Gate connection components, components, thyristors, semiconductor devices, power equipment

Abstract

The present application relates to a gate connection element, a gate assembly, a thyristor, a power semiconductor device and an electric power device, wherein the main body has a first surface and a second surface, the surface orientation of the first surface is a first orientation, the surface orientation of the second surface is a second orientation, the first orientation and the second orientation are opposite, the deformation part is connected to the main body, the deformation part has a first deformation state and a second deformation state, the first deformation state is a deformation in which the deformation part changes position along the first orientation, the second deformation state is a deformation in which the deformation part changes position along the second orientation, and the connection part changes position relative to the main body based on the switching of the deformation part between the first deformation state and the second deformation state. The size of the gap between the gate connection element and the cathode lead-out piece can be changed based on the deformation capacity of the deformation part in the gate connection element, so that the disadvantage of deteriorating the gate connection element will not occur, and the electrical performance of the power semiconductor device will not be damaged.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a gate connection element, a gate assembly, a thyristor, a power semiconductor device and an electric power device. Background Art

[0002] Power Electronic Device, also known as power semiconductor device, is mainly used for power conversion and control circuit of power equipment. After packaging, the power semiconductor device will lead to the gate connection ring and cathode flange, and a gap for connecting the drive unit will be formed between the gate connection ring and the cathode flange. During the assembly and separation process of the drive unit and the package tube shell of the power semiconductor device, the gap between the gate connection ring and the cathode flange can be used for the drive unit to be electrically connected to the gate connection ring and the cathode flange through the electrodes of the printed circuit board, so that the electrodes of the printed circuit board are located between the gate connection ring and the cathode flange, and can be locked by screw pressure after electrical connection.

[0003] However, in the existing packaging structure of power semiconductor devices, the gap between the gate connection ring, cathode flange and the electrode of the printed circuit board of the power semiconductor device is small, which makes it difficult to screw in and out the drive unit, which makes it difficult to assemble and separate the drive unit and the package tube shell of the power semiconductor device, and the repeatability of the operation is poor. Moreover, when the drive unit and the package tube shell of the power semiconductor device are assembled and separated, it is necessary to use a strong external force to expand the gap between the gate connection ring and the cathode flange, which easily causes the gate connection ring and the cathode flange to deform, thereby deteriorating the electrical contact effect between the gate connection ring, the cathode flange and the electrode of the printed circuit board, and affecting the electrical performance of the power semiconductor device. Summary of the invention

[0004] Based on this, it is necessary to provide a gate connection element, a gate assembly, a thyristor, a power semiconductor device and an electric power equipment to address the above-mentioned technical problems.

[0005] The present application provides a gate connection element, the gate connection element comprising:

[0006] A main body, wherein the main body has a first surface and a second surface, the surface orientation of the first surface is a first orientation, the surface orientation of the second surface is a second orientation, and the first orientation is opposite to the second orientation;

[0007] A deformation portion, the deformation portion is connected to the main body portion, the deformation portion has a first deformation state and a second deformation state, the first deformation state is configured as the deformation of the deformation portion changing its position along the first direction, and the second deformation state is configured as the deformation of the deformation portion changing its position along the second direction;

[0008] A connecting portion is connected to the deformation portion, and is configured to change position relative to the main body portion based on the switching of the deformation portion between the first deformation state and the second deformation state.

[0009] In one embodiment, the deformation of the deformable portion causing a position change is configured as a flipping of the deformable portion causing a position change, wherein the first deformation state is configured as a flipping of the deformable portion causing a position change along the first direction, and the second deformation state is configured as a flipping of the deformable portion causing a position change along the second direction.

[0010] In one embodiment, the deformable portion is flipped along the first direction so that the deformable portion presents a first arc-shaped state, and the deformable portion has a first arc-shaped inner concave surface and a first arc-shaped outer convex surface in the first arc-shaped state, and the direction of the first arc-shaped inner concave surface of the deformable portion is the same as the first direction;

[0011] The deformable portion flips along the second direction so that the deformable portion presents a second arc-shaped state. In the second arc-shaped state, the deformable portion has a second arc-shaped inner concave surface and a second arc-shaped outer convex surface, and the direction of the second arc-shaped inner concave surface of the deformable portion is the same as the second direction.

