Cleaning apparatus

Abstract

The present disclosure provides a cleaning apparatus for cleaning a semiconductor clamped workpiece, which includes a cleaning chamber, a fixed base, a water reservoir, and a motor. The fixed base is disposed in the cleaning chamber and configured to support the semiconductor clamped workpiece, wherein the fixed base includes a vacuum hole and a water spraying hole. The water reservoir is coupled to the fixed base and in fluid communication with the water spraying hole. The motor is coupled to the water reservoir and in fluid communication with the water spraying hole and the vacuum hole, so as to provide a vacuum suction to the semiconductor clamped workpiece through the vacuum hole and to spray a cleaning liquid in the water reservoir to the semiconductor clamped workpiece through the water spraying hole.

Description

Technical Field

[0001] This disclosure relates to a cleaning apparatus, and more particularly to a cleaning apparatus for cleaning semiconductor clamping workpieces. Background Technology

[0002] A cutting device is known to use a cutting blade to monolithize a semiconductor package. In this monolithization process, a semiconductor clamping workpiece (e.g., a cutting chuck) is typically used to fix the semiconductor package (e.g., a packaged substrate or lead frame). The semiconductor package is vacuum-adsorbed and fixed to the semiconductor clamping workpiece through vacuum holes on the semiconductor clamping workpiece, thereby assisting the cutting device in monolithization cutting.

[0003] However, during the use of this semiconductor clamping workpiece, its functional holes (such as air holes, mounting holes, flow channel holes, DC electrode holes, etc.) are easily contaminated and blocked by various factors such as the cutting process. Therefore, these functional holes of the semiconductor clamping workpiece need to be cleaned separately each time it is used.

[0004] The existing technology uses a small-diameter cylinder to manually open the functional holes. This method is not only time-consuming and laborious, but it is also more likely to cause scratches or abrasions to varying degrees on the inner wall of the functional holes while opening them. Summary of the Invention

[0005] This disclosure relates to a cleaning device that can automatically clean semiconductor clamped workpieces, saving cleaning manpower and time, and reducing damage to semiconductor clamped workpieces.

[0006] According to embodiments of this disclosure, the fixing base includes a plurality of fixing bases, each used to support a plurality of semiconductor clamping workpieces.

[0007] According to embodiments of this disclosure, the shapes of the multiple bearing surfaces of the multiple fixed bases are different.

[0008] According to embodiments of this disclosure, the fixed base is detachably disposed within the cleaning chamber.

[0009] According to embodiments of the present disclosure, a semiconductor clamping workpiece includes a plurality of suction holes arranged in an array and a vacuum coupling port in fluid communication with the plurality of suction holes, and the vacuum holes of the fixing base are coupled to the vacuum coupling port.

[0010] According to embodiments of this disclosure, the semiconductor clamping workpiece includes a plurality of washing holes surrounding a plurality of suction holes and a water source coupling port in fluid communication with the plurality of washing holes, and the water spray hole of the fixing base is coupled to the water source coupling port.

[0011] According to embodiments of this disclosure, the fixing base further includes a plurality of fixing members, wherein when the lower surface of the semiconductor clamping workpiece is placed on the fixing base, the plurality of fixing pins respectively engage with the semiconductor clamping workpiece.

[0012] According to embodiments of this disclosure, the cleaning device further includes a spray head disposed above a fixed base and coupled to a water tank for spraying cleaning liquid onto the upper surface of the semiconductor clamping workpiece.

[0013] According to embodiments of this disclosure, the fixed base includes multiple fixed bases, and the spray head is correspondingly disposed above one of the multiple fixed bases.

[0014] According to embodiments of this disclosure, the mounting base also includes an air blowing port coupled to a motor and configured to blow gas onto the semiconductor clamping workpiece.

[0015] Based on the above, the cleaning equipment of this disclosure has a fixed base disposed within the cleaning chamber and used to support the semiconductor clamping workpiece. The fixed base is coupled to a motor and includes a vacuum port and a water spray port. With this configuration, the motor can provide vacuum suction to the semiconductor clamping workpiece through the vacuum port to adsorb the semiconductor clamping workpiece onto the fixed base. Furthermore, the motor can apply pressure to spray cleaning liquid onto the semiconductor clamping workpiece through the water spray port to clean it. Therefore, the cleaning equipment of this disclosure can save manpower and time in cleaning semiconductor clamping workpieces and can reduce damage to the semiconductor clamping workpieces caused by manual cleaning. Attached Figure Description

[0016] The accompanying drawings are included to further illustrate this disclosure, and are incorporated in and form a part of this specification. The drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the disclosure.

