A tetrahydrofuran safety recovery device

Abstract

This invention discloses a tetrahydrofuran safety recovery device, comprising a heat exchange box, a first semiconductor cooling chip fixedly mounted at the rear of the heat exchange box, a second semiconductor cooling chip fixedly mounted at the front of the heat exchange box, a first heat dissipation fin fixedly mounted at the rear of the first semiconductor cooling chip, and a second heat dissipation fin fixedly mounted at the front of the second semiconductor cooling chip. A discharge pipe is fixedly mounted on one side surface of the heat exchange box near the bottom. A pre-cooling structure is provided at the top of the heat exchange box, including a pre-cooling chamber fixedly mounted on the top of the heat exchange box. By adopting the above technical solution, the tetrahydrofuran safety recovery device provided by this invention, on the one hand, utilizes condensed air, achieving energy saving and environmental protection; on the other hand, it also reduces the temperature of tetrahydrofuran entering the heat exchange box, improving condensation efficiency and increasing tetrahydrofuran recovery efficiency.

Description

Technical Field

[0001] This invention relates to a safe recovery device for tetrahydrofuran. Background Technology

[0002] Tetrahydrofuran is a class of organic heterocyclic compounds and one of the strongest polar ethers. It is the most commonly used organic solvent in organic chemical production (especially Grignard reactions). Due to its high price, scarcity of resources, and the fact that direct discharge will pollute the environment, it needs to be recycled after use. Common recycling methods include distillation and condensation.

[0003] However, existing tetrahydrofuran (THF) condensation and recovery methods suffer from low recovery efficiency. Typically, a refrigerant is introduced into the recovery device for heat exchange, followed by recooling to achieve THF condensation and recovery. Since the refrigerant's residence time within the recovery device determines the efficiency of THF condensation and recovery, traditional THF recovery devices are typically very large, further increasing the refrigerant's residence time and resulting in high costs. Furthermore, they cannot utilize the condensed cold air, thus failing to achieve energy-saving and environmentally friendly effects. Summary of the Invention

[0004] The main objective of this invention is to provide a safe recovery device for tetrahydrofuran, which can effectively solve the technical problems in the background art.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0006] A tetrahydrofuran safety recovery device includes a heat exchange box, a first semiconductor refrigeration chip fixedly installed at the rear of the heat exchange box, a second semiconductor refrigeration chip fixedly installed at the front of the heat exchange box, a first heat dissipation fin fixedly installed at the rear of the first semiconductor refrigeration chip, a second heat dissipation fin fixedly installed at the front of the second semiconductor refrigeration chip, a discharge pipe fixedly installed on one side of the heat exchange box, and a pre-cooling structure provided on the upper part of the heat exchange box 1.

[0007] Preferably, the precooling structure includes a precooling box, which is fixedly installed on the top of the heat exchange box. An inlet pipe is fixedly installed on one side of the upper part of the precooling box, an exhaust pipe is fixedly installed on the other side of the upper part of the precooling box, a first circulation pipe is fixedly installed on the other side of the heat exchange box, and a second circulation pipe is fixedly installed on one side of the precooling box. A connecting pipe connects the first circulation pipe and the second circulation pipe.

[0008] Preferably, mounting plates are fixedly installed at both the front and rear of the heat exchange box, and the upper surface of the mounting plates is provided with through grooves.

[0009] Preferably, a heat dissipation structure is provided between the connecting pipe and the first and second heat dissipation fins. The heat dissipation structure includes a connecting pipe, one end of which is fixedly connected to the connecting pipe, and the other end of which is fixedly connected to a main pipe. A hollow plate is installed on one side of both the first and second heat dissipation fins. Three distribution pipes are connected between the hollow plate and the main pipe. A ball valve is installed inside the main pipe.

[0010] Preferably, each of the two hollow plates has a plurality of exhaust grooves on one side surface, and each exhaust groove is aligned with the fin gap of the first heat dissipation fin and the second heat dissipation fin.