[0012] In one embodiment, the main body has a central reference plane, the first surface and the second surface of the main body are respectively located on two opposite sides of the central reference plane, the side where the first surface is located is the first reference side of the central reference plane, and the side where the second surface is located is the second reference side of the central reference plane;

[0013] In the first deformed state, at least a portion of the structure of the deformable portion moves to a first reference side of the central reference plane based on the deformation that causes the position change;

[0014] In the second deformed state, at least a portion of the structure of the deformable portion moves to a second reference side of the central reference plane based on the deformation resulting in a positional change.

[0015] In one embodiment, the deformation portion has an inner end and an outer end, the inner end of the deformation portion is connected to the main body portion, and the outer end of the deformation portion is connected to the connecting portion;

[0016] The first deformation state is configured such that the outer end of the deformation portion moves along the first direction, and drives the connection portion to move synchronously along the first direction;

[0017] The second deformation state is configured such that the outer end of the deformation portion moves along the second direction and drives the connection portion to move synchronously along the second direction.

[0018] In one embodiment, at least one of the main body, the deformation portion and the connection portion is configured as an annular structure; and / or,

[0019] The first orientation and the second orientation are parallel to each other; and / or,

[0020] At least one of the main body, the deformation portion and the connection portion is made of metal material.

[0021] The present application provides a gate assembly, the gate assembly comprising:

[0022] The gate connection element;

[0023] A gate spoke is connected to the main body of the gate connection element.

[0024] The present application provides a thyristor, and the thyristor includes the gate assembly.

[0025] The present application provides a power semiconductor device, the power semiconductor device comprising the thyristor;

[0026] A driving unit, wherein an electrode of the driving unit is connected to the thyristor.

[0027] The present application provides an electric power device, wherein the electric power device comprises the power semiconductor device.

[0028] In the above-mentioned gate connection element, gate assembly, thyristor, power semiconductor device and power equipment, the size of the gap between the gate connection element and the cathode lead-out piece can be changed based on the deformation capacity of the deformation part in the gate connection element. Therefore, compared with the method of expanding the gap by a strong external force in the prior art, the deformation capacity of the deformation part is a controllable deformation, which can not only expand the size of the gap as expected, but also restore the size of the gap as expected, so that the disadvantage of deteriorating the gate connection element will not occur. After restoring the size of the gap, the electrical contact effect between the gate connection element, the cathode lead-out piece and the electrode of the printed circuit board can still be guaranteed, and the electrical performance of the power semiconductor device is guaranteed not to be damaged. Moreover, based on the controllable gap expansion and contraction ability, it will be easier to assemble and separate the drive unit and the tube shell of the power semiconductor device, improving the repeatability of the operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic structural diagram of a thyristor in a first deformation state provided in an embodiment of the present application.

[0030] Figure 2 For Figure 1 The shown schematic diagram is a partial enlarged structure of the thyristor in the first deformation state.

[0031] Figure 3 This is a schematic structural diagram of a thyristor in a second deformation state provided in one embodiment of the present application.

[0032] Figure 4 For Figure 3 The schematic diagram of the local enlarged structure of the thyristor shown is in the second deformation state.

[0033] Figure 5 It is a schematic structural diagram of a deformation portion of a gate connection element provided in an embodiment of the present application being in a first deformation state.

[0034] Figure 6 For Figure 5 The diagram is a partial enlarged structural diagram of the deformation portion of the gate connection element in a first deformation state.

[0035] Figure 7 It is a schematic structural diagram of a deformation portion of a gate connection element provided in an embodiment of the present application being in a second deformation state.

[0036] Figure 8 For Figure 7 The diagram is a partial enlarged structural diagram of the deformation portion of the gate connection element being in a second deformation state.

