A method and device for adjusting parameters of a nickel plating solution, a storage medium and an electronic device

Abstract

The application discloses a nickel plating solution parameter adjustment method and device, a storage medium and an electronic device, and relates to the technical field of chemical plating. The method comprises the following steps: performing calculation and processing based on initial proportions of each sub-solution in an initial nickel plating solution to obtain a first index value and a second index value of solution parameters used for adjusting the initial nickel plating solution; performing calculation and processing by using a preset index function based on an initial temperature, an initial pH value of the initial nickel plating solution, the first index value and the second index value to obtain an evaluation index of the initial nickel plating solution; and in the case that the evaluation index is less than a preset target index, adjusting at least one solution parameter in the initial proportions, the initial temperature and the initial pH value of each sub-solution to obtain a target nickel plating solution. The method can improve the corrosion resistance of the nickel plating solution.

Description

Technical Field

[0001] This invention relates to the field of solution parameter adjustment technology, and in particular to a method, apparatus, storage medium, and electronic device for adjusting the parameters of a nickel plating solution. Background Technology

[0002] Existing methods for adjusting electroless nickel plating solution parameters are mostly based on the controlled variable method, using empirical formulas to adjust coating performance. The biggest drawback of this method is the lack of theoretical guidance; it relies solely on trial and error based on industrial experience, failing to provide targeted optimization for the coating. Furthermore, existing methods can only control single variables, while the influencing factors of electroless plating solutions are not only complex, but each factor also has a different mechanism of influence on the coating. Therefore, when multiple factors change simultaneously, it is impossible to determine the changes in coating performance, resulting in poor corrosion resistance of the solution after parameter adjustment. Summary of the Invention

[0003] In view of this, the present invention provides a method, apparatus, storage medium and electronic device for adjusting nickel plating solution parameters, the main purpose of which is to solve the problem that the chemically plated coating has poor corrosion resistance after adjusting the solution parameters using existing nickel plating solution parameter adjustment methods.

[0004] To address the above problems, this application provides a method for adjusting the parameters of a nickel plating solution, comprising:

[0005] The initial ratio of each sub-solution in the initial nickel plating solution is used to calculate and process the solution parameters for adjusting the initial nickel plating solution, and the first index value and the second index value are obtained.

[0006] The evaluation index of the initial nickel plating solution is obtained by calculating based on the initial temperature, initial pH, first index value, and second index value of the initial nickel plating solution using a preset index function.

[0007] If the evaluation index is less than the preset target index, at least one of the solution parameters, namely the initial ratio, the initial temperature and the initial pH, of each of the sub-solutions is adjusted to obtain the target nickel plating solution.

[0008] Optionally, before performing calculations using a preset index function based on the initial temperature, initial pH, the first index value, and the second index value of the initial nickel plating solution, the method further includes: constructing the preset index function, specifically including:

[0009] Construct the chemical reaction equations for the reduction of electrons in the process of electroless plating of magnesium alloy using historical nickel plating solutions;

[0010] Based on the aforementioned electron reduction chemical reaction equations, the electroless plating process is monitored using deposition thermodynamics, deposition kinetics, and nucleation kinetics methods, respectively, to obtain the target influencing factors affecting the electroless plating quality, as well as the target correspondence between the electroless plating quality and the aforementioned target influencing factors.

[0011] Based on the aforementioned electronic reduction chemical reaction equations, determine the weight index corresponding to the phosphate ion concentration in each target influencing factor.

[0012] The preset index function is obtained by constructing a function based on each of the target influencing factors, the weight index, and the target correspondence with each of the target influencing factors.

[0013] Optionally, based on each of the electron reduction chemical reaction equations, the electroless plating process is monitored using deposition thermodynamics, deposition kinetics, and nucleation kinetics methods to obtain the target influencing factors affecting the electroless plating quality, and the target correspondence between the electroless plating quality and each of the target influencing factors, specifically including:

[0014] Based on the electron reduction chemical reaction equations, the electrode potential in the electroless plating process is calculated using the deposition thermodynamics method to obtain the first influencing factors affecting the quality of electroless plating and the first correspondence between the quality of electroless plating and each of the first influencing factors.

[0015] Based on the electron reduction chemical reaction equations, the electrode reaction rate in the electroless plating process is calculated using the deposition kinetics method to obtain the second influencing factors affecting the electroless plating quality and the second correspondence between the electroless plating quality and the second influencing factors.

[0016] Based on the aforementioned electronic reduction chemical reaction equations, the nucleation rate in the electroless plating process is calculated using the nucleation kinetics method, thereby obtaining the third influencing factors affecting the electroless plating quality and the third correspondence between the electroless plating quality and the aforementioned third influencing factors.

[0017] Each of the first influencing factors, each of the second influencing factors, and each of the third influencing factors are screened to obtain each of the target influencing factors, and the correspondence between the electroless plating quality and each of the target influencing factors is determined as the target correspondence relationship.

[0018] Optionally, the electrode potential during the electroless plating process is calculated using deposition thermodynamics based on each of the electron reduction chemical reaction equations to obtain each first influencing factor affecting the electroless plating quality and a first correspondence between the electroless plating quality and each of the first influencing factors, specifically including:

[0019] Based on the aforementioned electronic reduction chemical reaction equations, the Nernst equation is used to construct the electrode potentials in the electroless plating process, resulting in electrode potential equations. Each electrode potential equation includes a first influencing factor, which includes temperature parameter, nickel ion concentration parameter, hypophosphite ion concentration parameter, phosphite ion concentration parameter, and hydrogen ion concentration parameter.

[0020] Construct the hydrolysis equilibrium equation for the electroless plating process;

[0021] Construct the complexation equilibrium equation for the electroless plating process;

[0022] Based on the electrode potential equations, hydrolysis equilibrium equations, and complexation equilibrium equations, a single-factor analysis method is used to adjust each of the first influencing factors in the electroless plating process, and the quality of the electroless plating process is monitored to obtain the first correspondence between the electroless plating quality and each of the first influencing factors.

[0023] Optionally, the electrode reaction rate in the electroless plating process is calculated using deposition kinetics based on each of the electron reduction chemical reaction equations to obtain each of the second influencing factors affecting the electroless plating quality and the second correspondence between the electroless plating quality and each of the second influencing factors, specifically including:

[0024] Based on the aforementioned electronic reduction chemical reaction equations, the Butler-Former equation is used to construct the reaction rates of each electrode in the electroless plating process, resulting in electrode reaction rate equations. Each electrode reaction rate equation includes a second influencing factor, which includes temperature parameters, nickel ion concentration parameters, hypophosphatemite concentration parameters, and hydrogen ion concentration parameters.

[0025] Construct the current density balance equations for the cathode and anodic reactions during the electroless plating process;

[0026] Based on the electrode reaction rate equations and the current density balance equations, a single-factor analysis method was used to adjust each of the second influencing factors in the electroless plating process, and the quality of the electroless plating process was monitored to obtain a second correspondence between the electroless plating quality and each of the second influencing factors.

