Electroplating device

Abstract

The electroplating device provided by the application keeps a constant distance between the inert anode and the substrate by setting the solid anode, the mesh anode or the perforated anode as the inert anode in the anode area, so as to form a stable electric field on the surface of the substrate, thereby improving the uniformity of electroplating; the active anode is set below the inert anode in the anode area, so as to continuously supplement metal ions in the electroplating process, so that the metal ions are more sufficient to be transmitted to the substrate, thereby playing a role in improving the uniformity of electroplating; the rectifier plate, the fluid dispersion pipe or the stirring part and the like are set in the anode area, so as to uniformly disperse the anode liquid, thereby further improving the uniformity of electroplating.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing equipment, and in particular to an electroplating apparatus. Background Technology

[0002] Semiconductor electroplating refers to the process of electroplating metal ions from an electroplating solution onto the surface of a substrate (such as a wafer) to form metal interconnects during chip manufacturing.

[0003] The metal block acts as the anode, replenishing the metal ions consumed in the electroplating solution. During the electroplating process, the surface of the metal block is continuously consumed, causing the distance between the metal block and the substrate, which serves as the cathode, to increase continuously. Furthermore, the flat surface of the metal block becomes uneven as the process progresses, causing changes in the distance between different locations on the metal block surface and the substrate. All of these factors affect the metal deposition rate on the substrate surface, leading to uneven distribution of the coating thickness on the substrate surface.

[0004] Therefore, it is necessary to improve the electroplating equipment in order to improve the uniformity of substrate electroplating. Summary of the Invention

[0005] The purpose of this invention is to provide an electroplating apparatus to solve the problem of uneven electroplating of substrates in the prior art.

[0006] To achieve the above and other related objectives, the present invention provides an electroplating apparatus, comprising:

[0007] A clamp used to hold a substrate;

[0008] Anode cavity, the anode cavity comprising at least one independent anode region, each anode region being configured with:

[0009] A solid anode, wherein the solid anode is an inert anode, and the solid anode is disposed below the substrate and is parallel to and opposite to the substrate;

[0010] An active anode, disposed below the solid anode, is used to replenish metal ions;

[0011] At least one anode inlet is provided for supplying anolyte to the anode region;

[0012] At least one anode drain port is provided for discharging anolyte from the anode area;

[0013] At least one internal fluid channel is disposed within the wall of the anode region to guide the anolyte from the anode inlet to the anode outlet.

[0014] To achieve the above and other related objectives, the present invention also provides an electroplating apparatus, comprising:

[0015] A clamp used to hold a substrate;

[0016] Anode cavity, the anode cavity comprising at least one independent anode region, each anode region being configured with:

[0017] A mesh anode, wherein the mesh anode is an inert anode, and the mesh anode is disposed below the substrate and is parallel to and opposite to the substrate;

[0018] An active anode, disposed below the mesh anode, is used to replenish metal ions;

[0019] At least one anode inlet is provided for supplying anolyte to the anode region;

[0020] At least one anode drain port is provided for discharging anolyte from the anode area.

[0021] To achieve the above and other related objectives, the present invention also provides an electroplating apparatus, comprising:

[0022] A clamp used to hold a substrate;

[0023] Anode cavity, the anode cavity comprising at least one independent anode region, each anode region being configured with:

[0024] A perforated anode, wherein the perforated anode is an inert anode and is disposed below the substrate and parallel to the substrate;

[0025] An active anode, disposed below the perforated anode, is used to replenish metal ions;

[0026] At least one anode inlet is provided for supplying anolyte to the anode region;

[0027] At least one anode drain port is provided for discharging anolyte from the anode area;

[0028] The perforated anode has perforations and a first surface, which is parallel to the substrate. The first surfaces of the perforated anodes in each anode region together constitute an electric field generating surface, and the size of the electric field generating surface is equal to the size of the effective electroplating surface of the substrate.

[0029] To achieve the above and other related objectives, the present invention also provides an electroplating apparatus, comprising:

[0030] A clamp used to hold a substrate;

[0031] Anode cavity, the anode cavity comprising at least one independent anode region, each anode region being configured with:

[0032] A perforated anode, wherein a perforation is formed on the perforated anode, and the perforated anode is an inert anode, wherein the perforated anode is disposed below the substrate and is parallel to and opposite to the substrate;

[0033] An active anode, disposed below the perforated anode, is used to replenish metal ions;

[0034] At least one anode inlet is provided for supplying anolyte to the anode region;

[0035] At least one anode drain port is provided for discharging anolyte from the anode area;

[0036] In this embodiment, at least one anode region is provided with a rectifier plate, which is disposed between the anode inlet and the active anode of the anode region in which it is located.

[0037] To achieve the above and other related objectives, the present invention also provides an electroplating apparatus, comprising:

[0038] A clamp used to hold a substrate;

[0039] Anode cavity, the anode cavity comprising at least one independent anode region, each anode region being configured with:

[0040] A perforated anode, wherein a perforation is formed on the perforated anode, and the perforated anode is an inert anode, wherein the perforated anode is disposed below the substrate and is parallel to and opposite to the substrate;

[0041] An active anode, disposed below the perforated anode, is used to replenish metal ions;

[0042] At least one anode inlet is provided for supplying anolyte to the anode region;

[0043] At least one anode drain port is provided for discharging anolyte from the anode area;

[0044] At least one anode region is provided with a stirring section, the stirring section comprising:

[0045] A magnetic stirrer is located between the active anode and the anode inlet in the anode region where it is located;

[0046] A magnetic generator, located outside its anode region, is used to drive the magnetic stir bar to rotate.

[0047] To achieve the above and other related objectives, the present invention also provides an electroplating apparatus, comprising:

[0048] A clamp used to hold a substrate;

[0049] Anode cavity, the anode cavity comprising at least one independent anode region, each anode region being configured with:

[0050] A perforated anode, wherein a perforation is formed on the perforated anode, and the perforated anode is an inert anode, wherein the perforated anode is disposed below the substrate and is parallel to and opposite to the substrate;

[0051] An active anode, disposed below the perforated anode, is used to replenish metal ions;

[0052] At least one anode inlet is provided for supplying anolyte to the anode region;

[0053] At least one anode drain port is provided for discharging anolyte from the anode area;

[0054] In this configuration, at least one anode zone is provided with a fluid dispersion pipe and an anode inlet pipe. The fluid dispersion pipe is located above the perforated anode in its anode zone and is connected to the anode inlet of its anode zone through the anode inlet pipe, so as to ensure uniform dispersion of the anolyte.

