Film coating apparatus for semiconductor wafer processing capable of eliminating bubbles

Abstract

The application relates to a film coating device for semiconductor wafer processing, and belongs to the technical field of semiconductor wafer processing, in particular to a film coating device for semiconductor wafer processing capable of eliminating bubbles, which comprises a processing table, a winding assembly, a compaction assembly and a positioning assembly arranged outside the processing table. In the application, the protective film is placed between the compaction roller and the positioning roller, the winding rod rotates under the influence of the winding spring, the middle part of the protective film is extruded by the side walls of the compaction roller and the positioning roller, the force from the pulling during the winding process is concentrated on the part between the compaction roller and the winding shaft, the side wall of the positioning disc and the dynamic protective film are clamped into the inside of the positioning groove, the edge position of the protective film is fixed, the two sides of the protective film are positioned, the pulling of the protective film is avoided, and the deformation of the protective film is avoided. The application solves the problem that the existing protective film is prone to deformation during the winding process.

Description

Technical Field

[0001] This invention relates to the field of semiconductor wafer processing technology, and in particular to a coating apparatus for semiconductor wafer processing that can eliminate air bubbles. Background Technology

[0002] Semiconductor wafers are a basic material used to manufacture integrated circuits. They are usually made of single-crystal silicon and have a circular or square flat plate shape. The surface of the wafer undergoes special treatment to achieve very high purity and flatness. The quality and manufacturing process of semiconductor wafers have a significant impact on the final performance of integrated circuits. During the processing of semiconductor wafers, a thin film is often needed to cover the wafer surface to protect it from contamination and damage.

[0003] Chinese Patent CN117087156A discloses a coating apparatus for semiconductor wafer processing capable of eliminating air bubbles, relating to the field of semiconductor wafer processing technology, and includes a support assembly. In use, during the coating process, an air pump is activated, and gas drawn in through the inlet pipe is pressurized and delivered to the air chamber through the outlet pipe. The gas in the air chamber then presses down the bubble-eliminating plate and the silicone sealing piston until the defoaming roller presses against the protective film on the coating stage. The defoaming roller rotates and presses simultaneously during the coating process, reducing friction and protecting the film. After the film is firmly attached, two multi-stage electric actuators are simultaneously activated, pushing the entire defoaming assembly forward. During this pushing process, the defoaming roller firmly presses against the protective film and the semiconductor wafer body, thus eliminating air bubbles.

[0004] In the aforementioned existing technical solution, a protective film is laid on top of the coating stage, and then the protective film is squeezed by a defoaming roller to adhere to the top of the semiconductor wafer. At the same time, defoaming is performed. After the protective film is adhered, it is cut with a cutting tool. Then, the semiconductor wafer with the protective film is removed and a new semiconductor wafer is placed on it. In actual use, since the protective film needs to be wound on the winding roller, it needs to be kept as a whole for easy winding. After the protective film is cut, there are some holes on it. When the winding roller winds up the protective film, it will generate tension. The protective film is unevenly stressed due to the holes. The middle part of the protective film is prone to forming a "W" shape. The two ends of the protective film therefore converge towards the center. When the semiconductor wafer is coated again, the protective film will wrinkle or produce bubbles due to deformation. Summary of the Invention

[0005] To address the aforementioned technical problems, this invention proposes a coating apparatus for semiconductor wafer processing that can eliminate air bubbles. By placing a protective film between a compaction roller and a positioning roller, and rotating a winding rod under the influence of a winding spring, the middle portion of the protective film is pressed against the sidewalls of the compaction roller and the positioning roller. This concentrates the tensile force on the protective film during winding into the portion between the compaction roller and the winding shaft. Furthermore, the protective film, along with the moving protective film, is inserted into the positioning groove through the sidewall of the positioning disc, fixing the edge position of the protective film and positioning both sides of the protective film, thus preventing the protective film from being stretched and deformed.

