Air volume control method, device and equipment of wafer cleaning equipment and storage medium

Abstract

The present application relates to wafer cleaning technical field, disclose a kind of air volume control method, device, equipment and storage medium of wafer cleaning equipment, the method comprises: according to the cleanliness requirement of each preset module in wafer cleaning equipment determines the differential pressure set value corresponding to each preset module, forms differential pressure gradient distribution, wherein, the higher the cleanliness requirement of preset module, the greater the differential pressure set value corresponding;Receive the real-time differential pressure detection value of each preset module under current working condition;According to differential pressure set value and real-time differential pressure detection value control the rotational speed of the air supply device of corresponding preset module to maintain differential pressure gradient distribution, the present application can avoid when transmission operation is carried out, and the turbulence phenomenon between module and module can make the differential pressure of module fluctuate, and the situation that particle can flow from the module of low clean level to the module of high clean level, to improve cleaning effect.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning technology, and more specifically to a method, apparatus, equipment, and storage medium for controlling the airflow of a wafer cleaning device. Background Technology

[0002] With the continuous development of semiconductor integrated circuit (IC) manufacturing technology, the minimum linewidth is getting smaller, the number of interconnect layers is increasing, and the wafer diameter is constantly growing. To achieve multi-layer wiring, the wafer surface must have extremely high flatness, smoothness, and cleanliness. Current technology generally uses chemical mechanical polishing (CMP) to perform global planarization on the wafer. After the CMP process, the wafer still needs to be cleaned. The cleanliness of the cleaning chamber affects the wafer's particle size. The cleaning chamber typically uses clean air that passes through an air filter before entering the cleaning chamber and then into the exhaust duct. This creates a pressure difference between the cleaning chamber and the exhaust duct, causing the cleaned particles to be forced into the exhaust duct by the air pressure, thus ensuring the cleanliness of the cleaning chamber.

[0003] To improve wafer cleaning efficiency and ensure wafer surface grain size, a cleaning method with multiple cleaning modules coexisting exists. However, during wafer transfer, the opening and closing of the transfer gate can cause communication between modules, leading to mutual interference between different cleaning modules. This mutual interference can result in unsatisfactory final cleaning effect, deteriorate the cleaning chamber environment, and affect the wafer cleaning effect. Summary of the Invention

[0004] In view of this, the present invention provides a method, apparatus, device and storage medium for controlling the air volume of a wafer cleaning equipment, in order to solve the technical problem of poor wafer cleaning effect when multiple modules are cleaned in parallel.

[0005] In a first aspect, the present invention provides an airflow control method for a wafer cleaning equipment, comprising: determining a differential pressure setting value corresponding to each preset module based on the cleanliness requirements of each preset module in the wafer cleaning equipment, forming a differential pressure gradient distribution, wherein the higher the cleanliness requirement of the preset module, the larger the corresponding differential pressure setting value; receiving real-time differential pressure detection values ​​of each preset module under the current operating conditions; and controlling the rotation speed of the air supply device of the corresponding preset module according to the differential pressure setting value and the real-time differential pressure detection value to maintain the differential pressure gradient distribution.

[0006] This invention discloses an airflow control method for a wafer cleaning equipment. This method determines the differential pressure setting value for each preset module based on its cleanliness requirements, forming a differential pressure gradient distribution. It receives real-time differential pressure detection values ​​for each preset module under current operating conditions and controls the rotation speed of the air supply device for the corresponding preset module based on the differential pressure setting value and the real-time differential pressure detection value to maintain the differential pressure gradient distribution. This method enables the setting of differential pressure values ​​based on the different cleanliness requirements of each preset module during parallel cleaning. During wafer transfer, the exhaust volume is adjusted in real-time according to the pre-set differential pressure values, ensuring that particles flow from modules with higher cleanliness requirements to modules with lower cleanliness requirements, and finally exit through the plant exhaust duct. This avoids turbulence between modules during transfer operations, preventing pressure fluctuations and the possibility of particles flowing from lower-cleanliness modules to higher-cleanliness modules, thereby improving the cleaning effect.

[0007] Optionally, controlling the rotation speed of the air supply device of the corresponding preset module to maintain the pressure gradient distribution based on the pressure difference setpoint and the real-time pressure difference detection value includes: determining whether the actual pressure difference of each preset module meets the pressure gradient distribution based on the real-time pressure difference detection value; when the actual pressure difference of each preset module does not meet the pressure gradient distribution, controlling the rotation speed of the air supply device corresponding to each preset module based on the pressure difference setpoint and the correspondence between rotation speed and pressure difference under the current operating condition, wherein the correspondence between rotation speed and pressure difference under the current operating condition is obtained through pre-tuning.

