Corrosion-resistant diamond dressing disc and method of making same

Abstract

The application relates to the technical field of diamond tool manufacturing, and particularly discloses a corrosion-resistant diamond dressing disc and a preparation method thereof. The diamond dressing disc comprises a dressing disc base body, a brazing layer, a copper plating layer, a nickel-copper-manganese plating layer, a fluoroalkylsilane treatment layer and a plurality of diamond particles. The brazing layer is arranged on one side of the dressing disc base body, the plurality of diamond particles are arranged at a certain interval, each diamond particle is partially arranged in the brazing layer, and the upper surface of the brazing layer is sequentially deposited with the copper plating layer, the nickel-copper-manganese plating layer and the fluoroalkylsilane treatment layer from bottom to top. The cauliflower-shaped structure of the nickel-copper-manganese plating layer and the synergistic effect of the fluoroalkylsilane treatment layer can obtain a super-hydrophobic surface with high hardness and high corrosion resistance, slow down the corrosion rate of the brazing layer in the process of dressing and polishing, and further reduce the falling probability of the diamond particles, so that the sharpness and service life of the diamond are ensured.

Description

Technical Field

[0001] This invention belongs to the field of diamond tool manufacturing technology, specifically relating to a corrosion-resistant diamond dressing disc and its preparation method. Background Technology

[0002] Chemical mechanical planarization (CMP) is a technique that uses chemical etching and mechanical polishing to smooth silicon wafers or other substrates during processing. It is a crucial step in the manufacturing of very large-scale integrated circuits (VLSI). During CMP, diamond dressing discs are typically used to properly dress the surface of the polishing pads, removing the enamel layer and increasing surface roughness to improve the pads' machinability and ensure the stability and repeatability of the polishing process. Diamond dressing discs usually use stainless steel as the substrate, with diamond particles fixed to the substrate surface using brazing, electroplating, or sintering techniques. During CMP, especially with tungsten and copper, the diamond dressing discs are subjected to chemical corrosion from highly corrosive polishing solutions, leading to premature failure and even the shedding of some diamond particles that can scratch the wafer. Furthermore, the etched metal ions entering the polishing solution can contaminate the wafer and affect chip quality, placing higher demands on the post-CMP cleaning process. Therefore, improving the corrosion resistance of diamond dressing discs is of great significance.

[0003] Currently, the main approach to improving the corrosion resistance of diamond dressing discs is to add a corrosion-resistant coating to the working surface of the dressing disc. The coatings used primarily include: nickel-phosphorus electroless amorphous plating, electroplated chromium, titanium nitride vapor deposition, chromium nitride vapor deposition, diamond-like carbon film, and polytetrafluoroethylene (PTFE) coating. These coatings can effectively improve the corrosion resistance of diamond dressing discs and extend their service life. However, on the one hand, during the fabrication of these coatings, it is often unavoidable that they will also cover the surface of the diamond particles at the cutting edge, impairing the sharpness of the diamond and reducing the cutting rate of the dressing disc on the polishing pad; on the other hand, electroplated chromium and diamond-like carbon films may also have poor bonding strength with the brazing layer, affecting the reliability of the coating's protection of the brazing layer. Summary of the Invention

[0004] The purpose of this invention is to address the aforementioned shortcomings of the prior art by providing a corrosion-resistant diamond dressing disc and its preparation method, aiming to solve the problem that insufficient corrosion resistance of the brazed layer may lead to a shortened service life of the diamond dressing disc or even diamond detachment.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: The first objective of this invention is to provide a corrosion-resistant diamond dressing disc, comprising a diamond substrate, a brazing layer, a copper plating layer, a nickel-copper-manganese plating layer, a fluoroalkylsilane treatment layer, and a plurality of diamond particles. The brazing layer is disposed on one side of the dressing disc substrate. The plurality of diamond particles are arranged at a certain interval, and each diamond particle is partially disposed within the brazing layer. The upper surface of the brazing layer is sequentially deposited from bottom to top with the copper plating layer, the nickel-copper-manganese plating layer, and the fluoroalkylsilane treatment layer. The mass ratio of nickel, copper, and manganese in the nickel-copper-manganese plating layer is (92~93.5):(6~7):(0.5~1). The fluoroalkylsilane in the fluoroalkylsilane treatment layer includes any one of 1H,1H,2H,2H-perfluorooctyltriethoxysilane, 1H,1H,2H,2H-perfluorodecyltriethoxysilane, 1H,1H,2H,2H-perfluoroheptadecanetrimethyloxysilane, and perfluorooctadecyltriethoxysilane.

