LED lamp bead and transparent LED display screen

Abstract

The application relates to an LED lamp bead and a transparent LED display screen, the LED lamp bead comprising an insulating support seat, a first circuit layer and a lampshade; the insulating support seat comprises oppositely arranged first and second side edges; the first circuit layer is arranged on the front surface of the insulating support seat and comprises a first power binding area, a second power binding area, a first signal binding area and a second signal binding area; the first power binding area comprises a first connecting part arranged on the first side edge and a second connecting part arranged on the second side edge; the second power binding area comprises a third connecting part arranged on the first side edge and a fourth connecting part arranged on the second side edge; the lampshade is arranged on the front surface of the insulating support seat, and the first connecting part, the second connecting part, the third connecting part, the fourth connecting part, the first signal binding area and the second signal binding area are at least partially exposed outside the lampshade. In this way, the LED display screen made of the LED lamp bead is more convenient to produce, the cost is reduced, and the resolution and the transparency are improved.

Description

Technical Field

[0001] This invention belongs to the field of display screen technology, and in particular relates to an LED lamp bead and a transparent LED display screen. Background Technology

[0002] Transparent LED displays are gradually gaining widespread application in the market and have developed into various product forms. A technology for transparent LED displays that uses an array of LED beads distributed on a transparent substrate has begun to emerge.

[0003] Existing LED beads consist of a housing, a driver chip, and red, green, and blue light-emitting wafers. The housing has a chip mounting surface with pins extending from it, and the driver chip is mounted on the housing. The light-emitting wafers are mounted on the driver chip. Since the power circuit of each LED bead in a transparent LED display is achieved by sequentially connecting the positive and negative pins of the corresponding chip mounting surfaces, a failure in one LED bead will affect the entire display. Furthermore, the electrical connections between the various structures on the LED bead are achieved through bonding wires, resulting in a dense arrangement of bonding wires and a complex LED bead structure. This not only significantly obstructs the view and affects the transparency of the transparent LED display, but also complicates the connection between the LED beads, hindering the production of transparent LED displays. Summary of the Invention

[0004] This invention provides an LED chip and a transparent LED display screen to optimize the structure of the LED chip.

[0005] This invention provides an LED lamp bead, comprising an insulating support base, a first circuit layer, a driver chip, a light-emitting wafer, and a lamp cover; The insulating support includes a first side and a second side disposed opposite to each other, the first side and the second side being spaced apart along a first direction; The first circuit layer is disposed on the front side of the insulating support base and includes a first power bonding area, a second power bonding area, a first signal bonding area, and a second signal bonding area that are isolated from each other. The first power bonding area includes a first connecting portion disposed on the first side and a second connecting portion disposed on the second side. The first connecting portion and the second connecting portion are electrically connected, and the first power bonding area is used to connect a first electrode of an external power source. The second power bonding area includes a third connecting portion disposed on the first side and a fourth connecting portion disposed on the second side. The third connecting portion and the fourth connecting portion are electrically connected, and the second power bonding area is used to connect a second electrode of an external power source with a polarity opposite to that of the first electrode. The driving chip and the light-emitting chip are disposed on the first circuit layer, and the driving chip is connected to the light-emitting chip, the first power bonding area, the second power bonding area, the first signal bonding area and the second signal bonding area respectively. The lampshade is located on the front of the insulating support base, and the first connecting part, the second connecting part, the third connecting part, the fourth connecting part, the first signal binding area and the second signal binding area are all at least partially exposed outside the lampshade.

[0006] Optionally, one end of the first power bonding area extends to the first side to form the first connection portion, and the other end of the first power bonding area extends to the second side to form the second connection portion; One end of the second power bonding area extends to the first side to form the third connection portion, and the other end of the second power bonding area extends to the second side to form the fourth connection portion.

[0007] Optionally, the insulating support base further includes a first corner and a second corner arranged diagonally, the first corner being located at one end of the first side and the second corner being located at one end of the second side; The first signal binding area is located at the first corner, the second signal binding area is located at the second corner, and the first power binding area and the second power binding area are spaced apart within the area formed between the first corner and the second corner.

[0008] Optionally, the insulating support base further includes a third corner and a fourth corner arranged diagonally; the second corner and the third corner are respectively located at both ends of the second side; the first corner and the fourth corner are respectively located at both ends of the first side; One end of the first power binding area is located at the third corner, and the other end is located on the first side; one end of the second power binding area is located at the fourth corner, and the other end is located on the second side.

[0009] Optionally, the driver chip is disposed on the first power bonding area; The first circuit layer further includes a first signal connection area, which is located close to the driver chip; The LED bead also includes a second circuit layer; the second circuit layer is disposed on the back of the insulating support and includes a second signal connection area; The driver chip, the first signal connection area, the second signal connection area, and the second signal binding area are connected in sequence.

[0010] Optionally, the insulating support base further includes a third corner and a fourth corner arranged diagonally; the second corner and the third corner are respectively located at both ends of the second side; the first corner and the fourth corner are respectively located at both ends of the first side; The first circuit layer further includes a first signal short-circuit bonding area and a second signal short-circuit bonding area that are isolated from each other; the first signal short-circuit bonding area is located at the third corner, and the second signal short-circuit bonding area is located at the fourth corner; the first signal short-circuit bonding area and the second signal short-circuit bonding area are short-circuited together. The first signal short-circuit binding area is at least partially exposed outside the lampshade; the second signal short-circuit binding area is at least partially exposed outside the lampshade.

[0011] Optionally, the LED bead further includes a third circuit layer; the third circuit layer is disposed on the back side of the insulating support and includes a signal shorting connection area; The signal short-circuit connection area connects the first signal short-circuit binding area and the second signal short-circuit binding area, so that the first signal short-circuit binding area and the second signal short-circuit binding area are short-circuited.

[0012] Optionally, the insulating support base further includes a first corner, a second corner, a third corner, and a fourth corner; the first corner and the second corner are diagonally arranged, and the third corner and the fourth corner are diagonally arranged; the first corner and the fourth corner are respectively located at both ends of the first side; the second corner and the third corner are respectively located at both ends of the second side. The first circuit layer further includes a third signal binding area and a fourth signal binding area that are isolated from each other; the third signal binding area is at least partially exposed outside the lampshade, and the fourth signal binding area is at least partially exposed outside the lampshade; the first signal binding area is located at the first corner, the second signal binding area is located at the fourth corner, the third signal binding area is located at the third corner, and the fourth signal binding area is located at the second corner; the first signal binding area and the second signal binding area are connected through the driver chip to form a first signal path, and the third signal binding area and the fourth signal binding area are connected through the driver chip to form a second signal path; one of the first signal path and the second signal path can be used selectively.

[0013] Optionally, the LED bead further includes a fourth circuit layer; the fourth circuit layer is disposed on the back of the insulating support and includes a first power connection area and a second power connection area; The first connecting portion and the second connecting portion are spaced apart, the first power connection area connects the first connecting portion and the second connecting portion, and the first signal binding area is disposed between the first connecting portion and the second connecting portion; The third connection portion and the fourth connection portion are spaced apart, and the second power connection area connects the third connection portion and the fourth connection portion; the second signal binding area is disposed between the third connection portion and the fourth connection portion.

[0014] Optionally, the insulating support includes a first corner, a second corner, a third corner, and a fourth corner; the first corner and the second corner are diagonally arranged, the third corner and the fourth corner are diagonally arranged, the first corner and the fourth corner are respectively located at both ends of the first side; the second corner and the third corner are respectively located at both ends of the second side. The first connecting part is located at the first corner, the second connecting part is located at the third corner; the third connecting part is located at the second corner, and the fourth connecting part is located at the fourth corner.

[0015] Optionally, the first circuit layer further includes a fifth signal binding area and a sixth signal binding area that are isolated from each other; The first signal binding area and the second signal binding area are connected through the driver chip to form a first signal path, and the fifth signal binding area and the sixth signal binding area are connected through the driver chip to form a third signal path; the first signal path and the third signal path can be used selectively.

[0016] The present invention also provides a transparent LED display screen, including a transparent substrate and the LED beads described in the foregoing technical solution; an array of multiple LED beads is arranged on the transparent substrate, and the back side of the insulating support faces the transparent substrate; The transparent substrate is provided with a circuit pattern, which includes a first power pad and a second power pad with opposite polarities. The first power bonding area of ​​two adjacent LED beads is connected by a first power jumper, and the first power bonding area of ​​at least one LED bead is connected to the first power pad by the first power jumper. The second power bonding area of ​​two adjacent LED beads is connected by a second power jumper, and the second power bonding area of ​​at least one LED bead is connected to the second power pad by the second power jumper. In two adjacent LED beads, the first signal binding area of ​​one LED bead is connected to the second signal binding area of ​​the other LED bead via a signal jumper.

[0017] Optionally, one of the first signal binding area and the second signal binding area is a signal input binding area, and the other is a signal output binding area; The circuit pattern also includes signal pads; The transparent LED display screen includes at least one set of LED light strings, and the LED light strings include multiple LED beads; the signal input binding area of ​​the first LED bead is bound to the signal pad through the signal jumper, and the signal input binding areas of the remaining LED beads are bound to the signal output binding area of ​​the previous LED bead through the signal jumper.

[0018] Optionally, each group of LED strings is provided with two signal pads; in the LED string, the signal input binding area of ​​the first LED is bound to the first signal pad through the signal jumper, the signal input binding areas of the remaining LEDs are bound to the signal output binding area of ​​the preceding LED through the signal jumper, and the signal output binding area of ​​the last LED is bound to the second signal pad through the signal jumper.

[0019] The present invention also provides a transparent LED display screen, including a transparent substrate and the LED beads described in the foregoing technical solution; an array of multiple LED beads is arranged on the transparent substrate, and the back side of the insulating support faces the transparent substrate; The transparent substrate is provided with a circuit pattern, which includes a first power pad and a second power pad with opposite polarities. The first power bonding area of ​​two adjacent LED beads is connected by a first power jumper, and the first power bonding area of ​​at least one LED bead is connected to the first power pad by the first power jumper. The second power bonding area of ​​two adjacent LED beads is connected by a second power jumper, and the second power bonding area of ​​at least one LED bead is connected to the second power pad by the second power jumper. In the first signal binding area and the second signal binding area, one is a signal input binding area and the other is a signal output binding area; in the first signal short-circuit binding area and the second signal short-circuit binding area, one is a short-circuit input binding area and the other is a short-circuit output binding area. In the three adjacent LED beads, the signal input binding area of ​​the middle LED bead is connected to the short-circuit output binding area of ​​the preceding LED bead via a signal jumper, the signal output binding area of ​​the middle LED bead is connected to the short-circuit input binding area of ​​the following LED bead via the same signal jumper, and the short-circuit input binding area of ​​the middle LED bead is connected to the signal output binding area of ​​the preceding LED bead via the same signal jumper, and the short-circuit output binding area of ​​the middle LED bead is connected to the signal input binding area of ​​the following LED bead via the same signal jumper.

[0020] Optionally, the circuit pattern may further include signal pads; The transparent LED display screen includes at least one set of LED strings, each LED string including multiple LED beads; each set of LED strings has two corresponding signal pads; in each set of LED strings, the signal input binding area of ​​the first LED bead is bound to one of the signal pads via a signal jumper, and the short-circuit input binding area of ​​the first LED bead is bound to the other signal pad via a signal jumper; the signal input binding areas of the remaining LED beads are bound to the short-circuit output binding area of ​​the preceding LED bead via signal jumpers, and the short-circuit input binding areas of each LED bead are bound to the signal output binding area of ​​the preceding LED bead via signal jumpers.

[0021] Optionally, the circuit pattern further includes connection pads, with each group of LED strings corresponding to one connection pad; In each LED string, the signal output binding area of ​​the last LED is bound to the connection pad via the signal jumper, and the short-circuit output binding area of ​​the last LED is bound to the connection pad via the signal jumper.

[0022] Optionally, the circuit pattern further includes at least one connection pad; each connection pad corresponds to two sets of LED strings; The short-circuit output bonding area of ​​the last LED in the first group of LED strings is bonded to the connection pad via the signal jumper; the signal output bonding area of ​​the last LED in the second group of LED strings is bonded to the connection pad via the signal jumper; the signal output bonding area of ​​the last LED in the first group of LED strings is bonded to the short-circuit output bonding area of ​​the last LED in the second group of LED strings via the signal jumper.