[0027] Optionally, the nucleation rate in the electroless plating process is calculated using nucleation kinetics based on each of the electron reduction chemical reaction equations to obtain each third influencing factor affecting the electroless plating quality and a third correspondence between the electroless plating quality and each of the third influencing factors, specifically including:

[0028] The critical nucleation radius is obtained by calculating the free energy change function during nickel nucleation in the electroless plating process.

[0029] Based on the free energy change function and the critical nucleation radius, a function is constructed to obtain the nucleation work function;

[0030] Based on the nucleation work function and the initial nucleation rate function, a function is constructed to obtain the target nucleation rate function. The target nucleation rate function includes each third influencing factor, which includes the cathode overpotential parameter, temperature parameter, and complexing agent content parameter.

[0031] Based on the target nucleation rate function, a single-factor analysis method was used to adjust each of the third influencing factors in the electroless plating process, and the quality of the electroless plating process was monitored to obtain the third correspondence between the electroless plating quality and each of the third influencing factors.

[0032] Optionally, when the evaluation index is less than the preset target index, adjusting at least one of the solution parameters among the initial ratio, initial temperature, and initial pH of each of the sub-solutions to obtain the target nickel plating solution specifically includes:

[0033] If the evaluation index is less than the preset target index, at least one of the solution parameters of the initial nickel plating solution is adjusted according to the predetermined solution parameter priority to obtain the target nickel plating solution;

[0034] The order of adjustment of the predetermined solution parameters from high to low priority is as follows: decrease the initial pH, increase the initial ratio corresponding to the second index value, increase the initial ratio corresponding to the first index value, and increase the initial temperature.

[0035] To solve the above problems, this application provides a nickel plating solution parameter adjustment device, comprising:

[0036] Initial proportion calculation module: used to perform calculations based on the initial proportions of each sub-solution in the initial nickel plating solution to obtain a first index value and a second index value for adjusting the solution parameters of the initial nickel plating solution;

[0037] The evaluation index calculation module is used to calculate the evaluation index of the initial nickel plating solution based on the initial temperature, initial pH, first index value and second index value of the initial nickel plating solution using a preset index function.

[0038] Solution parameter adjustment module: used to adjust at least one of the solution parameters, namely the initial ratio, the initial temperature and the initial pH, of each of the sub-solutions when the evaluation index is less than the preset target index, so as to obtain the target nickel plating solution.

[0039] To address the aforementioned problems, this application provides a storage medium storing a computer program that, when executed by a processor, implements the steps of the nickel plating solution parameter adjustment method described above.

[0040] To address the aforementioned problems, this application provides an electronic device, comprising at least a memory and a processor. The memory stores a computer program, and the processor, when executing the computer program in the memory, implements the steps of the nickel plating solution parameter adjustment method described above.

[0041] The beneficial effects of this application are as follows: This application calculates and processes the initial ratio of each sub-solution in the initial nickel plating solution to obtain a first index value and a second index value for adjusting the solution parameters of the initial nickel plating solution; based on the initial temperature, initial pH, the first index value, and the second index value of the initial nickel plating solution, a preset index function is used to calculate and process the evaluation index of the initial nickel plating solution; this application evaluates the quality of the electroless plating process by introducing a preset index function, and considering multiple influencing factors in the electroless plating process, establishes a unified mechanism to characterize the impact of changes in different factors on the corrosion resistance of the coating. When the evaluation index is less than the preset target index, at least one of the solution parameters of the initial ratio, the initial temperature, and the initial pH of each sub-solution is adjusted to obtain the target nickel plating solution. By using a priority method to adjust the solution parameters, costs are saved while effectively improving the quality of electroless nickel plating and enhancing corrosion resistance.

[0042] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and in order to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description

[0043] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0044] Figure 1A schematic flowchart of a method for adjusting nickel plating solution parameters provided in an embodiment of this application is shown;

[0045] Figure 2 A flowchart illustrating a method for adjusting nickel plating solution parameters according to another embodiment of this application is shown;

[0046] Figure 3 A schematic diagram of the potential change in the oxidation-reduction reaction of electroless nickel plating according to an embodiment of this application is shown;

[0047] Figure 4 A potential difference trend diagram of the oxidation-reduction reaction of electroless nickel plating according to an embodiment of this application is shown;

[0048] Figure 5 A schematic diagram showing the reaction rate variation of the electroless nickel plating electrode according to an embodiment of this application is shown;

[0049] Figure 6 This diagram illustrates the corrosion resistance verification results of the coating in Implementation Example 1 of this application.

[0050] Figure 7 A schematic diagram showing the coating corrosion resistance verification results of Implementation Example 2 of this application is illustrated.

[0051] Figure 8 This diagram illustrates the corrosion resistance verification results of the coating in Implementation Example 3 of this application.

[0052] Figure 9 A schematic diagram of the surface morphology of the coating obtained by the plating solution with an evaluation index value of 0.823 in Implementation Example 5 of this application is shown.

[0053] Figure 10 A schematic diagram of the cross-sectional morphology of the coating obtained by the plating solution with an evaluation index value of 0.823 in Implementation Example 5 of this application is shown.

[0054] Figure 11 A schematic diagram of the surface morphology of the coating obtained by the plating solution with an evaluation index value of 1.034 is shown in Implementation Example 5 of this application.

[0055] Figure 12 A schematic diagram of the cross-sectional morphology of the coating obtained by the plating solution with an evaluation index value of 1.034 is shown in Implementation Example 5 of this application.

[0056] Figure 13 A structural block diagram of a nickel plating solution parameter adjustment device according to another embodiment of this application is shown. Detailed Implementation

[0057] Various embodiments and features of this application are described herein with reference to the accompanying drawings.

[0058] It should be understood that various modifications can be made to the embodiments described herein. Therefore, the above description should not be considered as limiting, but merely as an example of embodiments. Other modifications within the scope and spirit of this application will be apparent to those skilled in the art.

[0059] The accompanying drawings, which are included in and form part of this specification, illustrate embodiments of the present application and, together with the general description of the present application given above and the detailed description of the embodiments given below, serve to explain the principles of the present application.

[0060] These and other features of this application will become apparent from the following description of preferred forms of embodiments given as non-limiting examples, with reference to the accompanying drawings.

[0061] It should also be understood that although this application has been described with reference to some specific examples, those skilled in the art can certainly implement many other equivalent forms of this application.

[0062] The above and other aspects, features and advantages of this application will become more apparent when taken in conjunction with the accompanying drawings and in view of the following detailed description.

[0063] Specific embodiments of this application are described thereafter with reference to the accompanying drawings; however, it should be understood that the claimed embodiments are merely examples of this application, which can be implemented in various ways. Well-known and / or repeated functions and structures are not described in detail to avoid unnecessary or redundant details that could obscure the application. Therefore, the specific structural and functional details claimed herein are not intended to be limiting, but merely serve as the basis and representative basis for the claims to teach those skilled in the art to use this application in a variety of substantially any suitable detailed structures.

[0064] This specification may use the phrases “in one embodiment,” “in another embodiment,” “in yet another embodiment,” or “in other embodiments,” all of which may refer to one or more of the same or different embodiments according to this application.

