Material transfer apparatus and method of material transport control

Abstract

The present disclosure provides a material transfer device, comprising: a plurality of conveying devices, each conveying device comprising at least two conveying parts, each conveying part comprising: a base, a first conveying assembly arranged on the base, the first conveying assembly comprising two states of buffer, conveying cutter disc and circuit board, in the buffer state, the cutter disc and the circuit board are located on the first conveying assembly; in the conveying state, the first conveying assembly sequentially conveys the cutter disc and the circuit board; the cutter disc stores at least one cutter for processing the circuit board. The present disclosure also provides a material conveying control method. The material conveying device and the material conveying control method realize the same side upper and lower cutter disc and circuit board, reduce the cost, save the workshop space, and improve the material replacement efficiency.

Description

Technical Field

[0001] This disclosure relates to the field of circuit board processing equipment technology, and more precisely, to a material transfer device and a material transport control method. Background Technology

[0002] Currently, to improve the production utilization rate of circuit board processing equipment, fully automatic drilling machines are developing towards automation and intelligence. Equipment automation inevitably leads to an increase in the number and size of machines, which reduces the capacity of equipment within the workshop and thus reduces overall workshop productivity. Therefore, how to integrate automated circuit board loading and unloading, and automated cutter head loading and unloading, to achieve a smaller footprint and higher material change efficiency has become a new challenge for fully automatic drilling equipment. Summary of the Invention

[0003] This disclosure aims to address the problems existing in the prior art by providing a material transfer device and a material transportation control method.

[0004] According to a first aspect of this disclosure, a material transfer device is provided, comprising: a plurality of conveying devices arranged along a second direction, each of the conveying devices including at least two conveying sections stacked along a height direction, each of the conveying sections including: a base, on which a first transport assembly extending along a first direction perpendicular to the second direction is disposed, the first transport assembly including two states: a buffer state and a conveying cutter head and a circuit board state; in the buffer state, the cutter head and the circuit board are located on the first transport assembly; in the conveying state, the first transport assembly sequentially conveys the cutter head and the circuit board; the cutter head stores at least one cutting tool for processing the circuit board.

[0005] In some optional embodiments of this disclosure, the first transport component includes a first transport member and a second transport member, wherein in a first direction, the first transport member is located between the worktable of the circuit board processing equipment and the second transport member; the first transport member buffers the cutter head, and the second transport member buffers the circuit board.

[0006] In some optional embodiments of this disclosure, a first limiting member and a second limiting member are further provided between the first transport member and the second transport member, the first limiting member being used to stop the cutter head, and the second limiting member being used to stop the circuit board; or, Position sensors are respectively installed under the cutter head and circuit board in the buffer state. The first transport component stops working in response to the signal of the corresponding position sensor, and the second transport component stops working in response to the signal of the corresponding position sensor.

[0007] In some optional embodiments of this disclosure, the base is provided with a first lifting member located at the bottom of the cutter head and a second lifting member located at the bottom of the circuit board. The first lifting member is used to change the height of the cutter head; the second lifting member is used to change the height of the circuit board.

[0008] In some optional embodiments of this disclosure, the base is further provided with a lifting member, which changes the height of the first transport component, so that the height of the first transport component is different when the cutter head or circuit board is being transported.

[0009] In some optional embodiments of this disclosure, the first transport component includes a first transport member and a second transport member, wherein in a first direction, the first transport member is located between the worktable of the circuit board processing equipment and the second transport member; the circuit board is buffered on the first transport member, and the cutter head is buffered on the second transport member.

[0010] In some optional embodiments of this disclosure, the base is provided with a first cutter head guide groove and a first circuit board guide groove extending in a first direction, the first cutter head guide groove and the first circuit board guide groove penetrating the area enclosed by the first transport component; The worktable of the circuit board processing equipment is provided with a second cutter head guide groove and a second circuit board guide groove extending along a first direction, and the length of the second cutter head guide groove is greater than the length of the second circuit board guide groove.

[0011] In some optional embodiments of this disclosure, the base is provided with a first guide groove extending in a first direction, the first guide groove penetrating the area enclosed by the first transport assembly; the first guide groove is used for the sequential passage of the pins of the cutter head and the circuit board; The worktable of the circuit board processing equipment is provided with a second guide groove extending along a first direction. The second guide groove includes a continuous first segment and a second segment. The second segment is located between the first segment and the transmission part. The depth or width of the second segment is greater than the depth or width of the first segment.

[0012] In some optional embodiments of this disclosure, a second transport component is provided on the worktable of the circuit board processing equipment. The second transport component has a first position and a second position in the height direction. When transporting the circuit board and the cutter head respectively, the second transport component switches between the first position and the second position.

[0013] According to a second aspect of this disclosure, a material transport control method is provided, applied to material transport equipment, comprising the following steps: S20: The transmission unit receives the cutter head and the circuit board in sequence, and the first transport component buffers the cutter head and the circuit board; S40: Controls the same-layer transmission section of multiple transmission devices to simultaneously transmit the cutting head to the worktable of the circuit board processing equipment along the first direction; S60: After a predetermined time interval, the same-layer transmission section of multiple transmission devices is controlled to simultaneously transmit the circuit board to the workbench along the first direction.

[0014] In some optional embodiments of this disclosure, before controlling the same-layer transmission section of multiple transmission devices to simultaneously convey the cutter head to the worktable of the circuit board processing equipment along a first direction, the method further includes: controlling a second transport component of the worktable to sequentially transport the circuit board and the cutter head to another layer of transmission sections stacked along the height direction.

[0015] In some optional embodiments of this disclosure, before the control of the co-layer transmission section of the multiple transmission devices to simultaneously transport the circuit board to the workbench along a first direction, the method further includes: controlling the multiple transmission devices to change their overall height to align with a second transport component of the workbench.

[0016] In some optional embodiments of this disclosure, the frequency at which the transmission unit transmits the tool disc to the worktable is less than the frequency of the transmission circuit board.

[0017] In some optional embodiments of this disclosure, on the conveying path formed by the conveying unit, the worktable, and the conveying unit, the cutter head is first-in, last-out, and the circuit board is last-in, first-out.

[0018] According to a third aspect of this disclosure, a material transport control method is provided, applied to material transport equipment, comprising the following steps: S320: The transmission unit receives the circuit board and the cutter head in sequence, and the first transport component buffers the circuit board and the cutter head; S340: Controls the same-layer transmission section of multiple transmission devices to simultaneously transmit circuit boards to the worktable of the circuit board processing equipment along a first direction; S360: After a predetermined time interval, the same-layer transmission section of multiple transmission devices is controlled to simultaneously transmit the tool disc to the recessed area of ​​the worktable along the first direction.

[0019] In some optional embodiments of this disclosure, before the same-layer transmission unit controlling multiple transmission devices simultaneously transmits the circuit board to the worktable of the circuit board processing equipment along a first direction, the method further includes controlling another layer transmission unit to sequentially receive the cutter head and the circuit board transmitted by the worktable.

[0020] According to a fourth aspect of this disclosure, a material transfer device is provided, comprising: a plurality of transfer devices, each of the transfer devices including at least two transfer sections stacked along a height direction, each of the transfer sections including: a base, on which a first transport component is disposed, the first transport component including two states: a buffer state and a transfer cutter head and a circuit board state; in the buffer state, the cutter head and the circuit board are located on the first transport component; in the transfer state, the first transport component simultaneously sends the cutter head and the circuit board outward; the cutter head stores at least one cutting tool for processing the circuit board.

[0021] According to a fifth aspect of this disclosure, a material transfer device is provided, comprising: a plurality of transfer devices, each of the transfer devices including at least four transfer sections stacked along a height direction, each transfer section including: a base, on which a first transport assembly is disposed, the first transport assembly including two states: a buffer state and a transfer cutter head and a circuit board state; in the buffer state, the cutter head and the circuit board are respectively located on the first transport assemblies of two transfer sections stacked along the height direction; in the transfer state, the first transport assembly sequentially sends the cutter head and the circuit board outward; the cutter head stores at least one cutting tool for processing the circuit board.

[0022] The material transfer equipment and material transport control method disclosed herein have the following technical effects: (1) The first transport component simultaneously buffers the cutter head and the circuit board, realizing the same-side and same-layer processing of the circuit board processing equipment for the upper and lower cutter heads and circuit boards. In the first direction of the extension of the first transport component, the cutter head is closer to the worktable than the circuit board, adapting to the layout of the cutter head and circuit board on the worktable, thus avoiding interference of the cutter head height on the circuit board transmission. (2) The cutter head and circuit board are transported separately at predetermined intervals, which can avoid the two from colliding and also avoid mutual interference between the transported cutter head and circuit board. (3) Reduce costs, reduce the floor space, and save workshop space. One material transfer equipment can realize tool changing and material changing. The material transfer equipment simultaneously buffers the cutter head and circuit board, and the cutter head and circuit board are changed one after another without affecting the processing, thus improving production efficiency.

[0023] Other features and advantages of this disclosure will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments of the present disclosure and, together with their description, serve to explain the principles of the present disclosure.

[0025] Figure 1 This is a partial structural schematic diagram of a circuit board processing equipment, a material transfer equipment, and a material transport equipment provided in an embodiment of this disclosure; Figure 2 This is a schematic diagram of a portion of the structure of a material transfer device provided in an embodiment of this disclosure; Figure 3 This is a schematic diagram of a portion of the structure of a material transfer device provided in an embodiment of this disclosure; Figure 4 This is a schematic diagram of the workbench structure of a circuit board processing equipment according to an embodiment of the present disclosure; Figure 5 This is a schematic diagram of a circuit board portion structure provided in an embodiment of the present disclosure; Figure 6 This is a schematic diagram of the cutter head structure provided in one embodiment of the present disclosure; Figure 7 This is a schematic diagram of a portion of the structure of a material transfer device provided in an embodiment of this disclosure; Figure 8 This is a schematic diagram of the workbench structure of a circuit board processing equipment according to an embodiment of the present disclosure; Figure 9 This is a schematic diagram of a portion of the structure of a material transfer device provided in an embodiment of this disclosure; Figure 10 This is a schematic diagram of the workbench structure of a circuit board processing equipment according to an embodiment of the present disclosure; Figure 11 This is a schematic diagram of a portion of the structure of a material transfer device provided in an embodiment of this disclosure; Figure 12 This is a schematic diagram of the second guide groove portion structure provided in an embodiment of this disclosure; Figure 13 This is a schematic diagram of the second guide groove portion structure provided in an embodiment of this disclosure; Figure 14 This is a schematic diagram of a partial structure of a circuit board processing equipment provided in an embodiment of this disclosure; Figure 15 This is a schematic diagram of the workbench structure of a circuit board processing equipment according to an embodiment of the present disclosure; Figure 16 This is a schematic diagram of the workbench structure of a circuit board processing equipment according to an embodiment of this disclosure.

[0026] Figures 1 to 16 The one-to-one correspondence between the component names and the attached reference numerals is as follows: 100, Circuit board processing equipment; 200, Material transfer equipment; 300, Self-propelled transfer equipment; 10. Workbench; 11. Second transport assembly; 12. Circuit board; 121. Circuit board pin; 13. Cutter head; 131. Cutter head pin; 14. Second cutter head guide groove; 141. Cutter head stop point; 15. Second circuit board guide groove; 151. Circuit board stop point; 16. Second guide groove; 161. First stop point; 162. Second stop point; 17. Buffer rack; 21. Transmission device; 22. Transmission section; 221. Base; 220. First transport assembly; 222. First transport component; 223. Second transport component; 224. First cutter head guide groove; 225. First circuit board guide groove; 226. First limiting component; 227. Second limiting component; 228. Third limiting component; 229. Fourth limiting component; 231. First lifting component; 232. Second lifting component; 233. First guide groove; 25. Base; 30. Workbench; 31. Machining area; 310. Circuit board; 32. Edge area; 33. Recessed area; 34. Transition area; 35. Second transport component; 36. Guide groove; 331. Cutter head; 332. Opening; 333. Buffer rack; 3331. Lifting component; 334. First recessed area; 335. Second recessed area. Detailed Implementation

[0027] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present disclosure.

[0028] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit this disclosure or its application or use.

[0029] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0030] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0031] The specific embodiments of this disclosure are described below with reference to the accompanying drawings.

[0032] In this article, terms such as "up," "down," "front," "back," "left," and "right" are used only to indicate the relative positional relationship between related parts, rather than to define the absolute position of these related parts.

[0033] In this article, "first," "second," "third," "fourth," etc., are used only to distinguish each other, and do not indicate the degree of importance or order, or the premise of each other's existence.

[0034] In this document, terms such as “equal,” “same,” “aligned,” “vertical,” “horizontal,” “above,” “flush,” “synchronous,” “at the same time,” and “in sequence” are not strict mathematical and / or geometric limitations, but also include errors that are understandable to those skilled in the art and permissible in manufacturing or use.