[0023] In the LED beads and transparent LED display screen provided in this embodiment of the invention, the first connecting part and the second connecting part of the first power binding area are respectively disposed on the first side and the second side, and the third connecting part and the fourth connecting part of the second power binding area are respectively disposed on the first side and the second side. This design allows for the selection of the position on the first power binding area and the second power binding area closest to the external power source for binding connection, making the connection path between the LED bead and the external power source shorter, simplifying the connection lines on the LED bead, and making the connection lines on the LED bead clearer and more understandable. This optimizes the structure of the LED bead, making the connection of the LED bead itself simpler and more convenient, and also facilitating the production and manufacturing of the transparent LED display screen based on this LED bead, thus reducing costs. At the same time, the first power binding area, the second power binding area, the first signal binding area, and the second signal binding area are disposed on the front of the insulating support, and each binding area is at least partially exposed outside the lamp cover, that is, the binding connection position of each binding area is located on the outer surface of the LED bead, which facilitates circuit connection, makes fault diagnosis and repair more intuitive and convenient, and reduces maintenance difficulty. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the LED lamp bead provided in Embodiment 1 of the present invention; Figure 2 This is a front view of the LED lamp bead provided in Embodiment 1 of the present invention; Figure 3 This is a partial structural schematic diagram of the LED lamp bead provided in Embodiment 1 of the present invention; Figure 4 yes Figure 3 A front view of part of the structure of the LED beads; Figure 5 yes Figure 4 A schematic diagram of the back of a portion of the LED chip structure; Figure 6 This is a schematic diagram of the structure of the transparent LED display screen provided in Embodiment 1 of the present invention; Figure 7 yes Figure 6 Enlarged view of point A in the middle; Figure 8 This is a structural schematic diagram of the transparent LED display screen provided in Embodiment 1 of the present invention from another angle; Figure 9 This is a schematic diagram of the structure of the LED lamp bead provided in Embodiment 2 of the present invention; Figure 10 This is a front view of the LED lamp bead provided in Embodiment 2 of the present invention; Figure 11 This is a partial structural schematic diagram of the LED lamp bead provided in Embodiment 2 of the present invention; Figure 12 yes Figure 11 A front view of part of the structure of the LED beads; Figure 13 yes Figure 11 A schematic diagram of the back of a portion of the LED chip structure; Figure 14 This is a schematic diagram of the structure of a transparent LED display screen provided in Embodiment 2 of the present invention; Figure 15 This is a structural schematic diagram of a transparent LED display screen provided in Embodiment 2 of the present invention from another angle; Figure 16 yes Figure 15 Enlarged view of point C in the image; Figure 17 This is a schematic diagram of another transparent LED display screen provided in Embodiment 2 of the present invention; Figure 18 yes Figure 17 Enlarged view of point B in the image; Figure 19 This is a schematic diagram of the structure of the LED lamp bead provided in Embodiment 3 of the present invention; Figure 20 This is a partial structural schematic diagram of the LED lamp bead provided in Embodiment 3 of the present invention; Figure 21 yes Figure 20 A front view of part of the structure of the LED beads; Figure 22 yes Figure 20 A schematic diagram of the back of a portion of the LED chip structure; Figure 23 This is a schematic diagram of the structure of the transparent LED display screen provided in Embodiment 3 of the present invention; Figure 24 yes Figure 23 Enlarged view at point D; Figure 25 This is a schematic diagram of the structure of the LED lamp bead provided in Embodiment 4 of the present invention; Figure 26 This is a partial structural schematic diagram of the LED lamp bead provided in Embodiment 4 of the present invention; Figure 27 yes Figure 26 A front view of part of the structure of the LED beads; Figure 28 yes Figure 26 A schematic diagram of the back of a portion of the LED chip structure; Figure 29 This is a schematic diagram of the structure of the transparent LED display screen provided in Embodiment 3 of the present invention; Figure 30 yes Figure 29 Enlarged view of point E in the middle.

[0025] The reference numerals in the accompanying drawings are as follows: 1. LED lamp bead; 11. Insulating support base; 111. First side; 112. Second side; 113. Third side; 114. Fourth side; 12. First circuit layer; 121. First power bonding area; 1211. First main body; 1212. First connecting part; 1213. Second connecting part; 1214. Third main body; 1215. Fifth connecting part; 122. Second power bonding area; 1221. Second main body; 1222. Third connecting part; 1223, Fourth connecting part; 1224, Fourth main body part; 1225, Sixth connecting part; 123, First signal binding area; 124, Second signal binding area; 125, First signal connection area; 126, Second signal short-circuit binding area; 127, Third signal connection area; 128, First signal short-circuit binding area; 129, Third signal binding area; 1210, Fourth signal binding area; 1220, Fifth signal connection area; 1230 1240, 125 ... Detailed Implementation

[0026] To make the technical problems solved, the technical solutions, and the beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the invention and are not intended to limit the invention.

[0027] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0028] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0030] like Figures 1-3 As shown, the LED lamp bead provided in this embodiment of the invention includes an insulating support 11, a first circuit layer 12, a driver chip 14, a light-emitting wafer 15, and a lamp cover 16. The insulating support 11 includes a first side 111 and a second side 112 disposed opposite to each other, the first side 111 and the second side 112 being spaced apart along a first direction. The first circuit layer 12 is disposed on the front side of the insulating support 11 and includes a first power binding area 121, a second power binding area 122, a first signal binding area 123, and a second signal binding area 124 disposed mutually isolated from each other. The first power binding area 121 includes a first connecting portion 1212 disposed on the first side 111 and a second connecting portion 1213 disposed on the second side 112, the first connecting portion 1212 and the second connecting portion 1213 being electrically connected, and the first power binding area 121 being used to connect a first electrode of an external power source. The second power binding area 122 includes a first connecting portion 1212 disposed on the first side 111 and a second connecting portion 1213 disposed on the second side 112. The first connecting portion 1212 and the second connecting portion 1213 are electrically connected, and the first power binding area 121 is used to connect a first electrode of an external power source. A third connecting portion 1222 on one side 111 and a fourth connecting portion 1223 on the second side 112 are electrically connected. The third connecting portion 1222 and the fourth connecting portion 1223 are electrically connected. The second power binding area 122 is used to connect a second electrode of an external power source with a polarity opposite to that of the first electrode. A driving chip 14 and a light-emitting chip 15 are disposed on the first circuit layer 12. The driving chip 14 is connected to the light-emitting chip 15, the first power binding area 121, the second power binding area 122, the first signal binding area 123, and the second signal binding area 124, respectively. A lampshade 16 is disposed on the front of the insulating support base 11. The two ends of the first power binding area 121 along the first direction are exposed outside the lampshade 16. The two ends of the second power binding area 122 along the first direction are exposed outside the lampshade 16. The first signal binding area 123 is at least partially exposed outside the lampshade 16. The second signal binding area 124 is at least partially exposed outside the lampshade 16.

[0031] As an example, the insulating support 11 is a component that supports the LED bead 1; a first circuit layer 12 is provided on the front side of the insulating support 11; the first side 111 and the second side 112 are two sides of the insulating support 11 distributed in a first direction, and the first side 111 and the second side 112 are arranged along a second direction, with the first direction perpendicular to the second direction.

[0032] As an example, the first power bonding region 121 is electrically connected to the first electrode of the driver chip 14 and the external power supply, and the second power bonding region 122 is electrically connected to the second electrode of the driver chip 14 and the external power supply, forming a conductive circuit to supply power to the driver chip 14.

[0033] As an example, the first signal binding area 123, the driver chip 14 and the second signal binding area 124 are connected to form a signal transmission path, and the driver chip 14 controls the light-emitting chip 15 to work according to the signal.

[0034] As an example, the driver chip 14 is a control component on the LED bead 1, used to control the operation of the light-emitting wafer 15. The driver chip 14 is disposed on the first circuit layer 12 and is electrically connected to the first power bonding area 121, the second power bonding area 122, the first signal bonding area 123, and the second signal bonding area 124, respectively. Furthermore, the driver chip 14 is electrically connected to the light-emitting wafer 15. The driver chip 14 is generally known to the public; it typically integrates a driving circuit and has a passivation layer formed during its manufacturing process. The driver chip 14 has several pins, each of which is electrically connected to the light-emitting wafer 15, the first power bonding area 121, the second power bonding area 122, the first signal bonding area 123, and the second signal bonding area 124 via bonding wires. Bonding wires, also called bonding lines, typically include gold wires, copper wires, palladium-plated copper wires, and alloy wires. The pin (English name: PAD) is generally placed on the passivation layer. The pin is the terminal inside the driver chip 14.

[0035] As an example, the light-emitting chip 15 is a component on the LED bead 1 that plays the role of emitting light. It includes light-emitting chips 15 of three colors: red, green and blue, which are respectively called red light-emitting chip 15a, green light-emitting chip 15b and blue light-emitting chip 15c.

[0036] As an example, the lampshade 16 is mounted on the front of the insulating support 11, and the first connecting part 1212, the second connecting part 1213, the third connecting part 1222, the fourth connecting part 1223, the first signal binding area 123 and the second signal binding area 124 are all at least partially exposed outside the lampshade 16. In other words, a receiving space is formed between the lamp cover 16 and the front of the insulating support 11. The driver chip 14 and the light-emitting chip 15 are located in the receiving space. The first connecting part 1212 extends at least partially out of the receiving space, the second connecting part 1213 extends at least partially out of the receiving space, the third connecting part 1222 extends at least partially out of the receiving space, the fourth connecting part 1223 extends at least partially out of the receiving space, the first signal binding area 123 extends at least partially out of the receiving space, and the second signal binding area 124 extends at least partially out of the receiving space. This design allows the first power binding area 121, the second power binding area 122, the first signal binding area 123, and the second signal binding area 124 to be located on the front of the insulating support 11. The binding connection positions of each binding area are located on the outer surface of the LED bead 1, which facilitates circuit connection, makes fault diagnosis and maintenance more intuitive and convenient, and reduces maintenance difficulty.

[0037] The LED bead provided in this embodiment of the invention has a first connecting portion 1212 and a second connecting portion 1213 of the first power binding area 121 respectively disposed on the first side 111 and the second side 112, and a third connecting portion 1222 and a fourth connecting portion 1223 of the second power binding area 122 respectively disposed on the first side 111 and the second side 112. This design allows for the selection of the position on the first power binding area 121 and the second power binding area 122 closest to the external power source for binding connection, making the connection path between the LED bead 1 and the external power source shorter, simplifying the connection lines on the LED bead 1, optimizing the overall structure of the LED bead 1, and making the connection of the LED bead 1 simpler and more convenient. At the same time, the first power binding area 121, the second power binding area 122, the first signal binding area 123 and the second signal binding area 124 are disposed on the front of the insulating support base 11, and each binding area is at least partially exposed outside the lamp cover 16, that is, the binding connection position of each binding area is located on the outer surface of the LED bead 1, which facilitates circuit connection, makes fault diagnosis and maintenance more intuitive and convenient, and reduces maintenance difficulty.

[0038] In this embodiment, as Figure 1 and Figure 2As shown, the insulating support 11 is a square support, and the lampshade 16 is a square lampshade 16; the length of the lampshade 16 in the first direction is less than the length of the square support 16 in the first direction; the length of the lampshade 16 in the second direction is not less than the length of the square support 16 in the second direction; the second direction is perpendicular to the first direction. In this example, this design ensures that each of the first power binding area 121, the second power binding area 122, the first signal binding area 123, and the second signal binding area 124 is at least partially exposed outside the lampshade 16, while maximizing the protection range of the lampshade 16 for the first circuit layer 12.

[0039] In this example, the insulating support 11 is a square support. The square support has a simple and regular shape, which makes it easy to process and assemble.

[0040] In this embodiment, the insulating support base 11 further includes a first corner and a second corner arranged diagonally, the first corner being located at one end of the first side 111 and the second corner being located at one end of the second side 112.

[0041] In this embodiment, the insulating support base 11 further includes a third corner and a fourth corner arranged diagonally; the second corner and the third corner are respectively arranged at both ends of the second side 112; the first corner and the fourth corner are respectively arranged at both ends of the first side 111.

[0042] In this embodiment, the insulating support base 11 further includes a third side 113 and a fourth side 114 disposed opposite to each other, the third side 113 and the fourth side 114 being spaced apart along a second direction; the first side 111, the third side 113, the second side 112 and the fourth side 114 are connected in sequence; the first side 111 and the third side 113 are connected by a first corner, the second side 112 and the fourth side 114 are connected by a second corner; the second side 112 and the third side 113 are connected by a third corner, and the first side 111 and the fourth side 114 are connected by a fourth corner.

[0043] The following describes various embodiments of the present invention: Example 1 The LED bead 1 provided in this embodiment, such as Figures 1-3 As shown, one end of the first power binding area 121 extends to the first side 111 to form a first connection portion 1212, and the other end extends to the second side 112 to form a second connection portion 1213; one end of the second power binding area 122 extends to the first side 111 to form a third connection portion 1222, and the other end extends to the second side 112 to form a fourth connection portion 1223.

[0044] In this example, the two ends of the first power binding area 121 extend to the first side 111 and the second side 112, respectively, and the two ends of the second power binding area 122 extend to the first side 111 and the second side 112, respectively. That is, the first power binding area 121 is arranged through the first direction, and the second power binding area 122 is arranged through the first direction, which increases the area of ​​the first power binding area 121 and the second power binding area 122. It is possible to select the position on the first power binding area 121 and the second power binding area 122 closest to the external power source for binding and connection, making the connection path between the LED bead 1 and the external power source shorter. Furthermore, the first power binding area 121 and the second power binding area 122 are integrated, which simplifies the connection lines on the LED bead 1, making the connection lines on the LED bead 1 clearer and more understandable. The overall structure of the LED bead 1 is optimized, and the connection of the LED bead 1 is simpler and more convenient.

[0045] As an example, such as Figure 3 and Figure 4 As shown, the first signal binding area 123 is located at the first corner; the second signal binding area 124 is located at the second corner; the first power binding area 121 and the second power binding area 122 are spaced apart within the area formed by the first corner and the second corner.

[0046] In this example, the first signal binding area 123 is located at the first corner; the second signal binding area 124 is located at the second corner; the first power binding area 121 and the second power binding area 122 are spaced apart within the area formed by the first and second corners; this makes the first signal binding area 123 and the second signal binding area 124 diagonally arranged, maximizing the distance between them, avoiding close proximity of the signal jumpers 6 connected to the first signal binding area 123 and the second signal binding area 124, preventing short circuits between the signal jumpers 6, and facilitating the rational planning of the connection lines on the LED beads 1, making the arrangement of the connection lines on the LED beads 1 clearer and smoother.

[0047] As an example, such as Figure 3 and Figure 4 As shown, one end of the first power binding area 121 is located at the third corner, and the other end is located on the first side 111; one end of the second power binding area 122 is located at the fourth corner, and the other end is located on the second side 112.

