Microstrip line surface with self-phase modulation function phase adhesive film

Abstract

This invention discloses a phase adhesive film with self-phase modulation function on the surface of a microstrip line, belonging to the field of communication and radar technology. Its aim is to achieve flexible and precise phase control using a low-cost method. This invention achieves flexible and precise phase control through miniaturized coating of the phase adhesive film on the copper conductor strip of the microstrip line, which is of great significance for phase consistency adjustment of communication devices. This method has low manufacturing cost and a simple control method, and is more adaptable to the current trend of integrated and miniaturized devices.

Description

Technical Field

[0001] This invention relates to the fields of communication and radar, to the accuracy and security of information transmission, and particularly to a phase film with self-phase modulation function on the surface of a microstrip line. Background Technology

[0002] Many components in applications such as radar and communications, including power divider amplifiers, microwave power amplifiers, and transceiver components, require multi-channel signal coherence (coherence), meaning continuous signal phase or a constant phase difference. To avoid the impact of carrier amplitude noise on the performance of the communication system, it is necessary to compensate for the phase difference between different batches of modules. This involves measuring and adjusting the phase of the microstrip lines in the radio frequency circuit to meet the phase consistency requirements between modules.

[0003] Currently, the most mature phase consistency adjustment methods in the industry utilize phase modulation modules or phase-shifting networks. However, in recent years, as electronic products have become increasingly integrated, miniaturized, and flexible, these devices, due to their relatively large rigid modules, are unsuitable for the precise monitoring and flexible control of integrated miniaturized flexible electronic products. Furthermore, these devices are also relatively expensive and require sophisticated and complex operating procedures.

[0004] For the reasons mentioned above, this invention provides a phase adhesive film with self-phase modulation function on the surface of a microstrip line. Flexible phase modulation can be achieved by miniaturizing the phase adhesive film on the copper conductor strip of the microstrip line. This method has extremely low manufacturing costs and a simple operation process, making it suitable for modulation of highly integrated miniaturized electronic devices. Summary of the Invention

[0005] This invention aims to effectively solve the technical problems existing in current phase consistency modulation processes. To this end, this invention provides a phase adhesive film with self-phase modulation function on the surface of a microstrip line. Phase consistency adjustment can be achieved by layering a miniaturized phase adhesive film onto a copper conductor strip on the microstrip line surface. This method uses low-cost raw materials, has a simple process flow, and offers flexible control effects, making it well-suited for highly integrated small flexible electronic devices.

[0006] The technical solution provided by this invention is as follows: A phase adhesive film with self-phase modulation function on the surface of a microstrip line includes the following steps: micro-coating a phase adhesive film with a dense cross-interconnect structure onto a copper conductor strip on the surface of the microstrip line, wherein the phase adhesive film is composed of the following components: S1, at least one selected from epoxy resin E-51, epoxy resin E-44, epoxy resin E-31, epoxy resin 615, and epoxy resin 616; S2, at least one of the following selected from benzyl glycidyl ether, alkylene glycidyl ether, 1,4-butanediol diglycidyl ether, and phenyl glycidyl ether; S3, at least one of the following: polyetheramine D-230, polyamide 140-3, methylhexahydrophthalic anhydride, or dicyandiamide.

[0007] Furthermore, one or more compounds among S1, S2, and S3 are thoroughly mixed, wherein the mass ratio of S2 to S1 is 1:9 to 3:17, and the mass ratio of S3 to S1 is 0.1:1 to 1.5:1.

[0008] Furthermore, the preparation process of the phase adhesive film is as follows: Step 1: Mix one or more of the compounds S1, S2, and S3 until the mixture is clear and free from stratification or flocculation, thus obtaining the phase colloid. Step 2: Apply a small amount of phase adhesive to the copper conductor strip on the surface of the microstrip line. The width of the adhesive layer should be the same as the conductor strip width, and the length should be 5-15% of the conductor strip length. The thickness of a single layer should be 0.2-1 mm. The phase adhesive film should be uniform and dense, completely covering this part of the conductor strip, and should not diffuse to the surface of the underlying dielectric substrate. Step 3: Vacuum curing is performed on the microstrip lines coated with phase adhesive film in Step 2. The curing conditions depend on the properties of different curing agents, generally 25~180℃, and the curing time is 4~24h.

[0009] Step 4: Remove the cured microstrip line from Step 3 and allow it to cool naturally to room temperature (25°C). Then, adjust the required number of coating layers according to the monitored phase hysteresis value. That is, repeat the operations in Steps 1-3 above, where the number of coating layers is 1 to 5.

[0010] Furthermore, the microstrip line structure comprises a dielectric substrate, a copper conductor strip on its surface, and a copper ground plane on its back side. The dielectric substrate is at least one of alumina ceramic, glass fiber reinforced epoxy resin, polytetrafluoroethylene, polyimide, Duroid 5880, and Duroid 5870.

[0011] Compared with the prior art, the beneficial effects of the present invention are: (1) The present invention achieves phase modulation by micro-scale local coating of phase adhesive film on the copper conductor strip on the surface of microstrip line, which causes a change in the relative permittivity of the local region of microstrip line. The mechanism equation is as follows: In the formula, f is the signal frequency; l is the signal transmission channel length; ε rLet be the relative permittivity of the microstrip line. From this equation, it can be seen that at a specific operating frequency and microstrip line length, the phase is proportional to the square root of the relative permittivity of the microstrip line. Therefore, in phase consistency adjustment, simply selecting a channel as a standard for normalization processing easily achieves phase consistency adjustment. Compared to existing modulation techniques, this method significantly reduces operating costs and complexity while maintaining modulation effectiveness, demonstrating significant application value.

