A method for simultaneous machining of die and punch positioning plates

Abstract

This invention discloses a method for synchronously processing a die and a punch positioning plate, belonging to the field of machining technology. It includes a die with an inner cavity contour and a punch positioning plate with a mounting hole contour, the inner cavity contour and the mounting hole contour having the same shape. When the area enclosed by the inner cavity contour is the same as the area enclosed by the mounting hole contour, the die and punch positioning plate are stacked on a machining station for simultaneous processing. When the area enclosed by the inner cavity contour is different from the area enclosed by the mounting hole contour, the template with the larger enclosed area is the lower die, and the template with the smaller enclosed area is the upper die. The upper die is stacked on top of the lower die and placed on a machining station for simultaneous processing, after which the lower die undergoes secondary processing. This invention can precisely control the gap between the inner cavity on the die and the punch mounted on the punch positioning plate after processing, and the gap is evenly distributed.

Description

Technical Field

[0001] This invention belongs to the field of machining technology, specifically relating to a method for synchronously machining a positioning plate for a die and a punch. Background Technology

[0002] Stamping is a pressure processing method that uses dies mounted on a press to apply pressure to materials at room temperature, causing them to separate or undergo plastic deformation to obtain the desired parts. When processing products using dies and punches, the positions of the dies and the gap between them are relatively fixed. However, during the processing of the die and punch positioning plate, machine tool errors exist on the wire EDM machine, and changes in the surrounding environment, such as temperature changes, can cause variations in the dimensions of the processed die and punch positioning plate. This results in uneven gaps between the punch mounted on the punch positioning plate and the die, significantly impacting the product's dimensions and quality. Therefore, we provide a method for the simultaneous processing of the die and punch positioning plate. Summary of the Invention

[0003] The purpose of this invention is to provide a method for synchronously processing a die and a punch positioning plate, which can accurately control the gap between the inner cavity on the die and the punch mounted on the punch positioning plate after processing, and the gap is evenly distributed.

[0004] To achieve the above objectives, the present invention provides the following technical solution:

[0005] A method for synchronously machining a die and a punch positioning plate includes a die and a punch positioning plate. The die has an inner cavity contour that needs to be wire-cut, and the punch positioning plate has a mounting hole contour that needs to be wire-cut. The inner cavity contour and the mounting hole contour have the same shape, and the area enclosed by the inner cavity contour may be the same as or different from the area enclosed by the mounting hole contour. A machining station is provided on the wire cutting machine. When the area enclosed by the inner cavity contour is the same as the area enclosed by the mounting hole contour, the die and the punch positioning plate are stacked on the machining station for simultaneous machining. When the area enclosed by the inner cavity contour is different from the area enclosed by the mounting hole contour, the template with the larger enclosed area is the lower die, and the template with the smaller enclosed area is the upper die. The upper die is stacked on top of the lower die and placed on the machining station for simultaneous machining. After that, the lower die is machined a second time.

[0006] Preferably, the inner cavity contour has a first scaling center, the inner cavity contour can be scaled proportionally with the first scaling center, and the distance between any two corresponding points of the scaled first scaling contour and the inner cavity contour is the same; the mounting hole contour has a second scaling center, the mounting hole contour can be scaled proportionally with the second scaling center, and the distance between any two corresponding points of the scaled second scaling contour and the mounting hole contour is the same; the inner cavity contour has a first arbitrary point, the mounting hole contour has a second arbitrary point, and the second arbitrary point is the corresponding point of the first arbitrary point; the line connecting the first arbitrary point and the first scaling center is set as a first orientation line, the line connecting the second arbitrary point and the second scaling center is set as a second orientation line, and when the die and the punch positioning plate are placed on the machining station for simultaneous processing, the first scaling center and the second scaling center coincide at the machining station, and the first orientation line and the second orientation line coincide.

[0007] Preferably, when the area enclosed by the inner cavity contour is the same as the area enclosed by the mounting hole contour, the first azimuth line and the second azimuth line coincide and have the same length.

[0008] Preferably, when the area enclosed by the inner cavity contour is not the same as the area enclosed by the mounting hole contour, the first azimuth line and the second azimuth line coincide and their lengths are proportionally set.