[0048] In this example, one end of the first power binding area 121 is located at the third corner, and the other end is located on the first side 111, that is, the second connecting part 1213 is located at the third corner, and the first connecting part 1212 is located on the first side 111; one end of the second power binding area 122 is located at the fourth corner, and the other end is located on the second side 112, that is, the third connecting part 1222 is located at the fourth corner, and the fourth connecting part 1223 is located on the second side 112; this facilitates the lead-out of the first power binding area 121 and the second power binding area 122 of the LED bead 1.

[0049] As an example, such as Figures 2-4 As shown, the first power bonding area 121 includes a first main body 1211, a second connecting portion 1213 extending from the first main body 1211 along a first direction to a third corner, and a first connecting portion 1212 extending from the first main body 1211 along a first direction to a first side 111; the first connecting portion 1212 is located on the first main body 1211 near the third side 113, and the second connecting portion 1213 is located on the first main body 1211 near the second power bonding area 122; the first main body 1211 is located within an accommodating space, and the first connecting portion 1212 and the second connecting portion 1213 are located within the accommodating space. The second power binding area 122 includes a second main body 1221, a third connecting portion 1222 extending from the second main body 1221 along a first direction to a fourth corner, and a fourth connecting portion 1223 extending from the second main body 1221 along a first direction to a second side 112; the third connecting portion 1222 is located on the second main body 1221 near the fourth side 114, and the fourth connecting portion 1223 is located on the second main body 1221 near the first power binding area 121; the second main body 1221 is located within the receiving space, and the third connecting portion 1222 and the fourth connecting portion 1223 are located outside the receiving space.

[0050] like Figure 6 and Figure 7 As shown, the LED bead 1 of this example is applied in a transparent LED display screen. The first connection part 1212 of each LED bead 1 is connected to the first electrode of an external power supply or the second connection part 1213 of an adjacent LED bead 1 via a first power jumper 4; the third connection part 1222 of each LED bead 1 is connected to the second electrode of an external power supply or the fourth connection part 1223 of an adjacent LED bead 1 via a second power jumper 5.

[0051] In this example, the spacing between the first connecting part 1212 and the second connecting part 1213 on the first power binding area 121 is ensured to facilitate the connection of the first power jumper 4 on the first connecting part 1212 and the second connecting part 1213; the spacing between the third connecting part 1222 and the fourth connecting part 1223 on the second power binding area 122 is also ensured to facilitate the connection of the first power jumper 4 on the third connecting part 1222 and the fourth connecting part 1223; at the same time, sufficient spacing is maintained between the binding connection positions of the first power binding area 121 and the binding connection positions of the second power binding area 122 to avoid the dense and intertwined arrangement of the first power jumper 4 and the second power jumper 5, and to prevent the first power jumper 4 and the second power jumper 5 from short-circuiting. This is conducive to the rational planning of the connection path of the first power jumper 4 and the second power jumper 5 on the transparent LED display screen, optimizes the structure of the LED lamp bead 1, makes the connection of the LED lamp bead 1 simpler and more convenient, facilitates the production of the transparent LED display screen, and also improves the resolution and transparency of the transparent LED display screen.

[0052] As an example, such as Figure 3 As shown, the driver chip 14 is disposed on the first power bonding area 121. In this example, the driver chip 14 is disposed on the first main body portion 1211 of the first power bonding area 121; the first power bonding area 121 has sufficient space to facilitate the installation of the driver chip 14.

[0053] As an example, the light-emitting chip 15 is disposed on the second power bonding region 122, and the light-emitting chip 15 is disposed on the second main body portion 1221 of the second power bonding region 122; the second power bonding region 122 has sufficient space to facilitate the installation of the light-emitting chip 15. In addition, the light-emitting chip 15 can also be mounted on the driver chip 14.

[0054] As an example, such as Figures 3-5As shown, the first circuit layer 12 further includes a first signal connection area 125, which is located near the driver chip 14; the LED bead 1 further includes a second circuit layer 13, which is located on the back of the insulating support 11 and includes a second signal connection area 131; the driver chip 14, the first signal connection area 125, the second signal connection area 131 and the second signal bonding area 124 are connected in sequence. In this example, a first signal connection area 125 is provided near the driver chip 14, and the first signal connection area 125 is electrically connected to the driver chip 14. A second signal connection area 131 is provided on the back of the insulating support 11 for electrically connecting the first signal connection area 125 and the second signal bonding area 124. The first signal bonding area 123, the driver chip 14, the first signal connection area 125, the second signal connection area 131, and the second signal bonding area 124 are connected in sequence to form a signal transmission path inside the LED bead 1. This allows the driver chip 14 and the second signal bonding area 124 to be electrically connected through the first signal connection area 125 and the second signal connection area 131, avoiding the need to cross the second power bonding area 122 when directly connecting the driver chip 14 and the second signal bonding area 124 with a bonding wire. This minimizes the length of the bonding wire on the driver chip 14, reduces the crossover between bonding wires, facilitates the rational planning of the connection lines on the LED bead 1, simplifies the connection lines on the LED bead 1, optimizes the overall structure of the LED bead 1, facilitates the production of the transparent LED display, and improves the resolution and transparency of the transparent LED display.

[0055] Preferably, the second signal connection area 131 is connected to the first signal connection area 125 via a via, and the second signal connection area 131 is connected to the second signal bonding area 124 via a via; the via connection is used to realize the electrical connection, which is simple in structure, reduces the number of bonding wires on the LED bead 1, and simplifies the connection lines on the LED bead 1.

[0056] The LED bead 1 provided in Example 1 is applied to a transparent LED display screen; for example... Figures 6-8As shown, the transparent LED display screen includes a transparent substrate 2 and LED beads 1 as described in any of the embodiments of the aforementioned Example 1; an array of multiple LED beads 1 is arranged on the transparent substrate 2, and the back of the insulating support 11 faces the transparent substrate 2; a circuit pattern 3 is arranged on the transparent substrate 2, the circuit pattern 3 including a first power pad 31 and a second power pad 32 with opposite polarities; the first power bonding area 121 of two adjacent LED beads 1 is connected by a first power jumper 4, and the first power bonding area 121 of at least one LED bead 1 is connected to the first power pad 31 by the first power jumper 4; the second power bonding area 122 of two adjacent LED beads 1 is connected by a second power jumper 5, and the second power bonding area 122 of at least one LED bead 1 is connected to the second power pad 32 by the second power jumper 5; in two adjacent LED beads 1, the first signal bonding area 123 of one LED bead 1 and the second signal bonding area 124 of another LED bead 1 are connected by a signal jumper 6.

[0057] As an example, such as Figure 8 As shown, multiple LED beads 1 are arrayed on a transparent substrate 2, with the back of the insulating support 11 facing the transparent substrate 2; that is, the side of the insulating support 11 away from the light-emitting chip 15 faces the transparent substrate 2, and the side of the insulating support 11 with the light-emitting chip 15 faces outward; the first power binding area 121, the second power binding area 122, the first signal binding area 123, and the second signal binding area 124 are located on the front of the insulating support 11, and the binding connection position of each binding area is located on the outer surface of the LED beads 1, which facilitates the binding connection wires on each binding area, making fault diagnosis and repair more intuitive and convenient, and reducing the maintenance difficulty.

[0058] Preferably, the LED beads 1 are bonded to the transparent substrate 2.

[0059] As an example, such as Figure 6 and Figure 7As shown, the first power bonding area 121 of two adjacent LED beads 1 is connected by a first power jumper 4, and the first power bonding area 121 of at least one LED bead 1 is connected to the first power pad 31 by the first power jumper 4. That is, the LED bead 1 closest to the first power pad 31 has its first power bonding area 121, the end of which is closer to the first power pad 31 in the first direction, bonded to the first power pad 31 by the first power jumper 4; and the end of its first power bonding area 121, the end of which is farther from the first power pad 31 in the first direction, is bonded to the end of the first power bonding area 121 of the adjacent LED bead 1 in the first direction, the end of which is closer to the adjacent LED bead 1 by the first power jumper 4. Each of the other LED beads 1 has its first power bonding area 121 connected at one end in the first direction to the end of the first power bonding area 121 of an adjacent LED bead 1 near that LED bead 1 in the first direction via a first power jumper 4; the other end of its first power bonding area 121 in the first direction is connected to the end of the first power bonding area 121 of another adjacent LED bead 1 near that LED bead 1 in the first direction via a first power jumper 4. The first power bonding area 121 of each LED bead 1 is connected to the first power pad 31 or the first power bonding area 121 of an adjacent LED bead 1 via the first power jumper 4. Furthermore, the first power bonding area 121 is arranged through the first direction, allowing for the selection of the most appropriate position within the first power bonding area 121 for connection to the first power pad 31 or the first power bonding area 121 of an adjacent LED bead 1. This shortens the connection path of the first power jumper 4, makes the connection lines between the LED beads 1 clearer, improves the resolution and transparency of the transparent LED display screen, facilitates the production of the transparent LED display screen, and reduces costs.

[0060] As an example, such as Figure 6 and Figure 7As shown, the second power bonding area 122 of two adjacent LED beads 1 is connected by a second power jumper 5, and the second power bonding area 122 of at least one LED bead 1 is connected to the second power pad 32 by the second power jumper 5. That is, the end of the second power bonding area 122 of the LED bead 1 closest to the second electrode of the second power pad 32 in the first direction is bonded to the second power pad 32 by the second power jumper 5; the end of the second power bonding area 122 of the LED bead 1 away from the second power pad 32 in the first direction is bonded to the end of the second power bonding area 122 of the adjacent LED bead 1 in the first direction near that LED bead 1 by the second power jumper 5. Each of the other LED beads 1 has its second power bonding area 122 connected at one end in the first direction to the end of the second power bonding area 122 of an adjacent LED bead 1 near that LED bead 1 in the first direction via a second power jumper 5; the other end of its second power bonding area 122 in the first direction is connected to the end of the second power bonding area 122 of another adjacent LED bead 1 near that LED bead 1 in the first direction via a second power jumper 5. The second power bonding area 122 of each LED bead 1 is connected to the second power pad 32 or the second power bonding area 122 of an adjacent LED bead 1 via the second power jumper 5. Furthermore, the second power bonding area 122 is arranged through the first direction, allowing for the selection of the most appropriate position in the second power bonding area 122 for connection to the second power pad 32 or the second power bonding area 122 of an adjacent LED bead 1. This shortens the connection path of the second power jumper 5, makes the connection lines between the LED beads 1 clearer, improves the resolution and transparency of the transparent LED display, facilitates the production of the transparent LED display, and reduces costs.

[0061] As an example, such as Figure 7 and Figure 8 As shown, in two adjacent LED beads 1, the first signal binding area 123 of one LED bead 1 is connected to the second signal binding area 124 of the other LED bead 1 through a signal jumper 6, thereby realizing the signal connection between each LED bead 1 to control the light emission of each LED bead 1.

[0062] In the transparent LED display screen provided in this embodiment of the invention, the first power bonding area 121 of each LED bead 1 is bonded to the first power pad 31 or the first power bonding area 121 of an adjacent LED bead 1 via a first power jumper 4. The second power bonding area 122 of each LED bead 1 is bonded to the second power pad 32 or the second power bonding area 122 of an adjacent LED bead 1 via a second power jumper 5. This allows each LED bead 1 to directly draw power from the first power pad 31 and the second power pad 32 via the first power jumper 4 and the second power jumper 5. The power transfer does not need to go through the internal circuit of each LED bead 1, thus avoiding the impact on the normal operation of other LED bead 1 when the internal circuit of an LED bead 1 fails. Furthermore, the first power bonding area 121 is arranged through the first direction, and the second power bonding area 122 is arranged along the first direction. The through-type design allows for the selection of the closest position on the first power bonding area 121 and the second power bonding area 122 to the corresponding power pad or adjacent LED bead 1 for bonding and connection. This shortens the connection path of the first power jumper 4 and the second power jumper 5, simplifies the connection lines on the LED bead 1, and makes the connection lines between each LED bead 1 clearer. The overall structure of the LED bead 1 is optimized, and the connection of the LED bead 1 is simpler and more convenient, facilitating the production of transparent LED displays and improving the transparency of transparent LED displays. At the same time, the back of the insulating support 11 is mounted facing the transparent substrate 2, which facilitates the mounting of the LED bead 1 on the transparent substrate 2. The first power jumper 4, the second power jumper 5, and the signal jumper 6 are all connected to the front of the LED bead 1, which facilitates the bonding and connection between each LED bead 1.

[0063] As an example, such as Figure 6 As shown, circuit pattern 3 also includes power supply line 33; power supply line 33 includes first power supply line 33a and second power supply line 33b; first power supply line 33a is connected to first power pad 31, and second power supply line 33b is connected to second power pad 32; the first power bonding area 121 on each LED bead 1 is bonded to the first power supply line 33a or the first power bonding area 121 on the adjacent LED bead 1 through the first power jumper 4; the second power bonding area 122 on each LED bead 1 is bonded to the second power supply line 33b or the second power bonding area 122 on the adjacent LED bead 1 through the second power jumper 5.

[0064] In this example, the first power binding area 121 of each LED bead 1 is bound to the first power supply line 33a or the first power binding area 121 of the adjacent LED bead 1 via the first power jumper 4, and the second power binding area 122 of each LED bead 1 is bound to the second power supply line 33b or the second power binding area 122 of the adjacent LED bead 1 via the second power jumper 5, so that each LED bead 1 can directly draw power from the power supply line 33 via the first power jumper 4 and the second power jumper 5.