[0006] Furthermore, the material of the diamond dressing disc substrate is stainless steel.

[0007] Furthermore, the diameter of the diamond particles ranges from 80 to 300 μm, and the height of the diamond particles exposed on the surface of the brazing layer ranges from 56 to 210 μm.

[0008] Furthermore, the thickness of the copper plating layer is 1~5μm.

[0009] Furthermore, the thickness of the nickel-copper-manganese plating layer is 5~20μm.

[0010] Furthermore, the microhardness of the nickel-copper-manganese coating is 550~700HV.

[0011] Furthermore, the brazing layer is fixed to one side of the diamond dressing disc substrate by vacuum brazing, and the brazing material is a nickel-based alloy.

[0012] A second objective of this invention is to provide a method for preparing the aforementioned corrosion-resistant diamond dressing disc, comprising the following specific steps: S1. Clean the stains and oxide film on the surface of the stainless steel substrate, then apply adhesive to the cleaned substrate surface, evenly distribute nickel-chromium alloy solder, then spray adhesive on the nickel-chromium alloy solder layer, and evenly sprinkle diamond particles on the nickel-chromium alloy solder layer using the template method. S2. The workpiece with diamond particles spread on it obtained in step S1 is sintered in a high temperature vacuum environment of 900~1100℃ to obtain a diamond trimming disc semi-finished product. S3. Partially insulate the diamond trimming disc semi-finished product obtained in step S2, exposing only the diamond-containing brazing layer. Then, perform pre-plating treatment processes such as electrochemical degreasing, electrochemical activation, and cleaning on the surface of the diamond-containing brazing layer. Finally, place it in an electroplating tank for copper plating. S4. Remove the copper-plated diamond trimming tray semi-finished product obtained in step S3 from the tank, rinse it clean with distilled water, and then electrodeposit a nickel-copper-manganese plating layer. S5. Remove the semi-finished diamond dressing disc with nickel-copper-manganese plating obtained in step S4 from the tank, remove the insulating material, clean it with water, place it in anhydrous ethanol solution of fluoroalkylsilane, heat it in a water bath to react, rinse the surface of the nickel-copper-manganese plating with anhydrous ethanol, and dry it to obtain the finished diamond dressing disc with good corrosion resistance.

[0013] Further, in step S4, the electroplating solution used for electrodepositing the nickel-copper-manganese coating comprises 150~300 g / L NiSO4, 5~10 g / L CuSO4, 5~10 g / L MnCl2, 60~120 g / L Na3C6H5O7, and 30~50 g / L H3BO3, and direct current electroplating is used with a current density of 5~8 A / dm³. 2 The plating solution temperature is 30~40 ℃, and the pH value of the plating solution is 3.6~4.2.

[0014] Furthermore, in step S5, the mass concentration of the anhydrous ethanol solution of fluoroalkylsilane is 25~40 g / L.

