A high-thermal-insulation composite silicate board and a preparation method thereof

Abstract

The application relates to the technical field of building materials, and discloses a high-thermal-insulation composite silicate board and a preparation method thereof. The high-thermal-insulation composite silicate board comprises the following components by weight: 100-120 parts of silicate cement, 6-10 parts of a flame retardant, 1-2 parts of a water reducing agent, 4-6 parts of a foaming agent, 1-3 parts of a thickening agent, 3-5 parts of expanded perlite, 20-30 parts of modified lignin fiber and 70-80 parts of water. The modified lignin fiber is obtained by modifying lignin fiber with stearic acid diethanolamide and 4-(octadecyl aminocarbonyl) methyl benzoate. The technical scheme solves the problems of low thermal insulation and low compressive strength of the silicate board in the prior art.

Description

Technical Field

[0001] This invention relates to the field of building materials technology, specifically to a high-insulation composite silicate board and its preparation method. Background Technology

[0002] Silicate boards, as an important building material, are widely used in the current construction industry. These boards typically possess excellent thermal insulation properties and superior environmental performance, thus gaining market favor. They can be used in interior buildings, industrial areas, schools, and other buildings as firewalls or for enclosing air ducts. Furthermore, they can be used in the ceiling decoration of high-rise buildings, not only regulating indoor temperature but also providing insulation against cold in winter and heat in summer. Silicate boards also have sound absorption and noise reduction functions, making them suitable for use in places with high privacy and sound insulation requirements. However, silicate boards are brittle and easily damaged during transportation and construction, affecting their thermal insulation performance and threatening the stability of the building structure. Therefore, there is a need to develop a high-compressive-strength, thermally insulating composite silicate board. Summary of the Invention

[0003] This invention proposes a high-insulation composite silicate board and its preparation method, which solves the problems of low insulation and compressive strength of silicate boards in related technologies.

[0004] The technical solution of the present invention is as follows: This invention proposes a high-insulation composite silicate board, comprising the following raw materials in parts by weight: 100-120 parts silicate cement, 6-10 parts flame retardant, 1-2 parts water-reducing agent, 4-6 parts foaming agent, 1-3 parts thickener, 3-5 parts expanded perlite, 20-30 parts modified lignin fiber, and 70-80 parts water; wherein the modified lignin fiber is obtained by modifying lignin fiber with stearic acid diethanolamide and methyl 4-(octadecylcarbamoyl)benzoate.

[0005] As a further technical solution, the mass ratio of stearic acid diethanolamide to methyl 4-(octadecylcarbamoyl)benzoate is 1~3:1.

[0006] In this invention, by limiting the mass ratio of stearic acid diethanolamide to methyl 4-(octadecylcarbamoyl)benzoate to 1~3:1, the thermal insulation and compressive strength of silicate boards are further improved.

[0007] As a further technical solution, the mass ratio of stearic acid diethanolamide to methyl 4-(octadecylcarbamoyl)benzoate is 2:1.

[0008] As a further technical solution, the combined mass of the added stearic acid diethanolamide and methyl 4-(octadecylcarbamoyl)benzoate is 2% to 4% of the mass of the lignin fiber.

[0009] In this invention, by limiting the combined mass of stearic acid diethanolamide and methyl 4-(octadecylcarbamoyl)benzoate to 2%~4% of the mass of lignin fiber, the thermal insulation and compressive strength of silicate boards are further improved.

[0010] As a further technical solution, the combined mass of the added stearic acid diethanolamide and methyl 4-(octadecylcarbamoyl)benzoate is 3% of the mass of the lignin fiber.

[0011] As a further technical solution, the lignin fiber has a diameter of 10~20μm and a length of 1~3mm.

[0012] As a further technical solution, the preparation method of modified lignin fiber includes the following steps: adding lignin fiber, stearic acid diethanolamide and methyl 4-(octadecylcarbamoyl)benzoate to N,N-dimethylformamide for modification, and obtaining modified lignin fiber by filtration and drying.

[0013] As a further technical solution, the modification temperature is 50~60℃ and the modification time is 2~4h.

[0014] As a further technical solution, the flame retardant includes one or more of aluminum hydroxide, antimony trioxide, and magnesium oxide.

[0015] As a further technical solution, the water-reducing agent is a polycarboxylate-type water-reducing agent.

[0016] As a further technical solution, the polycarboxylate superplasticizer includes one or more of polycarboxylate superplasticizer PC-615, polycarboxylate superplasticizer PC-303, and polycarboxylate superplasticizer PC-1006.