[0008] This method determines in real time whether the actual pressure difference meets the pressure difference gradient distribution and adjusts the speed of the air supply device according to the pre-set corresponding relationship. It can monitor and provide precise control in real time, and realize closed-loop and complete feedback regulation.

[0009] Optionally, before controlling the rotation speed of the corresponding air supply device according to the differential pressure set value and the real-time differential pressure detection value to maintain the differential pressure gradient distribution, the method further includes: receiving the real-time pressure detection value of the plant exhaust duct under the current operating conditions; and controlling the opening degree of the plant exhaust duct according to the preset pressure value and the real-time pressure detection value.

[0010] In this method, changes in the pressure value of the plant's exhaust duct can be quickly detected and precisely adjusted, providing a stable control platform for the differential pressure gradient control of the wafer cleaning equipment.

[0011] Optionally, controlling the opening of the plant exhaust duct based on the preset pressure value and the real-time pressure detection value includes: determining whether the real-time pressure detection value is equal to the preset pressure value; when the real-time pressure detection value is not equal to the preset pressure value, controlling the opening of the plant exhaust duct based on the correspondence between the preset pressure value and the opening and pressure difference under the current operating conditions, wherein the correspondence between the opening and pressure difference is obtained through pre-setting.

[0012] In this method, by judging whether the real-time pressure detection value is equal to the preset pressure value in real time, and controlling the opening of the plant exhaust duct according to the pre-set corresponding relationship, it can monitor and provide precise control in real time, and realize closed-loop and complete feedback regulation.

[0013] Optionally, the preset module includes a cleaning module, a device front-end module, and a transmission hand, wherein the cleanliness requirement of the device front-end module is higher than that of the cleaning module, and the cleanliness requirement of the cleaning module is higher than that of the transmission hand.

[0014] Secondly, the present invention provides an airflow control device for a wafer cleaning equipment, comprising: a differential pressure determination module, used to determine a differential pressure setting value corresponding to each preset module according to the cleanliness requirements of each preset module in the wafer cleaning equipment, forming a differential pressure gradient distribution, wherein the higher the cleanliness requirements of the preset module, the larger the corresponding differential pressure setting value; a detection value receiving module, used to receive real-time differential pressure detection values ​​of each preset module under the current operating conditions; and a speed control module, used to control the speed of the air supply device of the corresponding preset module according to the differential pressure setting value and the real-time differential pressure detection value to maintain the differential pressure gradient distribution.

[0015] Thirdly, the present invention provides an airflow control device for a wafer cleaning equipment, including a host computer and an air supply device and a first air pressure detection device respectively connected to the host computer; the air supply device is disposed at the air outlet of each preset module in the wafer cleaning equipment, for providing airflow to each preset module; the first air pressure detection device is disposed in each preset module, for acquiring the real-time differential pressure detection value of each preset module; the host computer includes a memory and a processor, the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor executes the computer instructions to execute the airflow control method of the wafer cleaning equipment described in the first aspect or any corresponding embodiment.

[0016] Optionally, the airflow control device of the wafer cleaning equipment further includes an exhaust duct control system and a second air pressure detection device, which are respectively connected to the host computer; the second air pressure detection device is installed in the plant exhaust duct and is used to obtain the real-time pressure detection value of the plant exhaust duct; the exhaust duct control system is used to control the opening of the exhaust duct according to the control instructions of the host computer.

[0017] Fourthly, the present invention provides a computer-readable storage medium storing computer instructions for causing a computer to execute the airflow control method of the wafer cleaning equipment described in the first aspect or any corresponding embodiment thereof.

[0018] Fifthly, the present invention provides a computer program product, including computer instructions for causing a computer to execute an airflow control method for a wafer cleaning apparatus as described in the first aspect or any corresponding embodiment thereof. Attached Figure Description

[0019] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0020] Figure 1 This is a flowchart illustrating the airflow control method for a wafer cleaning device according to an embodiment of the present invention.

