between the conductive film 133 and the first conductive layer 11 and the second conductive layer 12.

[0062] When the conductive sticker 13 is pasted on the second side P5 of the substrate 10, the conductive film 133 of the conductive sticker 13 is electrically connected to at least two adjacent second traces 22 and at least one first trace 21 of the first conductive layer 11, and the conductive film 133 is electrically connected to at least two adjacent second traces 22 and at least one first trace 21 of the second conductive layer 12, thereby ensuring the connection stability between the conductive film 133 and the first conductive layer 11 and the second conductive layer 12.

[0063] In some embodiments, see Figure 3 The conductive film 133 of the conductive sticker 13 includes a first part 133a located on the first surface P1, a second part 133b located on the side P3, and a third part 133c located on the second surface P2. The first part 133a, the second part 133b and the third part 133c of the conductive film 133 are connected in sequence.

[0064] See Figure 2 and Figure 3The third direction U is parallel to the first surface P1 of the substrate 10, and the third direction U is perpendicular to the connection line L between the first surface P1 and the side surface P3. The size of the first part 133a along the third direction U is equal to the size of the third part 133c along the third direction U. The contact area between the first part 133a of the conductive film 133 and the first conductive layer 11 and the contact area between the third part 133c and the second conductive layer 12 are approximately equal. The contact area between the conductive film 133 and the first conductive layer 11 and the second conductive layer 12 is approximately equal, so that the connection stability between the conductive film 133 and the first conductive layer 11 and the second conductive layer 12 is consistent, which is beneficial to the uniform diffusion of static electricity between the first conductive layer 11, the conductive film 133 and the second conductive layer 12.

[0065] In some embodiments, see Figure 1 The first surface P1 and the second surface P2 of the substrate 10 both include a central region A1 and a peripheral region A2 surrounding the central region A1. Multiple conductive stickers 13 are disposed in the peripheral region A2 of the first surface P1 and in the peripheral region A2 of the second surface P2.

[0066] The middle region A1 of the first surface P1 of the substrate 10 is used to place electronic devices. During the handling of the substrate 10, the handling personnel hold the peripheral region A2 of the substrate 10 and attach multiple conductive stickers 13 to the peripheral region A2 of the substrate 10. The handling personnel's hands press the conductive stickers 13, which can enhance the adhesion effect of the conductive stickers 13 and prevent the conductive stickers 13 from falling off. In addition, static electricity can be discharged through the conductive stickers 13 and the handling personnel's body.

[0067] For example, the peripheral area A2 includes two opposite ends along the first direction X and two opposite ends along the second direction Y. At least two conductive stickers 13 are attached to the opposite ends of the peripheral area A2 along the first direction X. When a person handling the peripheral area A2 holds the opposite ends along the first direction X, the person handling the peripheral area A2 can press the conductive stickers 13 with their hands, and static electricity can be discharged through the human body.

[0068] For example, at least two conductive stickers 13 are affixed to opposite ends of the peripheral area A2 along the second direction Y. When a person handling the peripheral area A2 holds the opposite ends of the peripheral area A2 along the second direction Y, the person handling the transport can press the conductive stickers 13 with their hands, and static electricity can be discharged through the human body.

[0069] For example, at least two conductive stickers 13 are attached to opposite ends of the peripheral area A2 along the first direction X, and at least two conductive stickers 13 are attached to opposite ends of the peripheral area A2 along the second direction Y. In this way, the handling personnel can hold the peripheral area A2 at one end along the first direction X and one end along the second direction Y, the handling personnel's hands can press the conductive stickers 13, and static electricity can be discharged through the human body.

[0070] In some embodiments, see Figure 1 and Figure 2 The first surface P1 of the substrate 10 has a reinforcing rib 14, which is disposed in the peripheral area A2 of the first surface P1. The reinforcing rib 14 is recessed inward in a direction V toward the middle area A1, and the conductive sticker 13 is pasted on the recess of the reinforcing rib 14.

[0071] The recessed part of the reinforcing rib 14 makes it easy for the handling personnel to hold. By attaching the conductive sticker 13 to the recessed part of the reinforcing rib 14, the handling personnel can press the conductive sticker 13 with their hands, and static electricity can be discharged through the human body.

[0072] For example, see Figure 2 The recessed portion of the reinforcing rib 14 has a dimension ranging from 20mm to 25mm along direction V, meaning the depth of the recessed portion of the reinforcing rib 14 ranges from 20mm to 25mm. The recessed portion of the reinforcing rib 14 has a dimension ranging from 50mm to 100mm along the second direction Y, meaning the width of the reinforcing rib 14 ranges from 50mm to 100mm, ensuring that the recessed portion of the reinforcing rib 14 has sufficient area to facilitate the adhesion of the conductive sticker 13 to the recessed portion of the reinforcing rib 14.

