Unit-level ultra-thin glass manufactured by cutting and post-processing methods of glass

Abstract

The unit-level ultra-thin glass (4) manufactured by the cutting and post-processing method of glass according to the present application is a unit-level ultra-thin glass (4) arranged on the front surface of the display part of an electrical or electronic device, and a bevel-shaped cutting part (41) in a bevel shape is formed at the side end of the unit-level ultra-thin glass (4) in contact with the front surface of the display part. Moreover, the height (H) of the bevel-shaped cutting part (41) is 5% or more and 50% or less of the thickness of the unit-level ultra-thin glass (4). Moreover, the width (W) of the bevel-shaped cutting part (41) is 10% or more and 300% or less of the thickness of the unit-level ultra-thin glass (4), and the unit-level ultra-thin glass (4) is bent toward the front of the display part.

Description

Technical Field

[0001] This invention relates to a unit-scale ultrathin glass manufactured by glass cutting and post-processing methods, and more particularly to an invention that improves the bending characteristics and durability of unit-scale ultrathin glass by forming a beveled cut at one end of a side surface of the unit-scale ultrathin glass that contacts the display portion of an electrical or electronic device. Background Technology

[0002] In recent years, due to the trend of thinner and lighter electronic products such as smartphones, traditional glass or acrylic is being replaced by ultra-thin glass.

[0003] This ultra-thin glass is used as a display window for portable electronic products such as mobile phones, PMPs, and MP3 players. The thinner the ultra-thin glass, the better its design and portability.

[0004] In order to manufacture unit-level ultra-thin glass for use in various electronic products, the ultra-thin glass in the mother plate state is cut into certain sizes.

[0005] At this point, microcracks or chipping that occur during the cutting process will reduce the strength of the cut unit-level ultrathin glass. To minimize this, additional face cutting and chamfering processes are required.

[0006] However, in this process, because the ultra-thin glass in the motherboard state is very thin, there is a risk of damage during the face cutting and chamfering processes. Furthermore, individual face cutting and chamfering of the unit-level ultra-thin glass used in the product requires a lot of manpower and time, resulting in excessive losses.

[0007] To address this issue, a method is proposed that involves joining and stacking ultra-thin glass in a motherboard state and then processing them into a single unit.

[0008] The method for joining and stacking the ultra-thin glass in the motherboard state to process it into a whole includes a first embodiment using CNC machining and a second embodiment using laser beam machining. The first embodiment using CNC machining is described in detail below.

[0009] First, the first embodiment generally includes the following steps: stacking two or more mother-plate ultra-thin glass sheets, coating the two or more mother-plate ultra-thin glass sheets with a resin in a preset pattern to maintain a height gap; cutting the two or more stacked mother-plate ultra-thin glass sheets using CNC machining to cut the mother-plate ultra-thin glass sheets into unit-level ultra-thin glass sheets applicable to various electrical and electronic products; chemically healing the multiple stacked unit-level ultra-thin glass sheets to make the cut surfaces of the unit-level ultra-thin glass sheets flat; cleaning the healed unit-level ultra-thin glass sheets; completely curing the resin coated between the unit-level ultra-thin glass sheets to make them easy to peel off; peeling off the resin bonded between the unit-level ultra-thin glass sheets; cleaning the unit-level ultra-thin glass sheets after removing the resin; chemically healing the cleaned unit-level ultra-thin glass sheets; cleaning the chemically healed unit-level ultra-thin glass sheets; strengthening the cleaned unit-level ultra-thin glass sheets before sending them to subsequent processes.

[0010] The step of stacking two or more ultra-thin glass substrates and coating the space between the two or more ultra-thin glass substrates with a resin in a predetermined pattern to maintain a height gap includes the following steps: Step 1-1, coating the upper surface of the ultra-thin glass substrates with resin; Step 1-2, after stacking the ultra-thin glass substrates on the coated resin, spreading the resin thinly; Step 1-3, curing the thinly spread resin with ultraviolet light; and repeating Step 1-1 to Step 1-3 to stack two or more ultra-thin glass substrates.

