A display panel, its manufacturing method, and a display device.

Abstract

This invention discloses a display panel, its fabrication method, and a display device. The display panel includes a driving substrate and a light-emitting element. The driving substrate includes a substrate, a support layer, and a connecting electrode. The light-emitting element is electrically connected to the connecting electrode. The display panel also includes an opening disposed in the support layer, the opening penetrating at least a portion of the support layer. The display panel also includes connecting wires that at least cover the sidewalls of the opening, and the connecting wires are electrically connected to the connecting electrode. By providing an opening in the support layer, the bonding agent overflowing during the bonding process of the driving substrate and the light-emitting element is accommodated to form connecting wires in the opening, thus avoiding chip short circuits caused by bonding agent overflow during the bonding process. Furthermore, by connecting the connecting wires to the connecting electrode, the structural stability of the connecting electrode can be improved, avoiding warping and peeling problems. On the other hand, the electrical connection stability of the connecting electrode can also be improved, ensuring normal signal transmission and guaranteeing the display effect of the display panel.

Description

Technical Field

[0001] The present invention relates to the field of light-emitting technology, and in particular to a display panel, a method for preparing the same, and a display device. Background Technology

[0002] Currently, laser mass bonding is one of the main bonding methods for light-emitting diode (LED) displays. The basic process involves aligning and pressing a temporary substrate with arranged LED chips onto the corresponding positions on the substrate, and then heating it with laser irradiation to melt the bonding layer between the substrate pads and the LED pads, thereby electrically connecting the LED and the substrate.

[0003] However, during the laser heating bonding process, the bonded material may melt and overflow, causing short circuits between different light-emitting elements or between electrodes at different potentials in the same light-emitting element, reducing the bonding yield and affecting the normal light emission and display of the panel. Summary of the Invention

[0004] This invention provides a display panel and its manufacturing method, as well as a display device, to avoid short circuits in the light-emitting elements during bonding and improve bonding yield.

[0005] In a first aspect, embodiments of the present invention provide a display panel, including a driving substrate and a light-emitting element;

[0006] The driving substrate includes a substrate, a support layer located on one side of the substrate, and a connecting electrode located on the side of the support layer away from the substrate; the light-emitting element is electrically connected to the connecting electrode;

[0007] The display panel further includes an opening disposed in the support layer, which penetrates at least a portion of the support layer along the thickness direction of the display panel;

[0008] The display panel also includes connecting wires that at least cover the sidewalls of the opening, and the connecting wires are electrically connected to the connecting electrodes.

[0009] Secondly, embodiments of the present invention also provide a method for manufacturing a display panel, comprising:

[0010] A substrate is provided and a support layer is prepared on one side of the substrate;

[0011] The support layer is patterned to create openings in the support layer;

[0012] A connection electrode is fabricated on the side of the support layer away from the substrate;

[0013] A light-emitting element is provided and the light-emitting element and the connecting electrode are soldered to form a connecting wire in the opening, the connecting wire being electrically connected to the connecting electrode and at least covering the sidewall of the opening.

[0014] Thirdly, embodiments of the present invention also provide a display device, including the display panel described in the first aspect.

[0015] The technical solution provided by this invention, by providing an opening in the support layer, allows the bonding agent overflowing during the bonding process of the driving substrate and the light-emitting element to be accommodated, forming connecting wires within the opening. This avoids short circuits in the light-emitting element caused by bonding agent overflow during the bonding process, such as short circuits between different light-emitting elements and / or short circuits between different electrodes of the same light-emitting element. By reducing the risk of bonding short circuits, the bonding yield is improved. Furthermore, by connecting the conductive link to the connecting electrode, the structural stability of the connecting electrode can be improved, avoiding warping and peeling problems. On the other hand, the electrical connection stability of the connecting electrode can also be improved, ensuring normal signal transmission and guaranteeing the display effect of the display panel. Attached Figure Description

[0016] Figure 1 This is a top view of the structure of the first type of display panel provided in this embodiment of the invention;

[0017] Figure 2 This is a top view of the structure of the second type of display panel provided in an embodiment of the present invention;

[0018] Figure 3 yes Figure 1 A schematic diagram of the first type of cross-sectional structure of the provided display panel along section line A-A';

[0019] Figure 4 yes Figure 2 A schematic diagram of the first cross-sectional structure of the provided display panel along section line B-B';

[0020] Figure 5 This is a cross-sectional structural diagram of a display panel provided in an embodiment of the present invention;

[0021] Figure 6 This is a top view of the third type of display panel provided in this embodiment of the invention;

[0022] Figure 7 This is a top view of the fourth type of display panel provided in this embodiment of the invention;

[0023] Figure 8 This is a top view of the fifth type of display panel provided in this embodiment of the invention;

[0024] Figure 9 yes Figure 1 A schematic diagram of the second cross-sectional structure of the provided display panel along section line A-A';

[0025] Figure 10 yes Figure 2 A schematic diagram of the second cross-sectional structure of the provided display panel along section line B-B';

[0026] Figure 11 yes Figure 1 A schematic diagram of the third cross-sectional structure of the provided display panel along section line A-A';

[0027] Figure 12 yes Figure 1 A schematic diagram of the fourth cross-sectional structure of the provided display panel along section line A-A';

[0028] Figure 13 This is a schematic flowchart of the first method for manufacturing a display panel provided in an embodiment of the present invention;

[0029] Figure 14 This is a schematic flowchart of the second method for manufacturing a display panel provided in an embodiment of the present invention;

[0030] Figure 15 This is a flowchart of the preparation method of the first organic protective layer provided in the embodiments of the present invention;

[0031] Figure 16 for Figure 15 A schematic diagram of the preparation method in the middle;

[0032] Figure 17 This is a flowchart of the preparation method of the second organic protective layer provided in the embodiments of the present invention;

[0033] Figure 18 for Figure 17 A schematic diagram of the preparation method in the middle;

[0034] Figure 19 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention. Detailed Implementation

[0035] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0036] Figure 1 This is a top view schematic diagram of the first type of display panel provided in the embodiment of the present invention. Figure 2 This is a top view schematic diagram of the second type of display panel provided in an embodiment of the present invention. Figure 3 yes Figure 1 The provided schematic diagram shows the first type of cross-sectional structure of the display panel along section line A-A'. Figure 4 yes Figure 2 The provided schematic diagram shows the first type of cross-sectional structure of the display panel along section line B-B', as follows: Figures 1-4 As shown, the display panel provided in this embodiment of the invention includes a driving substrate 10 and a light-emitting element 20; the driving substrate 10 includes a substrate 101, a support layer 102 located on one side of the substrate 101, and a connecting electrode 103 located on the side of the support layer 102 away from the substrate; the light-emitting element 20 is electrically connected to the connecting electrode 103; the display panel also includes an opening 30 disposed in the support layer 102, and along the thickness direction of the display panel (Z direction as shown in the figure), the opening 30 penetrates at least a portion of the support layer 102; the display panel also includes a connecting wire 104 that at least covers the sidewall of the opening 30, and the connecting wire 104 is electrically connected to the connecting electrode 103.

[0037] Specifically, the driving substrate 10 includes a substrate 101 and a driving structure located on one side of the substrate 101. The driving structure may include an active driving structure and a passive driving structure. The active driving structure may include a pixel circuit 105 (such as...). Figure 3 and Figure 4 As shown in the figure, the passive driving structure may include a driving signal line (not shown). The driving structure outputs a light-emitting signal to the connecting electrode 103, and further transmits the light-emitting signal to the light-emitting element 20 through the connecting electrode 103 to realize the display light emission of the light-emitting element. This embodiment of the invention does not limit whether the driving structure is an active driving structure or a passive driving structure; the figure only illustrates an active driving structure as an example. The light-emitting element 20 may include a light-emitting layer 201 and an electrode 202. The electrode 202 is electrically connected to the connecting electrode 103 and is used to receive the light-emitting signal transmitted by the connecting electrode 103. Furthermore, the light-emitting element 20 may include light-emitting elements of the same color to achieve monochrome display, or the light-emitting element 20 may include light-emitting elements of different colors to achieve color display. For example, the light-emitting element 20 may include red, green, and blue light-emitting elements to achieve full-color display.