[0073] Furthermore, the conductive sticker 13 has a dimension of greater than or equal to 2 mm along the direction V, ensuring that the conductive sticker 13 has sufficient adhesion depth on the surface of the substrate 10.

[0074] In some embodiments, see Figure 2 and Figure 3 The first conductive layer 11 extends to the edge of the first surface P1, and the second conductive layer 12 extends to the edge of the second surface P2. During the handling of the substrate 10, the handling personnel hold the edge of the substrate 10, and the handling personnel's hands can come into contact with the first conductive layer 11 and the second conductive layer 12, and static electricity can be discharged through the human body.

[0075] Embodiments of this application also provide another packaging material. Figure 4 A partial enlarged view of point M for another packaging material provided in an embodiment of this application.

[0076] See Figure 4 ,and Figure 2 The difference is that the orthographic projection of the first conductive layer 11 on the first surface P1 is within the outline of the first surface P1, and the orthographic projection of the first conductive layer 11 does not intersect with the edge E of the first surface P1. That is, the first conductive layer 11 does not extend to the edge E of the first surface P1.

[0077] For example, the minimum distance between the first conductive layer 11 and the edge E of the first surface P1 ranges from 1 mm to 2 mm.

[0078] Similarly, the orthographic projection of the second conductive layer 12 onto the second surface P2 lies within the contour of the second surface P2, and the orthographic projection of the second conductive layer 12 does not intersect with the edge of the second surface P2. That is, the second conductive layer 12 does not extend to the edge of the second surface P2.

[0079] For example, the minimum distance between the edge of the second conductive layer 12 and the second surface P2 ranges from 1 mm to 2 mm.

[0080] During the fabrication of the substrate 10 to form the tray, a grinding wheel is needed to smooth the burrs on the edges of the substrate 10, making the edges smooth and preventing the burrs from scratching the handling personnel. Since the first conductive layer 11 and the second conductive layer 12 do not extend to the edge of the substrate 10, the grinding wheel can be avoided from grinding the first conductive layer 11 and the second conductive layer 12. This avoids the problem of the difficulty of grinding metal with a grinding wheel and also avoids damage to the first conductive layer 11 and the second conductive layer 12, ensuring that the first conductive layer 11 and the second conductive layer 12 can diffuse and conduct static electricity.

[0081] For example, when both the first conductive layer 11 and the second conductive layer 12 are made of metal mesh lines, the metal mesh lines do not extend to the edges of the first surface P1 and the second surface P2. The ends of the traces in the metal mesh lines are embedded inside the substrate 10. During the process of grinding the edges of the substrate 10 with a grinding wheel, the traces can be prevented from being carried out by the grinding wheel.

[0082] Embodiments of this application also provide another packaging material. Figure 5 This is a top view of another packaging material provided in an embodiment of this application.

[0083] See Figure 5 ,and Figure 1 The difference is that the first conductive layer 11 is not disposed on the entire surface of the first surface P1 of the substrate 10. The first conductive layer 11 is disposed in the peripheral area A2 of the first surface P1, and the first conductive layer 11 is not disposed in the middle area A1 of the first surface P1. The middle area A1 of the first surface P1 is used to place electronic devices. In this way, during the diffusion of static electricity in the first conductive layer 11, the interference of static electricity on the first conductive layer 11 on the electronic devices can be reduced.

[0084] Similarly, the second conductive layer 12 may not be disposed on the entire surface of the second surface P2 of the substrate 10. The second conductive layer 12 may be disposed in the peripheral area A2 of the second surface P2, and the second conductive layer 12 may not be disposed in the middle area A1 of the second surface P2. In this way, during the diffusion of static electricity in the second conductive layer 12, the interference of static electricity on the second conductive layer 12 on the electronic device can be reduced.

[0085] Embodiments of this application also provide yet another packaging material. Figure 6A cross-sectional view along section line AA' of another packaging material provided in this application embodiment.

[0086] See Figure 6 ,and Figure 3 The difference is that the first conductive layer 11 is a metal thin film, which is disposed on the first surface P1 of the substrate 10, and part of the metal thin film is embedded in the substrate 10 to increase the connection strength between the first conductive layer 11 and the substrate 10.

[0087] Similarly, the second conductive layer 12 is also a metal thin film, which is disposed on the second surface P2 of the substrate 10, and part of the metal thin film is embedded in the substrate 10 to increase the connection strength between the second conductive layer 12 and the substrate 10.

[0088] It is understandable that by setting the first conductive layer 11 and the second conductive layer 12 as metal thin films, the rate of static electricity diffusion on the metal thin film is faster, which is conducive to achieving rapid and uniform diffusion of static electricity, so as to facilitate the rapid discharge of static electricity.