[0015] Compared with the prior art, the beneficial effects of the technical solution provided by the present invention are as follows: This invention provides a corrosion-resistant diamond dressing disc. A brazing layer is provided on one side of the dressing disc substrate. Multiple diamond particles are arranged at a certain interval, with each diamond particle partially disposed within the brazing layer. The upper surface of the brazing layer is sequentially deposited with a copper plating layer, a nickel-copper-manganese plating layer, and a fluoroalkylsilane treatment layer from bottom to top. The cauliflower-like structure of the nickel-copper-manganese plating layer and the synergistic effect of the fluoroalkylsilane treatment layer can obtain a superhydrophobic surface with high hardness and high corrosion resistance, which slows down the corrosion rate of the brazing layer during the dressing and polishing process, thereby reducing the probability of diamond particle detachment and ensuring the sharpness and service life of the diamond. Attached Figure Description

[0016] Figure 1 A schematic diagram of the structure of a corrosion-resistant diamond dressing disc provided by the present invention; Figure 2 A surface morphology diagram of the nickel-copper-manganese alloy coating on the surface of the diamond dressing disc provided by the present invention. Figure 3 Optical photograph of the water droplet contact angle on the surface of the diamond dressing disc provided by this invention; Figure 4 A comparison chart of the Tafel curves of the diamond dressing disc provided by this invention and a conventional diamond dressing disc in polishing fluid.

[0017] In the diagram, 1. Trimmed substrate; 2. Brazing layer; 3. Copper plating; 4. Nickel-copper-manganese plating; 5. Fluoroalkylsilane treatment layer; 6. Diamond particles. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this invention clearer, the specific embodiments and accompanying drawings are described in further detail below. Where specific techniques or conditions are not specified in the embodiments, they are performed according to the techniques or conditions described in the literature in this field or according to the product instructions. Reagents or instruments whose manufacturers are not specified are all commercially available conventional products.

[0019] refer to Figure 1 This invention provides a corrosion-resistant diamond dressing disc, comprising a dressing disc substrate 1, a brazing layer 2, a copper plating layer 3, a nickel-copper-manganese plating layer 4, a fluoroalkyl silane treatment layer 5, and multiple diamond particles 6. The brazing layer 2 is disposed on one side of the dressing disc substrate 1. The multiple diamond particles 6 are arranged at a certain interval, with each diamond particle 6 partially disposed within the brazing layer 2. The height of the diamond particles 6 exposed above the surface of the brazing layer 2 is 70% of the diamond particle diameter, ranging from 56 to 210 μm. The upper surface of the brazing layer 2 is arranged from bottom to top... A copper plating layer 3, a nickel-copper-manganese plating layer 4, and a fluoroalkylsilane treatment layer 5 are deposited sequentially. The nickel-copper-manganese plating layer 4 has a nickel, copper, and manganese mass ratio of (92~93.5):(6~7):(0.5~1). The fluoroalkylsilane treatment layer 5 contains any one of 1H,1H,2H,2H-perfluorooctyltriethoxysilane, 1H,1H,2H,2H-perfluorodecyltriethoxysilane, 1H,1H,2H,2H-perfluoroheptadecanetrimethyloxysilane, and perfluorooctadecyltriethoxysilane.

[0020] This invention provides a method for preparing a diamond dressing disc, comprising the following steps: S1. Use sandblasting and chemical cleaning methods to clean the stains and oxide film on the surface of the stainless steel substrate. Then, apply a layer of adhesive I to the surface of the stainless steel substrate. Then, evenly distribute nickel-chromium alloy solder on the surface of adhesive I, and spray adhesive II on the nickel-chromium alloy solder layer. Use the template method to evenly distribute diamond particles on adhesive II to complete the sandblasting. In this invention, both Adhesive I and Adhesive II are combinations of acrylate pressure-sensitive adhesive and acetone. Adhesive I is prepared by mixing acrylate pressure-sensitive adhesive and acetone at a volume ratio of 1:2 to 1:8. Adhesive II is prepared by mixing acrylate pressure-sensitive adhesive and acetone at a volume ratio of 1:8 to 1:12.

