An ultra-precision grinding tool for a high-aspect-ratio complex surface with high steepness and a method of using the same

By designing microstructured grooves and optimizing the grinding process for grinding tools on complex surfaces with large aspect ratios and steepness in hard and brittle materials, the problems of unstable grinding force and poor surface quality were solved, achieving high-precision and low-damage machining results.

CN118559556BActive Publication Date: 2026-07-21HARBIN INST OF TECH +2
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HARBIN INST OF TECH
Filing Date
2024-06-25
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

Existing technologies are insufficient to effectively address the problems of unstable grinding force and poor surface quality in ultra-precision grinding of complex surfaces with large aspect ratios and high steepness in hard and brittle materials.

Method used

The design employs a micro-structured groove design distributed circumferentially along the central axis of the hemispherical grinding wheel surface, with the groove spacing gradually increasing. Combined with picosecond laser processing and in-situ repair technology, the grinding process parameters are optimized to control the grinding force and chip thickness, thereby achieving stable grinding.

Benefits of technology

It enables low-damage machining of complex surfaces with large aspect ratios and steepness in hard and brittle materials, improves machining accuracy and efficiency, ensures constant grinding force, and is suitable for ultra-precision machining of a variety of hard and brittle materials.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a kind of ultra-precision grinding tools for large aspect ratio high steep complex surface and its using method, grinding tool includes grinding wheel, grinding wheel is hemispherical structure, the side of the grinding wheel is equipped with several microstructure grooves distributed along the central axis, microstructure groove is divergent from center to periphery, the spacing between adjacent grooves gradually changes according to rules.This application changes the micro groove arrangement spacing to adapt to different curvature grinding area on one hand, on the other hand, by refining chip thickness to achieve a wide plastic domain removal, significantly reduce the roughness and waviness of grinding surface;In addition, in the using method, the material removal rate is kept unchanged, the machining efficiency of grinding process is not reduced.This application can be popularized to ultra-precision machining of glass, crystal, ceramic and other types of optical element complex surface.
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