[0089] Embodiments of this application also provide a method for preparing packaging materials. Figures 7A to 7F The diagram shows the steps involved in preparing the packaging material as provided in the embodiments of this application.

[0090] The preparation method of the above packaging material may include the following steps S1 to S3:

[0091] S1: See Figures 7A to 7C The first conductive layer 11, the substrate 10, and the second conductive layer 12 are stacked sequentially.

[0092] For example, see Figure 7A Before molding, the substrate 10 is a resin sheet, which is a flat plate.

[0093] See Figure 7B Both the first conductive layer 11 and the second conductive layer 12 are metal mesh lines with high ductility.

[0094] See Figure 7C First, set the parameters of the molding machine. Based on the material characteristics of the resin sheet, set the temperature of the molding machine to the high elasticity temperature range of the resin material, set the pressure to between 0.01MPa and 1MPa, and set the holding time to between 10s and 100s.

[0095] Then, a second conductive layer 12 is placed in a molding machine, a substrate 10 is placed on top of the second conductive layer 12, and a first conductive layer 11 is placed on top of the substrate 10. The first conductive layer 11, the substrate 10, and the second conductive layer 12 are stacked in sequence, and the first conductive layer 11, the substrate 10, and the second conductive layer 12 are positioned by a fixture in the molding machine.

[0096] S2: See also Figure 7D , Figure 7D Figure b is a cross-sectional view of Figure a along section line BB', showing the first conductive layer 11, substrate 10 and second conductive layer 12 being laminated together. Part of the first conductive layer 11 is embedded in the substrate 10 and part of the second conductive layer 12 is embedded in the substrate 10.

[0097] For example, after the first conductive layer 11, the substrate 10 and the second conductive layer 12 are installed and positioned, the pressing button of the molding machine is pressed to press the first conductive layer 11, the substrate 10 and the second conductive layer 12 together. Under the action of high temperature and high pressure, the substrate 10 is molded and has the shape of a tray, and a portion of the first conductive layer 11 is embedded in the substrate 10 and a portion of the second conductive layer 12 is embedded in the substrate 10.

[0098] After the first conductive layer 11, the substrate 10, and the second conductive layer 12 are pressed together, the substrate is cooled for 60 seconds, and then the packaging material 1 with burrs on the edges is removed. Then, according to the size of the packaging material 1, the edges of the substrate 10 are polished with a grinding wheel to remove the burrs and excess corners of the substrate 10.

[0099] S3: See also Figure 7E and Figure 7F A conductive sticker 13 is attached to the substrate 10. The conductive sticker 13 is located on the first surface P1, the side surface P3 and the second surface P2, and the conductive sticker 13 is connected to the first conductive layer 11 and the second conductive layer 12.

[0100] For example, see Figure 7E , Figure 7E Figure b is a cross-sectional view of Figure a along section line CC'. The conductive sticker 13 includes a substrate 131, an adhesive layer 132, and a conductive film 133.

[0101] See Figure 7F The conductive sticker 13 is attached to the first surface P1, side surface P3 and second surface P2 of the substrate 10. The conductive film 133 is electrically connected to the first conductive layer 11 and the second conductive layer 12. The colloidal layer 132 and the substrate 131 are sequentially disposed on the outside of the conductive film 133. The colloidal layer 132 and the substrate 131 wrap the conductive film 133.

[0102] The preparation method provided in the embodiments of this application involves sequentially stacking a first conductive layer, a substrate, and a second conductive layer in a molding machine, and pressing the first conductive layer 11, the substrate 10, and the second conductive layer 12 together, so that a portion of the first conductive layer 11 is embedded in the substrate 10 and a portion of the second conductive layer 12 is embedded in the substrate 10, thereby increasing the connection strength between the first conductive layer 11 and the second conductive layer 12 and the substrate 10.

[0103] Then, conductive sticker 13 is attached to the first surface P1, side surface P3, and second surface P2 of the substrate 10. The conductive sticker 13 connects the first conductive layer 11 and the second conductive layer 12, and the first conductive layer 11 and the second conductive layer 12 form an equipotential body. When the electronic device is placed on the first surface P1 of the substrate 10, the first conductive layer 11 can discharge static electricity from the electronic device, and the equipotential body formed by the first conductive layer 11 and the second conductive layer 12 can quickly and uniformly diffuse static electricity. The second surface P2 of the substrate 10 is in contact with the support, and static electricity can be released through the support via the second conductive layer 12.