[0017] Figure 1 This is a schematic diagram of a cleaning device according to an embodiment of the present disclosure;

[0018] Figure 2 This is a perspective view of a cleaning chamber according to an embodiment of the present disclosure;

[0019] Figure 3 This is a schematic diagram of a semiconductor clamping workpiece according to an embodiment of the present disclosure;

[0020] Figure 4 This is a top view schematic diagram of the first layer of a semiconductor clamping workpiece according to an embodiment of the present disclosure;

[0021] Figure 5 This is a top view schematic diagram of the second layer of a semiconductor clamping workpiece according to an embodiment of the present disclosure;

[0022] Figure 6 This is a top view schematic diagram of a fixing base according to an embodiment of the present disclosure;

[0023] Figure 7 This is a side view schematic diagram of a fixing base according to an embodiment of the present disclosure;

[0024] Figure 8 This is a bottom view schematic diagram of a semiconductor clamping workpiece according to an embodiment of the present disclosure.

[0025] Explanation of icon numbers

[0026] 100: Cleaning equipment

[0027] 110: Cleaning Chamber

[0028] 120, 120a, 120b, 120c: Fixed base

[0029] 122, 124: Spray nozzles

[0030] 126: Vacuum Hole

[0031] 128, 262: Fasteners

[0032] 130: Water storage tank

[0033] 140: Electric motor

[0034] 151, 152, 154, 156: Pipelines

[0035] 160: Sprayer head

[0036] 200, 200a, 200b, 200c: Semiconductor clamping workpieces

[0037] 201: Connector

[0038] 210: Ontology

[0039] 212: Lower surface

[0040] 220: Unsinking Groove

[0041] 222: Washing hole

[0042] 230: Adsorption region

[0043] 240: Suction hole

[0044] 242: Vacuum Coupling Port

[0045] 244: Suction Flow Channel

[0046] 252: Water source coupling port

[0047] 254: Water Source Flow Channel

[0048] 256: Sub-channel Detailed Implementation

[0049] Reference will now be made in detail to exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0050] The foregoing and other technical contents, features, and effects of this disclosure will be clearly presented in the following detailed description of the embodiments with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as "up," "down," "front," "back," "left," and "right," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting this disclosure. Furthermore, in the following embodiments, the same or similar elements will be referred to by the same or similar reference numerals.

[0051] Figure 1 This is a schematic diagram of a cleaning device according to an embodiment of the present disclosure. Figure 2 This is a three-dimensional schematic diagram of a cleaning chamber according to an embodiment of the present disclosure. Figure 3 This is a schematic diagram of a semiconductor workpiece clamping method according to an embodiment of the present disclosure. Please refer to... Figures 1 to 3 In some embodiments, such as Figure 1 The cleaning device 100 can be used for, for example, cleaning... Figure 3 The semiconductor clamping workpiece 200 shown is cleaned. The cleaning device 100 includes a cleaning chamber 110, a fixed base 120, a water tank 130, and a motor 140. In some embodiments, the fixed base 120 is disposed within the cleaning chamber 110 and used to support the semiconductor clamping workpiece 200. The water tank 130 may, for example, be disposed outside the cleaning chamber 110 and coupled to the fixed base 120 for fluid communication with the fixed base 120.

[0052] In one embodiment, the water reservoir 130 may be disposed outside the body of the cleaning device 100 and coupled to the cleaning device 100. In other embodiments, the water reservoir 130 may also be disposed inside the body of the cleaning device 100, for example, located below the cleaning chamber 110. The water reservoir 130 may store cleaning liquid for cleaning the semiconductor clamping workpiece 200, providing cleaning liquid such as pure water into the cleaning chamber 110. The motor 140 is coupled to the water reservoir 130 and in fluid communication with the fixed base 120 to provide vacuum suction to the semiconductor clamping workpiece 200 via the fixed base 120 and spray the cleaning liquid in the water reservoir 130 onto the semiconductor clamping workpiece 200 for cleaning.