[0065] As an example, such as Figure 6 and Figure 7 As shown, all LED beads 1 are arranged in a square array on the transparent substrate 2. The power supply line 33 includes at least one first power supply line 33a and at least one second power supply line 33b. Several columns or rows of LED beads 1 share the power supply line 33, that is, several LED beads 1 between the first power supply line 33a and the second power supply line 33b share the first power supply line 33a and the second power supply line 33b.

[0066] The first power supply line 33a and the second power supply line 33b are distributed at intervals along the first direction. The LED beads 1 located between the first power supply line 33a and the second power supply line 33b are arranged in a square array. The LED beads 1 that are distributed in a straight line in the first direction are LED beads 1 in the same row, and the LED beads 1 that are distributed in a straight line in the second direction are LED beads 1 in the same column. The column of LED beads 1 closest to the first power supply line 33a is the first column of LED beads 1, and the column of LED beads 1 closest to the second power supply line 33b is the last column of LED beads 1. In each row of LED beads 1, the first connection portion 1212 of the first power bonding area 121 of the first column of LED beads 1 is bonded to the first power supply line 33a via the first power jumper 4. The second connection portion 1213 of the first power bonding area 121 of the first column of LED beads 1 is bonded to the first connection portion 1212 of the first power bonding area 121 of the second column of LED beads 1 via the first power jumper 4. The second connection portion 1213 of the first power bonding area 121 of the second column of LED beads 1 is bonded to the first connection portion 1212 of the first power bonding area 121 of the third column of LED beads 1 via the first power jumper 4, and so on. The second connection portion 1213 of the first power bonding area 121 of the second-to-last column of LED beads 1 is bonded to the first connection portion of the first power bonding area 121 of the last column of LED beads 1 via the first power jumper 4. 1212; The third connection portion 1222 of the second power binding area 122 of the first column of LED beads 1 is connected to the fourth connection portion 1223 of the second power binding area 122 of the second column of LED beads 1 via the second power jumper 5. The third connection portion 1222 of the second power binding area 122 of the second column of LED beads 1 is connected to the fourth connection portion 1223 of the second power binding area 122 of the third column of LED beads 1 via the second power jumper 5, and so on. The third connection portion 1222 of the second power binding area 122 of the penultimate column of LED beads 1 is connected to the fourth connection portion 1223 of the second power binding area 122 of the last column of LED beads 1 via the second power jumper 5. The third connection portion 1222 of the second power binding area 122 of the last column of LED beads 1 is connected to the second power supply line 33b via the second power jumper 5.

[0067] Preferably, the first power supply line 33a is connected to the first power bonding area 121 of each LED bead 1 in the same row located between the first power supply line 33a and the second power supply line 33b via a first power jumper 4. Using a single first power jumper 4 to bond the LED bead 1 in the same row eliminates the need to disconnect the first power jumper 4 in between, improving wiring efficiency and preventing interference between the first power jumpers 4 on each LED bead 1, thus facilitating processing and installation. Alternatively, multiple first power jumpers 4 can be used to bond to the first power bonding area 121 of each LED bead 1.

[0068] Preferably, the second power supply line 33b is connected to the second power bonding area 122 of each LED bead 1 in the same row between the first power supply line 33a and the second power supply line 33b via a second power jumper 5. Using a single second power jumper 5 to bond the LED bead 1 in the same row eliminates the need to disconnect the second power jumper 5 in between, improving wiring efficiency and preventing interference between the second power jumpers 5 on each LED bead 1, thus facilitating processing and installation. Alternatively, multiple second power jumpers 5 can be used to bond to the second power bonding area 122 of each LED bead 1.

[0069] As an example, such as Figure 6 and Figure 7 As shown, in the first signal binding area 123 and the second signal binding area 124, one is a signal input binding area and the other is a signal output binding area; the circuit pattern 3 also includes a signal pad 34; the transparent LED display screen includes at least one set of LED strings, and the LED strings include multiple LED beads 1; the signal input binding area of ​​the first LED bead 1 is bound to the signal pad 34 through a signal jumper 6, and the signal input binding areas of the remaining LED beads 1 are bound to the signal output binding area of ​​the previous LED bead 1 through a signal jumper 6.

[0070] In this example, all LED beads 1 are arranged in a square array on the transparent substrate 2. Each column of LED beads 1 is connected in series via signal jumpers 6 to form an LED string. Taking the first column of LED beads 1 as an example, the signal input bonding area of ​​the first row of LED beads 1 in the first column is bonded to the signal pad 34 via signal jumpers 6. The signal output bonding area of ​​the first row of LED beads 1 in the first column is bonded to the signal input bonding area of ​​the second row of LED beads 1 in the first column via signal jumpers 6. The signal output bonding area of ​​the second row of LED beads 1 in the first column is bonded to the signal input bonding area of ​​the third row of LED beads 1 in the first column via signal jumpers 6. And so on, until the signal output bonding area of ​​the second to last row of LED beads 1 in the first column is bonded to the signal input bonding area of ​​the last row of LED beads 1 in the first column via signal jumpers 6. Thus, the LED bead 1 is connected to the signal pad 34 or the LED beads 1 before and after it via the signal line (specifically the signal jumper 6 in this application) to achieve the series connection of the LED beads 1 and form a set of LED beads; so that the signal controlling the on and off of each LED bead 1 can be input from the signal pad 34 through the signal jumper 6 and then transmitted sequentially through each series-connected LED bead 1.

[0071] In this configuration, the inputs and outputs of the first signal binding area 123 and the second signal binding area 124 are opposite. For example, if the first signal binding area 123 is a signal input binding area, then the second signal binding area 124 is a signal output binding area. Conversely, if the first signal binding area 123 is a signal output binding area, then the second signal binding area 124 is a signal input binding area. Preferably, the first signal binding area 123 and the second signal binding area 124 can be switched between each other. In this configuration, if one of the first signal binding area 123 and the second signal binding area 124 serves as a signal input binding area, then the other serves as a signal output binding area.

[0072] As an example, each LED string has two signal pads 34. In the LED string, the signal input binding area of ​​the first LED bead 1 is bound to the first signal pad 34 through the signal jumper 6. The signal input binding areas of the remaining LED beads 1 are bound to the signal output binding area of ​​the previous LED bead 1 through the signal jumper 6. The signal output binding area of ​​the last LED bead 1 is bound to the second signal pad 34 through the signal jumper 6.

[0073] In this example, under normal circumstances, in each LED string, the first signal pad 34 is the signal input pad, and the second signal pad 34 is the spare pad. The first signal pad 34 transmits signals from the first LED 1 to the last LED 1 through the signal jumper 6 to control the on / off state of each LED 1. When the first signal pad 34 malfunctions and cannot transmit signals, the second pad is activated to transmit signals to the LED 1. At this time, the signal input binding area of ​​each LED 1 becomes the signal output binding area, and the signal output binding area of ​​each LED 1 becomes the signal input binding area. The second signal pad 34 transmits signals from the last LED 1 to the first LED 1 through the signal jumper 6 to control the on / off state of each LED 1. Furthermore, in existing transparent LED displays using a single signal pad 34, when the Nth LED in the LED string fails, the signal connection between the LEDs is serial, preventing signal transmission to the LEDs following the Nth LED and thus failing to control the on / off state of the Nth to the last LED. This example, however, uses two signal pads 34. When the signal transmitted from the first signal pad 34 is interrupted due to the failure of the Nth LED, the second signal pad 34 is simultaneously activated. At this time, the signal output from the first signal pad 34 is transmitted from the first LED to the (N-1)th LED, controlling the on / off state of the first to the (N-1)th LEDs; the signal output from the second signal pad 34 is transmitted from the last LED to the Nth LED, controlling the on / off state of the last to the Nth LED. This example uses two signal pads 34, providing a backup plan for signal transmission to each LED, ensuring signal transmission to every LED and guaranteeing the display effect of the transparent LED display.

[0074] As an example, such as Figure 6 As shown, two signal pads 34 are arranged in the same row. Every two columns of LED beads 1 are connected in series through signal jumpers 6 to form a set of LED beads. Taking the first column and the second column of LED beads 1 as an example, the second signal binding area 124 of the first row of LED beads 1 in the first column is bound to the first signal pad 34 through signal jumpers 6. The second signal binding area 124 of the first row of LED beads 1 in the second column is bound to the second signal pad 34 through signal jumpers 6. In the first column and the second column, except for the first row, the second signal binding area 124 of each row of LED beads 1 is bound to the first signal binding area 123 of the previous row of LED beads 1 through signal jumpers 6. The first signal binding area 123 of the last row of the first column is bound to the first signal binding area 123 of the last row of LED beads 1 in the second column through signal jumpers 6.

[0075] In this example, when the first signal pad 34 is used to output a signal, the second signal bonding area 124 of the first column of LED beads 1 is the signal input bonding area, the first signal bonding area 123 of the first column of LED beads 1 is the signal output bonding area, the second signal bonding area 124 of the second column of LED beads 1 is the signal output bonding area, and the first signal bonding area 123 of the second column of LED beads 1 is the signal input bonding area; when the second signal pad 34 is used to output a signal, the second signal bonding area 124 of the first column of LED beads 1 is the signal output bonding area, the first signal bonding area 123 of the first column of LED beads 1 is the signal input bonding area, the second signal bonding area 124 of the second column of LED beads 1 is the signal input bonding area, and the first signal bonding area 123 of the second column of LED beads 1 is the signal output bonding area.

[0076] Example 2: The LED bead 1 provided in this embodiment, such as Figures 9-13 As shown, one end of the first power binding area 121 extends to the first side 111 to form a first connection portion 1212, and the other end extends to the second side 112 to form a second connection portion 1213; one end of the second power binding area 122 extends to the first side 111 to form a third connection portion 1222, and the other end extends to the second side 112 to form a fourth connection portion 1223.

[0077] The first circuit layer 12 also includes a first signal short-circuit binding area 128 and a second signal short-circuit binding area 126 that are isolated from each other; the first signal short-circuit binding area 128 is located at the third corner, and the second signal short-circuit binding area 126 is located at the fourth corner, and the first signal short-circuit binding area 128 and the second signal short-circuit binding area 126 are short-circuited together; the first signal short-circuit binding area 128 is at least partially exposed outside the lamp cover 16, and the second signal short-circuit binding area 126 is at least partially exposed outside the lamp cover 16; the first power binding area 121 and the second power binding area 122 are spaced apart and located in the area formed between the first corner, the second corner, the third corner and the fourth corner.

[0078] As an example, such as Figure 9 , Figure 14 , Figure 15 and Figure 17 As shown, the LED lamp bead 1 of this embodiment is applied to a transparent LED display screen. The transparent LED display screen includes a transparent substrate 2 and a plurality of LED lamp beads 1. The plurality of LED lamp beads 1 are arrayed on the transparent substrate 2, and the back of the insulating support base 11 faces the transparent substrate 2. A circuit pattern 3 is arranged on the transparent substrate 2. The circuit pattern 3 includes a first power pad 31 and a second power pad 32 with opposite polarities.

[0079] Specifically, such as Figure 12 , Figure 15 and Figure 16 As shown, in the transparent LED display screen, the first power bonding area 121 of two adjacent LED beads 1 is connected by a first power jumper 4, and the first power bonding area 121 of at least one LED bead 1 is connected to the first power pad 31 by the first power jumper 4. That is, the first power bonding area 121 of the LED bead 1 closest to the first power pad 31 is bonded to the first power pad 31 in the first direction at one end via the first power jumper 4; the first power bonding area 121 of the LED bead 1 closest to the first power pad 31 in the first direction is bonded to the first power pad 31 at one end via the first power jumper 4. Each of the other LED beads 1 has its first power binding area 121 at one end in the first direction connected to the end of the first power binding area 121 of the adjacent LED bead 1 in the first direction near the LED bead 1 via a first power jumper 4; and its other end in the first direction is connected to the end of the first power binding area 121 of another adjacent LED bead 1 in the first direction near the LED bead 1 via a first power jumper 4. Each LED bead 1 has a first power bonding area 121 that is bonded to the first power pad 31 or the first power bonding area 121 of an adjacent LED bead 1 via a first power jumper 4. The first power bonding area 121 is arranged through the first side 111 and the second side 112, i.e., the first power bonding area 121 is arranged through the first direction. This allows the most appropriate position to be selected in the first power bonding area 121 to bond and connect with the first power pad 31 or the first power bonding area 121 of an adjacent LED bead 1. This makes the connection path of the first power jumper 4 shorter, the connection lines between each LED bead 1 clearer, improves the resolution and transparency of the transparent LED display, and facilitates the production of the transparent LED display.

[0080] The second power bonding area 122 of two adjacent LED beads 1 is connected by a second power jumper 5, and the second power bonding area 122 of at least one LED bead 1 is connected to the second power pad 32 by the second power jumper 5. That is, the end of the second power bonding area 122 of the LED bead 1 closest to the second electrode of the second power pad 32 in the first direction is bonded to the second power pad 32 by the second power jumper 5; the end of the second power bonding area 122 of the LED bead 1 closest to the second power pad 32 in the first direction is bonded to the end of the second power bonding area 122 of the adjacent LED bead 1 in the first direction, which is closer to that LED bead 1 by the second power jumper 5. Each of the other LED beads 1 has its second power binding area 122 at one end in the first direction connected to the end of the second power binding area 122 of the adjacent LED bead 1 in the first direction near the LED bead 1 via a second power jumper 5; and its second power binding area 122 at the other end in the first direction connected to the end of the second power binding area 122 of another adjacent LED bead 1 in the first direction near the LED bead 1 via a second power jumper 5. Each LED bead 1 has a second power bonding area 122 that is bonded to the second power pad 32 or the second power bonding area 122 of an adjacent LED bead 1 via a second power jumper 5. The second power bonding area 122 is arranged through the first side 111 and the second side 112 in a spaced-out direction, i.e., the second power bonding area 122 is arranged through the first direction. This allows for the selection of the most appropriate position in the second power bonding area 122 to bond with the second power pad 32 or the second power bonding area 122 of an adjacent LED bead 1. This makes the connection path of the second power jumper 5 shorter, the connection lines between each LED bead 1 clearer, improves the resolution and transparency of the transparent LED display screen, and facilitates the production of the transparent LED display screen.