[0065] This application provides a method for adjusting the parameters of a nickel plating solution, such as... Figure 1 As shown, it includes:

[0066] Step S101: Based on the initial ratio of each sub-solution in the initial nickel plating solution, perform calculations to obtain a first index value and a second index value for adjusting the solution parameters of the initial nickel plating solution;

[0067] In the specific implementation process of this step, the initial nickel plating solution is a solution obtained by mixing the various sub-solutions. In the application scenario of electroless plating of magnesium alloys, the initial nickel plating solution can be a solution obtained by mixing sub-solutions including nickel sulfate hexahydrate solution, sodium citrate dihydrate solution, sodium hypophosphite solution, and ammonium bifluoride solution. The first index value is the nickel ion concentration, and the second index value is the hypophosphite ion concentration. Specifically, the first index value can be obtained by calculation based on the initial ratio of nickel sulfate hexahydrate solution in the initial solution; the second index value can be obtained by calculation based on the initial ratio of sodium hypophosphite solution in the initial solution.

[0068] Step S102: Based on the initial temperature, initial pH, first index value, and second index value of the initial nickel plating solution, the evaluation index of the initial nickel plating solution is obtained by calculation using a preset index function.

[0069] In the specific implementation process of this step, the evaluation index of the initial nickel plating solution is obtained by using a preset index function based on the initial temperature, initial pH, first index value, and second index value of the initial nickel plating solution; the mathematical expression of the preset index function can be shown in the following formula (1):

[0070]

[0071] in, This refers to the nickel ion concentration. Where is the phosphate ion concentration, T is the temperature parameter, and PH is the acidity / alkalinity parameter. The initial temperature, initial acidity / alkalinity, the first index value, and the second index value of the initial nickel plating solution are substituted into formula (1) for calculation to obtain the evaluation index Z of the initial nickel plating solution.

[0072] Step S103: If the evaluation index is less than the preset target index, adjust at least one of the solution parameters, namely the initial ratio, the initial temperature and the initial pH, for each of the sub-solutions to obtain the target nickel plating solution.

[0073] In this step, when the evaluation index is less than the preset target index, at least one of the solution parameters of the initial nickel plating solution is adjusted according to the predetermined solution parameter priority to obtain the target nickel plating solution. The predetermined solution parameter priority, adjusted in descending order, is: decreasing the initial pH, increasing the initial ratio corresponding to the second index value, increasing the initial ratio corresponding to the first index value, and increasing the initial temperature. Specifically, each solution parameter is adjusted in descending order of priority, and the evaluation index of the adjusted current nickel plating solution is calculated after each adjustment until the evaluation index of the current nickel plating solution is greater than or equal to the preset target index, at which point the current nickel plating solution is determined as the target nickel plating solution.

[0074] This application calculates and processes the initial proportions of each sub-solution in the initial nickel plating solution to obtain a first index value and a second index value for adjusting the solution parameters of the initial nickel plating solution. Based on the initial temperature, initial pH, the first index value, and the second index value of the initial nickel plating solution, a preset index function is used to calculate and process the evaluation index of the initial nickel plating solution. This application introduces a preset index function to evaluate the quality during the electroless plating process. Considering multiple influencing factors in the electroless plating process, a unified mechanism is established to characterize the impact of changes in different factors on the corrosion resistance of the coating. When the evaluation index is less than the preset target index, at least one of the solution parameters corresponding to each sub-solution—the initial proportion, the initial temperature, and the initial pH—is adjusted to obtain the target nickel plating solution. By using a priority method to adjust the solution parameters, costs are saved while effectively improving the quality of electroless nickel plating and enhancing corrosion resistance.

[0075] Another embodiment of this application provides a different method for adjusting the parameters of a nickel plating solution, such as... Figure 2 As shown, it includes:

[0076] Step S201: Based on the initial ratio of each sub-solution in the initial nickel plating solution, perform calculations to obtain a first index value and a second index value for adjusting the solution parameters of the initial nickel plating solution;

[0077] In the specific implementation process of this step, the initial nickel plating solution is a solution obtained by mixing the various sub-solutions. In the application scenario of electroless plating of magnesium alloys, the initial nickel plating solution can be a solution obtained by mixing sub-solutions including nickel sulfate hexahydrate solution, sodium citrate dihydrate solution, sodium hypophosphite solution, and ammonium bifluoride solution. The first index value is the nickel ion concentration, and the second index value is the hypophosphite ion concentration. Specifically, the first index value can be obtained by calculation based on the initial ratio of nickel sulfate hexahydrate solution in the initial solution; the second index value can be obtained by calculation based on the initial ratio of sodium hypophosphite solution in the initial solution.

[0078] Step S202: Construct the chemical reaction equations for the reduction of electrons in the process of electroless plating of magnesium alloy using historical nickel plating solution;

[0079] In this step, hypophosphite ions react with water in the historical nickel plating solution to generate electrons, which act as the actual reducing agent. Nickel ions gain electrons and are reduced, and a small amount of hypophosphite ions are also reduced to phosphorus to form a Ni-P solid solution, accompanied by the release of hydrogen gas. The chemical reaction equations for the reduction of each point are shown in the following formulas (1)-(4):

[0080]

[0081] Ni 2+ +2e - → Ni (2);

[0082]

[0083] 2H + +2e - →H2(4);

[0084] in, It is a hypophosphatemoid ion; It is a phosphate ion; H + Hydrogen ions; H2O is water; e - For electrons; Ni 2+ Ni is nickel ions; Ni is solid nickel; P is solid phosphorus; H2 is hydrogen gas.

[0085] Step S203: Based on the electron reduction chemical reaction equations, the electrode potential in the electroless plating process is calculated using the deposition thermodynamics method to obtain the first influencing factors affecting the electroless plating quality and the first correspondence between the electroless plating quality and the first influencing factors.

[0086] In the specific implementation process of this step, based on the electronic reduction chemical reaction equations, the Nernst equation is used to construct the electrode potentials in the electroless plating process, and the electrode potential equations are obtained. Each electrode potential equation includes a first influencing factor, which includes temperature parameter, nickel ion concentration parameter, hypophosphite ion concentration parameter, phosphite ion concentration parameter, and hydrogen ion concentration parameter. Specifically, the mathematical formulas that express the relationship between the electrode potentials in the electroless plating process and the ion concentrations, temperature, and pH based on the electronic chemical reaction equations using the Nernst equation are as follows: (5)-(8)

[0087]

[0088]

[0089]

[0090]

[0091] Where R is the gas constant, T is the temperature, n is the number of electrons transferred, F is the Faraday constant, and [M+] and [N-] represent the concentrations of each ion. E is the equilibrium potential. θ This is the standard potential.