[0012] (2) The present invention achieves phase modulation of microstrip lines by micro-coating phase adhesive film on copper conductor strips on the surface of microstrip lines. Compared with the more mature phase shifting networks in the industry, it has lower manufacturing costs, simpler and more flexible control methods, and is more suitable for highly integrated and miniaturized electronic devices.

[0013] (2) The phase film described in this invention has an extremely low outgassing rate and reliable moisture absorption characteristics. It will not have any negative impact on electronic devices and can achieve consistent adjustment of the microstrip line phase while ensuring normal operation of the devices.

[0014] (3) The phase film described in this invention does not contain any toxic substances and has environmentally friendly characteristics. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments: Figure 1 This is a schematic diagram of the microstrip line coated with a phase adhesive film in Example 1; Figure 2 The phase modulation results are shown in Example 1 and the comparative example; Figure 3 The transmission performance test results for Example 1 and the comparative example are shown, where (a) is the voltage standing wave ratio (VSWR) of Example 1 and the comparative example in the 1-4 GHz band. SWR (b) represents the insertion loss (S) of Example 1 and the comparative example in the 1-4 GHz frequency band. 21 ). Detailed Implementation

[0016] Example 1: A phase adhesive film with self-phase modulation function on the surface of a microstrip line includes the following steps: (1) Mix 4g of epoxy resin (E-51), 0.71g of diluent (benzyl glycidyl ether) and 1.48g of curing agent (polyetheramine D-230) until homogeneous to obtain phase adhesive solution; (2) Apply 1 mg of the phase adhesive solution from step (1) evenly and smoothly onto the copper conductor strip on the surface of the microstrip line. The coating size is 0.2 mm wide, 5 mm long, and the single layer thickness is 0.3 mm. Then, vacuum cure at room temperature (25°C) for 6 h. (3) After completion, remove the microstrip line coated with a single layer of phase adhesive film and allow it to cool naturally to room temperature (25°C).

[0017] Comparative example: The difference between the comparative example and Example 1 is that the microstrip line surface in the comparative example is not coated with a phase adhesive film, while the rest of the steps are the same as in Example 1.

[0018] Figure 1 This is a schematic diagram of the phase adhesive film coating on the surface of the microstrip line in Example 1. As shown in the figure, only a small amount of phase adhesive film needs to be coated on the conductor strip on the surface of the microstrip line. This method is simple to operate and requires very little amount.

[0019] Figure 2 The phase modulation results of Example 1 and the comparative example respectively demonstrate that only 1 mg of phase film is needed to achieve a phase lag of 14.1° at a frequency of 4 GHz, providing reliable phase modulation results.

[0020] Figure 3 The figures show the transmission performance test results for Example 1 and the comparative example, respectively, where (a) represents the voltage standing wave ratio (VSWR) of Example 1 and the comparative example in the 1-4 GHz frequency band. SWR (b) represents the insertion loss (S) of Example 1 and the comparative example in the 1-4 GHz frequency band. 21 As shown in the figure, the phase adhesive film coating has little impact on the transmission performance of the microstrip line and has good usability.

[0021] The above examples are preferred embodiments of the present invention, but the implementation method of the present invention is not limited to the above examples. The phase adhesive film is not limited to a certain material. As long as a formula is selected according to the phase adhesive composition and the operation method described in the invention is followed, the technical effect of the present invention can be achieved.

Claims

1. A microstrip line assembly, characterized in that, The microstrip line assembly includes a microstrip line and a phase adhesive film with self-phase modulation function on the surface of the microstrip line, wherein the phase adhesive film is composed of the following components: S1, at least one selected from epoxy resin E-51, epoxy resin E-44, epoxy resin E-31, epoxy resin 615, and epoxy resin 616; S2, at least one of benzyl glycidyl ether, alkylene glycidyl ether, or phenyl glycidyl ether; S3, at least one of the following: polyetheramine D-230, polyamide 140-3, methylhexahydrophthalic anhydride, or dicyandiamide.

2. A microstrip line assembly according to claim 1, characterized in that, The preparation steps of the phase film include thoroughly mixing the compounds in S1, S2, and S3 until homogeneous.

3. A microstrip line assembly according to claim 1, characterized in that, The fabrication method of the microstrip line assembly includes the following steps: Step 1: Mix and stir the compounds in S1, S2 and S3 until clear and free of stratification and flocculation, thus obtaining the phase colloidal solution; Step 2: Apply phase adhesive to the copper conductor strip on the surface of the microstrip line. The width of the coating is the same as the conductor strip, the length is 5 to 15% of the conductor strip length, and the thickness of a single layer is 0.2 to 1 mm. The phase adhesive film should be uniform and dense to completely cover this part of the conductor strip without diffusing to the surface of the underlying dielectric substrate. Step 3: The microstrip lines coated with phase adhesive film in Step 2 are subjected to vacuum curing treatment at a curing temperature of 25~180 ℃ and a curing time of 4~24 h. Step 4: Remove the cured microstrip line from Step 3 and allow it to cool naturally to room temperature. Then, adjust the required number of coating layers according to the monitored phase hysteresis value and repeat the operations in Steps 1-3 above.

4. A microstrip line assembly according to claim 1, characterized in that, The microstrip line consists of a dielectric substrate, a copper conductor strip on its surface, and a copper ground plane on its back.

5. A microstrip line assembly according to claim 4, characterized in that, The dielectric substrate is at least one of alumina ceramic, glass fiber reinforced epoxy resin, polytetrafluoroethylene, and polyimide.

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