[0038] Furthermore, taking the active driving structure including pixel circuit 105 as an example, the connecting electrode 103 may include an anode connecting electrode 1031 and a cathode connecting electrode 1032. The pixel circuit 105 is used to receive a scan signal and turn on or off under the action of the scan signal, so as to provide the light-emitting signal provided by the light-emitting signal line to the light-emitting element 20 through the anode connecting electrode 1031, or to stop providing the light-emitting signal to the light-emitting element 20. The light-emitting signal line may include a data signal line and a positive power signal line, and the corresponding light-emitting signal may include a data signal and a positive power signal. The light-emitting element 20 is used to realize light emission display under the drive of the light-emitting signal. The pixel circuit 105 may include one or more thin-film transistors. Figure 3 and Figure 4 Taking a pixel circuit 105 including a thin-film transistor as an example, the specific composition of the pixel circuit 105 is not limited in this embodiment of the invention, but can be limited according to requirements and the type of display panel. Further, the thin-film transistor may include a source 1051, a drain 1052, a gate 1053, and an active layer 1054. The gate 1053 is configured corresponding to the channel region of the active layer 1054, the source 1051 is configured corresponding to the source region of the active layer 1054, and the drain 1052 is configured corresponding to the drain region of the active layer 1054. Under the action of the gate signal, the channel region is turned on, changing from a non-conductor state to a conductor state, and a path is formed between the corresponding source 1051 and drain 1052. Data signals can be sequentially written to the drain 1052 through the source 1051 and the channel region.

[0039] Further reference Figures 1-4As shown, during the bonding process between the light-emitting element 20 and the connecting electrode 103, the bonding compound (e.g., solder paste) on the surface of the electrode 202 in the light-emitting element 20 and the bonding compound (e.g., solder paste) on the surface of the connecting electrode 103 melts and fuses due to the high temperature. Electrical connection between the light-emitting element 20 and the connecting electrode 103 is achieved based on the extrusion force during the bonding process. Furthermore, to prevent the molten bonding compound from flowing everywhere and causing short circuits between different light-emitting elements, or between the anode and cathode of the same light-emitting element, this embodiment of the invention creatively provides an opening 30 in the support layer 102. Since the opening 30 is located in the support layer 102 and its surface height is lower than the height of the connecting electrode 103, the molten bonding compound can flow into the opening 30, forming a connecting wire 104 electrically connected to the connecting electrode 103 at least on the sidewall of the opening 30. In other words, the opening 30 accommodates the bonding compound overflowing during the bonding process of the light-emitting element, so that a connecting wire 104 electrically connected to the connecting electrode 103 is formed at least on the sidewall of the opening 30. The connection wire 104 can enhance the bonding effect between the connection electrode 103 and the support layer 102, avoiding the problem of warping and peeling between the connection electrode 103 and the support layer 102. On the other hand, it can also improve the electrical connection stability of the connection electrode, ensure normal signal transmission, and ensure the display effect of the display panel.

[0040] Furthermore, the opening 30 can be set close to the connecting electrode 103, for example, the opening 30 is connected to the connecting electrode 103; or, there is a small gap between the opening 30 and the connecting electrode 103. This small gap can prevent the setting of the opening 30 from affecting the setting of the connecting electrode 103, and can ensure that the bonding compound overflowing during the high-temperature bonding process between the light-emitting element and the connecting electrode 103 can flow smoothly into the opening 30.

[0041] It should be noted that continued reference is necessary. Figure 1 As shown, the display panel provided in this embodiment of the invention further includes a spare connection electrode 106. The connection electrode 103 can be understood as the preferred connection electrode for electrical connection with the light-emitting element 20, and the spare connection electrode 106 can be understood as an alternative connection electrode for electrical connection with the light-emitting element 20. When the connection electrode 103 fails, it can be electrically connected to the light-emitting element 20 through the spare connection electrode 106 to ensure that the light-emitting elements at different positions of the entire light-emitting element can normally receive light emission signals and emit light.

[0042] The display panel provided in this invention, by providing openings in the support layer to accommodate bonding agents overflowing during the bonding process between the connecting electrodes and the light-emitting elements, forms connecting wires within the openings. This avoids short circuits in the light-emitting elements caused by bonding agent overflow during the bonding process, such as short circuits between different light-emitting elements and / or short circuits between different electrodes of the same light-emitting element. By reducing the risk of bonding short circuits, the bonding yield is improved. Furthermore, by connecting conductive links to the connecting electrodes, the structural stability of the connecting electrodes is improved, preventing warping and peeling problems. Simultaneously, the electrical connection stability of the connecting electrodes is improved, ensuring normal signal transmission and guaranteeing the display effect of the display panel.

[0043] Optional, continue to refer to Figure 3 and Figure 4 As shown, the display panel also includes a bridging electrode 107 located on the side of the support layer 102 away from the connecting electrode 103; along the thickness direction of the display panel, the opening 30 penetrates the support layer 102 and exposes part of the bridging electrode 107, and the connecting wire 104 is electrically connected to the bridging electrode 107.

[0044] like Figure 3 and Figure 4 As shown, the bridging electrode 107 is located between the film layer containing the connecting electrode 103 and the film layer containing the pixel circuit 105, and is electrically connected to both the connecting electrode 103 and the pixel circuit 105. In other words, the bridging electrode 107 can serve as a connection structure between the connecting electrode 103 and the pixel circuit 105. This avoids the need for deep drilling during the electrical connection process between the connecting electrode 103 and the pixel circuit 105, reduces the connection difficulty between them, and improves the connection stability.

[0045] Furthermore, such as Figure 3 and Figure 4 As shown, the opening 30 penetrates the support layer 102 and exposes part of the bridging electrode 107, thus ensuring that the connecting wire 104 can be connected to the bridging electrode 107 through the opening 30. In this way, the connecting wire 104 connects the bridging electrode 107 and the connecting electrode 103 respectively, increasing the connection stability between the bridging electrode 107 and the connecting electrode 103, that is, increasing the connection stability between the pixel circuit 105 and the connecting electrode 103, and ensuring that the display signal is stably transmitted to the connecting electrode 103.

[0046] Furthermore, Figure 5 This is a cross-sectional structural diagram of a display panel according to an embodiment of the present invention, specifically a cross-sectional structural diagram of the display panel before the light-emitting element is transferred. Figure 3 , Figure 4 and Figure 5As shown, the display panel provided in this embodiment of the invention also includes a connection via 40 disposed in the support layer 102. The connection via 40 penetrates the support layer 102 along the thickness direction of the display panel (Z direction as shown in the figure); the connection electrode 103 and the bridging electrode 107 are electrically connected through the connection via 40.

[0047] like Figure 3 , Figure 4 and Figure 5 As shown, the display panel may also include a connection via 40 disposed in the support layer 102. The connection wire 104 can be connected to the bridging electrode 107 through the connection via 40, and the electrical connection with the pixel circuit 105 is realized through the connection via 40 and the bridging electrode 107.

[0048] It should be noted that, Figure 3 and Figure 5 In the illustrated scheme, the connecting via 40 and the opening 30 are independently configured different structures. The connecting electrode 103 can be electrically connected to the bridging electrode 107 through the connecting via 40 and the opening 30 respectively. This can ensure the stability of the electrical connection between the connecting electrode 103 and the bridging electrode 107, and at the same time reduce the connection resistance between the connecting electrode 103 and the bridging electrode 107, ensuring a good electrical connection between the connecting electrode 103 and the bridging electrode 107. Figure 4 In the illustrated scheme, the connecting via 40 is reused as the opening 30, that is, the connecting via 40 and the opening 30 have the same structure. This can reduce the space occupied by the connecting via 40 or the opening 30, leaving more space to set up the light-emitting elements, which is beneficial to improving the display resolution of the display panel.