[0011] However, in the case of the first embodiment, it is necessary to perform the following steps: laminating two or more master-state ultra-thin glass sheets with resin; including a CNC cutting process for cutting the master-state ultra-thin glass sheets into unit-level ultra-thin glass sheets through rough cutting, medium cutting, and fine cutting; a process for smoothing the cut surfaces of the unit-level ultra-thin glass sheets by chemically healing the laminated unit-level ultra-thin glass sheets; a process for completely curing the resin so that the laminated unit-level ultra-thin glass sheets can be easily separated; a cleaning process for the unit-level ultra-thin glass sheets after resin peeling; and a cleaning process after chemically healing the unit-level ultra-thin glass sheets. Therefore, there are problems such as long manufacturing time and high production cost of unit-level ultra-thin glass sheets.

[0012] Next, the second embodiment will be described in detail.

[0013] The second embodiment of processing using a laser beam generally includes: a first step, irradiating the ultrathin glass in a motherboard state with a laser beam along the cutting line to cut the ultrathin glass in a motherboard state into unit-level ultrathin glass; a second step, stacking two or more cut unit-level ultrathin glass, and coating the space between the vertically arranged unit-level ultrathin glass with a resin to maintain a height gap; a third step, chemically healing the two or more stacked unit-level ultrathin glass to make the cut surfaces of the cut unit-level ultrathin glass smooth; a fourth step, The process involves several steps: 1) Cleaning the stacked unit-level ultrathin glass; 2) Fully curing the resin coated between the stacked unit-level ultrathin glass sheets to facilitate easy peeling; 3) After peeling off the resin bonded to the unit-level ultrathin glass, cleaning the separated individual unit-level ultrathin glass sheets; 4) Chemically healing the cleaned unit-level ultrathin glass; and 5) Cleaning the chemically healed unit-level ultrathin glass, performing a strengthening process, and then sending it to subsequent processes.

[0014] Furthermore, the second step of stacking two or more cut unit-level ultrathin glass panes and coating the space between the vertically arranged unit-level ultrathin glass panes with a resin for maintaining a height gap includes: step 2-1, stacking two or more of the cut unit-level ultrathin glass panes and coating the space between a pair of vertically arranged unit-level ultrathin glass panes with a resin for maintaining a height gap; step 2-2, after stacking the unit-level ultrathin glass panes on the coated resin, spreading the resin thinly; step 2-3, curing the spread resin flat with ultraviolet light; and repeating steps 2-1 to 2-3 to stack two or more cut unit-level ultrathin glass panes.

[0015] However, the method using the laser beam requires steps such as stacking two or more cut unit-level ultrathin glasses with resin, completely curing the resin coated between the stacked unit-level ultrathin glasses, peeling off the resin and separating the stacked unit-level ultrathin glasses. Therefore, there are problems such as long manufacturing time and high production cost of unit-level ultrathin glasses.

[0016] Furthermore, CNC glass cutting methods often result in defects such as microcracks or chipping on the cut surface, and unit-level ultrathin glass is prone to damage.

[0017] Thermal damage caused by defects such as microcracks or chipping due to CNC machining can also lead to a decrease in flexural strength after strengthening of unit-level ultrathin glass.

[0018] To compensate for weak areas on CNC or laser-cut surfaces, resin is mainly used to stack multiple layers of unit-level ultrathin glass, and the cut surfaces are chemically treated to heal defects or thermal damage that occur during glass cutting, as in the first and second embodiments.

[0019] However, these surface treatment methods also have limitations, so it is necessary to ensure that damage to ultra-thin glass is minimized when using CNC or laser processes to cut it. However, this method suffers from reduced process applicability and increased processing time for unit-level ultra-thin glass used in various electrical and electronic products. If additional surface treatment processes are performed, the manufacturing process for unit-level ultra-thin glass becomes very complex, which may increase the cost of manufacturing the product.

