Chamfering device for optical module circuit board

Abstract

The application relates to the technical field of circuit board processing, and discloses a chamfering treatment equipment for an optical module circuit board, which comprises a rack, a moving mechanism, a positioning mechanism and a polishing mechanism. The moving mechanism is installed on the rack and is used for conveying the circuit board to the positioning mechanism. The positioning mechanism is installed on the rack and is used for positioning the circuit board. The polishing mechanism is movably installed on the rack and is used for chamfering the positioned circuit board. The moving mechanism comprises a mounting rack, a conveying belt and a supporting plate. The mounting rack is connected to the rack. The conveying belt is conveyed on the mounting rack and is used for conveying the circuit board. The supporting plate is located in a cavity enclosed by the conveying belt and is used for supporting the conveying belt. The positioning mechanism comprises a connecting rack and a pressing plate. The connecting rack is arranged on the rack. The pressing plate moves up and down on the connecting rack and is used for pressing the circuit board between the pressing plate and the supporting plate. The application can improve the chamfering processing quality of the circuit board.

Description

Technical Field

[0001] This application relates to the technical field of circuit board processing, and in particular to a chamfering equipment for optical module circuit boards. Background Technology

[0002] During the production of optical modules, due to the need for connection and fit, chamfers need to be made on the gold fingers on the edge of the circuit board to improve the smoothness of the circuit board during insertion and removal operations.

[0003] Currently, the chamfering of circuit boards is often done by hand, moving the circuit board through the grinding mechanism of the chamfering equipment. This can easily cause the circuit board to tilt during the grinding process, resulting in uneven chamfering and affecting the processing quality of the circuit board. Summary of the Invention

[0004] To improve the chamfering quality of circuit boards, this application provides a chamfering processing device for optical module circuit boards.

[0005] This application provides a chamfering processing device for optical module circuit boards, which adopts the following technical solution: A chamfering device for an optical module circuit board includes: a frame, a moving mechanism, a positioning mechanism, and a grinding mechanism; the moving mechanism is mounted on the frame and is used to convey the circuit board to the positioning mechanism; the positioning mechanism is mounted on the frame and is used to position the circuit board; the grinding mechanism is movably mounted on the frame and is used to chamfer the positioned circuit board. The moving mechanism includes a mounting frame, a conveyor belt, and a support plate; the mounting frame is connected to the frame; the conveyor belt is conveyed on the mounting frame for conveying the circuit board; the support plate is located in the cavity enclosed by the conveyor belt for supporting the conveyor belt. The positioning mechanism includes a connecting frame and a pressure plate; the connecting frame is mounted on the frame; the pressure plate moves up and down on the connecting frame to press the circuit board between the pressure plate and the support plate.

[0006] By adopting the above technical solution and integrating the moving mechanism, positioning mechanism and grinding mechanism, automatic conveying, precise positioning and efficient grinding of circuit boards are realized. This effectively reduces the problem of uneven chamfering caused by circuit board skewing in traditional hand-held grinding methods, and improves the processing quality and production efficiency of circuit boards.

[0007] Optionally, the connecting frame includes a side frame and a stop bar, the stop bar being located above the conveyor belt; the frame is provided with a grinding position and a material transfer position, the grinding position being located above the material transfer position, and the mounting frame moves up and down on the frame to drive the conveyor belt to move to the material transfer position or the grinding position; When the conveyor belt is located at the material transfer position, there is space between the conveyor belt and the stop bar for the circuit board to pass through; when the conveyor belt is located at the grinding position, the upper surface of the conveyor belt abuts against the stop bar, and the conveyor belt is conveyed in the opposite direction so that the side of the circuit board away from the side to be ground abuts against the stop bar, and the side of the circuit board to be ground is opposite to the grinding mechanism. At this time, the grinding mechanism can move to chamfer the circuit board.

[0008] By adopting the above technical solution, the circuit board can be moved to the correct position and posture before grinding by using the cooperation of the baffle and the conveyor belt, and then the circuit board ribs can be positioned, thereby further improving the uniformity of chamfering and processing accuracy.