[0009] Preferably, the area enclosed by the inner cavity contour is larger than the area enclosed by the mounting hole contour, the cavity contour is the lower die, and the punch positioning plate is the upper die.

[0010] Preferably, the area enclosed by the inner cavity contour is smaller than the area enclosed by the mounting hole contour, the inner cavity contour is the upper machining mold, and the punch positioning plate of the mounting hole contour is the lower machining mold.

[0011] Preferably, when the area enclosed by the inner cavity contour is not the same as the area enclosed by the mounting hole contour, the processing steps include:

[0012] S1: The upper processing mold is superimposed on the lower processing mold and placed on the processing station for simultaneous processing. At this time, the first scaling center and the second scaling center coincide with the processing station of the wire cutting machine tool, and the first orientation line and the second orientation line coincide and are set in proportion.

[0013] S2: The upper and lower dies are processed simultaneously using a wire EDM machine tool, and the processing path of the wire EDM machine tool is the processing contour of the upper die.

[0014] S3: After the wire EDM process is completed, remove the finished upper die.

[0015] S4: Reposition and calibrate the machining station of the wire EDM machine;

[0016] S5: Perform secondary machining on the lower die that has already undergone one machining operation. The machining path for the secondary machining is the machining contour of the lower die.

[0017] Preferably, the machining mold that has completed one machining operation has a machined outline, and the machined outline has a first reference line and a second reference line that coincide with two mutually perpendicular axes of the wire cutting machine tool. The first reference line and the machined outline have two intersection points, and the second reference line and the machined outline have two intersection points.

[0018] Preferably, in step S4, the specific operation is as follows: the wire cutting machine moves along the first reference line, and when the distance between the two intersection points of the wire cutting machine and the first reference line is the same, the calibration is performed by comparing the current value of the wire cutting machine; the wire cutting machine moves along the second reference line, and when the distance between the two intersection points of the wire cutting machine and the second reference line is the same, the calibration is performed by comparing the current value of the wire cutting machine.

[0019] Preferably, the calibration method involves moving the lower die that has completed one machining operation along a first reference line or along a second reference line.

[0020] Compared with the prior art, the beneficial effects of the present invention are as follows: When the area enclosed by the inner cavity contour is the same as the area enclosed by the mounting hole contour, the present invention stacks the die and the punch positioning plate on the machining station for simultaneous processing; when the area enclosed by the inner cavity contour is different from the area enclosed by the mounting hole contour, the template with the larger enclosed area is the lower die, and the template with the smaller enclosed area is the upper die. After stacking the upper die on top of the lower die and placing it on the machining station for simultaneous processing, the lower die is then subjected to secondary processing. This arrangement can precisely control the gap between the inner cavity on the die and the punch mounted on the punch positioning plate after processing, and the gap is evenly distributed. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0022] Figure 2 This is a schematic diagram showing that the cross-sectional area of ​​the punch mounting section is larger than the cross-sectional area of ​​the stamping section in this invention.

[0023] In the figure: 1. Die; 2. Punch positioning plate; 3. Inner cavity contour; 4. Mounting hole contour; 5. First scaling center; 6. Second scaling center; 7. First arbitrary point; 8. Second arbitrary point; 9. First orientation line; 10. Second orientation line; 111. Mounting section; 112. Stamping section. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] like Figure 1 As shown, this invention provides a method for synchronously machining a die and a punch positioning plate, including a die 1 and a punch positioning plate 2. The die 1 has an inner cavity contour 3 that needs to be machined by wire cutting. The inner cavity contour 3 can be machined by wire cutting to form an inner cavity on the die 1. The punch positioning plate 2 has a mounting hole contour 4 that needs to be machined by wire cutting. The mounting hole contour 4 can be machined by wire cutting to form a mounting hole on the punch positioning plate 2. The mounting hole is used to mount a punch, and the inner cavity is used to fit the punch. The inner cavity contour 3 and the mounting hole contour 4 have the same shape. Figure 2 As shown, the punch includes a mounting section 111 and a stamping section 112. The mounting section 111 is fitted tightly into the mounting hole; the stamping section 112 is adapted to fit into the inner cavity of the die 1. The mounting section 111 and the stamping section 112 have the same shape, but the cross-sectional area of ​​the mounting section 111 and the cross-sectional area of ​​the stamping section 112 can be the same or different. That is, there are three ways to set the punch: first, the cross-sectional area of ​​the mounting section 111 is the same as the cross-sectional area of ​​the stamping section 112; second, the cross-sectional area of ​​the mounting section 111 is larger than the cross-sectional area of ​​the stamping section 112; and third, the cross-sectional area of ​​the mounting section 111 is smaller than the cross-sectional area of ​​the stamping section 112. Depending on the way the punch is set, the area enclosed by the inner cavity contour 3 can be the same as or different from the area enclosed by the mounting hole contour 4.