[0006] The technical solution for achieving the objective of this invention is as follows: a coating apparatus for semiconductor wafer processing capable of eliminating air bubbles, comprising a processing table, two support legs fixedly mounted on the top wall of the processing table, a coating roll rotatably mounted on the side wall of the two support legs adjacent to each other, a mold groove formed on the top wall of the processing table, a winding assembly provided outside the processing table, the winding assembly including two winding frames fixedly mounted on the side wall of the processing table away from the support legs, a winding shaft rotatably mounted on the side wall of the two winding frames adjacent to each other, the winding shaft being fixedly connected to the output end of an external motor, and a compaction assembly provided on the top of the processing table, the compaction assembly including a compaction frame slidably mounted on the side wall of the processing table. The compaction frame has a lower pressure plate inside, and a compaction roller is installed at the bottom of the lower pressure plate. A positioning assembly is installed on the top of the processing table. The positioning assembly includes mounting slots on the left and right ends of the side wall of the processing table near the film roll. A winding rod is rotatably installed inside each of the two mounting slots. A winding spring is fixedly installed on the top wall of each of the two winding rods. The top of the winding spring is fixedly installed on the side wall of the compaction frame. A positioning groove is opened on the side wall of the compaction roller. The positioning groove is a triangular groove that surrounds the compaction roller. A positioning plate is rotatably installed on the side wall of each of the two winding rods. The side wall of the positioning plate is locked inside the positioning groove. A positioning roller is fixedly installed on the side wall of each of the two positioning plates.

[0007] In some embodiments, a limiting rod penetrating the interior of the compaction frame is fixedly installed on the top wall of the lower pressure plate, and a compaction spring is sleeved on the bottom end of the side wall of the limiting rod.

[0008] In some embodiments, the compaction frame has movable grooves on both the left and right inner walls, and a limiting groove is formed on the bottom inner wall of the movable groove. An installation frame is slidably installed inside the limiting groove, and an installation bearing is fixedly installed on the inner side wall of the installation frame. The two ends of the compaction roller are respectively fixedly installed on the inner side walls of the two installation bearings.

[0009] In some embodiments, guide frames are fixedly installed on both the left and right sides of the top wall of the processing table near the winding frame, and guide shafts are rotatably installed on the adjacent side walls of the two guide frames.

[0010] In some embodiments, a guide groove is provided on the top wall of the guide frame near the end of the coated roll. The guide groove is inclined at the end near the coated roll, and the part of the guide groove near the top is a downwardly concave arc shape.

[0011] In some embodiments, a rolling ball is rotatably mounted on the bottom end of the arc-shaped sidewall of the guide groove.

[0012] In some embodiments, the bottom of the processing table is provided with a reinforcement component, which includes two reinforcement plates fixedly installed on the bottom wall of the processing table. The two reinforcement plates have reinforcement grooves on their adjacent side walls. Reinforcement blocks are slidably installed inside the two reinforcement grooves. The reinforcement blocks are fixedly installed on the side wall of the compaction frame.

[0013] In some embodiments, a cutting assembly is provided on the top of the processing table. The cutting assembly includes a fixed platform fixedly installed on the top wall of the support leg. A lifting cylinder is fixedly installed on the top wall of the fixed platform, and a rotary motor is fixedly installed at the output end of the lifting cylinder.

[0014] In some embodiments, a mounting bracket is fixedly installed on the side wall of the rotary motor, and an adjustment groove is provided on the bottom wall of the mounting bracket. A tool holder is arranged inside the adjustment groove, and a blade is fixedly installed on the bottom wall of the tool holder.

[0015] In some embodiments, an adjusting bolt is rotatably mounted on the side wall of the fixed frame away from the rotary motor, and the tool holder is threaded onto the side wall of the adjusting bolt.

[0016] The significant advantages of this invention compared to existing technologies are:

[0017] Firstly, this invention places the protective film between the compaction roller and the positioning roller. The winding rod rotates under the influence of the winding spring, and the middle portion of the protective film is pressed against the side walls of the compaction roller and the positioning roller. This concentrates the tensile force on the protective film between the compaction roller and the winding shaft during the winding process. Furthermore, the protective film, along with the side wall of the positioning disc, is engaged with the positioning groove, fixing the edge position of the protective film and positioning both sides, thus preventing the protective film from being stretched and deformed. This solves the problem of existing protective films easily deforming during the winding process.