[0009] Optionally, the length of the baffle extends perpendicular to the conveyor belt conveying direction, the frame is provided with an abutment position and a cleaning position along the length of the baffle, the pressure plate is installed on the baffle and is opposite to the abutment position, and the baffle is provided with a dust suction chamber at the cleaning position; The conveyor belt can move along the vertical conveying direction on the mounting frame, so that the conveyor belt is located at the contact position or the cleaning position; when the conveyor belt is located at the contact position and the polishing position, the circuit board is polished; when the conveyor belt is located at the cleaning position and the polishing position, the conveyor belt is cleaned; when the conveyor belt is located at the cleaning position and the material transfer position, the circuit board is loaded; when the conveyor belt is located at the contact position and the material transfer position, the circuit board is unloaded.

[0010] By adopting the above technical solution, the device can not only perform grinding operations, but also clean the conveyor belt when not grinding, as well as load and unload circuit boards, realizing multi-station integrated operation and improving the utilization rate and flexibility of the device.

[0011] Optionally, the baffle has bristles facing the conveyor belt at the location opposite the dust collection chamber.

[0012] By adopting the above technical solution and setting bristles at the cleaning position, dust and debris on the conveyor belt can be removed more effectively.

[0013] Optionally, the mounting frame includes a main frame, rotating rollers, and a conveyor sleeve; the main frame is mounted on the machine frame, and the rotating rollers are two in number and rotatably connected to the main frame, with the two rotating rollers being parallel to each other; the conveyor sleeve is used for the conveyor belt to be fitted onto, and the conveyor sleeve is two in number and is respectively fitted onto the two rotating rollers. When the rotating rollers rotate, they drive the conveyor sleeves to rotate, and the conveyor sleeves can move along the axial direction of the rotating rollers on the rotating rollers to drive the conveyor belt to move to the position opposite to the contact position or the cleaning position.

[0014] By adopting the above technical solution, the operation of switching the conveyor belt between the re-contact position and the cleaning position is realized through the cooperation of the conveyor sleeve and the rotating roller.

[0015] Optionally, the moving mechanism further includes a connecting bar and a driving component. The connecting bar is sleeved on the rotating roller, and the end of the conveying sleeve has a rotating ring, which is rotatably connected to the connecting bar. The driving component is mounted on the main frame and is used to drive the connecting bar to move along the length direction of the rotating roller, thereby driving the conveying sleeve to move.

[0016] By adopting the above technical solution, the connecting bar is moved by the driving component, which in turn moves the transmission sleeve that rotates on the connecting bar via the rotating ring.

[0017] Optionally, the inner wall of the conveying sleeve is provided with a guide protrusion, and the outer wall of the rotating roller has a guide groove for the guide protrusion to slide along a direction parallel to the axis of the rotating roller.

[0018] By adopting the above technical solution, the guide convex and guide groove cooperate to guide the movement of the conveyor sleeve on the rotating roller.

[0019] Optionally, the positioning mechanism further includes a limiting plate mounted on the frame, with the end of the conveyor belt away from the feed facing the limiting plate. The limiting plate is used to block the movement of the circuit board. When the circuit board abuts against the limiting plate, the circuit board is located between the stop bar and the limiting plate.

[0020] By adopting the above technical solution, the limiting plate provides obstruction to the movement of the circuit board, making it difficult for the circuit board to be completely moved off the conveyor belt along with the conveyor belt.

[0021] Optionally, the baffle includes an extension bar and a baffle plate. The extension bar moves along the conveyor belt in the conveying direction on the side frame, and the side frame has a limiting member for limiting the position of the baffle bar. The baffle plate is connected to the extension bar and is used for the circuit board to abut against it.

[0022] By adopting the above technical solution, the position of the baffle can be adjusted as needed to accommodate circuit boards of different sizes, thereby improving the adaptability and flexibility of the device.

[0023] In summary, this application includes at least one of the following beneficial effects: 1. The circuit board is conveyed to the grinding position by the moving mechanism and positioned by the positioning mechanism so that the circuit board is not easily tilted when the grinding mechanism grinds the circuit board, reducing manual operation errors and improving the yield rate. 2. By setting up a conveyor belt and a support plate, the conveyor belt can transport the circuit board, and the support plate supports the conveyor belt to ensure that the conveyor belt transports the circuit board smoothly. Attached Figure Description

[0024] Figure 1 This is a structural schematic diagram of an embodiment of this application; Figure 2 yes Figure 1 Side view; Figure 3 This is a schematic diagram of the structure of the moving mechanism according to an embodiment of this application; Figure 4 This is a cross-sectional view of the transmission sleeve according to an embodiment of this application; Figure 5 This is a schematic diagram of the positioning mechanism in an embodiment of this application; Figure 6 This is a structural schematic diagram of the positioning mechanism in an embodiment of this application from another angle.