[0092] The hydrolysis equilibrium equation for the electroless plating process is constructed; the mathematical expression of the hydrolysis equilibrium equation can be shown in the following formula (9):

[0093]

[0094] Construct the complexation equilibrium equation in the electroless plating process; the mathematical expression of the complexation equilibrium equation can be shown by the following formulas (10)-(11):

[0095]

[0096]

[0097] Among them, K w K is the ion product constant of water, K1 and K2 are the stability constants of nickel complexes, and K a3 The third-order ionization constant of citrate is... [OH - [This represents the concentration of citrate monohydric ions.] The concentration of citrate ions, [NiC6H5O7] -[NiC6H6O7] represents the concentration of the first nickel citrate complex ion, and [NiC6H6O7] represents the concentration of the second nickel citrate complex. Based on the electrode potential equations, the hydrolysis equilibrium equations, and the complexation equilibrium equations, a single-factor analysis method was used to adjust each of the first influencing factors in the electroless plating process, and the quality of the electroless plating process was monitored to obtain the first correspondence between the electroless plating quality and each of the first influencing factors. Specifically, for example, the concentration of phosphate ions is... The concentration of hypophosphate ions is Substituting the concentrations of each ion into formulas (8) to (11), we can obtain the schematic diagram of the potential change in the oxidation-reduction reaction of electroless nickel plating as shown below. Figure 3 As shown, different reactions exhibit different trends depending on the factors. Single-factor analysis reveals that the reduction potential of nickel increases with increasing nickel ion content. Conversely, increasing hypophosphite ion concentration decreases the oxidation potential while increasing the reduction potential. Thermodynamically, the potential difference between the cathode and anode is the driving force for the reaction; a larger potential difference indicates a more vigorous reaction. Therefore, combining electron potential chemical reaction equation (1) with electron potential chemical reaction equations (2), (3), and (4) yields three different redox reactions. The potential difference trend diagrams are attached. Figure 4 As shown, with increasing pH, the potential difference between nickel reduction and hydrogen reduction increases, while the potential difference for phosphorus reduction decreases. At low nickel ion concentrations, the potential difference for hydrogen reduction is higher than that for nickel reduction. During electroless nickel plating, the large amount of hydrogen released leads to tensile stress in the coating, causing peeling and cracking. The phosphorus content also significantly affects the corrosion resistance of the coating; phosphorus solution makes the coating amorphous, reducing the presence of dislocations and defects, and also reducing intergranular corrosion. Therefore, from a thermodynamic perspective, the direction of solution parameter adjustment should be based on reducing the potential difference for hydrogen reduction and increasing the potential difference for phosphorus reduction. The first corresponding relationship for the first influencing factor, nickel ion concentration, is to increase the nickel ion concentration; the first corresponding relationship for the first influencing factor, hypophosphite ion concentration, is to increase the hypophosphite ion concentration; and the first corresponding relationship for the first influencing factor, pH, is to decrease the pH.

[0098] Step S204: Based on the electron reduction chemical reaction equations, the electrode reaction rate in the electroless plating process is calculated using the deposition kinetics method to obtain the second influencing factors affecting the electroless plating quality and the second correspondence between the electroless plating quality and the second influencing factors.

[0099] In the specific implementation process of this step, based on the electronic reduction chemical reaction equations, the Butler-Former equation is used to construct the reaction rates of each electrode in the electroless plating process, and the reaction rate equations of each electrode are obtained. Each reaction rate equation includes a second influencing factor, which includes temperature parameter, nickel ion concentration parameter, hypophosphatemoid ion concentration parameter, and hydrogen ion concentration parameter. The mathematical expressions of each reaction rate equation are shown in the following formulas (12)-(15):

[0100]

[0101]

[0102]

[0103]

[0104] Where α is the charge transfer coefficient, n is the number of electrons transferred, F is the Faraday constant, R is the gas constant, and T is the temperature. This refers to the equilibrium current density of phosphite or hypophosphite. This represents the equilibrium current density of nickel ions; This refers to the equilibrium current density of hypophosphatemions or the equilibrium current density of phosphorus. I is the equilibrium current density of hydrogen ions; c 0 E represents the exchange current density. e Let E be the standard potential and E be the equilibrium potential. The current density balance equation for the cathode and anodic reactions during the electroless plating process is constructed; the mathematical expression of the current density balance equation can be expressed as follows (16):

[0105]

[0106] Based on the electrode reaction rate equations and the current density balance equations, a single-factor analysis method was used to adjust each of the second influencing factors in the electroless plating process, and the quality of the electroless plating process was monitored to obtain a second correspondence between the electroless plating quality and each of the second influencing factors. For example... Figure 5The diagram shows the changes in the electrode reaction rates during electroless nickel plating. The electrode reaction rates for nickel reduction and hydrogen reduction increase with increasing pH, while the reaction rate for phosphorus reduction decreases with increasing pH. At excessively low pH, the reaction rate for hydrogen reduction is higher than that for nickel reduction. From the perspective of coating performance, the direction for adjusting the solution parameters of the nickel plating solution is to increase the reaction rates for nickel and phosphorus reduction and decrease the reaction rate for hydrogen reduction. The second corresponding relationship for the nickel ion concentration parameter (the second influencing factor) is to increase the nickel ion concentration; the second corresponding relationship for the hypophosphite ion concentration (the second influencing factor) is to increase the hypophosphite ion concentration; and the second corresponding relationship for pH (the second influencing factor) is to decrease the pH.

[0107] Step S205: Based on the electron reduction chemical reaction equations, the nucleation rate in the electroless plating process is calculated using the nucleation kinetics method to obtain the third influencing factors affecting the electroless plating quality and the third correspondence between the electroless plating quality and the third influencing factors.

[0108] In this step, the critical nucleation radius is obtained by calculating the free energy change function during nickel nucleation in the electroless plating process. The mathematical expression of the free energy change function can be expressed by the following formula (17).

[0109]

[0110] Specifically, by performing a first derivative operation on the radius r in the free energy change function, the critical nucleation radius r during nickel nucleation in the electroless plating process can be calculated. The mathematical expression for the critical nucleation radius r can be shown in the following formula (18):

[0111]

[0112] Where ρ is the density of the deposited metal, n is the valence of the metal ion, F is the Faraday constant, η is the cathode overpotential, Q is the atomic weight of the metal, and δ is the interfacial tension during nucleation. Based on the free energy change function and the critical nucleation radius, a function is constructed to obtain the nucleation work function; the mathematical expression of the nucleation work function can be expressed by the following formula (19):

[0113]

[0114] Based on the nucleation work function and the initial nucleation rate function, a target nucleation rate function is obtained. The target nucleation rate function includes various third influencing factors, including cathode overpotential parameters, temperature parameters, and complexing agent content parameters. The mathematical expression of the initial nucleation rate function can be expressed by the following formula (20):

[0115]

[0116] The mathematical formula for calculating the target nucleation rate function can be shown in the following formula (21):

[0117]

[0118] Where A is the pre-exponential factor, k is the Boltzmann constant, and T is the temperature. Based on the target nucleation rate function, a single-factor analysis method was used to adjust each of the third influencing factors in the electroless plating process, and the quality of the electroless plating process was monitored to obtain the third correspondence between the electroless plating quality and each of the third influencing factors. It can be seen that the critical nucleation radius decreases with the increase of the cathode overpotential, while the nucleation rate increases with the increase of the cathode overpotential. The grain size is directly related to the density of the coating. When the nucleation rate is high, the growth of the grains is restricted from both sides. When the grains collide, the growth stops. Therefore, the coating has high density and good corrosion resistance. From the perspective of nucleation kinetics, increasing the cathode overpotential is an effective way to improve the corrosion resistance of the coating. Thus, the third correspondence between the electroless plating quality and each of the third influencing factors is obtained. The second correspondence for the hypophosphite ion concentration parameter among the third influencing factors is the hypophosphite ion concentration.

