A filter device and thin film deposition apparatus

CN118543176BActive Publication Date: 2026-09-22PIOTECH (SHANGHAI) CO LTD
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Patent Information

Application Number
CN202410606642.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-05-15
Publication Date
2026-09-22
Estimated Expiration
2044-05-15

AI Technical Summary

Technical Problem

[0004]本发明的实施例提供了一种过滤装置及薄膜沉积设备,旨在解决现有的过滤装置内部的副产物累积较多导致过滤效果差的问题

Benefits of technology

[0017]本发明提供一种过滤装置及薄膜沉积设备,该过滤装置包括壳体、滤芯和衬套,滤芯安装在壳体的内部,衬套套设在滤芯的外侧壁与壳体的内侧壁之间,壳体具有温控功能,可以使得壳体内部未完全反应气体反应从而附着在壳体的内侧壁、衬套的内侧壁和衬套的外侧壁上,一方面在壳体的内侧壁、衬套的内侧壁和衬套的外侧壁中的至少任一者的表面上设置粗糙面,提高了侧壁表面的粗糙程度,从而提高了对副产物的吸附能力;另一方面将壳体的内侧壁、衬套的内侧壁和衬套的外侧壁中的至少任一者的纵截面设有变径截面,提高侧壁的表面积,从而增大了与未完全反应气体的接触面积,以此提高对副产物的吸附能力;由此,通过增大粗糙程度和增加有效接触面积,提升了过滤装置对副产物的吸附能力,减轻了滤芯的过滤负担,提高了过滤效果,进而延长了过滤装置的使用时间,减少维护的次数进而增大了产线的产能。

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Abstract

The application discloses a filtering device and a thin film deposition equipment, the filtering device comprises a shell, a filter core and a bushing, the filter core is installed in the inside of the shell, the bushing is sleeved between the outside wall of the filter core and the inside wall of the shell, the shell is configured to have a temperature control function, so that the unreacted gas in the inside of the shell is reacted and attached to the inside wall of the shell, the inside wall of the bushing and the outside wall of the bushing; wherein the surface of at least any one of the inside wall of the shell, the inside wall of the bushing and the outside wall of the bushing is provided with a rough surface; and / or the longitudinal section of at least any one of the inside wall of the shell, the inside wall of the bushing and the outside wall of the bushing is provided with a variable diameter section. The application improves the adsorption capacity of the filtering device to by-products by increasing the roughness and increasing the effective contact area, reduces the filtering burden of the filter core and prolongs the service life.
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Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more particularly to a filtration device and a thin film deposition apparatus. Background Technology

[0002] In the core equipment of semiconductor thin film manufacturing, the reaction chamber system, effective management of byproduct generation and treatment is crucial to ensuring production quality and efficiency. Traditionally, cleaning the reaction chamber using plasma or specific reactive gases is a common method to remove byproducts that may affect subsequent processes. However, not all reaction chambers are equipped with native cleaning capabilities, necessitating additional control measures to prevent byproducts from being transported through piping connecting the reaction chamber and pump system, ultimately depositing within the pump system (including throttle valves (TV), gate valves (GV), and related components). Long-term accumulation severely threatens the performance and lifespan of these critical components, leading to decreased pump efficiency or even failure. Therefore, the introduction of high-efficiency filtration devices has become a common solution in the industry. These devices effectively trap byproducts and other particulate matter, achieving highly efficient interception of tiny particles, constructing a protective barrier for the TV, GV, and pump body, significantly extending their service life and maintaining system stability.

[0003] However, with prolonged use, existing filtration devices accumulate a significant amount of byproducts as the membrane thickness reaches a certain level, leading to a substantial reduction in filtration efficiency. In extreme cases, this can directly impact pump speed, causing abnormal fluctuations in the TV opening, and may also result in residual gas within the reaction chamber, inducing issues such as membrane peeling and particle formation. Furthermore, it can cause uneven gas extraction between the two chambers, leading to wafer mismatch and directly reducing the yield and reliability of semiconductor devices, while also shortening equipment maintenance cycles. Summary of the Invention

[0004] The embodiments of the present invention provide a filtration device and a thin film deposition apparatus, which aim to solve the problem of poor filtration effect caused by the accumulation of excessive by-products inside existing filtration devices.

[0005] In a first aspect, the present invention provides a filtration device, comprising: a housing, a filter element, and a bushing, wherein the filter element is installed inside the housing, and the bushing is sleeved between the outer side wall of the filter element and the inner side wall of the housing, and the housing is configured to have a temperature control function, such that unreacted gases inside the housing react and adhere to the inner side wall of the housing, the inner side wall of the bushing, and the outer side wall of the bushing.