[0017] As a further technical solution, the polycarboxylate superplasticizer PC-615 was purchased from Liaoning Hengda New Material Co., Ltd.; the polycarboxylate superplasticizer PC-303 was purchased from Wuhan Huaxuan High-Tech Co., Ltd.; and the polycarboxylate superplasticizer PC-1006 was purchased from Wuhan Huaxuan High-Tech Co., Ltd.

[0018] As a further technical solution, the foaming agent includes one or more of hydrogen peroxide, n-hexane, and sodium dodecyl sulfate.

[0019] As a further technical solution, the thickener includes one or more of hydroxyethyl cellulose, bentonite, and sodium carboxymethyl cellulose.

[0020] As a further technical solution, the expanded perlite has a particle size of 40-100 mesh.

[0021] This invention also proposes a method for preparing a high-insulation composite silicate board, comprising the following steps: S1. Mix silicate cement, flame retardant, water-reducing agent, thickener, expanded perlite, modified lignin fiber, and water to obtain a mixture. S2. Add foaming agent to the mixture and stir to obtain slurry; S3. The slurry is injected into the mold and cured. After demolding and curing, a high-insulation composite silicate board is obtained.

[0022] As a further technical solution, the curing time in S3 is 28 days.

[0023] The working principle and beneficial effects of this invention are as follows: In this invention, the addition of a water-reducing agent can reduce the amount of water used and enhance fluidity, thereby improving the strength of the composite silicate board and reducing shrinkage and cracking. The microporous structure inside expanded perlite can form an air layer, and adding expanded perlite to the composite silicate board can improve its thermal insulation performance. The addition of lignin fiber can improve the toughness of the composite silicate board. However, due to hydrogen bonding, the lignin fibers exhibit severe agglomeration. In this invention, lignin fibers are modified using stearic acid diethanolamide and methyl 4-(octadecylcarbamoyl)benzoate, which fully utilizes the three-dimensional network structure of lignin fibers, thereby improving the thermal insulation and compressive strength of the composite silicate board and solving the problem of poor thermal insulation and compressive strength of the composite silicate board. Detailed Implementation

[0024] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0025] In the following embodiments and comparative examples: Lignin fibers, with a diameter of 10~20μm and a length of 1~3mm, were purchased from Fuzhou Sifang Chemical Co., Ltd. Expanded perlite, particle size 40-100 mesh, purchased from Fanxian Puyue Building Insulation Materials Co., Ltd. Polycarboxylate superplasticizer PC-615 was purchased from Liaoning Hengda New Materials Co., Ltd. Polycarboxylate superplasticizer PC-303 was purchased from Wuhan Huaxuan High-Tech Co., Ltd. Polycarboxylate superplasticizer PC-1006 was purchased from Wuhan Huaxuan High-Tech Co., Ltd. Bentonite, type 12, purchased from Hebei Yousheng Refractory Materials Co., Ltd. Silicate cement, model KB-30, purchased from Jinhua Kunbang Decoration Materials Co., Ltd.

[0026] Example 1 A method for preparing a high-insulation composite silicate board includes the following steps: S1. Mix 100 parts silicate cement, 6 parts aluminum hydroxide, 1 part polycarboxylate superplasticizer PC-615, 1 part hydroxyethyl cellulose, 3 parts expanded perlite (40-100 mesh), 20 parts modified lignin fiber, and 70 parts water to obtain a mixture. S2. Add 4 parts hydrogen peroxide to the mixture and stir to obtain a slurry; S3. The slurry is injected into the mold and cured. After demolding and curing for 28 days, a high-insulation composite silicate board is obtained.

[0027] Preparation method of modified lignin fiber: 60g of lignin fiber (diameter 10~20μm, length 1~3mm), 0.2g of stearic acid diethanolamide and 0.4g of methyl 4-(octadecylcarbamoyl)benzoate were added to 300mL of N,N-dimethylformamide and stirred at 50℃ for 4h. After filtration and drying, modified lignin fiber was obtained.

[0028] Example 2 A method for preparing a high-insulation composite silicate board includes the following steps: S1. Mix 110 parts silicate cement, 8 parts antimony trioxide, 1.5 parts polycarboxylate superplasticizer PC-303, 2 parts bentonite, 4 parts expanded perlite (40-100 mesh), 25 parts modified lignin fiber, and 75 parts water to obtain a mixture. S2. Add 5 parts of n-hexane to the mixture and stir to obtain a slurry; S3. The slurry is injected into the mold and cured. After demolding and curing for 28 days, a high-insulation composite silicate board is obtained.

[0029] Preparation method of modified lignin fiber: 60g of lignin fiber (diameter 10~20μm, length 1~3mm), 0.2g of stearic acid diethanolamide and 0.4g of methyl 4-(octadecylcarbamoyl)benzoate were added to 300mL of N,N-dimethylformamide and stirred at 55℃ for 3h. After filtration and drying, modified lignin fiber was obtained.