[0026] like Figure 1As shown, the inner cavity contour 3 on the die 1 has a first scaling center 5. The inner cavity contour 3 can be scaled proportionally with the first scaling center 5, and the distance between any two corresponding points of the scaled first scaling contour and the inner cavity contour 3 is the same. The mounting hole contour 4 has a second scaling center 6. The mounting hole contour 4 can be scaled proportionally with the second scaling center 6, and the distance between any two corresponding points of the scaled second scaling contour and the mounting hole contour 4 is the same. In addition, the inner cavity contour 3 has a first arbitrary point 7, and the mounting hole contour 4 has a second arbitrary point 8, which is the corresponding point of the first arbitrary point 7. The line connecting the first arbitrary point 7 and the first scaling center 5 is set as the first orientation line 9, and the line connecting the second arbitrary point 8 and the second scaling center 6 is set as the second orientation line 10.

[0027] The inner cavity contour 3 on the die 1 can be a regular or irregular shape, and the mounting hole contour 4 on the punch positioning plate 2 can be a regular or irregular shape accordingly. When the upper inner cavity contour 3 of the die 1 is a regular shape, the mounting hole contour 4 on the punch positioning plate 2 is a regular shape; when the inner cavity contour 3 of the die 1 is an irregular shape, the mounting hole contour 4 on the punch positioning plate 2 is an irregular shape.

[0028] Specifically, when both the inner cavity contour 3 and the mounting hole contour 4 are circular, the first scaling center 5 of the inner cavity contour 3 and the second scaling center 6 of the mounting hole contour 4 are both the centers of the circles. Furthermore, the first orientation line 9 of the inner cavity contour 3 is an arbitrary radius line; the second orientation line 10 of the mounting hole contour 4 is an arbitrary radius line and corresponds to the first orientation line 9.

[0029] When both the inner cavity contour 3 and the mounting hole contour 4 are rectangular, the first scaling center 5 of the inner cavity contour 3 and the second scaling center 6 of the mounting hole contour 4 are the intersections of the two diagonals of the rectangle. Furthermore, the first orientation line 9 of the inner cavity contour 3 is the line connecting the first scaling center 5 to any point on any of the four sides of the rectangle; the second orientation line 10 of the mounting hole contour 4 is the line connecting the second scaling center 6 to any point on any of the four sides of the rectangle and is correspondingly set to the first orientation line 9.

[0030] When both the inner cavity contour 3 and the mounting hole contour 4 are elliptical, the first scaling center 5 of the inner cavity contour 3 and the second scaling center 6 of the mounting hole contour 4 are the midpoints of the two foci of the ellipse. Furthermore, the first orientation line 9 of the inner cavity contour 3 is the line connecting the first scaling center 5 to any point on the curve enclosing the ellipse; the second orientation line 10 of the mounting hole contour 4 is the line connecting the second scaling center 6 to any point on the curve enclosing the ellipse and is correspondingly set to the first orientation line 9.

[0031] The wire EDM machine tool is equipped with a processing station. When the area enclosed by the inner cavity contour 3 is the same as the area enclosed by the mounting hole contour 4, the die 1 and the punch positioning plate 2 are stacked on the processing station for simultaneous processing. At this time, the first scaling center 5 of the inner cavity contour 3 and the second scaling center 6 of the mounting hole contour 4 coincide at the processing station. The first orientation line 9 and the second orientation line 10 are set to coincide and have the same length.