[0006] Wherein, at least one of the inner wall of the housing, the inner wall of the bushing, and the outer wall of the bushing has a roughened surface; or,

[0007] The longitudinal section of at least one of the inner wall of the housing, the inner wall of the bushing, and the outer wall of the bushing has a variable diameter section.

[0008] Furthermore, the rough surface is a sandblasted surface.

[0009] Furthermore, the rough surface is a surface with a dense mesh structure.

[0010] Furthermore, the roughness Ra of the roughened surface is 8. μm ~10 μm。

[0011] Furthermore, the variable diameter cross section is polygonal.

[0012] Furthermore, the filtration device also includes a base and a pressure plate. The base is provided with a plurality of through holes evenly distributed along the circumference. The lower end faces of the plurality of filter elements are respectively mounted on the base plate corresponding to the plurality of through holes. The pressure plate presses the upper end face of the filter element away from the base plate.

[0013] Furthermore, the filtration device also includes a central rod, which is disposed between the base and the pressure plate, and the two ends of the central rod are fixedly connected to the center of the pressure plate and the center of the base, respectively.

[0014] Furthermore, the filter device also includes a handle, and one end of the central rod extends through the center of the pressure plate in a direction away from the filter element to form a mounting section, and the handle is fixed to the mounting section.

[0015] Furthermore, the housing includes an upper cover, an outer shell, and a lower cover. The upper cover has an air inlet, and the lower cover has an air outlet. The upper cover is detachably fitted onto the top of the outer shell, and the lower cover is detachably fitted onto the bottom of the outer shell.

[0016] Secondly, the present invention also provides a thin film deposition apparatus, including the aforementioned filtration device.

[0017] This invention provides a filtration device and a thin film deposition apparatus. The filtration device includes a housing, a filter element, and a bushing. The filter element is installed inside the housing, and the bushing is fitted between the outer wall of the filter element and the inner wall of the housing. The housing has a temperature control function, allowing unreacted gases inside the housing to react and adhere to the inner wall of the housing, the inner wall of the bushing, and the outer wall of the bushing. Firstly, a rough surface is provided on the surface of at least one of the inner wall of the housing, the inner wall of the bushing, and the outer wall of the bushing, increasing the roughness of the sidewall surface and thus improving the adsorption capacity for by-products. Secondly, the longitudinal section of at least one of the inner wall of the housing, the inner wall of the bushing, and the outer wall of the bushing has a variable diameter section, increasing the surface area of ​​the sidewall and thus increasing the contact area with the unreacted gases, thereby improving the adsorption capacity for by-products. Therefore, by increasing the roughness and increasing the effective contact area, the adsorption capacity of the filtration device for by-products is improved, the filtration burden on the filter element is reduced, the filtration effect is improved, the service life of the filtration device is extended, the number of maintenance cycles is reduced, and the production line capacity is increased. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A top view schematic diagram of the filtration device according to an embodiment of the present invention is shown;

[0020] Figure 2 A cross-sectional schematic diagram of the filtration device according to an embodiment of the present invention is shown;

[0021] Figure 3 A schematic diagram illustrating the gas flow direction of the filtration device according to an embodiment of the present invention is shown;

[0022] Figure 4 A schematic diagram showing the surface of the housing / liner of the filter device according to an embodiment of the present invention;

[0023] Figure 5 A schematic diagram showing the surface of the housing / liner of a filter device according to another embodiment of the present invention is provided.

[0024] Figure 6 A top view schematic diagram of the bushing of the filter device according to an embodiment of the present invention is shown;

[0025] Figure 7 A cross-sectional schematic diagram of the bushing of the filter device according to an embodiment of the present invention is shown;

[0026] Figure 8A schematic diagram of a thin film deposition apparatus according to an embodiment of the present invention is shown;

[0027] Figure label:

[0028] 1. Housing; 11. Top cover; 111. Air inlet; 12. Outer shell; 13. Bottom cover; 131. Air outlet; 2. Filter element; 3. Bushing; 4. Base; 5. Pressure plate; 6. Center rod; 61. Mounting section; 7. Handle; 100. Filter device; 200. Reaction chamber; 300. Connecting pipeline; 400. TV valve; 500. GV valve; 600. Vacuum pump. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] The directional terms used in this invention, such as "up," "down," "front," "back," "left," "right," "inner," "outer," and "side," are merely for reference to the accompanying drawings. Therefore, the directional terms used are for illustrating and understanding this invention, and not for limiting it. Furthermore, in the drawings, structures that are similar or identical are indicated by the same reference numerals.