[0021] S2. The workpiece with sanding obtained in step S1 is sintered in a high-temperature vacuum environment of 900~1100℃. The nickel-chromium alloy is melted and reacted with diamond to generate chromium carbide on the diamond surface. The liquid phase in the brazing filler rises to the diamond surface under the action of surface tension and holds the diamond, thus obtaining a diamond dressing disc semi-finished product.

[0022] S3. Partially insulate the diamond trimming disc semi-finished product obtained in step S2, exposing only the diamond brazing layer. Then, perform pre-plating treatment processes such as electrochemical degreasing, electrochemical activation, and cleaning on the surface of the diamond brazing layer. Finally, place it in an electroplating tank for copper plating. In this invention, the copper plating process can employ processes such as sulfate copper plating, pyrophosphate copper plating, and citrate copper plating; preferably, this invention employs acidic sulfate copper plating, which contains 140~160 g / L CuSO4, 90~120 g / L H2SO4, 0.06~0.12 g / L NaCl, and 0.4~0.8 mg / L 2-mercaptobenzoimidazole.

[0023] In this invention, direct current electroplating is used, with the copper plating bath temperature at 18~22℃ and the current density at 1.0~2.0 A / dm³. 2 The electroplating time can be selected from 1 to 10 minutes, and preferably, the electroplating time can be selected from 3 to 4 minutes.

[0024] S4. Remove the copper-plated diamond trimming disc semi-finished product obtained in step S3 from the tank, rinse it clean with distilled water, and then electrodeposit a nickel-copper-manganese plating layer with a thickness between 5 and 20 μm.

[0025] In this invention, the plating solution used for electrodepositing nickel-copper-manganese coatings contains 150~300 g / L NiSO4, 5~10 g / L CuSO4, 5~10 g / L MnCl2, 60~120 g / L Na3C6H5O7, and 30~50 g / L H3BO3.

[0026] In this invention, the process parameters for electrodepositing nickel-copper-manganese coatings are a current density of 5~8 A / dm³. 2 The plating solution temperature is 30~40 ℃, the pH value of the plating solution is 3.6~4.2, and the current waveform is DC.

[0027] S5. Remove the semi-finished diamond dressing disc with nickel-copper-manganese plating obtained in step S4 from the tank, remove the insulating material, and clean it with water. Then, use fluoroalkylsilane to modify the surface of the nickel-copper-manganese plating to improve the hydrophobicity of the plating surface, and obtain the finished diamond dressing disc with good corrosion resistance.

[0028] In this invention, the fluoroalkylsilane can be 1H,1H,2H,2H-perfluorooctyltriethoxysilane, 1H,1H,2H,2H-perfluorodecyltriethoxysilane, 1H,1H,2H,2H-perfluoroheptadecanetrimethyloxysilane, perfluorooctadecyltriethoxysilane, etc.

[0029] In this invention, the method for modifying the surface of a copper-nickel-manganese plating layer with fluoroalkylsilane is as follows: First, the diamond dressing disc semi-finished product with a nickel-copper-manganese plating layer electrodeposited in step S4 is placed in an anhydrous ethanol solution of 25~40 g / L fluoroalkylsilane, and the fluoroalkylsilane reacts with the plating surface at 60°C in a water bath for 4 hours; then, the nickel-copper-manganese plating surface is rinsed with anhydrous ethanol; finally, the dressing disc semi-finished product after reacting with fluoroalkylsilane is placed in an oven and kept at 180°C for 6 hours to improve the bonding degree between fluoroalkylsilane and the plating surface.

[0030] Example 1 This embodiment provides a corrosion-resistant diamond dressing disc for use in the bond manufacturing process. It includes a diamond dressing disc substrate, a brazing layer containing diamond particles, a copper plating layer, a nickel-copper-manganese plating layer, and a fluoroalkyl silane treatment layer on the surface of the nickel-copper-manganese plating layer. The substrate is 314 stainless steel, and the brazing layer is made of a nickel-based alloy, wherein the total nickel-chromium alloy content exceeds 50%; the diamond particle size D... 50 The diamond is approximately 160 μm in diameter, and the height at which the diamond protrudes from the surface of the brazing layer is approximately 110 μm.