[0032] When the area enclosed by the inner cavity contour 3 is different from the area enclosed by the mounting hole contour 4, the template with the larger enclosed area is the lower processing mold, and the template with the smaller enclosed area is the upper processing mold. Specifically, when the area enclosed by the inner cavity contour 3 is larger than the area enclosed by the mounting hole contour 4, the cavity mold 1 containing the inner cavity contour 3 is the lower processing mold, and the punch positioning plate 2 containing the mounting hole contour 4 is the upper processing mold; when the area enclosed by the inner cavity contour 3 is smaller than the area enclosed by the mounting hole contour 4, the cavity mold 1 containing the inner cavity contour 3 is the upper processing mold, and the punch positioning plate 2 containing the mounting hole contour 4 is the lower processing mold. When machining of the cavity mold 1 and the punch positioning plate 2 is required, the upper processing mold is superimposed on top of the lower processing mold and placed on the machining station for simultaneous machining, and then the lower processing mold is machined a second time. The specific machining steps include:

[0033] S1: The upper machining die is superimposed on the lower machining die and placed on the machining station for simultaneous machining. At this time, the first scaling center 5 and the second scaling center 6 coincide with the machining station of the wire EDM machine, and the first orientation line 9 and the second orientation line 10 coincide and their lengths are set proportionally.

[0034] S2: The upper and lower dies are processed simultaneously using a wire EDM machine. The processing path of the wire EDM machine is the processing contour of the upper die.

[0035] S3: After the wire EDM process is completed, remove the finished upper die.

[0036] S4: Reposition and calibrate the machining station of the wire EDM machine. The specific steps are as follows: The lower die, which has completed one machining operation, has a machined outline. Within this outline are a first reference line and a second reference line that coincide with two mutually perpendicular axes of the wire EDM machine. The two intersection points of the first reference line and the machined outline are designated as points A and B, respectively, and the two intersection points of the second reference line and the machined outline are designated as points C and D, respectively. Move the wire cutting device of the wire EDM machine along the first reference line to a position close to point A. This position is recorded as point A1, and the current value is recorded as I0. The distance between point A1 and point A is recorded as L. Then, move the wire cutting device of the wire EDM machine along the first reference line to point B1, which is L away from point B. Observe the current value... Check if the current value at point is I0. If it is I0, no adjustment is needed. If it is not I0, move the position of the lower die along the first reference line until the current value is I0. Then move the wire cutting machine along the second reference line to a position close to point C. This position is recorded as point C1, and the current is recorded as I1. The distance between point C1 and point C is recorded as L1. Then move the wire cutting machine along the first reference line to point D1, which is L1 away from point D. Check if the current value at this point is I1. If it is I1, no adjustment is needed. If it is not I1, move the position of the lower die along the first reference line until the current value is I1.

[0037] S5: Perform secondary machining on the lower die that has already undergone one machining operation. The machining path for the secondary machining is the machining contour of the lower die.

[0038] The above-mentioned synchronous processing method can accurately control the gap between the inner cavity of the die 1 and the punch installed on the punch positioning plate 2 after processing, and the gap is evenly distributed.

[0039] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A method for synchronous machining of a female die and a male die positioning plate, comprising a female die (1) and a male die positioning plate (2), characterized in that: The die (1) has an inner cavity contour (3) that needs to be wire-cut, and the punch positioning plate (2) has a mounting hole contour (4) that needs to be wire-cut. The inner cavity contour (3) and the mounting hole contour (4) have the same shape. The area enclosed by the inner cavity contour (3) is the same as or different from the area enclosed by the mounting hole contour (4). The wire cutting machine tool is provided with a processing station. When the area enclosed by the inner cavity contour (3) is the same as the area enclosed by the mounting hole contour (4), the die (1) and the punch positioning plate (2) are stacked on the processing station for simultaneous processing. When the area enclosed by the inner cavity contour (3) is different from the area enclosed by the mounting hole contour (4), the template with the larger enclosed area is the lower processing die, and the template with the smaller enclosed area is the upper processing die. The upper processing die is stacked on top of the lower processing die and placed on the processing station for simultaneous processing. After the lower processing die is processed, it is then processed a second time. The inner cavity contour (3) has a first scaling center (5), and the inner cavity contour (3) can be scaled proportionally with the first scaling center (5); the mounting hole contour (4) has a second scaling center (6), and the mounting hole contour (4) can be scaled proportionally with the second scaling center (6); the inner cavity contour (3) has a first arbitrary point (7), and the mounting hole contour (4) has a second arbitrary point (8), and the second arbitrary point (8) is the corresponding point of the first arbitrary point (7); the line connecting the first arbitrary point (7) and the first scaling center (5) is set as a first orientation line (9), and the line connecting the second arbitrary point (8) and the second scaling center (6) is set as a second orientation line (10). When the die (1) and the punch positioning plate (2) are placed on the processing station for simultaneous processing, the first scaling center (5) and the second scaling center (6) coincide at the processing station and the first orientation line (9) and the second orientation line (10) coincide.