[0020] Meanwhile, as prior art to this invention, there is Korean Patent Application No. 10-2010-0026394 entitled "Efficient Processing Method for Thin Glass Sheets", which includes the following steps: coating a bonding material between multiple stacked glass sheets to bond the multiple glass sheets together, and uniformly cutting the bonded glass sheets into block units; performing surface cutting processing on the thin sheet material of the block units; and polishing the cut surfaces by the rotational force of a brush and abrasive.

[0021] However, the efficient processing method for thin glass requires face cutting and polishing processes, which cannot completely remove defects such as microcracks or chipping from the cut surface of the thin glass.

[0022] Content of the invention

[0023] The technical problem that the invention aims to solve

[0024] Therefore, the present invention is intended to solve the problems described above. One object of the present invention is to provide a unit-level ultra-thin glass manufactured by a glass cutting and post-processing method, which can reduce the production costs of glass cutting and post-processing steps in manufacturing unit-level ultra-thin glass (UTG) for various electrical and electronic products.

[0025] Furthermore, another object of the present invention is to provide a unit-level ultrathin glass manufactured by a glass cutting and post-processing method, thereby reducing the manufacturing cost of unit-level ultrathin glass by simplifying the manufacturing process.

[0026] Furthermore, another object of the present invention is to provide a unit-level ultrathin glass manufactured by a glass cutting and post-processing method, wherein defects or thermal damage around the glass cut surface generated during glass cutting are removed by selective chemical treatment, thereby improving the durability of the finished unit-level ultrathin glass.

[0027] Furthermore, another objective of the present invention is to provide a unit-level ultrathin glass manufactured by glass cutting and post-processing methods that exhibits excellent bending characteristics and durability.

[0028] Technical solutions for solving the problem

[0029] To achieve the aforementioned objective, the unit-level ultra-thin glass 4 manufactured according to the present invention using a glass cutting and post-processing method is a unit-level ultra-thin glass 4 disposed on the front surface of a display section of an electrical or electronic device. A beveled cut portion 41 is formed at the end of one side of the unit-level ultra-thin glass 4 that faces and contacts the front surface of the display section. The height H of the beveled cut portion 41 is 5% to 50% of the thickness T of the unit-level ultra-thin glass 4. The width W of the beveled cut portion 41 is 10% to 300% of the thickness T of the unit-level ultra-thin glass 4. The unit-level ultra-thin glass 4 is curved towards the front of the display section. The inclination angle S of the side portion S of the unit-level ultra-thin glass 4 relative to the horizontal plane is 85 degrees to 95 degrees. The glass cutting and post-processing method includes: step (S1), coating one side of the ultra-thin glass 1 in the mother plate state with a coating liquid for preventing contact with chemicals to perform selective chemical treatment; step (S2), forming a coating film 2 on one side of the ultra-thin glass 1 in the mother plate state by drying the coating liquid; step (S3), cutting the ultra-thin glass 1 in the mother plate state to cut unit-level ultra-thin glass 4 for display parts of electrical or electronic equipment from the ultra-thin glass 1 in the mother plate state; step (S4), performing selective chemical treatment on the cut unit-level ultra-thin glass 4 to heal the cut surface of the unit-level ultra-thin glass 4 to remove heat damage and defective areas around the cut surface of the unit-level ultra-thin glass 4 generated during the cutting process; step (S5), removing the coating film 2 of the unit-level ultra-thin glass 4; and step (S6), chemically healing the surface of the unit-level ultra-thin glass 4 after the coating film 2 is removed to remove defects or blemishes on the surface of the unit-level ultra-thin glass 4 after the coating film 2 is removed. In step (S3), when cutting the ultra-thin glass 1 in its mother state to cut unit-level ultra-thin glass 4 for display sections of electrical or electronic equipment, if the coating 2 is formed only on one side of the ultra-thin glass 1 in its mother state, a laser beam (beam) output from an infrared laser 3 with a wavelength of 1000 nm or higher is irradiated onto the surface of the ultra-thin glass 1 in its mother state where the coating 2 is not formed, to cut the ultra-thin glass 1 in its mother state and the coating 2. The infrared laser 3 is a nanosecond infrared laser 3, a picosecond infrared laser 3, or a femtosecond infrared laser 3, and the infrared laser 3 outputs a Bessel beam. In step (S3), when cutting the ultra-thin glass 1 in its mother state to cut unit-level ultra-thin glass 4 for display sections of electrical or electronic equipment, a diamond wheel or a diamond saw blade can be used as the cutting tool for the ultra-thin glass 1 in its mother state.