[0049] Further reference Figure 5 As shown, the connecting electrode 103 and the bridging electrode 107 are electrically connected through at least two connecting vias 40. Before the light-emitting element is transferred, the connecting electrode 103 includes multiple electrode portions 103a, each of which is electrically connected to the bridging electrode 107 through a connecting via 40. This division by multiple connecting vias 40 enhances the adhesion between the connecting electrode 103 and the support layer 102, preventing warping and peeling of the connecting electrode 103 in subsequent processes.

[0050] Based on the above embodiments, continue to refer to Figure 3 and Figure 4 As shown, the connecting wire 104 covers at least part of the bottom surface of the opening 30, which increases the connection area between the connecting wire 104 and the bridging electrode 107, reduces the connection resistance between the connecting wire 104 and the bridging electrode 107, reduces the loss of the display signal when it is transmitted between the connecting wire 104 and the bridging electrode 107, and ensures that the display signal is accurately transmitted to the connecting electrode 103.

[0051] Based on the above embodiments, Figure 6 This is a top view schematic diagram of the third type of display panel provided in the embodiment of the present invention. Figure 7 This is a top view schematic diagram of the fourth type of display panel provided in the embodiments of the present invention. Figure 8 This is a top view structural diagram of the fifth type of display panel provided in the embodiments of the present invention, combined with... Figure 1 , Figure 3 , Figure 6 , Figure 7 and Figure 8 As shown, along a first direction (the X direction as shown in the figure), the opening 30 is located on at least one side of the connecting electrode 103; the first direction is parallel to the plane where the substrate 10 is located.

[0052] like Figure 1 , Figure 3 , Figure 6 , Figure 7 and Figure 8 As shown, in a direction parallel to the substrate 10, the opening 30 is located on at least one side of the connecting electrode 103, that is, in the thickness direction of the display panel, the opening 30 does not overlap with the connecting electrode 103. Thus, during the bonding process between the light-emitting element 20 and the connecting electrode 103, the bonding agent (e.g., solder paste) on the surface of the connecting electrode 103 and / or the light-emitting element 20 can flow into the opening 30 located on one side of the connecting electrode 103. The opening 30 can accommodate the bonding agent, preventing it from causing short circuits between different light-emitting elements, or between the cathode and anode of the same light-emitting element, reducing the risk of short circuits between different light-emitting elements or between the cathode and anode of the same light-emitting element. Simultaneously, the bonding agent flows into the opening 30 and at least covers the sidewall of the opening 30 to form a connecting wire 104. The connecting wire 104 improves the adhesion between the connecting electrode 103 and the support layer 102, preventing warping and peeling between the connecting electrode 103 and the support layer 102. Furthermore, when the bridging electrode 107 is present and the opening 30 exposes the bridging electrode 107, the electrical connection between the connecting electrode 103 and the bridging electrode 107 can also be achieved through the connecting wire 104 located in the opening 30, thereby improving the stability of the electrical connection between the connecting electrode 103 and the bridging electrode 107.

[0053] Further reference Figure 1 , Figure 3 , Figure 6 , Figure 7 and Figure 8As shown, the connecting electrode 103 includes an anode connecting electrode 1031 and a cathode connecting electrode 1032; the opening 30 includes an anode opening 301 and a cathode opening 302, which are independently disposed; along a first direction (the X direction shown in the figure), the anode opening 301 is located on the side of the anode connecting electrode 1031 away from the cathode connecting electrode 1032, and / or, the anode opening 301 is located on the side of the anode connecting electrode 1031 close to the cathode connecting electrode 1032; along the first direction (the X direction shown in the figure), the cathode opening 302 is located on the side of the cathode connecting electrode 1032 away from the anode connecting electrode 1031, and / or, the cathode opening 302 is located on the side of the cathode connecting electrode 1032 close to the anode connecting electrode 1031.

[0054] Specifically, such as Figure 3 As shown, the light-emitting element 20 may include a light-emitting layer 201 and an electrode 202 located on one side of the light-emitting layer 201. The light-emitting layer 201 may include a P-type semiconductor layer, an N-type semiconductor layer, and a quantum well layer located between the P-type semiconductor layer and the N-type semiconductor layer. The electrode 202 may include an anode 2021 and a cathode 2022. The anode 2021 is electrically connected to the P-type semiconductor layer, and the cathode 2022 is electrically connected to the N-type semiconductor layer. Correspondingly, the connecting electrode 103 includes an anode connecting electrode 1031 and a cathode connecting electrode 1032. The anode connecting electrode 1031 is electrically connected to the anode 2021, and the cathode connecting electrode 1032 is electrically connected to the cathode 2022. Furthermore, the opening 30 includes an anode opening 301 and a cathode opening 302. The anode opening 301 is used to accommodate the bonding compound that overflows when the anode connecting electrode 1031 is electrically connected to the anode 2021, and the cathode opening 302 is used to accommodate the bonding compound that overflows when the cathode connecting electrode 1032 is electrically connected to the cathode 2022. The anode opening 301 and the cathode opening 302 are independently set and will not be connected. This ensures that the connecting wires covering the sidewall of the anode opening 301 and the connecting wires covering the sidewall of the cathode opening 302 are independently set and will not short-circuit, thereby ensuring that there will be no short circuit between the anode 2021 and the cathode 2022.

[0055] The arrangement of the anode opening 301 and the cathode opening 302 can be as follows: Figure 1 and Figure 3 As shown, the anode opening 301 is located on the side of the anode connecting electrode 1031 away from the cathode connecting electrode 1032, and the cathode opening 302 is located on the side of the cathode connecting electrode 1032 away from the anode connecting electrode 1031. This results in a large distance between the anode opening 301 and the cathode opening 302, ensuring complete insulation between the connecting wires covering the sidewall of the anode opening 301 and the connecting wires covering the sidewall of the cathode opening 302, thus preventing interference between the anode and cathode signals. Alternatively, as... Figure 6As shown, the anode opening 301 is located on the side of the anode connecting electrode 1031 closest to the cathode connecting electrode 1032, and the cathode opening 302 is located on the side of the cathode connecting electrode 1032 closest to the anode connecting electrode 1031. That is, the anode opening 301 and the cathode opening 302 are located between the anode connecting electrode 1031 and the cathode connecting electrode 1032. This fully utilizes the area between the anode connecting electrode 1031 and the cathode connecting electrode 1032 to set the anode opening 301 and the cathode opening 302, without occupying extra space due to their placement. This ensures that a larger space can be reserved for setting more light-emitting elements, guaranteeing a high-resolution display panel. Alternatively, as... Figure 7 and Figure 8 As shown, the anode opening 301 or the cathode opening 302 is disposed between the anode connecting electrode 1031 and the cathode connecting electrode 1032, and the cathode opening 302 or the anode opening 301 is disposed on the periphery of the anode connecting electrode 1031 and the cathode connecting electrode 1032. In this way, in addition to ensuring that the large distance between the anode opening 301 and the cathode opening 302 will not affect each other, the area between the anode connecting electrode 1031 and the cathode connecting electrode 1032 can be fully utilized, which can take into account the characteristics that the anode signal and the cathode signal will not interfere with each other, as well as the display resolution.

[0056] It should be noted that the above Figure 1 , Figure 3 , Figures 6-8 Taking an example where the anode opening is located on one side of the anode connecting electrode and the cathode opening is located on one side of the cathode connecting electrode, it can be understood that the anode opening can be located on both sides of the anode connecting electrode or around the anode connecting electrode, and the cathode opening can be located on both sides of the cathode connecting electrode or around the cathode connecting electrode. The placement of the anode and cathode openings is diverse, and will not be illustrated with examples here.

[0057] As one possible implementation method, please refer to [reference]. Figure 2 and Figure 4 As shown, along the first direction, along the thickness direction of the display panel (e.g.) Figure 4 (as shown in the Z direction), the opening 30 overlaps with the connecting electrode 103.