[0081] As an example, such as Figure 12 As shown, the first signal bonding area 123, the driver chip 14, and the second signal bonding area 124 are connected to form a signal transmission path on the LED bead 1, so that the signal in the signal transmission path passes through the driver chip 14, and the driver chip 14 controls the light-emitting chip 15 to work according to the signal; the first signal short-circuit bonding area 128 and the second signal short-circuit bonding area 126 are short-circuited to form a signal short-circuit path on the LED bead 1, so that the signal in the signal short-circuit path is directly transmitted to the subsequent LED bead 1 without passing through the driver chip 14 of the LED bead 1.

[0082] Specifically, such as Figure 12 , Figure 15 and Figure 16As shown, in the transparent LED display screen, in the first signal binding area 123 and the second signal binding area 124, one is a signal input binding area and the other is a signal output binding area; in the first signal short-circuit binding area 128 and the second signal short-circuit binding area 126, one is a short-circuit input binding area and the other is a short-circuit output binding area; in three adjacent LED beads 1, the signal input binding area of ​​the middle LED bead 1 is connected to the short-circuit output binding area of ​​the preceding LED bead 1 through a signal jumper 6, the signal output binding area of ​​the middle LED bead 1 is connected to the short-circuit input binding area of ​​the following LED bead 1 through a signal jumper 6, the short-circuit input binding area of ​​the middle LED bead 1 is connected to the signal output binding area of ​​the preceding LED bead 1 through a signal jumper 6, and the short-circuit output binding area of ​​the middle LED bead 1 is connected to the signal input binding area of ​​the following LED bead 1 through a signal jumper 6. This design divides the LED beads 1 in the transparent LED display into two parts, with each part controlled by a separate control signal. This solves the problem of excessive LED beads 1 connected in series, which leads to a decrease in display quality due to signal attenuation during signal transmission. This design helps to improve the display effect of the transparent LED display.

[0083] In the LED bead 1 provided in this embodiment of the invention, the two ends of the first power binding area 121 extend to the first side 111 and the second side 112, respectively, and the two ends of the second power binding area 122 extend to the first side 111 and the second side 112, respectively. That is, the first power binding area 121 and the second power binding area 122 are both disposed through the first direction, increasing the area of ​​the first and second power binding areas 121 and 122. This allows for the selection of the closest position on the first and second power binding areas 121 and 122 to the external power source for binding and connection, making the connection path between the LED bead 1 and the external power source shorter, simplifying the connection lines on the LED bead 1, making the connection lines on the LED bead 1 clearer and more concise, and making the connection of the LED bead 1 simpler and more convenient. This design improves the production and manufacturing of transparent LED displays, reducing costs. Simultaneously, the LED beads 1 are equipped with signal transmission paths and signal short-circuit paths, allowing two adjacent LED beads 1 on the transparent LED display to be controlled by two separate signals, ensuring the display effect of each LED bead 1. Furthermore, the first signal binding area 123, the second signal binding area 124, the first signal short-circuit binding area 128, and the second signal short-circuit binding area 126 are respectively located in the four corner areas on the front of the insulating support base 11. In other words, the signal jumpers 6 are bound and connected in the four corner areas on the front of the insulating support base 11, maximizing the distance between each signal jumper 6 and preventing short circuits. This improves the resolution and transparency of the transparent LED display and also ensures that the binding connection positions of each binding area are located on the outer surface of the LED beads 1, facilitating connection.

[0084] In one embodiment, such as Figure 12 and Figure 13 As shown, the LED bead 1 also includes a third circuit layer 17; the third circuit layer 17 is disposed on the back of the insulating support 11, including a signal short-circuit connection area 171; the signal short-circuit connection area 171 connects the first signal short-circuit bonding area 128 and the second signal short-circuit bonding area 126, so that the first signal short-circuit bonding area 128 and the second signal short-circuit bonding area 126 are short-circuited. In this example, by setting the signal short-circuit connection area 171 on the back of the insulating support 11, the first signal short-circuit bonding area 128 and the second signal short-circuit bonding area 126 are short-circuited; this solves the problem that the first signal short-circuit bonding area 128 and the second signal short-circuit bonding area 126 need to be electrically connected by a long bonding wire due to the obstruction of the lamp cover 16, reduces the number of bonding wires on the LED bead 1, reduces the crossing between bonding wires, facilitates the rational planning of the connection lines on the LED bead 1, simplifies the connection lines on the LED bead 1, improves the resolution and transparency of the transparent LED display screen, and facilitates the production of the transparent LED display screen.

[0085] Preferably, the signal shorting connection area 171 is connected to the first signal shorting bonding area 128 via a via; the signal shorting connection area 171 is connected to the second signal shorting bonding area 126 via a via; the via connection is used to realize the electrical connection, which is simple in structure, reduces the number of bonding wires on the LED bead 1, and simplifies the connection lines on the LED bead 1.

[0086] As an example, all the LED beads 1 in the transparent LED display screen are arranged in a square array. The transparent LED display screen includes multiple rows of LED beads 1 and multiple columns of LED beads 1; the LED beads 1 in the same column (or the same row) are connected in series via signal jumpers 6. This design allows the signal jumpers 6 of the LED beads 1 in the same column (or the same row) to be arranged along the arrangement direction of the LED beads 1 in that column (or row), making the signal connection lines between each LED bead 1 clearer and avoiding overlapping of the signal jumpers 6. This facilitates the rational planning of the connection lines on the LED beads 1, simplifies the connection of the LED beads 1, facilitates the connection of the LED beads 1, facilitates the production of the transparent LED display screen, and improves the resolution and transparency of the transparent LED display screen.

[0087] As an example, such as Figure 12 and Figure 16As shown, the first power bonding area 121 includes a third main body 1214, a first connecting portion 1212 extending from the third main body 1214 to the first side 111, a second connecting portion 1213 extending from the third main body 1214 to the second side 112, and a fifth connecting portion 1215 extending from the third main body 1214 to the third side 113. In other words, the first connecting portion 1212 and the second connecting portion 1213 of the first power bonding area 121 extend along the first direction, and the fifth connecting portion 1215 extends along the second direction; the second connecting portion 1213 is used to bond and connect with the first power pad 31 or the first connecting portion 1212 of the first power bonding area 121 of the adjacent LED bead 1, and the first connecting portion 1212 is used to bond and connect with the second connecting portion 1213 of the first power bonding area 121 of the adjacent LED bead 1; this design maximizes the area of ​​the first power bonding area 121, allowing for the selection of appropriate positions on the first power bonding area 121 to make electrical connections with the corresponding structures, ensuring sufficient spacing between each bonding connection position, avoiding short circuits, facilitating the rational planning of the connection lines on the LED bead 1, and making the connection of the LED bead 1 easier, thereby facilitating the production of the transparent LED display screen and improving the resolution and transparency of the transparent LED display screen.

[0088] As an example, such as Figure 12 and Figure 16 As shown, the second power bonding area 122 includes a fourth main body 1224, a third connecting portion 1222 extending from the fourth main body 1224 to the first side 111, a fourth connecting portion 1223 extending from the fourth main body 1224 to the second side 112, and a sixth connecting portion 1225 extending from the fourth main body 1224 to the fourth side 114. In other words, the third connecting portion 1222 and the fourth connecting portion 1223 of the second power bonding area 122 extend along the first direction, and the sixth connecting portion 1225 extends along the second direction; the third connecting portion 1222 is used to bond and connect with the second power pad 32 or the fourth connecting portion 1223 of the second power bonding area 122 of the adjacent LED bead 1, and the fourth connecting portion 1223 is used to bond and connect with the third connecting portion 1222 of the second power bonding area 122 of the adjacent LED bead 1; this design maximizes the area of ​​the second power bonding area 122, allowing for the selection of appropriate positions on the second power bonding area 122 to make electrical connections with the corresponding structures, ensuring sufficient spacing between each bonding connection position, avoiding short circuits, facilitating the rational planning of the connection lines on the LED bead 1, and making the connection of the LED bead 1 easier, thereby facilitating the production of the transparent LED display screen and improving the resolution and transparency of the transparent LED display screen.

[0089] As an example, such as Figure 12As shown, the first power bonding area 121 is located near the first signal bonding area 123; the second power bonding area 122 is located near the second signal bonding area 124; and the driver chip 14 is disposed on the first power bonding area 121. In this example, the driver chip 14 is disposed on the third main body 1214 of the first power bonding area 121, and the first power bonding area 121 has sufficient space to facilitate the installation of the driver chip 14.

[0090] As an example, the light-emitting chip 15 is disposed on the second power bonding region 122, and the light-emitting chip 15 is disposed on the fourth main body portion 1224 of the second power bonding region 122; the second power bonding region 122 has sufficient space to facilitate the installation of the light-emitting chip 15. In addition, the light-emitting chip 15 can also be mounted on the driver chip 14.

[0091] As an example, such as Figures 11-13 As shown, the first circuit layer 12 also includes a third signal connection area 127, which is located near the driver chip 14; the third circuit layer 17 also includes a fourth signal connection area 172; the driver chip 14, the third signal connection area 127, the fourth signal connection area 172, and the second signal bonding area 124 are connected in sequence. In this example, a third signal connection area 127 is provided near the driver chip 14, and the third signal connection area 127 is electrically connected to the driver chip 14. A fourth signal connection area 172 is provided on the back of the insulating support 11 for electrically connecting the third signal connection area 127 and the second signal bonding area 124. The first signal bonding area 123, the driver chip 14, the third signal connection area 127, the fourth signal connection area 172, and the second signal bonding area 124 are connected in sequence to form a signal transmission path inside the LED bead 1. This allows the driver chip 14 and the second signal bonding area 124 to be electrically connected through the third signal connection area 127 and the fourth signal connection area 172, avoiding the need to cross the second power bonding area 122 when directly connecting the driver chip 14 and the second signal bonding area 124 with a bonding wire. This minimizes the length of the bonding wire on the driver chip 14 and reduces the crossover between bonding wires, which is beneficial for the rational planning of the connection lines on the LED bead 1 and simplifies the connection lines on the LED bead 1. This facilitates the production of the transparent LED display and improves the resolution and transparency of the transparent LED display.

[0092] Preferably, the fourth signal connection area 172 is connected to the third signal connection area 127 via a via, and the fourth signal connection area 172 is connected to the second signal bonding area 124 via a via; the via connection is used to realize the electrical connection, which is simple in structure, reduces the number of bonding wires on the LED bead 1, and simplifies the connection lines on the LED bead 1.

[0093] The LED bead 1 provided in Example 1 is applied to a transparent LED display screen; for example... Figures 14-18 As shown, the transparent LED display screen includes a transparent substrate 2 and LED beads 1 as described in any of the embodiments of the aforementioned Example 2; an array of multiple LED beads 1 is arranged on the transparent substrate 2, with the back of the insulating support 11 facing the transparent substrate 2; a circuit pattern 3 is arranged on the transparent substrate 2, the circuit pattern 3 including a first power pad 31 and a second power pad 32 with opposite polarities; the first power bonding area 121 of two adjacent LED beads 1 is connected by a first power jumper 4, and the first power bonding area 121 of at least one LED bead 1 is connected to the first power pad 31 by the first power jumper 4; the second power bonding area 122 of two adjacent LED beads 1 is connected by a second power jumper 5, and the second power bonding area 122 of at least one LED bead 1 is connected to the second power pad 32 by the second power jumper 5; the first signal In signal binding area 123 and signal binding area 124, one is a signal input binding area and the other is a signal output binding area; in the first signal short-circuit binding area 128 and the second signal short-circuit binding area 126, one is a short-circuit input binding area and the other is a short-circuit output binding area; in three adjacent LED beads 1, the signal input binding area of ​​the middle LED bead 1 is connected to the short-circuit output binding area of ​​the preceding LED bead 1 through a signal jumper 6, the signal output binding area of ​​the middle LED bead 1 is connected to the short-circuit input binding area of ​​the following LED bead 1 through a signal jumper 6, the short-circuit input binding area of ​​the middle LED bead 1 is connected to the signal output binding area of ​​the preceding LED bead 1 through a signal jumper 6, and the short-circuit output binding area of ​​the middle LED bead 1 is connected to the signal input binding area of ​​the following LED bead 1 through a signal jumper 6.

[0094] As an example, such as Figure 14 As shown, multiple LED beads 1 are arrayed on a transparent substrate 2, with the back of the insulating support 11 facing the transparent substrate 2; that is, the side of the insulating support 11 away from the light-emitting chip 15 faces the transparent substrate 2, and the side of the insulating support 11 with the light-emitting chip 15 faces outward; the first power binding area 121, the second power binding area 122, the first signal binding area 123, the second signal binding area 124, the first signal short-circuit binding area 128, and the second signal short-circuit binding area 126 are arranged on the front of the insulating support 11, and the binding connection position of each binding area is located on the outer surface of the LED beads 1, which facilitates the binding connection wires on each binding area, making fault diagnosis and maintenance more intuitive and convenient, and reducing maintenance difficulty.

[0095] Preferably, the LED beads 1 are bonded to the transparent substrate 2.