[0119] Step S206: Screen each of the first influencing factors, each of the second influencing factors, and each of the third influencing factors to obtain each of the target influencing factors, and determine the correspondence between the electroless plating quality and each of the target influencing factors as the target correspondence relationship;

[0120] In this step, the first, second, and third influencing factors are screened to obtain the target influencing factors. The correspondence between the electroless plating quality and the target influencing factors is determined as the target correspondence. The target influencing factors are nickel ion concentration parameter, hypophosphite ion concentration parameter, temperature parameter, and pH parameter. The target correspondence for the nickel ion concentration parameter is to increase the nickel ion concentration; the target correspondence for the hypophosphite ion concentration parameter is to increase the hypophosphite ion concentration parameter; the target correspondence for the temperature parameter is to increase the temperature parameter; and the target correspondence for the pH parameter is to decrease the pH parameter.

[0121] Step S207: Determine the weight index corresponding to the phosphate ion concentration in each target influencing factor based on the aforementioned electronic reduction chemical reaction equations;

[0122] In the specific implementation of this step, when the reaction probability of each of the electron reduction chemical reaction equations is the same, the coating quality is better when the ratio of nickel ion concentration to hypophosphite ion concentration to phosphite ion concentration during the deposition process in the chemical plating process is a first predetermined index value. The first predetermined index value can be 0.3, and the first predetermined index value is determined as the weight index corresponding to the phosphite ion concentration.

[0123] Step S208: Based on each of the target influencing factors, the weight index, and the target correspondence relationship with each of the target influencing factors, construct a function to obtain the preset index function;

[0124] In the specific implementation of this step, the mathematical expression of the preset index function can be represented by the following formula (22):

[0125]

[0126] The numerator of the preset index function can be regarded as the deposition of the coating, while the denominator can be regarded as the hydrogen evolution of the coating. The ratio of the two is the deposition quality of the coating.

[0127] Step S209: Based on the initial temperature, initial pH, first index value, and second index value of the initial nickel plating solution, the evaluation index of the initial nickel plating solution is obtained by calculation using a preset index function.

[0128] In the specific implementation process of this step, the evaluation index Z of the initial nickel plating solution is obtained by using the preset index function based on the initial temperature, initial pH, first index value and second index value of the initial nickel plating solution.

[0129] Step S210: If the evaluation index is less than the preset target index, adjust at least one of the solution parameters, namely the initial ratio, the initial temperature and the initial pH, for each of the sub-solutions to obtain the target nickel plating solution.

[0130] In this step, when the evaluation index is less than the preset target index, at least one of the solution parameters of the initial nickel plating solution is adjusted according to the predetermined solution parameter priority to obtain the target nickel plating solution. The preset target index has a value range of greater than or equal to 1 and less than or equal to 1.3. The predetermined solution parameter priority, adjusted in descending order, is as follows: decrease the initial pH, increase the initial ratio corresponding to the second index value, increase the initial ratio corresponding to the first index value, and increase the initial temperature. Specifically, when the evaluation index is less than the preset target index, the initial pH is first decreased, and the predetermined index function is used again for calculation to obtain an intermediate evaluation index. This intermediate evaluation index is then compared with the preset target index. If the intermediate evaluation index is greater than the predetermined target index, the current nickel plating solution after adjusting the initial pH is determined as the target nickel plating solution.If the intermediate evaluation index is less than the predetermined target index, the pH of the current nickel plating solution is further reduced, and the predetermined index function is used again for calculation to obtain an updated intermediate evaluation index. If the difference between the intermediate evaluation index calculated by changing the pH of the current nickel plating solution twice is less than or equal to the first preset threshold and the current intermediate evaluation index is less than the preset target index, the initial ratio corresponding to the second index value is added to the current nickel plating solution after adjusting the pH. That is, the initial ratio of sodium citrate dihydrate solution corresponding to the hypophosphatemia concentration is added. Specifically, the sodium citrate dihydrate solution is gradually added at predetermined content intervals, and the current evaluation index value is calculated after each addition of sodium citrate dihydrate solution. If the current evaluation index value is greater than or equal to the preset target index, the current nickel plating solution with added sodium citrate dihydrate solution is determined as the target nickel plating solution. If the difference between the intermediate evaluation index calculated by changing the content of sodium citrate dihydrate solution in the current nickel plating solution twice is less than or equal to the first preset threshold and the current intermediate evaluation index is less than the preset target index, the current evaluation index is determined as the first preset threshold and the current intermediate evaluation index is less than the preset target index. When the standard deviation is less than or equal to the second preset threshold and the current evaluation index is less than the preset target index, the initial ratio corresponding to the first index value is added to the current nickel plating solution with added sodium citrate dihydrate solution. Specifically, the nickel sulfate hexahydrate solution is gradually added at predetermined content intervals, and the current evaluation index value is calculated after each addition of nickel sulfate hexahydrate solution. If the current evaluation index value is greater than or equal to the preset target index, the current nickel plating solution with added nickel sulfate hexahydrate solution is determined as the target nickel plating solution. If the difference in the calculated evaluation index is less than or equal to the third preset threshold and the current evaluation index is less than the preset target index after two changes in the content of nickel sulfate hexahydrate solution in the current nickel plating solution, the temperature of the current nickel plating solution with added nickel sulfate hexahydrate solution is gradually increased to calculate the evaluation index of the current nickel plating solution with increased temperature, until the evaluation index of the current nickel plating solution is greater than or equal to the preset target index, at which point the current nickel plating solution is determined as the target nickel plating solution.

[0131] This application, combining the electron reduction chemical reaction mechanism in the electroless plating process, employs deposition thermodynamics, deposition kinetics, and nucleation kinetics to determine the various influencing factors affecting the quality of electroless plating and their corresponding influence directions. It obtains target influencing factors and their corresponding target relationships, and constructs index functions based on these target influencing factors and their corresponding target relationships. These index functions are then used to evaluate the nickel plating solution, encompassing all factors affecting the electroless plating process and establishing a unified mechanism to characterize the impact of different factor changes on the corrosion resistance of the coating. Using the method of this application can improve the corrosion resistance of electroless plating.

[0132] To better explain the method of this application, the following explanation is provided in conjunction with specific application scenarios:

[0133] Implementation Case 1: Single-Factor Solution Optimization for Magnesium Alloy Initial Nickel Plating Solution: 20 g / L NiSO4·6H2O, 20 g / L Na3C6H5O7·2H2O, 20 g / L NaH2PO2·H2O, 10 g / L NH4HF2, pH = 8, T = 60℃;

[0134] Substituting, we get: Nickel plating solution after adjusting solution parameters: 20 g / L NiSO4·6H2O, 20 g / L Na3C6H5O7·2H2O, 30 g / L NaH2PO2·H2O, 10 g / L NH4HF2, pH=8, T=60℃;

[0135] Substituting, we get:

[0136] The results of the coating corrosion resistance verification are as follows: Figure 6 .