[0021] Figure 2 This is a schematic diagram of the system layout of the airflow control method for the wafer cleaning equipment according to an embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of the wafer transport path of the wafer cleaning equipment according to an embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of the airflow control device of the wafer cleaning equipment according to an embodiment of the present invention;

[0024] Figure 5 This is a structural block diagram of the airflow control device of the wafer cleaning equipment according to an embodiment of the present invention. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] In relevant wafer cleaning equipment, the pressure difference between each module is generally set to a fixed value. During transfer operations, turbulence occurs between modules, causing fluctuations in the pressure difference. Particles may flow from modules with lower cleanliness levels to modules with higher cleanliness levels, ultimately leading to unsatisfactory cleaning results. Furthermore, the exhaust ducts of each module are connected to the plant's exhaust system, which is affected by the operation of other equipment, causing fluctuations in the exhaust duct pressure. This makes it difficult to control the pressure gradient required by the wafer cleaning equipment. To address this issue, pressure detection and adjustment devices are added. Combined with the equipment's air supply device, the required pressure gradient for the wafer cleaning equipment can be controlled more quickly and accurately.

[0027] Based on this, embodiments of the present invention provide an airflow control method for a wafer cleaning equipment. During the wafer transfer process, the exhaust volume is adjusted in real time according to the pre-set module cleaning cleanliness level to ensure that particles flow from high-level modules to low-level modules and finally flow out through the plant exhaust duct.

[0028] According to an embodiment of the present invention, an embodiment of an airflow control method for a wafer cleaning equipment is provided. It should be noted that the steps shown in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions. Furthermore, although a logical order is shown in the flowchart, in some cases, the steps shown or described may be executed in a different order than that shown here.

[0029] This embodiment provides a method for controlling the airflow of a wafer cleaning equipment, which can be used in a host computer, such as a computer, mobile phone, PLC, or other terminal. Figure 1 and Figure 2 As shown, the process includes the following steps:

[0030] Step S101: Determine the differential pressure setting value corresponding to each preset module according to the cleanliness requirements of each preset module in the wafer cleaning equipment, and form a differential pressure gradient distribution. The higher the cleanliness requirement of the preset module, the larger the corresponding differential pressure setting value.

[0031] Specifically, the gradient of each differential pressure setpoint in the differential pressure gradient distribution can be a fixed value or a range value, and can be modified in real time according to the control accuracy of the machine and the process.

[0032] The wafer cleaning equipment includes several modules, with the preset modules being those that have certain requirements for cleanliness.

[0033] In one example, the preset modules include a cleaning module, an Equipment Front End Module (EFEM), and a transfer hand. There can be one or more of each type of module. The cleanliness requirement of the Equipment Front End Module is higher than that of the cleaning module, and the cleanliness requirement of the cleaning module is higher than that of the transfer hand.

[0034] The higher the cleanliness requirement, the lower the pressure difference setting value of the preset module, thus forming a pressure difference gradient distribution between the modules.

[0035] Step S102: Receive the real-time differential pressure detection values ​​of each preset module under the current operating conditions.

[0036] Specifically, by setting up differential pressure detection devices in each preset module, the pressure difference between the current position and atmospheric pressure is transmitted to the host computer via analog signals. The host computer then receives the real-time differential pressure detection values ​​of each preset module under the current operating conditions.

[0037] Step S103: Control the rotation speed of the air supply device of the corresponding preset module according to the differential pressure set value and the real-time differential pressure detection value to maintain the differential pressure gradient distribution.

[0038] During the operation of the wafer cleaning equipment, a series of interactions occur. For example, when transferring wafers, the wafers are transferred between different preset modules. At this time, the door for interaction between the corresponding preset modules is opened. The pressure difference between different modules is different, and the different pressure differences will cause interference. At this time, the detected real-time pressure difference value is inconsistent with the pressure difference set value. Based on this, the air supply device corresponding to each preset module is controlled in real time to make the real-time pressure difference detection value and the pressure difference set value of each preset module the same, so as to maintain the pressure difference gradient distribution.

[0039] This invention discloses an airflow control method for a wafer cleaning equipment. This method determines the differential pressure setting value for each preset module based on its cleanliness requirements, forming a differential pressure gradient distribution. It receives real-time differential pressure detection values ​​for each preset module under current operating conditions and controls the rotation speed of the air supply device for the corresponding preset module based on the differential pressure setting value and the real-time differential pressure detection value to maintain the differential pressure gradient distribution. This method enables the setting of differential pressure values ​​based on the different cleanliness requirements of each preset module during parallel cleaning. During wafer transfer, the exhaust volume is adjusted in real-time according to the pre-set differential pressure values, ensuring that particles flow from modules with higher cleanliness requirements to modules with lower cleanliness requirements, and finally exit through the plant exhaust duct. This avoids turbulence between modules during transfer operations, preventing pressure fluctuations and the possibility of particles flowing from lower-cleanliness modules to higher-cleanliness modules, thereby improving the cleaning effect.