[0037] Figure Number:

[0038] 10. Thyristor;

[0039] 10a, tube shell; 10b, insulating ring; 101, anode electrode; 102, anode molybdenum sheet; 103, power semiconductor chip; 104, cathode molybdenum sheet; 105, cathode electrode; 106, gate molybdenum sheet; 107, anode lead-out piece; 108, cathode lead-out piece;

[0040] 100, gate connection element; 200, gate spoke; 300, elastic element;

[0041] 1000, main body; 2000, deformation part; 3000, connection part;

[0042] 1100, first surface; 1200, second surface; 1000a, first orientation; 1000b, second orientation;

[0043] 1300. Center reference plane. DETAILED DESCRIPTION

[0044] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0045] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0046] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0047] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0048] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0049] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0050] The present application provides a gate connection element 100, a gate assembly, a thyristor 10, a power semiconductor device and an electric power device. Among them, a power semiconductor device needs to be provided in the electric power device, and the power semiconductor device is used to realize the functions of power conversion and control circuit in the electric power device. The power semiconductor device generally includes a thyristor 10 and a drive unit, and the electrode of the drive unit is electrically connected to the thyristor 10 to form a drive control for the thyristor 10. The thyristor 10 is the abbreviation of a thyristor, which can also be called a silicon-controlled rectifier.

[0051] "Thyristor" mostly refers to a semi-controlled thyristor, which is a device that can only be turned on and not turned off by the gate. Thyristor devices also include: gate turn-off thyristor (GTO), gate commutated thyristor (GCT), emitter turn-off thyristor (ETO), dual-core gate commutated thyristor (Dual-GCT), internal commutated thyristor (ICT), dual-mode gate commutated thyristor (Bi-mode GCT), MOSFET turn-off thyristor (MTO), etc. These devices are devices that can be turned on and off by the gate, and can all be called gate turn-off thyristors.

[0052] The structural optimization of this application is mainly aimed at devices that require external integrated driver boards, such as GCT, ETO, Dual-GCT, Bi-mode GCT, MTO, etc.

[0053] Therefore, the thyristor 10 uses corresponding packaging methods based on different types to package the power semiconductor chip 103. For example, the thyristor 10 may include a tube shell 10a, the tube shell 10a has a packaging cavity inside, and the tube shell 10a can package the power semiconductor chip 103, the anode molybdenum sheet 102, the anode electrode 101, the cathode molybdenum sheet 104, the cathode electrode 105 and the gate molybdenum sheet 106 based on the packaging cavity inside.

[0054] In the thyristor 10, the power semiconductor chip 103 generally defines an anode region, a cathode region, and a gate region. The anode molybdenum sheet 102 contacts the anode region of the power semiconductor chip 103, and the anode electrode 101 contacts the anode molybdenum sheet 102. The cathode molybdenum sheet 104 contacts the cathode region of the power semiconductor chip 103, and the cathode electrode 105 contacts the cathode molybdenum sheet 104. The gate molybdenum sheet 106 contacts the gate region of the power semiconductor chip 103. A gate assembly is provided between the insulating ring 10b and the tube shell 10a, the anode lead-out piece 107 connects the anode electrode 101 and the tube shell 10a, and the cathode lead-out piece 108 connects the cathode electrode 105 and the insulating ring 10b.

[0055] In one embodiment, see Figures 1 to 4 As shown, the cross-sectional structure of the package is stacked anode electrode 101, anode molybdenum sheet 102, power semiconductor chip 103, cathode molybdenum sheet 104 and cathode electrode 105 from top to bottom. The anode molybdenum sheet 102, cathode molybdenum sheet 104 and gate molybdenum sheet 106 are respectively in contact with the anode region, cathode region and gate region of the power semiconductor chip 103 under the action of external pressure, and an anode lead-out member 107 such as an anode flange can be used to connect the anode electrode 101 and an insulating tube shell 10a such as a ceramic tube shell 10a, and a cathode lead-out member 108 such as a cathode flange can be used to connect the cathode electrode 105 and an insulating ring 10b such as a ceramic ring.

[0056] The gate assembly may include a gate connection element 100, a gate spoke 200 and an elastic element 300. The gate connection element 100 in the gate assembly leads out the gate spoke 200 and connects the tube shell 10a and the insulating ring 10b. The gate spoke 200 in the gate assembly may contact the gate molybdenum sheet 106 under the elastic pressure of the elastic element 300 such as the disc spring. The drive unit may electrically connect the gate connection element 100 and the cathode lead-out piece 108 through the electrodes of the printed circuit board. The electrical connection position is located between the gate connection element 100 and the cathode lead-out piece 108, and may be pressure-locked by means of threading, clamping, etc.