[0031] Not all reaction chambers in existing thin film deposition equipment are equipped with native cleaning functions. Some reaction chambers do not have the ability to clean. During the deposition process in the chamber, unreacted gases and reaction byproducts will be extracted by the vacuum pump at the end through the evacuation line. Therefore, filtration measures are required to prevent byproducts from entering the vacuum pump from the reaction chamber through the evacuation line. Over time, this will cause the TV valve, GV valve, and vacuum pump to fail due to too many byproducts.

[0032] To address this issue, this invention provides a filtration device and a thin film deposition apparatus, which solve the problem of poor filtration performance caused by the accumulation of excessive byproducts inside existing filtration devices. By increasing the roughness of the internal surface and the effective contact area of ​​the filtration device, the adsorption capacity for byproducts is improved, the filtration burden on the filter element is reduced, and the service life is extended.

[0033] To address the aforementioned problem of poor filtration performance, this invention employs two different technical solutions, as follows:

[0034] First, it should be noted that after a single thin-film deposition reaction, the exhaust from the reaction chamber includes some unreacted gas from the initial deposition. This unreacted gas may undergo a secondary thin-film deposition reaction in the downstream TV valve, GV valve, and vacuum pump of the filtration device, causing valve blockage. Therefore, the filtration device of this embodiment employs a heat trap structure with a temperature control function, capable of heating the shell to reach the reaction temperature of the reacting gas. When the gas diffuses into the filtration device, the heated shell causes the unreacted gas to deposit and adhere to the internal surface of the filtration device. The resulting byproducts are filtered out by the filter element, preventing excessive accumulation of byproducts downstream and contaminating downstream pipelines and components. Under the heating effect of the shell, the unreacted gas deposits and reacts to form a film on the internal surface of the filtration device. The unreacted gas then deposits and adheres to the internal surface of the filtration device and the filter element. In this way, the internal surface of the filtration device can share some of the byproducts generated by the reaction with the filter element, preventing excessive accumulation of byproducts, thus reducing the filtration burden on the filter element, improving the filtration effect, and preventing excessive accumulation of byproducts downstream and contaminating downstream pipelines and components. Therefore, improving the adsorption and collection capacity of by-products on the internal surface of the filtration device can reduce the filtration burden on the filter element, improve the filtration effect, increase the service life of the filtration device, extend the maintenance cycle, and thus increase the production line's capacity. This invention proposes two solutions to improve the adsorption and collection capacity of by-products on the internal surface of the filtration device.

[0035] The first solution is to increase the effective contact area of ​​the filter's internal surface. The larger the surface area of ​​the filter's internal surface, the greater the contact area with unreacted gas, resulting in more unreacted gas depositing and adhering to the filter's internal surface. Therefore, increasing the surface area of ​​the filter's internal surface in contact with unreacted gas strengthens its ability to collect byproducts, thereby significantly extending the filter's lifespan.

[0036] The second solution is to increase the roughness of the internal surface of the filter device. The rougher the internal surface of the filter device, the stronger its adsorption capacity for the membrane, allowing it to collect more reaction byproducts and reducing the likelihood of membrane peeling and particle formation. Therefore, increasing the roughness of the internal surface of the filter device enhances its ability to collect byproducts, thereby significantly extending the service life of the filter device.

[0037] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0038] Please see Figures 1-8This invention provides a filtration device 100, comprising: a housing 1, a filter element 2, and a bushing 3. The filter element 2 is installed inside the housing 1, and the bushing 3 is sleeved between the outer side wall of the filter element 2 and the inner side wall of the housing 1. The housing 1 is configured to have a temperature control function, such that unreacted gases inside the housing 1 react and adhere to the inner side wall of the housing 1, the inner side wall of the bushing 3, and the outer side wall of the bushing 3. At least one of the inner side wall of the housing 1, the inner side wall of the bushing 3, and the outer side wall of the bushing 3 has a roughened surface; and / or, at least one of the inner side wall of the housing 1, the inner side wall of the bushing 3, and the outer side wall of the bushing 3 has a variable diameter section in its longitudinal cross-section.