[0040] In one embodiment, step S103 controls the rotation speed of the air supply device of the corresponding preset module according to the differential pressure set value and the real-time differential pressure detection value to maintain the differential pressure gradient distribution, including:

[0041] Step S1031: Determine whether the actual pressure difference of each preset module meets the pressure difference gradient distribution based on the real-time pressure difference detection value;

[0042] Step S1032: When the actual pressure difference of each preset module does not meet the pressure difference gradient distribution, the speed of the air supply device corresponding to each preset module is controlled according to the pressure difference setting value and the correspondence between the speed and pressure difference under the current operating condition. The correspondence between the speed and pressure difference under the current operating condition is obtained through pre-tuning.

[0043] Specifically, during wafer transfer, since the pressure difference requirements between preset modules are different, the host computer monitors the real-time pressure difference detection value of the relevant preset modules. When the actual pressure difference of each preset module is different from the pressure difference set value in the pressure difference gradient distribution, the rotation speed value is calculated according to the correspondence between rotation speed and pressure difference. This solution proposes a tuning and adjustment system, which has higher real-time performance and more precise control.

[0044] By judging in real time whether the actual pressure difference meets the pressure difference gradient distribution, and adjusting the speed of the air supply device according to the pre-set corresponding relationship, it is possible to monitor and provide precise control in real time, and realize closed-loop and complete feedback regulation.

[0045] In one embodiment, before S103 controls the rotation speed of the corresponding air supply device based on the differential pressure setpoint and the real-time differential pressure detection value to maintain the differential pressure gradient distribution, the method further includes:

[0046] S201, receives the real-time pressure detection value of the plant's exhaust duct under the current operating conditions;

[0047] S202 controls the opening of the plant's exhaust duct based on preset pressure values ​​and real-time pressure detection values.

[0048] The plant exhaust duct is prone to pressure fluctuations due to its connection to other equipment. This introduces additional variables into the pressure gradient control of the wafer cleaning equipment, increasing the difficulty of control. Therefore, a plant-side control system is proposed to control the real-time pressure of the plant exhaust duct. When the pressure value of the plant exhaust duct changes, it can be quickly detected and accurately adjusted, reducing control variables for the pressure gradient control of the wafer cleaning equipment and greatly improving the stability of system control.

[0049] Furthermore, S202 controls the opening of the plant exhaust duct based on preset pressure values ​​and real-time pressure detection values, including:

[0050] S2021, Determine whether the real-time pressure detection value is equal to the preset pressure value;

[0051] S2022, when the real-time pressure detection value is not equal to the preset pressure value, the opening of the plant exhaust duct is controlled according to the correspondence between the preset pressure value and the opening degree and pressure difference under the current operating conditions. The correspondence between the opening degree and pressure difference is obtained through pre-setting.

[0052] Specifically, the host computer sends control commands to the differential pressure regulating device, which then adjusts the opening of the plant's exhaust duct. The differential pressure regulating device can be a ball valve with controllable opening or other frequency converter equipment. This device can be installed on the plant's exhaust duct or it can be an independent controllable device with its duct connected to the plant's exhaust duct.

[0053] By determining whether the real-time pressure detection value is equal to the preset pressure value, and controlling the opening of the plant's exhaust duct according to the pre-set corresponding relationship, it can monitor and provide precise control in real time, achieving closed-loop and complete feedback regulation.

[0054] The following is combined with Figure 2 The specific wafer cleaning equipment shown illustrates the airflow control method of this embodiment of the invention.

[0055] Figure 2 The explanation is as follows:

[0056] 1) Figure 2 In the diagram, 1, 2, and 3 are the air supply devices of the wafer cleaning equipment, which are connected to the upper control system via serial communication and are named FFU1, FFU2, and FFU3 respectively.

[0057] 2) Mark 4, 5, and 6 are the differential pressure detection devices of each module in the wafer cleaning equipment. They feed back the pressure difference between the current position and atmospheric pressure to the host computer through analog signals and are named Diffpressure1, Diffpressure2, and Diffpressure3 respectively.