[0031] The method for preparing a chemical mechanical polishing diamond finishing disc in this embodiment includes the following steps: S1. Clean the stains and oxide film on the surface of the stainless steel substrate using sandblasting and chemical cleaning methods. Then, apply a layer of adhesive I, which is a mixture of acrylic pressure-sensitive adhesive and acetone in a volume ratio of 1:3, to the surface of the stainless steel substrate. Then, evenly distribute nickel-chromium alloy solder on the surface of the adhesive. Finally, spray adhesive II, which is a mixture of acrylic pressure-sensitive adhesive and acetone in a volume ratio of 1:10, onto the nickel-chromium alloy solder layer. Use a template method to evenly distribute diamond particles on adhesive II to complete the sandblasting process. S2. The workpiece with sand applied in step S1 is sintered in a high-temperature vacuum environment of 1050℃ to obtain a diamond dressing disc semi-finished product.

[0032] S3. Partially insulate the diamond trimming disc semi-finished product obtained in step S2 with insulating varnish, exposing only the diamond-containing brazing layer. Then, perform cathodic degreasing and anodic degreasing on the surface of the diamond-containing brazing layer for 2 minutes each, with a current density of 5 A / dm³. 2 Then, after washing with hot water and rinsing with cold water, electrochemical activation is performed at an activation current density of 15 A / dm³. 2The time is 1.5 minutes. After rinsing with tap water and distilled water, the diamond trimming tray semi-finished product is quickly put into the tank while energized for copper plating. This embodiment uses acidic sulfate copper plating. The plating bath contains 160 g / L CuSO4, 100 g / L H2SO4, 0.06 g / L NaCl, and 0.5 mg / L 2-mercaptobenzoimidazole. The plating bath temperature is 20°C, and the current density is 1.0 A / dm³. 2 The electroplating time can be selected as 3 minutes.

[0033] S4: Remove the copper-plated diamond trimming disc semi-finished product obtained in step S3 from the tank, rinse it clean with distilled water, and then electrodeposit a nickel-copper-manganese plating layer with a thickness between 5 and 20 μm.

[0034] In this embodiment, the plating bath used for electrodepositing a nickel-copper-manganese coating contains 180 g / L NiSO4, 10 g / L CuSO4, 8 g / L MnCl2, 80 g / L Na3C6H5O7, and 35 g / L H3BO3. Direct current electroplating is used, with a current density of 6 A / dm³. 2 The plating bath temperature was 38 ℃, and the pH value was 4.0. The resulting nickel-copper-manganese plating layer exhibited a cauliflower-like surface morphology, such as... Figure 2 As shown, the microhardness of the coating is 620 HV.

[0035] S5. Remove the semi-finished diamond dressing disc with nickel-copper-manganese plating obtained in step S4 from the tank, remove the insulating material, and clean it with water. Then, modify the surface of the nickel-copper-manganese plating with fluoroalkylsilane to obtain the finished diamond dressing disc with good corrosion resistance.

[0036] In this embodiment, the surface of the copper-nickel-manganese coating was modified with 1H,1H,2H,2H-perfluorodecyltriethoxysilane: First, the diamond dressing disc semi-finished product with the nickel-copper-manganese coating electrodeposited in step S4 was placed in an anhydrous ethanol solution of 25~40 g / L 1H,1H,2H,2H-perfluorodecyltriethoxysilane and reacted in a water bath at 60°C for 4 hours; then, the surface of the nickel-copper-manganese coating was rinsed with anhydrous ethanol; finally, the dressing disc semi-finished product after reacting with 1H,1H,2H,2H-perfluorodecyltriethoxysilane was placed in an oven and kept at 180°C for 6 hours. The contact angle photograph between the droplet and the diamond dressing disc surface is shown below. Figure 3 As shown, the contact angle is 151.3°, exhibiting excellent hydrophobicity.