[0039] Reference Figure 2 and Figure 3 Specifically, the housing 1 has a cylindrical structure with an internal cavity. The upper end of the housing 1 has an air inlet 111, and the lower end has an air outlet 131. The air inlet 111 connects to the reaction chamber 200, and the air outlet 131 connects to the downstream extraction pipeline. The filter element 2 is installed in the cavity. The bushing 3 has a sleeve-like structure with both ends open. The bushing 3 is fitted onto the outside of the filter element 2, with its outer wall facing the inner wall of the housing 1 and its inner wall facing the outside of the filter element 2. Gas exiting the reaction chamber 200 enters the housing 1 through the air inlet 111. The gas is distributed between the housing 1 and the bushing 3, and between the bushing 3 and the filter element 2. After being filtered by the filter element 2, the gas is discharged from the air outlet 131 of the housing 1 to the downstream extraction pipeline. The housing 1 has a temperature control function. A temperature control component is provided on the outside of the housing 1. The temperature control component can adjust the temperature of the housing 1 according to the type of unreacted gas discharged from the reaction chamber 200, heating the housing 1 so that the interior of the housing 1 reaches the reaction temperature, so as to carry out a secondary reaction treatment on the unreacted gas in the housing 1 at the corresponding temperature. The unreacted gas reaction deposits will adhere to the inner surface of the filter device 100, mostly adhering to the inner wall of the housing 1, the inner wall of the bushing 3, the outer wall of the bushing 3, and the filter element 2.

[0040] To improve the adsorption and collection capacity of by-products on the internal surface of the filter device 100, embodiments of the present invention provide a rough surface on at least one of the inner wall of the housing 1, the inner wall of the bushing 3, and the outer wall of the bushing 3; and / or, provide a variable diameter section for the longitudinal section of at least one of the inner wall of the housing 1, the inner wall of the bushing 3, and the outer wall of the bushing 3. That is, embodiments of the present invention may choose to provide a rough surface alone or a variable diameter section alone on the internal surface of the filter device 100, or a combination of both, to improve the ability to collect by-products. There are various combinations, specifically as follows: For example, the surface of the inner wall of the housing 1 is provided with a rough surface; for example, the surfaces of both the inner wall of the housing 1 and the inner wall of the bushing 3 are provided with rough surfaces; for example, the surfaces of the inner wall of the housing 1, the inner wall of the bushing 3, and the outer wall of the bushing 3 are all provided with rough surfaces. For example, the longitudinal section of the inner wall of the housing 1 has a variable diameter section; for example, the longitudinal sections of both the inner wall of the housing 1 and the inner wall of the bushing 3 have variable diameter sections; for example, the longitudinal sections of the inner wall of the housing 1, the inner wall of the bushing 3, and the outer wall of the bushing 3 all have variable diameter sections; for example, the surface of the inner wall of the housing 1 has a rough surface and the longitudinal section has a variable diameter section; for example, the surfaces of both the inner wall of the housing 1 and the inner wall of the bushing 3 have rough surfaces and the longitudinal section has a variable diameter section; for example, the surfaces of the inner wall of the housing 1, the inner wall of the bushing 3, and the outer wall of the bushing 3 all have rough surfaces and the longitudinal section has a variable diameter section. It is understood that other combinations are also possible, such as the inner wall of the housing 1 having only a rough surface, the inner and outer walls of the bushing 3 having rough surfaces and variable diameter sections in their longitudinal sections, or other variations. For the sake of brevity, these will not be elaborated here, and those skilled in the art can set them according to actual needs.

[0041] Compared to smooth surfaces, rough surfaces have a larger surface area and more microstructures. When the sidewall surface becomes rough, its surface area increases significantly. A larger surface area provides more space to accommodate unreacted gases, thus improving adsorption capacity. Furthermore, rough surfaces typically contain numerous microstructures such as micropores, grooves, and protrusions, which provide more adsorption sites and contact surfaces for unreacted gases, increasing the chances of adsorption. Therefore, by creating rough surfaces on the inner sidewalls of the housing 1, the inner sidewalls of the bushing 3, and the outer sidewalls of the bushing 3, the surface roughness is increased. The rougher the surface, the stronger the adsorption capacity for the membrane, thereby enhancing the adsorption capacity of the membrane, reducing the filtration burden on the filter element 2, and improving the filtration effect.