[0096] In the transparent LED display screen provided in this embodiment of the invention, the first power bonding area 121 of each LED bead 1 is bonded to the first power pad 31 or the first power bonding area 121 of the adjacent LED bead 1 through the first power jumper 4. The second power bonding area 122 of each LED bead 1 is bonded to the second power pad 32 or the second power bonding area 122 of the adjacent LED bead 1 through the second power jumper 5. This allows each LED bead 1 to directly draw power from the first power pad 31 and the second power pad 32 through the first power jumper 4 and the second power jumper 5. The transfer of power does not need to go through the internal circuit of each LED bead 1, thus avoiding the failure of the internal circuit of the LED bead 1 from affecting the normal operation of other LED bead 1. The first power bonding area 121 is disposed through the first direction, and the second power bonding area 122 is disposed through the first direction. This allows for bonding connections at the positions on the first and second power bonding areas 121 and 122 closest to the corresponding power pads or adjacent LED beads 1, thus shortening the connection paths of the first power jumper 4 and the second power jumper 5. Furthermore, the LED beads 1 are provided with signal transmission paths and signal shorting paths, allowing two adjacent LED beads 1 on the transparent LED display to be controlled by two separate signals, ensuring the display effect of each LED bead 1. The first signal bonding area 123 and the second... The signal bonding area 124, the first signal short-circuit bonding area 128, and the second signal short-circuit bonding area 126 are respectively located in the four corner areas. This means that the signal jumpers 6 are bonded and connected in the four corner areas, maximizing the distance between each signal jumper 6 and avoiding short circuits. This design facilitates the rational planning of the connection lines between each LED bead 1, making the connection lines between each LED bead 1 clearer and more concise, simplifying the connection of the LED bead 1, and making the connection of the LED bead 1 simpler and more convenient. This facilitates the production of the transparent LED display screen and helps improve its transparency. Simultaneously, the back of the insulating support 11 faces the transparent substrate 2, facilitating the mounting of the LED bead 1 onto the transparent substrate 2. The first power jumper 4, the second power jumper 5, and the signal jumper 6 are all connected to the front of the LED bead 1, facilitating the bonding connection between each LED bead 1.

[0097] As an example, such as Figures 15-18As shown, circuit pattern 3 also includes power supply line 33; power supply line 33 includes first power supply line 33a and second power supply line 33b; first power supply line 33a is connected to first power pad 31, and second power supply line 33b is connected to second power pad 32; the first power bonding area 121 on each LED bead 1 is bonded to the first power supply line 33a or the first power bonding area 121 on the adjacent LED bead 1 through the first power jumper 4; the second power bonding area 122 on each LED bead 1 is bonded to the second power supply line 33b or the second power bonding area 122 on the adjacent LED bead 1 through the second power jumper 5.

[0098] In this example, the first power binding area 121 of each LED bead 1 is bound to the first power supply line 33a or the first power binding area 121 of the adjacent LED bead 1 via the first power jumper 4, and the second power binding area 122 of each LED bead 1 is bound to the second power supply line 33b or the second power binding area 122 of the adjacent LED bead 1 via the second power jumper 5, so that each LED bead 1 can directly draw power from the power supply line 33 via the first power jumper 4 and the second power jumper 5.

[0099] In this embodiment, all LED beads 1 are arranged in a square array on the transparent substrate 2. The power supply line 33 includes at least one first power supply line 33a and at least one second power supply line 33b. Several columns or rows of LED beads 1 share the power supply line 33. That is, several LED beads 1 between the first power supply line 33a and the second power supply line 33b share the first power supply line 33a and the second power supply line 33b.

[0100] The first power supply line 33a and the second power supply line 33b are distributed at intervals along the first direction. The LED beads 1 located between the first power supply line 33a and the second power supply line 33b are arranged in a square array. The LED beads 1 that are distributed in a straight line in the first direction are LED beads 1 in the same row, and the LED beads 1 that are distributed in a straight line in the second direction are LED beads 1 in the same column. The column of LED beads 1 closest to the first power supply line 33a is the first column of LED beads 1, and the column of LED beads 1 closest to the second power supply line 33b is the last column of LED beads 1. In each row of LED beads 1, the second connection portion 1213 of the first power binding area 121 of the first column of LED beads 1 is connected to the first power supply line 33a via the first power jumper 4. The first connection portion 1212 of the first power binding area 121 of the first column of LED beads 1 is connected to the second connection portion 1213 of the first power binding area 121 of the second column of LED beads 1 via the first power jumper 4. The first connection portion 1212 of the first power binding area 121 of the second column of LED beads 1 is connected to the second connection portion 1213 of the first power binding area 121 of the third column of LED beads 1 via the first power jumper 4, and so on. The first connection portion 1212 of the first power binding area 121 of the second-to-last column of LED beads 1 is connected to the second connection portion 1213 of the first power binding area 121 of the last column of LED beads 1 via the first power jumper 4. Part 1213; The third connection part 1222 of the second power binding area 122 of the first column of LED beads 1 is connected to the fourth connection part 1223 of the second power binding area 122 of the second column of LED beads 1 via the second power jumper 5. The third connection part 1222 of the second power binding area 122 of the second column of LED beads 1 is connected to the fourth connection part 1223 of the second power binding area 122 of the third column of LED beads 1 via the second power jumper 5, and so on. The third connection part 1222 of the second power binding area 122 of the second-to-last column of LED beads 1 is connected to the fourth connection part 1223 of the second power binding area 122 of the last column of LED beads 1 via the second power jumper 5. The third connection part 1222 of the second power binding area 122 of the last column of LED beads 1 is connected to the second power supply line 33b via the second power jumper 5. With this design, the first power jumper 4 and the second power jumper 5 between each LED bead 1 are both set along the first direction, which is conducive to the rational planning of the connection lines between each LED bead 1. The connection lines between each LED bead 1 are clearer and more understandable, which simplifies the connection lines on the LED bead 1. The connection of each LED bead 1 is simpler and more convenient, which helps to improve the transparency of the transparent LED display screen.

[0101] Preferably, the first power supply line 33a is connected to the first power bonding area 121 of each LED bead 1 in the same row located between the first power supply line 33a and the second power supply line 33b via a first power jumper 4. Using a single first power jumper 4 to bond the LED bead 1 in the same row eliminates the need to disconnect the first power jumper 4 in between, improving wiring efficiency and preventing interference between the first power jumpers 4 on each LED bead 1, thus facilitating processing and installation. Alternatively, multiple first power jumpers 4 can be used to bond to the first power bonding area 121 of each LED bead 1.

[0102] Preferably, the second power supply line 33b is connected to the second power bonding area 122 of each LED bead 1 in the same row between the first power supply line 33a and the second power supply line 33b via a second power jumper 5. Using a single second power jumper 5 to bond the LED bead 1 in the same row eliminates the need to disconnect the second power jumper 5 in between, improving wiring efficiency and preventing interference between the second power jumpers 5 on each LED bead 1, thus facilitating processing and installation. Alternatively, multiple second power jumpers 5 can be used to bond to the second power bonding area 122 of each LED bead 1.

[0103] As an example, such as Figures 15-18 As shown, circuit pattern 3 also includes at least two signal pads 34; the transparent LED display screen includes at least one set of LED strings, each LED string including multiple LED beads 1; each set of LED strings is provided with two signal pads 34; in each set of LED strings, the signal input binding area of ​​the first LED bead 1 is bound to one of the signal pads 34 through a signal jumper 6, and the short-circuit input binding area of ​​the first LED bead 1 is bound to another signal pad 34 through a signal jumper 6; the signal input binding areas of the remaining LED beads 1 are bound to the short-circuit output binding area of ​​the previous LED bead 1 through a signal jumper 6, and the short-circuit input binding area of ​​each LED bead 1 is bound to the signal output binding area of ​​the previous LED bead 1 through a signal jumper 6.

[0104] In this example, in each LED string, the signal input binding area of ​​the first LED 1 is bound to one of the signal pads 34 via signal jumper 6, and the short-circuit input binding area of ​​the first LED 1 is bound to another signal pad 34 via signal jumper 6; the signal output binding area of ​​the first LED 1 is bound to the short-circuit input binding area of ​​the second LED 1 via signal jumper 6; the short-circuit output binding area of ​​the first LED 1 is bound to the signal input binding area of ​​the second LED 1 via signal jumper 6; the signal output binding area of ​​the second LED 1 is bound to the short-circuit input binding area of ​​the third LED 1 via signal jumper 6; the short-circuit output binding area of ​​the second LED 1 is bound to the signal input binding area of ​​the third LED 1 via signal jumper 6; and so on, with the signal output binding area of ​​the second-to-last LED 1 bound to the short-circuit input binding area of ​​the last LED 1 via signal jumper 6; the short-circuit output binding area of ​​the second-to-last LED 1 is bound to the signal input binding area of ​​the last LED 1 via signal jumper 6. In this way, a set of LED strings can be transformed into two sets of LED strings controlled by two separate signals. The odd-numbered LEDs 1 in the LED string transmit signals from the first signal pad 34; the even-numbered LEDs 1 in the LED string transmit signals from the second signal pad 34; and vice versa. Due to this special bonding connection method, the two signals from the two signal pads 34 are always transmitted within adjacent LEDs 1 or short-circuited, bypassing the interior of those LEDs 1.

[0105] Further description is as follows: Let the signal input to the first signal pad 34 be the first control signal, and the signal input to the second signal pad 34 be the second control signal; then... Figure 18As shown, each column of LED beads 1 is connected in series via signal jumpers 6 to form an LED string. Taking the first column of LED beads 1 as an example, the first signal pad 34 is bonded to the signal input bonding area of ​​the first row of LED beads 1 in the first column, and the signal output bonding area of ​​the first row of LED beads 1 in the first column is bonded to the short-circuit input bonding area of ​​the second row of LED beads 1 in the first column. This allows the first control signal transmitted in the first signal pad 34 to pass through the first row of LED beads 1 in the first column, controlling the on / off state of the first row of LED beads 1, and then transmitted to the short-circuit input bonding area of ​​the second row of LED beads 1 in the first column. The second signal pad 34 is bonded to the short-circuit input bonding area of ​​the first row of LED beads 1 in the first column, and the short-circuit output bonding area of ​​the first row of LED beads 1 in the first column is bonded to the signal input bonding area of ​​the second row of LED beads 1 in the first column. This allows the second control signal transmitted in the second signal pad 34 to be short-circuited in the first row of LED beads 1 in the first column, and then transmitted to the signal input bonding area of ​​the second row of LED beads 1 in the first column, without passing through the interior of the first row of LED beads 1. Similarly, the first control signal is input from the signal input binding area of ​​the LED 1 in the second row of the first column, controlling the on / off state of the LED 1 in the second row of the first column, and output from the signal output binding area to the short-circuit input binding area of ​​the LED 1 in the third row of the first column. The second control signal is short-circuited in the LED 1 in the second row of the first column and does not pass through its interior. This process continues, with the first control signal passing through the LED 1 in odd-numbered rows, controlling the on / off state of the LED 1 in those rows, and being short-circuited and transmitted in the LED 1 in even-numbered rows. The second control signal passes through the LED 1 in even-numbered rows, controlling the on / off state of the LED 1 in those rows, and being short-circuited and transmitted in the LED 1 in odd-numbered rows. Of course, the reverse is also possible.

[0106] This method increases the number of LED beads 1 connected in series in each LED string. The number of LED beads 1 in this LED string is twice that of a conventional LED string.

[0107] In this configuration, the inputs and outputs of the first signal binding area 123 and the second signal binding area 124 are opposite. For example, if the first signal binding area 123 is a signal input binding area, then the second signal binding area 124 is a signal output binding area. Conversely, if the first signal binding area 123 is a signal output binding area, then the second signal binding area 124 is a signal input binding area. Preferably, the first signal binding area 123 and the second signal binding area 124 can be switched between each other. In the first signal binding area 123 and the second signal binding area 124, if one is used as a signal input binding area, then the other is used as a signal output binding area. The definition of the signal input binding area and the signal output binding area on each LED bead 1 is based on the signal transmission direction; in the first signal binding area 123 and the second signal binding area 124, the binding area for signal input is the signal input binding area, and the binding area for signal output is the signal output binding area.

[0108] The inputs and outputs of the first signal short-circuit binding area 128 and the second signal short-circuit binding area 126 are opposite. For example, if the first signal short-circuit binding area 128 is a short-circuit input binding area, then the second signal short-circuit binding area 126 is a short-circuit output binding area. Conversely, if the first signal short-circuit binding area 128 is a short-circuit output binding area, then the second signal short-circuit binding area 126 is a short-circuit input binding area. Preferably, the first signal short-circuit binding area 128 and the second signal short-circuit binding area 126 can be switched. If one of the first signal short-circuit binding area 128 and the second signal short-circuit binding area 126 is used as a short-circuit input binding area, then the other is used as a short-circuit output binding area. The definition of the short-circuit input binding area and the short-circuit output binding area on each LED bead 1 is based on the signal transmission direction. In the first signal short-circuit binding area 128 and the second signal short-circuit binding area 126, the binding area for signal input is the short-circuit input binding area, and the binding area for signal output is the short-circuit output binding area.

[0109] As an example, such as Figure 15 and Figure 16 As shown, circuit pattern 3 also includes a connection pad 35, with each group of LED strings corresponding to a connection pad 35; in each group of LED strings, the signal output binding area of ​​the last LED bead 1 is bound to the connection pad 35 through a signal jumper 6, and the short-circuit output binding area of ​​the last LED bead 1 is bound to the connection pad 35 through a signal jumper 6.