[0058] 3) Mark 7 and 8 as pressure testing devices for plant exhaust ducts, and name them Exhaust1 and Exhaust2 respectively;

[0059] 4) Mark 9, 10, 11, 12, 13, and 14 as cleaning modules, and name them C1, C2, C3, C4, C5, and C6 respectively;

[0060] 5) Mark 15 as EFFM, and 16, 17, and 18 as wafer temporary storage stations, named WS1, WS2, and WS3 respectively;

[0061] 6) Mark 19 and 20 as plant exhaust ducts, and 21 and 22 as pressure regulating devices on the plant exhaust ducts, named BL1 and BL2 respectively;

[0062] 7) Mark 23 as the host computer, and 24 and 25 as the transmitters, named CR1 and CR2 respectively;

[0063] 8) The air supply device marked 26 as C3 is named FFU4, the air supply device marked 27 as C4 is named FFU5, the air supply device marked 28 as C5 is named FFU6, and the air supply device marked 29 as C6 is named FFU7.

[0064] 9) The differential pressure detection device inside C3 is marked 30 and named Diffpressure4; the differential pressure detection device inside C4 is named Diffpressure5; the differential pressure detection device inside C5 is named Diffpressure6; and the differential pressure detection device inside C6 is named Diffpressure7.

[0065] 10) All differential pressure detection devices feed back the current differential pressure value to the host computer via analog signals. The host computer controls the rotation speed of the module's air supply device via serial communication. The host computer also controls the exhaust volume of the plant's exhaust duct via analog signals using the electro-proportional valve. The transmission path of this wafer cleaning equipment is as follows: Figure 3 As shown, the C2 module wafer enters C3 or C4 through CR1 for high-level cleaning and drying, then is placed into WS3 through CR2, and finally flows into EFFM. The C1 module wafer enters WS2 through CR1, is taken out through CR2 and placed into C5 or C6 for high-level cleaning and drying, and finally flows into EFFM.

[0066] 11) Before operating the equipment, perform self-tuning. Self-tuning is divided into two parts: air supply and exhaust. Taking CR1 as an example, the specific operation for air supply tuning is as follows: Completely close BL1, i.e., close the plant exhaust, and turn on FFU1 alone, continuously adjusting its speed. The purpose is to adjust the differential pressure value of this module to be consistent with the differential pressure value required by the plant exhaust duct. Record the speed of FFU1 as s1. Then increase the speed of FFU1 to increase the differential pressure intensity. Record the speed of FFU1 several times in units of 5Pa. Record the speed of FFU1 as s2, s3, ..., sn. Finally, fit the speed and differential pressure to obtain the relationship between the differential pressure and the speed. To obtain a better correspondence between speed and differential pressure, the fitting should be performed no less than 4 times. The tuning operation method for the exhaust is: Close FFU1, ... The host computer controls the opening of BL1 to adjust the differential pressure value to the required value of the equipment. At this time, the opening of BL1 is recorded as OP1. Then, the opening of BL1 is continuously increased or decreased in units of 5Pa to adjust the differential pressure value. The opening of BL1 is recorded as OP2, OP3, ..., OPn in sequence. Finally, the opening and differential pressure are fitted at least 4 times to obtain the corresponding relationship between the opening and differential pressure. CR2, C3, C4, C5, C6, EFFM are adjusted in sequence. The adjustment unit of 5Pa and the number of fitting times can be increased or decreased according to actual needs and control accuracy. When adjusting the air supply section, multiple modules can also be adjusted simultaneously according to the actual transmission path required by the wafer. In this way, the fault tolerance of the host computer's control system will be higher during actual operation.

[0067] 12) In this wafer cleaning equipment, EFFM has the highest cleanliness requirement, followed by C3, C4, C5, C6, and finally CR2 and CR1. Therefore, during the operation of the equipment, it is necessary to ensure that the value of Diffpressure3 is greater than that of Diffpressure4, Diffpressure5, Diffpressure6, and Diffpressure7, which are greater than that of Diffpressure1 and Diffpressure2. The arrangement of the above pressure difference values ​​is the pressure difference gradient distribution in the embodiment of the present invention.

[0068] 13) During the operation of the wafer cleaning equipment, the host computer first adjusts the opening of BL1 and BL2 in real time according to the obtained correspondence between the opening degree and the pressure difference to ensure that the values ​​of Exhaust1 and Exhaust2 meet the requirements. When transferring wafers, taking CR1 and C3 as an example, CR1 transports the wafer to C3. The interactive door on the left side of C3 opens. At this time, the pressure difference at CR1 will interfere with the pressure difference at C3. The host computer automatically calculates the pressure difference by using the data uploaded by Diffpressure1 and Diffpressure4 and combining it with the set pressure difference gradient. Then, it sends the target rotation speed to FFU1 and FFU4 to maintain the pressure difference gradient distribution and prevent particles from CR1 from entering the C3 module. This feedback, calculation, sending and execution process is the adjustment method.