[0025] Explanation of reference numerals in the attached drawings: 1. Frame; 2. Mounting frame; 201. Main frame; 202. Rotary roller; 203. Conveyor sleeve; 3. Conveyor belt; 4. Support plate; 5. Connecting strip; 6. Drive component; 7. Connecting frame; 71. Side frame; 72. Stop bar; 721. Extension strip; 722. Baffle; 8. Pressure plate; 9. Limiting plate; 10. Grinding position; 11. Material transfer position; 12. Abutment position; 13. Cleaning position; 14. Dust suction chamber; 15. Brush bristles; 16. 17. Rotating ring; 18. Guide protrusion; 19. Guide groove; 10. Limiting component; 191. Limiting nut; 20. First station; 21. Second station; 22. Third station; 23. Fourth station; 24. Vertical screw; 25. Guide rod; 26. Mounting base; 27. Electric telescopic rod; 28. Horizontal screw; 29. ​​Clearance opening; 30. Stand; 31. Grinding component; 311. Grinding head; 312. Rotating motor; 32. Dust suction pipe. Detailed Implementation

[0026] The following is in conjunction with the appendix Figure 1-6 This application will be described in further detail.

[0027] This application discloses a chamfering device for an optical module circuit board. (Refer to...) Figure 1 The chamfering equipment for optical module circuit boards includes a frame 1, a moving mechanism, a positioning mechanism, and a grinding mechanism. The frame 1 serves as the base for the moving mechanism, positioning mechanism, and grinding mechanism. The moving mechanism is used to convey the circuit boards, enabling them to move from the loading position to the grinding mechanism for grinding. The positioning mechanism is used to position the circuit boards during grinding, improving their stability and preventing them from tilting during the grinding process.

[0028] Reference Figure 1 and Figure 2 The frame 1 has a grinding station 10 and a material transfer station 11 arranged vertically, with the grinding station 10 located above the material transfer station 11. The frame 1 also has a contact station 12 and a cleaning station 13 arranged horizontally. The grinding station 10 covers the upper sides of both the contact station 12 and the cleaning station 13, and the material transfer station 11 covers the lower sides of both the contact station 12 and the cleaning station 13. A moving mechanism moves to each station. The overlap between the material transfer station 11 and the cleaning station 13 is defined as the first station 20. When the moving mechanism moves the circuit board to the first station 20, the circuit board can be loaded. The overlap between the material transfer station 11 and the contact station 12 is the second station 21. When the moving mechanism moves the circuit board to the second station 21, the chamfered circuit board can be unloaded. The overlap between the grinding station 10 and the contact station 12 is positioned as the third station 22. When the moving mechanism moves the circuit board to the third station 22, the circuit board can undergo chamfering and grinding. The overlapping area of ​​the grinding position 10 and the cleaning position 13 is positioned as the fourth work station 23. When the moving mechanism moves to the fourth work station 23, it can be cleaned.

[0029] When the circuit board is chamfered, it is loaded at the first station 20, then moved to the second station 21, then to the third station 22 for grinding, and then moved to the second station 21 for unloading.

[0030] Reference Figure 1 The frame 1 is rotatably connected to a vertical screw 24, which is driven to rotate by a motor. The frame 1 also has guide rods 25 parallel to the vertical screw 24. There are two vertical screws 24. A moving mechanism, in cooperation with the vertical screws 24, moves vertically on the frame 1.

[0031] Reference Figure 3 and Figure 4 The moving mechanism includes a mounting frame 2, a conveyor belt 3, a support plate 4, a connecting strip 5, and a driving component 6. The mounting frame 2 includes a main frame 201, a rotating roller 202, and a conveyor sleeve 203. Combined Figure 1 The system comprises two main frames 201, each threaded onto a vertical screw 24 and slidably mounted on a guide rod 25 for synchronous vertical movement. Two rotating rollers 202 are also present, parallel to each other, with each roller's opposite ends rotatably connected to one of the main frames 201. The axis of each roller is parallel to the distribution direction of the contact position 12 and the cleaning position 13, extending from the contact position 12 to the cleaning position 13. The two main frames 201 and the two rotating rollers 202 together form a square structure. A motor is mounted on each main frame 201 to drive one of the rotating rollers 202 to rotate.