[0055] As described above, the present invention provides an electroplating apparatus, which has the following beneficial effects:

[0056] 1) By setting solid anodes, mesh anodes or perforated anodes as inert anodes in the anode area and maintaining a constant distance from the substrate, a stable electric field is formed on the substrate surface, thereby improving the uniformity of electroplating;

[0057] 2) By setting an active anode below the inert anode in the anode area, metal ions are continuously replenished during the electroplating process, so that the metal ions are more fully transported to the substrate, thereby improving the uniformity of electroplating.

[0058] 3) By setting up components such as rectifiers, fluid dispersion tubes or stirring parts in the anode area, the anolyte can be evenly dispersed, thereby further improving the uniformity of electroplating. Attached Figure Description

[0059] Figure 1 The diagram shown is a schematic diagram of the electroplating apparatus in Embodiment 1 of the present invention;

[0060] Figure 2 This is a schematic diagram of another electroplating apparatus in Embodiment 1 of the present invention;

[0061] Figure 3 The diagram shown is a top view of the anode cavity in Embodiment 1 of the present invention;

[0062] Figure 4 The diagram shown is a schematic diagram of the electroplating apparatus in Embodiment 2 of the present invention;

[0063] Figure 5The diagram shown is a schematic diagram of the electroplating apparatus in Embodiment 3 of the present invention;

[0064] Figure 6 This is a schematic diagram of another electroplating apparatus in Embodiment 3 of the present invention;

[0065] Figure 7 The diagram shown is a schematic diagram of the electroplating apparatus in Embodiment 4 of the present invention;

[0066] Figure 8 The diagram shown is a top view of the anode cavity in Embodiment 4 of the present invention;

[0067] Figure 9 The diagram shown is a schematic diagram of the electroplating apparatus in Embodiment 5 of the present invention;

[0068] Figure 10 The diagram shown is a schematic diagram of the electroplating apparatus in Embodiment Six of the present invention;

[0069] Figure 11 This is a schematic diagram of another electroplating apparatus in Embodiment Six of the present invention;

[0070] Figure 12a The diagram shown is a top view of the fluid dispersion tube in Embodiment Six of the present invention;

[0071] Figure 12b The diagram shown is a top view of a deformation example of the fluid dispersion tube in Embodiment Six of the present invention;

[0072] Figure 13 The diagram shown is a schematic diagram of the electroplating apparatus in Embodiment 7 of the present invention;

[0073] Figure 14 This is a schematic diagram of another electroplating apparatus in Embodiment 7 of the present invention;

[0074] Figure 15 The diagram shown is a schematic diagram of the electroplating apparatus in Embodiment 8 of the present invention;

[0075] Figure 16 This is a schematic diagram of another electroplating apparatus in Embodiment 8 of the present invention;

[0076] Figure 17 The diagram shown is a top view of the anode cavity in Embodiment 8 of the present invention;

[0077] Figure 18 The diagram shown is a schematic diagram of the electroplating apparatus in Embodiment 9 of the present invention;

[0078] Figure 19 The diagram shown is a schematic diagram of the electroplating apparatus in Embodiment 10 of the present invention;

[0079] Figure 20 The diagram shown is a schematic representation of the electroplating apparatus in Embodiment Eleven of the present invention; and

[0080] Figure 21 This is a schematic diagram of another electroplating apparatus in Embodiment Eleven of the present invention. Detailed Implementation

[0081] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0082] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Although the illustrations only show components relevant to the present invention and are not drawn according to the actual number, shape, and size of components in implementation, the shape, quantity, and proportion of each component in actual implementation can be arbitrarily changed, and the layout of the components may also be more complex. In addition, the same reference numerals in multiple figures represent the same or equivalent parts or components.

[0083] Example 1

[0084] like Figure 1 As shown, this embodiment proposes an electroplating apparatus, including a clamp 100 and an electroplating chamber 200. The clamp 100 is used to hold a substrate w. The clamp 100 can drive the substrate w to perform rotation, tilting, and lifting actions. The clamp 100 has a sealing member 101, which divides the surface of the substrate w into a first region w1 and a second region w2. The first region w1 is covered by the sealing member 101 and does not come into contact with the electroplating solution; the second region w2 is exposed outside the clamp 100 and comes into contact with the electroplating solution. The second region w2 is the effective electroplating surface of the substrate w, and during electroplating, metal ions are deposited on the second region w2.

[0085] The electroplating chamber 200 includes an anode chamber 201, a cathode chamber 202 disposed above the anode chamber 201, an ion exchange membrane 203 separating the anode chamber 201 and the cathode chamber 202, an outer periphery 204 surrounding the anode chamber 201 and the cathode chamber 202, and a protective cover 205 disposed above the outer periphery 204. The anode chamber 201 is used to store anolyte, and the cathode chamber 202 is used to store catholyte. The anolyte and catholyte are collectively referred to as electroplating solution.

[0086] The cathode cavity 202 is equipped with a cathode inlet 221, a cathode supply pipe 222, and a diffuser plate 223. For example... Figure 1As indicated by the solid arrow, cathodic liquid enters the cathode supply pipe 222 from the cathode inlet 221, and is then supplied to the cathode cavity 202 by the cathode supply pipe 222. It then overflows upwards through the diffuser plate 223 to the outer cavity 204, and finally exits from the cathode outlet 241 at the bottom of the outer cavity 204. The diffuser plate 223 is positioned above the cathode supply pipe 222 to ensure uniform dispersion of the cathodic liquid within the cathode cavity 202. It is understood that the cathode outlet 241 can be connected to the cathode inlet 221 via an external circulation pipe (not shown) to allow for cathodic liquid circulation.

[0087] The anode chamber 201 includes at least one independent anode region 212, each anode region 212 being configured with a solid anode 213, an active anode 214, and an anolyte supply section. In this example, not intended to limit the invention, a partition wall 211 is provided within the anode chamber 201, dividing it into two independent anode regions 212 arranged concentrically. In each anode region 212, the active anode 214 is positioned below the solid anode 213. During the electroplating process, the active anode 214 is continuously consumed to replenish metal ions. The active anode 214 can be a metal block or metal particles, such as a copper block or copper particles.

[0088] The solid anode 213 is an inert anode, made of an inert material such as titanium (Ti). The surface of the solid anode 213 may also have a gold (Au) or platinum (Pt) coating. During electroplating, the solid anode 213 provides a stable potential and is not consumed. It maintains a constant distance from the substrate w, therefore, the electric field generated by the solid anode 213 on the substrate w does not change with the electroplating time, thus improving the uniformity of the electroplating to a certain extent.