[0011] Preferably, a spiral condenser tube is fixedly installed inside the heat exchange box, and an inverted "T"-shaped plate is fixedly installed inside the heat exchange box. The inverted "T"-shaped plate divides the heat exchange box into three spaces, which are the condensation zone of the spiral condenser tube, the liquid storage tank, and the filter tank. A filter box is fixedly installed inside the filter tank.

[0012] Preferably, the top of the vertical plate of the inverted "T"-shaped plate is provided with a ventilation groove, the height of which is higher than the height of the discharge pipe, and the bottom end of the spiral condenser extends through the inverted "T"-shaped plate into the interior of the liquid storage tank, and the filter box is located between the ventilation groove and the first circulation pipe.

[0013] Preferably, a precooling pipe is fixedly installed inside the precooling box, and the two ends of the precooling pipe are respectively connected to the input pipe and the spiral condenser pipe.

[0014] Preferably, the contact surfaces of the heat exchange box with the first and second semiconductor refrigeration chips are provided with grooves, and the depth of the grooves is 1 / 5 of the thickness of the first and second semiconductor refrigeration chips.

[0015] As can be seen from the above description of the structure of the present invention, compared with the prior art, the present invention has the following advantages:

[0016] 1. The tetrahydrofuran safety recovery device provided by the present invention is equipped with a first semiconductor refrigeration chip and a second semiconductor refrigeration chip in conjunction with a heat exchange box. The two refrigeration chips directly cool the inside of the heat exchange box. When the medium passes through the spiral condenser tube, it can be condensed into a liquid state. The condensation effect is good. Compared with the traditional method of using refrigerant condensation, the entire tetrahydrofuran recovery device can be prepared in a smaller volume and with higher efficiency. Moreover, it does not require the use of circulating pumps and other devices, and the preparation cost is lower.

[0017] 2. The tetrahydrofuran safety recovery device provided by this invention has a pre-cooling structure. Since high-temperature gaseous tetrahydrofuran will produce liquid and gas after condensation, the liquid has usable value, while the gas needs to be directly discharged. Since the gas is in a low-temperature state, this invention can cool down the tetrahydrofuran by using the pre-cooling structure in conjunction with the gas produced after condensation. On the one hand, it utilizes the condensed air, which plays an energy-saving and environmental protection role. On the other hand, it also reduces the temperature of tetrahydrofuran entering the heat exchange box, improves the condensation efficiency, and increases the tetrahydrofuran recovery efficiency.

[0018] 3. The tetrahydrofuran safety recovery device provided by the present invention, by setting a pre-cooling structure and a heat dissipation structure, branches the condensed air through pipes into the fin gaps of the first heat dissipation fin and the second heat dissipation fin, which can effectively cool the first heat dissipation fin and the second heat dissipation fin, thereby increasing the heat dissipation performance of the first semiconductor refrigeration chip and the second semiconductor refrigeration chip. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a tetrahydrofuran safety recovery device according to the present invention. Figure 1 ;

[0020] Figure 2 This is a schematic diagram of the structure of a tetrahydrofuran safety recovery device according to the present invention. Figure 2 ;

[0021] Figure 3 for Figure 1 A longitudinal sectional view;

[0022] Figure 4 for Figure 3 Explosion Figure 1 ;

[0023] Figure 5 for Figure 3 Explosion Figure 2 .

[0024] In the diagram: 1. Heat exchange box; 2. First semiconductor refrigeration chip; 3. Second semiconductor refrigeration chip; 4. First heat dissipation fin; 5. Second heat dissipation fin; 6. Mounting plate; 7. Through slot; 8. Discharge pipe; 9. Pre-cooling structure; 10. Pre-cooling box; 11. Inlet pipe; 12. Exhaust pipe; 13. First circulation pipe; 14. Second circulation pipe; 15. Connecting pipe; 16. Heat dissipation structure; 17. Connecting pipe; 18. Ball valve; 19. Main pipe; 20. Hollow plate; 21. Dispersion pipe; 22. Spiral condenser pipe; 23. Liquid storage tank; 24. Filter tank; 25. Filter box; 26. Pre-cooling pipe. Detailed Implementation