[0030] The effects of the invention

[0031] The unit-level ultrathin glass 4 manufactured according to the present invention through glass cutting and post-processing methods can reduce the manufacturing time and cost of unit-level ultrathin glass 4 by simplifying the manufacturing process.

[0032] Furthermore, the present invention can remove defects or thermal damage around the glass cut surface generated when using laser cutting glass through selective chemical treatment, thereby improving the durability of the finished unit-level ultrathin glass 4 and increasing production efficiency by reducing defective products.

[0033] Furthermore, the present invention has excellent bending characteristics and durability, making it suitable for foldable devices that require frequent folding and unfolding. Attached Figure Description

[0034] Figure 1 To illustrate the formation of a beveled cut at one end of a unit-level ultrathin glass through selective chemical treatment,

[0035] Figure 2 This is a flowchart of glass cutting and post-processing methods.

[0036] Figure 3 To illustrate the process of cutting the ultrathin glass substrate and the coating by irradiating the uncoated surface of the ultrathin glass substrate with an infrared laser when a coating is formed only on one side of the substrate, the diagram shows...

[0037] Figure 4 This diagram illustrates the unit-level ultra-thin glass that curves forward towards the display section.

[0038] Figure 5a Example 1 is a unit-level ultrathin glass manufactured by the present invention.

[0039] Figure 5b Example 2 of a unit-level ultrathin glass manufactured by the present invention.

[0040] Figure 5c As a comparative example for comparing the bending strength with the present invention, a unit-level ultrathin glass without beveled cuts is shown.

[0041] Figure 5d The bending strength of each embodiment and comparative example is shown when the unit-level ultrathin glass 4 shown in Embodiment 1, Embodiment 1-1, Embodiment 2, Embodiment 2-1 and the comparative example is folded to form a concave upper surface center of the unit-level ultrathin glass 4, and the minimum, maximum, average and standard deviation of the bending strength of each embodiment and comparative example are shown in the form of a table.

[0042] Explanation of reference numerals in the attached figures

[0043] 1: Motherboard state: Ultra-thin glass 2: Coating

[0044] 3: Infrared laser; 4: Unit-level ultra-thin glass

[0045] 41: Beveled Cut Section Detailed Implementation

[0046] The present invention will now be described in detail with reference to the accompanying drawings.

[0047] like Figure 1 As shown, the unit-level ultra-thin glass 4 manufactured according to the present invention by glass cutting and post-processing method is a unit-level ultra-thin glass 4 provided on the front surface of the display part of an electrical or electronic device, and a beveled cut portion 41 is formed on the side end of the unit-level ultra-thin glass 4 that is in contact with the front surface of the display part.

[0048] The height H of the beveled cut section 41 is more than 5% and less than 50% of the thickness T of the unit-level ultra-thin glass 4.

[0049] The width W of the beveled cut portion 41 is more than 10% and less than 300% of the thickness T of the unit-level ultra-thin glass 4.

[0050] The unit-level ultra-thin glass 4 bends towards the front of the display section.

[0051] The side S of the unit-level ultra-thin glass 4 has an inclination angle of 85 degrees to 95 degrees relative to the horizontal plane, preferably 90 degrees.

[0052] like Figure 2As shown, the glass cutting and post-processing method includes: step (S1), coating one side of the ultra-thin glass 1 in the mother plate state with a coating liquid for preventing contact with chemicals to perform selective chemical treatment; step (S2), forming a coating film 2 on one side of the ultra-thin glass 1 in the mother plate state by drying the coating liquid; step (S3), cutting the ultra-thin glass 1 in the mother plate state to cut unit-level ultra-thin glass 4 for the display part of electrical or electronic equipment; step (S4), selectively chemically treating the cut unit-level ultra-thin glass 4 to heal the cut surface of the unit-level ultra-thin glass 4 to remove heat damage and defective areas around the cut surface of the unit-level ultra-thin glass 4 generated during the cutting process; step (S5), removing the coating film 2 of the unit-level ultra-thin glass 4; and step (S6), chemically healing the surface of the unit-level ultra-thin glass 4 after the coating film 2 is removed to remove defects or blemishes on the surface of the unit-level ultra-thin glass 4 after the coating film 2 is removed.