[0030] Example 3 A method for preparing a high-insulation composite silicate board includes the following steps: S1. Mix 120 parts silicate cement, 10 parts magnesium oxide, 2 parts polycarboxylate superplasticizer PC-1006, 3 parts sodium carboxymethyl cellulose, 5 parts expanded perlite (40-100 mesh), 30 parts modified lignin fiber, and 80 parts water to obtain a mixture. S2. Add 6 parts of sodium dodecyl sulfate to the mixture and stir to obtain a slurry; S3. The slurry is injected into the mold and cured. After demolding and curing for 28 days, a high-insulation composite silicate board is obtained.

[0031] Preparation method of modified lignin fiber: 60g of lignin fiber (diameter 10~20μm, length 1~3mm), 0.2g of stearic acid diethanolamide and 0.4g of methyl 4-(octadecylcarbamoyl)benzoate were added to 300mL of N,N-dimethylformamide and stirred at 60℃ for 2h. After filtration and drying, modified lignin fiber was obtained.

[0032] Example 4 The only difference between this embodiment and Example 1 is that the amount of stearic acid diethanolamide added is 0.48g and the amount of methyl 4-(octadecylcarbamoyl)benzoate added is 0.12g.

[0033] Example 5 The only difference between this embodiment and Example 1 is that the amount of stearic acid diethanolamide added is 0.3g, and the amount of methyl 4-(octadecylcarbamoyl)benzoate added is 0.3g.

[0034] Example 6 The only difference between this embodiment and Example 1 is that the amount of stearic acid diethanolamide added is 0.4g, and the amount of methyl 4-(octadecylcarbamoyl)benzoate added is 0.2g.

[0035] Example 7 The only difference between this embodiment and Example 1 is that the amount of stearic acid diethanolamide added is 0.45g and the amount of methyl 4-(octadecylcarbamoyl)benzoate added is 0.15g.

[0036] Example 8 The only difference between this embodiment and Example 6 is that the amount of stearic acid diethanolamide added is 2g, and the amount of methyl 4-(octadecylcarbamoyl)benzoate added is 1g.

[0037] Example 9 The only difference between this embodiment and Example 6 is that the amount of stearic acid diethanolamide added is 0.8g, and the amount of methyl 4-(octadecylcarbamoyl)benzoate added is 0.4g.

[0038] Example 10 The only difference between this embodiment and Example 6 is that the amount of stearic acid diethanolamide added is 1.2g, and the amount of methyl 4-(octadecylcarbamoyl)benzoate added is 0.6g.

[0039] Example 11 The only difference between this embodiment and Example 6 is that the amount of stearic acid diethanolamide added is 1.6g, and the amount of methyl 4-(octadecylcarbamoyl)benzoate added is 0.8g.

[0040] Comparative Example 1 A method for preparing a high-insulation composite silicate board includes the following steps: S1. Mix 100 parts silicate cement, 6 parts aluminum hydroxide, 1 part polycarboxylate superplasticizer PC-615, 1 part hydroxyethyl cellulose, 3 parts expanded perlite (40-100 mesh), 20 parts lignin fiber (diameter 10~20μm, length 1~3mm), and 70 parts water to obtain a mixture. S2. Add 4 parts hydrogen peroxide to the mixture and stir to obtain a slurry; S3. The slurry is injected into the mold and cured. After demolding and curing for 28 days, a high-insulation composite silicate board is obtained.

[0041] Comparative Example 2 The only difference between this comparative example and Example 1 is that stearic acid diethanolamide is not added.

[0042] Comparative Example 3 The only difference between this comparative example and Example 1 is that methyl 4-(octadecylcarbamoyl)benzoate is not added.

[0043] The thermal conductivity of the composite silicate boards in Examples 1-11 and Comparative Examples 1-3 was tested according to the method in GB / T 10294-2008 "Determination of Steady-State Thermal Resistance and Related Properties of Thermal Insulation Materials - Protective Hot Plate Method"; the compressive strength was tested according to the method in GB / T5486-2008 "Test Methods for Inorganic Rigid Thermal Insulation Products"; the test results are shown in Table 1.

[0044] Table 1 Performance test results of composite silicate boards in Examples 1-11 and Comparative Examples 1-3

[0045] Compared with Example 1, Comparative Example 1 added unmodified lignin fibers, Comparative Example 2 modified lignin fibers only with methyl 4-(octadecylcarbamoyl)benzoate, and Comparative Example 3 modified lignin fibers only with diethanolamide stearate. The results showed that the compressive strength of the composite silicate boards in Comparative Examples 1 to 3 was lower than that in Example 1, while the thermal conductivity was higher than that in Example 1. This indicates that modifying lignin fibers with both methyl 4-(octadecylcarbamoyl)benzoate and diethanolamide stearate can improve the compressive strength of the composite silicate board and reduce the thermal conductivity.