[0089] The solid anode 213 is flat, dividing its anode region 212 into independent upper and lower spaces. The anolyte in the lower space flows upward into the upper space only through the internal fluid channel 217 described later, thereby reducing the influence of the anolyte flow on the electric field generated by the solid anode 213. To prevent the anolyte in the lower space from flowing upward into the upper space through the sidewall of the solid anode 213, the solid anode 213 and the wall (such as the sidewall) of its anode region 212 are in sealed contact. For example, an O-ring 2130 is provided between the sidewall of the solid anode 213 and the sidewall of its anode region 212.

[0090] A solid anode 213 is located below the substrate w and is arranged parallel to and opposite to the substrate w. The solid anode 213 has a first surface 2131, which is a flat, closed plane arranged opposite to the effective plating surface of the substrate w. The first surfaces 2131 of the solid anodes 213 in each anode region 212 collectively constitute an electric field generating surface. The size B of this electric field generating surface is equal to the size A of the effective plating surface of the substrate w (i.e., the second region w2), so that the solid anode 213 forms a uniform electric field on the effective plating surface of the substrate w. It should be understood that "equal" here allows for a certain degree of error, i.e., including cases where they are approximately equal.

[0091] The electroplating apparatus is also equipped with an electroplating power supply 300 for controlling the current (or voltage) in the substrate w. The negative terminal of the electroplating power supply 300 is connected to the fixture 100 via a wire 301 to supply power to the substrate w in the fixture 100. Each anode region 212 is also equipped with a conductive post 218. The conductive post 218 may be made of titanium (Ti). The electroplating power supply 300 is connected to the conductive post 218 via a wire 302. The conductive post 218 is electrically connected to the solid anode 213 and the active anode 214, and the electroplating power supply 300 supplies power to the solid anode 213 and the active anode 214 through the conductive post 218.

[0092] In one example, such as Figure 1 As shown, the active anode 214 can be a metal block, directly inverted below the solid anode 213. In this case, the solid anode 213 can be electrically connected to the electroplating power supply 300 through the conductive post 218, and the solid anode 213 can also act as a conductive plate to supply power to the active anode 214. In another example, as... Figure 2 As shown, the active anode 214 can be metal particles, which are laid flat on the conductive plate 219 arranged below the solid anode 213. At this time, the solid anode 213 is electrically connected to the electroplating power supply 300 through the conductive post 218, and the conductive plate 219 is electrically connected to the electroplating power supply 300 through the conductive post 218, so as to supply power to the active anode 214.

[0093] In the above description, the example of solid anode 213 and active anode 214 sharing a conductive post 218 is used. It can be understood that in other examples, solid anode 213 and active anode 214 can each be independently configured with conductive posts 218 electrically connected to the electroplating power supply 300, so that the electroplating power supply 300 can independently control solid anode 213 and active anode 214 respectively.

[0094] Additionally, it should be noted that the electroplating power supply 300 can independently control each anode, or synchronously control some anodes within each anode. For example, the electroplating power supply 300 can independently control the current (or voltage) in the solid anode 213 and active anode 214 of the same anode region 212, or synchronously control the current (or voltage) in the solid anode 213 and active anode 214 of the same anode region 212.

[0095] Each anode zone 212 is equipped with an independent anolyte supply unit for supplying anolyte to that anode zone 212. For example... Figure 1 As shown, the anolyte supply section of each anode region 212 includes at least one anode inlet 215 disposed below the active anode 214 for supplying anolyte to the anode region 212; at least one anode outlet 216 disposed above the solid anode 213 for discharging anolyte from the anode region 212; and at least one internal fluid channel 217 disposed within the sidewall of the anode region 212 for guiding anolyte from the anode inlet 215 to the anode outlet 216.

[0096] In this example, two anode inlets 215 are disposed at the bottom of the inner anode region 212a, and two anode inlets 215 are disposed at the bottom of the outer anode region 212b. The anolyte in each anode region 212 can flush the active anode 214 from bottom to top, which facilitates the diffusion of metal ions generated by the active anode 214 and removes anode sludge from the surface of the active anode 214. In one example, such as... Figure 1 As shown, the active anode 214 is a metal block. Anodic liquid enters each anode region 212 from the anode inlet 215 and washes the lower surface of the active anode 214, allowing the metal ions generated by the active anode 214 to be uniformly dispersed in the anodic liquid and more fully transported to the cathode region through the internal fluid channels 217 configured in each anode region 212. In another example, as... Figure 2 As shown, the active anode 214 is a metal particle. The anolyte enters each anode region 212 from the anode inlet 215 and flows continuously in the gaps between the metal particles, continuously transporting the metal ions generated by the active anode 214 to the cathode region through the internal fluid channels 217 configured in each anode region 212.

[0097] One of the at least one anode drain ports 216 configured in each anode region 212 is located at the highest point of its respective anode region 212. In a preferred embodiment, reference is made to... Figure 3 Each anode region 212 includes a first anode drain port 2161 and at least a pair of second anode drain ports 2162, wherein the first anode drain port 2161 is located at the highest point of its respective anode region 212. Figure 2In the vertical direction, the second anode drain port 2162 is arranged in pairs on both sides of the first anode drain port 2161 in its respective anode area 212. Figure 3 In the anode regions 212a and 212b, there is a first anode drain port 2161 and a pair of second anode drain ports 2162.

[0098] In this example, such as Figure 1 As shown, in each anode region 212, the inlet end 2171 of the internal fluid channel 217 is connected to the anode inlet 215 through the space below the active anode 214; the outlet end 2172 of the internal fluid channel 217 is connected to the anode outlet 216 through the space above the solid anode 213. It can be understood that in... Figure 2 In the example shown, in each anode region 212, the inlet end 2171 of the internal fluid channel 217 is connected to the anode inlet 215 through the gaps between the metal particles.

[0099] Furthermore, in this example, three internal fluid channels 217 are configured within the sidewall of each anode region 212. (Refer to the reference...) Figure 1 and Figure 3 In each anode region 212, the outlet end 2172 of the internal fluid channel 217 is positioned opposite to the anode drain port 216. Specifically, the outlet end 2172 of the internal fluid channel 217 and the anode drain port 216 are respectively positioned on opposite walls of the anode region 212, so that the anolyte flows smoothly from one side of the solid anode 213 to the other side, as shown below. Figure 3 As indicated by the dashed arrow.

[0100] It should be noted that, Figure 3 This is merely an example and is not intended to limit the number of internal fluid channels 217 and anode drain ports 216 in each anode zone 212 or their relative positions. The number and positional relationship of internal fluid channels 217 and anode drain ports 216 in each anode zone 212 can be reasonably optimized based on parameters such as fluid flux and flow field distribution in the anode zone 212.

