一种无差别修复微缝隙的封头制备工艺
By combining thermal stress repair and laser technology to repair micro-gap in the end cap, the problem of insufficient sealing of the end cap was solved, and high-quality repair and performance improvement of the end cap were achieved.
CN118578055BActive Publication Date: 2026-07-17浙江晟益封头有限公司
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 浙江晟益封头有限公司
- Filing Date
- 2024-07-02
- Publication Date
- 2026-07-17
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Figure CN118578055B_ABST
Abstract
本发明涉及封头制备技术领域，且公开了一种无差别修复微缝隙的封头制备工艺，包括以下步骤：下料；清洗；加热；封头成型；修复微缝隙；后处理，为对封头中的微缝隙进行高效修复，采用热应力修复与激光技术相结合的工艺，通过热应力短时间内的高温加热和自然冷却的过程，实现了对微缝隙的初步处理，同时热应力修复通过产生局部的热应力场来驱动填充材料向裂缝内部渗透，为后续的激光修复打下基础，再采用激光技术进行进一步精细修复，通过比较封头裂缝面积大小来切换激光设备和调整工艺参数使激光的高能量密度将填充材料熔融并固化，从而实现对微缝隙的有效封闭，这种结合热应力修复和激光技术的修复方法，提高了修复效率和质量，节约了能源消耗。
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