[0037] Example 2 This embodiment provides a corrosion-resistant diamond dressing disc for use in the bond manufacturing process. It includes a diamond dressing disc substrate, a brazing layer containing diamond particles, a copper plating layer, a nickel-copper-manganese plating layer, and a fluoroalkyl silane treatment layer on the surface of the nickel-copper-manganese plating layer. The substrate is 314 stainless steel, and the brazing layer is made of a nickel-based alloy, wherein the total nickel-chromium alloy content exceeds 50%; the diamond particle size D... 50 The diamond is approximately 80 μm in diameter, and the height of the diamond protruding from the surface of the brazing layer is approximately 56 μm.

[0038] The preparation process is basically the same as in Example 1, except that in step S4, the electroplating solution used for electrodepositing the nickel-copper-manganese coating includes 150 g / L NiSO4, 5 g / L CuSO4, 5 g / L MnCl2, 60 g / L Na3C6H5O7 and 30 g / L H3BO3, and DC electroplating is used with a current density of 5 A / dm³. 2 The plating bath temperature was 30℃, and the pH value was 3.6. The resulting nickel-copper-manganese coating exhibited a cauliflower-like surface morphology, and its microhardness was 550 HV.

[0039] Example 3 This embodiment provides a corrosion-resistant diamond dressing disc for use in the bond manufacturing process. It includes a diamond dressing disc substrate, a brazing layer containing diamond particles, a copper plating layer, a nickel-copper-manganese plating layer, and a fluoroalkyl silane treatment layer on the surface of the nickel-copper-manganese plating layer. The substrate is 314 stainless steel, and the brazing layer is made of a nickel-based alloy, wherein the total nickel-chromium alloy content exceeds 50%; the diamond particle size D... 50 The diamond is approximately 300 μm in diameter, and the height at which the diamond protrudes from the surface of the brazing layer is approximately 210 μm.

[0040] The preparation process is basically the same as in Example 1, except that in step S4, the electroplating solution used for electrodepositing the nickel-copper-manganese coating includes 300 g / L NiSO4, 10 g / L CuSO4, 10 g / L MnCl2, 120 g / L Na3C6H5O7 and 50 g / L H3BO3, and DC electroplating is used with a current density of 8 A / dm³. 2 The plating bath temperature was 40℃, and the pH value was 4.2. The resulting nickel-copper-manganese coating had a cauliflower-like surface morphology and a microhardness of 700 HV.

[0041] In its research, the applicant discovered that when the copper content in the nickel-copper-manganese plating is 6%–7%, the plating surface can form a cauliflower-like structure, resulting in a diamond dressing disc with superhydrophobic properties and a contact angle of 150°–160°. When the copper content in the nickel-copper-manganese plating is not 6%–7%, the plating surface cannot form a cauliflower-like structure, and the contact angle of the diamond dressing disc surface is only 110°–120°.

[0042] Comparative Example 1 The preparation method adopts steps S1 and S2 in Example 1 above; the difference is that steps S3, S4 and S5 are not performed.

[0043] Comparative Example 2 The preparation method adopts steps S1, S2, and S5 in Example 1 above; the difference is that steps S3 and S4 are not performed.

[0044] Comparative Example 3 The preparation method follows steps S1, S2, S3, S4, and S5 of Example 1 above; the difference lies in the plating solution used in step S4, which is as follows: 180 g / L NiSO4, 8 g / L MnCl2, 80 g / L Na3C6H5O7, and 35 g / L H3BO3. The electroplating process parameters are a current density of 6 A / dm³. 2 The plating solution temperature was 38 ℃ and the pH value of the plating solution was 4.0.