[0053] In one embodiment, the cleaning device 100 may include a plurality of fixed bases 120a, 120b, and 120c, each used to support a plurality of semiconductor clamping workpieces 200. In this embodiment, the number of fixed bases 120a, 120b, and 120c is shown as three, each with a different external shape. However, this disclosure is not limited to this; the cleaning device 100 may be provided with more or fewer fixed bases as needed to support a corresponding number of semiconductor clamping workpieces 200a, 200b, and 200c. In this embodiment, as... Figure 2 As shown, the shapes of the bearing surfaces of the fixing bases 120a, 120b, and 120c used to couple the semiconductor clamping workpieces 200a, 200b, and 200c can be different to engage with multiple semiconductor clamping workpieces 200a, 200b, and 200c with different engagement interfaces. In one embodiment, the fixing base 120 can be detachably disposed within the cleaning chamber 110 to allow for replacement of the corresponding fixing base 120 for different engagement interfaces of the semiconductor clamping workpieces 200a, 200b, and 200c. For ease of explanation, the following description of the fixing base 120 is merely illustrative. Of course, this embodiment is not limited to this.

[0054] Figure 4 This is a top view schematic diagram of the first layer of a semiconductor clamping workpiece according to an embodiment of the present disclosure. Figure 5 This is a top view schematic diagram of the second layer of a semiconductor clamping workpiece according to an embodiment of the present disclosure. It should be noted that the semiconductor clamping workpiece 200 may, for example, be composed of multiple layers. Figure 4 An example is shown: a structural top view of one of the shelves (e.g., the first shelf), while Figure 5 The example shown is a top view of the structure of another layer (e.g., the second layer). Thus, multiple layers are stacked to collectively form a semiconductor clamping workpiece 200 with multiple gas and liquid flow channels. Please also refer to... Figures 3 to 5In some embodiments, the semiconductor clamping workpiece 200 may serve as a chuck table in a cutting apparatus for securing semiconductor devices thereon. The semiconductor devices may include packaging substrates or other devices to be cut. In some embodiments, the semiconductor clamping workpiece 200 may include a body 210 composed of multiple layers, a relief groove 220 disposed on the body 210, and a plurality of suction holes 240 arranged in an array. The lower surface 212 of the body 210 may be coupled to the fixing base 120, while the relief groove 220 is a plurality of intersecting grooves in a grid pattern on the upper surface of the body 210, which divides the body 210 into a plurality of suction regions 230 arranged in an array. The relief groove 220 may correspond to a cutting line on the semiconductor device, so that when a cutting tool cuts the semiconductor device on the semiconductor clamping workpiece 200, the cutting tool can cut through the semiconductor device along the cutting line and enter the relief groove 220.

[0055] Please refer to Figure 3 and Figure 4 The suction holes 240 can be arranged in an array within the adsorption area 230 defined by the relief groove 220. In one embodiment, the semiconductor clamping workpiece 200 may further include a vacuum coupling port 242 and multiple suction channels 244 connecting the suction holes 240 and the vacuum coupling port 242, so that the arrayed suction holes 240 can be in fluid communication with the vacuum coupling port 242 via the suction channels 244. In one embodiment, the vacuum coupling port 242 is adapted to couple a motor 140 to provide vacuum suction to the suction holes 240, so that the semiconductor clamping workpiece 200 can adsorb the semiconductor device onto the body 210 through the vacuum suction of the suction holes 240.

[0056] Please refer to Figure 3 and Figure 5In some embodiments, the semiconductor clamping workpiece 200 may further include a plurality of washing holes 222 surrounding a plurality of suction holes 240, a water source coupling port 252, and a plurality of water source channels 254, wherein the water source channels 254 are respectively connected between the washing holes 222 and the water source coupling ports 252 to enable fluid communication between the washing holes 222 and the water source coupling ports 252. In one embodiment, the washing holes 222 may be disposed within the tool relief groove 220 to surround the suction holes 220 along the tool relief groove 220. Further, the semiconductor clamping workpiece 200 may further include a plurality of sub-channels 256, which may be located below the plurality of washing holes 222 to respectively connect to the plurality of washing holes 222, and the water source channels 254 further connect the plurality of sub-channels 256 to the water source coupling ports 252. Of course, this embodiment is only an example, and this disclosure does not limit the channel configuration in the semiconductor clamping workpiece 200. The water source coupling port 252 is adapted to couple a water source so that the water supplied by the water source can be sprayed out through the washing hole 222 to clean the dust generated by cutting.