[0035] The material handling system disclosed herein includes circuit board processing equipment, material transfer equipment, and material transport equipment. The material transport equipment loads and unloads materials onto the material transfer equipment, which in turn conveys and buffers materials and loads and unloads materials onto the circuit board processing equipment. In the context of this disclosure, the circuit board processing equipment can be a drilling machine, a forming machine, a milling machine, a drilling and milling integrated machine, etc., without limitation. In the embodiments of this disclosure, the number of spindles of the circuit board processing equipment can be one, two, three, six, ten, twelve, etc., without any limitation. In the context of this disclosure, the material transport equipment can be a self-moving transport equipment that simultaneously stores a cutter head and a circuit board material box, or it can be two independent transport equipment: a cutter head transport equipment and a circuit board transport equipment. The cutter head transport equipment contains a material box for storing the cutter head, and the circuit board transport equipment contains a material box for storing circuit boards, which sequentially transport the cutter head and circuit boards to the material transfer equipment. In summary, the cutter head transport equipment and the circuit board transport equipment are AGV trolleys, self-moving guide trolleys, or rail transport vehicles that load material boxes, without any limitation.

[0036] This disclosed circuit board processing equipment includes a base, a crossbeam, a spindle, and a worktable. The worktable is mounted on the base, and a crossbeam is mounted above the worktable. At least one spindle is slidably mounted on the crossbeam. The worktable moves along a first direction on the base, the crossbeam is mounted above the worktable, and at least one spindle moves along a second direction on the crossbeam. Each spindle has a cutting tool clamped at its bottom end, and the cutting tool moves along a third direction to process the circuit board carried on the worktable. The worktable has at least one processing position, each processing position carrying one circuit board. A cutter head area is provided outside the processing position, and the cutting tool in the cutter head is used to process the circuit board at that processing position. The first, second, and third directions are perpendicular to each other. During the operation of the circuit board processing equipment, the spindle clamps the cutting tool to process the circuit board on the worktable. Circuit boards come in different types, with differences in materials, dimensions, thickness, hardness, etc., and the physical properties of different types of circuit boards vary greatly. However, these circuit boards are all fixed on the worktable, and the high-speed moving spindle clamps the cutting tool to process the circuit board. There are various ways to fix circuit boards to the worktable, including but not limited to: pneumatic clamps, bakelite boards, and suction devices. These methods ensure that the circuit boards are stably and reliably fixed to the worktable, preventing displacement during high-speed machining of the circuit boards. Cutting tools are consumables, and they are prone to wear and even breakage when machining relatively stationary circuit boards. Therefore, a device for detecting and replacing cutting tools is needed. A CBD (Chip Detector) and tool inspection assembly are used to detect cutting tools. Tool replacement involves setting up a tool turret area at the front of the worktable. The spindle clamps the old tool and moves it relative to the tool turret, unloading the old tool into the tool turret, and then picking up and loading a new tool from the tool turret. This completes the tool replacement process.

[0037] In one embodiment of this disclosure, a material transfer device is fixedly installed at the rear of a circuit board processing equipment. When the worktable of the circuit board processing equipment moves to the rear material exchange position, it aligns with one layer of the transfer section of the material transfer device, enabling unloading and loading of materials, including cutter heads and / or circuit boards. The material transfer device has at least two layers of transfer sections stacked in the height direction, forming a single transfer unit. The material transfer device includes multiple transfer units arranged linearly in the second direction. The number of transfer units is the same as the number of processing positions on the worktable of the circuit board processing equipment, and they correspond one-to-one. One end of each transfer unit simultaneously exchanges materials with multiple processing positions, while the other end sequentially exchanges materials with a material transport device. At least two layers of transfer sections in each transfer unit have the same structure, enabling the transfer and buffering of cutter heads and / or circuit boards.

[0038] In another embodiment of this disclosure, a material transfer device is fixedly installed at the front of the circuit board processing equipment. When the worktable of the circuit board processing equipment moves to the material exchange position at the front, it aligns with one layer of the transfer section of the material transfer device, enabling unloading and loading of materials, including cutter heads and / or circuit boards. The material transfer device has at least two layers of transfer sections stacked in the height direction, forming a single transfer unit. The material transfer device includes multiple transfer units arranged linearly in the second direction, with the number of transfer units matching the number of processing positions on the worktable of the circuit board processing equipment, and the two correspond one-to-one. One end of each transfer unit simultaneously exchanges materials with multiple processing positions, while the other end sequentially exchanges materials with the material transport equipment. At least two layers of transfer sections in each transfer unit have the same structure, enabling the transfer and buffering of cutter heads and / or circuit boards.

[0039] It should be noted that the material transfer equipment can be located either in front of or behind the circuit board processing equipment, and the order of the cutting head and circuit boards can be adjusted accordingly. In the circuit board processing equipment, the cutting head area is located in front of the worktable, where the cutting head is placed; the circuit boards are placed on the processing positions on the worktable opposite to the cutting head area. Specifically, if the material transfer equipment is located in front of the circuit board processing equipment, the circuit boards are transferred to the worktable before the cutting head during the transfer process. If the material transfer equipment is located in the rear of the circuit board processing equipment, the cutting head is transferred to the worktable before the circuit boards; simultaneously, the cutting head is closer to the worktable during the transfer process.

[0040] In the material transfer equipment, multiple conveying devices move up and down on a base to switch alignment with the worktable of the circuit board processing equipment, thereby realizing unloading and loading. Specifically, each conveying device includes at least two layers of conveying sections, with multiple conveying sections on the same layer aligned in the vertical direction. This allows the following to be achieved: the multiple conveying sections on the first layer simultaneously receive multiple circuit boards and / or cutting discs conveyed from the worktable of the circuit board processing equipment; after raising and lowering the height, the multiple conveying sections on the second layer simultaneously convey multiple circuit boards and / or cutting discs to the worktable of the circuit board processing equipment.

[0041] In some embodiments of this disclosure, the worktable of the circuit board processing equipment includes multiple processing positions, each processing position being equipped with a second transport component for conveying circuit boards and / or cutting discs. The unloading process is as follows: multiple second transport components rise synchronously, and each circuit board detaches from the worktable and is supported on the second transport component. Multiple transport devices of the material transfer equipment are raised and lowered as a whole, and multiple transport sections of the first layer align one-to-one with the second transport components of the multiple processing positions, so that multiple circuit boards that have completed processing are synchronously transferred from the second transport components to the corresponding multiple transport sections of the first layer. The multiple transport devices of the material transfer equipment are raised as a whole, and the second transport components of the multiple processing positions continue to rise and fall, so that the second transport components align with the transport sections of the first layer, and each cutting disc detaches from the buffer frame and is lifted onto the corresponding second transport component. Multiple second transport components work synchronously, and each cutting disc is synchronously transferred from the second transport components to the corresponding multiple transport sections of the first layer. The multiple transport devices of the material transfer equipment are raised and lowered as a whole, switching alignment with the multiple second transport components on the worktable. The loading process is as follows: Multiple transfer units on the second layer align with each second transport component. The cutter heads on these units are simultaneously transferred to their corresponding second transport components, which then transfer them to the buffer racks on the front of the worktable. As the second transport components descend, multiple transfer devices in the material transfer equipment rise and fall together, aligning the second transport components with the multiple transfer units on the second layer. Circuit boards on these units are simultaneously transferred to their corresponding second transport components. This completes one unloading and loading operation for the cutter heads and circuit boards. During unloading or loading, the second and third directions are aligned upwards, and the first and second transport components are aligned to ensure smooth transfer of the cutter heads or circuit boards between the material transfer equipment and the circuit board processing equipment.

[0042] This disclosure discloses a material transfer device, comprising: a plurality of conveying devices arranged along a second direction, each conveying device including at least two conveying sections stacked along a height direction, each conveying section including: a base, on which a first transport assembly extending along a first direction perpendicular to the second direction is disposed, the first transport assembly including two states: a buffer state and a conveying cutter head and a circuit board state; in the buffer state, the cutter head and the circuit board are located on the first transport assembly; in the conveying state, the first transport assembly sequentially conveys the cutter head and the circuit board; the cutter head stores at least one cutting tool for processing the circuit board.

[0043] This material transfer equipment, used for loading and unloading materials onto circuit board processing equipment, includes multiple identical transfer units. The first transport component of each unit simultaneously buffers both the cutting head and the circuit board, enabling same-side loading and unloading of the cutting head and circuit board on the circuit board processing equipment. In a first direction extending from the first transport component, the cutting head and circuit board are transported on the same layer, achieving same-side, same-layer loading of the cutting head and circuit board on the circuit board processing equipment, thus avoiding interference from the cutting head height on the circuit board transport. Furthermore, transporting the cutting head and circuit board sequentially at predetermined intervals avoids rear-end collisions and mutual interference. During loading, the transfer unit of this material transfer equipment sequentially transports the cutting head and circuit board on a base at predetermined intervals; during unloading, it also sequentially transports the circuit board and cutting head at predetermined intervals. This allows for both cutting head and circuit board replacement on the same side of the transfer equipment, and the first transport component of the same transfer unit buffers both the cutting head and circuit board on the same layer, reducing costs, saving workshop space, and improving production efficiency. In material transfer equipment, similar to the directional definition of circuit board processing equipment, the direction in which the circuit board or cutter head on the material transfer equipment is conveyed to the circuit board processing equipment is the first direction, the direction in which multiple transmission devices are arranged linearly is the second direction, and the height direction of at least two transmission parts stacked is the third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other.

[0044] In the material transfer equipment disclosed herein, the material transfer equipment includes multiple conveying devices, each of which includes at least two conveying sections stacked along the height direction. The multiple conveying devices move vertically as a whole along the height direction, so that the first and second transport components of any one of the conveying sections can be aligned with the second transport assembly of the worktable in the height direction. Specifically, the material transfer equipment includes multiple conveying devices arranged along a second direction, which are connected by connecting rods or conveying rollers. Each conveying device includes at least two conveying sections stacked along the height direction. The multiple conveying devices move vertically as a whole on a base along the height direction, so that the multiple transporting sections arranged along the second direction in each layer move vertically as a whole in the height direction. The worktable of the circuit board processing equipment includes multiple processing positions, the number of which is the same as the number of conveying devices, and the two are aligned one-to-one. The second transport assemblies of the multiple processing positions move up and down synchronously, and the second transport assemblies of the multiple processing positions rise to the same predetermined height.

[0045] In some optional embodiments of this disclosure, the first transport assembly includes a first transport member and a second transport member, with the first transport member located between the worktable and the second transport member in a first direction; the first transport member has a buffer cutter head, and the second transport member has a buffer circuit board.

[0046] Specifically, to achieve the buffering of cutter heads and circuit boards in the same-side, same-layer transfer section, two transfer sections in the height direction load and unload materials separately. Each transfer section's first transport component includes a first transport member and a second transport member, both independently controlled. They are capable of receiving and sending cutter heads and circuit boards at predetermined intervals, avoiding mutual rear-end collisions or interference between cutter heads and circuit boards transferred on the same layer. In the first direction, the first transport member is located between the worktable and the second transport member. In buffered state, the cutter head is buffered on the first transport member, and the circuit board is buffered on the second transport member. When the material transport equipment loads materials into the transfer section, the cutter head is transferred first, and the first and second transport members of the transfer section are controlled to operate, with the cutter head being transferred to the first transport member for buffering; then the circuit board is transferred, with the second transport member operating and the first transport member not operating, with the circuit board being transferred to the second transport member for buffering. A predetermined time interval is maintained during the process of the transfer section receiving the cutter head and circuit board; this time interval is sufficient to ensure that the cutter head is transferred to its designated position, and the sequential transfer of the two components is unaffected by each other.

[0047] When the material transfer equipment sends the cutting head and circuit boards to the circuit board processing equipment, the cutting head is conveyed first. The first transport component of the control unit operates, while the second transport component remains inactive. The cutting head is then transferred to the second transport assembly on the worktable. Next, the circuit boards are conveyed, with the first and second transport components operating simultaneously. The circuit boards are then transferred to the second transport assembly on the worktable. A predetermined time interval is maintained between the conveying of the cutting head and circuit boards to the second transport assembly. This time is sufficient to ensure that the cutting head is properly positioned on the worktable, and the sequential conveying of the two components is uninterrupted. The unloading process is similar. The worktable of the circuit board processing equipment conveys the circuit boards, with the first and second transport components operating simultaneously. The circuit boards are then buffered on the second transport component. Next, the cutting head is conveyed, with the first transport component operating and the second transport component remaining inactive. The cutting head is then buffered on the first transport component. When the material transfer equipment conveys the cutting head and circuit boards to the material transport equipment, the circuit boards are conveyed first, with the second transport component operating and the first transport component remaining inactive. The circuit boards are unloaded and conveyed to the material transport equipment. Finally, the cutting head is conveyed, with both the first and second transport components operating simultaneously. The cutting head is then conveyed to the material transport equipment. It should be noted that, similar to the loading process, during the unloading process, the cutter head and the circuit board are conveyed by the transmission unit at predetermined intervals to ensure that they are conveyed sequentially without colliding or interfering with each other during the conveying process.

[0048] In some optional embodiments of this disclosure, the first transport component includes at least two sets of first conveyors, and the second transport component includes at least two sets of second conveyors, with one end of each set of first conveyors aligned with each set of second conveyors and the other end facing the worktable.