[0137] Implementation Case 2: Solution Optimization for Multi-Factor Variations in Magnesium Alloys

[0138] Basic solution: 20 g / L NiSO4·6H2O, 20 g / L Na3C6H5O7·2H2O, 20 g / L NaH2PO2·H2O, 10 g / L NH4HF2, pH=8, T=60℃;

[0139] Substituting, we get: The nickel plating solution after adjusting the solution parameters is: 20 g / L NiSO4·6H2O, 20 g / L Na3C6H5O7·2H2O, 30 g / L NaH2PO2·H2O, 10 g / L NH4HF2, pH=5, T=60℃;

[0140] Substituting, we get: The results of the coating corrosion resistance verification are as follows: Figure 7 As shown.

[0141] Implementation Case 3: Comparison of the corrosion resistance of coatings obtained from plating solutions:

[0142] Initial nickel plating solution: 20 g / L NiSO4·6H2O, 20 g / L Na3C6H5O7·2H2O, 30 g / L NaH2PO2·H2O, 10 g / L NH4HF2, pH=8, T=60℃;

[0143] Substituting, we get: Nickel plating solution 2 after adjusting solution parameters: 20 g / L NiSO4·6H2O, 20 g / L Na3C6H5O7·2H2O, 20 g / L NaH2PO2·H2O; 10 g / L NH4HF2, pH=6, T=60℃;

[0144] Substituting, we get: Coating corrosion resistance verification, such as Figure 8 As shown.

[0145] Implementation Case 4: Optimizing the plating solution based on the target ratio:

[0146] Initial nickel plating solution: 20 g / L NiSO4·6H2O, 20 g / L Na3C6H5O7·2H2O, 20 g / L NaH2PO2·H2O, 10 g / L NH4HF2, pH=8, T=60℃;

[0147] Substituting, we get: To obtain a nickel plating solution with an evaluation index Z of 0.8, assuming other factors remain constant, and the changed concentration of [NiSO4·6H2O] is X, then:

[0148]

[0149] We can obtain X = 0.0946, that is, [NiSO4·6H2O] = 24.86 g / L.

[0150] Implementation Case 5: Coating Grain Refinement

[0151] Initial nickel plating solution: 20 g / L NiSO4·6H2O, 20 g / L Na3C6H5O7·2H2O, 30 g / L NaH2PO2·H2O, 10 g / L NH4HF2, pH=8, T=60℃;

[0152] Substituting, we get:

[0153] The surface morphology of the coating obtained by the plating solution with an evaluation index value of 0.823 is as follows: Figure 9 As shown, the cross-section of the coating obtained by electroless plating using a nickel plating solution with an evaluation index value of 0.823 is as follows. Figure 10 As shown.

[0154] Nickel plating solution after parameter adjustment: 20 g / L NiSO4·6H2O, 20 g / L Na3C6H5O7·2H2O, 30 g / L NaH2PO2·H2O, 10 g / L NH4HF2, pH=5, T=60℃;

[0155] Substituting the preset index function yields: The surface morphology of the coating obtained by the plating solution with an evaluation index value of 1.034 is as follows: Figure 11 As shown, the cross-section of the coating obtained by electroless plating using a nickel plating solution with an evaluation index value of 1.034 is as follows. Figure 12 As shown, the nickel plating solution with an evaluation index value of 1.034 has finer and denser plating particles than the nickel plating solution with an evaluation index value of 0.823.

[0156] Another embodiment of this application provides a device for adjusting the parameters of a nickel plating solution, such as... Figure 13 As shown, it includes:

[0157] Initial proportion calculation module 1: used to perform calculations based on the initial proportions of each sub-solution in the initial nickel plating solution to obtain a first index value and a second index value for adjusting the solution parameters of the initial nickel plating solution;

[0158] Evaluation index calculation module 2 is used to calculate the evaluation index of the initial nickel plating solution based on the initial temperature, initial pH, first index value and second index value of the initial nickel plating solution using a preset index function.

[0159] Solution parameter adjustment module 3: When the evaluation index is less than the preset target index, it is used to adjust at least one of the solution parameters of the initial ratio, the initial temperature and the initial pH of each of the sub-solutions to obtain the target nickel plating solution.

[0160] In the specific implementation process, the nickel plating solution parameter adjustment device further includes a preset index function construction module. This module is specifically used for: constructing various electron reduction chemical reaction equations during the electroless plating of magnesium alloys using historical nickel plating solutions; monitoring the electroless plating process using deposition thermodynamics, deposition kinetics, and nucleation kinetics methods based on these electron reduction chemical reaction equations to obtain the target influencing factors affecting the electroless plating quality, and the target correspondence between the electroless plating quality and these target influencing factors; determining the weight index corresponding to the phosphate ion concentration in each target influencing factor based on these electron reduction chemical reaction equations; and constructing a function based on these target influencing factors, the weight index, and the target correspondence with each target influencing factor to obtain the preset index function.

[0161] In the specific implementation process, the preset index function construction module is further used to: calculate the electrode potential in the electroless plating process using deposition thermodynamics based on each of the electron reduction chemical reaction equations, to obtain each first influencing factor affecting the electroless plating quality and a first correspondence between the electroless plating quality and each of the first influencing factors; calculate the electrode reaction rate in the electroless plating process using deposition kinetics based on each of the electron reduction chemical reaction equations, to obtain each second influencing factor affecting the electroless plating quality and a second correspondence between the electroless plating quality and each of the second influencing factors; calculate the nucleation rate in the electroless plating process using nucleation kinetics based on each of the electron reduction chemical reaction equations, to obtain each third influencing factor affecting the electroless plating quality and a third correspondence between the electroless plating quality and each of the third influencing factors; screen each of the first influencing factors, each of the second influencing factors, and each of the third influencing factors to obtain each of the target influencing factors, and determine the correspondence between the electroless plating quality and each of the target influencing factors as the target correspondence.

[0162] In the specific implementation process, the preset index function construction module is also used to: construct each electrode potential in the electroless plating process based on each of the electron reduction chemical reaction equations using the Nernst equation, to obtain each electrode potential equation, each electrode potential equation including each first influencing factor, each first influencing factor including temperature parameter, nickel ion concentration parameter, hypophosphite ion concentration parameter, phosphite ion concentration parameter, and hydrogen ion concentration parameter; construct the hydrolysis equilibrium equation in the electroless plating process; construct the complexation equilibrium equation in the electroless plating process; and adjust each of the first influencing factors in the electroless plating process using a single-factor analysis method based on each of the electrode potential equations, the hydrolysis equilibrium equation, and the complexation equilibrium equation, and monitor the quality of the electroless plating process to obtain a first correspondence between the electroless plating quality and each of the first influencing factors.