[0069] An embodiment of the present invention provides an airflow control method for a wafer cleaning equipment. During the wafer transfer process, the exhaust volume is adjusted in real time according to a pre-set differential pressure value. This ensures that particles flow from modules with higher cleanliness requirements to modules with lower cleanliness requirements, and finally flow out through the plant exhaust duct. This avoids turbulence between modules during the transfer operation, which could cause fluctuations in the differential pressure between modules and potentially allow particles to flow from modules with lower cleanliness requirements to modules with higher cleanliness requirements, thereby improving the cleaning effect.

[0070] In addition, the exhaust ducts of each module are connected to the plant exhaust system, and the plant exhaust system is affected by the operation of other equipment, which causes the air pressure of the exhaust ducts to fluctuate. To address this phenomenon, this embodiment of the invention detects the real-time pressure value of the plant exhaust duct and controls the opening of the plant exhaust duct in real time. Combined with the air supply device of the equipment, the pressure differential gradient required by the wafer cleaning equipment can be controlled more quickly and accurately.

[0071] This invention also provides an airflow control device for wafer cleaning equipment, such as... Figure 4 As shown, the device includes a host computer and an air supply device and a first air pressure detection device connected to the host computer. The air supply device is installed at the air outlet of each preset module in the wafer cleaning equipment to provide airflow to each preset module. The first air pressure detection device is installed in each preset module to obtain the real-time differential pressure detection value of each preset module. The host computer includes a memory and a processor, which are interconnected. The memory stores computer instructions, and the processor executes the computer instructions to perform the airflow control method of the wafer cleaning equipment according to any of the above embodiments.

[0072] Furthermore, the airflow control equipment of the wafer cleaning equipment also includes an exhaust duct control system and a second air pressure detection device, which are respectively connected to the host computer. The second air pressure detection device is installed in the plant exhaust duct and is used to obtain the real-time pressure detection value of the plant exhaust duct. The exhaust duct control system is used to control the opening of the exhaust duct according to the control instructions of the host computer.

[0073] This invention discloses an airflow control device for a wafer cleaning equipment. This device determines the differential pressure setting value for each preset module based on its cleanliness requirements, forming a differential pressure gradient distribution. It receives real-time differential pressure detection values ​​for each preset module under current operating conditions and controls the rotation speed of the air supply device for the corresponding preset module based on the differential pressure setting value and the real-time differential pressure detection value to maintain the differential pressure gradient distribution. This allows for setting differential pressure values ​​according to the different cleanliness requirements of each preset module during parallel cleaning. During wafer transfer, the exhaust volume is adjusted in real-time based on the pre-set differential pressure values, ensuring that particles flow from modules with higher cleanliness requirements to modules with lower cleanliness requirements, and finally exit through the plant exhaust duct. This avoids turbulence between modules during transfer operations, preventing pressure fluctuations and the possibility of particles flowing from lower-cleanliness modules to higher-cleanliness modules, thereby improving the cleaning effect.

[0074] The present invention also provides an airflow control device for wafer cleaning equipment, such as... Figure 5 As shown, it includes:

[0075] The differential pressure determination module 501 is used to determine the differential pressure setting value corresponding to each preset module according to the cleanliness requirements of each preset module in the wafer cleaning equipment, forming a differential pressure gradient distribution. The higher the cleanliness requirement of the preset module, the larger the corresponding differential pressure setting value.

[0076] The detection value receiving module 502 is used to receive the real-time differential pressure detection values ​​of each preset module under the current operating conditions.

[0077] The speed control module 503 is used to control the speed of the air supply device of the corresponding preset module according to the differential pressure set value and the real-time differential pressure detection value to maintain the differential pressure gradient distribution.

[0078] The airflow control device of the wafer cleaning equipment in this embodiment of the invention determines the differential pressure setting value corresponding to each preset module according to the cleanliness requirements of each preset module in the wafer cleaning equipment, forming a differential pressure gradient distribution. It receives the real-time differential pressure detection value of each preset module under the current operating conditions, and controls the rotation speed of the air supply device of the corresponding preset module according to the differential pressure setting value and the real-time differential pressure detection value to maintain the differential pressure gradient distribution. It can set the differential pressure setting value according to the different cleanliness requirements of the preset modules when multiple modules are cleaning in parallel. During the wafer transfer process, it adjusts the exhaust volume in real time according to the set differential pressure setting value to ensure that particles flow from the module with a high cleanliness requirement level to the module with a low cleanliness requirement level, and finally flow out through the plant exhaust duct. This avoids the situation where turbulence occurs between modules during the transfer operation, causing fluctuations in the differential pressure between modules, and particles may flow from the module with a low cleanliness requirement level to the module with a high cleanliness requirement level, thereby improving the cleaning effect.