[0032] Reference Figure 3 and Figure 4There are two conveyor sleeves 203. Each conveyor sleeve 203 is cylindrical, and a circular rotating ring 16 is coaxially fixed at each of its two far apart ends. The inner diameter of the rotating ring 16 is the same as the inner diameter of the conveyor sleeve 203, and the outer diameter of the rotating ring 16 is larger than the outer diameter of the conveyor sleeve 203. The two conveyor sleeves 203 are coaxially sleeved on two rotating rollers 202. A guide protrusion 17 is fixed on the inner wall of the conveyor sleeve 203. A guide groove 18 is formed on the outer wall of the rotating roller 202 along a direction parallel to its own axis, allowing the guide protrusion 17 to slide. The extension length of the conveyor sleeve 203 is less than the extension length of the rotating roller 202, so that the conveyor sleeve 203 can move axially relative to the rotating roller 202, but the rotation of the conveyor sleeve 203 relative to the rotating roller 202 is restricted.

[0033] The conveyor belt 3 is simultaneously fitted onto two conveyor sleeves 203, and is located between two rotating rings 16 of the conveyor sleeves 203, with the rotating rings 16 limiting the movement of the conveyor belt 3. When the roller 202 rotates, it drives the conveyor sleeves 203 to rotate, thereby driving the conveyor belt 3 to move through the friction between the conveyor sleeves 203 and the conveyor belt 3. The conveying direction of the conveyor belt 3 is perpendicular to the axial direction of the conveyor sleeves 203. The grinding mechanism is located at one end of the conveyor belt 3 in the conveying direction, and the end of the conveyor belt 3 away from the grinding mechanism is the feed end of the circuit board.

[0034] Reference Figure 3 and Figure 4 The connecting strip 5 is simultaneously sleeved on both rotating rollers 202 and moves axially along the rotating rollers 202. The driving component 6 is a multi-stage telescopic cylinder. The cylinder body of the multi-stage telescopic cylinder is installed on the main frame 201. The telescopic rod of the multi-stage telescopic cylinder is adjacent to the connecting sleeve and extends and retracts axially parallel to the rotating rollers 202. The connecting strip 5 is located at the end of the conveying sleeve 203 near the abutment position 12. The rotating rings 16 of the two conveying sleeves 203 near the connecting sleeve are rotatably connected to the connecting strip 5.

[0035] The support plate 4 is fixed to the connecting strip 5 and extends into the cavity formed by the conveyor belt 3. The upper and lower surfaces of the support plate 4 abut against the opposite sides of the upper and lower sides of the conveyor belt 3, so that the support plate 4 supports the conveyor belt 3, thereby improving the support effect of the conveyor belt 3 on the circuit board.

[0036] Reference Figure 1 and Figure 4When the multi-stage telescopic cylinder drives the connecting strip 5 to move on the rotating roller 202, it drives the conveyor sleeve 203 to move axially relative to the rotating roller 202, thereby causing the conveyor belt 3 to switch positions between the contact position 12 and the cleaning position 13. When the conveyor belt 3 moves the circuit board from the cleaning position 13 to the contact position 12, the portion of the rotating ring 16 extending out of the conveyor belt 3 can abut against the circuit board to assist in pushing the circuit board to move and prevent the circuit board from falling off the side of the conveyor belt 3. In addition, when the vertical screw 24 on the frame 1 rotates, it drives the main frame 201 to move up and down, thereby causing the conveyor belt 3 to switch positions between the grinding position 10 and the material transfer position 11.

[0037] Reference Figure 1 and Figure 5 The positioning mechanism includes a connecting frame 7, a pressure plate 8, and a limiting plate 9. The connecting frame 7 includes a side frame 71 and a stop bar 72. The side frame 71 is long and there are two of them. The two side frames 71 are respectively installed on opposite sides of the frame 1. The length of the side frame 71 extends in the horizontal direction, and the length extension direction of the side frame 71 is perpendicular to the axial direction of the roller 202.