[0045] Corrosion resistance test of diamond dressing discs: The diamond dressing discs in Example 1 and Comparative Examples 1-3 were subjected to potentiodynamic polarization curve tests to evaluate their corrosion resistance. The test conditions are as follows: The testing instrument was a CS310H electrochemical workstation; The three-electrode system used in the test used a saturated calomel electrode as the reference electrode, a platinum sheet electrode as the counter electrode, and a portion of the diamond dressing disc prepared in Example 1 and Comparative Examples 1-3 as the working electrode. The test solution was ANJI3060 polishing slurry (1:9 dilution, H2O 2% = 1%). Based on the recorded Tafel curve (e.g.) Figure 4 As shown in the figure), the electrochemical parameters of the calculated potentiodynamic polarization curves are shown in Table 1.

[0046] Table 1. Fitted electrochemical parameters of the corrosion process

[0047] The corrosion current density in Example 1 was 1.38 × 10⁻⁶. -8 A / cm 2 The corrosion current densities of Comparative Example 1 and Comparative Example 3 were compared (1.07 × 10⁻⁶, respectively). -5 A / cm 2 2.51×10 -6 A / cm 2 The current density is much lower, and significantly lower than that of Comparative Example 2 (6.88 × 10⁻⁶). -7 A / cm 2Therefore, from the perspective of electrochemical corrosion kinetics, the diamond dressing disc obtained in Example 1 exhibits significantly higher corrosion resistance in the polishing solution than the diamond dressing discs obtained in Comparative Examples 1, 2, and 3. Furthermore, the corrosion potential of the diamond dressing disc obtained in Example 1 is significantly higher than that of Comparative Example 1, and also higher than that of Comparative Examples 2 and 3. From the perspective of electrochemical corrosion thermodynamics, the diamond dressing disc of Example 1 is also less prone to corrosion. Thus, it is evident that the diamond dressing disc obtained in the embodiments of this invention possesses stronger corrosion resistance.

[0048] Compared to Comparative Example 1, Example 1 introduces a... Figure 2 The cauliflower-like structure of the coating shown is modified with superhydrophobic coating, which makes the polishing liquid and the surface of the dressing disc have more air space. The surface tension of water causes the polishing liquid to be more effectively lifted on the surface of the nickel-copper-manganese coating, which better prevents the corrosive components in the polishing liquid from entering the coating and further reaching the substrate, thereby significantly improving the corrosion resistance of the dressing disc.

[0049] Compared to Comparative Example 2, Example 1 introduces a... Figure 2 The cauliflower-shaped coating shown has a significantly larger contact angle between the polishing liquid and the surface of the dressing disc in Example 1 than between the polishing liquid and the surface of the dressing disc in Comparative Example 2. The contact area between the polishing liquid and the surface of the dressing disc is also smaller, so Example 1 has better corrosion resistance.

[0050] Compared with Comparative Example 2, the surface of the trimming disc in Comparative Example 3 was coated with a relatively smooth nickel-manganese plating layer. After surface modification, the hydrophobicity of this plating layer was similar to that of Comparative Example 2. However, the corrosion resistance of the nickel-manganese plating layer was not as good as that of the nickel-chromium alloy brazing layer. Therefore, the corrosion resistance of the trimming disc in Comparative Example 3 was not as good as that of the trimming disc in Comparative Example 2, and even less so than that of the trimming disc in Example 1.

[0051] Where there is no conflict, the above embodiments and features described herein can be combined with each other.