[0079] Furthermore, the speed control module 503 includes:

[0080] The module differential pressure judgment module is used to determine whether the actual differential pressure of each preset module meets the differential pressure gradient distribution based on the real-time differential pressure detection value.

[0081] The differential pressure control module is used to control the speed of the air supply device corresponding to each preset module according to the differential pressure set value and the correspondence between the speed and differential pressure under the current operating condition when the actual differential pressure of each preset module does not meet the differential pressure gradient distribution. The correspondence between the speed and differential pressure under the current operating condition is obtained through pre-tuning.

[0082] Furthermore, the airflow control device for the wafer cleaning equipment also includes:

[0083] The pipeline pressure receiving module is used to receive the real-time pressure detection value of the plant's exhaust pipeline under the current operating conditions.

[0084] The opening control module is used to control the opening of the plant's exhaust ducts based on preset pressure values ​​and real-time pressure detection values.

[0085] Furthermore, the opening control module includes:

[0086] The pipeline pressure judgment module is used to determine whether the real-time pressure detection value is equal to the preset pressure value;

[0087] The pressure control module is used to control the opening of the plant exhaust duct according to the preset pressure value and the correspondence between the opening and the differential pressure under the current operating conditions when the real-time pressure detection value is not equal to the preset pressure value. The correspondence between the opening and the differential pressure is obtained through pre-setting.

[0088] Furthermore, the preset module includes a cleaning module, a front-end module, and a transfer hand. The cleanliness requirement of the front-end module is higher than that of the cleaning module, and the cleanliness requirement of the cleaning module is higher than that of the transfer hand.

[0089] This invention also provides a computer-readable storage medium. The methods described above according to embodiments of the invention can be implemented in hardware or firmware, or implemented as computer code that can be recorded on a storage medium, or implemented as computer code downloaded via a network and originally stored on a remote storage medium or a non-transitory machine-readable storage medium and then stored on a local storage medium. Thus, the methods described herein can be processed by software stored on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. The storage medium can be a magnetic disk, optical disk, read-only memory, random access memory, flash memory, hard disk, or solid-state drive, etc.; further, the storage medium can also include combinations of the above types of memory. It is understood that computers, processors, microprocessor controllers, or programmable hardware include storage components capable of storing or receiving software or computer code, which, when accessed and executed by the computer, processor, or hardware, implements the methods shown in the above embodiments.

[0090] A portion of this invention can be applied as a computer program product, such as computer program instructions, which, when executed by a computer, can invoke or provide the methods and / or technical solutions according to the invention through the operation of the computer. Those skilled in the art will understand that the forms in which computer program instructions exist in a computer-readable medium include, but are not limited to, source files, executable files, installation package files, etc. Correspondingly, the ways in which computer program instructions are executed by a computer include, but are not limited to: the computer directly executing the instructions, or the computer compiling the instructions and then executing the corresponding compiled program, or the computer reading and executing the instructions, or the computer reading and installing the instructions and then executing the corresponding installed program. Here, the computer-readable medium can be any available computer-readable storage medium or communication medium accessible to a computer.

[0091] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A method for controlling the airflow of a wafer cleaning equipment, characterized in that, include: Based on the cleanliness requirements of each preset module in the wafer cleaning equipment, the pressure difference setting value corresponding to each preset module is determined to form a pressure difference gradient distribution. The higher the cleanliness requirement of the preset module, the larger the corresponding pressure difference setting value. Receive the real-time differential pressure detection values ​​of each preset module under the current operating conditions; The rotation speed of the air supply device of the corresponding preset module is controlled according to the differential pressure setting value and the real-time differential pressure detection value to maintain the differential pressure gradient distribution. When multiple preset modules are cleaned in parallel, the differential pressure setting value is set according to the different cleanliness requirements of the preset modules. During the wafer transfer process, the exhaust volume is adjusted in real time according to the set differential pressure setting value so that the particles flow from the preset module with a high cleanliness requirement level to the preset module with a low cleanliness requirement level. The step of controlling the rotation speed of the air supply device of the corresponding preset module according to the differential pressure set value and the real-time differential pressure detection value to maintain the differential pressure gradient distribution includes: Based on the real-time differential pressure detection value, it is determined whether the actual differential pressure of each preset module meets the differential pressure gradient distribution; when the actual differential pressure of each preset module does not meet the differential pressure gradient distribution, the speed of the air supply device corresponding to each preset module is controlled according to the differential pressure setting value and the correspondence between the speed and differential pressure under the current operating condition, wherein the correspondence between the speed and differential pressure under the current operating condition is obtained through pre-tuning; The preset module includes a cleaning module, a device front-end module, and a transmission hand. The cleanliness requirement of the device front-end module is higher than that of the cleaning module, and the cleanliness requirement of the cleaning module is higher than that of the transmission hand.