[0101] Example 2

[0102] Please see Figure 4 This embodiment provides an electroplating apparatus. Compared with Embodiment 1, the difference lies in that at least one anode region 212 is further provided with a rectifier plate 2101, which is disposed between the anode inlet 215 and the active anode 214 of the anode region 212 in which it is located. The rectifier plate 2101 can promote the uniform dispersion of the anolyte, so that metal ions are uniformly and quickly transported to the substrate w, thereby improving the uniformity of electroplating.

[0103] It should be noted that when the active anode 214 is made of metal particles, the metal particles can be laid flat on the rectifier plate 2101. In this case, the rectifier plate 2101 can be made of a conductive material (such as titanium) to supply power to the active anode 214. Specifically, the rectifier plate 2101 can be electrically connected to the electroplating power supply 300 through the conductive post 218 to supply power to the active anode 214.

[0104] Example 3

[0105] Please see Figure 5 This embodiment provides an electroplating apparatus. Compared with Embodiment 1, the difference lies in that at least one anode region 212 is further provided with a stirring section 2102. The stirring section 2102 is disposed between the active anode 214 and the anode inlet 215 in its anode region 212, and is used to uniformly disperse the anolyte and improve the uniformity of electroplating. In this example, not to limit the invention, the stirring section 2102 is disposed in the anode region 212a located in the inner ring.

[0106] The stirring section 2102 is a magnetic stirrer, including a magnetic stir bar 21021 and a magnetic generator 21022. The magnetic stir bar 21021 is rotatably disposed inside its anode region 212. In one example, as... Figure 5 As shown, the magnetic stir bar 21021 is freely placed inside its anode region 212. In another example, as... Figure 6 As shown, the magnetic stir bar 21021 is rotatably mounted on the bottom wall of the anode region 212 where it is located via a bearing 21023.

[0107] A magnetic generator 21022 is positioned outside its anode region 212 to drive the magnetic stir bar 21021 to rotate. The magnetic generator 21022 drives the magnetic stir bar 21021 to rotate by continuously changing the polarity at both ends, thereby uniformly dispersing the anolyte.

[0108] Example 4

[0109] Please see Figure 7 This embodiment provides an electroplating apparatus, including a clamp 100 and an electroplating chamber 400. The clamp 100 is used to hold a substrate w. The clamp 100 can drive the substrate w to perform rotation, tilting, and lifting actions. The clamp 100 has a sealing member 101, which divides the surface of the substrate w into a first region w1 and a second region w2. The first region w1 is covered by the sealing member 101 and does not come into contact with the electroplating solution; the second region w2 is exposed outside the clamp 100 and comes into contact with the electroplating solution. The second region w2 is the effective electroplating surface of the substrate w, and during electroplating, metal ions are deposited on the second region w2.

[0110] The electroplating chamber 400 includes an anode chamber 401, a cathode chamber 202 disposed above the anode chamber 401, an ion exchange membrane 203 separating the anode chamber 401 and the cathode chamber 202, an outer periphery 204 surrounding the anode chamber 401 and the cathode chamber 202, and a protective cover 205 disposed above the outer periphery 204. The anode chamber 401 is used to store anolyte, and the cathode chamber 202 is used to store catholyte. The anolyte and catholyte are collectively referred to as electroplating solution.

[0111] The cathode cavity 202 is equipped with a cathode inlet 221, a cathode supply pipe 222, and a diffuser plate 223. For example... Figure 7 As indicated by the solid arrow, cathodic liquid enters the cathode supply pipe 222 from the cathode inlet 221, and is then supplied to the cathode cavity 202 by the cathode supply pipe 222. It then overflows upwards through the diffuser plate 223 and finally exits from the cathode outlet 241 at the bottom of the outer cavity 204. The diffuser plate 223 is positioned above the cathode supply pipe 222 to ensure uniform dispersion of the cathodic liquid within the cathode cavity 202. It is understood that the cathode outlet 241 can be connected to the cathode inlet 221 via an external circulation pipe to allow for cathodic liquid circulation.

[0112] The anode cavity 401 includes at least one independent anode region 412, each anode region 412 being configured with a mesh anode 413, an active anode 414, an anode inlet 415, and an anode outlet 416. In this example, not intended to limit the invention, a partition wall 411 is provided within the anode cavity 401, dividing the anode cavity 401 into two independent anode regions 412, which are arranged concentrically. The active anode 414 is disposed below the mesh anode 413. During the electroplating process, the active anode 414 is continuously consumed to replenish metal ions. The active anode 414 can be a metal block or metal particles, such as a copper block or copper particles.

[0113] The mesh anode 413 is an inert anode, made of an inert material such as titanium (Ti). The surface of the mesh anode 413 may also have a gold (Au) or platinum (Pt) coating. During electroplating, the mesh anode 413 provides a stable potential and is not consumed. It maintains a constant distance from the substrate w, therefore, the electric field generated by the mesh anode 413 on the substrate w does not change with the electroplating time, thus improving the uniformity of the electroplating to a certain extent.

[0114] The mesh anode 413 has a plurality of mesh openings, through which the anolyte can flow freely. The mesh openings can be of any shape, such as round, elliptical, or polygonal. The mesh anode 413 is located below the substrate w and is arranged parallel to and opposite to the substrate w. The mesh anode 413 has a first surface 4131, which is arranged opposite to the effective plating surface of the substrate w. A plurality of mesh openings are formed on the first surface 4131. The first surfaces 4131 of the mesh anodes 413 in each anode region 412 collectively constitute an electric field generating surface. The size B of this electric field generating surface is equal to the size A of the effective plating surface of the substrate w (i.e., the second region w2), so that the mesh anode 413 forms a uniform electric field on the effective plating surface of the substrate w. It should be understood that "equal" here allows for a certain degree of error, i.e., including cases where they are approximately equal.

[0115] The electroplating apparatus is also equipped with an electroplating power supply 300 for controlling the current in the substrate w. The negative terminal of the electroplating power supply 300 is connected to the fixture 100 via a wire 301 to supply power to the substrate w in the fixture 100. Each anode region 412 is also equipped with a conductive post 418 and a conductive plate 419, which can be made of titanium (Ti). The conductive plate 419 can be directly mounted on the bottom of its respective anode region 412, or it can be spaced apart from the bottom of its respective anode region 412, with the gap forming a space for the anolyte to flow. The active anode 414 is placed on the conductive plate 419. The conductive post 418 is electrically connected to the mesh anode 413 and the conductive plate 419. The positive terminal of the electroplating power supply 300 is connected to the conductive post 418 via a wire 302 to supply power to the mesh anode 413 and the active anode 414 placed on the conductive plate 419.