[0057] See also Figures 1 to 8As shown, the present application provides a gate connection element 100, which may include a main body 1000, a deformation part 2000 and a connection part 3000, and the gate spoke 200 is connected to the main body 1000 of the gate connection element 100. In one embodiment, at least one of the main body 1000, the deformation part 2000 and the connection part 3000 may be set as an annular structure according to design requirements, such as an annular structure such as a circular ring, an elliptical ring, a square ring, or the annular structure is not limited to a complete annular structure with a full circle, for example, it may also be an incomplete annular structure with a gap in the circumferential direction. Those skilled in the art may set the structure of at least one of the main body 1000, the deformation part 2000 and the connection part 3000, or the structure of the gate connection element 100 according to actual requirements, which is not limited here. Moreover, at least one of the main body 1000, the deformation part 2000 and the connection part 3000 may be made of metal materials such as copper.

[0058] Continue reading Figures 5 to 8 As shown, in order to express the different forms of the gate connection element 100 during the assembly process, the main body 1000 may be defined as having a first surface 1100 and a second surface 1200, wherein the surface orientation of the first surface 1100 is a first orientation 1000a, that is, Figure 1 or Figure 2 In the upward direction, the surface orientation of the second surface 1200 is the second orientation 1000b, that is, Figure 1 or Figure 2 The first direction 1000a and the second direction 1000b are opposite, for example, the first direction 1000a and the second direction 1000b are parallel to each other, or, although the first direction 1000a and the second direction 1000b are not completely parallel, the first direction 1000a and the second direction 1000b need to be kept within a certain angle range, which can be set by those skilled in the art according to actual needs and is not limited here.

[0059] The deformation part 2000 of the gate connection element 100 is the main design structure of the gate connection element 100 provided in the present application, and the deformation part 2000 is connected to the main body 1000. The deformation part 2000 may have a deformation ability, and the deformation ability means that the deformation part 2000 itself may change in shape or structure, and this deformation may achieve the expected deformation effect according to control, and this deformation effect may also be controllably restored. In one embodiment, it is defined that the deformation part 2000 may have a first deformation state and a second deformation state, and the first deformation state of the deformation part 2000 is configured as a deformation in which the deformation part 2000 changes position along a first direction 1000a. The deformation in which the position changes here means that after the deformation part 2000 changes in shape or structure, the deformation part 2000 changes position relative to the main body 1000 connected thereto, and the position change in the first deformation state is a position change in the first direction 1000a toward the main body 1000, as shown in FIG. Figure 1 and Figure 2 The second deformation state of the deformation part 2000 is configured as a deformation in which the deformation part 2000 changes position along the second direction 1000b. The deformation in which the position changes here means that after the deformation part 2000 changes in shape or structure, the deformation part 2000 changes position relative to the main body 1000 connected thereto, and the position change in the second deformation state is a position change toward the second direction 1000b of the main body 1000, as shown in FIG. Figure 3 and Figure 4 shown.

[0060] The connecting portion 3000 is connected to the deformable portion 2000. Therefore, based on the deformation capability of the deformable portion 2000 and the expected definition of the first deformation state and the second deformation state, the connecting portion 3000 can be configured to change its position relative to the main portion 1000 based on the switching of the deformable portion 2000 between the first deformation state and the second deformation state, that is, in the first deformation state, the connecting portion 3000 is Figure 1 and Figure 2 As shown, the connection portion 3000 may be configured to change its position along the first direction 1000a relative to the main body portion 1000, that is, in the second deformation state, Figure 3 and Figure 4 As shown, the connection portion 3000 may be configured to change position relative to the main body portion 1000 along the second direction 1000 b.