[0052] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A corrosion-resistant diamond dressing disc, characterized in that, The coating includes a dressing disk substrate (1), a brazing layer (2), a copper plating layer (3), a nickel-copper-manganese plating layer (4), a fluoroalkyl silane treatment layer (5), and multiple diamond particles (6). The brazing layer (2) is provided on one side of the dressing disk substrate (1). The multiple diamond particles (6) are arranged at a certain interval. Each diamond particle (6) is partially disposed in the brazing layer (2). The upper surface of the brazing layer (2) is sequentially deposited with the copper plating layer (3), the nickel-copper-manganese plating layer (4), and the fluoroalkyl silane treatment layer (5) from bottom to top. The mass ratio of nickel, copper, and manganese in the nickel-copper-manganese plating layer (4) is (92~93.5):(6~7):(0.5~1). The fluoroalkylsilane treatment layer (5) includes any one of 1H,1H,2H,2H-perfluorooctyltriethoxysilane, 1H,1H,2H,2H-perfluorodecyltriethoxysilane, 1H,1H,2H,2H-perfluoroheptadecanetrimethyloxysilane, and perfluorooctadecyltriethoxysilane.

2. The corrosion-resistant diamond dressing disc as described in claim 1, characterized in that, The base material of the diamond dressing disc is stainless steel.

3. The corrosion-resistant diamond dressing disc as described in claim 1, characterized in that, The diameter of the diamond particles ranges from 80 to 300 μm, and the height of the diamond particles exposed on the surface of the brazing layer ranges from 56 to 210 μm.

4. The corrosion-resistant diamond dressing disc as described in claim 1, characterized in that, The thickness of the copper plating layer is 1~5μm.

5. A corrosion-resistant diamond dressing disc as described in claim 1, characterized in that, The thickness of the nickel-copper-manganese plating is 5~15μm.

6. The corrosion-resistant diamond dressing disc as described in claim 5, characterized in that, The microhardness of the nickel-copper-manganese coating is 550~700HV.

7. The corrosion-resistant diamond dressing disc as described in claim 1, characterized in that, The brazing layer (2) is fixed to one side of the dressing plate substrate (1) by vacuum brazing, and the brazing material is a nickel-based alloy.

8. A method for preparing a corrosion-resistant diamond dressing disc as described in any one of claims 1-7, characterized in that, The specific steps include the following: S1. Clean the stains and oxide film on the surface of the stainless steel substrate, then apply adhesive to the cleaned substrate surface, evenly distribute nickel-chromium alloy solder, then spray adhesive on the nickel-chromium alloy solder layer, and evenly sprinkle diamond particles on the nickel-chromium alloy solder layer using the template method. S2. The workpiece with diamond particles spread on it obtained in step S1 is sintered in a high temperature vacuum environment of 900~1100℃ to obtain a diamond trimming disc semi-finished product. S3. Partially insulate the diamond trimming disc semi-finished product obtained in step S2, exposing only the diamond-containing brazing layer. Then, perform electrochemical degreasing, electrochemical activation, and cleaning pre-plating treatment on the surface of the diamond-containing brazing layer. Finally, place it in an electroplating tank for copper plating. S4. Remove the copper-plated diamond trimming tray semi-finished product obtained in step S3 from the tank, rinse it clean with distilled water, and then electrodeposit a nickel-copper-manganese plating layer. S5. Remove the semi-finished diamond dressing disc with nickel-copper-manganese plating obtained in step S4 from the tank, remove the insulating material, clean it with water, place it in anhydrous ethanol solution of fluoroalkylsilane, heat it in a water bath to react, rinse the surface of the nickel-copper-manganese plating with anhydrous ethanol, and dry it to obtain the finished diamond dressing disc with good corrosion resistance.

9. The preparation method according to claim 8, characterized in that, In step S4, the electroplating solution used for electrodepositing the nickel-copper-manganese coating comprises 150-300 g / L NiSO4, 5-10 g / L CuSO4, 5-10 g / L MnCl2, 60-120 g / L Na3C6H5O7, and 30-50 g / L H3BO3. Direct current electroplating is employed, with a current density of 5-8 A / dm³. 2 The plating solution temperature is 30~40 ℃, and the pH value of the plating solution is 3.6~4.

2.

10. The preparation method according to claim 8, characterized in that, In step S5, the mass concentration of the anhydrous ethanol solution of fluoroalkylsilane is 25~40 g / L.

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