[0058] like Figure 2 and Figure 4As shown, the opening 30 along the thickness direction of the display panel overlaps with the connecting electrode 103. This can be understood as the orthographic projection area of ​​the connecting electrode 103 on the plane of the substrate 101 covering the orthographic projection area of ​​the opening 30 on the plane of the substrate 101, or as the orthographic projection of the connecting electrode 103 on the plane of the substrate 101 surrounding the orthographic projection of the opening 30 on the plane of the substrate 101. Thus, during the bonding process between the light-emitting element 20 and the connecting electrode 103, the bonding agent can directly flow into the opening 30 located within the area defined by the connecting electrode 103, forming a conductive connection 104 on the sidewall of the opening 30. This increases the adhesion between the connecting electrode 103 and the support layer 102, preventing warping and peeling between the connecting electrode 103 and the support layer 102. Furthermore, when the bridging electrode 107 is present and the opening 30 exposes the bridging electrode 107, the electrical connection between the connecting electrode 103 and the bridging electrode 107 can also be achieved through the connecting wire 104 located in the opening 30, thereby improving the stability of the electrical connection between the connecting electrode 103 and the bridging electrode 107.

[0059] Further reference Figure 2 and Figure 4 As shown, the connecting electrode 103 includes an anode connecting electrode 1031 and a cathode connecting electrode 1032; the opening 30 includes an anode opening 301 and a cathode opening 302, which are independently arranged; along the thickness direction of the display panel (Z direction as shown in the figure), the anode connecting electrode 1031 is connected to and covers the anode opening 301, and the cathode connecting electrode 1032 covers the cathode opening 302.

[0060] like Figure 4 As shown, the light-emitting element 20 may include a light-emitting layer 201 and an electrode 202 located on one side of the light-emitting layer 201. The electrode 202 may include an anode 2021 and a cathode 2022. The anode 2021 is electrically connected to a P-type semiconductor, and the cathode 2022 is electrically connected to an N-type semiconductor layer. Correspondingly, the connecting electrode 103 includes an anode connecting electrode 1031 and a cathode connecting electrode 1032. The anode connecting electrode 1031 is electrically connected to the anode 2021, and the cathode connecting electrode 1032 is electrically connected to the anode 2022. Furthermore, the opening 30 includes an anode opening 301 and a cathode opening 302. The anode opening 301 is used to accommodate the bonding compound that overflows when the anode connecting electrode 1031 is electrically connected to the anode 2021, and the cathode opening 302 is used to accommodate the bonding compound that overflows when the cathode connecting electrode 1032 is electrically connected to the cathode 2022. The anode opening 301 and the cathode opening 302 are independently set and will not be connected. This ensures that the connecting wires covering the sidewall of the anode opening 301 and the connecting wires covering the sidewall of the cathode opening 302 are independently set and will not short-circuit, thereby ensuring that there will be no short circuit between the anode 2021 and the cathode 2022.

[0061] The arrangement of the anode opening 301 and the cathode opening 302 can be as follows: Figure 2 and Figure 4 As shown, along the thickness direction of the display panel (Z direction as shown in the figure), the anode connecting electrode 1031 connects to and covers the anode opening 301, and the cathode connecting electrode 1032 covers the cathode opening 302. That is, the orthogonal projection of the anode connecting electrode 1031 onto the plane of the substrate 101 surrounds the orthogonal projection of the anode opening 301 onto the plane of the substrate 101, and the orthogonal projection of the cathode connecting electrode 1032 onto the plane of the substrate 101 surrounds the orthogonal projection of the cathode opening 302 onto the plane of the substrate 101. This allows full utilization of the area below the anode connecting electrode 1031 and the cathode connecting electrode 1032 to accommodate the anode opening 301 and the cathode opening 302, without occupying additional space. This ensures ample space for accommodating more light-emitting elements and guarantees a high-resolution display panel. Furthermore, during the bonding process between the light-emitting element 20 and the connecting electrode 103, the bonding compound flows directly downwards into the opening 30 under the influence of gravity, ensuring that the bonding compound can fully flow into the opening 30 to form the connecting wire 104 within it. The connecting wire 104 can cover a larger area of ​​the opening 30, resulting in a good bonding effect between the connecting wire 104 and the opening 30, further ensuring a good adhesion between the connecting electrode 103 and the support layer 102. Moreover, when the bonding compound can fully flow into the opening 30, it reduces the amount of bonding compound residue on the surface of the support layer 102, reducing the risk of anode and cathode short circuits caused by bonding compound residue, and ensuring that the light-emitting element displays and emits light normally.

[0062] Further reference Figure 4 As shown, the opening 30 includes a first opening portion 30a and a second opening portion 30b. The first opening portion 30a is located on the side of the second opening portion 30b that is closer to the light-emitting element 20. The opening area of ​​the first opening portion 30a is larger than the opening area of ​​the second opening portion 30b.

[0063] Specifically, such as Figure 4 As shown, the opening 30 includes a first opening portion 30a and a second opening portion 30b that are interconnected. The first opening portion 30a is located on the side of the second opening portion 30b that is closer to the light-emitting element 20, and the opening area of ​​the first opening portion 30a is larger than the opening area of ​​the second opening portion 30b. In this way, the first opening portion 30a can serve as a flow guiding structure for the opening 30, which facilitates the flow of more bonding agents into the opening 30, reduces the residue of bonding agents on the surface of the support layer 102, so as to fully form the connecting wire 104 in the opening 30 and reduce the problem of short circuit between the anode and cathode caused by the residue of bonding agents.

[0064] It should be noted that opening 30 may include multiple opening sections. Figure 4 The explanation will focus on the first opening portion 30a and the second opening portion 30b. The sidewalls of the openings form multiple stepped structures, with the opening area of ​​the portion closer to the light-emitting element being larger than that of the portion farther from the light-emitting element. This allows the bonding agent to sequentially guide the flow of each opening portion into the opening portion below it, ensuring sufficient flow of the bonding agent into the openings and reducing the amount of bonding agent residue on the surface of the support layer 102. This reduces the risk of short circuits between the anode and cathode caused by bonding agent residue.

[0065] Based on the above embodiments, Figure 9 yes Figure 1 The provided schematic diagram shows the ectth cross-sectional structure of the display panel along the section line A-A'. Figure 10 yes Figure 2 The provided schematic diagram shows the second cross-sectional structure of the display panel along section line B-B', combined with... Figure 9 and Figure 10 As shown, the opening 30 includes a plurality of sub-openings 30-1 and sub-opening sidewalls 30-2 that define the sub-openings 30-1; along the thickness direction of the display panel, at least a portion of the thickness of the sub-opening sidewalls 30-2 is less than or equal to the thickness of the support layer 102.

[0066] Specifically, such as Figure 9 and Figure 10As shown, the opening 30 includes a plurality of sub-openings 30-1, which are arranged along a first direction (the X direction shown in the figure). Each sub-opening 30-1 is used to accommodate the bonding compound that overflows during the bonding process between the light-emitting element 20 and the connecting electrode 103. Furthermore, considering the capacity of the bonding compound, one or some of the sub-openings 30-1 along the first direction near the connecting electrode 103 may contain the bonding compound, with the connecting wire 104 formed only in one or some of the sub-openings 30-1 along the first direction near the connecting electrode 103; or all the sub-openings 30-1 may contain the bonding compound, with all the sub-openings 30-1 forming the connecting wire 104. This embodiment of the invention does not limit this, and the number of sub-openings accommodating the bonding compound is related to the capacity of the bonding compound. Furthermore, the opening 30 also includes a sub-opening sidewall 30-2 that defines the sub-opening 30-1; along the thickness direction of the display panel, at least part of the thickness of the sub-opening sidewall 30-2 is less than or equal to the thickness of the support layer 102, so that a micro-nano structure formed by multiple sub-openings 30-1 is formed inside the opening 30. The siphon effect can achieve better flow conduction, so that the bonding compound overflowing during the bonding process between the light-emitting element 20 and the connecting electrode 103 can flow more and more smoothly into the micro-nano structure formed by multiple sub-openings 30-1, reducing the residue of bonding compound on the surface of the support layer 102, and reducing the problem of short circuit between different light-emitting elements or short circuit between the anode and cathode of the same light-emitting element caused by bonding compound residue.