[0061] Continue reading Figures 1 to 4As shown, after the gate assembly is encapsulated in the thyristor 10, the gate connection element 100 of the gate assembly will form a gap with the cathode lead-out piece 108, and the gap is the gap for connecting the electrode of the driving unit. The electrical connection between the thyristor 10 and the driving unit requires that the size of the gap be enlarged before the electrode of the driving unit is electrically connected in the gap, and the size of the gap be reduced after the electrode of the driving unit is electrically connected in the gap, so that the electrode of the driving unit is stably pressed into the gap, and the gate connection element 100 will form a stable contact assembly with the cathode lead-out piece 108.

[0062] Therefore, after the gate connection element 100 is encapsulated in the thyristor 10, the first surface 1100 of the main body 1000 of the gate connection element 100 faces away from the cathode lead-out member 108, and the second surface 1200 of the main body 1000 faces the cathode lead-out member 108, based on the deformation ability of the deformable portion 2000 in the gate connection element 100, before the electrode of the driving unit is electrically connected in the gap, the deformable portion 2000 of the gate connection element 100 can be controlled to be converted into a first deformation state, so that the deformable portion 2000 is deformed to change its position along the first direction 1000a, and then in the first deformation state, the connection portion 3000 can change its position along the first direction 1000a relative to the main body 1000, thereby expanding the gap between the gate connection element 100 and the cathode lead-out member 108 by controlling the connection portion 3000 to move away from the cathode lead-out member 108.

[0063] Similarly, based on the deformation ability of the deformable portion 2000 in the gate connection element 100, after the electrode of the driving unit is electrically connected in the gap, the deformable portion 2000 of the gate connection element 100 can be controlled to be converted into a second deformation state, so that the deformable portion 2000 is deformed to change its position along the second direction 1000b, and then in the second deformation state, the connection portion 3000 can change its position along the second direction 1000b relative to the main body 1000, thereby reducing the gap between the gate connection element 100 and the cathode lead-out member 108 by controlling the connection portion 3000 to move toward the cathode lead-out member 108.

[0064] In the design of the gate connection element 100 provided above, the size of the gap between the gate connection element 100 and the cathode lead-out piece 108 can be changed based on the deformation capacity of the deformation part 2000 in the gate connection element 100. Therefore, compared with the method of expanding the gap by a strong external force in the prior art, the deformation capacity of the deformation part 2000 is a controllable deformation, which can not only expand the size of the gap as expected, but also restore the size of the gap as expected, so that the disadvantage of deteriorating the gate connection element 100 will not occur. After restoring the size of the gap, the electrical contact effect between the gate connection element 100, the cathode lead-out piece 108 and the electrode of the printed circuit board can still be guaranteed, and the electrical performance of the power semiconductor device is not damaged. Moreover, based on the controllable gap expansion and contraction ability, it is easier to assemble and separate the drive unit and the tube shell 10a of the power semiconductor device, improving the repeatability of the operation.

[0065] The deformation of the deformable part 2000 in which the position is changed can be realized in a variety of ways. For example, at least the deformable part 2000 in the gate connection element 100 has a shape memory function, so that the deformable part 2000 of the gate connection element 100 can be converted into the above-mentioned first deformation state under a specific temperature environment, pressure environment and other special conditions. Similarly, the deformable part 2000 of the gate connection element 100 can be converted into the above-mentioned second deformation state under another specific temperature environment, pressure environment and other special conditions. Alternatively, the deformable part 2000 of the gate connection element 100 can be connected to the main body 1000 in a rotating connection manner, so that it can be converted between the first deformation state and the second deformation state when subjected to an external force. Those skilled in the art can select a suitable deformation method to realize the deformation function of the deformable part 2000 according to actual needs, and this is not limited here.

[0066] In one embodiment, the deformation of the deformable portion 2000 in which the position is changed is configured as a flipping of the deformable portion 2000 in which the position is changed. Therefore, the first deformation state is configured as a flipping of the deformable portion 2000 in which the position is changed along the first direction 1000a. The flipping can be set to have a certain elastic effect, so that after flipping, the structural strength of the first deformation state of the current flipping can be maintained, and no deformation will occur when a certain force is applied, unless the applied force exceeds a certain threshold, the first deformation state will be changed. Similarly, the second deformation state is configured as a flipping of the deformable portion 2000 in which the position is changed along the second direction 1000b. The flipping can be set to have a certain elastic effect, so that after flipping, the structural strength of the first deformation state of the current flipping can be maintained, and no deformation will occur when a certain force is applied, unless the applied force exceeds a certain threshold, the second deformation state will be changed.