[0042] Traditionally, both the shell 1 and the bushing 3 are cylindrical structures with a rectangular longitudinal section and a sidewall surface area of ​​2πrh, where r is the radius and h is the height. To increase the surface area of ​​the sidewalls of the shell 1 and bushing 3, the radius or height of the cylinder can be increased. However, due to the limited internal space of the shell 1, its height variation is limited. Therefore, the surface area of ​​the sidewalls can be increased by changing the radius. Thus, in this embodiment, the longitudinal sections of the inner sidewall of the shell 1, the inner sidewall of the bushing 3, and the outer sidewall of the bushing 3 are provided with variable-diameter sections. A variable-diameter section refers to a section where the radius changes; that is, the radius of the cylinder along its axial direction is not constant but varies according to certain rules. This allows the surface area of ​​the sidewalls under the variable-diameter structure to be greater than that under the cylindrical structure, thereby increasing the contact area with unreacted gas and improving adsorption capacity. It is understandable that there are various forms of variable diameter cross-sections. Regardless of the form, the sum of the surface areas of the cross-section profile under a variable diameter cross-section structure on each cross-section perpendicular to the cylinder axis is significantly increased compared to the surface area of ​​a cylindrical structure. Therefore, by setting the longitudinal sections of the inner sidewall of shell 1, the inner sidewall of bushing 3, and the outer sidewall of bushing 3 as variable diameter sections, the surface area of ​​the sidewalls is increased. A larger surface area means a stronger capacity to collect by-products, thereby increasing the contact area with unreacted gas, thus improving the ability to collect by-products, reducing the filtration burden on filter element 2, and improving the filtration effect.

[0043] Through this embodiment, on the one hand, the effective contact area of ​​the internal surface of the filter device 100 is increased, effectively adsorbing the unreacted gas in the reaction chamber 200, reducing the filtration burden on the filter element 2, thereby increasing the service life of the filter device 100, extending the operating time, reducing the number of maintenance times, and thus increasing the production line capacity and saving the cleaning cost of the heat trap; on the other hand, the roughness of the internal surface of the filter device 100 is increased, increasing the adsorption of the membrane on the internal surface of the filter device 100, thereby extending the ability of the filter device 100 to collect process by-products, improving equipment capacity, extending the maintenance cycle, and saving the cost of cleaning and replacing parts.

[0044] Reference Figure 4In one embodiment, the roughened surface is a sandblasted surface. Specifically, at least one of the inner wall of the housing 1, the inner wall of the bushing 3, and the outer wall of the bushing 3 has a sandblasted surface. For example, only the inner wall of the housing 1 may have a sandblasted surface, or all three walls may have sandblasted surfaces, or other combinations thereof, which will not be elaborated here. The sandblasted surface is formed by sandblasting the surface of a workpiece. Sandblasting is a technique that uses high-speed jetting of abrasives (such as diamond, ceramic sand, stainless steel sand, glass sand, etc.) to treat the surface of a workpiece. Sandblasting uses compressed air or other high-pressure fluids (such as steam, high-pressure water) as a power source to form a high-speed jet stream, which drives abrasive particles to impact the workpiece surface at high speed. This impact and cutting action can remove impurities, oxide scale, old coatings, etc. from the surface and form a new microstructure with a certain roughness on the surface. By adjusting factors such as the type and size of the abrasive, the spray angle, the spraying time, and the air pressure, sandblasting can precisely control the roughness of the treated surface. Increasing roughness is beneficial for improving surface adhesion because a rough surface provides more mechanical interlocking points. In practical applications, the microstructure of a sandblasted surface can be a lattice structure, a microgroove structure, a pyramidal or rhomboid structure, etc. A lattice structure forms regularly or randomly distributed tiny protrusions or pits on the surface, which can significantly increase the actual contact area and enhance adhesion or the coefficient of friction. A microgroove structure consists of parallel or staggered microgrooves that can guide liquid flow and improve reaction efficiency. Three-dimensional structures such as pyramidal or rhomboid structures can provide multi-directional contact surfaces to improve surface adsorption or friction. In summary, all the above-mentioned microstructures of sandblasted surfaces can increase surface roughness, thereby improving the adsorption capacity for thin films.