[0110] In this example, taking the first column of LED beads 1 as an example, the signal output binding area of ​​the last row of LED beads 1 is bound to the connection pad 35 through the signal jumper 6, and the short-circuit output binding area of ​​the last row of LED beads 1 is bound to the connection pad 35 through the signal jumper 6. That is to say, the signal output binding area of ​​the last row of LED beads 1 and its own short-circuit output binding area are connected through the connection pad 35. This design forms a signal transmission closed loop in the LED string. The first signal pad 34 is the signal input pad of the odd-numbered row of LED beads 1, transmitting the first control signal to the odd-numbered row of LED beads 1. The second signal pad 34 is the spare pad of the odd-numbered row of LED beads 1. The second signal pad 34 is the signal input pad of the even-numbered row of LED beads 1, transmitting the second control signal to the even-numbered row of LED beads 1. The first signal pad 34 is the spare pad of the odd-numbered row of LED beads 1. Under normal circumstances, the first signal pad 34 controls the on / off state of the odd-numbered row LED beads 1; the second signal pad 34 controls the on / off state of the even-numbered row LED beads 1. When the first signal pad 34 malfunctions, the second signal pad 34 simultaneously controls the on / off state of both the odd-numbered and even-numbered row LED beads 1. When the second signal pad 34 malfunctions, the first signal pad 34 simultaneously controls the on / off state of both the odd-numbered and even-numbered row LED beads 1. When the Nth row of LED beads 1 malfunctions, since the signal connection between each LED bead 1 is series, if N is odd, the first control signal cannot be transmitted to the odd-numbered row LED beads 1 after the Nth row. Pad 34 cannot control the on / off state of LED beads 1 in row N and all subsequent odd-numbered rows, but the second control signal can be transmitted to LED beads 1 in row N and all subsequent odd-numbered rows. Therefore, the on / off state of LED beads 1 in row N and all subsequent odd-numbered rows is controlled by the second signal pad 34. If N is an even number, the second control signal cannot be transmitted to LED beads 1 in rows N and all subsequent even-numbered rows, and the second signal pad 34 cannot control the on / off state of LED beads 1 in row N and all subsequent even-numbered rows. However, the first control signal can be transmitted to LED beads 1 in row N and all subsequent even-numbered rows. Therefore, the on / off state of LED beads 1 in row N and all subsequent even-numbered rows is controlled by the first signal pad 34. This design provides a backup scheme for the signal transmission of each LED bead 1, ensuring signal transmission to every LED bead 1 and guaranteeing the display effect of the transparent LED display screen.

[0111] As an example, such as Figure 17 and Figure 18As shown, circuit pattern 3 also includes at least one connection pad 35; each connection pad 35 is provided with two sets of LED strings; the short-circuit output binding area of ​​the last LED bead 1 in the first set of LED strings is bound to the connection pad 35 through a signal jumper 6, the signal output binding area of ​​the last LED bead 1 in the second set of LED strings is bound to the connection pad 35 through a signal jumper 6; the signal output binding area of ​​the last LED bead 1 in the first set of LED strings is bound to the short-circuit output binding area of ​​the last LED bead 1 in the second set of LED strings through a signal jumper 6.

[0112] In this example, every two sets of LED strings are connected via a connection pad 35 and a signal jumper 6, forming two signal transmission loops. Each column of LED beads 1 constitutes one LED string. Taking the first and second columns of LED beads 1 as examples, the short-circuit output binding area of ​​the last row of LED beads 1 in the first column is connected to the connection pad 35 via the signal jumper 6, and the signal output binding area of ​​the last row of LED beads 1 in the second column is also connected to the connection pad 35 via the signal jumper 6. In other words, the short-circuit output binding area of ​​the last row of LED beads 1 in the first column and the signal output binding area of ​​the last row of LED beads 1 in the second column are connected via the connection pad 35, thus forming the first signal transmission loop in the two columns of LED beads 1; the signal output binding area of ​​the last row of LED beads 1 in the first column is connected to the short-circuit output binding area of ​​the last row of LED beads 1 in the second column via the signal jumper 6, thus forming the second signal transmission loop in the two columns of LED beads 1. In other words, this design forms a signal transmission closed loop between the odd-numbered rows of LED beads 1 in the first column and the even-numbered rows of LED beads 1 in the second column; and a signal transmission closed loop between the even-numbered rows of LED beads 1 in the first column and the odd-numbered rows of LED beads 1 in the second column. This example sets up a backup scheme for the signal transmission of each LED bead 1 to ensure that the signal is transmitted to every LED bead 1, thus guaranteeing the display effect of the transparent LED display screen.

[0113] Example 3: The LED bead 1 provided in this embodiment, such as Figures 19-24As shown, one end of the first power binding area 121 extends to the first side 111 to form a first connection portion 1212, and the other end extends to the second side 112 to form a second connection portion 1213; one end of the second power binding area 122 extends to the first side 111 to form a third connection portion 1222, and the other end extends to the second side 112 to form a fourth connection portion 1223. The first circuit layer 12 also includes a third signal binding area 129 and a fourth signal binding area 1210; the third signal binding area 129 is at least partially exposed outside the lampshade 16, and the fourth signal binding area 1210 is at least partially exposed outside the lampshade 16; the first signal binding area 123 is located at the first corner, the second signal binding area 124 is located at the fourth corner, the third signal binding area 129 is located at the third corner, and the fourth signal binding area 1210 is located at the second corner; the first signal binding area 123 and the second signal binding area 124 are connected through the driver chip 14 to form a first signal path, and the third signal binding area 129 and the fourth signal binding area 1210 are connected through the driver chip 14 to form a second signal path; the first signal path and the second signal path can be used selectively.

[0114] In this example, the first signal binding area 123, the driver chip 14, and the second signal binding area 124 are sequentially connected to form a first signal path, and the third signal binding area 129, the driver chip 14, and the fourth signal binding area 1210 are sequentially connected to form a second signal path, thus providing two signal paths within the LED bead 1. One of the first and second signal paths is used selectively; that is, one is the main signal path, and the other is a backup signal path. Under normal circumstances, the main signal path transmits signals, and the driver chip 14 uses this signal to control the light-emitting chip 15. When the main signal path fails, the backup signal path is activated, and signals are transmitted through the backup signal path, and the driver chip 14 uses this signal to control the light-emitting chip 15.

[0115] The LED bead 1 provided in this embodiment of the invention is provided with a first signal path and a second signal path, thereby adding a backup signal path for the signal transmission of the LED bead 1, ensuring that the signal is smoothly transmitted to the LED bead 1, and ensuring that the LED bead 1 works normally.

[0116] As an example, such as Figures 20 to 22As shown, the driver chip 14 is positioned close to the first signal bonding area 123; the first circuit layer 12 also includes a fifth signal connection area 1220 and a sixth signal connection area 1230; the fifth signal connection area 1220 and the sixth signal connection area 1230 are positioned close to the driver chip 14; the LED bead 1 also includes a fifth circuit layer 19, which is positioned on the back of the insulating support 11, and includes a seventh signal connection area 191 and an eighth signal connection area 192; the driver chip 14, the fifth signal connection area 1220, the seventh signal connection area 191, and the second signal bonding area 124 are connected in sequence; the driver chip 14, the sixth signal connection area 1230, the eighth signal connection area 192, and the fourth signal bonding area 1210 are connected in sequence.

[0117] In this example, a fifth signal connection area 1220 is provided near the driver chip 14, and the fifth signal connection area 1220 is electrically connected to the driver chip 14. A seventh signal connection area 191 is provided on the back of the insulating support 11 for electrically connecting the fifth signal connection area 1220 and the second signal bonding area 124. The first signal bonding area 123, the driver chip 14, the fifth signal connection area 1220, the seventh signal connection area 191, and the second signal bonding area 124 are sequentially connected to form a first signal path inside the LED bead 1. A sixth signal connection area 1230 is provided near the driver chip 14, and the sixth signal connection area 1230 is electrically connected to the driver chip 14. The back of the base 11 is provided with an eighth signal connection area 192 for electrically connecting the sixth signal connection area 1230 and the fourth signal bonding area 1210. The third signal bonding area 129, the driver chip 14, the sixth signal connection area 1230, the eighth signal connection area 192 and the fourth signal bonding area 1210 are connected in sequence to form the second signal path inside the LED bead 1. This design is conducive to the rational planning of the position of each structure inside the LED bead 1, minimizing the length of the bonding wires on the driver chip 14, reducing the crossover between bonding wires, and facilitating the rational planning of the connection lines on the LED bead 1, thereby simplifying the connection lines on the LED bead 1 and optimizing the overall structure of the LED bead 1.

[0118] The LED bead 1 provided in Example 3 is applied to a transparent LED display screen; for example... Figure 23 and Figure 24As shown, the transparent LED display screen includes a transparent substrate 2 and LED beads 1 as described in any of the embodiments of the aforementioned embodiment 3; an array of multiple LED beads 1 is arranged on the transparent substrate 2, and the back of the insulating support 11 faces the transparent substrate 2; a circuit pattern 3 is arranged on the transparent substrate 2, the circuit pattern 3 including a first power pad 31 and a second power pad 32 with opposite polarities; the first power bonding area 121 of two adjacent LED beads 1 is connected by a first power jumper 4, and the first power bonding area 121 of at least one LED bead 1 is connected to a first power supply via the first power jumper 4. The pads 31 are connected; the second power bonding area 122 of two adjacent LED beads 1 are connected through the second power jumper 5, and the second power bonding area 122 of at least one LED bead 1 is connected to the second power pad 32 through the second power jumper 5; among two adjacent LED beads 1, the first signal bonding area 123 of one LED bead 1 is connected to the second signal bonding area 124 of another LED bead 1 through the signal jumper 6, and the third signal bonding area 129 of one LED bead 1 is connected to the fourth signal bonding area 1210 of another LED bead 1 through the signal jumper 6.

[0119] In the transparent LED display screen provided in this embodiment of the invention, the first power bonding area 121 of each LED bead 1 is bonded to the first power pad 31 or the first power bonding area 121 of an adjacent LED bead 1 via a first power jumper 4. The second power bonding area 122 of each LED bead 1 is bonded to the second power pad 32 or the second power bonding area 122 of an adjacent LED bead 1 via a second power jumper 5. This allows each LED bead 1 to directly draw power from the first power pad 31 and the second power pad 32 via the first power jumper 4 and the second power jumper 5. The power transfer does not need to go through the internal circuit of each LED bead 1, avoiding the impact on the normal operation of other LED bead 1 when the internal circuit of an LED bead 1 fails. Furthermore, the first power bonding area 121 and the second power bonding area 122 are both arranged through the first direction, allowing the bonding connection to be made at the position on the first power bonding area 121 and the second power bonding area 122 closest to the corresponding power pad or the adjacent LED bead 1. This ensures the connection of the first power jumper 4 and the second power jumper 5. The path is shorter, simplifying the connection lines on the LED beads 1, making the connection lines between each LED bead 1 clearer and more understandable. The overall structure of the LED beads 1 is optimized, and the connection of the LED beads 1 is simpler and more convenient, which facilitates the production of transparent LED displays and also helps to improve the transparency of transparent LED displays. At the same time, in two adjacent LED beads 1, the first signal binding area 123 of one LED bead 1 is connected to the second signal binding area 124 of another LED bead 1 through a signal jumper 6, and the third signal binding area 129 of one LED bead 1 is connected to the fourth signal binding area 1210 of another LED bead 1 through a signal jumper 6. The first signal binding area 123 and the second signal binding area 124 are located on the first side 111, and the third signal binding area 129 and the fourth signal binding area 1210 are located on the second side 112. This makes the signal jumpers 6 of the first signal path and the signal jumpers 6 of the second signal path between adjacent LED beads 1 parallel, which is conducive to the rational arrangement of the signal jumpers 6 on the transparent LED display and avoids short circuit problems.

[0120] Example 4: The LED bead 1 provided in this embodiment, such as Figures 25-30As shown, the LED bead 1 also includes a fourth circuit layer 18; the fourth circuit layer 18 is disposed on the back of the insulating support 11, including a first power connection area 181 and a second power connection area 182; a first connection portion 1212 and a second connection portion 1213 are spaced apart, the first power connection area 181 connects the first connection portion 1212 and the second connection portion 1213, and a first signal binding area 123 is disposed between the first connection portion 1212 and the second connection portion 1213; a third connection portion 1222 and a fourth connection portion 1223 are spaced apart, the second power connection area 182 connects the third connection portion 1222 and the fourth connection portion 1223, and a second signal binding area 124 is disposed between the third connection portion 1222 and the fourth connection portion 1223.

[0121] In the LED bead 1 provided in the embodiments of the present invention, a first power connection area 181 for electrically connecting the first connection part 1212 and the second connection part 1213, and a second power connection area 182 for electrically connecting the third connection part 1222 and the fourth connection part 1223 are provided on the back side of the insulating support base 11. This facilitates the rational planning of the power connection structure on the LED bead 1, ensuring that the connection lines between the LED bead 1 and the external power supply are short, while avoiding increasing the number of internal bonding wires of the LED bead 1, thus simplifying the connection lines on the LED bead 11.

[0122] As an example, such as Figure 26 and Figure 27 As shown, the first connecting part 1212 is located at the first corner, the second connecting part 1213 is located at the third corner, the third connecting part 1222 is located at the second corner, and the fourth connecting part 1223 is located at the fourth corner. This design facilitates the rational planning of the positions of each structure on the LED bead 1. When the LED bead 1 is used in a transparent LED display screen, the power connection lines and signal connection lines between each LED bead 1 are simpler and clearer, which facilitates the production of the transparent LED display screen and also improves the resolution and transparency of the transparent LED display screen.