[0018] Secondly, this invention fixes the compaction roller by installing bearings and restricts the mounting frame by limiting grooves, thus limiting the range of vertical movement of the compaction roller and preventing the compaction roller from shifting. By utilizing the elasticity of the compaction spring, the lower pressure plate is pushed downward, so that the compaction roller has sufficient pressure to squeeze the protective film, preventing the protective film from not adhering tightly enough and causing air bubbles.

[0019] Thirdly, this invention guides the compaction roller through the bottom of the guide groove, facilitating its upward movement. This allows the compaction roller to fall into the interior of the arc-shaped portion of the guide groove, where it engages with the rolling ball inside. The arc-shaped portion of the guide groove limits the compaction roller, preventing it from rolling downwards. Simultaneously, the rolling ball inside the arc-shaped portion of the guide groove reduces friction during the roller's rotation, making it easier to wind the protective film onto the side wall of the winding shaft.

[0020] Fourthly, this invention, by fixing the reinforcing plate to the bottom wall of the processing table and then fixing the reinforcing block to the side wall of the compaction frame, indirectly increases the contact area between the compaction frame and the processing table through the cooperation of the reinforcing plate and the reinforcing block, thus ensuring the stability of the position of the compaction frame.

[0021] Fifthly, in this invention, the output end of a lifting cylinder pushes a rotary motor downwards, causing the blade to contact the protective film. The rotary motor then drives the blade to rotate one revolution, cutting the protective film attached to the wafer. An adjusting bolt is rotatably installed on the side wall of the mounting bracket away from the rotary motor, and the blade holder is threaded onto the side wall of the adjusting bolt. By threading the blade holder onto the side wall of the adjusting bolt, the position of the blade holder can be adjusted by rotating the adjusting bolt, making it convenient to adjust the cutting range according to the actual size of the wafer. Attached Figure Description

[0022] The present invention will be further explained below with reference to the accompanying drawings and embodiments:

[0023] Figure 1 This is a front view of the coating apparatus for semiconductor wafer processing of the present invention;

[0024] Figure 2 This is a schematic diagram of the guide groove shape of the present invention;

[0025] Figure 3 This is a front view of the compaction component of the present invention;

[0026] Figure 4 This is a cross-sectional view of the compaction frame of the present invention;

[0027] Figure 5 This is a front view of the compaction frame of the present invention;

[0028] Figure 6 This is a cross-sectional view of the fixing frame of the present invention.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1. Processing table; 2. Support leg; 3. Coated roll; 4. Cutting assembly; 41. Fixed table; 42. Lifting cylinder; 43. Rotary motor; 44. Fixed frame; 45. Adjusting groove; 46. Adjusting bolt; 47. Knife holder; 48. Blade; 5. Rewinding assembly; 51. Rewinding frame; 52. Rewinding shaft; 53. Guide frame; 54. Guide shaft; 55. Guide groove; 6. Compacting assembly; 61. Compacting frame; 62. Movable groove; 63. Lower pressure plate; 64. Limiting rod; 65. Compacting spring; 66. Limiting groove; 67. Mounting frame; 68. Mounting bearing; 69. Compacting roller; 7. Positioning assembly; 71. Mounting groove; 72. Rewinding rod; 73. Rewinding spring; 74. Positioning plate; 75. Positioning roller; 76. Positioning groove; 8. Reinforcing assembly; 81. Reinforcing plate; 82. Reinforcing groove; 83. Reinforcing block. Detailed Implementation

[0031] The present invention will now be described in detail, and the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] This invention provides an improved coating apparatus for semiconductor wafer processing that can eliminate air bubbles. The technical solution of this invention is as follows:

[0033] like Figure 1 - Figure 5As shown, a coating apparatus for semiconductor wafer processing capable of eliminating air bubbles includes a processing table 1. Two support legs 2 are fixedly mounted on the top wall of the processing table 1. A coating roll 3 is rotatably mounted on the side wall of the two support legs 2 adjacent to each other. A mold groove is formed on the top wall of the processing table 1. A winding assembly 5 is provided outside the processing table 1. The winding assembly 5 includes two winding frames 51 fixedly mounted on the side wall of the processing table 1 away from the support legs 2. A winding shaft 52 is rotatably mounted on the side wall of the two winding frames 51 adjacent to each other. The winding shaft 52 is fixedly connected to the output end of an external motor. The output end of the external motor drives the winding shaft 52 to rotate, allowing the winding shaft 52 to wind up the protective film extending outwards from the coating roll 3. For easy organization, a compaction assembly 6 is provided on the top of the processing table 1. The compaction assembly 6 includes a compaction frame 61 slidably mounted on the side wall of the processing table 1. A lower pressure plate 63 is provided inside the compaction frame 61, and a compaction roller 69 is provided at the bottom end of the lower pressure plate 63. By using the elasticity of the compaction spring 65 to push the lower pressure plate 63 downward, the side wall of the compaction roller 69 is made to fit against the top wall of the processing table 1. The semiconductor wafer to be coated is placed inside the mold slot on the processing table 1, and then one end of the protective film on the coating roll 3 is attached to the bottom end of the compaction roller 69 and pasted onto the side wall of the take-up shaft 52. By pushing the compaction assembly 6 to move towards the coating roll 3, the compaction roller 69 squeezes the protective film, so that the protective film is tightly pressed against the side wall of the semiconductor wafer. The protective film adheres tightly to the sidewall of the semiconductor wafer under the pressure of the compaction roller 69, which is horizontal at the bottom. This eliminates air bubbles. A positioning assembly 7 is provided on the top of the processing table 1. The positioning assembly 7 includes mounting grooves 71 on the left and right ends of the sidewall near the coating roll 3 on the processing table 1. A winding rod 72 is rotatably mounted inside each of the two mounting grooves 71. A winding spring 73 is fixedly mounted on the top wall of each of the two winding rods 72. The top of the winding spring 73 is fixedly mounted on the sidewall of the compaction frame 61. A positioning groove 76 is provided on the sidewall of the compaction roller 69. The positioning groove 76 is a triangular groove surrounding the compaction roller 69. The two winding rods 72 are rotatably mounted on the sidewall near each other. A positioning disc 74 is dynamically installed, and the side wall of the positioning disc 74 is inserted into the positioning groove 76. A positioning roller 75 is fixedly installed on the side wall of the two positioning discs 74 that are close to each other. Because the side wall of the protective film is in contact with the bottom end of the side wall of the compaction roller 69, the winding rod 72 rotates under the influence of the winding spring 73, so that the side wall of the positioning disc 74 drives the protective film to be inserted into the positioning groove 76 together, fixing the edge position of the protective film. The middle part of the protective film is squeezed against the side wall of the compaction roller 69 and the positioning roller 75, and the protective film is positioned in multiple places. This avoids the situation where the protective film deforms under tension due to uneven force after being cut, which would cause the compaction roller 69 to generate air bubbles or wrinkles during the process of squeezing the protective film.

[0034] like Figure 1 - Figure 5As shown, in one embodiment, to ensure sufficient downward pressure on the compaction roller 69, a limiting rod 64 penetrating the interior of the compaction frame 61 is fixedly installed on the top wall of the lower pressure plate 63. A compaction spring 65 is sleeved on the bottom end of the side wall of the limiting rod 64. By utilizing the elasticity of the compaction spring 65, the lower pressure plate 63 is pushed downward, so that the compaction roller 69 has sufficient pressure to squeeze the protective film, avoiding insufficient adhesion of the protective film and the generation of air bubbles. Movable grooves 62 are provided on both the left and right side walls inside the compaction frame 61. A limiting groove 66 is provided on the bottom wall inside the movable groove 62. A mounting frame 67 is slidably installed inside the limiting groove 66. A mounting bearing 68 is fixedly installed on the inner side wall of the mounting frame 67. The two ends of the compaction roller 69 are respectively fixedly installed on the inner side walls of the two mounting bearings 68. The compaction roller 69 is fixed by the mounting bearings 68, and the mounting frame 67 is restricted by the limiting grooves 66, limiting the range of vertical movement of the compaction roller 69 and preventing the compaction roller 69 from shifting.