[0067] Based on the above embodiments, continue to refer to Figure 1 , Figure 2 , Figure 6 , Figure 7 and Figure 8 As shown, the connecting electrode 103 includes an anode connecting electrode 1031 and a cathode connecting electrode 1032; the opening 30 includes an anode opening 301 and a cathode opening 302, and the anode opening 301 and the cathode opening 302 are independently arranged; there are two anode openings 301 independently arranged, and there are two cathode openings 302 connected together.

[0068] Specifically, the light-emitting element 20 may include a light-emitting layer 201 and an electrode 202 located on one side of the light-emitting layer 201. The electrode 202 may include an anode 2021 and a cathode 2022. Correspondingly, the connecting electrode 103 includes an anode connecting electrode 1031 and a cathode connecting electrode 1032. The anode connecting electrode 1031 is electrically connected to the anode 2021, and the cathode connecting electrode 1032 is electrically connected to the anode 2022. Furthermore, the opening 30 includes an anode opening 301 and a cathode opening 302. The anode opening 301 is used to accommodate the bonding compound that overflows when the anode connecting electrode 1031 is electrically connected to the anode 2021, and the cathode opening 302 is used to accommodate the bonding compound that overflows when the cathode connecting electrode 1032 is electrically connected to the cathode 2022. The anode opening 301 and the cathode opening 302 are independently set and will not be connected. This ensures that the connecting wires covering the sidewall of the anode opening 301 and the connecting wires covering the sidewall of the cathode opening 302 are independently set and will not short-circuit, thereby ensuring that there will be no short circuit between the anode 2021 and the cathode 2022.

[0069] Furthermore, since the input signals to the different anode connecting electrodes 1031 are different, two anode openings 301 are independently set. The connecting wires 104 in these independently set anode openings 301 are not short-circuited, thus preventing short circuits between the different anode connecting electrodes 1031 and ensuring that the different light-emitting elements 20 operate independently without affecting each other. Furthermore, the independent setting of any two anode openings 301 ensures that no two light-emitting elements 20 will cause a short circuit between the different anode connecting electrodes 1031, guaranteeing that any two light-emitting elements 20 operate independently without affecting each other.

[0070] Furthermore, since the input signals to different cathode connection electrodes 1032 are the same, such as the same negative potential signal or both being zero potential signals, when two cathode openings 302 are connected, even if different connecting wires 104 are connected to these connected cathode openings 302, the same signal is transmitted in the different cathode connection electrodes 1032 and connecting wires 104. Therefore, the connected cathode openings 302 will not affect the independent display between different light-emitting elements. Moreover, the mutual connection of the connecting wires 104 in the connected cathode openings 302 can reduce the resistance of the connecting wires 104, reduce the loss during cathode signal transmission, and ensure that the cathode signal can be accurately transmitted to the cathode in the light-emitting element, ensuring accurate display of the light-emitting element. Furthermore, any two cathode openings 302 being connected, that is, all cathode openings 302 being interconnected, can further reduce the resistance of the connecting wires 104, reduce the loss during cathode signal transmission, and ensure that the cathode signal can be accurately transmitted to the cathode in the light-emitting element, ensuring accurate display of the light-emitting element.

[0071] Based on the above embodiments, Figure 11 yes Figure 1 The provided schematic diagram shows a third cross-sectional structure of the display panel along section line A-A', as follows: Figure 11 As shown, the light-emitting element 20 includes a light-emitting element body 20a and a protective structure 20b covering the light-emitting surface of the light-emitting element body 20a; the protective structure 20b includes an organic protective structure.

[0072] like Figure 11 As shown, the light-emitting element 20 includes a light-emitting element body 20a and a protective structure 20b covering the side light-emitting surface of the light-emitting element body 20a. The protective structure 20b protects the side light-emitting surface of the light-emitting element body 20a, preventing short circuits between the P-type semiconductor layer and the cathode, and / or between the N-type semiconductor layer and the anode electrode, caused by bonding agents adhering to the side light-emitting surface of the light-emitting element body 20a during the bonding process between the light-emitting element 20 and the connecting electrode 103. By setting the protective structure 20b as an insulating protective layer, the side light-emitting surface of the light-emitting element body 20a is protected from short circuits caused by the adhered bonding agents, ensuring that the light-emitting element 20 can emit light normally for display.

[0073] Furthermore, during the transport of the light-emitting element body, the adhesive layer on the surface of the transport substrate needs to be etched. In this embodiment of the invention, the protective structure 20b is an organic protective structure, which is formed by a self-aligned etching process on the adhesive layer on the surface of the transport substrate during the transport of the light-emitting element. When etching the adhesive layer on the surface of the transport substrate, by controlling the proportion of etching gas, the adhesive etching product can be attached to the sidewall of the light-emitting element body 20a, thereby forming an organic protective layer.

[0074] Furthermore, the material of the organic protective structure includes fluorocarbon polymers rather than hydrocarbon polymers. The fluorocarbon polymer is formed by controlling the proportion of etching gas during the etching of the adhesive layer on the surface of the transport substrate. That is, the fluorocarbon polymer naturally forms on the sidewall of the light-emitting element body 20a during the etching of the adhesive layer on the surface of the transport substrate, without the need for a separate fabrication process for the protective structure 20b, nor the need to prepare separate materials for the protective structure. This ensures a simple fabrication process for the protective structure; secondly, by using the light-emitting element body 20a as the etching mask structure for the adhesive layer, a mask process can be saved; and thirdly, since the adhesive layer is etched through the gap between two adjacent light-emitting element bodies 20a, the etching product, i.e., the fluorocarbon polymer, generally adheres to the sidewall of the light-emitting element body 20a rather than its top surface, having little or no impact on the top surface of the light-emitting element body 20a, thus ensuring normal subsequent transport and light emission of the light-emitting element.

[0075] Based on the above embodiments, Figure 12 yes Figure 1The provided schematic diagram shows the fourth cross-sectional structure of the display panel along section line A-A'. Figure 12 The difference from the above embodiment is that in the above embodiment, the support layer 102 is a whole layer structure, and the opening 30 is a part formed in the support layer 102. Figure 12 In the middle, the support layer has 102 boss structures, and the areas without boss structures can be understood as openings. Furthermore, to prevent a short circuit between the anode connecting electrode 1031 and the anode connecting electrode 1032, a partition can be provided between the boss structure supporting the anode connecting electrode 1031 and the boss structure supporting the cathode connecting electrode 1032. The partition is used to block the flow of the bonding compound during the bonding process between the light-emitting element and the connecting electrode, thus preventing a short circuit between the anode connecting electrode 1031 and the anode connecting electrode 1032.

[0076] It should be noted that the specific configuration of the support layer in the embodiments of the present invention is not limited, and the support layer can be flexibly configured according to actual needs.

[0077] Based on the same inventive concept, embodiments of the present invention also provide a method for manufacturing a display panel. Figure 13 This is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present invention, as shown below. Figure 13 As shown, the manufacturing method of this type of display panel includes:

[0078] S101. Provide a substrate and prepare a support layer on one side of the substrate.

[0079] Specifically, the support layer can be a film layer used to support the connecting electrodes, which can be an organic layer or an inorganic layer, and can be a single film layer or multiple film layers. The embodiments of the present invention do not limit this.

[0080] S102, Pattern the support layer to create openings in the support layer.

[0081] Specifically, a patterning process is used to create openings in the support layer. When the support layer is an organic layer, the support layer can be directly patterned using a mask to create openings in the support layer; when the support layer is an inorganic layer, photoresist can be coated on the surface of the support layer, and then an exposure-development-etching process can be used to create openings in the support layer.