2. The method for synchronously processing a die and punch positioning plate according to claim 1, characterized in that: When the area enclosed by the inner cavity contour (3) is the same as the area enclosed by the mounting hole contour (4), the first azimuth line (9) and the second azimuth line (10) coincide and have the same length.

3. The method for synchronously processing a die and punch positioning plate according to claim 1, characterized in that: When the area enclosed by the inner cavity contour (3) is not the same as the area enclosed by the mounting hole contour (4), the first azimuth line (9) and the second azimuth line (10) coincide and their lengths are proportionally set.

4. The method for synchronously processing a die and punch positioning plate according to claim 1, characterized in that: The area enclosed by the inner cavity contour (3) is larger than the area enclosed by the mounting hole contour (4). The cavity contour (3) is located in the die (1) which is the lower die for machining, and the punch positioning plate (2) where the mounting hole contour (4) is located is the upper die for machining.

5. The method for synchronously processing a die and punch positioning plate according to claim 1, characterized in that: The area enclosed by the inner cavity contour (3) is smaller than the area enclosed by the mounting hole contour (4). The inner cavity contour (3) is located in the die (1) which is the upper die for machining, and the punch positioning plate (2) of the mounting hole contour (4) is the lower die for machining.

6. A method for synchronously processing a die and a punch positioning plate according to claim 4 or 5, characterized in that: When the area enclosed by the inner cavity contour (3) is not the same as the area enclosed by the mounting hole contour (4), the processing steps include: S1: The upper processing mold is superimposed on the lower processing mold and placed on the processing station for simultaneous processing. At this time, the first scaling center (5) and the second scaling center (6) coincide with the processing station of the wire cutting machine tool, and the first orientation line (9) and the second orientation line (10) coincide and are set proportionally. S2: The upper and lower dies are processed simultaneously using a wire EDM machine tool, and the processing path of the wire EDM machine tool is the processing contour of the upper die. S3: After the wire EDM process is completed, remove the finished upper die. S4: Reposition and calibrate the machining station of the wire EDM machine. S5: Perform secondary machining on the lower die that has already undergone one machining operation. The machining path for the secondary machining is the machining contour of the lower die.

7. A method for synchronously machining a die and a punch positioning plate according to claim 6, characterized in that: The machining mold that has completed one machining operation has a machined outline. Within the machined outline, there is a first reference line and a second reference line that coincide with two mutually perpendicular axes of the wire EDM machine. The first reference line and the machined outline have two intersection points, and the second reference line and the machined outline have two intersection points.

8. The method for synchronously processing a die and a punch positioning plate according to claim 7, characterized in that: In step S4, the specific operation is as follows: the wire cutting machine moves along the first reference line, and when the distance between the two intersection points of the wire cutting machine and the first reference line is the same, the current value of the wire cutting machine is compared for calibration; the wire cutting machine moves along the second reference line, and when the distance between the two intersection points of the wire cutting machine and the second reference line is the same, the current value of the wire cutting machine is compared for calibration.

9. A method for synchronously processing a die and a punch positioning plate according to claim 8, characterized in that: The calibration method involves moving the lower die, which has already undergone one machining operation, along either a first reference line or a second reference line.

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