[0116] In the above description, the example of the mesh anode 413 and the active anode 414 sharing a common conductive post 418 is used. It can be understood that in other examples, the mesh anode 413 and the active anode 414 can each be independently configured with conductive posts 418 electrically connected to the electroplating power supply 300, so that the electroplating power supply 300 can independently control the mesh anode 413 and the active anode 414 respectively.

[0117] Additionally, it should be noted that the electroplating power supply 300 can independently control each anode, or synchronously control some anodes within each anode. For example, the electroplating power supply 300 can independently control the current (or voltage) in the mesh anode 413 and active anode 414 of the same anode region 412, or synchronously control the current (or voltage) in the mesh anode 413 and active anode 414 of the same anode region 412.

[0118] Each anode zone 412 is provided with at least one anode inlet 415 for supplying anolyte to the anode zone 412. Figure 7In this design, three anode inlets 415 are located at the bottom of the inner anode region 412a, and two anode inlets 415 are located at the bottom of the outer anode region 412b. In this example, the active anode 414 is a metal block, and both the active anode 414 and the conductive plate 419 below it have through holes 417 that communicate with the anode inlets 415 to allow anolyte flow. Specifically, as shown... Figure 7 As shown, the anode inlet 415 directly penetrates the active anode 414 and the conductive plate 419 below the active anode 414, forming the aforementioned through hole 417. Figure 7 The dashed arrow indicates the flow direction of the anolyte in the anode region 412. The anolyte flows upward from the anode inlet 415 to submerge the active anode 414, and then flows through the mesh anode 413 to the anode outlet 416.

[0119] Each anode region 412 is provided with at least one anode drain port 416 for discharging anolyte from the anode region 412. One of the at least one anode drain ports 416 provided in each anode region 412 is located at the highest point of its respective anode region 412. In a preferred embodiment, reference... Figure 8 Each anode region 412 includes a first anode drain port 4161 and at least a pair of second anode drain ports 4162, wherein the first anode drain port 4161 is located at the highest point of its respective anode region 412. Figure 7 In the vertical direction, the second anode drain port 4162 is arranged in pairs on both sides of the first anode drain port 4161 in its respective anode area 412. Figure 8 In the anode regions 412a and 412b, there is a first anode drain port 4161 and a pair of second anode drain ports 4162. Figure 8 The dashed arrow indicates the flow direction of the anolyte above the mesh anode 413. Specifically, above the mesh anode 413, the anolyte generally flows smoothly in one direction towards the anode drain port 416.

[0120] It should be noted that, Figure 8 This is for illustrative purposes only and is not intended to limit the number of anode drain ports 416. The number of anode drain ports 416 can be reasonably optimized based on the process flow rate of the anolyte and the flow field distribution parameters.

[0121] Example 5

[0122] Please see Figure 9 This embodiment proposes an electroplating apparatus. Compared with Embodiment 4, the difference lies in that the active anode 414 is made of metal particles. The granular active anode 414 is laid flat on the conductive plate 419.

[0123] Since the anolyte can flow freely through the gaps between the metal particles, in this example, only the conductive plate 419 has a through hole 417 for the anolyte to flow through. The through hole 417 can be formed by directly penetrating the conductive plate 419 through the anode inlet 415. Figure 9 The dashed arrow indicates the flow direction of the anolyte in the anolyte zone 412. For example... Figure 9 As shown, the anolyte flows upward from the anode inlet 415 into the gaps between the metal particles, then submerges the metal particles, then flows upward through the mesh anode 413, and finally flows out through the anode outlet 416.

[0124] Example 6

[0125] Please see Figure 10 This embodiment proposes an electroplating apparatus. Compared with Embodiment 4, the difference lies in that at least one anode region 412 is further equipped with a fluid dispersion pipe 4101 and an anolyte inlet pipe 4102. The fluid dispersion pipe 4101 is located above the active anode 414 of its anode region 412 and is connected to the anode inlet 415 of its anode region 412 via the anode inlet pipe 4102, so as to uniformly disperse the anolyte. In this example, not to limit the invention, the fluid dispersion pipe 4101 is arranged in the anode region 412a located in the inner circle.

[0126] In this example, such as Figure 12a As shown, the fluid dispersion pipe 4101 includes multiple branch pipes 41011. These branch pipes 41011 are radially distributed around the anode inlet pipe 4102 and are connected to it. Each branch pipe 41011 is straight and has multiple nozzles 41012 along its length, which are inclined downwards. To further enhance the dispersion effect of the fluid dispersion pipe 4101 on the anolyte, such as... Figure 12a As shown, each of the multiple branch pipes 41011 has a row of nozzles 41012 along its length, and the multiple rows of nozzles 41012 rotate in the same direction (e.g., Figure 12a The orientation of the nozzle 41012 is set in a counterclockwise direction.

[0127] Figure 12b Another variation of the fluid dispersion tube is shown. For example... Figure 12b As shown, the fluid dispersion pipe 4103 includes at least one annular pipe 41031, and the annular pipe 41031 has a plurality of nozzles 41032. Figure 12b In the middle, the fluid dispersion tube 4103 includes two annular tubes 41031, which are arranged in concentric circles.

[0128] It should be noted that the specific form of the fluid dispersion tube can be designed reasonably according to the shape, size and other parameters of the anode area where it is located, and is not limited to... Figure 12a and Figure 12b The example shown. In addition, different forms of fluid dispersion tubes can be used in different anode regions, for example, fluid dispersion tube 4101 is used in the inner anode region 412a and fluid dispersion tube 4103 is used in the outer anode region 413b.

[0129] The fluid dispersion tube 4101 is located above the active anode 414. In one example, the fluid dispersion tube 4101 is as follows: Figure 10 As shown, located between the active anode 414 and the mesh anode 413, in the anode region 412a located in the inner circle, the anolyte is... Figure 10 As indicated by the dashed arrow, the fluid sprayed downwards from the nozzle 41012 to flush the active anode 414, then flows upwards through the mesh anode 413 to the anode drain port 416. In another example, the fluid dispersion tube 4101 is as follows... Figure 11 As shown, located above the mesh anode 413, in the anode region 412a located in the inner ring, the anolyte is... Figure 11 As shown by the dashed arrow, the liquid is sprayed downwards from the nozzle 41012 to successively wash the mesh anode 413 and the active anode 414, and then flows through the mesh anode 413 to the anode drain port 416.

[0130] Example 7

[0131] Please see Figure 13 This embodiment proposes an electroplating apparatus. Compared with Embodiment 4, the difference lies in that at least one anode region 412 is further provided with a stirring unit 4102 for uniformly dispersing the anolyte. In this example, not to limit the invention, the stirring unit 4102 is disposed in the anode region 412a located in the inner ring.