[0163] In the specific implementation process, the preset index function construction module is also used to: construct the reaction rates of each electrode in the electroless plating process based on the electron reduction chemical reaction equations, using the Butler-Former equation, to obtain the reaction rate equations of each electrode, each reaction rate equation including each second influencing factor, each second influencing factor including temperature parameter, nickel ion concentration parameter, hypophosphite ion concentration parameter, and hydrogen ion concentration parameter; construct the current density balance equation of the cathode reaction and the anode reaction in the electroless plating process; adjust each second influencing factor in the electroless plating process using a single-factor analysis method based on the reaction rate equations of each electrode and the current density balance equation, and monitor the quality of the electroless plating process to obtain the second correspondence between the electroless plating quality and each second influencing factor.

[0164] In the specific implementation process, the preset index function construction module is also used to: calculate and process the free energy change function during nickel nucleation in the electroless plating process to obtain the critical nucleation radius; construct a function based on the free energy change function and the critical nucleation radius to obtain the nucleation work function; construct a function based on the nucleation work function and the initial nucleation rate function to obtain the target nucleation rate function, wherein the target nucleation rate function includes each third influencing factor, and each third influencing factor includes the cathode overpotential parameter, temperature parameter, and complexing agent content parameter; adjust each of the third influencing factors in the electroless plating process using a single-factor analysis method based on the target nucleation rate function, and monitor the quality of the electroless plating process to obtain the third correspondence between the electroless plating quality and each of the third influencing factors.

[0165] In the specific implementation process, the solution parameter adjustment module 3 is specifically used to: when the evaluation index is less than the preset target index, adjust at least one of the solution parameters of the initial nickel plating solution according to the predetermined solution parameter priority to obtain the target nickel plating solution; wherein, the predetermined solution parameter priority is adjusted in the following order from high to low: decrease the initial pH, increase the initial ratio corresponding to the second index value, increase the initial ratio corresponding to the first index value, and increase the initial temperature.

[0166] This application calculates and processes the initial proportions of each sub-solution in the initial nickel plating solution to obtain a first index value and a second index value for adjusting the solution parameters of the initial nickel plating solution. Based on the initial temperature, initial pH, the first index value, and the second index value of the initial nickel plating solution, a preset index function is used to calculate and process the evaluation index of the initial nickel plating solution. This application introduces a preset index function to evaluate the quality during the electroless plating process. Considering multiple influencing factors in the electroless plating process, a unified mechanism is established to characterize the impact of changes in different factors on the corrosion resistance of the coating. When the evaluation index is less than the preset target index, at least one of the solution parameters corresponding to each sub-solution—the initial proportion, the initial temperature, and the initial pH—is adjusted to obtain the target nickel plating solution. By using a priority method to adjust the solution parameters, costs are saved while effectively improving the quality of electroless nickel plating and enhancing corrosion resistance.

[0167] Another embodiment of this application provides a storage medium storing a computer program, which, when executed by a processor, implements the following method steps:

[0168] Step 1: Based on the initial ratio of each sub-solution in the initial nickel plating solution, perform calculations to obtain the first index value and the second index value for adjusting the solution parameters of the initial nickel plating solution;

[0169] Step 2: Based on the initial temperature, initial pH, first index value, and second index value of the initial nickel plating solution, the evaluation index of the initial nickel plating solution is obtained by using a preset index function.

[0170] Step 3: If the evaluation index is less than the preset target index, adjust at least one of the solution parameters, namely the initial ratio, the initial temperature and the initial pH, for each of the sub-solutions to obtain the target nickel plating solution.

[0171] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0172] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is used as an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0173] The specific implementation process of the above method steps can be found in the embodiments of the above arbitrary nickel plating solution parameter adjustment method, which will not be repeated here.

[0174] This application calculates and processes the initial proportions of each sub-solution in the initial nickel plating solution to obtain a first index value and a second index value for adjusting the solution parameters of the initial nickel plating solution. Based on the initial temperature, initial pH, the first index value, and the second index value of the initial nickel plating solution, a preset index function is used to calculate and process the evaluation index of the initial nickel plating solution. This application introduces a preset index function to evaluate the quality during the electroless plating process. Considering multiple influencing factors in the electroless plating process, a unified mechanism is established to characterize the impact of changes in different factors on the corrosion resistance of the coating. When the evaluation index is less than the preset target index, at least one of the solution parameters corresponding to each sub-solution—the initial proportion, the initial temperature, and the initial pH—is adjusted to obtain the target nickel plating solution. By using a priority method to adjust the solution parameters, costs are saved while effectively improving the quality of electroless nickel plating and enhancing corrosion resistance.

[0175] Another embodiment of this application provides an electronic device, which can be a server. The electronic device includes a processor, a memory, a network interface, and a database connected via a system bus. The processor provides computing and control capabilities. The memory includes non-volatile and / or volatile storage media and internal memory. The non-volatile storage media stores an operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The network interface is used to communicate with external clients via a network connection. When the program is executed by the processor, it implements the functions or steps of a nickel plating solution parameter adjustment method on the server side.

[0176] In one embodiment, an electronic device is provided, which can be a client. The electronic device includes a processor, memory, a network interface, a display screen, and an input device connected via a system bus. The processor provides computing and control capabilities. The memory includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores an operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage medium. The network interface is used to communicate with an external server via a network connection. When the program is executed by the processor, it implements the functions or steps of a nickel plating solution parameter adjustment method on the client side.

[0177] Another embodiment of this application provides an electronic device, including at least a memory and a processor. The memory stores a computer program, and the processor, when executing the computer program in the memory, performs the following method steps:

[0178] Step 1: Based on the initial ratio of each sub-solution in the initial nickel plating solution, perform calculations to obtain the first index value and the second index value for adjusting the solution parameters of the initial nickel plating solution;

[0179] Step 2: Based on the initial temperature, initial pH, first index value, and second index value of the initial nickel plating solution, the evaluation index of the initial nickel plating solution is obtained by using a preset index function.

[0180] Step 3: If the evaluation index is less than the preset target index, adjust at least one of the solution parameters, namely the initial ratio, the initial temperature and the initial pH, for each of the sub-solutions to obtain the target nickel plating solution.

[0181] The specific implementation process of the above method steps can be found in the embodiments of the above arbitrary nickel plating solution parameter adjustment method, which will not be repeated here.

[0182] The above embodiments are merely exemplary embodiments of this application and are not intended to limit this application. The scope of protection of this application is defined by the claims. Those skilled in the art can make various modifications or equivalent substitutions to this application within its substance and scope of protection, and such modifications or equivalent substitutions should also be considered to fall within the scope of protection of this application.