[0025] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0026] like Figures 1 to 5 As shown, a tetrahydrofuran safety recovery device includes a heat exchange box 1. A first semiconductor cooling chip 2 is fixedly installed at the rear of the heat exchange box 1, and a second semiconductor cooling chip 3 is fixedly installed at the front of the heat exchange box 1. A first heat dissipation fin 4 is fixedly installed at the rear of the first semiconductor cooling chip 2, and a second heat dissipation fin 5 is fixedly installed at the front of the second semiconductor cooling chip 3. An exhaust pipe 8 is fixedly installed on one side surface of the heat exchange box 1 near the bottom. A pre-cooling structure 9 is provided on the upper part of the heat exchange box 1. With this structure, by setting the pre-cooling structure and the heat dissipation structure, the condensed air is branched through pipes to the first heat dissipation fins and the exhaust pipe 9. The gaps between the fins of the second heat dissipation fins can effectively cool the first and second heat dissipation fins, thereby increasing the heat dissipation performance of the first and second semiconductor refrigeration chips. By setting up the first and second semiconductor refrigeration chips in conjunction with the heat exchange box, the two refrigeration chips directly cool the inside of the heat exchange box. When the medium passes through the spiral condenser tube, it can be condensed into a liquid state, resulting in good condensation effect. Compared with the traditional method of using refrigerant condensation, the entire tetrahydrofuran recovery device can be prepared in a smaller volume and with higher efficiency. Moreover, it does not require the use of circulating pumps and other devices, making the preparation cost lower.

[0027] In this embodiment, the precooling structure 9 includes a precooling box 10, which is fixedly installed on the top of the heat exchange box 1. An inlet pipe 11 is fixedly installed on the upper side of the precooling box 10 near the front, and an exhaust pipe 12 is fixedly installed on the other upper side of the precooling box 10 near the rear. A first circulation pipe 13 is fixedly installed on the other side of the heat exchange box 1 near the bottom, and a second circulation pipe 14 is fixedly installed on one side of the precooling box 10 near the front. A connecting pipe 15 connects the first circulation pipe 13 and the second circulation pipe 14. With this structure, the precooling structure allows for the cooling of the tetrahydrofuran. Since the high-temperature gaseous tetrahydrofuran condenses into liquid and gas, the liquid is usable, while the gas needs to be directly discharged. Because the gas is at a low temperature, this invention utilizes the precooling structure in conjunction with the condensed gas to cool the tetrahydrofuran. This utilizes the condensed air, achieving energy saving and environmental protection, and also reduces the temperature of the tetrahydrofuran entering the heat exchange box, improving condensation efficiency and tetrahydrofuran recovery efficiency.

[0028] In this embodiment, mounting plates 6 are fixedly installed at the front and rear of the heat exchange box 1, flush with the bottom. The upper surface of the mounting plate 6 has a through groove 7. With this structure, the mounting plate 6 and the through groove 7 can be used to easily install the heat exchange box 1 on an external platform or bracket using external bolts.

[0029] In this embodiment, a heat dissipation structure 16 is provided between the connecting pipe 15 and the first heat dissipation fin 4 and the second heat dissipation fin 5. The heat dissipation structure 16 includes a connecting pipe 17, one end of which is fixedly connected to the connecting pipe 15, and the other end of which is fixedly connected to a main pipe 19. A hollow plate 20 is installed on one side of both the first heat dissipation fin 4 and the second heat dissipation fin 5. Three distribution pipes 21 are connected between the hollow plate 20 and the main pipe 19. A ball valve 18 is installed inside the main pipe 19. With this structure, the connecting pipe 17 is connected to the connecting pipe 15. Therefore, the cold air in the connecting pipe 15 can enter the hollow plate 20 through the connecting pipe 17, thereby cooling the first heat dissipation fin 4 and the second heat dissipation fin 5. The ball valve 18 can control the air flow rate of the connecting pipe 17.

