显示面板组合结构、微投影光机及电子设备

By electrically connecting the micro-display panel with structures such as lenses and optimizing component design, the assembly problem of the micro-display panel was solved, enabling the miniaturization of the micro-projection optical engine and the lightweighting of electronic devices, thereby improving the durability of the equipment and the convenience of electrical connection.

CN118502182BActive Publication Date: 2026-07-17JADE BIRD DISPLAY (SHANGHAI) LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
JADE BIRD DISPLAY (SHANGHAI) LTD
Filing Date
2024-06-07
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

In the existing technology, the assembly problem of micro-display panels composed of Micro LEDs with structures such as lenses is difficult to solve, and the miniaturization and lightweight requirements of micro-projection optical engines have not been met, especially in wearable electronic devices.

Method used

By electrically connecting the first microdisplay panel to at least two second microdisplay panels, with the electrical connection points distributed on different sides and connected via a flexible circuit board, and combining the design of the light combining assembly and lens assembly, the assembly volume of the electronic device and the volume of the micro-projection optical engine are reduced.

Benefits of technology

This technology enables the miniaturization of electronic devices and the lightweighting of micro-projection optical engines, improves the convenience of electrical connections and the protection of light-combining components, and enhances the durability and strength of the equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

一种显示面板组合结构、微投影光机及电子设备,涉及显示技术领域,其中显示面板组合结构包括:第一微显示面板,第一微显示面板具有至少2个第一连接器部,不同的第一连接器部之间通过第一电连接件进行电学连接;至少2个第二微显示面板,每个第二微显示面板具有第二连接器部;第一微显示面板的至少2个第一连接器部可与至少2个第二微显示面板的第二连接器部进行对应的电学连接。通过将至少3个微显示面板电学连接具有的至少2处电连接位置可分布于不同的侧面,能够避免将多处电连接位置设置在同一侧面而占用较大面积的问题,能够减小电子设备的组装体积,利于电子设备趋向于小型化。
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