[0049] The first transport component of the transmission section has a relatively long travel distance in a first direction. During this travel distance, it not only transports the circuit board or cutter head but also buffers it. Both transport and buffering are carried by the first transport component and / or the second transport component. Specifically, during buffering, the first transport component carries the cutter head, and the second transport component carries the circuit board; during transport, the first transport component transports the circuit board and / or cutter head, and the second transport component transports the circuit board and / or cutter head. The first transport component includes at least two sets of first transport bodies, and the second transport component includes at least two sets of second transport bodies. The cutter head is carried on at least two sets of first transport bodies. The first transport component also includes a first drive component, which drives the at least two sets of first transport bodies to synchronously transport the cutter head or circuit board. The circuit board is carried on at least two sets of second transport bodies. The second transport component also includes a second drive component, which drives the at least two sets of second transport bodies to synchronously transport the cutter head or circuit board.

[0050] The number of first conveyors is the same as the number of second conveyors. One end of each group of first conveyors is aligned with one group of second conveyors, and the other end faces the worktable. That is, in the first direction, the first conveyors are located between the second conveyors and the worktable. Aligning each group of first conveyors with each group of second conveyors means that the first conveyors are aligned with the second conveyors in the first and third directions to ensure smooth transport of the circuit board and the cutter head on at least two groups of first conveyors and at least two groups of second conveyors. In some preferred embodiments of this disclosure, both the first and second conveyors are pulley assemblies or guide rail assemblies.

[0051] In some optional embodiments of this disclosure, a first limiting member and a second limiting member are further provided between the first transport member and the second transport member. The first limiting member is used to stop the cutter head, and the second limiting member is used to stop the circuit board. The first transport assembly of the transmission unit includes a first transport member and a second transport member. The first transport member has a first limiting member and a third limiting member at both ends, and the second transport member has a second limiting member and a fourth limiting member at both ends. The first limiting member and the second limiting member are located between the first transport member and the second transport member. A plurality of position detection sensors are also provided on the base. The plurality of position detection sensors cooperate with the four limiting members to detect and sense the position of the cutter head or the circuit board, and stop the cutter head or the circuit board when it reaches a predetermined position.

[0052] Specifically, during the unloading process, upon receiving a control command for the receiving circuit board, the fourth limiting member rises. When the corresponding sensor detects the circuit board's presence, the control drive unit stops the first and second conveyor bodies sequentially, stopping the circuit board on one side of the fourth limiting member and buffering it on the second transport component. Upon receiving a control command for the receiving cutter head, the first limiting member rises. When the corresponding sensor detects the cutter head's presence, the control drive unit stops the first conveyor body, stopping the cutter head on one side of the first limiting member and buffering it on the first transport component. During the loading process, another layer of the transmission unit receives the circuit board or cutter head conveyed by the material transport equipment. Specifically, upon receiving a control command for the receiving cutter head, the third limiting member rises. When the corresponding sensor detects the cutter head's presence, the control drive unit stops the second and first conveyor bodies sequentially, stopping the cutter head on one side of the third limiting member and buffering it on the first transport component. Upon receiving the control command for the receiving circuit board, the second limit switch rises. When the corresponding sensor detects the circuit board's presence, the second conveyor stops operating, and the circuit board is stopped on one side of the second limit switch, thus buffering the circuit board on the second transport component. In this embodiment, the first limit switch is used to stop the cutter head during the unloading process, and the second limit switch is used to stop the circuit board during the loading process. Similarly, the third limit switch is used to stop the cutter head during the loading process, and the fourth limit switch is used to stop the circuit board during the unloading process. Typically, two of each limit switch are used, moving synchronously. The limit switches ensure that the circuit board and cutter head are stably and reliably buffered on the first transport component. Combined with the corresponding sensors, motion control and positioning become more precise and reliable.

[0053] In some optional embodiments of this disclosure, position sensors are respectively disposed under the cutter head and the circuit board in the buffered state. The first transport component stops working in response to the signal of the corresponding position sensor, and the cutter head is buffered on the first transport component. The second transport component stops working in response to the signal of the corresponding position sensor, and the circuit board is buffered on the second transport component.

[0054] Specifically, multiple position sensors are mounted on the base, each facing a corresponding cutter head and circuit board. When the cutter head moves on the first transport assembly, if the position sensor at the bottom detects a signal indicating that the cutter head is in position, the drive mechanism of the first transport component stops operating in response to the change in the corresponding position sensor's signal. The cutter head stops at a predetermined position on the first transport component. By adjusting the position of the position sensors, signal delay time, and deceleration of the first transport component, the position of the cutter head on the first transport component can be reasonably controlled. Similarly, when the circuit board moves on the first transport assembly, if the position sensor at the bottom detects a signal indicating that the circuit board is in position, the drive mechanism of the second transport component stops operating in response to the change in the corresponding position sensor's signal. The circuit board stops at a predetermined position on the second transport component. By adjusting the position of the position sensors, signal delay time, and deceleration of the second transport component, the position of the circuit board on the second transport component can be reasonably controlled. The position sensors' ability to sense and stop the cutter head and circuit board also achieves the purpose of controlling the cutter head and circuit board to stop at predetermined positions on the first transport assembly.

[0055] In some optional embodiments of this disclosure, the base is provided with a first lifting member located at the bottom of the cutter head and a second lifting member located at the bottom of the circuit board. The first lifting member is used to change the height of the cutter head; the second lifting member is used to change the height of the circuit board.

[0056] The transfer unit includes a first transport component extending along a first direction, and a first lifting member and a second lifting member within the area enclosed by the first transport component. In the buffer state, the first lifting member is located below the cutter head, and the second lifting member is located below the circuit board. In the transfer state, during loading, the transfer unit first receives the cutter head. After being transported by the first transport component, the cutter head is stopped by a third limiting member, controlling the first lifting member to rise. The first lifting member lifts the cutter head to a predetermined height, causing the cutter head to detach from the first transport component, and the cutter head is temporarily buffered on the first lifting member. The transfer unit then receives the circuit board. After being transported by the first transport component, the circuit board is stopped by a second limiting member, controlling the first lifting member to descend. The cutter head and the circuit board are simultaneously buffered on the same first transport component. During unloading, before sending the cutter head, the transfer unit controls the second lifting member to rise, and the circuit board is temporarily buffered on the second lifting member. The first transport component prepares to transport the cutter head, the third limiting member descends, and the cutter head is transported to the second transport component of the worktable until it reaches a predetermined position on the worktable. The circuit boards are then transported. After descending from the second lifting member, they are conveyed by the first transport component and sent to the second transport component of the worktable. The process of receiving circuit boards and cutter heads from the circuit board processing equipment, and sending the cutter heads and circuit boards to the material transport equipment, is similar to the previous process, except that the order of the circuit boards and cutter heads is reversed. Other adjustments are made accordingly and will not be elaborated here. It should be noted that the first lifting member lifts the cutter head from the first transport component, changing the height of the cutter head, thereby preventing the stationary cutter head from interfering with the first transport component's transport of the circuit boards. The second lifting member lifts the circuit boards from the first transport component, changing the height of the circuit boards, thereby preventing the stationary circuit boards from interfering with the first transport component's transport of the cutter head.

[0057] In some optional embodiments of this disclosure, a lifting component is further provided on the base. This lifting component changes the height of the first transport assembly, resulting in different heights of the first transport assembly when transporting the cutter head or circuit board. Specifically, a driven mechanism consisting of multiple conveying shafts and rollers is provided within the area enclosed between the first transport assemblies on the base. The lifting component on the base changes the height of the first transport assembly, causing it to move up and down relative to the driven mechanism. When transporting the cutter head or circuit board, the lifting component controls the lifting and lowering of the first transport assembly, thereby changing its height and ensuring that the cutter head and circuit board are transported sequentially without interference.

[0058] In some optional embodiments of this disclosure, the base is provided with a first cutter head guide groove and a first circuit board guide groove extending along a first direction, the first cutter head guide groove and the first circuit board guide groove penetrating the area enclosed by the first transport assembly. Specifically, the first cutter head guide groove is used to guide the movement of the cutter head on the transport section to ensure the position and orientation of the cutter head on the first transport assembly and improve the positioning accuracy of the cutter head. The circuit board is equipped with pins, and the first circuit board guide groove facilitates the passage of the pins, thereby realizing the transport guidance of the circuit board. At the same time, the first cutter head guide groove penetrates the area enclosed by the first transport assembly to adapt to the pins at the bottom of the cutter head, improving the stability and positioning accuracy of the cutter head transmission. In some preferred embodiments, the first cutter head guide groove is located below the center of gravity of the cutter head carried on the first transport component, this configuration improves the stability of the transmission of heavy cutter heads. In some preferred embodiments of this disclosure, the bottom of the cutter head is provided with at least two pins adapted to the first cutter head guide groove, the at least two pins are arranged along the width direction of the cutter head, and in a first direction, the at least two pins are located on both sides of the center of gravity of the cutter head. Specifically, both the cutter head and the circuit board have a square structure. To accommodate larger circuit boards and smaller cutter heads sharing the first and second transport components, the cutter head is arranged laterally on the transmission section, with its length in the second direction and its width in the first direction. At least two pins are located at the bottom of the cutter head, positioned on either side of its center of gravity. These pins improve the positioning accuracy and stability of the cutter head and allow it to share the transmission section with the circuit board, thus saving costs.

[0059] In some optional embodiments of this disclosure, the first transport assembly includes a first transport member and a second transport member, with the first transport member located between the worktable and the second transport member in a first direction; the first transport member has a buffer circuit board, and the second transport member has a buffer cutter head.

[0060] Specifically, to achieve the same-side, same-layer buffering of the cutter head and circuit board in the transfer section, two transfer sections in the height direction are used for loading and unloading respectively. Each transfer section's first transport component includes a first transport member and a second transport member, both independently controlled. They are capable of receiving and sending circuit boards and cutter heads at predetermined intervals, avoiding interference between the same-layer transfer of cutter heads and circuit boards. In the first direction, the first transport member is located between the worktable and the second transport member. In buffering mode, the first transport member buffers the circuit board, and the second transport member buffers the cutter head. When the material transport equipment loads the transfer section, it first transports the circuit board, controlling the first and second transport members of the transfer section to operate, and the circuit board is transferred to the first transport member for buffering; then it transports the cutter head, the second transport member operates, the first transport member does not operate, and the cutter head is transferred to the second transport member for buffering. A predetermined time interval is maintained during the process of the transfer section receiving the circuit board and cutter head; this time interval is sufficient to ensure that the circuit board is delivered to its designated position, and the sequential transfer of the two is not subject to mutual interference.

[0061] When the material transfer equipment sends circuit boards and a cutting head to the circuit board processing equipment, the circuit board is transferred first. The first transport component of the control unit operates, while the second transport component remains inactive. The circuit board is then transferred to the second transport assembly on the worktable. Next, the cutting head is transferred. The first and second transport components are then activated, and the cutting head is transferred to the second transport assembly on the worktable. A predetermined time interval is maintained between the transfer unit's transfer of the cutting head and circuit board to the second transport assembly. This time is sufficient to ensure that the circuit board is properly positioned on the worktable, and the sequential transfer of the two components does not interfere with each other.

[0062] The unloading process from the circuit board processing equipment to the material transfer equipment is as follows: The worktable of the circuit board processing equipment first conveys the cutting head, controlling the operation of the first and second transport components. The cutting head is then transferred to the second transport component for buffering. Next, the circuit boards are conveyed, controlling the first transport component to operate while the second transport component remains inactive. The circuit boards are then transferred to the first transport component for buffering. When the material transfer equipment conveys the cutting head and circuit boards to the material transport equipment, the cutting head is conveyed first, with the second transport component operating while the first transport component remains inactive. The cutting head is then unloaded and conveyed to the material transport equipment. Finally, the circuit boards are conveyed, with both the first and second transport components operating, and the circuit boards are conveyed to the material transport equipment. It should be noted that, similar to the loading process, during the unloading process, the cutting head and circuit boards are conveyed by the transfer unit at predetermined intervals to ensure that they are conveyed sequentially without collisions or mutual interference.

[0063] In some optional embodiments of this disclosure, the workbench is provided with a second cutter head guide groove and a second circuit board guide groove extending along a first direction, wherein the length of the second cutter head guide groove is greater than the length of the second circuit board guide groove.

[0064] To accommodate the first cutter head guide groove and the first circuit board guide groove of the machining unit's base, the corresponding cutter head with pins and the circuit board need to move on the worktable, and a pin guide groove also needs to be configured on the worktable. A second cutter head guide groove, aligned with the first cutter head guide groove, is used for guiding and positioning the cutter head on the worktable; a second circuit board guide groove, aligned with the first circuit board guide groove, is used for guiding the circuit board. In the entire circuit board processing equipment, the cutter head is located at the front of the worktable, and the material transfer device is located at the rear of the worktable. That is, in the first direction, the circuit board is located between the material transfer device and the cutter head. Compared to the circuit board, the cutter head has a greater stroke on the worktable; that is, the stroke of the cutter head on the worktable is greater than that of the circuit board. Furthermore, neither the second cutter head guide groove nor the second circuit board guide groove is a through groove. The second cutter head guide groove ends at the cutter head's endpoint on the worktable, and the second circuit board guide groove ends at the circuit board's endpoint. The starting points of both the cutter head and the circuit board are open Y-shaped openings located on the worktable near the transfer unit. The length from the starting point to the ending point of the cutter head is greater than the length from the starting point to the ending point of the circuit board. To avoid rear-end collisions between the cutter head and the circuit board during transport on the worktable, as well as mutual interference between the two during transport.