[0053] The thickness of the motherboard ultrathin glass 1 and the unit-level ultrathin glass 4 is less than 100 μm.

[0054] The thickness of the coating 2 formed on either side of the ultrathin glass 1 in the mother plate state is 1 μm to 30 μm.

[0055] The ultra-thin glass 1 in the mother plate state refers to the ultra-thin glass 1 in its original state before the unit-level ultra-thin glass 4 is extracted from the ultra-thin glass 1 in the mother plate state state, and can also be called the mother glass.

[0056] The unit-level ultrathin glass 4 is an ultrathin glass cut and separated from the mother plate state ultrathin glass 1.

[0057] The ultra-thin glass 1 in the motherboard state is made of sodium alumino-silicate glass.

[0058] like Figure 3 As shown, in step (S3) of cutting the mother-plate ultra-thin glass 1 to cut out unit-level ultra-thin glass 4 for the display section of electrical or electronic equipment, when the coating 2 is formed only on one side of the mother-plate ultra-thin glass 1, a laser beam (Beam) output from an infrared laser 3 with a wavelength of 1000 nm or more is irradiated onto the surface of the mother-plate ultra-thin glass 1 where the coating 2 is not formed, so as to cut the mother-plate ultra-thin glass 1 and the coating 2.

[0059] The infrared laser 3 is a nanosecond infrared laser 3, a picosecond infrared laser 3, or a femtosecond infrared laser 3, and the infrared laser 3 outputs a Bessel beam.

[0060] The infrared laser 3, used to output a Bessel beam, generates heat energy inside the motherboard-state ultrathin glass 1 and coating 2 to simultaneously cut the motherboard-state ultrathin glass 1 and coating 2.

[0061] The infrared laser 3 used to output a Bessel beam has a laser beam wavelength of 1020 nm to 1040 nm, a laser beam size of 1.4 μm to 1.8 μm, and a laser beam pulse duration of 3 ps to 7 ps.

[0062] Furthermore, the pulse repetition rate of the laser beam is 190 kHz to 210 kHz, and the pulse energy is 38 μJ to 42 μJ.

[0063] The coating solution is made of acrylic acid solution, polyethylene resin, polypropylene resin, polyvinyl chloride resin, or polystyrene solution.

[0064] In step (S1), when coating one side of the ultra-thin glass 1 in the motherboard state with a coating liquid to prevent contact with chemicals for selective chemical treatment, the coating liquid can be applied by slot die coating, spray coating, inkjet coating, bar coating, or screen printing.

[0065] In step (S2) of forming a coating film 2 on one side of the ultrathin glass 1 in the motherboard state by drying the coating liquid, the drying method of the coating liquid can use an infrared lamp, a hot air generator, a hot plate, an oven, etc., and a cluster type drying device can be used in an inline type drying device.

[0066] The unit-level ultrathin glass 4 is immersed in a healing solution to be healed, the healing solution containing ammonium difluoride, sulfuric acid, nitric acid, water and additives.

[0067] The additive is a surfactant used to improve healing performance, which increases the uniformity of healing by reducing surface tension.

[0068] The healing solution contains 0.5 to 0.9% by weight ammonium difluoride, 3 to 15% by weight sulfuric acid, 1 to 10% by weight nitric acid, 80 to 90% by weight water, and 0.01 to 0.1% by weight additives.

[0069] The surfactant may be a compound represented by the following chemical formula 1:

[0070] [Chemical Formula 1]

[0071] R1-OSO3 - HA +

[0072] Wherein, R1 is 4,8,12-triproplypentadecane, and A is triethanolamine.