[0132] like Figure 13 As shown, the stirring unit 4102 is a magnetic stirrer, including a magnetic stir bar 41021 and a magnetic generator 41022. The magnetic stir bar 41021 is rotatably mounted inside the anode region 412 in which it is located. Specifically, the magnetic stir bar 41021 is mounted on the upper end of a rotating shaft 41023, the lower end of which passes through a through hole 417 on the active anode 414 and the conductive plate 419, and is rotatably mounted on the bottom wall of the anode region 412 via a bearing 41024. The magnetic generator 41022 is disposed outside the anode region 412 in which it is located to drive the magnetic stir bar 41021 to rotate.

[0133] The magnetic stir bar 41021 is located above the active anode 414. In one example, as... Figure 13 As shown, the magnetic stir bar 41021 is located between the mesh anode 413 and the active anode 414. In another example, as... Figure 14 As shown, the magnetic stir bar 41021 is located above the mesh anode 413.

[0134] Example 8

[0135] Please see Figure 15 This embodiment provides an electroplating apparatus, including a clamp 100 and an electroplating chamber 500. The clamp 100 is used to hold a substrate w. The clamp 100 can drive the substrate w to perform rotation, tilting, and lifting actions. The clamp 100 has a sealing member 101, which divides the surface of the substrate w into a first region w1 and a second region w2. The first region w1 is covered by the sealing member 101 and does not come into contact with the electroplating solution; the second region w2 is exposed outside the clamp 100 and comes into contact with the electroplating solution. The second region w2 is the effective electroplating surface of the substrate w, and during electroplating, metal ions are deposited on the second region w2.

[0136] The electroplating chamber 500 includes an anode chamber 501, a cathode chamber 202 disposed above the anode chamber 501, an ion exchange membrane 203 separating the anode chamber 501 and the cathode chamber 202, an outer periphery 204 surrounding the anode chamber 501 and the cathode chamber 202, and a protective cover 205 disposed above the outer periphery 204. The anode chamber 501 is used to store anolyte, and the cathode chamber 202 is used to store catholyte. The anolyte and catholyte are collectively referred to as electroplating solution.

[0137] The cathode cavity 202 is equipped with a cathode inlet 221, a cathode supply pipe 222, and a diffuser plate 223. For example... Figure 15 As indicated by the solid arrow, cathodic liquid enters the cathode supply pipe 222 from the cathode inlet 221, and is then supplied to the cathode cavity 202 by the cathode supply pipe 222. It then overflows upwards through the diffuser plate 223 to the outer cavity 204, and finally exits from the cathode outlet 241 at the bottom of the outer cavity 204. The diffuser plate 223 is positioned above the cathode supply pipe 222 to ensure uniform dispersion of the cathodic liquid within the cathode cavity 202. It is understood that the cathode outlet 241 can be connected to the cathode inlet 221 via an external circulation pipe to allow for cathodic liquid circulation.

[0138] The anode cavity 501 includes at least one independent anode region 512, each anode region 512 being configured with a perforated anode 513, an active anode 514, an anode inlet 515, and an anode outlet 516. In this example, not intended to limit the invention, a partition wall 511 is provided within the anode cavity 501, dividing the anode cavity 501 into two independent anode regions 512, which are arranged concentrically. The active anode 514 is positioned below the perforated anode 513 for replenishing metal ions.

[0139] The perforated anode 513 is an inert anode, made of an inert material such as titanium (Ti). The surface of the perforated anode 513 may also have a gold (Au) or platinum (Pt) coating. During electroplating, the perforated anode 513 provides a stable potential and is not consumed. It maintains a constant distance from the substrate w, therefore, the electric field generated by the perforated anode 513 on the substrate w does not change with the electroplating time, thus improving the uniformity of the electroplating to a certain extent.

[0140] A perforated anode 5133 has a perforation 5130 formed therein for the free flow of anolyte. The perforated anode 513 is located below the substrate w and is disposed parallel to the substrate w. The perforated anode 513 has a first surface 5131, which is disposed opposite to the effective electroplating surface of the substrate w. Preferably, the perforation 5130 is perpendicular to the substrate w.

[0141] The first surfaces 5131 of the perforated anodes 513 in each anode region 512 collectively constitute an electric field generating surface. The size B of this electric field generating surface is equal to the size A of the effective electroplating surface of the substrate w (i.e., the second region w2), so that the perforated anodes 513 form a uniform electric field on the effective electroplating surface of the substrate w. It should be understood that "equal" here allows for a certain degree of error, i.e., it includes cases where they are approximately equal.

[0142] The electroplating apparatus is also equipped with an electroplating power supply 300 for controlling the current in the substrate w. The negative terminal of the electroplating power supply 300 is connected to the fixture 100 via a wire 301 to supply power to the substrate w in the fixture 100. Each anode region 512 is also equipped with a conductive post 518, which may be made of titanium (Ti). The electroplating power supply 300 is connected to the conductive post 518 via a wire 302. The conductive post 518 is electrically connected to the perforated anode 513 and the active anode 514, and the electroplating power supply 300 supplies power to the perforated anode 513 and the active anode 514 through the conductive post 518.

[0143] In one example, such as Figure 15 As shown, the active anode 514 is a metal block, directly inverted below the perforated anode 513. In this case, the perforated anode 513 can be electrically connected to the electroplating power supply 300 via the conductive post 518, and the perforated anode 513 can also act as a conductive plate 519 to supply power to the active anode 514. In another example, as... Figure 16 As shown, the active anode 514 can be metal particles, which are laid flat on the conductive plate 519 arranged below the perforated anode 513. At this time, the perforated anode 513 is electrically connected to the electroplating power supply 300 through the conductive post 518, and the conductive plate 519 is electrically connected to the electroplating power supply 300 through the conductive post 518, thus supplying power to the active anode 514.

[0144] In the above description, the example of perforated anode 513 and active anode 514 sharing a conductive post 518 is used. It can be understood that in other examples, perforated anode 513 and active anode 514 can each be independently configured with conductive posts 518 electrically connected to the electroplating power supply 300, so that the electroplating power supply 300 can independently control perforated anode 513 and active anode 514 respectively.

[0145] Additionally, it should be noted that the electroplating power supply 300 can independently control each anode, or synchronously control some anodes within each anode. For example, the electroplating power supply 300 can independently control the current (or voltage) in the perforated anode 513 and the active anode 514 of the same anode region 512, or synchronously control the current (or voltage) in the perforated anode 513 and the active anode 514 of the same anode region 512.

[0146] Each anode zone 512 is provided with at least one anode inlet 515 for supplying anolyte to that anode zone 512. Figure 15 In the inner ring, the anode area 512a has three anode inlets 515 at its bottom, while the outer ring, the anode area 512b, has two anode inlets 515 at its bottom. For example... Figure 15 As shown by the dashed arrow, the anolyte is supplied from bottom to top from the anode inlet 515 to each anode zone 512. In each anode zone 512, the anolyte flows sequentially through the active anode 514 and the perforated anode 513, and finally flows to the anode outlet 516.