[0082] The embodiments of the present invention do not limit the process of how to prepare the opening in the support layer.

[0083] S103. Prepare a connection electrode on the side of the support layer away from the substrate.

[0084] Specifically, the connecting electrode is a structure used to electrically connect with the light-emitting element that is subsequently transported. It includes an anode connecting electrode and a cathode connecting electrode. The anode connecting electrode is used to electrically connect with the anode in the light-emitting element and transmit the anode display signal to the anode. The cathode connecting electrode is used to electrically connect with the cathode in the light-emitting element and transmit the cathode display signal to the cathode.

[0085] Furthermore, the opening can be positioned close to the connecting electrode, for example, the opening can be connected to the connecting electrode; or, there can be a small gap between the opening and the connecting electrode, which can ensure that the bonding compound overflowing during the high-temperature bonding process between the light-emitting element and the connecting electrode can flow smoothly into the opening.

[0086] S104. Provide a light-emitting element and weld the light-emitting element and a connecting electrode to form a connecting wire in the opening, the connecting wire being electrically connected to the connecting electrode and at least covering the sidewall of the opening.

[0087] Specifically, during the bonding process between the light-emitting element and the connecting electrode, the bonding agents (e.g., solder paste) on the electrode surface of the light-emitting element and the bonding agents (e.g., solder paste) on the connecting electrode surface melt and fuse due to high temperatures. Electrical connection between the light-emitting element and the connecting electrode is achieved based on the extrusion pressure during the bonding process. Furthermore, to prevent the molten bonding agents from flowing everywhere and causing short circuits between different light-emitting elements, or between the anode and cathode of the same light-emitting element, during the melting and extrusion of the bonding agents, this invention creatively prepares an opening in the support layer. Since the opening is located in the support layer and its surface height is lower than the height of the connecting electrode, the molten bonding agents can flow into the opening, forming a connecting wire electrically connected to the connecting electrode at least on the sidewall of the opening. In other words, the opening accommodates the bonding agents overflowing during the bonding process between the light-emitting element and the connecting electrode, thereby forming a connecting wire electrically connected to the connecting electrode at least on the sidewall of the opening. The placement of connecting wires can enhance the bonding effect between the connecting electrodes and the support layer, avoiding warping and peeling between them. On the other hand, it can also improve the electrical connection stability of the connecting electrodes, ensuring normal signal transmission and the display effect of the display panel.

[0088] The fabrication method provided in this invention, by creating openings in the support layer to accommodate the bonding compound overflowing during the bonding process of the connecting electrode and the light-emitting element, forms connecting wires within the openings. This avoids short circuits in the light-emitting element caused by the overflow of the bonding compound during bonding, such as short circuits between different light-emitting elements and / or short circuits between different electrodes of the same light-emitting element. By reducing the risk of bonding short circuits, the bonding yield is improved. Furthermore, by connecting the conductive link to the connecting electrode, the structural stability of the connecting electrode is improved, avoiding warping and peeling problems. On the other hand, the electrical connection stability of the connecting electrode is also improved, ensuring normal signal transmission and guaranteeing the display effect of the display panel.

[0089] Figure 14 This is a flowchart of a second method for fabricating a display panel according to an embodiment of the present invention. The fabrication method provided by this embodiment adds a scheme for fabricating a protective structure on the side of the light-emitting element body, based on the above embodiments, and specifically explains how to fabricate the protective structure. For example... Figure 14 As shown, the preparation method provided in this embodiment of the invention includes:

[0090] S201. Provide a substrate and prepare a support layer on one side of the substrate.

[0091] S202, Pattern the support layer to create openings in the support layer.

[0092] S203. Fabricate a connection electrode on the side of the support layer away from the substrate.

[0093] Specifically, the connecting electrode is a structure used to electrically connect with the light-emitting element that is subsequently transported. It includes an anode connecting electrode and a cathode connecting electrode. The anode connecting electrode is used to electrically connect with the anode in the light-emitting element and transmit the anode display signal to the anode. The cathode connecting electrode is used to electrically connect with the cathode in the light-emitting element and transmit the cathode display signal to the cathode.

[0094] Furthermore, the opening can be positioned close to the connecting electrode, for example, the opening can be connected to the connecting electrode; or, there can be a small gap between the opening and the connecting electrode, which can ensure that the bonding compound overflowing during the high-temperature bonding process between the light-emitting element and the connecting electrode can flow smoothly into the opening.

[0095] S204, Provide the light-emitting element body.

[0096] The light-emitting element body can be a light-emitting diode, specifically a micro light-emitting diode, such as micro-led or mini-led. The embodiments of the present invention do not limit the type of light-emitting element.

[0097] S205. A protective structure is prepared on the side light-emitting surface of the light-emitting element body, and the material of the protective structure includes fluoropolymer.

[0098] The protective structure can protect the side light-emitting surface of the light-emitting element body, and can prevent the bonding agent from adhering to the side light-emitting surface of the light-emitting element body during the bonding process between the light-emitting element and the connecting electrode, which would cause a short circuit between the P-type semiconductor layer and the cathode, and / or cause a short circuit between the N-type semiconductor layer and the anode electrode.

[0099] As one feasible implementation method, the preparation process of the protective structure is described below.

[0100] Figure 15 This is a flowchart of the preparation method of the first organic protective layer provided in the embodiments of the present invention. Figure 16 for Figure 15 A schematic diagram of the preparation method in the middle, combined with Figure 15 and Figure 16 As shown, the method for preparing the organic protective layer provided in this embodiment of the invention includes:

[0101] S2051. Provide a first transfer substrate and prepare a first transfer adhesive layer on one side of the first transfer substrate.

[0102] refer to Figure 16 Figure (a) shows a first transfer substrate 51, on one side of which a first transfer adhesive layer 52 may be disposed. The first transfer adhesive layer 52 subsequently serves as the adhesive for bonding the light-emitting element body 20a to the first transfer substrate 51, and the first transfer adhesive layer 52 contains carbon elements.

[0103] S2052, The light-emitting element body is transferred to the first transfer substrate in such a way that the first light-emitting surface is away from the first transfer adhesive layer.

[0104] refer to Figure 16 In Figure (b), the light-emitting element body 20a includes a light-emitting layer 201 and an electrode 202. The light-emitting layer 201 includes a first light-emitting surface 2011 and a side light-emitting surface 2012 connected to the first light-emitting surface 2011. The first light-emitting surface 2011 is the light-emitting surface of the light-emitting layer 201 away from the electrode 202. The first light-emitting surface 2011 can be understood as the main light-emitting surface of the light-emitting element body 20a. When the light-emitting element body 20a is transferred to the first transfer substrate 51, the light-emitting element body 20a is transferred to the first transfer substrate 51 in such a way that the first light-emitting surface 2011 is away from the first transfer adhesive layer 52, that is, the light-emitting element body 20a is transferred to the first transfer substrate 51 in such a way that the electrode 202 is facing the first transfer adhesive layer 52.

[0105] It should be noted that the light-emitting elements transferred to the first transfer substrate 51 can be light-emitting elements of the same color.

[0106] S2053. The first transfer adhesive layer exposed by two adjacent light-emitting element bodies is etched by etching gas to prepare a protective structure on the side light-emitting surface of the light-emitting element body.

[0107] refer to Figure 16 In Figure (c), when the light-emitting element body 20a is transferred to the first transfer substrate 51, the light-emitting element body 20a covers part of the first transfer adhesive layer 52 and exposes part of the first transfer adhesive layer 52, with the first transfer adhesive layer 52 between two adjacent element bodies 20a exposed. After the light-emitting element body 20a is transferred, the first transfer adhesive layer 52 between two adjacent light-emitting element bodies 20a needs to be removed to facilitate the normal execution of subsequent transfer processes of the light-emitting element body 20a.