[0045] Reference Figure 5In one embodiment, the rough surface is a surface with a dense mesh structure. This dense mesh structure can be integrally formed on the inner wall of the housing 1, the inner wall of the bushing 3, or the outer wall of the bushing 3, or it can be attached as a separate component to the inner wall of the housing 1, the inner wall of the bushing 3, or the outer wall of the bushing 3. Specifically, at least any one of the inner wall of the housing 1, the inner wall of the bushing 3, and the outer wall of the bushing 3 has a surface with a dense mesh structure. For example, only the inner wall of the housing 1 may have a surface with a dense mesh structure, or all three surfaces may have a surface with a dense mesh structure, or other combinations thereof, which will not be elaborated here. The surface of a dense network structure can enhance the adsorption capacity of gaseous reactants. The principle is that while the area of ​​the dense network structure appears unchanged on a macroscopic plane, at the microscopic level, the network structure adds numerous pores and edges. These tiny structural features significantly increase the effective surface area in contact with the gas. More surface area means more active sites for gas molecules to adsorb, thereby increasing the total adsorption and improving the adsorption capacity. Furthermore, the network structure can improve diffusion conditions. The channels within the network structure can act as pathways for gas molecule transport, promoting gas molecule penetration and accelerating mass transfer. This helps increase the opportunity for gaseous reactants to contact the active sites on the network surface, thus enhancing the adsorption rate. In some cases, the network structure itself or its material can act as a catalyst, promoting the adsorption, activation, and transformation of gaseous reactants on its surface, accelerating the chemical reaction rate, and thus improving the efficiency and quality of reaction deposition. In addition, the network structure can enhance the capillary effect. The tiny gaps in the network structure can utilize capillary action to attract and retain a certain amount of unreacted gas, helping to maintain a stable reaction interface. Therefore, by making the rough surface a surface with a dense mesh structure, the adsorption and storage capacity for by-products can be improved.

[0046] In this embodiment, the roughness Ra of the roughened surface is 8 μm to 10 μm. For example, the roughness could be 8 μm, 9 μm, or 10 μm, and other values ​​are also possible. A higher roughness is not always better; there is an optimal range. This range is based on several considerations: First, when the surface roughness reaches a certain level, the newly added microstructures may no longer significantly increase the effective surface area available for adsorption, i.e., the adsorption saturation point has been reached. Instead, the small pore size may hinder gas molecule entry, or the overly dense structure may restrict diffusion, affecting mass transfer efficiency. Second, for balance reasons, excessively high roughness may worsen adsorption kinetics; although the theoretical adsorption amount increases, the actual rate at which gas molecules reach and occupy adsorption sites slows down, affecting the reaction rate. Third, considering physical stability and mechanical strength, extreme roughening may impair the physical stability and mechanical strength of the shell 1, especially for thin-walled structures. Fourth, economic factors are also considered; excessively high processing costs are a factor, as extreme surface treatments may require more complex processes and longer processing times, thus increasing costs. Therefore, this embodiment takes into account the above-mentioned limiting factors and sets the roughness range Ra of the rough surface to 8μm to 10μm to achieve a better overall adsorption capacity.

[0047] Reference Figure 6 and Figure 7In one embodiment, the variable-diameter cross-section is a polygonal shape. Specifically, the shell 1 and the bushing 3 can be structures with a certain wall thickness, such that the outer and inner walls of the shell 1 and the bushing 3 have different shapes. Alternatively, they can be thin-walled structures, with the outer and inner walls maintaining the same shape. For example, the sidewall of the shell 1 has a certain thickness. In the longitudinal section of the shell 1, the longitudinal section of the outer wall of the shell 1 is a non-variable-diameter cross-section, while the longitudinal section of the inner wall of the shell 1 is a variable-diameter cross-section. That is, the outer diameter of the outer wall of the shell 1 does not change, and from the appearance, the shell 1 is still a cylindrical structure. However, the inner diameter of the inner wall of the shell 1 changes, that is, the longitudinal section of the inner wall of the shell 1 has a variable-diameter cross-section, increasing the surface area of ​​the inner wall of the shell 1, allowing more unreacted gas to adhere to the inner wall of the shell 1. For example, the sidewall of bushing 3 is a thin-walled structure. Both the outer and inner longitudinal sections of bushing 3 have variable diameter sections. The outer diameter of the outer sidewall of bushing 3 changes in the same direction as the inner diameter of the inner sidewall. For instance, the variable diameter section is a polygonal shape with a radius that continuously folds inward and outward, making the overall shape of bushing 3 resemble a bellows. Therefore, its surface area is the sum of the surface areas of all the inward and outward folds, which is much larger than the surface area of ​​the sidewall under a cylindrical structure. In other embodiments, the variable diameter section can be wavy, or a combination of wavy and polygonal shapes, or it can be spiral, elliptical, trumpet-shaped, or a composite shape of the above combinations, or it can be any free curvature shape designed according to an algorithm.