[0123] As an example, such as Figure 26 and Figure 27 As shown, the first circuit layer 12 also includes a fifth signal binding area 1240 and a sixth signal binding area 1250; the first signal binding area 123 and the second signal binding area 124 are connected through the driver chip 14 to form a first signal path, and the fifth signal binding area 1240 and the sixth signal binding area 1250 are connected through the driver chip 14 to form a third signal path; the first signal path and the third signal path can be used selectively.

[0124] In this example, the first signal binding area 123, the driver chip 14, and the second signal binding area 124 are sequentially connected to form a first signal path, and the fifth signal binding area 1240, the driver chip 14, and the sixth signal binding area 1250 are sequentially connected to form a third signal path, thus providing two signal paths within the LED bead 1. The first and third signal paths are used selectively; one is the main signal path, and the other is a backup signal path. Under normal circumstances, the main signal path transmits signals, and the driver chip 14 uses this signal to control the light-emitting chip 15. When the main signal path fails, the backup signal path is activated, and signals are transmitted through the backup signal path, and the driver chip 14 uses this signal to control the light-emitting chip 15.

[0125] The LED bead 1 provided in Example 4 is applied to a transparent LED display screen; for example... Figure 29 and Figure 30 As shown, the transparent LED display screen includes a transparent substrate 2 and LED beads 1 as described in any of the embodiments of the aforementioned embodiment 4; an array of multiple LED beads 1 is arranged on the transparent substrate 2, and the back of the insulating support 11 faces the transparent substrate 2; a circuit pattern 3 is arranged on the transparent substrate 2, the circuit pattern 3 including a first power pad 31 and a second power pad 32 with opposite polarities; the first power bonding area 121 of two adjacent LED beads 1 is connected by a first power jumper 4, and the first power bonding area 121 of at least one LED bead 1 is connected to the first power pad 32 by the first power jumper 4. The second power bonding area 122 of two adjacent LED beads 1 is connected through the second power jumper 5, and the second power bonding area 122 of at least one LED bead 1 is connected to the second power pad 32 through the second power jumper 5; among two adjacent LED beads 1, the first signal bonding area 123 of one LED bead 1 is connected to the second signal bonding area 124 of another LED bead 1 through the signal jumper 6, and the fifth signal bonding area 1240 of one LED bead 1 is connected to the sixth signal bonding area 1250 of another LED bead 1 through the signal jumper 6.

[0126] The first power jumper 4, the second power jumper 5, and the signal jumper 6 mentioned in this invention are bonding wires or bonding wires as understood by those skilled in the art; they are simply named here to distinguish the components. Using the first power jumper 4, the second power jumper 5, and the signal jumper 6 can effectively improve the transparency of the transparent LED display screen. The aforementioned first power jumper 4, second power jumper 5, and signal jumper 6 preferably have a diameter of 15μm-70μm and are made of gold, copper, or alloy wire. Due to their very small diameter, they are almost invisible to the naked eye. Therefore, while ensuring the operating current of the connected LED beads 1 is met, it reduces obstruction of the view and improves the product's transparency.

[0127] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An LED lamp bead, characterized in that, Includes an insulating support base, a first circuit layer, a driver chip, a light-emitting chip, and a lampshade; The insulating support includes a first side and a second side disposed opposite to each other, the first side and the second side being spaced apart along a first direction; The first circuit layer is disposed on the front side of the insulating support base and includes a first power bonding area, a second power bonding area, a first signal bonding area, and a second signal bonding area that are isolated from each other. The first power bonding area includes a first connecting portion disposed on the first side and a second connecting portion disposed on the second side. The first connecting portion and the second connecting portion are electrically connected, and the first power bonding area is used to connect a first electrode of an external power source. The second power bonding area includes a third connecting portion disposed on the first side and a fourth connecting portion disposed on the second side. The third connecting portion and the fourth connecting portion are electrically connected, and the second power bonding area is used to connect a second electrode of an external power source with a polarity opposite to that of the first electrode. The driving chip and the light-emitting chip are disposed on the first circuit layer, and the driving chip is connected to the light-emitting chip, the first power bonding area, the second power bonding area, the first signal bonding area and the second signal bonding area respectively. The lampshade is located on the front of the insulating support base, and the first connecting part, the second connecting part, the third connecting part, the fourth connecting part, the first signal binding area and the second signal binding area are all at least partially exposed outside the lampshade.

2. The LED lamp bead according to claim 1, characterized in that, One end of the first power bonding area extends to the first side to form the first connection portion, and the other end of the first power bonding area extends to the second side to form the second connection portion; One end of the second power bonding area extends to the first side to form the third connection portion, and the other end of the second power bonding area extends to the second side to form the fourth connection portion.

3. The LED lamp bead according to claim 2, characterized in that, The insulating support base also includes a first corner and a second corner arranged diagonally, with the first corner located at one end of the first side and the second corner located at one end of the second side; The first signal binding area is located at the first corner, the second signal binding area is located at the second corner, and the first power binding area and the second power binding area are spaced apart within the area formed between the first corner and the second corner.

4. The LED lamp bead according to claim 3, characterized in that, The insulating support base further includes a third corner and a fourth corner arranged diagonally; the second corner and the third corner are respectively located at both ends of the second side; the first corner and the fourth corner are respectively located at both ends of the first side; One end of the first power binding area is located at the third corner, and the other end is located on the first side. One end of the second power binding area is located at the fourth corner, and the other end is located on the second side.

5. The LED lamp bead according to claim 4, characterized in that, The driver chip is disposed on the first power binding area; The first circuit layer further includes a first signal connection area, which is located close to the driver chip; The LED bead also includes a second circuit layer; the second circuit layer is disposed on the back of the insulating support and includes a second signal connection area; The driver chip, the first signal connection area, the second signal connection area, and the second signal binding area are connected in sequence.

6. The LED lamp bead according to claim 3, characterized in that, The insulating support base further includes a third corner and a fourth corner arranged diagonally; the second corner and the third corner are respectively located at both ends of the second side; the first corner and the fourth corner are respectively located at both ends of the first side; The first circuit layer further includes a first signal short-circuit bonding area and a second signal short-circuit bonding area that are isolated from each other; the first signal short-circuit bonding area is located at the third corner, and the second signal short-circuit bonding area is located at the fourth corner; the first signal short-circuit bonding area and the second signal short-circuit bonding area are short-circuited together. The first signal short-circuit binding area is at least partially exposed outside the lampshade; the second signal short-circuit binding area is at least partially exposed outside the lampshade.

7. The LED lamp bead according to claim 6, characterized in that, The LED bead also includes a third circuit layer; the third circuit layer is disposed on the back of the insulating support base and includes a signal shorting connection area; The signal short-circuit connection area connects the first signal short-circuit binding area and the second signal short-circuit binding area, thereby short-circuiting the first signal short-circuit binding area and the second signal short-circuit binding area.

8. The LED lamp bead according to claim 2, characterized in that, The insulating support base further includes a first corner, a second corner, a third corner, and a fourth corner; the first corner and the second corner are diagonally arranged, and the third corner and the fourth corner are diagonally arranged; the first corner and the fourth corner are respectively located at both ends of the first side; the second corner and the third corner are respectively located at both ends of the second side. The first circuit layer further includes a third signal binding area and a fourth signal binding area that are isolated from each other; the third signal binding area is at least partially exposed outside the lampshade, and the fourth signal binding area is at least partially exposed outside the lampshade; the first signal binding area is located at the first corner, the second signal binding area is located at the fourth corner, the third signal binding area is located at the third corner, and the fourth signal binding area is located at the second corner; the first signal binding area and the second signal binding area are connected through the driver chip to form a first signal path, and the third signal binding area and the fourth signal binding area are connected through the driver chip to form a second signal path; one of the first signal path and the second signal path can be used selectively.

9. The LED lamp bead according to claim 1, characterized in that, The LED lamp bead also includes a fourth circuit layer; the fourth circuit layer is disposed on the back of the insulating support base and includes a first power connection area and a second power connection area; The first connecting portion and the second connecting portion are spaced apart, the first power connection area connects the first connecting portion and the second connecting portion, and the first signal binding area is disposed between the first connecting portion and the second connecting portion; The third connection portion and the fourth connection portion are spaced apart, and the second power connection area connects the third connection portion and the fourth connection portion; the second signal binding area is disposed between the third connection portion and the fourth connection portion.

10. The LED lamp bead according to claim 9, characterized in that, The insulating support base includes a first corner, a second corner, a third corner, and a fourth corner; the first corner and the second corner are diagonally opposite each other, the third corner and the fourth corner are diagonally opposite each other, the first corner and the fourth corner are respectively located at both ends of the first side; the second corner and the third corner are respectively located at both ends of the second side. The first connecting part is located at the first corner, the second connecting part is located at the third corner; the third connecting part is located at the second corner, and the fourth connecting part is located at the fourth corner.

11. The LED lamp bead according to claim 10, characterized in that, The first circuit layer also includes a fifth signal binding area and a sixth signal binding area that are isolated from each other; The first signal binding area and the second signal binding area are connected through the driver chip to form a first signal path, and the fifth signal binding area and the sixth signal binding area are connected through the driver chip to form a third signal path; the first signal path and the third signal path can be used selectively.

12. A transparent LED display screen, characterized in that, The device includes a transparent substrate and LED beads as described in any one of claims 1-5 and 8-11; an array of said LED beads is arranged on said transparent substrate, and the back side of said insulating support faces said transparent substrate; The transparent substrate is provided with a circuit pattern, which includes a first power pad and a second power pad with opposite polarities. The first power bonding area of ​​two adjacent LED beads is connected by a first power jumper, and the first power bonding area of ​​at least one LED bead is connected to the first power pad by the first power jumper. The second power bonding area of ​​two adjacent LED beads is connected by a second power jumper, and the second power bonding area of ​​at least one LED bead is connected to the second power pad by the second power jumper. In two adjacent LED beads, the first signal binding area of ​​one LED bead is connected to the second signal binding area of ​​the other LED bead via a signal jumper.

13. The transparent LED display screen according to claim 12, characterized in that, Of the first signal binding area and the second signal binding area, one is a signal input binding area and the other is a signal output binding area; The circuit pattern also includes signal pads; The transparent LED display screen includes at least one set of LED light strings, and the LED light strings include multiple LED beads; the signal input binding area of ​​the first LED bead is bound to the signal pad through the signal jumper, and the signal input binding areas of the remaining LED beads are bound to the signal output binding area of ​​the previous LED bead through the signal jumper.

14. The transparent LED display screen according to claim 13, characterized in that, Each LED string has two signal pads; in the LED string, the signal input binding area of ​​the first LED is bound to the first signal pad through the signal jumper, the signal input binding areas of the remaining LEDs are bound to the signal output binding area of ​​the preceding LED through the signal jumper, and the signal output binding area of ​​the last LED is bound to the second signal pad through the signal jumper.

15. A transparent LED display screen, characterized in that, It includes a transparent substrate and the LED beads as described in claim 6 or 7; a plurality of the LED beads are arranged in an array on the transparent substrate, and the back side of the insulating support faces the transparent substrate; The transparent substrate is provided with a circuit pattern, which includes a first power pad and a second power pad with opposite polarities. The first power bonding area of ​​two adjacent LED beads is connected by a first power jumper, and the first power bonding area of ​​at least one LED bead is connected to the first power pad by the first power jumper. The second power bonding area of ​​two adjacent LED beads is connected by a second power jumper, and the second power bonding area of ​​at least one LED bead is connected to the second power pad by the second power jumper. In the first signal binding area and the second signal binding area, one is a signal input binding area and the other is a signal output binding area; in the first signal short-circuit binding area and the second signal short-circuit binding area, one is a short-circuit input binding area and the other is a short-circuit output binding area. In the three adjacent LED beads, the signal input binding area of ​​the middle LED bead is connected to the short-circuit output binding area of ​​the preceding LED bead via a signal jumper, the signal output binding area of ​​the middle LED bead is connected to the short-circuit input binding area of ​​the following LED bead via the same signal jumper, and the short-circuit input binding area of ​​the middle LED bead is connected to the signal output binding area of ​​the preceding LED bead via the same signal jumper, and the short-circuit output binding area of ​​the middle LED bead is connected to the signal input binding area of ​​the following LED bead via the same signal jumper.

16. The transparent LED display screen according to claim 15, characterized in that, The circuit pattern also includes signal pads; The transparent LED display screen includes at least one set of LED strings, each LED string including multiple LED beads; each set of LED strings has two corresponding signal pads; in each set of LED strings, the signal input binding area of ​​the first LED bead is bound to one of the signal pads via a signal jumper, and the short-circuit input binding area of ​​the first LED bead is bound to the other signal pad via a signal jumper; the signal input binding areas of the remaining LED beads are bound to the short-circuit output binding area of ​​the preceding LED bead via signal jumpers, and the short-circuit input binding areas of each LED bead are bound to the signal output binding area of ​​the preceding LED bead via signal jumpers.

17. The transparent LED display screen according to claim 16, characterized in that, The circuit pattern also includes a connection pad, with each group of LED strings corresponding to one of the connection pads; In each LED string, the signal output binding area of ​​the last LED is bound to the connection pad via the signal jumper, and the short-circuit output binding area of ​​the last LED is bound to the connection pad via the signal jumper.

18. The transparent LED display screen according to claim 16, characterized in that, The circuit pattern also includes at least one connection pad; each connection pad corresponds to two sets of LED strings. The short-circuit output bonding area of ​​the last LED in the first group of LED strings is bonded to the connection pad via the signal jumper; the signal output bonding area of ​​the last LED in the second group of LED strings is bonded to the connection pad via the signal jumper; the signal output bonding area of ​​the last LED in the first group of LED strings is bonded to the short-circuit output bonding area of ​​the last LED in the second group of LED strings via the signal jumper.

Images