[0030] In this embodiment, several exhaust grooves are formed on one side surface of each of the two hollow plates 20, and each exhaust groove is aligned with the fin gap of the first heat dissipation fin 4 and the second heat dissipation fin 5. With this structure, after the cold air is discharged through the exhaust grooves of the hollow plate 20, it enters the fin gap of the two heat dissipation fins, thereby cooling the two heat dissipation fins and thus cooling the first thermoelectric cooler 2 and the second thermoelectric cooler 3.

[0031] In this embodiment, a spiral condenser tube 22 is fixedly installed inside the heat exchange box 1, and an inverted "T"-shaped plate is fixedly installed near the bottom of the heat exchange box 1. The inverted "T"-shaped plate divides the heat exchange box 1 into three spaces: a condensation zone with the spiral condenser tube 22, a liquid storage tank 23, and a filter tank 24. A filter box 25 is fixedly installed inside the filter tank 24. With this structure, gaseous high-temperature tetrahydrofuran enters the spiral condenser tube 22 and is condensed in the condensation zone. The condensed liquid flows into the liquid storage tank 23 and then overflows through the discharge pipe 8.

[0032] In this embodiment, a venting groove is provided at the top of the vertical plate of the inverted "T"-shaped plate. The height of the venting groove is higher than the height of the discharge pipe 8. The bottom end of the spiral condenser pipe 22 extends through the inverted "T"-shaped plate into the interior of the liquid storage tank 23. The filter box 25 is located between the venting groove and the first circulation pipe 13. With this structure, liquid and gas are generated after condensation. The gas is also at a low temperature. Since the height of the venting groove is higher than the discharge pipe 8, the gas will enter the filter tank 24 through the venting groove, be filtered by the filter box 25, and then be discharged into the first circulation pipe 13.

[0033] In this embodiment, a precooling pipe 26 is fixedly installed inside the precooling chamber 10, and both ends of the precooling pipe 26 are connected to the inlet pipe 11 and the spiral condenser pipe 22, respectively. With this structure, the spirally arranged precooling pipe 26 can increase the residence time of high-temperature gaseous tetrahydrofuran in the precooling chamber 10, thereby increasing the precooling effect.

[0034] In this embodiment, the contact surfaces of the heat exchange box 1 with the first thermoelectric cooler 2 and the second thermoelectric cooler 3 are both provided with grooves, the depth of which is 1 / 5 of the thickness of the first thermoelectric cooler 2 and the second thermoelectric cooler 3. This structure allows the grooves to increase the stability of the first thermoelectric cooler 2 and the second thermoelectric cooler 3.

[0035] Working principle:

[0036] In use, the discharge pipe 8 is connected to the external recovery pipe, the input pipe 11 is connected to the high-temperature gaseous tetrahydrofuran input pipe, and the exhaust pipe 12 is connected to the external gas discharge pipe. During operation, the high-temperature gaseous tetrahydrofuran is input into the input pipe 11, and then enters the precooling pipe 26 through the input pipe 11, and then enters the spiral condenser 22. At this time, the first semiconductor refrigeration chip 2 and the second semiconductor refrigeration chip 3 work to cool, so that the tetrahydrofuran in the spiral condenser 22 is condensed into a liquid state. The liquid enters the liquid storage tank 23. As the liquid rises continuously, it finally overflows through the discharge pipe 8.

[0037] The condensed gas enters the filter tank 24 through the ventilation slot, and after being filtered by the filter box 25, it enters the connecting pipe 15 through the first circulation pipe 13, and then enters the pre-cooling box 10 through the second circulation pipe 14. After circulating in the pre-cooling box 10, it is discharged from the exhaust pipe 12. During the process, the condensed gas can achieve heat exchange with the pre-cooling pipe 26, thus achieving the purpose of pre-cooling.