[0048] Reference Figure 2In one embodiment, the filtration device 100 further includes a base 4 and a pressure plate 5. The base 4 is provided with a plurality of through holes evenly distributed along the circumferential direction. The lower end faces of the plurality of filter elements 2 are respectively mounted on the base plate corresponding to the plurality of through holes. The pressure plate 5 presses the upper end face of the filter element 2 away from the base plate. Specifically, the filter element 2 has a cylindrical structure, the side wall of the filter element 2 is a filtration structure, and the interior of the filter element 2 is a channel for gas flow, through which gas flows from the outside of the filter element 2 to the inside of the filter element 2. The filter element 2 has a pressure plate 5 and a base 4 at its upper and lower ends, respectively. The base 4 has multiple through holes, for example, six through holes, evenly distributed circumferentially around the center of the base plate. The filter element 2 also has six through holes, with the lower end of each through hole corresponding to one of them. The six filter elements 2 are evenly distributed circumferentially on the base 4, and their upper ends are pressed together by the pressure plate 5. Thus, the pressure plate 5, filter elements 2, and base 4 form a filter assembly, facilitating replacement and maintenance. A support plate is also provided in the cavity of the housing 1. This support plate holds the filter assembly and has a corresponding number of holes for air outlet at positions corresponding to the through holes in the base 4. These holes on the support plate coincide with the through holes on the base 4. Gas enters through the inlet 111 of the housing 1. A portion of the gas is distributed between the inner wall of the housing 1 and the outer wall of the bushing 3, while another portion is distributed between the inner wall of the bushing 3 and the filter element 2. The gas between the inner wall of the housing 1 and the outer wall of the bushing 3 flows back to the space between the inner wall of the bushing 3 and the filter element 2. Gas flows from the outside of the filter element 2 towards its center, where it is filtered by the filtration structure on its sidewall. The filtered gas flows to the lower end of the filter element 2, passes through the through-holes in the base 4 and the holes in the support plate, and finally exits from the outlet 131 at the lower end of the housing 1. This embodiment, by placing the filter element 2 between the pressure plate 5 and the base 4, ensures that all gas flows from the outside of the filter element 2 to its interior for filtration, preventing unfiltered gas from exiting and ensuring filtration reliability. Furthermore, the filter element 2, base 4, and pressure plate 5 form a filtration assembly, facilitating maintenance and replacement and improving equipment productivity.

[0049] Reference Figure 2In a specific embodiment, the filter device 100 further includes a central rod 6, which is disposed between the base 4 and the pressure plate 5. Both ends of the central rod 6 are fixedly connected to the center of the pressure plate 5 and the center of the base 4, respectively. Specifically, both ends of the central rod 6 are threaded, and the center of the base 4 and the pressure plate 5 are threaded holes. The threads at both ends of the central rod 6 engage with the threaded holes in the center of the base 4 and the pressure plate 5, respectively, to fix the base 4 and the pressure plate 5. This ensures that the upper end face of the filter element 2 is in close contact with the pressure plate 5, and the lower end face of the filter element 2 is in close contact with the base 4, preventing gas from entering the interior of the filter element 2 from its upper or lower end face, thus preventing unfiltered gas from being discharged and ensuring the reliability of filtration. Furthermore, the central rod 6 enables the assembly of the filter element 2 with the base 4 and the pressure plate 5 to form a filter assembly, which has a simple structure and is easy to install.

[0050] Reference Figure 2 Furthermore, the filter device 100 also includes a handle 7. One end of the central rod 6 extends through the center of the pressure plate 5 away from the filter element 2 to form an installation section 61, and the handle 7 is fixed to the installation section 61. Specifically, the upper end of the central rod 6 is designed to be relatively long, allowing it to protrude through the upper surface of the pressure plate 5. The portion of the central rod 6 protruding through the upper surface of the pressure plate 5 forms the installation section 61, which is threaded. The handle 7 has a threaded hole. Through the engagement of the thread on the installation section 61 and the threaded hole on the handle 7, the handle 7 is installed on the upper section of the central rod 6. In this way, maintenance personnel can easily lift the entire filter assembly using the handle 7, making installation and removal convenient, and the structure is simple and cost-effective.