[0147] In one example, such as Figure 15 As shown, the active anode 514 is a metal block with a through hole 517. This through hole 517 connects the anode inlet 515 to the through hole 5130 of the perforated anode 513, allowing the anolyte to flow through. In another example, as... Figure 16 As shown, the active anode 514 is a metal particle with gaps between it. These gaps connect the anode inlet 515 to the perforation 5130 of the perforated anode 513, allowing anolyte flow. It is understood that in other examples, a slit may be provided between the sidewall of the perforated anode 513 and the sidewall of its corresponding anode region 512, serving as a channel for anolyte flow. Similarly, when the active anode 514 is a metal block, a slit may also be provided between the sidewall of the active anode 514 and the sidewall of its corresponding anode region 512, serving as a channel for anolyte flow.

[0148] Each anode zone 512 is provided with at least one anode drain port 516 for discharging anolyte from that anode zone 512. For example... Figure 15As shown, in each anode region 512, an anode drain port 516 is disposed above the perforated anode 513. One of the at least one anode drain ports 516 disposed in each anode region 512 is located at the highest point of its respective anode region 512. In a preferred embodiment, reference... Figure 17 Each anode region 512 includes a first anode drain port 5161 and at least one pair of second anode drain ports 5162, wherein the first anode drain port 5161 is located at the highest point of its respective anode region 512, and the second anode drain ports 5162 are arranged in pairs on both sides of the first anode drain port 5161 in its respective anode region 512. Figure 17 In the anode regions 512a and 512b, there is a first anode drain port 5161 and a pair of second anode drain ports 5162. Figure 17 The dashed arrow indicates the flow direction of the anolyte above the perforated anode 513. Specifically, above the perforated anode 513, the anolyte generally flows smoothly in one direction towards the anode drain port 516.

[0149] It should be noted that, Figure 17 This is for illustrative purposes only and is not intended to limit the number of anode drain ports 516. The number of anode drain ports 516 can be reasonably optimized based on the process flow rate of the anolyte and the flow field distribution parameters.

[0150] Example 9

[0151] Please see Figure 18 This embodiment proposes an electroplating apparatus. Compared with Embodiment Eight, the difference lies in that at least one anode region 512 is further equipped with a fluid dispersion pipe 4101 and an anolyte inlet pipe 4102. The fluid dispersion pipe 4101 is located above the perforated anode 513 of its anode region 512 and is connected to the anode inlet 515 of its anode region 512 via the anode inlet pipe 4102, so as to uniformly disperse the anolyte. In this example, not to limit the invention, the fluid dispersion pipe 4101 is arranged in the anode region 512a located in the inner circle.

[0152] Reference Figure 12a The fluid dispersion pipe 4101 includes multiple branch pipes 41011. These branch pipes 41011 are radially distributed around the anode inlet pipe 4102 and are connected to it. Each branch pipe 41011 is straight and has multiple nozzles 41012 along its length, with the nozzles 41012 angled downwards. In this example, as... Figure 18As shown, the anode inlet pipe 4102 is installed at the perforation 5130 of the perforated anode 513, and one end of the anode inlet pipe 4102 is located above the perforated anode 513 and connected to multiple branch pipes 41011, while the other end of the anode inlet pipe 4102 is located below the perforated anode 513 and connected to the anode inlet 515.

[0153] To further enhance the dispersing effect of the fluid dispersion tube 4101 on the anolyte, such as Figure 12a As shown, each of the multiple branch pipes 41011 has a row of nozzles 41012 along its length direction, and the multiple rows of nozzles 41012 are oriented in the same rotation direction (e.g., counterclockwise).

[0154] Figure 12b Another variation of the fluid dispersion tube is shown. For example... Figure 12b As shown, the fluid dispersion pipe 4103 includes at least one annular pipe 41031, and the annular pipe 41031 has a plurality of nozzles 41032. Figure 12b In the middle, the fluid dispersion tube 4103 includes two annular tubes 41031, which are arranged in concentric circles.

[0155] Example 10

[0156] Please see Figure 19 This embodiment provides an electroplating apparatus. Compared with Embodiment 8, the difference lies in that at least one anode region 512 is further provided with a rectifier plate 5102, which is disposed between the anode inlet 515 and the active anode 514 of the anode region 512 in which it is located. The rectifier plate 5102 can promote the uniform dispersion of the anolyte and enable the metal ions to be uniformly and quickly transported to the substrate w, thereby improving the uniformity of electroplating.

[0157] It should be noted that when the active anode 514 is made of metal particles, the metal particles can be laid flat on the rectifier plate 5102. In this case, the rectifier plate 5102 can be made of a conductive material (such as titanium) to supply power to the active anode 514. Specifically, the rectifier plate 5102 can be electrically connected to the electroplating power supply 300 through the conductive post 518 to supply power to the active anode 514.

[0158] Example 11

[0159] Please see Figure 20 This embodiment proposes an electroplating apparatus. Compared with Embodiment Eight, the difference lies in that at least one anode region 512 is further provided with a stirring section 5103. The stirring section 5103 is disposed between the anode inlet 515 and the active anode 514 of its respective anode region 512, for uniformly dispersing the anolyte. In this example, not to limit the invention, the stirring section 5103 is disposed in the anode region 512a located in the inner ring.

[0160] The stirring section 5103 is a magnetic stirrer, including a magnetic stir bar 51031 and a magnetic generator 51032. The magnetic stir bar 51031 is rotatably disposed inside its anode region 512, specifically, the magnetic stir bar 51031 is rotatably disposed between the anode inlet 515 and the active anode 514 in its anode region 512. In one example, as... Figure 20 As shown, the magnetic stir bar 51031 is freely placed inside its anode region 512. In another example, as... Figure 21 As shown, the magnetic stir bar 51031 is rotatably mounted on the bottom wall of the anode region 512 where it is located via a bearing 51033.

[0161] A magnetic generator 51032 is positioned outside its anode region 512 to drive the magnetic stir bar 51031 to rotate. The magnetic generator 51032 drives the magnetic stir bar 51031 to rotate by continuously changing the polarity at both ends, thereby uniformly dispersing the anolyte.