[0035] like Figure 1 and Figure 2 As shown, in one embodiment, to facilitate the winding of the used protective film onto the side wall of the winding shaft 52, guide frames 53 are fixedly installed on both the left and right sides of the top wall of the processing table 1 near the winding frame 51. Guide shafts 54 are rotatably installed on the adjacent side walls of the two guide frames 53. By attaching the protective film to the top of the guide shaft 54 ​​and fixing it to the side wall of the winding shaft 52, the guide frames 53 support the protective film, preventing it from sticking to the corners of the side wall of the processing table 1, which would result in greater friction during film movement and potential breakage. A guide groove 55 is provided on the top wall of the guide frame 53 near the end of the coated roll 3. The guide groove 55 has a guide groove near the end of the coated roll 3. One end is inclined, and the part of the guide groove 55 near the top is a downward concave arc shape. A rolling ball is rotatably installed at the bottom end of the arc-shaped side wall of the guide groove 55. The bottom end of the guide groove 55 guides the compaction roller 69, making it easy for the compaction roller 69 to move upward and fall into the interior of the arc-shaped part of the guide groove 55, where it fits against the rolling ball. The arc-shaped part of the guide groove 55 limits the compaction roller 69, preventing it from rolling downward. At the same time, the rolling ball inside the arc-shaped part of the guide groove 55 reduces the friction of the compaction roller 69 when it rotates, making it easier to roll the protective film onto the side wall of the take-up shaft 52.

[0036] like Figure 1 - Figure 3As shown, in one embodiment, in order to ensure the stability of the compaction frame 61, a reinforcing component 8 is provided at the bottom of the processing table 1. The reinforcing component 8 includes two reinforcing plates 81 fixedly installed on the bottom wall of the processing table 1. Reinforcing grooves 82 are opened on the side wall of the two reinforcing plates 81 that are close to each other. Reinforcing blocks 83 are slidably installed inside the two reinforcing grooves 82. The reinforcing blocks 83 are fixedly installed on the side wall of the compaction frame 61. By fixing the reinforcing plates 81 to the bottom wall of the processing table 1 and then fixing the reinforcing blocks 83 to the side wall of the compaction frame 61, the contact area between the compaction frame 61 and the processing table 1 is indirectly increased through the cooperation of the reinforcing plates 81 and the reinforcing blocks 83, thus ensuring the stability of the position of the compaction frame 61.

[0037] like Figure 1 and Figure 6 As shown, in one embodiment, to facilitate the cutting of the protective film, a cutting assembly 4 is provided on the top of the processing table 1. The cutting assembly 4 includes a fixed platform 41 fixedly installed on the top wall of the support leg 2. A lifting cylinder 42 is fixedly installed on the top wall of the fixed platform 41. A rotary motor 43 is fixedly installed at the output end of the lifting cylinder 42. A fixed frame 44 is fixedly installed on the side wall of the rotary motor 43. An adjustment groove 45 is provided on the bottom wall of the fixed frame 44. A knife holder 47 is provided inside the adjustment groove 45. A blade 48 is fixedly installed on the bottom wall of the knife holder 47. The output end of the lifting cylinder 42 pushes the rotary motor 43 downward, so that the blade 48 contacts the protective film. Then, the rotary motor 43 drives the blade 48 to rotate one revolution, cutting the protective film attached to the wafer. An adjusting bolt 46 is rotatably installed on the side wall of the fixed frame 44 away from the rotary motor 43. The blade holder 47 is threadedly installed on the side wall of the adjusting bolt 46. By threading the blade holder 47 on the side wall of the adjusting bolt 46, the position of the blade holder 47 can be adjusted by rotating the adjusting bolt 46, so as to easily adjust the cutting range according to the actual size of the wafer.