[0057] Figure 6 This is a top view schematic diagram of a fixed base according to an embodiment of the present disclosure. Figure 7 This is a side view schematic diagram of a fixing base according to an embodiment of the present disclosure. Figure 8 This is a bottom view schematic diagram of a semiconductor workpiece clamping device according to an embodiment of the present disclosure. Please refer to... Figures 6 to 8 In some embodiments, such as Figure 6 The mounting base 120 shown can be coupled to the connector 201 on the lower surface 212 of the semiconductor clamping workpiece 200. Specifically, the mounting base 120 also includes water spray holes 122 and 124. The motor 140 can be coupled to the water tank 130, for example, via pipe 151, and can be in fluid communication with the water spray holes 122 and 124 via pipes 152 and 154, respectively. In one embodiment, the motor 140 can provide vacuum suction to the semiconductor clamping workpiece 200 via vacuum hole 126 to adsorb the semiconductor clamping workpiece 200 onto the mounting base 120. Furthermore, the motor 140 can apply pressure to spray cleaning liquid in the water tank 130 onto the semiconductor clamping workpiece 200 through the water spray holes 122 and 124 to clean the semiconductor clamping workpiece 200. It is worth noting that the water spray hole 122 on the fixed base 120 is used for vacuum suction when installed on a cutting machine table, but when used in the cleaning equipment of this disclosure, it is used to connect to the water storage tank 130 for cleaning the holes on the semiconductor clamping workpiece 200. In one embodiment, the motor 140 may be located in the area below the cleaning chamber 110 and coupled to the fixed base 120.

[0058] In one embodiment, the vacuum port 126 of the fixed base 120 is coupled to the motor 140, so that the motor 140 can provide vacuum suction to the semiconductor clamping workpiece 200 through the vacuum port 126, adsorbing the semiconductor clamping workpiece 200 onto the fixed base 120. Furthermore, in this embodiment, the water spray port 122 of the fixed base 120 can be coupled to the vacuum coupling port 242 of the semiconductor clamping workpiece 200, while the water spray port 124 can be coupled to the water source coupling port 252 of the semiconductor clamping workpiece 200. This allows the cleaning liquid in the water tank 140 to be delivered to the vacuum coupling port 242 and the water source coupling port 252 of the semiconductor clamping workpiece 200 through the water spray ports 122 and 124, and to flow through the suction channel 242, the water source channel 254, and the sub-channel 256, respectively, and then sprayed out through multiple washing holes 222 to clean and remove blockages from all channels and holes within the semiconductor clamping workpiece 200. It is worth noting that when the vacuum coupling port 242 of the semiconductor clamping workpiece 200 is set on the cutting machine table, it is used as a vacuum suction to adsorb semiconductor devices onto the semiconductor clamping workpiece 200. However, when the semiconductor clamping workpiece 200 is set on the cleaning equipment of this disclosure, it is used to couple the water spray hole 122 so that the cleaning liquid in the water tank 140 can be transferred through the water spray holes 122 and 124 of the fixed base 120 to the vacuum coupling port 242 of the semiconductor clamping workpiece 200 to clean the holes on the semiconductor clamping workpiece 200.

[0059] Please refer to again Figure 1 and Figure 2 In one embodiment, the cleaning device 100 may further include a spray head 160 disposed above the fixed base 120 and coupled to a water tank 130 to spray cleaning liquid onto the upper surface of the semiconductor clamping workpiece 200. With this configuration, when cleaning the semiconductor clamping workpiece 200 which contains a lot of dust, in addition to using the fixed base 120 to clean the interior of the semiconductor clamping workpiece 200, the spray head 160 can also be used to perform enhanced cleaning on the surface of the semiconductor clamping workpiece 200. In one embodiment, the spray head 160 may, for example, be disposed above one of a plurality of fixed bases 120. Furthermore, in one embodiment, the spray head 160 is movable, so that it can be moved as needed above a corresponding fixed base 120 to spray cleaning liquid onto the semiconductor clamping workpiece 200 thereon.

[0060] Please refer to Figure 6 and Figure 7In one embodiment, the fixing base 120 further includes a plurality of fixing members 128. When the lower surface 212 of the semiconductor clamping workpiece 200 is placed on the fixing base 120, the fixing members 128 can respectively engage with the fixing members 262 of the semiconductor clamping workpiece 200. Specifically, the fixing members 128 of the fixing base 120 may include pins protruding from the coupling surface of the fixing base 120, while the fixing members 262 of the semiconductor clamping workpiece 200 may correspondingly include a plurality of positioning holes. Thus, when the semiconductor clamping workpiece 200 is placed on the fixing base 120, the pins can respectively engage with the positioning holes of the lower surface 212 of the semiconductor clamping workpiece 200 for positioning, so as to more securely fix the semiconductor clamping workpiece 200 on the fixing base 120. Furthermore, the number and arrangement position of the fixing members 128 and the fixing members 262 may be directional (e.g., Figure 6 The three pins shown are configured in three different orientations to ensure that the semiconductor clamping workpiece 200 is correctly positioned on the fixed base 120.