Claims

1. A method for adjusting parameters of a nickel plating solution, characterized in that, include: The initial ratio of each sub-solution in the initial nickel plating solution is used to calculate and process the solution parameters for adjusting the initial nickel plating solution, and the first index value and the second index value are obtained. The evaluation index of the initial nickel plating solution is obtained by calculating based on the initial temperature, initial pH, first index value, and second index value of the initial nickel plating solution using a preset index function. If the evaluation index is less than the preset target index, at least one of the solution parameters, namely the initial ratio, the initial temperature and the initial pH, corresponding to each of the sub-solutions, is adjusted to obtain the target nickel plating solution; Before performing calculations using a preset index function based on the initial temperature, initial pH, the first index value, and the second index value of the initial nickel plating solution, the method further includes: constructing the preset index function, specifically including: Construct the chemical reaction equations for the reduction of electrons in the process of electroless plating of magnesium alloy using historical nickel plating solutions; Based on the aforementioned electron reduction chemical reaction equations, the electroless plating process is monitored using deposition thermodynamics, deposition kinetics, and nucleation kinetics methods, respectively, to obtain the target influencing factors affecting the electroless plating quality, as well as the target correspondence between the electroless plating quality and the aforementioned target influencing factors. Based on the aforementioned electronic reduction chemical reaction equations, determine the weight index corresponding to the phosphate ion concentration in each target influencing factor. Based on the target influencing factors, the weight indicators, and the target correspondence with each target influencing factor, a function is constructed to obtain the preset indicator function; The mathematical expression of the preset index function is: in, This refers to the nickel ion concentration. The concentration of phosphate ions is T, and T is the temperature parameter. PH This refers to the pH parameter. When the evaluation index is less than the preset target index, adjusting at least one of the solution parameters among the initial ratio, initial temperature, and initial pH of each sub-solution to obtain the target nickel plating solution specifically includes: If the evaluation index is less than the preset target index, at least one of the solution parameters of the initial nickel plating solution is adjusted according to the predetermined solution parameter priority to obtain the target nickel plating solution; The order of adjustment of the predetermined solution parameters from high to low priority is as follows: decrease the initial pH, increase the initial ratio corresponding to the second index value, increase the initial ratio corresponding to the first index value, and increase the initial temperature.

2. The method as described in claim 1, characterized in that, Based on the aforementioned electron reduction chemical reaction equations, the electroless plating process is monitored using deposition thermodynamics, deposition kinetics, and nucleation kinetics methods to obtain the target influencing factors affecting the electroless plating quality, and the target correspondence between the electroless plating quality and each of the aforementioned target influencing factors, specifically including: Based on the electron reduction chemical reaction equations, the electrode potential in the electroless plating process is calculated using the deposition thermodynamics method to obtain the first influencing factors affecting the quality of electroless plating and the first correspondence between the quality of electroless plating and each of the first influencing factors. Based on the electron reduction chemical reaction equations, the electrode reaction rate in the electroless plating process is calculated using the deposition kinetics method to obtain the second influencing factors affecting the electroless plating quality and the second correspondence between the electroless plating quality and the second influencing factors. Based on the aforementioned electronic reduction chemical reaction equations, the nucleation rate in the electroless plating process is calculated using the nucleation kinetics method, thereby obtaining the third influencing factors affecting the electroless plating quality and the third correspondence between the electroless plating quality and the aforementioned third influencing factors. Each of the first influencing factors, each of the second influencing factors, and each of the third influencing factors are screened to obtain each of the target influencing factors, and the correspondence between the electroless plating quality and each of the target influencing factors is determined as the target correspondence relationship.

3. The method as described in claim 2, characterized in that, The electrode potential during the electroless plating process is calculated using deposition thermodynamics based on the electron reduction chemical reaction equations, resulting in first influencing factors affecting the electroless plating quality and a first correspondence between the electroless plating quality and each of the first influencing factors, specifically including: Based on the aforementioned electronic reduction chemical reaction equations, the Nernst equation is used to construct the electrode potentials in the electroless plating process, resulting in electrode potential equations. Each electrode potential equation includes a first influencing factor, which includes temperature parameter, nickel ion concentration parameter, hypophosphite ion concentration parameter, phosphite ion concentration parameter, and hydrogen ion concentration parameter. Construct the hydrolysis equilibrium equation for the electroless plating process; Construct the complexation equilibrium equation for the electroless plating process; Based on the electrode potential equations, hydrolysis equilibrium equations, and complexation equilibrium equations, a single-factor analysis method is used to adjust each of the first influencing factors in the electroless plating process, and the quality of the electroless plating process is monitored to obtain the first correspondence between the electroless plating quality and each of the first influencing factors.

4. The method as described in claim 2, characterized in that, The electrode reaction rate during the electroless plating process is calculated using deposition kinetics based on the electron reduction chemical reaction equations, resulting in second influencing factors affecting the electroless plating quality and a second correspondence between the electroless plating quality and each of the second influencing factors. Specifically, this includes: Based on the aforementioned electronic reduction chemical reaction equations, the Butler-Former equation is used to construct the reaction rates of each electrode in the electroless plating process, resulting in electrode reaction rate equations. Each electrode reaction rate equation includes a second influencing factor, which includes temperature parameters, nickel ion concentration parameters, hypophosphatemite concentration parameters, and hydrogen ion concentration parameters. Construct the current density balance equations for the cathode and anodic reactions during the electroless plating process; Based on the electrode reaction rate equations and the current density balance equations, a single-factor analysis method was used to adjust each of the second influencing factors in the electroless plating process, and the quality of the electroless plating process was monitored to obtain a second correspondence between the electroless plating quality and each of the second influencing factors.

5. The method as described in claim 2, characterized in that, The nucleation rate during the electroless plating process is calculated using nucleation kinetics based on the aforementioned electron reduction chemical reaction equations. This yields the third influencing factors affecting the electroless plating quality and the third correspondence between the electroless plating quality and these third influencing factors, specifically including: The critical nucleation radius is obtained by calculating the free energy change function during nickel nucleation in the electroless plating process. Based on the free energy change function and the critical nucleation radius, a function is constructed to obtain the nucleation work function; Based on the nucleation work function and the initial nucleation rate function, a function is constructed to obtain the target nucleation rate function. The target nucleation rate function includes various third influencing factors, including cathode overpotential parameters, temperature parameters, and complexing agent content parameters. Based on the target nucleation rate function, a single-factor analysis method was used to adjust each of the third influencing factors in the electroless plating process, and the quality of the electroless plating process was monitored to obtain the third correspondence between the electroless plating quality and each of the third influencing factors.

6. A nickel plating solution parameter adjustment device, used to implement any one of the nickel plating solution parameter adjustment methods as described in claims 1 to 5, characterized in that, include: Initial proportion calculation module: used to perform calculations based on the initial proportions of each sub-solution in the initial nickel plating solution to obtain a first index value and a second index value for adjusting the solution parameters of the initial nickel plating solution; The evaluation index calculation module is used to calculate the evaluation index of the initial nickel plating solution based on the initial temperature, initial pH, first index value and second index value of the initial nickel plating solution using a preset index function. Solution parameter adjustment module: used to adjust at least one of the solution parameters, namely the initial ratio, the initial temperature and the initial pH, of each of the sub-solutions when the evaluation index is less than the preset target index, so as to obtain the target nickel plating solution.

7. A storage medium, characterized in that, The storage medium stores a computer program, which, when executed by a processor, implements the steps of the nickel plating solution parameter adjustment method according to any one of claims 1-5.

8. An electronic device, characterized in that, It includes at least a memory and a processor, wherein the memory stores a computer program, and the processor, when executing the computer program in the memory, implements the steps of the nickel plating solution parameter adjustment method according to any one of claims 1-5.

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