[0065] In some optional embodiments of this disclosure, the base is provided with a first guide groove extending in a first direction, the first guide groove penetrating the area enclosed by the first transport component; the first guide groove is used for the passage of the pins of the cutter head and the circuit board; the worktable is provided with a second guide groove extending in the first direction, the second guide groove including a continuous first segment and a second segment, the second segment being located between the first segment and the transport part, and the depth or width of the second segment being greater than the depth or width of the first segment.

[0066] For the base of the transmission unit and the machining position of the worktable, the cutter head and the circuit board can share a pin groove. The base is provided with a first guide groove extending in a first direction, penetrating the area enclosed by the first transport component. The worktable is provided with a second guide groove extending in the first direction, aligned with the first guide groove. The first and second guide grooves are used for the pins of the cutter head and the circuit board to pass through. The first guide groove is a through groove, while the second guide groove has a stop point and is not a through groove. Setting two stop points in a reasonable form helps to stop the cutter head and the circuit board. In some preferred embodiments, the second guide groove includes a continuous first segment and a second segment, the second segment being located between the first segment and the transmission unit, and the depth or width of the second segment being greater than the depth or width of the first segment. The second segment of the second guide groove is used to stop the circuit board, and the first segment of the second guide groove is used to stop the cutter head. Correspondingly, the length or diameter of the pins on the circuit board is greater than the length or diameter of the pins on the cutter head to stop the pins on the circuit board at the stop point, while allowing the cutter head pins to pass through the stop point. This configuration of the first and second guide slots saves costs and achieves the same technical effect of independently conveying the cutter head or circuit board without interference, without requiring excessive modifications to the worktable and cutter head.

[0067] In some optional embodiments of this disclosure, the second transport component has a first position and a second position in the height direction, and switches between the first position and the second position when transporting the circuit board and the cutter head respectively. Specifically, the second transport component has a first position and a second position in the height direction, the first position is used to transport the cutter head, and the second position is used to transport the circuit board, the first position being higher than the second position. The second transport component first rises to the first position, transports the cutter head to a predetermined position, and then lowers its height, at which point the cutter head is buffered on a rising buffer rack at the top of the cutter head. The second transport component lowers to the second position and continues to transport the circuit board until the circuit board is stopped above the worktable by a second circuit board guide groove or the end point of the second guide groove. The second transport component continues to lower its height, the buffer rack at the bottom of the cutter head lowers its height, and the circuit board and the cutter head are supported on the worktable. The circuit board is fixed by a pneumatic clamp assembly, and the cutter head is fixed by magnetic attraction. By changing its height, the second transport component transports the cutter head and the circuit board separately, so that the transport of the two does not interfere with each other.

[0068] This disclosure also provides a material transport control method, including the following steps: S20: a transport unit sequentially receives a cutter head and a circuit board, and a first transport component buffers the cutter head and the circuit board; S40: a transport unit of multiple transport devices on the same layer simultaneously transports the cutter head to the worktable of the circuit board processing equipment along a first direction; S60: after a predetermined time interval, a transport unit of multiple transport devices on the same layer simultaneously transports the circuit board to the worktable of the circuit board processing equipment along the first direction.

[0069] The material transfer equipment's transmission unit first receives the cutter head and circuit board sequentially, and buffers them on the first transport component. Once multiple transmission units on the same level have buffered the cutter head and circuit board, the system controls these units to simultaneously transport the cutter head to the worktable along a first direction. After the cutter head reaches the front of the worktable, the system controls these units to simultaneously transport the circuit board to the worktable along the first direction. This completes the sequential transfer of the cutter head and circuit board from the material transport equipment to the material transfer equipment, and the simultaneous transfer of the cutter head and circuit board from the material transfer equipment to the circuit board processing equipment. This completes one loading operation. This material transport control method has the following technical advantages: the first transport component buffers both the cutter head and circuit board, enabling simultaneous loading and unloading of the cutter head and circuit board on the same side and layer of the circuit board processing equipment. In the first direction extending from the first transport component, the cutter head is closer to the worktable than the circuit board, adapting to the layout of the cutter head and circuit board on the worktable and avoiding interference from the cutter head height during circuit board transport. Transporting the cutter head and circuit board sequentially at predetermined intervals avoids rear-end collisions and mutual interference between them. Reduce costs, minimize floor space, and save workshop space; a single material transfer device can achieve both tool and material changes. The material transfer device simultaneously buffers the tools and circuit boards, allowing for sequential replacement of the tool head and circuit boards without affecting processing and improving production efficiency.

[0070] In some embodiments of this disclosure, before the transfer unit sequentially receives the cutter head and the circuit board, the process further includes: controlling a second transport component of the worktable to sequentially transport the circuit board and the cutter head to another layer of transfer units stacked along the height direction. Specifically, before loading, the process further includes unloading the worktable to a material transfer device. Unloading involves the second transport component conveying the circuit board and the cutter head to another layer of transfer units, and then, through the transfer of the first transport component, sequentially receiving the processed cutter head and circuit board via the material transport setup.

[0071] In some embodiments of this disclosure, during a predetermined first time interval between the sequential reception of the cutter head and the circuit board by the transmission unit, the cutter head has been conveyed to its designated position on the transmission unit. In step S60, the predetermined time interval is a predetermined second time interval, during which the cutter head has been conveyed to its designated position on the worktable. During the conveyance of the cutter head and the circuit board on the first and second transport components, to avoid rear-end collisions, a predetermined time interval is required. After the cutter head has been conveyed to its designated position on the first transport component within the predetermined first time interval, the first transport component can receive the circuit board. On the worktable, the cutter head is conveyed first, and the second transport component conveys the cutter head to its designated position. The cutter head is located on the buffer rack, and after a predetermined second time interval, the second buffer rack conveys the circuit board. In the embodiments of the present invention, the predetermined first time is longer than the predetermined second time, which can improve material conveying efficiency.

[0072] In some embodiments of this disclosure, the process further includes controlling a plurality of conveying devices to change their overall height to align with the second transport component of the worktable after step S40 and before step S60. For the worktable of the circuit board processing equipment, the second transport component has different heights when conveying the cutter head and the circuit board. When the conveying unit of the material transfer equipment simultaneously conveys the cutter head to the worktable, the second transport component has a first position; when conveying the circuit board, the second transport component has a second position, and the height of the first position is greater than the height of the second position. For the material transfer equipment, whether conveying the circuit board or the cutter head, the height needs to be adjusted to align the first transport component of the conveying unit with the second transport component of the worktable. Therefore, after conveying the cutter head in step S40 and before conveying the circuit board in step S60, the height needs to be adjusted. Specifically, the height of the plurality of conveying devices is changed as a whole to align the plurality of first transport components of one layer of conveying devices with the plurality of second transport components on the corresponding worktable, thereby preparing for the conveying of the circuit board.

[0073] In some embodiments of this disclosure, the frequency at which the transmission unit conveys the cutting head to the worktable is less than the frequency at which the circuit boards are conveyed. In the embodiments of this disclosure, frequency refers to the number of times a certain task is completed within a predetermined time. Since a cutting head stores multiple cutting tools, these tools can satisfy the processing of multiple circuit boards, therefore the frequency of changing the cutting head and changing the circuit boards is different. Specifically, when the cutting tools in one cutting head can satisfy the processing of ten circuit boards, the frequency at which the transmission unit conveys the cutting head to the worktable is much less than the frequency at which the circuit boards are conveyed. In some preferred embodiments of the present invention, the circuit board processing equipment conveys the cutting head to the worktable 12 times in 24 hours, and the frequency at which the transmission unit conveys the circuit boards to the worktable is 144 times. This frequency at which the transmission unit conveys the cutting head is lower than the frequency at which the circuit boards are conveyed provides a low-cost solution for sharing the transmission on the same side, improves the efficiency of loading and unloading, and saves costs.

[0074] In some embodiments of this disclosure, on the conveying path formed by the conveying unit, worktable, and conveying unit, the cutter head is first-in, last-out (LIFO), and the circuit board is last-in, first-out (FIFO). During the unloading process, the circuit board is conveyed first, followed by the cutter head; during the loading process, the cutter head is conveyed first, followed by the circuit board. This order is determined by the structure of the circuit board processing equipment. The material transfer device is located at the rear of the circuit board processing equipment, and on the worktable, the cutter head is located at the front. In the entire first direction, the cutter head on the worktable is at the front, the circuit board on the worktable is in the middle, and the material transfer device is at the rear. For the material transfer device, on the path from the entry of a new circuit board into the circuit board processing equipment to its return after processing, that is, the processing path of the conveying unit, worktable, and conveying unit, the cutter head exits first, and the circuit board exits last. This conveying sequence and path ensures the smooth conveying of the cutter head and circuit board without interference or collision, providing a low-cost solution for same-side loading. Example

[0075] This embodiment takes a six-axis drilling machine as the circuit board processing equipment and a two-section first transport component of the material transfer equipment as an example to explain in detail the structure of the material transfer equipment and the steps of the control method applied on the material transfer equipment.

[0076] like Figure 1 As shown, the material loading and unloading system of this embodiment includes a circuit board processing equipment 100, a material transfer equipment 200, and a material transport equipment 300. The material transport equipment 300 is located behind the circuit board processing equipment 100, and the three are arranged along the first direction of material conveying. Figure 4 As shown, the circuit board processing equipment 100 includes a worktable 10 with six processing positions. Each processing position carries a circuit board 12. A second transport component 11 is provided at the bottom of the circuit board 12 at each processing position. A cutter head area is provided on the front side of the circuit board 12 at each processing position, and at least one cutter head 13 is fixed in the cutter head area. Figure 2 , Figure 3 As shown, the material transfer equipment 200 includes six conveying devices 21. Each conveying device 21 includes two layers of conveying sections 22 stacked along the height direction. The six conveying devices 21 move up and down along the base 25 as a whole, so that the first transport component 220 of each of the six conveying sections 22 aligns with the second transport component 11 of the six processing positions on the worktable 10. When the first transport component 220 of the conveying section 22 aligns with the second transport component 11, the first transport component 220 sequentially receives the circuit board 12 and the cutter head 13 conveyed by the second transport component 11, or sequentially sends the cutter head 13 and the circuit board 12 to the second transport component 11.

[0077] In this embodiment, as Figure 2 , Figure 3As shown, six conveying devices 21 are arranged linearly along a second direction, and the first transport component 220 of each conveying unit 22 extends along a first direction, which is perpendicular to the second direction. The first transport component 220 includes two states: buffer and conveying the cutter head 13 and circuit board 12. The conveying unit 22 needs to convey the two materials, the cutter head 13 and the circuit board 12, to the worktable 10. However, the material transport equipment 200 conveys the cutter head 13 and the circuit board 12 to each conveying unit 22 sequentially. Therefore, the cutter head 13 and the circuit board 12 are in a buffer state in the first transport component 220. After all six conveying units 22 on the same layer have completed loading, the cutter head 13 and the circuit board 12 are simultaneously conveyed to the worktable 10. In the buffer state, in the first direction, the cutter head 13 is located between the circuit board 12 and the worktable 10 of the circuit board processing equipment; that is, the cutter head 13 and the circuit board 12 are buffered in the first transport component 220 in a predetermined order and position. This position and order can ensure that the cutter head 13 and the circuit board 12 are loaded and unloaded on the same side without interference. In the conveying state, the first transport component 220 sequentially transports the cutter head 13 and the circuit board 12. Sequential transport here means that the circuit board 12 is not transported while the cutter head 13 is being transported, and vice versa; they are transported separately with a predetermined time difference or interval, without affecting or interfering with each other. Specifically, the first transport component 220 first transports the cutter head 13 to the worktable 10, and after a predetermined time interval, then transports the circuit board 12 to the worktable 10. When unloading into the material transport equipment 300, the circuit board 12 is first transported to the material transport equipment 300, and after a predetermined time interval, the cutter head is then transported to the material transport equipment 300. This sequential transport method avoids a collision between the cutter head 13 and the circuit board 12 on the first transport component 220. The cutter head 13 and the circuit board 12 have a specific relationship; the cutter head 13 stores at least one cutting tool for processing the circuit board 12. In this embodiment, the cutter head 13 stores all types of cutting tools required for processing the circuit board 12, and the cutting tools in the cutter head 13 can be used to process multiple circuit boards 12. For circuit board processing equipment, sequentially feeding circuit boards 12 and cutting discs 13 on the same side can improve efficiency and save time.

[0078] In this embodiment, as Figure 3 , Figure 4 , Figure 7 , Figure 8As shown, the first transport assembly 220 includes a first transport member 222 and a second transport member 223. In the buffer state, in a first direction, the first transport member 222 is located between the worktable 10 and the second transport member 223; the first transport member 222 buffers the cutter head 13, and the second transport member 223 buffers the circuit board 12. In the conveying state, the conveying unit 22 sequentially conveys the cutter head 13 and the circuit board 12. Specifically, the first transport member 222 first conveys the cutter head 13 to the second transport assembly 11, and after a predetermined interval, the second transport member 223 then conveys the circuit board 12 to the second transport assembly 11. During the unloading process, when the second transport assembly 11 conveys the cutter head 13 and the circuit board 12 to the conveying unit 22, the second transport assembly 11 first conveys the circuit board 12 to the conveying unit 22, and after being conveyed by the first transport member 222, it is buffered on the second transport member 223; after a predetermined interval, the second transport assembly 11 then conveys the cutter head 13 to the conveying unit 22, which is buffered on the first transport member 222.