[0067] For example, the deformable portion 2000 is flipped along the first direction 1000a so that the deformable portion 2000 presents a first arc-shaped state. The deformable portion 2000 has a first arc-shaped inner concave surface and a first arc-shaped outer convex surface in the first arc-shaped state. Therefore, after the deformable portion 2000 presents the first arc-shaped state, it can be maintained in the first flipped first deformation state based on the first arc-shaped inner concave surface and the first arc-shaped outer convex surface formed by it. When subjected to a certain degree of force, the deformable portion 2000 can not change its shape based on the first arc-shaped inner concave surface and the first arc-shaped outer convex surface formed by it, unless the force applied exceeds a certain threshold value, the first deformation state will be changed. Figure 1 As shown, at this time, the direction of the first arc-shaped inner concave surface of the deformation portion 2000 can be the same as the first direction 1000a, thereby being used to expand the above-mentioned gap.

[0068] Similarly, the deformable portion 2000 is flipped along the second direction 1000b so that the deformable portion 2000 presents a second arc-shaped state. The deformable portion 2000 has a second arc-shaped inner concave surface and a second arc-shaped outer convex surface in the second arc-shaped state. Therefore, after the deformable portion 2000 presents the second arc-shaped state, it can be maintained in the second deformable state currently flipped based on the second arc-shaped inner concave surface and the second arc-shaped outer convex surface formed. When subjected to a certain degree of force, the deformable portion 2000 can not change shape based on the second arc-shaped inner concave surface and the second arc-shaped outer convex surface formed, unless the force applied exceeds a certain threshold, the second deformable state will be changed. Figure 2 As shown, at this time, the direction of the second arc-shaped inner concave surface of the deformation portion 2000 can be the same as the second direction 1000b, thereby being used to reduce the above-mentioned gap.

[0069] For example, when the gate connection element 100 is an annular element, the main body 1000, the deformation part 2000 and the connection part 3000 can all be set as an annular structure. In this case, the deformation part 2000 can be similar to a disc spring structure with an arc-shaped inner concave surface and an arc-shaped outer convex surface. When a force is applied in two axial directions toward the deformation part 2000, the arc-shaped inner concave surface currently possessed by the deformation part 2000 will be converted into an arc-shaped outer convex surface, and the corresponding arc-shaped outer convex surface currently possessed by the deformation part 2000 will be converted into an arc-shaped inner concave surface, thereby realizing the flip deformation of the deformation part 2000.

[0070] When the deformation part 2000 is in the first deformation state or the second deformation state, the moving size of the connection part 3000 driven by the deformation part 2000 relative to the main body 1000 can be set according to the needs. For example, when it is in the first deformation state or the second deformation state, the moving size of the connection part 3000 driven by the deformation part 2000 relative to the main body 1000 can be the same or different, as long as the expansion and contraction of the above-mentioned gap is convenient for the electrode of the driving unit to be screwed in or out, and no limitation is made here. In one embodiment, it can be defined that the main body 1000 has a central reference plane 1300, and the first surface 1100 and the second surface 1200 of the main body 1000 are respectively located on opposite sides of the central reference plane 1300, the side where the first surface 1100 is located is the first reference side of the central reference plane 1300, and the side where the second surface 1200 is located is the second reference side of the central reference plane 1300. Therefore, in the first deformation state, at least a part of the structure of the deformation part 2000 moves to the first reference side of the central reference plane 1300 based on the deformation with position change, for example, the entire structure of the deformation part 2000 can move to the first reference side of the central reference plane 1300 based on the deformation with position change. In the second deformation state, at least a part of the structure of the deformation part 2000 moves to the second reference side of the central reference plane 1300 based on the deformation with position change, for example, the entire structure of the deformation part 2000 can move to the second reference side of the central reference plane 1300 based on the deformation with position change. Those skilled in the art can set it according to the needs, and it is not limited here.