[0038] In addition, by controlling the opening of the ball valve 18, some cold air can enter the connecting pipe 17, and then enter the hollow plate 20 through the main pipe 19 and the distribution pipe 21 in sequence. Finally, it is discharged through the hollow plate 20. The discharged cold air enters the fin gaps of the first heat dissipation fin 4 and the second heat dissipation fin 5 to cool the two heat dissipation fins, thereby achieving the purpose of heat dissipation for the first semiconductor refrigeration chip 2 and the second semiconductor refrigeration chip 3.

[0039] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A tetrahydrofuran safety recovery device, characterized in that: The heat exchange box (1) includes a heat exchange box (1), a first semiconductor cooling chip (2) is fixedly installed at the rear of the heat exchange box (1), a second semiconductor cooling chip (3) is fixedly installed at the front of the heat exchange box (1), a first heat dissipation fin (4) is fixedly installed at the rear of the first semiconductor cooling chip (2), a second heat dissipation fin (5) is fixedly installed at the front of the second semiconductor cooling chip (3), a discharge pipe (8) is fixedly installed on one side of the heat exchange box (1), and a pre-cooling structure (9) is provided on the upper part of the heat exchange box (1). The precooling structure (9) includes a precooling box (10), which is fixedly installed on the top of the heat exchange box (1). An inlet pipe (11) is fixedly installed on one side of the upper part of the precooling box (10), an exhaust pipe (12) is fixedly installed on the other side of the upper part of the precooling box (10), a first circulation pipe (13) is fixedly installed on the other side of the heat exchange box (1), a second circulation pipe (14) is fixedly installed on one side of the precooling box (10), and a connecting pipe (15) is connected between the first circulation pipe (13) and the second circulation pipe (14). A heat dissipation structure (16) is provided between the connecting pipe (15) and the first heat dissipation fin (4) and the second heat dissipation fin (5). The heat dissipation structure (16) includes a connecting pipe (17). One end of the connecting pipe (17) is fixedly connected to the connecting pipe (15), and the other end of the connecting pipe (17) is fixedly connected to a main pipe (19). A hollow plate (20) is installed on one side of the first heat dissipation fin (4) and the second heat dissipation fin (5). Three distribution pipes (21) are connected between the hollow plate (20) and the main pipe (19). A ball valve (18) is installed inside the main pipe (19). The heat exchange box (1) is fixedly installed with a spiral condenser tube (22) and an inverted "T" shaped plate. The inverted "T" shaped plate divides the heat exchange box (1) into three spaces, namely the condensation zone of the spiral condenser tube (22), the liquid storage tank (23), and the filter tank (24). The filter tank (24) is fixedly installed with a filter box (25). The top of the vertical plate of the inverted "T" shaped plate is provided with a ventilation groove. The height of the ventilation groove is higher than the height of the discharge pipe (8). The bottom end of the spiral condenser pipe (22) extends through the inverted "T" shaped plate to the interior of the liquid storage tank (23). The filter box (25) is located between the ventilation groove and the first circulation pipe (13).

2. The tetrahydrofuran safety recovery device according to claim 1, characterized in that: The heat exchange box (1) is fixedly installed with mounting plates (6) at both the front and rear, and the upper surface of the mounting plate (6) is provided with a through groove (7).

3. The tetrahydrofuran safety recovery device according to claim 1, characterized in that: Several exhaust grooves are provided on one side surface of the two hollow plates (20), and each exhaust groove is aligned with the fin gap of the first heat dissipation fin (4) and the second heat dissipation fin (5).

4. The tetrahydrofuran safety recovery device according to claim 1, characterized in that: The precooling box (10) is fixedly installed with a precooling pipe (26), and the two ends of the precooling pipe (26) are connected to the input pipe (11) and the spiral condenser pipe (22) respectively.

5. The tetrahydrofuran safety recovery device according to claim 1, characterized in that: The contact surfaces of the heat exchange box (1) with the first semiconductor refrigeration chip (2) and the second semiconductor refrigeration chip (3) are provided with grooves, and the depth of the grooves is 1 / 5 of the thickness of the first semiconductor refrigeration chip (2) and the second semiconductor refrigeration chip (3).

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