[0079] The first transport component 222 includes two sets of synchronously moving first conveyor bodies, and the second transport component 223 includes two sets of synchronously moving second conveyor bodies. The first and second conveyor bodies serve as driving wheels, and multiple axially connected rollers are arranged between and on both sides of the two sets of first and second conveyor bodies as driven wheels. The driving and driven wheels jointly transport the circuit board 12 and the cutter head 13. Simultaneously, each set of first conveyor bodies is aligned with each set of second conveyor bodies in a first direction and a height direction to ensure that the circuit board 12 and the cutter head 13 are transported along the first direction. In this embodiment, the first and second conveyor bodies are pulley assemblies, each driven by an independent motor to operate or stop, thereby achieving individual control over the transport of the circuit board 12 or the cutter head 13.

[0080] In this embodiment, as Figure 7 As shown, a first limiting member 226 and a second limiting member 227 are also provided in the area between the first transport member 222 and the second transport member 223. The first limiting member 226 is used to stop the cutter head 13, and the second limiting member 227 is used to stop the circuit board 12. A first limiting member 226 and a third limiting member 228 are provided at both ends of the first transport member 222, and a second limiting member 227 and a fourth limiting member 229 are provided at both ends of the second transport member 223. The first limiting member 226 and the second limiting member 227 are located between the first transport member 222 and the second transport member 223. The third limiting member 228 is closer to the worktable 10 side, and the fourth limiting member 229 is closer to the material transport equipment 300 side. The four limiting members, in conjunction with corresponding position sensors, can stop the cutter head 13 on the first transport member 222, so that the cutter head 13 changes from a conveying state to a buffering state; they can also stop the circuit board 12 on the second transport member 223, so that the circuit board 12 changes from a conveying state to a buffering state.

[0081] In this embodiment, as Figure 3 , Figure 7 As shown, the transmission unit 22 includes a base 221, on which a first cutter head guide groove 224 and a first circuit board guide groove 225 extending in a first direction are provided. It should be noted that the first cutter head guide groove 224 and the first circuit board guide groove 225 are located between two sets of first and second transmission bodies. Their specific positions can be configured according to the pins of the circuit board 12 and the cutter head 13. The first cutter head guide groove 224 is used to guide the cutter head 13 and allows the pins 131 of the cutter head 13 to pass through; the first circuit board guide groove 225 is used to guide the circuit board 12 and allows the pins 121 of the circuit board to pass through. Figure 5 and Figure 6 The diagram illustrates the circuit board pin 121 and the cutter head pin 131. The first cutter head guide groove 224 and the first circuit board guide groove 225 extend along a first direction and are parallel to the first and second conveyors. The first cutter head guide groove 224 and the first circuit board guide groove 225 penetrate the area enclosed by the first transport assembly 220; that is, they are through guide grooves. The first cutter head guide groove 224 has Y-shaped openings at both ends to guide the cutter head pin 131 smoothly into the groove; the first circuit board guide groove 225 also has Y-shaped openings at both ends to guide the circuit board pin 121 smoothly into the groove.

[0082] like Figure 4 , Figure 8As shown, correspondingly, a second cutter head guide groove 14 and a second circuit board guide groove 15 extending along a first direction are provided on the worktable 10 of the circuit board processing equipment. The second cutter head guide groove 14 is aligned with the first cutter head guide groove 224 to ensure smooth transition of the cutter head pin 131; the second circuit board guide groove 15 is aligned with the first circuit board guide groove 225 to ensure smooth transition of the circuit board pin 121. Since the cutter head 13 and the circuit board 12 are at different positions on the worktable, their stopping points are different. In this embodiment, guide grooves are used on the worktable to stop the cutter head and the circuit board. Specifically, the second cutter head guide groove 14 has a cutter head stopping point 141 at the end away from the material transfer device to stop the cutter head pin 131, allowing the cutter head 13 to stop on the second transport component 11 at the cutter head stopping point 141. The second circuit board guide groove 15 has a circuit board stopping point 151 at the end facing away from the material transfer equipment to stop the circuit board pin 121, allowing the circuit board 12 to stop on the second transport component 11 at the circuit board stopping point. On the second transport component 11, the cutter head 13 is closer to the front than the circuit board 12, so the position of the cutter head stopping point 141 is closer to the front than the position of the circuit board stopping point 151. That is, the second cutter head guide groove 14 has a certain length, the distance from the Y-shaped opening facing the material transfer equipment 200 to the cutter head stopping point 141. Similarly, the second circuit board guide groove 15 also has a certain length, the distance from the Y-shaped opening facing the material transfer equipment 200 to the circuit board stopping point 151; therefore, the length of the second cutter head guide groove 14 is greater than the length of the second circuit board guide groove 15. On the one hand, the cutter head 13 and circuit board 12 can be stopped by using the stop points of the guide grooves, saving costs. On the other hand, this length relationship can ensure the positional relationship of the cutter head 13 and circuit board 12 on the second transport assembly, so that the cutter head 13 and circuit board 12 can accurately stop at the corresponding positions on the worktable. In this embodiment, the second cutter head guide groove 14 and the second circuit board guide groove 15 are not through guide grooves. At the stop points 141 and 151, the groove openings are closed and no longer extend. When the circuit board pin 121 stops at the stop point 151, the circuit board 12 stops being transported; when the cutter head pin 131 stops at the stop point 141, the cutter head 13 stops being transported.

[0083] This embodiment of the material transfer equipment also discloses a material transportation control method, which mainly includes the following steps: S20: The transfer unit sequentially receives the cutter head and the circuit board, and the first transport component buffers the cutter head and the circuit board. For material transfer equipment, each transfer unit needs to receive the cutter head and the circuit board and buffer them on the first transport component.

[0084] In this embodiment, the material handling equipment includes a cutter head conveying device and a circuit board conveying device. One cutter head conveying device carries multiple cutter heads and moves from its initial position to align with a transfer device in the material transfer equipment, conveying the cutter heads to the first-level transfer section. The cutter head conveying device then moves along a second direction to align with another transfer device to convey the cutter heads. Similarly, the cutter head conveying device sequentially aligns with six transfer devices, conveying the cutter heads sequentially to the first-level transfer section of each transfer device. The cutter head conveying device completes the loading process, and the six transfer sections sequentially receive the cutter heads and buffer them on the first transport component of the transfer section.

[0085] After the cutter head conveyor completes its loading, the circuit board conveyor begins loading. Specifically, the circuit board conveyor moves from its starting point to a transfer device near the material transfer equipment, conveying circuit boards to the first-level transfer section. The circuit board conveyor then moves in a second direction, aligning with another transfer device to convey circuit boards. Similarly, the circuit board conveyor aligns with all six transfer devices sequentially, conveying circuit boards to the first-level transfer section of each device. The material transfer equipment receives the six circuit boards and buffers them on the first transport component of each transfer section.

[0086] For the material transfer equipment, the six transfer sections on the first layer first receive the cutter heads in sequence, and after being transported by the second transport component, each cutter head is sequentially buffered on the first transport component of its respective transfer section. After a predetermined interval, the six transfer sections on the first layer then receive the circuit boards in sequence, and each circuit board is sequentially buffered on the second transport component of its respective transfer section.

[0087] S40: Controlling the same-layer transfer units of multiple transfer devices to simultaneously transfer the cutting head to the worktable of the circuit board processing equipment along a first direction. Six transfer units on the same layer simultaneously transfer the cutting head to the worktable.

[0088] For circuit board processing equipment, a material transfer device is needed to automatically add cutter heads and circuit boards. After the circuit board processing equipment and the material transfer device exchange loading signals, the six second transport components of the worktable rise and fall to the first position, aligning with the first transport components of the six transmission sections, ready to receive the cutter heads. In the six transmission sections of the material transfer device, the third limiting member descends, and each of the first transport components begins to work, conveying the cutter heads to the worktable along the first direction. The cutter head pin smoothly transitions along the first cutter head guide groove to the second cutter head guide groove on the worktable. The second transport components drive the cutter heads to continue moving, and the cutter head pin moves within the second cutter head guide groove until the cutter head reaches its cutter head stop point. The cutter head buffer rises, lifting and buffering the cutter heads. Through the transmission of the first transport components and the second transport components, the six cutter heads are simultaneously transferred from the first-layer transmission section to the cutter head buffer on the worktable. In this way, the first-layer transmission sections of the six transmission devices simultaneously convey six cutter heads to the worktable along the first direction.

[0089] S60: After a predetermined time interval, the same-layer transmission units of multiple transmission devices simultaneously convey circuit boards to the worktable of the circuit board processing equipment along a first direction. Six transmission units on the same layer simultaneously convey circuit boards to the worktable.

[0090] In this embodiment, a predetermined time interval is required between the transfer of the cutter head and the conveyed circuit board to prevent a rear-end collision. After the cutter head is transferred to the worktable, the circuit board processing equipment and the material transfer equipment exchange signals, and the six second transport components of the worktable rise and fall to a second position. In this embodiment, the height of the second position is less than the height of the first position. In the second position, the second transport components are ready to receive the circuit board. At this time, the cutter head is located in the buffer rack, and the two are at different heights, so they do not interfere with or affect each other. To accommodate the descent height of the second transport components, the six transmission devices of the material transfer equipment are lowered as a whole so that the six first-layer transmission sections are aligned with the second transport components.

[0091] After the second transport component aligns with the first transport component, the second limiting component descends. The second and first transport components operate sequentially, and the circuit board buffered in the second transport component is moved onto the second transport component via the transfer between the second and first transport components. The first and second circuit board guide grooves provide guidance for the circuit board pins until the circuit board pins reach the end point of the second circuit board guide groove, where the circuit board stops on the second transport component. The first layer of the six transport devices of the material transfer equipment simultaneously transports six circuit boards to the worktable along the first direction.

[0092] After the circuit board is transferred to the second transport assembly, the height of the second transport assembly is controlled to be higher than the first position. The cutter head and the circuit board are simultaneously buffered on the second transport assembly. The cutter head buffer frame descends, and the second transport assembly descends until the circuit board is placed on the processing position of the worktable, and the cutter head is placed on the cutter head area. Then, the pneumatic clamp assembly fixes the circuit board, and the magnetic suction assembly fixes the cutter head. The cutter head and the circuit board have completed the task of sequentially loading materials on the same side.

[0093] In this embodiment, before the transmission unit sequentially receives the cutter head and the circuit board, the method further includes: controlling the second transport component of the worktable to sequentially transport the circuit board and the cutter head to another layer of transmission units stacked along the height direction. Before loading, the method also includes a process of unloading the worktable of the circuit board processing equipment to the material transfer equipment. Specifically, the second transport component switches between a first position and a second position along the height direction to transport the circuit board and the cutter head to the second layer of transmission units of the material transfer equipment. The transport process includes, when the second transport component is in the second position, the second transport component transports the circuit board to the first transport component. After being transported by the first transport component, the circuit board is stopped by the fourth limiting member and buffered on the second transport component. At this time, the cutter head is located in the cutter head buffer frame. After the circuit board is transported, the circuit board processing equipment and the material transfer equipment exchange signals, the second transport component rises to the first position to lift the cutter head, and the six corresponding transmission devices also rise to align with the second transport component. The cutter head is transferred from the cutter head buffer frame to the second transport component. After being transported by the second transport component, the cutter head is transferred from the worktable to the first transport component of the second layer of transmission units. The first limiting member rises, and the cutter head is buffered on the first transport component. In this way, the finished circuit boards and the used cutting heads are unloaded from the circuit board processing equipment to the material transfer equipment, completing the unloading process. Similar to the loading process, six circuit boards are unloaded simultaneously first, followed by six cutting heads. The circuit boards and cutting heads on the worktable are unloaded sequentially, providing a fully automated solution for loading and unloading on the same side.

[0094] In this embodiment, the transmission unit sequentially receives the cutter head and the circuit board at predetermined intervals for a first time. During this first time interval, the cutter head has been conveyed to its designated position on the transmission unit. A predetermined second time interval follows, during which the cutter head has been conveyed to its designated position on the worktable. The first time interval includes not only the conveying of the cutter head on the transmission unit but also the positioning of the circuit board transport equipment and its alignment with the material transfer equipment. During the second time interval, the cutter head is conveyed to its designated position on the worktable. Therefore, the first time interval is longer than the second time interval. Setting a time difference between the first and second times avoids interference between the cutter head transport equipment and the circuit board transport equipment, while also preventing the circuit board from colliding with the cutter head. Efficiency is also considered. The first time interval being longer than the second time interval is based on safety considerations, as both transport equipment require reasonable safety clearance time.