[0073] In the step (S4) of selectively chemically treating the cut surface of the unit-level ultrathin glass 4 to heal the cut surface of the unit-level ultrathin glass 4 and remove the thermal damage and defects around the cut surface of the unit-level ultrathin glass 4 generated during the cutting process, a beveled cut portion 41 is formed on the side end of the unit-level ultrathin glass 4 that is in contact with the coating film 2 by the healing solution.

[0074] like Figure 1 As shown, the height H of the beveled cut portion 41 is more than 5% and less than 50% of the thickness T of the unit-level ultra-thin glass 4.

[0075] And, as Figure 1 As shown, the width W of the beveled cut portion 41 is more than 10% and less than 300% of the thickness T of the unit-level ultra-thin glass 4.

[0076] In step (S5) of removing the coating 2 from the unit-level ultrathin glass 4, the unit-level ultrathin glass 4 coated with the coating 2 is immersed in the coating 2 removal solution to melt and remove the coating 2.

[0077] The coating removal solution is an alkaline aqueous solution, and potassium hydroxide (KOH) can be used, wherein the temperature of the potassium hydroxide (KOH) is above 25 degrees Celsius.

[0078] However, in order to remove traces of coating 2 that exist on the surface of the unit-level ultrathin glass 4 due to the adhesion of part of the coating 2, an additional cleaning process can be performed after removing the coating 2.

[0079] Furthermore, the present invention also includes a step of strengthening the unit-level ultrathin glass 4 after surface healing is completed.

[0080] In the step of strengthening the unit-level ultrathin glass 4 after surface healing, the strengthening liquid used to strengthen the unit-level ultrathin glass 4 is a potassium nitrate melt.

[0081] The steps for strengthening the unit-level ultrathin glass 4 after surface healing include the following steps: preheating the unit-level ultrathin glass 4 to a range of 200°C to 400°C; immersing the preheated unit-level ultrathin glass 4 in a strengthening liquid maintained at 370°C to 470°C for strengthening; and removing the unit-level ultrathin glass 4 from the strengthening liquid and then slowly cooling it to room temperature.

[0082] Figure 5a Example 1 is an example of a unit-level ultrathin glass 4 manufactured by the present invention. Figure 5b Example 2 of the unit-level ultrathin glass 4 manufactured by the present invention. Figure 5c As a comparative example for comparing the bending strength with the present invention, a unit-level ultrathin glass 4 without the beveled cut portion 41 is shown. Figure 5d The bending strength of each embodiment and comparative example is shown when the unit-level ultrathin glass 4 shown in Embodiment 1, Embodiment 1-1, Embodiment 2, Embodiment 2-1 and the comparative example is folded to form a concave upper surface center of the unit-level ultrathin glass 4, and the minimum, maximum, average and standard deviation of the bending strength of each embodiment and comparative example are shown in the form of a table.

[0083] exist Figure 5a and Figure 5b In the figure, "T" is the thickness of the unit-level ultra-thin glass 4, "SH" is the side height S of the unit-level ultra-thin glass 4, "W" is the width of the beveled cut section 41, and "H" is the height of the beveled cut section 41.

[0084] Figure 5d Example 1-1 is a state diagram of the unit-level ultrathin glass shown in Example 1 after it has been flipped. Figure 5d Example 2-1 is a state diagram of the unit-level ultrathin glass after flipping, as shown in Example 2.

[0085] Figure 5d The bending strength of each embodiment and comparative example is shown when the unit-level ultrathin glass 4 shown in Embodiment 1, Embodiment 1-1, Embodiment 2, Embodiment 2-1 and the comparative example is folded to form a concave upper surface center of the unit-level ultrathin glass 4, and the minimum, maximum, average and standard deviation of the bending strength of each embodiment and comparative example are shown in the form of a table.

[0086] refer to Figure 5dIt can be seen that the bending strength of the unit-level ultrathin glass 4 with the beveled cut portion 41 (Example 1, Example 1-1, Example 2, Example 2-1) is higher than that of the unit-level ultrathin glass 4 without the beveled cut portion 41 (comparative example).