[0038] The two ends of the baffle 72, which are far apart from each other, are connected to the side frame 71. The length direction of the baffle 72 is parallel to the axial direction of the roller 202, and the baffle 72 is located at the grinding position 10 and is always above the conveyor belt 3. A mounting base 26 is connected to the baffle 72, and an electric telescopic rod 27 that extends and retracts vertically is mounted on the mounting base 26. The telescopic shaft of the electric telescopic rod 27 is connected to the pressure plate 8 to drive the pressure plate 8 to move up and down. The pressure plate 8 is located at the abutment position 12 and is used to press the circuit board.

[0039] Reference Figure 1 The limiting plate 9 is fixedly installed on the frame 1. The length direction of the limiting plate 9 is parallel to the axial direction of the rotating roller 202. The limiting plate 9 is located at the end of the conveyor belt 3 away from the feed end and is located at the material transfer position 11. At the same time, it extends from the cleaning position 13 to the contact position 12.

[0040] Reference Figure 1 and Figure 2 When the conveyor belt 3 is at the first station 20, there is space between the upper surface of the conveyor belt 3 and the lower surface of the baffle 72 for the circuit board to pass through, and the circuit board does not interfere with the baffle 72 when the conveyor belt 3 is conveying the circuit board. At the first station 20, the conveyor belt 3 conveys the circuit board from the feed end toward the direction close to the limiting plate 9, until the end of the circuit board that needs to be polished and chamfered moves out of the end of the conveyor belt 3 and abuts against the limiting plate 9. At this time, the circuit board is located between the baffle 72 and the limiting plate 9, and the conveyor belt 3 stops conveying.

[0041] Then, the conveyor belt 3 moves the circuit board laterally to the second station 21, and then the conveyor belt 3 moves the circuit board vertically to the third station 22. At this time, the circuit board leaves the limiting plate 9, and the upper surface of the conveyor belt 3 abuts against the lower surface of the baffle 72. Then, the conveyor belt 3 is conveyed upward away from the limiting plate 9, so that the end of the circuit board away from the end to be polished abuts against the baffle 72. The baffle 72 prevents the circuit board from moving away from the limiting plate 9, so that the end of the circuit board gradually becomes flush with the baffle 72 during the conveyor belt 3 process. After the circuit board ends flush with and abut against the stop bar 72, the conveyor belt 3 stops conveying. At the same time, the electric telescopic rod 27 drives the pressure plate 8 to move downward and press the circuit board, so that the circuit board is pressed between the conveyor belt 3 and the pressure plate 8 and supported by the support plate 4 to position the circuit board. At this time, the end of the circuit board to be polished is opposite to the polishing mechanism. The polishing mechanism moves along the axis of the rotating roller 202 to pass through the circuit board and perform chamfer polishing on the circuit board.

[0042] After the circuit board is polished, the conveyor belt 3 moves downward to the second station 21, separating the circuit board from the stop bar 72. Then the conveyor belt 3 drives the circuit board to move away from the limit plate 9, so as to unload the circuit board.

[0043] The direction and time of conveyor belt 3 can be controlled manually via buttons, or sensors (not shown in the figure) can be installed on limit plate 9 and stop bar 72. When the sensor on limit plate 9 detects that the circuit board is flush with and abuts against limit plate 9, the sensor transmits a signal to the controller. The controller controls conveyor belt 3 to stop conveying and moves conveyor belt 3 to the third station 22, after which conveyor belt 3 conveys in the opposite direction. When the sensor on stop bar 72 detects that the circuit board is flush with and abuts against stop bar 72, the sensor transmits a signal to the controller. The controller controls conveyor belt 3 to stop conveying and controls the grinding mechanism to move to grind the circuit board. After that, the conveyor belt 3 moves to the second station 21 and then drives the circuit board to convey and feed material again.

[0044] Reference Figure 5 Furthermore, the baffle 72 includes an extension strip 721 and a baffle 722. The extension strip 721 is elongated, and its two ends, which are far apart from each other, are respectively connected to the side frame 71 and can extend along the length of the side frame 71. The baffle 722 is fixed to the lower surface of the extension strip 721 and is used for the circuit board to abut against it.

[0045] The length direction of the side frame 71 is perpendicular to the length direction of the roller 202. A transverse screw 28 is rotatably connected to the side frame 71. The circumferential direction of the transverse screw 28 is parallel to the length direction of the side frame 71. The extension strip 721 is slidably sleeved on the transverse screw 28 along the axial direction to adjust its position, so that the position of the baffle 722 can adapt to circuit boards of different lengths.