[0095] In this embodiment, the cutter head stores more than 300 cutting tools, which are used to process the circuit boards at the corresponding processing positions. Processing one circuit board requires only 4 to 6 cutting tools. Therefore, the frequency of replacing circuit boards is much higher than the frequency of replacing the cutter head. That is, in a 24-hour continuous operation of the circuit board processing equipment, the cutter head may need to be replaced 12 times, and the circuit boards may need to be replaced 144 times. Therefore, the frequency of replacing the cutter head is much lower than the frequency of replacing circuit boards, and the frequency of the transport unit conveying the cutter head to the worktable is lower than the frequency of conveying circuit boards. This high-capacity cutter head configuration reduces the number of cutter head replacements and improves the efficiency of loading and unloading materials on the same side.

[0096] In the material transport control method of this embodiment, for the material transfer equipment, on the conveying path formed by the transmission section, the worktable, and the transmission section, the cutter head is first-in, last-out, and the circuit board is last-in, first-out. The material transfer equipment loads and unloads the cutter head and circuit board onto the circuit board processing equipment on the same side. The cutter head and circuit board are transported using the same first and second transport components, eliminating the problem of tailgating between the cutter head and the circuit board. By allowing the cutter head to be first-in, last-out, and the circuit board to be last-in, first-out, the tailgating is avoided. The structure is simple and the cost is low, providing a technical solution for loading and unloading materials sequentially on the same side. Example

[0097] This embodiment takes a six-axis drilling machine as a circuit board processing equipment, and the first transport component and additional lifting component of the material transfer equipment as examples to explain in detail the structure of the material transfer equipment and the steps of the control method applied on the material transfer equipment.

[0098] The material transfer equipment in this embodiment is basically similar to that in Embodiment 1, except that the cutter head and the circuit board share the first guide groove, the first transport component is an integral structure, and a buffer lifting component is provided between the first transport components. The circuit board processing equipment is basically similar to that in Embodiment 1, except that the cutter head and the circuit board share the second guide groove, the depth of the guide groove is different, and the pin lengths of the cutter head and the circuit board are different.

[0099] In this embodiment, as Figure 9 , Figure 10As shown, the structure of the material transfer equipment is basically the same as that of Embodiment 1, except that the first transport component 220 is a through transport component. A first lifting component 231 is provided on the base 221 facing the worktable 10, which is used to change the height of the cutter head and buffer the cutter head 13. A second lifting component 232 is provided on the base 221 facing the material transport equipment 300, which is used to change the height of the circuit board and buffer the circuit board 12. Simultaneously, a through first guide groove 233 is provided between the first transport components 220, allowing the pins 121 of the circuit board and the pins 131 of the cutter head to pass through. Y-shaped openings are provided at both ends of the first guide groove 233.

[0100] like Figure 10 As shown, the worktable 10 of the circuit board processing equipment is provided with a second guide groove 16. The second guide groove 16 has different depths, and the second guide groove 16 of different depths can be used to stop the cutting head or the circuit board. For the second guide groove 16, the opening facing the material transfer device 200 is a Y-shaped opening; near the front of the worktable, it includes a first stopping point 161 and a second stopping point 162. The first stopping point 161 is used to stop the circuit board, and the second stopping point 162 is used to stop the cutting head. Figure 10 , Figure 12 As shown, in the second guide groove 16, the second section of the guide groove from the Y-shaped opening to the first stop point 161 has a first depth, and the first section of the guide groove from the first stop point 161 to the second stop point 162 has a second depth. The depth of the second section of the guide groove is greater than the depth of the first section of the guide groove; that is, the first depth is greater than the second depth. Correspondingly, the pin 121 of the circuit board 12 moves within the second section of the guide groove, and the pin 131 of the cutter head moves within both the second section of the guide groove and the first section of the guide groove. Therefore, to accommodate the different depths of the two sections of the second guide groove 16, the length of the pin 121 of the circuit board 12 is greater than the length of the pin 131 of the cutter head 13, so as to ensure that the circuit board pin 121 stops at the end point 161 of the second section of the guide groove.

[0101] Since the structure of the material transfer equipment is basically similar to that of Embodiment 1, it will not be described again here. The material transportation control method will be explained in detail below.

[0102] S120: The transfer unit sequentially receives the cutter head and the circuit board, and the first transport component buffers the cutter head and the circuit board. For material transfer equipment, each transfer unit needs to receive the cutter head and the circuit board and buffer them on the first transport component.

[0103] In this embodiment, the material handling equipment includes a cutter head conveying device and a circuit board conveying device. One cutter head conveying device carries multiple cutter heads and moves from its initial position to align with a transfer device in the material transfer equipment, conveying the cutter heads to the first-level transfer section. The cutter head conveying device then moves along a second direction to align with another transfer device to convey the cutter heads. Similarly, the cutter head conveying device sequentially aligns with six transfer devices, conveying the cutter heads sequentially to the first-level transfer section of each transfer device. The cutter head conveying device completes the loading process, and the six transfer sections sequentially receive the cutter heads, temporarily buffering each cutter head on the first transport component of the transfer section.

[0104] The first lifting member on the base rises, lifting the cutter head, which then leaves the first transport assembly and is temporarily buffered on the first lifting member, which is at a height higher than the first transport assembly. The first transport assembly is then ready to receive the circuit board.

[0105] After the cutter head conveyor completes its loading, the circuit board conveyor begins loading. Specifically, the circuit board conveyor moves from its starting point to a transfer device near the material transfer equipment, conveying circuit boards to the first-level transfer section. The circuit board conveyor then moves in a second direction, aligning with another transfer device to convey circuit boards. Similarly, the circuit board conveyor aligns with all six transfer devices sequentially, conveying circuit boards to the first-level transfer section of each device. The material transfer equipment receives the six circuit boards and buffers them on the first transport component of each transfer section.

[0106] For the material transfer equipment, the six transfer sections on the first layer first receive the cutter heads sequentially, and after being conveyed by the first transport component, each cutter head is sequentially buffered on the first lifting member of its respective transfer section. After a predetermined interval, the six transfer sections on the first layer then sequentially receive circuit boards, each circuit board being sequentially buffered on the first transport component of its respective transfer section. While buffering the circuit boards on the first transport component, the first lifting member descends, and the cutter heads are buffered on the first transport component. At this time, both the cutter heads and circuit boards are buffered on the first transport component simultaneously. In the buffered state, in the first direction, the cutter heads are located at the front, the circuit boards at the rear, and the cutter heads are positioned between the worktable and the circuit boards.

[0107] S140: The same-layer transmission units of multiple transmission devices simultaneously transmit the cutting head to the worktable of the circuit board processing equipment along a first direction. Six transmission units on the same layer simultaneously transmit the cutting head to the worktable.

[0108] For circuit board processing equipment, a material transfer device is needed to automatically add cutter heads and circuit boards. After the circuit board processing equipment and the material transfer device exchange loading signals, the six second transport components of the worktable rise and fall to the first position, aligning with the first transport components of the six transmission sections, ready to receive the cutter heads. In the six transmission sections of the material transfer device, the second lifting member rises, lifting the circuit board. The height of the circuit board is higher than the first transport component, and it is temporarily buffered on the second lifting member. The third limiting member descends, and each of the first transport components begins to work, conveying the cutter heads to the worktable along the first direction. The cutter head pin smoothly transitions along the first guide groove to the second guide groove on the worktable. The second transport component drives the cutter head to continue moving, and the cutter head pin moves within the second guide groove until the second stopping point. The cutter head buffer rises, lifting and buffering the cutter head. After being conveyed by the first and second transport components, the six cutter heads are simultaneously transferred from the first-layer transmission section to the cutter head buffer on the worktable. In this way, the first-layer transmission sections of the six transmission devices simultaneously convey six cutter heads to the worktable along the first direction.

[0109] S160: After a predetermined time interval, the same-layer transmission units of multiple transmission devices simultaneously convey circuit boards to the worktable of the circuit board processing equipment along a first direction. Six transmission units on the same layer simultaneously convey circuit boards to the worktable.

[0110] In this embodiment, a predetermined time interval is required between the delivery of the cutter head and the conveyed circuit board to prevent a rear-end collision. After the cutter head is conveyed to the worktable, the circuit board processing equipment and the material transfer equipment exchange signals, and the six second transport components of the worktable rise and fall to a second position. In this embodiment, the height of the second position is less than the height of the first position. In the second position, the second transport components are ready to receive the circuit board. At this time, the cutter head is located in the buffer rack, and the two are at different heights, so they do not interfere with or affect each other. To accommodate the descent height of the second transport components, the six transmission devices of the material transfer equipment lower their overall height so that the six first-layer transmission sections are aligned with the second transport components. After the cutter head leaves the first transport components, the first transport components stop working, the second lifting member descends, and the second limiting member is in the rising state. The circuit board is buffered on the first transport components.

[0111] After the second transport component aligns with the first transport group, the second limiting member descends, the first transport component operates, and the circuit board buffered in the first transport component moves to the second transport component via the first transport component's transfer. The first and second guide grooves provide guidance for the circuit board pins until the pins reach the first stopping point at the end of the second guide groove, at which point the circuit board stops on the second transport component. The first layer of the six transport units of the material transfer equipment simultaneously transports six circuit boards to the worktable along a first direction.

[0112] After the circuit board is transferred to the second transport assembly, the height of the second transport assembly is controlled to be higher than the first position. The cutter head and the circuit board are simultaneously buffered on the second transport assembly. The cutter head buffer frame descends, and the second transport assembly descends until the circuit board is placed on the processing position of the worktable, and the cutter head is placed on the cutter head area. Then, the pneumatic clamp assembly fixes the circuit board, and the magnetic suction assembly fixes the cutter head. The cutter head and the circuit board have completed the task of sequentially loading materials on the same side.

[0113] The process of unloading materials from the circuit board processing equipment to the material transfer equipment is completed with the cooperation of the first and second transport components, the first and second lifting components, the first guide groove and the second guide groove. Those skilled in the art can reasonably deduce the unloading process based on the loading process, which will not be elaborated here. Example

[0114] This embodiment uses a six-axis drilling machine as the circuit board processing equipment, a two-section first transport component of the material transfer equipment, and a pin groove shared by the cutter head and the circuit board as an example to explain in detail the structure of the material transfer equipment and the steps of the control method applied on the material transfer equipment.

[0115] The material transfer equipment in this embodiment is basically similar to that in Embodiment 1, except that the cutter head and the circuit board share the first guide groove, and the first transport component includes two sections: a first transport component and a second transport component. The circuit board processing equipment is basically similar to that in Embodiment 1, except that the cutter head and the circuit board share the second guide groove, the widths of the guide grooves are different, and the pin diameters of the cutter head and the circuit board are different.

[0116] In this embodiment, as Figure 11 and Figure 10 As shown, a through first guide groove 233 is also provided between the first transport components 220 of the transmission section 22. The first guide groove 233 is used for the pins of the circuit board and the pins of the cutter head to pass through. Y-shaped openings are provided at both ends of the first guide groove 233. A second guide groove 16 is provided on the worktable 10 of the circuit board processing equipment. The second guide groove 16 has different widths, and the second guide groove 16 of different widths can be used to stop the cutter head or the circuit board. For the second guide groove 16, the opening facing the material transfer equipment is a Y-shaped opening; near the front of the worktable 10, there are a first stopping point 161 and a second stopping point 162. The first stopping point 161 is used to stop the circuit board, and the second stopping point 162 is used to stop the cutter head. As shown in the figure. Figure 10 , Figure 13As shown, in the second guide groove 16, the second section of the guide groove from the Y-shaped opening to the first stop point 161 has a first width, and the first section of the guide groove from the first stop point 161 to the second stop point 162 has a second width. The width of the second section of the guide groove is greater than the width of the first section of the guide groove; that is, the first width is greater than the second width. Correspondingly, the pin of the circuit board 12 moves within the second section of the guide groove, and the pin of the cutter head moves within the range from the Y-shaped opening to the second stop point 162 in both the second section of the guide groove and the first section of the guide groove. Therefore, to accommodate the different widths of the two sections of the second guide groove 16, the diameter of the pin of the circuit board 12 is greater than the diameter of the pin of the cutter head 13, so as to ensure that the circuit board pin 121 stops at the end point 161 of the second section of the guide groove.

[0117] Since the structure of the material transfer equipment is basically similar to that of Embodiment 1, it will not be described in detail here. The following will describe the material transportation control method in detail, which mainly includes the following steps: S220: The transfer unit sequentially receives the cutter head and the circuit board, and the first transport component buffers the cutter head and the circuit board. For material transfer equipment, each transfer unit needs to receive the cutter head and the circuit board and buffer them on the first transport component. The method of S220 is basically the same as that of S20, and will not be described again here.

[0118] S240: Controlling the same-layer transmission units of multiple transmission devices to simultaneously convey the cutting head to the worktable of the circuit board processing equipment along a first direction. Six transmission units on the same layer simultaneously convey the cutting head to the worktable.

[0119] For circuit board processing equipment, a material transfer device is needed to automatically add cutter heads and circuit boards. After the circuit board processing equipment and the material transfer device exchange loading signals, the six second transport components of the worktable rise and fall to the first position, aligning with the first transport components of the six transmission sections, ready to receive the cutter heads. In the six transmission sections of the material transfer device, the third limiting member descends, and each of the first transport components begins to work, conveying the cutter heads to the worktable along the first direction. The cutter head pin smoothly transitions along the first guide groove to the second guide groove on the worktable. The second transport components drive the cutter head to continue moving, and the cutter head pin moves within the second guide groove until the second stopping point. The cutter head buffer rises, lifting and buffering the cutter head. Through the transmission of the first transport components and the second transport components, the six cutter heads are simultaneously transferred from the first-layer transmission section to the cutter head buffer on the worktable. In this way, the first-layer transmission sections of the six transmission devices simultaneously convey six cutter heads to the worktable along the first direction.