[0104] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A packaging material, characterized in that, include: The substrate includes opposing first and second surfaces, and a side surface connecting the first and second surfaces; The first surface is used to place electronic devices; A first conductive layer is disposed on the first surface, and a portion of the first conductive layer is embedded in the substrate; A second conductive layer is disposed on the second surface, and a portion of the second conductive layer is embedded in the substrate; A conductive sticker is disposed on the first surface, the side surface, and the second surface, and the conductive sticker connects the first conductive layer and the second conductive layer. The conductive sticker includes a substrate, an adhesive layer, and a conductive film; the conductive film is electrically connected to the first conductive layer and the second conductive layer; the adhesive layer and the substrate are sequentially disposed on the outside of the conductive film, and the adhesive layer and the substrate encapsulate the conductive film; the material of the conductive film includes at least one of Al or Cu. Both the first conductive layer and the second conductive layer are metal mesh lines. The metal mesh lines include multiple first traces and multiple second traces. The first traces extend along a first direction, and the multiple first traces are arranged along a second direction. The second traces extend along the second direction, and the multiple second traces are arranged along the first direction. The second direction intersects the first direction. The side surface of the substrate includes two first side surfaces opposite each other along the first direction, and two second side surfaces opposite each other along the second direction; The conductive film is located on the first side surface, and the conductive film is electrically connected to at least two first traces and at least one second trace adjacent to the first conductive layer, and the conductive film is electrically connected to at least two first traces and at least one second trace adjacent to the second conductive layer; and / or, the conductive film is located on the second side surface, and the conductive film is electrically connected to at least two second traces and at least one first trace adjacent to the first conductive layer, and the conductive film is electrically connected to at least two second traces and at least one first trace adjacent to the second conductive layer.

2. The packaging material according to claim 1, characterized in that, The conductive film includes a first portion located on the first surface, a second portion located on the side surface, and a third portion located on the second surface, wherein the first portion, the second portion, and the third portion are connected in sequence. The dimension of the first portion along the third direction is equal to the dimension of the third portion along the third direction; the third direction is parallel to the first surface and perpendicular to the line connecting the first surface and the side surface.

3. The packaging material according to claim 1, characterized in that, Both the first surface and the second surface include a central region and a peripheral region surrounding the central region; Multiple conductive stickers are disposed in the peripheral area of ​​the first surface and in the peripheral area of ​​the second surface.

4. The packaging material according to claim 3, characterized in that, The first surface has reinforcing ribs, which are disposed in the peripheral area of ​​the first surface; The reinforcing rib is recessed inward toward the central region, and the conductive sticker is disposed in the recess of the reinforcing rib.

5. The packaging material according to claim 1, characterized in that, The first conductive layer is disposed on the entire first surface, and the second conductive layer is disposed on the entire second surface; or, Both the first surface and the second surface include a central region and a peripheral region surrounding the central region. The central region of the first surface is used to place an electronic device. The first conductive layer is disposed in the peripheral region of the first surface, and the second conductive layer is disposed in the peripheral region of the second surface.

6. The packaging material according to claim 1, characterized in that, The first conductive layer extends to the edge of the first surface, and the second conductive layer extends to the edge of the second surface; or, The orthographic projection of the first conductive layer onto the first surface lies within the contour of the first surface and does not intersect with the edge of the first surface; the orthographic projection of the second conductive layer onto the second surface lies within the contour of the second surface and does not intersect with the edge of the second surface.

7. A method for preparing a packaging material, characterized in that, include: A first conductive layer, a substrate, and a second conductive layer are stacked sequentially. The substrate includes a first surface near the first conductive layer, a second surface near the second conductive layer, and a side surface connecting the first surface and the second surface. The first conductive layer, the substrate, and the second conductive layer are laminated together, with a portion of the first conductive layer embedded in the substrate and a portion of the second conductive layer embedded in the substrate. A conductive sticker is attached to the first surface, the side surface, and the second surface, and the conductive sticker connects the first conductive layer and the second conductive layer. An electronic device is placed on the first surface; The conductive sticker includes a substrate, an adhesive layer, and a conductive film; the conductive film is electrically connected to the first conductive layer and the second conductive layer; the adhesive layer and the substrate are sequentially disposed on the outside of the conductive film, and the adhesive layer and the substrate encapsulate the conductive film; the material of the conductive film includes at least one of Al or Cu. Both the first conductive layer and the second conductive layer are metal mesh lines. The metal mesh lines include multiple first traces and multiple second traces. The first traces extend along a first direction, and the multiple first traces are arranged along a second direction. The second traces extend along the second direction, and the multiple second traces are arranged along the first direction. The second direction intersects the first direction. The side surface of the substrate includes two first side surfaces opposite each other along the first direction, and two second side surfaces opposite each other along the second direction; The conductive film is located on the first side surface, and the conductive film is electrically connected to at least two first traces and at least one second trace adjacent to the first conductive layer, and the conductive film is electrically connected to at least two first traces and at least one second trace adjacent to the second conductive layer; and / or, the conductive film is located on the second side surface, and the conductive film is electrically connected to at least two second traces and at least one first trace adjacent to the first conductive layer, and the conductive film is electrically connected to at least two second traces and at least one first trace adjacent to the second conductive layer.

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