[0087] The unit-level ultrathin glass 4 manufactured according to the present invention through glass cutting and post-processing methods can reduce the manufacturing time and cost of unit-level ultrathin glass 4 by simplifying the manufacturing process.

[0088] Furthermore, the present invention can remove defects or thermal damage around the glass cut surface generated when using laser cutting glass through selective chemical treatment, thereby improving the durability of the finished unit-level ultrathin glass 4 and increasing production efficiency by reducing defective products.

[0089] Furthermore, the present invention has excellent bending characteristics and durability, making it suitable for foldable devices that require frequent folding and unfolding.

Claims

1. A unit-level ultrathin glass (4) manufactured by a glass cutting and post-processing method, the unit-level ultrathin glass (4) being disposed on the front surface of the display portion of an electrical or electronic device, characterized in that, A beveled cut section (41) is formed on one side end of the unit-level ultra-thin glass (4) that is in contact with the front surface of the display unit. In the unit-level ultrathin glass (4) manufactured by glass cutting and post-processing methods, the side (S) of the unit-level ultrathin glass (4) has an inclination angle of 85 degrees to 95 degrees relative to the horizontal plane. The glass cutting and post-processing methods include: Step (S1): Coating one side of the ultrathin glass (1) in the motherboard state with a coating liquid for preventing contact with chemicals, in order to carry out selective chemical treatment; Step (S2): A coating film (2) is formed on one side of the ultrathin glass (1) in the mother plate state by drying the coating liquid. Step (S3): Cut the mother plate state ultra-thin glass (1) to cut out unit-level ultra-thin glass (4) for the display part of electrical equipment or electronic equipment from the mother plate state ultra-thin glass (1). Step (S4): Selective chemical treatment is performed on the cut unit-level ultrathin glass (4) to heal the cut surface of the unit-level ultrathin glass (4) in order to remove the thermal damage and defective parts around the cut surface of the unit-level ultrathin glass (4) generated during the cutting process. Step (S5): Remove the coating (2) from the unit-level ultrathin glass (4); and Step (S6) involves chemically healing the surface of the unit-level ultrathin glass (4) after the coating (2) is removed, in order to remove defects or blemishes from the surface of the unit-level ultrathin glass (4) after the coating (2) is removed. In step (S3), which involves cutting the ultra-thin glass (1) in the mother plate state to cut unit-level ultra-thin glass (4) for the display section of electrical or electronic equipment, When the coating (2) is formed only on one side of the mother plate state ultra-thin glass (1), the laser beam output from the infrared laser (3) that generates a wavelength of more than 1000 nm will irradiate the surface of the mother plate state ultra-thin glass (1) where the coating (2) is not formed, so as to cut the mother plate state ultra-thin glass (1) and the coating (2). The infrared laser (3) is a nanosecond infrared laser (3), a picosecond infrared laser (3), or a femtosecond infrared laser (3). The infrared laser (3) outputs a Bessel beam. In the step (S4) of selectively chemically treating the cut surface of the unit-level ultrathin glass (4) to heal the cut surface of the unit-level ultrathin glass (4) and remove the thermal damage and defective parts around the cut surface of the unit-level ultrathin glass (4) generated during the cutting process, a beveled cut part (41) is formed on the side end of the unit-level ultrathin glass (4) that is in contact with the coating (2) by the healing solution. The wavelength of the laser beam of the infrared laser (3) that outputs the Bessel beam is 1020 nm to 1040 nm; The unit-level ultra-thin glass (4) bends towards the front of the display section.

2. The unit-level ultrathin glass (4) manufactured by the glass cutting and post-processing method according to claim 1, characterized in that, The height (H) of the beveled cut section (41) is more than 5% and less than 50% of the thickness (T) of the unit-level ultrathin glass (4).

3. The unit-level ultrathin glass (4) manufactured by the glass cutting and post-processing method according to claim 1, characterized in that, The width (W) of the beveled cut (41) is more than 10% and less than 300% of the thickness (T) of the unit-level ultrathin glass (4).

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