[0051] Reference Figure 2In this embodiment, the housing 1 includes an upper cover 11, an outer shell 12, and a lower cover 13. The upper cover 11 has an air inlet 111, and the lower cover 13 has an air outlet 131. The upper cover 11 is detachably fitted onto the top of the outer shell 12, and the lower cover 13 is detachably fitted onto the bottom of the outer shell 12. Specifically, to facilitate maintenance and replacement of the filter element 2, the housing 1 is designed as a split type, comprising an upper cover 11, an outer shell 12, and a lower cover 13. The upper cover 11 and the lower cover 13 are located at the upper and lower ends of the outer shell 12, respectively. The air inlet 111 is located on the upper cover 11, and the air outlet 131 is located on the lower cover 13. The upper cover 11 is detachably connected to the outer shell 12. For example, a fitting structure can be provided on the lower end face of the upper cover 11 and the upper end face of the outer shell 12, so that the upper cover 11 and the outer shell 12 are fitted and locked together, realizing that the upper cover 11 is detachably fitted onto the top of the outer shell 12. For example, a snap-fit ​​structure can be provided on the side walls of the upper cover 11 and the outer shell 12 to lock the upper cover 11 and the outer shell 12 together. Similarly, the lower cover 13 can be detachably fitted onto the bottom of the outer shell 12 in the same way. Of course, it is understood that other detachable connection methods are also possible, as long as the upper cover 11, the outer shell 12, and the lower cover 13 can be locked together; no limitation is made here. By making the shell 1 a split structure, when maintenance personnel replace the filter element 2, they only need to remove the upper cover 11 and pull the handle 7 to lift the entire filter assembly and replace the new filter assembly, making maintenance simple and convenient.

[0052] Reference Figure 8 This invention also proposes a thin film deposition apparatus, including the filtration device 100 described in the above embodiments. The filtration device 100 has been described in detail in the above embodiments, and for the sake of brevity, it will not be repeated here. Specifically, the thin film deposition apparatus of this embodiment further includes a reaction chamber 200, a TV valve 400, a GV valve 500, and a vacuum pump 600. The reaction chamber 200, filtration device 100, TV valve 400, GV valve 500, and vacuum pump 600 are connected in sequence. The gas discharged from the reaction chamber 200 is first filtered by the filtration device 100 and then extracted by the vacuum pump 600.

[0053] For thin film deposition equipment without cleaning function, by adopting the filter device 100 of the present invention, the ability of the internal surface of the filter device 100 to collect by-products can be increased, thereby reducing the filtration burden of the filter element 2, extending its service life, extending the equipment maintenance cycle, and thus increasing the production capacity of the production line.

[0054] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A filtration device, characterized in that, include: The housing comprises a filter element, a filter cartridge, and a bushing. The filter element is installed inside the housing. The bushing has a sleeve-shaped structure with both ends open. The bushing is fitted between the outer wall of the filter element and the inner wall of the housing. The outer wall of the bushing faces the inner wall of the housing, and the inner wall of the bushing faces the outer side of the filter element. The housing is configured to have a temperature control function, so that unreacted gases inside the housing react and adhere to the inner wall of the housing, the inner wall of the bushing, and the outer wall of the bushing. Wherein, at least one of the inner wall of the housing, the inner wall of the bushing, and the outer wall of the bushing has a roughened surface; and / or, The longitudinal section of at least one of the inner wall of the housing, the inner wall of the bushing, and the outer wall of the bushing has a variable diameter section.

2. The filtration device according to claim 1, characterized in that, The rough surface is a sandblasted surface.

3. The filtration device according to claim 1, characterized in that, The rough surface is a surface with a dense mesh structure.

4. The filtration device according to claim 1, characterized in that, The roughness Ra of the rough surface is 8μm to 10μm.

5. The filtration device according to claim 1, characterized in that, The variable diameter section is polygonal.

6. The filtration device according to any one of claims 1-5, characterized in that, The filtration device also includes a base and a pressure plate. The base is provided with a plurality of through holes evenly distributed along the circumference. The lower end faces of the plurality of filter elements are respectively mounted on the base plate corresponding to the plurality of through holes. The pressure plate presses the upper end face of the filter element away from the base plate.

7. The filtration device according to claim 6, characterized in that, The filtration device further includes a central rod, which is disposed between the base and the pressure plate, and the two ends of the central rod are fixedly connected to the center of the pressure plate and the center of the base, respectively.

8. The filtration device according to claim 7, characterized in that, The filter device also includes a handle, and one end of the central rod extends through the center of the pressure plate in a direction away from the filter element to form a mounting section, and the handle is fixed to the mounting section.

9. The filtration device according to any one of claims 1-5, characterized in that, The housing includes an upper cover, an outer shell, and a lower cover. The upper cover has an air inlet, and the lower cover has an air outlet. The upper cover is detachably fitted onto the top of the outer shell, and the lower cover is detachably fitted onto the bottom of the outer shell.

10. A thin film deposition apparatus, characterized in that, Includes the filtration device as described in any one of claims 1-9.

Citation Information

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