[0108] In this embodiment of the invention, the light-emitting element body 20a is creatively used as the etching mask for the first transfer adhesive layer 52. The first transfer adhesive layer 52 exposed between two adjacent light-emitting element bodies 20a is etched by an etching gas, that is, the first transfer adhesive layer 52 is etched by a self-aligned process. The etching gas may include fluorine gas, or the etching gas may include fluorine element. When the first transfer adhesive layer 52 containing carbon element is etched by the etching gas, the etching product containing fluorine element and carbon element overflows through the channel between two adjacent light-emitting element bodies 20a. The etching product can naturally adhere to the side light-emitting surface 2012 of the light-emitting element body 20a, and there will not be too much residue on the first light-emitting surface 2011 of the light-emitting element body 20a. Therefore, a protective structure 20b including fluoropolymer can be formed on the side light-emitting surface 2012 of the light-emitting element body 20a. In other words, the protective structure 20b is formed during the etching process of the first transfer adhesive layer 52. Or, the fabrication process of the protective structure 20b is the same as that of the etching process of the first transfer adhesive layer 52; no separate fabrication process is added due to the addition of the protective structure 20b, making the fabrication process of the protective structure 20b simple. Furthermore, the protective structure 20b can ensure that it covers the side light-emitting surface 2012 of the light-emitting element body 20a without affecting the first light-emitting surface 2011, ensuring normal light emission and display from the first light-emitting surface 2011. Moreover, the fabrication process of the protective structure 20b will not leave any other impurities, such as metal particles or debris, ensuring that the performance of the light-emitting element body 20a will not be affected by the addition of the protective structure 20b.

[0109] It should be noted that after the fabrication process of the protective structure is completed, other transfer processes can be carried out, such as transfer to the second transfer substrate and transfer to the driving substrate. Subsequent processes will not be described in detail here.

[0110] In summary, the above embodiments are illustrated by taking the preparation of a protective structure during the transfer of the light-emitting element body to the first transfer substrate as an example. Next, the preparation of a protective structure during other transfer processes of the light-emitting element body will be illustrated by example.

[0111] As another feasible implementation method, another preparation process for the protective structure is described below.

[0112] Figure 17 This is a flowchart of the preparation method of the second organic protective layer provided in the embodiments of the present invention. Figure 18 for Figure 17 A schematic diagram of the preparation method in the middle, combined with Figure 17 and Figure 18 As shown, the method for preparing the organic protective layer provided in this embodiment of the invention includes:

[0113] S2051', Provide a first transfer substrate and transfer the light-emitting element body to the first transfer substrate in such a way that the first light-emitting surface is away from the first transfer substrate.

[0114] refer to Figure 18 In Figure (a), the light-emitting element body 20a includes a light-emitting layer 201 and an electrode 202. The light-emitting layer 201 includes a first light-emitting surface 2011 and a side light-emitting surface 2012 connected to the first light-emitting surface 2011. The first light-emitting surface 2011 is the light-emitting surface of the light-emitting layer 201 away from the electrode 202. The first light-emitting surface 2011 can be understood as the main light-emitting surface of the light-emitting element body 20a. When the light-emitting element body 20a is transferred to the first transfer substrate 51, the light-emitting element body 20a is transferred to the first transfer substrate 51 in such a way that the first light-emitting surface 2011 is away from the first transfer substrate 51, that is, the light-emitting element body 20a is transferred to the first transfer substrate 51 in such a way that the electrode 202 is facing the first transfer substrate 51.

[0115] It should be noted that the light-emitting elements transferred to the first transfer substrate 51 can be light-emitting elements of the same color.

[0116] S2052', Provide a second transfer substrate and prepare a second transfer adhesive layer on one side of the second transfer substrate.

[0117] refer to Figure 18 Figure (b) shows a second transfer substrate 53, on one side of which a second transfer adhesive layer 54 may be disposed. The second transfer adhesive layer 54 subsequently serves as the adhesive for bonding the light-emitting element body 20a to the second transfer substrate 53, and the second transfer adhesive layer 54 contains carbon elements.

[0118] S2053', The light-emitting element body is transferred to the second transfer substrate with the first light-emitting surface facing the second transfer adhesive layer.

[0119] refer to Figure 18 In Figure (c), when the light-emitting element body 20a is transferred to the second transfer substrate 53, the light-emitting element body 20a is transferred to the second transfer substrate 53 with the first light-emitting surface 2011 facing the second transfer adhesive layer 54, that is, the light-emitting element body 20a is transferred to the second transfer substrate 53 with the electrode 202 facing away from the second transfer adhesive layer 54.

[0120] It should be noted that the light-emitting elements transferred to the second transfer substrate 53 can be light-emitting elements of different colors, such as red light-emitting elements, green light-emitting elements and blue light-emitting elements, so that the light-emitting elements of different colors can be transferred to the driving substrate to form a display panel, thus ensuring the color display requirements of the display panel.

[0121] S2054': The second transfer adhesive layer exposed by two adjacent light-emitting element bodies is etched by etching gas to prepare a protective structure on the side light-emitting surface of the light-emitting element body.

[0122] refer to Figure 18 In Figure (d), when the light-emitting element body 20a is transferred to the second transfer substrate 51, the light-emitting element body 20a covers a portion of the second transfer adhesive layer 54 and exposes a portion of the second transfer adhesive layer 54, with the second transfer adhesive layer 54 between two adjacent element bodies 20a exposed. After the light-emitting element body 20a is transferred, the second transfer adhesive layer 54 between two adjacent light-emitting element bodies 20a needs to be removed to facilitate the normal execution of subsequent transfer processes of the light-emitting element body 20a.

[0123] In this embodiment of the invention, the light-emitting element body 20a is creatively used as the etching mask for the second transfer adhesive layer 54. The second transfer adhesive layer 54 exposed between two adjacent light-emitting element bodies 20a is etched by an etching gas, that is, the second transfer adhesive layer 54 is etched by a self-aligned process. The etching gas may include fluorine gas, or the etching gas may include fluorine element. When the second transfer adhesive layer 54 containing carbon element is etched by the etching gas, the etching product containing fluorine element and carbon element overflows through the channel between two adjacent light-emitting element bodies 20a. The etching product can naturally adhere to the side light-emitting surface 2012 of the light-emitting element body 20a, and there will not be too much residue on the first light-emitting surface 2011 of the light-emitting element body 20a. Therefore, a protective structure 20b including fluoropolymer can be formed on the side light-emitting surface 2012 of the light-emitting element body 20a. In other words, the protective structure 20b is formed during the etching process of the second transfer adhesive layer 54. Or, the fabrication process of the protective structure 20b is the same as that of the etching process of the second transfer adhesive layer 54; no separate fabrication process is added due to the addition of the protective structure 20b, making the fabrication process of the protective structure 20b simple. Furthermore, the protective structure 20b ensures that it covers the side light-emitting surface 2012 of the light-emitting element body 20a without affecting the first light-emitting surface 2011, guaranteeing normal light emission and display from the first light-emitting surface 2011. Moreover, the fabrication process of the protective structure 20b leaves no residue of other impurities, such as metal particles or debris, ensuring that the performance of the light-emitting element body 20a is not affected by the addition of the protective structure 20b.

[0124] After the fabrication process of the protective structure is completed, other transfer processes can be carried out, such as transferring to the driving substrate. Subsequent processes will not be described in detail here.

[0125] In summary, by forming a protective structure on the side of the light-emitting element during the etching process of the transfer adhesive layer on the transfer substrate during the transfer of the light-emitting element itself, the light-emitting element can serve as a mask structure for the transfer adhesive layer. This eliminates the need for a separate mask during the etching of the transfer adhesive layer, reducing mask mold costs and display panel manufacturing costs. Furthermore, by fabricating a protective structure that only covers the side of the light-emitting element during the etching process, no additional fabrication process is required, simplifying the fabrication process. The protective structure also ensures that it covers the side light-emitting surface of the light-emitting element without affecting the first light-emitting surface, guaranteeing normal light emission and display from the first light-emitting surface. Moreover, the fabrication process of the protective structure leaves no residue of impurities, such as metal particles or debris, ensuring that the performance of the light-emitting element is not affected by the addition of the protective structure.