[0038] The specific working method is as follows: The semiconductor wafer to be coated is placed inside the mold groove on the processing table 1. Then, one end of the protective film on the coating roll 3 is attached to the bottom end of the compaction roller 69 and pasted onto the side wall of the take-up shaft 52. The take-up rod 72 rotates under the influence of the take-up spring 73, so that the side wall of the positioning plate 74 drives the protective film into the interior of the positioning groove 76, fixing the edge position of the protective film. The middle part of the protective film is squeezed against the side wall of the compaction roller 69 and the positioning roller 75, positioning the protective film in multiple places. Then, the compaction frame 61 is pushed to move, so that the protective film is neatly attached to the processing table 1 and the top of the semiconductor wafer. After the protective film is cut, the compaction frame 61 is moved to move the compaction roller 69 into the interior of the guide groove 55. The protective film attached to the top of the processing table 1 is neatly separated from the processing table 1 under the guidance of the positioning roller 75, avoiding the stretching of the protective film, which would cause uneven length at both ends of the protective film and cause air bubbles or wrinkles to be generated by the compaction roller 69 during the compression of the protective film.

[0039] The compaction roller 69 is fixed by the mounting bearing 68, and the mounting frame 67 is restricted by the limiting groove 66 to limit the range of vertical movement of the compaction roller 69 and prevent the compaction roller 69 from deviating. By utilizing the elasticity of the compaction spring 65, the lower pressure plate 63 is pushed downward, so that the compaction roller 69 has sufficient pressure to squeeze the protective film and prevent the protective film from not adhering tightly enough and causing air bubbles.

[0040] The compaction roller 69 is guided by the bottom end of the guide groove 55, which facilitates the upward movement of the compaction roller 69. The compaction roller 69 falls into the interior of the arc-shaped part of the guide groove 55 and comes into contact with the rolling ball inside the arc-shaped part of the guide groove 55. The arc-shaped part of the guide groove 55 limits the compaction roller 69 and prevents it from rolling downward. At the same time, the rolling ball inside the arc-shaped part of the guide groove 55 reduces the friction of the compaction roller 69 when it rotates, making it easier to roll the protective film onto the side wall of the take-up shaft 52.

[0041] By fixing the reinforcing plate 81 to the bottom wall of the processing table 1 and then fixing the reinforcing block 83 to the side wall of the compaction frame 61, the contact area between the compaction frame 61 and the processing table 1 is indirectly increased through the cooperation of the reinforcing plate 81 and the reinforcing block 83, thus ensuring the stability of the position of the compaction frame 61.

[0042] By threading the blade holder 47 onto the side wall of the adjusting bolt 46, the position of the blade holder 47 can be adjusted by rotating the adjusting bolt 46, which makes it convenient to adjust the cutting range according to the actual size of the wafer. The output end of the lifting cylinder 42 pushes the rotary motor 43 to move downward, so that the blade 48 contacts the protective film. Then, the rotary motor 43 drives the blade 48 to rotate one revolution to cut the protective film attached to the wafer.

[0043] The technical means disclosed in this invention are not limited to those described above, but also include technical solutions composed of equivalent substitutions of the above technical features. Matters not covered in this invention are common knowledge to those skilled in the art.

Claims

1. A coating apparatus for semiconductor wafer processing capable of eliminating air bubbles, comprising a processing table (1), two support legs (2) fixedly mounted on the top wall of the processing table (1), a coating roll (3) rotatably mounted on the side wall of the two support legs (2) adjacent to each other, and a mold groove provided on the top wall of the processing table (1), characterized in that: The processing table (1) is provided with a winding assembly (5) on its exterior. The winding assembly (5) includes two winding frames (51) fixedly installed on the side wall of the processing table (1) away from the support leg (2). A winding shaft (52) is rotatably installed on the side wall of the two winding frames (51) that are close to each other. The winding shaft (52) is fixedly connected to the output end of an external motor. A compaction assembly (6) is provided on the top of the processing table (1). The compaction assembly (6) includes a compaction frame (61) slidably installed on the side wall of the processing table (1). A lower pressure plate (63) is provided inside the compaction frame (61). A compaction roller (69) is provided at the bottom end of the lower pressure plate (63). A positioning assembly (7) is provided on the top of the processing table (1). The positioning assembly (7) includes a positioning roller (69) opened on the side wall of the processing table (1). On the workbench (1), there are mounting slots (71) on both the left and right ends of the side wall near the film roll (3). Inside the two mounting slots (71), a winding rod (72) is rotatably installed. The top wall of the two winding rods (72) is fixedly installed with a winding spring (73). The top of the winding spring (73) is fixedly installed on the side wall of the compaction frame (61). A positioning slot (76) is provided on the side wall of the compaction roller (69). The positioning slot (76) is a triangular groove that surrounds the compaction roller (69). A positioning plate (74) is rotatably installed on the side wall of the two winding rods (72). The side wall of the positioning plate (74) is stuck inside the positioning slot (76). A positioning roller (75) is fixedly installed on the side wall of the two positioning plates (74).