[0046] Compared with Example 1, Examples 4-7 varied the mass ratio of stearic acid diethanolamide and methyl 4-(octadecylcarbamoyl)benzoate. The results showed that the compressive strength of the composite silicate boards in Examples 5-7 was higher than that in Examples 1 and 4, while the thermal conductivity was lower than that in Examples 1 and 4. This indicates that when the mass ratio of stearic acid diethanolamide to methyl 4-(octadecylcarbamoyl)benzoate is 1-3:1, the compressive strength of the composite silicate board can be further improved and the thermal conductivity can be reduced. Comparing Examples 5-7, it was found that the compressive strength of the composite silicate board in Example 6 was higher than that in Examples 5 and 7, while the thermal conductivity was lower than that in Examples 5 and 7. This indicates that when the mass ratio of stearic acid diethanolamide to methyl 4-(octadecylcarbamoyl)benzoate is 2:1, the composite silicate board obtained has the highest compressive strength and the lowest thermal conductivity.

[0047] Compared with Example 6, Examples 8-11 varied the amount of stearic acid diethanolamide and methyl 4-(octadecylcarbamoyl)benzoate added. The results showed that the compressive strength of the composite silicate board in Examples 9-11 was higher than that in Examples 6 and 8, and the thermal conductivity was lower than that in Examples 6 and 8. This indicates that when the total mass of stearic acid diethanolamide and methyl 4-(octadecylcarbamoyl)benzoate added is 2% to 4% of the mass of lignin fiber, the compressive strength of the composite silicate board can be further improved and the thermal conductivity can be reduced. Comparing Examples 9-11, it was found that the compressive strength of the composite silicate board in Example 10 was higher than that in Examples 9 and 11, and the thermal conductivity was lower than that in Examples 9 and 11. This indicates that when the total mass of stearic acid diethanolamide and methyl 4-(octadecylcarbamoyl)benzoate added is 3% of the mass of lignin fiber, the composite silicate board obtained has the highest compressive strength and the lowest thermal conductivity.

[0048] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-insulation composite silicate board, characterized in that, Raw materials comprising the following components by weight: 100-120 parts silicate cement, 6-10 parts flame retardant, 1-2 parts water-reducing agent, 4-6 parts foaming agent, 1-3 parts thickener, 3-5 parts expanded perlite, 20-30 parts modified lignin fiber, and 70-80 parts water. The modified lignin fiber is obtained by modifying lignin fiber with stearic acid diethanolamide and methyl 4-(octadecylcarbamoyl)benzoate.

2. The high-insulation composite silicate board according to claim 1, characterized in that, The mass ratio of stearic acid diethanolamide to methyl 4-(octadecylcarbamoyl)benzoate is 1~3:

1.

3. The high-insulation composite silicate board according to claim 1, characterized in that, The combined mass of the added stearic acid diethanolamide and methyl 4-(octadecylcarbamoyl)benzoate is 2% to 4% of the mass of the lignin fiber.

4. The high-insulation composite silicate board according to claim 1, characterized in that, The lignin fibers have a diameter of 10~20μm and a length of 1~3mm.

5. The high-insulation composite silicate board according to claim 1, characterized in that, The flame retardant includes one or more of aluminum hydroxide, antimony trioxide, and magnesium oxide.

6. The high-insulation composite silicate board according to claim 1, characterized in that, The water-reducing agent is a polycarboxylate-type water-reducing agent.

7. The high-insulation composite silicate board according to claim 1, characterized in that, The foaming agent includes one or more of hydrogen peroxide, n-hexane, and sodium dodecyl sulfate.

8. The high-insulation composite silicate board according to claim 1, characterized in that, The thickener includes one or more of hydroxyethyl cellulose, bentonite, and sodium carboxymethyl cellulose.

9. A high-insulation composite silicate board according to claim 1, characterized in that, The expanded perlite has a particle size of 40-100 mesh.

10. A method for preparing a high-insulation composite silicate board according to any one of claims 1 to 9, characterized in that, Includes the following steps: S1. Mix silicate cement, flame retardant, water-reducing agent, thickener, expanded perlite, modified lignin fiber, and water to obtain a mixture. S2. Add foaming agent to the mixture and stir to obtain slurry; S3. The slurry is injected into the mold and cured. After demolding and curing, a high-insulation composite silicate board is obtained.

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