[0126] S206. Welding a light-emitting element and a connecting electrode to form a connecting wire in the opening, the connecting wire being electrically connected to the connecting electrode and at least covering the sidewall of the opening.

[0127] The above-described fabrication method not only allows the bonding compound overflowing during the bonding process between the connecting electrode and the light-emitting element to form connecting wires within the opening, thus preventing short circuits in the light-emitting element caused by compound overflow during bonding—such as short circuits between different light-emitting elements and / or between different electrodes of the same light-emitting element—but also improves bonding yield by reducing the risk of bonding short circuits. Furthermore, by fabricating a protective structure on the side of the light-emitting element body, short circuits caused by compound overflow and the light-emitting layer of the light-emitting element body during bonding are also prevented, avoiding short circuits between different light-emitting elements and / or between different electrodes of the same light-emitting element. This further improves bonding yield by reducing the risk of bonding short circuits.

[0128] Based on the same inventive concept, embodiments of the present invention also provide a display device. Figure 19 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention, such as... Figure 19 As shown, the display device includes the display panel 100 in the above embodiments. Therefore, the display device provided in this embodiment also has the beneficial effects described in the above embodiments, which will not be repeated here. For example, the display device can be an electronic device such as a mobile phone, computer, smart wearable device (e.g., smartwatch), and in-vehicle display device. This embodiment of the invention does not limit this.

[0129] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that, Includes driving substrate and light-emitting element; The driving substrate includes a substrate, a support layer located on one side of the substrate, and a connecting electrode located on the side of the support layer away from the substrate; the light-emitting element is electrically connected to the connecting electrode; The display panel further includes an opening disposed in the support layer, which penetrates at least a portion of the support layer along the thickness direction of the display panel; The display panel also includes connecting wires that at least cover the sidewalls of the opening, and the connecting wires are electrically connected to the connecting electrodes; The light-emitting element includes a light-emitting element body and a protective structure covering the light-emitting surface of the light-emitting element body. The protective structure is an insulating protective layer and includes an organic protective structure. The organic protective structure is formed by performing a self-aligned etching process on the adhesive layer on the surface of the transfer substrate during the transfer of the light-emitting element.

2. The display panel according to claim 1, characterized in that, The display panel also includes a bridging electrode located on the side of the support layer away from the connecting electrode; Along the thickness direction of the display panel, the opening penetrates the support layer and exposes a portion of the bridging electrode, and the connecting wire is electrically connected to the bridging electrode.

3. The display panel according to claim 2, characterized in that, The connecting wire covers at least a portion of the bottom surface of the opening.

4. The display panel according to claim 1, characterized in that, Along a first direction, the opening is located on at least one side of the connecting electrode; the first direction is parallel to the plane of the substrate.

5. The display panel according to claim 4, characterized in that, The connecting electrodes include an anode connecting electrode and a cathode connecting electrode; The opening includes an anode opening and a cathode opening, and the anode opening and the cathode opening are set independently. Along the first direction, the anode opening is located on the side of the anode connecting electrode away from the cathode connecting electrode, and / or, the anode opening is located on the side of the anode connecting electrode closer to the cathode connecting electrode; Along the first direction, the cathode opening is located on the side of the cathode connecting electrode away from the anode connecting electrode, and / or the cathode opening is located on the side of the cathode connecting electrode closer to the anode connecting electrode.

6. The display panel according to claim 1, characterized in that, Along the thickness direction of the display panel, the opening overlaps with the connecting electrode.

7. The display panel according to claim 6, characterized in that, The connecting electrodes include an anode connecting electrode and a cathode connecting electrode; The opening includes an anode opening and a cathode opening, and the anode opening and the cathode opening are set independently. Along the thickness direction of the display panel, the anode connecting electrode connects to and covers the anode opening, and the cathode connecting electrode covers the cathode opening.

8. The display panel according to claim 6, characterized in that, The opening includes a first opening portion and a second opening portion, wherein the first opening portion is located on the side of the second opening portion closer to the light-emitting element; The opening area of ​​the first opening portion is greater than the opening area of ​​the second opening portion.

9. The display panel according to claim 1, characterized in that, The opening includes a plurality of sub-openings and sub-opening sidewalls defining the sub-openings; Along the thickness direction of the display panel, at least a portion of the thickness of the sub-opening sidewall is less than or equal to the thickness of the support layer.

10. The display panel according to claim 1, characterized in that, The connecting electrodes include an anode connecting electrode and a cathode connecting electrode; The opening includes an anode opening and a cathode opening, and the anode opening and the cathode opening are set independently. There are two independently configured anode openings and two interconnected cathode openings.

11. The display panel according to claim 2, characterized in that, The display panel further includes a connection via disposed in the support layer, and the connection via penetrates the support layer along the thickness direction of the display panel; The connecting electrode and the bridging electrode are electrically connected through at least two connecting vias.

12. The display panel according to claim 1, characterized in that, The materials used in the organic protective structure include fluoropolymers.

13. A method for manufacturing a display panel, characterized in that, include: A substrate is provided and a support layer is prepared on one side of the substrate; The support layer is patterned to create openings in the support layer; A connection electrode is fabricated on the side of the support layer away from the substrate; A light-emitting element is provided and the light-emitting element and the connecting electrode are soldered to form a connecting wire in the opening. The connecting wire is electrically connected to the connecting electrode and at least covers the sidewall of the opening. The light-emitting element includes a light-emitting element body and a protective structure covering the light-emitting surface of the light-emitting element body. The protective structure is an insulating protective layer and includes an organic protective structure. The organic protective structure is formed by performing a self-aligned etching process on the adhesive layer on the surface of the transfer substrate during the transfer of the light-emitting element.

14. The preparation method according to claim 13, characterized in that, Provide light-emitting elements, including: Provides the light-emitting element body; A protective structure is prepared on the side light-emitting surface of the light-emitting element body, and the material of the protective structure includes fluoropolymer.

15. The preparation method according to claim 14, characterized in that, The light-emitting element body includes a light-emitting layer and an electrode. The light-emitting layer includes a first light-emitting surface and a side light-emitting surface connected to the first light-emitting surface. The first light-emitting surface is the light-emitting surface of the light-emitting layer away from the electrode. A protective structure is fabricated on the side light-emitting surface of the light-emitting element body, including: A first transfer substrate is provided, and a first transfer adhesive layer is prepared on one side of the first transfer substrate; The light-emitting element body is transferred to the first transfer substrate in such a way that the first light-emitting surface is away from the first transfer adhesive layer; The first transfer adhesive layer exposed between two adjacent light-emitting element bodies is etched with an etching gas to prepare a protective structure on the side light-emitting surface of the light-emitting element body.

16. The preparation method according to claim 14, characterized in that, The light-emitting element body includes a light-emitting layer and an electrode. The light-emitting layer includes a first light-emitting surface and a side light-emitting surface connected to the first light-emitting surface. The first light-emitting surface is the light-emitting surface of the light-emitting layer away from the electrode. A protective structure is fabricated on the side light-emitting surface of the light-emitting element body, including: A first transfer substrate is provided, and the light-emitting element body is transferred to the first transfer substrate in such a way that the first light-emitting surface is away from the first transfer substrate. A second transfer substrate is provided, and a second transfer adhesive layer is prepared on one side of the second transfer substrate; The light-emitting element body is transferred to the second transfer substrate with the first light-emitting surface facing the second transfer adhesive layer; The second transfer adhesive layer exposed between two adjacent light-emitting element bodies is etched with an etching gas to prepare a protective structure on the side light-emitting surface of the light-emitting element body.

17. A display device, characterized in that, Includes the display panel as described in any one of claims 1-12.

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