[0046] To position the extension bar 721, the transverse screw 28 has a limiting member 19. The limiting member 19 includes limiting nuts 191; each transverse screw 28 has two limiting nuts 191, both threaded onto the transverse screw 28, and each limiting nut 191 abuts against opposite sides of the extension bar 721 to limit its position. The positions of the extension bar 721 and the baffle 722 can be adjusted by adjusting the position of the limiting nuts 191.

[0047] Reference Figure 1 and Figure 6 Furthermore, a suction chamber 14 is formed on the lower surface of the baffle 722 at the position opposite to the cleaning position 13, extending into the baffle 722. Brush bristles 15 are installed on the side of the lower surface of the baffle 722 opposite to the suction chamber 14, with the lower surface of the brush bristles 15 flush with the lower surface of the baffle 722. A clearance opening 29 is formed on the other side of the lower surface of the baffle 722 opposite to the suction chamber 14, communicating with the suction chamber 14. A suction pipe 32 communicating with the suction chamber 14 is also connected to the baffle 722. The end of the suction pipe 32 away from the baffle 722 is connected to a vacuum cleaner (not shown in the figure), and the vacuum cleaner provides suction to the suction chamber 14 through the suction pipe 32.

[0048] When it is necessary to clean the conveyor belt 3, move the conveyor belt 3 to the fourth station 23 and convey the conveyor belt 3 from the relief port 29 toward the direction close to the bristles 15, and turn on the vacuum cleaner so that the impurities on the conveyor belt 3 can be cleaned through the vacuum chamber 14.

[0049] Reference Figure 1 In addition, the grinding mechanism includes a stand 30 and grinding components 31. The stand 30 moves back and forth on the frame 1 along the axis of the parallel roller 202. The stand 30 moves on the frame 1 via a screw and a motor. Two grinding components 31 are mounted on the stand 30. Each stand 30 includes a grinding head 311 and a rotating motor 312. The rotating motor 312 is bolted to the stand 30, and the grinding head 311 is mounted at the output end of the rotating motor 312, which drives the grinding head 311 to rotate. The grinding heads 311 of the two grinding components 31 correspond to the upper and lower surfaces of the circuit board, respectively. When the circuit board moves to the third station 22 and abuts against the baffle 722, the stand 30 is moved axially along the parallel roller 202 to drive the two grinding heads 311 to chamfer the circuit board across the upper and lower surfaces.

[0050] Adaptably, the two grinding heads 311 are positioned on the upper side of the limiting plate 9 at one end for grinding the circuit board, so that the grinding heads 311 do not interfere with the limiting plate 9 when the stand 30 moves.

[0051] The implementation principle of the chamfering device for an optical module circuit board according to an embodiment of this application is as follows: The conveyor belt 3 first moves the circuit board to the first station 20 to abut against the limiting plate 9, and then moves the circuit board sequentially to the second station 21 and the third station 22. At the third station 22, the conveyor belt 3 moves in the reverse direction to abut against the baffle 722, so that the circuit board reaches the grinding position 10. Then, the pressure plate 8 presses down the positioning limiting plate 9, and the grinding mechanism is activated to chamfer the circuit board through the grinding head 311.

[0052] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A chamfering processing device for an optical module circuit board, characterized in that, include: The assembly includes a frame (1), a moving mechanism, a positioning mechanism, and a grinding mechanism; the moving mechanism is mounted on the frame (1) and is used to transfer the circuit board to the positioning mechanism; the positioning mechanism is mounted on the frame (1) and is used to position the circuit board; the grinding mechanism is movably mounted on the frame (1) and is used to chamfer the positioned circuit board. The moving mechanism includes a mounting frame (2), a conveyor belt (3), and a support plate (4); the mounting frame (2) is connected to the frame (1); the conveyor belt (3) is conveyed on the mounting frame (2) for conveying the circuit board; the support plate (4) is located in the cavity formed by the conveyor belt (3) for supporting the conveyor belt (3); The positioning mechanism includes a connecting frame (7) and a pressure plate (8); the connecting frame (7) is mounted on the frame (1); the pressure plate (8) moves up and down on the connecting frame (7) to press the circuit board between the pressure plate (8) and the support plate (4); The connecting frame (7) includes a side frame (71) and a stop bar (72), the stop bar (72) being located above the conveyor belt (3); the frame (1) is provided with a grinding position (10) and a material transfer position (11) at the top and bottom, the grinding position (10) being located above the material transfer position (11), and the mounting frame (2) moving up and down on the frame (1) to drive the conveyor belt (3) to move to the material transfer position (11) or the grinding position (10). When the conveyor belt (3) is located at the material transfer position (11), there is a space between the conveyor belt (3) and the baffle (72) for the circuit board to pass through; when the conveyor belt (3) is located at the polishing position (10), the upper surface of the conveyor belt (3) abuts against the baffle (72), and the conveyor belt (3) is conveyed in the opposite direction so that the side of the circuit board away from the side to be polished abuts against the baffle (72), and the side of the circuit board to be polished is opposite to the polishing mechanism. At this time, the movement of the polishing mechanism can chamfer the circuit board.