[0162] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. An electroplating apparatus, characterized in that, include: A clamp used to hold a substrate; Anode cavity, the anode cavity comprising at least one independent anode region, each anode region being configured with: A mesh anode, wherein the mesh anode is an inert anode and is disposed below the substrate and parallel to the substrate; An active anode, disposed below the mesh anode, is used to replenish metal ions; At least one anode inlet is provided for supplying anolyte to the anode region; At least one anode drain port is provided for discharging anolyte from the anode area; At least one of the anode regions is further provided with a fluid dispersion pipe and an anode inlet pipe. The fluid dispersion pipe is located above the active anode of the anode region and is connected to the anode inlet of the anode region through the anode inlet pipe to make the anolyte uniformly dispersed. The fluid dispersion pipe includes multiple branch pipes, each of which has a row of spray outlets along its length. The multiple rows of spray outlets are oriented in the same rotation direction.

2. The electroplating apparatus according to claim 1, characterized in that, The mesh anode has a first surface that is parallel to the substrate. The first surfaces of the mesh anodes in each anode region together constitute an electric field generating surface. The size of the electric field generating surface is equal to the size of the effective electroplating surface of the substrate.

3. The electroplating apparatus according to claim 1, characterized in that, Each anode region is configured with at least one anode drain outlet, including a first anode drain outlet and at least a pair of second anode drain outlets. The first anode drain outlet is located at the highest point of its anode region, and the second anode drain outlets are arranged in pairs on both sides of the first anode drain outlet in its anode region.

4. The electroplating apparatus according to claim 1, characterized in that, At least one of the anode regions is further provided with a stirring section, the stirring section comprising: A magnetic stir bar is located above the active anode in the anode region where it is located, and the magnetic stir bar is rotatably connected to the bottom wall of the anode region via a bearing; A magnetic generator, located outside its anode region, is used to drive the magnetic stir bar to rotate.

5. The electroplating apparatus according to claim 1, characterized in that, The branch pipe is straight and has multiple nozzles. The multiple branch pipes are radially distributed around the anode inlet pipe and are connected to the anode inlet pipe.

6. The electroplating apparatus according to claim 5, characterized in that, The nozzle is tilted downwards.

7. The electroplating apparatus according to claim 1, characterized in that, The fluid dispersion tube includes at least one annular tube with multiple nozzles.

8. The electroplating apparatus according to claim 1, characterized in that, The active anode is a metal particle or a metal block.

9. An electroplating apparatus, characterized in that, include: A clamp used to hold a substrate; Anode cavity, the anode cavity comprising at least one independent anode region, each anode region being configured with: A perforated anode, wherein the perforated anode is an inert anode and is disposed below the substrate and parallel to the substrate; An active anode, disposed below the perforated anode, is used to replenish metal ions; At least one anode inlet is provided for supplying anolyte to the anode region; At least one anode drain port is provided for discharging anolyte from the anode area; The perforated anode has perforations and a first surface, which is parallel to the substrate. The first surfaces of the perforated anodes in each anode region together constitute an electric field generating surface, and the size of the electric field generating surface is equal to the size of the effective electroplating surface of the substrate. At least one of the anode regions is further provided with a fluid dispersion pipe and an anode inlet pipe. The fluid dispersion pipe is located above the active anode of the anode region and is connected to the anode inlet of the anode region through the anode inlet pipe to make the anolyte uniformly dispersed. The fluid dispersion pipe includes multiple branch pipes, each of which has a row of spray outlets along its length. The multiple rows of spray outlets are oriented in the same rotation direction.

10. An electroplating apparatus, characterized in that, include: A clamp used to hold a substrate; Anode cavity, the anode cavity comprising at least one independent anode region, each anode region being configured with: A perforated anode, wherein a perforation is formed on the perforated anode, and the perforated anode is an inert anode, wherein the perforated anode is disposed below the substrate and is parallel to and opposite to the substrate; An active anode, disposed below the perforated anode, is used to replenish metal ions; At least one anode inlet is provided for supplying anolyte to the anode region; At least one anode drain port is provided for discharging anolyte from the anode area; In this embodiment, at least one anode region is provided with a rectifier plate, which is disposed between the anode inlet and the active anode of the anode region in which it is located; At least one of the anode regions is further provided with a fluid dispersion pipe and an anode inlet pipe. The fluid dispersion pipe is located above the active anode of the anode region and is connected to the anode inlet of the anode region through the anode inlet pipe to make the anolyte uniformly dispersed. The fluid dispersion pipe includes multiple branch pipes, each of which has a row of spray outlets along its length. The multiple rows of spray outlets are oriented in the same rotation direction.

11. An electroplating apparatus, characterized in that, include: A clamp used to hold a substrate; Anode cavity, the anode cavity comprising at least one independent anode region, each anode region being configured with: A perforated anode, wherein a perforation is formed on the perforated anode, and the perforated anode is an inert anode, wherein the perforated anode is disposed below the substrate and is parallel to and opposite to the substrate; An active anode, disposed below the perforated anode, is used to replenish metal ions; At least one anode inlet is provided for supplying anolyte to the anode region; At least one anode drain port is provided for discharging anolyte from the anode area; At least one anode region is provided with a stirring section, the stirring section comprising: A magnetic stirrer is located between the active anode and the anode inlet in the anode region where it is located; A magnetic generator, located outside its anode region, is used to drive the magnetic stir bar to rotate; At least one of the anode regions is further provided with a fluid dispersion pipe and an anode inlet pipe. The fluid dispersion pipe is located above the active anode of the anode region and is connected to the anode inlet of the anode region through the anode inlet pipe to make the anolyte uniformly dispersed. The fluid dispersion pipe includes multiple branch pipes, each of which has a row of spray outlets along its length. The multiple rows of spray outlets are oriented in the same rotation direction.

12. The electroplating apparatus according to claim 11, characterized in that, The magnetic stir bar is freely placed inside its anode region; or the magnetic stir bar is rotatably mounted at the bottom of its anode region via a bearing.

13. An electroplating apparatus, characterized in that, include: A clamp used to hold a substrate; Anode cavity, the anode cavity comprising at least one independent anode region, each anode region being configured with: A perforated anode, wherein a perforation is formed on the perforated anode, and the perforated anode is an inert anode, wherein the perforated anode is disposed below the substrate and is parallel to and opposite to the substrate; An active anode, disposed below the perforated anode, is used to replenish metal ions; At least one anode inlet is provided for supplying anolyte to the anode region; At least one anode drain port is provided for discharging anolyte from the anode area; In this embodiment, at least one anode zone is provided with a fluid dispersion pipe and an anode inlet pipe. The fluid dispersion pipe is located above the perforated anode in its anode zone and is connected to the anode inlet of its anode zone through the anode inlet pipe to ensure uniform dispersion of the anolyte. The fluid dispersion pipe includes multiple branch pipes, each of which has a row of spray outlets along its length. The multiple rows of spray outlets are oriented in the same rotation direction.

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