[0071] The deformation part 2000 has an inner end and an outer end. When the gate connection element 100 is an annular element, the inner end of the deformation part 2000 is the radial inner edge of the annular structure, and the outer end of the deformation part 2000 is the radial outer edge of the annular structure. The inner end of the deformation part 2000 is connected to the main body 1000, and the outer end of the deformation part 2000 is connected to the connection part 3000. At this time, the first deformation state is configured as the outer end of the deformation part 2000 moves along the first direction 1000a, and drives the connection part 3000 to move synchronously along the first direction 1000a. The second deformation state is configured as the outer end of the deformation part 2000 moves along the second direction 1000b, and drives the connection part 3000 to move synchronously along the second direction 1000b.

[0072] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0073] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A gate connection element, characterized in that: The gate connection element comprises: A main body, wherein the main body has a first surface and a second surface, the surface orientation of the first surface is a first orientation, the surface orientation of the second surface is a second orientation, and the first orientation is opposite to the second orientation; A deformation portion, the deformation portion is connected to the main body portion, the deformation portion has a first deformation state and a second deformation state, the first deformation state is configured as the deformation of the deformation portion changing its position along the first direction, and the second deformation state is configured as the deformation of the deformation portion changing its position along the second direction; A connecting portion is connected to the deformation portion, and is configured to change position relative to the main body portion based on the switching of the deformation portion between the first deformation state and the second deformation state.

2. The gate connection element according to claim 1, characterized in that: The deformation of the deformable portion causing a position change is configured as a flipping of the deformable portion causing a position change, wherein the first deformation state is configured as a flipping of the deformable portion causing a position change along the first direction, and the second deformation state is configured as a flipping of the deformable portion causing a position change along the second direction.

3. The gate connection element according to claim 2, characterized in that: The deformable portion is flipped along the first direction so that the deformable portion presents a first arc-shaped state, and the deformable portion has a first arc-shaped inner concave surface and a first arc-shaped outer convex surface in the first arc-shaped state, and the direction of the first arc-shaped inner concave surface of the deformable portion is the same as the first direction; The deformable portion flips along the second direction so that the deformable portion presents a second arc-shaped state. In the second arc-shaped state, the deformable portion has a second arc-shaped inner concave surface and a second arc-shaped outer convex surface, and the direction of the second arc-shaped inner concave surface of the deformable portion is the same as the second direction.

4. The gate connection element according to any one of claims 1 to 3, characterized in that: The main body is defined as having a central reference plane, the first surface and the second surface of the main body are respectively located on two opposite sides of the central reference plane, the side where the first surface is located is the first reference side of the central reference plane, and the side where the second surface is located is the second reference side of the central reference plane; In the first deformed state, at least a portion of the structure of the deformable portion moves to a first reference side of the central reference plane based on the deformation that causes the position change; In the second deformed state, at least a portion of the structure of the deformable portion moves to a second reference side of the central reference plane based on the deformation resulting in a positional change.

5. The gate connection element according to any one of claims 1 to 3, characterized in that: The deformation portion has an inner end and an outer end, the inner end of the deformation portion is connected to the main body portion, and the outer end of the deformation portion is connected to the connecting portion; The first deformation state is configured such that the outer end of the deformation portion moves along the first direction, and drives the connection portion to move synchronously along the first direction; The second deformation state is configured such that the outer end of the deformation portion moves along the second direction and drives the connection portion to move synchronously along the second direction.

6. The gate connection element according to any one of claims 1 to 3, characterized in that: At least one of the main body, the deformation portion and the connection portion is configured as a ring structure; and / or, The first orientation and the second orientation are parallel to each other; and / or, At least one of the main body, the deformation portion and the connection portion is made of metal material.

7. A gate assembly, characterized in that: The gate assembly comprises: The gate connection element according to any one of claims 1 to 6; A gate spoke is connected to the main body of the gate connection element.

8. A thyristor, characterized in that: The thyristor comprises the gate assembly according to claim 7.

9. A power semiconductor device, characterized in that: The power semiconductor device comprises a thyristor as claimed in claim 8; A driving unit, wherein an electrode of the driving unit is connected to the thyristor.

10. An electric power device, characterized in that: The electric power equipment comprises the power semiconductor device according to claim 9.

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