2. The coating apparatus for semiconductor wafer processing capable of eliminating air bubbles according to claim 1, characterized in that: The top wall of the lower pressure plate (63) is fixedly installed with a limiting rod (64) that penetrates the interior of the compaction frame (61), and a compaction spring (65) is sleeved on the bottom of the side wall of the limiting rod (64).

3. The coating apparatus for semiconductor wafer processing capable of eliminating air bubbles according to claim 1, characterized in that: The compaction frame (61) has movable grooves (62) on both the left and right sides inside. The bottom wall of the movable groove (62) has a limiting groove (66). A mounting frame (67) is slidably installed inside the limiting groove (66). A mounting bearing (68) is fixedly installed on the inner side wall of the mounting frame (67). The two ends of the compaction roller (69) are respectively fixedly installed on the inner side walls of the two mounting bearings (68).

4. The coating apparatus for semiconductor wafer processing capable of eliminating air bubbles according to claim 1, characterized in that: Guide frames (53) are fixedly installed on both the left and right sides of the top wall of the processing table (1) near the winding frame (51), and guide shafts (54) are rotatably installed on the adjacent side wall of the two guide frames (53).

5. A coating apparatus for semiconductor wafer processing capable of eliminating air bubbles according to claim 4, characterized in that: The top wall of the guide frame (53) is provided with a guide groove (55) near the end of the film roll (3). The end of the guide groove (55) near the film roll (3) is inclined, and the part of the guide groove (55) near the top is a downward concave arc shape.

6. A coating apparatus for semiconductor wafer processing capable of eliminating air bubbles according to claim 5, characterized in that: A rolling ball is rotatably installed at the bottom of the arc-shaped sidewall of the guide groove (55).

7. A coating apparatus for semiconductor wafer processing capable of eliminating air bubbles according to claim 1, characterized in that: The bottom of the processing table (1) is provided with a reinforcement component (8). The reinforcement component (8) includes two reinforcement plates (81) fixedly installed on the bottom wall of the processing table (1). The two reinforcement plates (81) have reinforcement grooves (82) on their adjacent side walls. Reinforcement blocks (83) are slidably installed inside the two reinforcement grooves (82). The reinforcement blocks (83) are fixedly installed on the side wall of the compaction frame (61).

8. A coating apparatus for semiconductor wafer processing capable of eliminating air bubbles according to claim 1, characterized in that: The top of the processing table (1) is provided with a cutting assembly (4), which includes a fixed table (41) fixedly installed on the top wall of the support leg (2). A lifting cylinder (42) is fixedly installed on the top wall of the fixed table (41), and a rotary motor (43) is fixedly installed at the output end of the lifting cylinder (42).

9. A coating apparatus for semiconductor wafer processing capable of eliminating air bubbles according to claim 8, characterized in that: A fixing bracket (44) is fixedly installed on the side wall of the rotary motor (43). An adjustment groove (45) is opened on the bottom wall of the fixing bracket (44). A knife holder (47) is set inside the adjustment groove (45). A blade (48) is fixedly installed on the bottom wall of the knife holder (47).

10. A coating apparatus for semiconductor wafer processing capable of eliminating air bubbles according to claim 9, characterized in that: An adjusting bolt (46) is rotatably mounted on the side wall away from the rotary motor (43) of the fixed frame (44), and the tool holder (47) is threaded onto the side wall of the adjusting bolt (46).

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