2. The chamfering equipment for an optical module circuit board according to claim 1, characterized in that: The length of the baffle (72) extends perpendicular to the conveying direction of the conveyor belt (3). The frame (1) is provided with an abutment position (12) and a cleaning position (13) along the length of the baffle (72). The pressure plate (8) is installed on the baffle (72) and is opposite to the abutment position (12). The baffle (72) is provided with a dust suction chamber (14) at the cleaning position (13). The conveyor belt (3) can move along the vertical conveying direction on the mounting frame (2) so that the conveyor belt (3) is located at the contact position (12) or the cleaning position (13); when the conveyor belt (3) is located at the contact position (12) and the polishing position (10), the circuit board is polished; when the conveyor belt (3) is located at the cleaning position (13) and the polishing position (10), the conveyor belt (3) is cleaned; when the conveyor belt (3) is located at the cleaning position (13) and the material transfer position (11), the circuit board is loaded; when the conveyor belt (3) is located at the contact position (12) and the material transfer position (11), the circuit board is unloaded.

3. The chamfering equipment for an optical module circuit board according to claim 2, characterized in that: The baffle (72) has bristles (15) facing the conveyor belt (3) at the location opposite to the suction chamber (14).

4. The chamfering equipment for an optical module circuit board according to claim 2, characterized in that: The mounting frame (2) includes a main frame (201), a rotating roller (202), and a conveyor sleeve (203). The main frame (201) is mounted on the machine frame (1). There are two rotating rollers (202) that are rotatably connected to the main frame (201), and the two rotating rollers (202) are parallel to each other. The conveyor sleeve (203) is used for the conveyor belt (3) to be fitted. There are two conveyor sleeves (203) that are fitted on the two rotating rollers (202) respectively. When the rotating rollers (202) rotate, they drive the conveyor sleeves (203) to rotate. The conveyor sleeves (203) can move along the axial direction of the rotating rollers (202) on the rotating rollers (202) to drive the conveyor belt (3) to move to the position opposite to the contact position (12) or the cleaning position (13).

5. The chamfering equipment for an optical module circuit board according to claim 4, characterized in that: The moving mechanism also includes a connecting strip (5) and a driving component (6). The connecting strip (5) is sleeved on the rotating roller (202). The end of the conveying sleeve (203) has a rotating ring (16), which is rotatably connected to the connecting strip (5). The driving component (6) is installed on the main frame (201) and is used to drive the connecting strip (5) to move along the length direction of the rotating roller (202) so as to drive the conveying sleeve (203) to move.

6. The chamfering equipment for an optical module circuit board according to claim 4, characterized in that: The inner wall of the conveying sleeve (203) is provided with a guide protrusion (17), and the outer wall of the roller (202) has a guide groove (18) for the guide protrusion (17) to slide along the axis parallel to the roller (202).

7. The chamfering equipment for an optical module circuit board according to claim 1, characterized in that: The positioning mechanism also includes a limiting plate (9) installed on the frame (1). The end of the conveyor belt (3) away from the feed is opposite to the limiting plate (9). The limiting plate (9) is used to block the movement of the circuit board. When the circuit board abuts against the limiting plate (9), the circuit board is located between the stop bar (72) and the limiting plate (9).

8. The chamfering equipment for an optical module circuit board according to claim 1, characterized in that: The baffle (72) includes an extension strip (721) and a baffle (722). The extension strip (721) moves along the conveying direction of the conveyor belt (3) on the side frame (71), and the side frame (71) has a limiting member (19) for limiting the baffle (72). The baffle (722) is connected to the extension strip (721) and is used for the circuit board to abut against it.

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