[0061] In one embodiment, the fixed base 120 may further include a vacuum port 126 coupled to a motor 140 and configured to draw a vacuum into the semiconductor clamping workpiece 200. Specifically, the motor 140 may be in fluid communication with the vacuum port 126, for example, via a conduit 156. With this configuration, when the semiconductor clamping workpiece 200 is cleaned and it is desired to separate it from the fixed base 120, the motor 140 can be started and gas can be blown onto the semiconductor clamping workpiece 200 through the vacuum port 126 to release the vacuum between the semiconductor clamping workpiece 200 and the fixed base 120, allowing the semiconductor clamping workpiece 200 to be easily separated from the fixed base 120. In one embodiment, the bottom of the fixed base 120 may, for example, be as follows: Figure 7 The shown fixture has threads to allow for detachable mounting on the bottom surface of the cleaning chamber 110 via threaded locking. This allows the mounting base 120 to be easily replaceable depending on the semiconductor clamping workpiece 200 required by the cutting machine, but this disclosure is not limited thereto.

[0062] In summary, the cleaning equipment of this disclosure has a fixed base disposed within the cleaning chamber to support the semiconductor clamped workpiece. The fixed base is coupled to a motor and includes a vacuum port and a water spray port. With this configuration, the motor can provide vacuum suction to the semiconductor clamped workpiece via the vacuum port, thereby adsorbing the semiconductor clamped workpiece onto the fixed base. Furthermore, the motor can apply pressure to spray cleaning liquid onto the semiconductor clamped workpiece through the water spray port, thereby cleaning the semiconductor clamped workpiece. Therefore, the cleaning equipment of this disclosure can save manpower and time in cleaning semiconductor clamped workpieces and can reduce damage to the semiconductor clamped workpieces caused by manual cleaning.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this disclosure.

Claims

1. A cleaning apparatus for cleaning semiconductor clamping workpieces including vacuum coupling ports, characterized in that, include: Clean the chamber; A fixing base is disposed in the cleaning chamber and used to support the semiconductor clamping workpiece, wherein the fixing base includes a vacuum hole and a water spray hole; A water storage tank, coupled to the fixed base and in fluid communication with the spray nozzle; and An electric motor, coupled to the water tank and in fluid communication with the water spray hole and the vacuum hole, provides vacuum suction to the semiconductor clamping workpiece via the vacuum hole and sprays cleaning liquid from the water tank onto the semiconductor clamping workpiece via the water spray hole. The water spray hole of the fixed base is coupled to the vacuum coupling port of the semiconductor clamping workpiece so that the cleaning liquid is delivered to the vacuum coupling port of the semiconductor clamping workpiece via the water spray hole to clean the holes on the semiconductor clamping workpiece.

2. The cleaning equipment according to claim 1, characterized in that, The fixed base includes multiple fixed bases, each used to support multiple semiconductor clamping workpieces.

3. The cleaning equipment according to claim 2, characterized in that, The shapes of the multiple bearing surfaces of the multiple fixed bases are all different.

4. The cleaning equipment according to claim 1, characterized in that, The fixed base is detachably installed in the cleaning chamber.

5. The cleaning equipment according to claim 1, characterized in that, The semiconductor clamping workpiece includes a plurality of suction holes arranged in an array and a vacuum coupling port in fluid communication with the plurality of suction holes, and the vacuum hole of the fixing base is coupled to the vacuum coupling port.

6. The cleaning equipment according to claim 5, characterized in that, The semiconductor clamping workpiece includes a plurality of washing holes surrounding the plurality of suction holes and a water source coupling port in fluid communication with the plurality of washing holes, and the water spray hole of the fixed base is coupled to the water source coupling port.

7. The cleaning equipment according to claim 1, characterized in that, The fixing base also includes multiple fixing members. When the lower surface of the semiconductor clamping workpiece is placed on the fixing base, the multiple fixing members respectively engage with the semiconductor clamping workpiece.

8. The cleaning equipment according to claim 1, characterized in that, It also includes a spray head, which is disposed above the fixed base and coupled to the water tank, to spray the cleaning liquid onto the upper surface of the semiconductor clamping workpiece.

9. The cleaning equipment according to claim 8, characterized in that, The fixed base includes multiple fixed bases, and the spray head is correspondingly disposed above one of the multiple fixed bases.

10. The cleaning equipment according to claim 1, characterized in that, The mounting base also includes an air inlet coupled to the motor and configured to blow gas onto the semiconductor clamping workpiece.

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