2. The airflow control method for the wafer cleaning equipment according to claim 1, characterized in that, Before controlling the rotational speed of the corresponding air supply device according to the differential pressure setpoint and the real-time differential pressure detection value to maintain the differential pressure gradient distribution, the method further includes: Receive real-time pressure detection values ​​of the plant's exhaust ducts under current operating conditions; The opening degree of the plant's exhaust duct is controlled according to the preset pressure value and the real-time pressure detection value.

3. The airflow control method for the wafer cleaning equipment according to claim 2, characterized in that, The control of the opening degree of the plant exhaust duct based on the preset pressure value and the real-time pressure detection value includes: Determine whether the real-time pressure detection value is equal to the preset pressure value; When the real-time pressure detection value is not equal to the preset pressure value, the opening of the plant exhaust duct is controlled according to the correspondence between the preset pressure value and the opening degree and pressure difference under the current operating conditions. The correspondence between the opening degree and pressure difference is obtained through pre-setting.

4. An airflow control device for a wafer cleaning equipment, characterized in that, include: The differential pressure determination module is used to determine the differential pressure setting value corresponding to each preset module according to the cleanliness requirements of each preset module in the wafer cleaning equipment, forming a differential pressure gradient distribution. The higher the cleanliness requirement of the preset module, the larger the corresponding differential pressure setting value. The detection value receiving module is used to receive the real-time differential pressure detection values ​​of each preset module under the current operating conditions; The speed control module is used to control the speed of the air supply device of the corresponding preset module according to the pressure difference set value and the real-time pressure difference detection value to maintain the pressure difference gradient distribution. When multiple preset modules are cleaned in parallel, the pressure difference set value is set according to the different cleanliness requirements of the preset modules. During the wafer transfer process, the exhaust volume is adjusted in real time according to the set pressure difference set value so that the particles flow from the preset module with a high cleanliness requirement level to the preset module with a low cleanliness requirement level. The speed control module includes: The module differential pressure judgment module is used to determine whether the actual differential pressure of each preset module meets the differential pressure gradient distribution based on the real-time differential pressure detection value. The differential pressure control module is used to control the speed of the air supply device corresponding to each preset module according to the differential pressure set value and the correspondence between the speed and differential pressure under the current operating condition when the actual differential pressure of each preset module does not meet the differential pressure gradient distribution. The correspondence between the speed and differential pressure under the current operating condition is obtained through pre-tuning. The preset module includes a cleaning module, a device front-end module, and a transmission hand. The cleanliness requirement of the device front-end module is higher than that of the cleaning module, and the cleanliness requirement of the cleaning module is higher than that of the transmission hand.

5. An airflow control device for a wafer cleaning equipment, characterized in that, It includes a host computer, an air supply device and a first air pressure detection device respectively connected to the host computer; The air supply device is installed at the air supply port of each preset module in the wafer cleaning equipment to provide air intake for each preset module; The first wind pressure detection device is installed in each preset module to obtain the real-time differential pressure detection value of each preset module; The host computer includes a memory and a processor, which are interconnected. The memory stores computer instructions, and the processor executes the computer instructions to perform the airflow control method of the wafer cleaning equipment according to any one of claims 1 to 3.

6. The airflow control device for the wafer cleaning equipment according to claim 5, characterized in that, It also includes an exhaust duct control system and a second air pressure detection device, which are respectively connected to the host computer; The second air pressure detection device is installed inside the plant exhaust duct and is used to obtain the real-time pressure detection value of the plant exhaust duct; The exhaust duct control system is used to control the opening degree of the exhaust duct according to the control instructions of the host computer.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions for causing the computer to execute the airflow control method of the wafer cleaning equipment according to any one of claims 1 to 3.

8. A computer program product, characterized in that, Includes computer instructions for causing a computer to execute the airflow control method for a wafer cleaning apparatus as described in any one of claims 1 to 3.

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