[0120] S260: After a predetermined time interval, the same-layer transmission units of multiple transmission devices simultaneously convey circuit boards to the worktable of the circuit board processing equipment along a first direction. Six transmission units on the same layer simultaneously convey circuit boards to the worktable.

[0121] In this embodiment, a predetermined time interval is required between the transfer of the cutter head and the conveyed circuit board to prevent a rear-end collision. After the cutter head is transferred to the worktable, the circuit board processing equipment and the material transfer equipment exchange signals, and the six second transport components of the worktable rise and fall to a second position. In this embodiment, the height of the second position is less than the height of the first position. In the second position, the second transport components are ready to receive the circuit board. At this time, the cutter head is located in the buffer rack, and the two are at different heights, so they do not interfere with or affect each other. To accommodate the descent height of the second transport components, the six transmission devices of the material transfer equipment are lowered as a whole so that the six first-layer transmission sections are aligned with the second transport components.

[0122] After the second transport component aligns with the first transport component, the second limiting component descends. The second and first transport components operate sequentially, and the circuit board buffered in the second transport component is moved onto the second transport component via the transfer between the second and first transport components. The first and second guide grooves provide guidance for the circuit board pins until the pins reach the first stop point within the second guide groove, at which point the circuit board stops on the second transport component. The first layer of the six transport devices in the material transfer equipment simultaneously transports six circuit boards to the worktable along the first direction.

[0123] After the circuit board is transferred to the second transport assembly, the height of the second transport assembly is controlled to be higher than the first position. The cutter head and the circuit board are simultaneously buffered on the second transport assembly. The cutter head buffer frame descends, and the second transport assembly descends until the circuit board is placed on the processing position of the worktable, and the cutter head is placed on the cutter head area. Then, the pneumatic clamp assembly fixes the circuit board, and the magnetic suction assembly fixes the cutter head. The cutter head and the circuit board have completed the task of sequentially loading materials on the same side.

[0124] The process of unloading materials from the circuit board processing equipment to the material transfer equipment is completed with the cooperation of the first and second transport components, the first guide groove and the second guide groove. Those skilled in the art can reasonably deduce the unloading process based on the loading process, so it will not be elaborated here. Example

[0125] This embodiment uses a six-axis drilling machine as an example of a circuit board processing equipment, with a recessed area on the worktable for layered conveying of circuit boards and cutter heads, and a material transfer device for conveying circuit boards and cutter heads on the same layer. It details the structure of the circuit board processing equipment, the structure of the material transfer device, and the material transport control method.

[0126] like Figure 14 , Figure 15 , Figure 16As shown, the circuit board processing equipment 100 includes a worktable 30 with six processing zones 31. Each processing zone 31 carries a circuit board 310. Each processing zone 31 has an edge zone 32 on its front side. The edge zone 32 includes a recessed area 33 and a transition area 34. The transition area 34 is flush with the processing zone 31, and a third guide groove 36 of the processing zone 31 extends into the transition area 34. The edge zone 32 also includes two recessed areas 33 located on either side of the transition area 34. The recessed areas 33 are recessed downward from the surface of the worktable 30 to a predetermined depth. The recessed areas 33 are used to accommodate a cutter head 331, which stores at least one cutting tool for processing the circuit board 310.

[0127] The bottom platform of the recessed area 33 supports the cutter head 331, and an opening is provided in the middle of the platform. Twelve buffer racks 333 are mounted on the base of the circuit board processing equipment. Each buffer rack 333 corresponds to a recessed area 33, and the buffer rack 333 is positioned directly below the cutter head 331 on the recessed area 33. Each buffer rack 333 includes a lifting member 3331, which passes through the opening to lift the cutter head 331, thereby changing the height of the cutter head 331.

[0128] In this embodiment, the edge region 32 includes two recessed regions: a first recessed region 334 and a second recessed region 335. The transition region 34 is located between the first recessed region 334 and the second recessed region 335. The transition region 34, the first recessed region 334, and the second recessed region 335 have approximately the same area. The second transport assembly 35 on the worktable 30 extends from the processing area 31 to the transition region 34. The second transport assembly 35 consists of two sets of pulley assemblies. Between the two sets of pulley assemblies, there is an air clamp assembly extending in a first direction and a third guide groove 36. The air clamp assembly is used to fix the circuit board 310, and the third guide groove 36 is used to guide the pins at the bottom of the circuit board.

[0129] In this embodiment, the material transport equipment 200 is similar to that in Embodiment 1 and Figure 3 The only difference is that the positions of the first and second transport components are swapped, and other configurations are adjusted or changed accordingly. The first transport component includes a first transport component and a second transport component. In a first direction, the first transport component is located between the worktable and the second transport component; the circuit board is buffered on the first transport component, and the cutter head is buffered on the second transport component. That is, during the process of the material transport equipment transferring the cutter head and circuit board to the circuit board processing equipment, the first transport component receives the circuit board first, then the cutter head, and the circuit board and cutter head are buffered on the same layer of the first transport component. During the process of the circuit board processing equipment transferring the cutter head and circuit board to the material transfer equipment, the material transfer equipment receives the cutter head first, then the circuit board, and the circuit board and cutter head are buffered on the same layer of the first transport component. The specific material transport control method in the material transport equipment includes the following steps: S320: The transmission unit sequentially receives the circuit board and the cutter head, and the first transport component buffers the circuit board and the cutter head. During the process of the material transport equipment transferring the circuit board and the cutter head to the circuit board processing equipment, since it is a same-layer transfer, under the scheduling and control of the host computer, the circuit board transport equipment first transfers the circuit board to the material transfer equipment. Each first transport component of the transmission unit buffers one circuit board. After the transfer is completed, the six circuit boards are buffered on the first transport components of the six first transport components on the same layer. Then, under the scheduling and control of the host computer, the cutter head transport equipment transfers the cutter head to the material transfer equipment. Each first transport component of the transmission unit buffers the circuit board and then continues to buffer the cutter head. After the transfer is completed, the six cutter heads are buffered on the second transport components of the six first transport components on the same layer. The specific process of the transmission unit receiving the circuit board and the cutter head is the same as in Embodiment 1, or with adaptive modifications. Those skilled in the art can undoubtedly determine the process of the transmission unit sequentially receiving the circuit board and the cutter head, and it will not be described in detail here.

[0130] S340: Controls the same-layer transmission section of multiple transmission devices to simultaneously transmit circuit boards to the worktable of the circuit board processing equipment along the first direction.

[0131] In this embodiment, the method of the first transport component conveying the circuit board is similar to the method of conveying the cutter head in S40 of Embodiment 1, with minor differences made to adapt it. These will not be elaborated further here.

[0132] S360: After a predetermined time interval, the same-layer transmission section of multiple transmission devices is controlled to simultaneously transmit the tool disc to the recessed area of ​​the worktable along the first direction.

[0133] In this embodiment, the method by which the first transport component transports the cutter head is similar to the method of transporting the circuit board in S60 of Embodiment 1, with minor differences made to adapt it. These will not be elaborated further here.

[0134] The difference from Embodiment 1 lies in the method by which the worktable of the circuit board processing equipment receives the cutting head and the circuit board. Because a recessed area is provided on the worktable, the cutting head and the circuit board are conveyed in layers. Therefore, the process of receiving the cutting head and the circuit board is as follows: First, upon receiving the feeding signal, the conveying device of the material transfer equipment raises or lowers its height to prepare the six first conveying components for alignment with the second conveying components on the worktable. The second conveying components on the worktable then raise or lower their height to receive the circuit boards from the first conveying components during the conveying process.

[0135] Secondly, upon receiving the signal from the loading cutter head, the worktable retracts, controlling the height of the conveyor to align the first transport component with the buffer rack in the recessed area. The cutter head on the first transport component is transferred to the buffer rack, where the lifting element rises, raising the cutter head height. The cutter head follows the rise and is temporarily buffered on the lifting element. The worktable moves forward, and the opening of the recessed area moves radially closer to the lifting element until the cutter head is above the recessed area. The lifting element then descends, and the cutter head falls back onto the top platform of the recessed area, buffering within it. This completes the loading of the cutter head.

[0136] During the loading process, the circuit board and the cutter head are horizontally buffered on the first transport component and then transported in layers to the worktable and the recessed area. During the layered transport, a predetermined time interval is maintained. This time interval can prevent the circuit board and the cutter head from colliding, and also requires changing the height of the transport device to ensure that the first transport component is aligned with the second transport component or the buffer rack respectively.

[0137] In this embodiment, before loading, unloading is also required; the cutting head and circuit boards on the circuit board processing equipment need to be unloaded to the material transfer equipment. Before the same-layer transfer unit controlling multiple transfer devices simultaneously transfers the circuit boards to the worktable of the circuit board processing equipment along the first direction, the method further includes: controlling another layer transfer unit to sequentially receive the cutting head and circuit boards transferred from the worktable.

[0138] Specifically, the cutting head is first controlled to unload material, followed by the circuit board unloading, so that the cutting head and circuit board are stored on the first transport component of the transfer unit in a predetermined order. During the cutting head unloading process, upon receiving the cutting head unloading signal, the lifting member passes through the opening to lift the cutting head, causing the cutting head to detach from the chassis platform in the recessed area and be temporarily buffered on the lifting member. The worktable retracts, and the opening moves in a direction away from the radial direction of the lifting member. The lifting member descends, and the cutting head descends along with it until the cutting head lands on the buffer rack. The height of the transfer device is controlled to rise and fall until the first transport component aligns with the buffer rack, and the cutting head on the buffer rack is transferred to the first transport component, and finally buffered on the first transfer unit.

[0139] The process of unloading circuit boards is similar to that of loading them, or may be slightly modified as appropriate. Those skilled in the art can directly and unambiguously determine the process of unloading circuit boards based on the context, so it will not be described in detail here.

[0140] The circuit board processing equipment, material transfer equipment, and material transport control method of this embodiment provide an alternative material transport control method by using layered buffering of the cutter head and circuit boards on the circuit board processing equipment side, and on the material transfer equipment side, using layered buffering of the cutter head and circuit boards. This equipment and method can also reduce equipment size, save space, and reduce material changeover time, thereby improving processing efficiency. Example

[0141] This embodiment takes a six-axis drilling machine as the circuit board processing equipment and a single-section material transfer device as the first transport component. The cutter head and the circuit board are transported on the same layer at the same time. The structure of the material transfer device and the steps of the control method applied on the material transfer device are described in detail.

[0142] The material transfer equipment in this embodiment is basically similar to that in Embodiment 1, except that the first transport component is an integral structure, consisting of a through-type transport member and two sets of synchronously moving conveyor bodies. The material transfer equipment in this embodiment includes six transmission devices, each comprising two transmission sections stacked along the height direction. Each transmission section includes a base on which the first transport component is mounted. The first transport component has two states: buffering and conveying the cutter head and circuit board. In the buffering state, the cutter head and circuit board are located on the first transport component. In the conveying state, the first transport component simultaneously sends the cutter head and circuit board outwards. The cutter head stores at least one cutting tool for processing the circuit board. The first transport component is an integral pulley assembly that simultaneously buffers the cutter head and circuit board, simultaneously sends the cutter head and circuit board to the circuit board processing equipment, and simultaneously receives the cutter head and circuit board sent by the circuit board processing equipment. To stop the cutter head and circuit board, limiters are provided between the two sets of conveyor bodies of the first transport component. The arrangement of the four sets of limiters is the same as in Embodiment 1 and will not be repeated here. Since the structure of the circuit board processing equipment is basically similar to that of Embodiment 1, it will not be described again here. The material transportation control method will be described in detail below.

[0143] S420: The transfer unit sequentially receives the cutter head and the circuit board, and the first transport component buffers the cutter head and the circuit board. For material transfer equipment, each transfer unit needs to receive the cutter head and the circuit board and buffer them on the first transport component.

[0144] In this embodiment, the material handling equipment includes a cutter head conveying device and a circuit board conveying device. One cutter head conveying device carries multiple cutter heads and moves from its initial position to align with a transfer device in the material transfer equipment, conveying the cutter heads to the first-level transfer section. The cutter head conveying device then moves along a second direction to align with another transfer device to convey the cutter heads. Similarly, the cutter head conveying device sequentially aligns with six transfer devices, conveying the cutter heads sequentially to the first-level transfer section of each transfer device. The cutter head conveying device completes the loading process, and the six transfer sections sequentially receive the cutter heads, temporarily buffering each cutter head on the first transport component of the transfer section.

[0145] Under the signal control of the sensor, the limiting component on the transmission section rises, restricting the continued movement of the cutter head on the first transport assembly and preventing the cutter head from prematurely moving out of the material transport equipment. At the same time, after the cutter head moves into position, the first transport assembly stops working, and the cutter head is buffered on the first transport assembly.

[0146] After the cutter head conveyor completes its loading, the circuit board conveyor begins loading. Specifically, the circuit board conveyor moves from its starting point to a transfer device near the material transfer equipment, conveying circuit boards to the first-level transfer section. The circuit board conveyor moves in a second direction, aligning with another transfer device to convey the cutter head. Similarly, the circuit board conveyor aligns with six transfer devices in sequence, conveying circuit boards to the first-level transfer section of each transfer device. The material transfer equipment receives the six circuit boards and buffers them on the first transport component of each transfer section.

[0147] For the material transfer equipment, the six transfer sections on the first layer first receive the cutter heads sequentially, and then, via the first transport component, each cutter head is buffered on its respective first transport component. After a predetermined interval, the six transfer sections on the first layer then receive circuit boards sequentially, each circuit board being buffered on its respective first transport component. During the circuit board loading process, the first transport component starts working and needs to receive the circuit boards. However, the operation of the first transport component causes relative movement between the first transport component and the cutter heads. Because the first transport component receives the circuit boards for a very short time and rotates at a very slow speed, this relative movement does not cause excessive wear on the bottom surface of the cutter heads. It should be noted that when the first transport component receives the circuit boards, due to the relative movement and the overlapping of the received circuit boards, the operating power of the first transport component is relatively high; the operating power of the first transport component receiving the circuit boards is greater than that of the first transport component receiving the cutter heads. During the process of the first transport component receiving the circuit boards, under the control of the position sensing signal of the sensor, the circuit boards move on the first transport component until the limit piece rises, stopping the circuit boards and preventing them from colliding with the cutter heads. In this way, both the circuit boards and the cutter heads are buffered on the first transport component.

[0148] S440: Multiple transfer units on the same layer simultaneously transfer the cutting head and circuit board to the worktable of the circuit board processing equipment along a first direction. Six transfer units on the same layer simultaneously transfer the cutting head and circuit board to the worktable.

[0149] For circuit board processing equipment, cutting discs and circuit boards need to be automatically added to the equipment via a material transfer device. After the circuit board processing equipment and the material transfer device exchange loading signals, the six second transport components of the worktable rise and fall to the first position, aligning with the first transport components of the six transfer sections, ready to receive the cutting discs and circuit boards. The first transport components begin operation, all limiters descend, and the cutting discs and circuit boards simultaneously begin to move towards the second transport components, which receive the sequentially arranged cutting discs and circuit boards. In this way, the first layer of the six transport devices simultaneously conveys six cutting discs to the worktable along the first direction.

[0150] After the cutter head and circuit board are transferred to the second transport assembly, the cutter head is stopped at the cutter head stop point, and the circuit board is stopped at the circuit board stop point. Through the cooperation of the second transport assembly and the buffer rack, the cutter head is first transferred to the buffer rack for buffering. Finally, the circuit board is placed on the processing position of the worktable, and the cutter head is placed on the cutter head area. Afterwards, the pneumatic clamp assembly fixes the circuit board, and the magnetic suction assembly fixes the cutter head, completing the task of simultaneous loading of the cutter head and circuit board on the same side.

[0151] The process of simultaneously feeding the cutting disc and circuit boards from the circuit board processing equipment to the material transfer equipment is completed with the cooperation of the first transport component, the second transport component, the buffer rack, the limiting component, etc. Those skilled in the art can reasonably deduce the unloading process based on the feeding process, which will not be elaborated here.

[0152] This embodiment of the material transfer equipment and predictive transport control method provides a technical solution for simultaneously conveying cutter heads and circuit boards on the same floor. This method enables simultaneous feeding of cutter heads and circuit boards from the same side. It not only saves workshop space but also improves material changeover efficiency. Example

[0153] This embodiment takes a circuit board processing equipment as a six-axis drilling machine and a material transfer equipment with at least four layers of transmission sections as an example to explain in detail the structure of the material transfer equipment and the steps of the control method applied on the material transfer equipment.

[0154] The material transfer device in this embodiment is a four-layer transfer unit, each layer having the same first transport component. This first transport component can transport both the cutter head and the circuit board. The material transfer device includes six transfer units, each comprising at least four transfer units stacked along the height direction. Each transfer unit includes a base, on which the first transport component is mounted. The first transport component has two states: buffering and transporting the cutter head and the circuit board. In the buffering state, the cutter head and the circuit board are respectively located on the first transport components of two stacked transfer units along the height direction. In the transporting state, the first transport component sequentially sends the cutter head and the circuit board outwards. The cutter head stores at least one cutting tool for processing the circuit board. The four stacked transfer units move vertically as a whole in the height direction to selectively align with a second transport component on the worktable, transporting the cutter head or circuit board to the worktable. Similarly, when loading or unloading materials onto the material transport equipment, the four-layer transfer unit also moves vertically as a whole, selectively aligning with the material transport equipment; this will not be elaborated further. In this embodiment, the first and second transmission layers receive circuit boards and cutting heads for feeding them into the circuit board processing equipment; the third and fourth transmission layers receive circuit boards and cutting heads sent by the circuit board processing equipment for unloading them from the equipment. In other embodiments, the order can be changed as appropriate, and the function of the four transmission layers is not strictly limited here. The structure of the circuit board processing equipment is basically similar to that of Embodiment 1, and will not be described again here.

[0155] The following details the material transport control method in conjunction with the structure of material transfer equipment and circuit board processing equipment, specifically including the following steps: S520: The first-level transfer section receives the circuit board, which is buffered on the first transport component of the first-level transfer section. For material transfer equipment, each transfer section can transport both the cutter head and the circuit board. When receiving the circuit board in the first level, the first transport component of the first-level transfer section transports and buffers the circuit board, and uses limiters and sensors to control and stop the circuit board, so that the circuit board stops or moves on the first transport component.

[0156] The second-layer transfer unit receives the cutter head, which is buffered on the first transport component of the second-layer transfer unit. The first-layer transfer unit and the second-layer transfer unit are stacked in the vertical direction. When the cutter head is received in the second layer, the first transport component of the second-layer transfer unit transports and buffers the cutter head, and uses limiting members and sensors to control and stop the cutter head, so that the cutter head stops or moves on the first transport component.

[0157] In practical applications, the circuit board transport equipment and the cutter head transport equipment sequentially feed the circuit boards to the material transfer equipment according to the control instructions of the host computer. The order in which the cutter head and circuit boards are fed varies depending on the time or queue. It's possible that the cutter head is fed first, or the circuit boards are fed first; the order is not restricted. Therefore, the order in which the first-level transfer unit receives the circuit boards and the second-level transfer unit receives the cutter head can be interchanged. The first-level transfer unit receives the circuit boards first, and the second-level transfer unit receives the cutter head later; or, the second-level transfer unit receives the cutter head first, and the first-level transfer unit receives the circuit boards later.

[0158] S540: Control the same-layer transmission sections of multiple transmission devices to simultaneously convey the cutting head to the worktable of the circuit board processing equipment along a first direction. It should be noted that when the first layer buffers the circuit board and the second layer buffers the cutting head, control the overall lifting and lowering of the six transmission devices so that the six second-layer transmission sections are respectively aligned with the second transport components on the worktable. First, the cutting head is conveyed, then the height is changed so that the first-layer transmission section aligns with the second transport components, and finally the circuit board is conveyed. The process of the worktable receiving the cutting head is similar to that in Embodiment 1, or can be adapted as appropriate. Those skilled in the art can directly and without objection determine the process of the worktable sequentially receiving the cutting head.

[0159] S560: After a predetermined time interval, the same-layer transmission sections of multiple transmission devices are controlled to simultaneously transmit circuit boards to the worktable along a first direction. The process of the worktable receiving the circuit boards is similar to that in Embodiment 1, or can be adapted as appropriate. Those skilled in the art can directly and without objection determine the process of the worktable receiving the tool head sequentially.

[0160] This embodiment of the material transfer equipment and predictive transport control method provides a technical solution for multi-layer conveying of the cutter head and circuit board separately. This method enables sequential feeding of the cutter head and circuit board on the same side. It not only saves workshop space but also improves material changeover efficiency.

[0161] The various embodiments of this disclosure have been described above. These descriptions are exemplary and not exhaustive, and are not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or technical improvements to the embodiments in the market, or to enable others skilled in the art to understand the embodiments disclosed herein. The scope of this disclosure is defined by the appended claims.

Claims

1. A material transfer device, characterized in that, include: Multiple transmission devices, each of the transmission devices comprising at least two transmission sections stacked along the height direction, each of the transmission sections comprising: A base is provided on which a first transport assembly is provided. The first transport assembly includes a first transport component and a second transport component. In a first direction, the first transport component is located between the worktable of the circuit board processing equipment and the second transport component. The first transport component includes two states: buffering and conveying. In the buffering state, the cutter head and the circuit board are located on the first transport component. In the conveying state, the first transport component conveys the cutter head and the circuit board in sequence. The cutter head stores at least one cutting tool for processing the circuit board. Wherein, the first transport component caches the cutter head, and the second transport component caches the circuit board; or, the first transport component caches the circuit board, and the second transport component caches the cutter head; A first limiting member and a second limiting member are further provided between the first transport member and the second transport member. The first limiting member is used to stop the cutter head, and the second limiting member is used to stop the circuit board. Alternatively, a plurality of position sensors are provided on the base. The plurality of position sensors are respectively located below the cutter head and the circuit board in the buffer state. The first transport member stops working in response to the signal of the corresponding position sensor, and the second transport member stops working in response to the signal of the corresponding position sensor.

2. The material transfer equipment according to claim 1, characterized in that, The base is provided with a first lifting member located at the bottom of the cutter head and a second lifting member located at the bottom of the circuit board. The first lifting member is used to change the height of the cutter head; the second lifting member is used to change the height of the circuit board.

3. The material transfer equipment according to claim 1, characterized in that, The base is also provided with a lifting component, which is used to change the height of the first transport component. The height of the first transport component is different when the cutter head or circuit board is being transported.

4. The material transfer equipment according to any one of claims 1 to 3, characterized in that, The base is provided with a first cutter head guide groove and a first circuit board guide groove extending along a first direction, and the first cutter head guide groove and the first circuit board guide groove penetrate the area enclosed by the first transport component. The workbench is provided with a second cutter head guide groove and a second circuit board guide groove extending along a first direction, and the length of the second cutter head guide groove is greater than the length of the second circuit board guide groove.

5. The material transfer equipment according to any one of claims 1 to 3, characterized in that, The base is provided with a first guide groove extending in a first direction, the first guide groove penetrating the area enclosed by the first transport component; the first guide groove is used to guide the pins of the cutter head and the circuit board through in sequence; The worktable is provided with a second guide groove extending along a first direction. The second guide groove includes a continuous first segment and a second segment. The second segment is located between the first segment and the transmission part. The depth or width of the second segment is greater than the depth or width of the first segment.

6. The material transfer equipment according to any one of claims 1 to 3, characterized in that, The workbench is provided with a second transport component, which has a first position and a second position in the height direction. When transporting the circuit board and the cutter head respectively, the second transport component switches between the first position and the second position.

7. A material transport control method, characterized in that, The material transfer equipment applied to any one of claims 1 to 6 includes the following steps: S20: The transmission unit receives the cutter head and the circuit board in sequence, and the first transport component buffers the cutter head and the circuit board; S40: Control the same-layer transmission section of multiple transmission devices to simultaneously transmit the buffered tool head to the worktable along the first direction; S60: After a predetermined time interval, control the same-layer transmission section of multiple transmission devices to simultaneously transmit the buffered circuit board to the workbench along the first direction.

8. The material transport control method according to claim 7, characterized in that, Before controlling the same-layer transmission section of multiple transmission devices to simultaneously convey the cutter head to the worktable along the first direction, the method further includes: controlling a second transport component of the worktable to sequentially convey the circuit board and the cutter head to another layer of transmission sections stacked along the height direction.

9. The material transport control method according to claim 7, characterized in that, Before controlling the co-layer transmission section of the multiple transmission devices to simultaneously transport the circuit board to the workbench along the first direction, the method further includes: controlling the multiple transmission devices to change their overall height to align with the second transport component of the workbench.

10. The material transport control method according to any one of claims 7 to 9, characterized in that, The frequency at which the transmission unit transmits the cutting head to the worktable is less than the frequency at which the circuit board is transmitted.

11. The material transport control method according to any one of claims 7 to 9, characterized in that, On the conveying path formed by the transmission unit, the worktable, and the transmission unit, the cutter head is first-in, last-out, and the circuit board is last-in, first-out.

12. A material transport control method, characterized in that, The material transfer equipment applied to any one of claims 1 to 6 includes the following steps: S320: The transmission unit receives the circuit board and the cutter head in sequence, and the first transport component buffers the circuit board and the cutter head; S340: Control the same-layer transmission section of multiple transmission devices to simultaneously transmit the buffered circuit board to the workbench along the first direction; S360: After a predetermined time interval, control the same-layer transmission section of multiple transmission devices to simultaneously transmit the buffered tool disc into the recessed area of ​​the worktable along the first direction.

13. The material transport control method according to claim 12, characterized in that, Before controlling the same-layer transmission section of multiple transmission devices to simultaneously transmit the circuit board to the worktable along the first direction, the method further includes: controlling another layer of transmission sections stacked along the height direction to sequentially receive the cutter head and the circuit board transmitted by the worktable.

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