A process for the preparation of a hydrogenated bisphenol a epoxy resin

Abstract

The application discloses a preparation method of hydrogenated bisphenol A epoxy resin. The method comprises the following steps: dissolving bisphenol A epoxy resin after extraction and desalination by using isopropyl alcohol to obtain a bisphenol A epoxy resin solution; and performing catalytic hydrogenation reaction on the bisphenol A epoxy resin solution by using a Rh / L molecular sieve catalyst to obtain hydrogenated bisphenol A epoxy resin. The method can efficiently hydrogenate the bisphenol A epoxy resin at a lower temperature, and has the characteristics of high benzene ring hydrogenation rate and low epoxy group decomposition rate, and the total chlorine content in the bisphenol A epoxy resin prepared by the method is low.

Description

Technical Field

[0001] This invention relates to a method for preparing hydrogenated bisphenol A epoxy resin, and particularly to a method for directly hydrogenating bisphenol A epoxy resin to prepare hydrogenated bisphenol A epoxy resin, belonging to the field of catalytic hydrogenation technology. Background Technology

[0002] Bisphenol A epoxy resins possess excellent adhesion, heat resistance, chemical resistance, and electrical properties, making them widely used in coatings, adhesives, fiberglass, laminates, electronic casting, potting, and encapsulation. However, due to the presence of benzene rings in their structure, their weather resistance, yellowing resistance, and UV resistance are relatively poor, limiting their application range, especially in outdoor applications. To improve the resin's weather resistance, yellowing resistance, and UV resistance, hydrogenated saturated double bonds are often used to enhance its antioxidant properties.

[0003] The properties of hydrogenated bisphenol A epoxy resin cured products are similar to those of bisphenol A type epoxy resin. However, due to the hydrogenation of the benzene ring into a saturated six-membered ring, the viscosity of hydrogenated bisphenol A type epoxy resin is significantly reduced compared to ordinary bisphenol A type epoxy resin. The cured products have better thermal stability, chemical stability, corona resistance, and weather resistance. They are widely used in outdoor coatings, outdoor casting materials, and LED encapsulation materials, and can replace ordinary bisphenol A type epoxy resin in projects requiring weather resistance and UV resistance.

[0004] There are generally two methods for preparing hydrogenated bisphenol A epoxy resin. One method involves etherifying hydrogenated bisphenol A with epichlorohydrin under the action of a catalyst and then cyclizing it under the action of an alkali. The other method involves directly hydrogenating bisphenol A epoxy resin.

[0005] Chinese patents CN102766113A and CN104193961A disclose a method for obtaining hydrogenated bisphenol A epoxy resin by first etherifying hydrogenated bisphenol A and epichlorohydrin using Lewis acid as a catalyst, followed by alkali-based ring-closure epoxidation. However, this method suffers from difficulties in etherifying alcohol hydroxyl groups compared to phenolic hydroxyl groups, requiring higher etherification temperatures and more β-addition during etherification. This results in a high total chlorine content in the product, typically between 3% and 5%, which severely impacts its application performance and makes it unsuitable for electrical applications and applications requiring high weather resistance.

[0006] US patents US6060611A and US6130344A disclose a method for directly hydrogenating bisphenol A epoxy resin to obtain hydrogenated bisphenol A epoxy resin using bisphenol A epoxy resin as a raw material and tetrahydrofuran as a solvent at a temperature of 30–150°C and a pressure of 2–30 MPa. This method uses tetrahydrofuran as a solvent, but tetrahydrofuran is easily oxidized. Trace amounts of peroxides in tetrahydrofuran can reduce the activity of the hydrogenation catalyst, or even deactivate it, thus affecting the benzene ring hydrogenation rate of the product.

[0007] Chinese patent CN100513453A discloses a method for directly hydrogenating bisphenol A epoxy resin to obtain hydrogenated bisphenol A epoxy resin using bisphenol A epoxy resin as raw material and ethyl acetate as solvent at a temperature of 30–150°C and a pressure of 2–15 MPa. This method uses ethyl acetate as a solvent, which is easily decomposed by hydrogenation under the action of a hydrogenation catalyst. Summary of the Invention

[0008] In view of the shortcomings of the existing technology, the purpose of this invention is to provide a method for preparing hydrogenated bisphenol A epoxy resin, which has a low hydrogenation temperature, a high benzene ring hydrogenation rate, a low epoxy group decomposition rate, and the solvent used will not oxidize or affect the hydrogenation catalyst.

[0009] To achieve the above-mentioned technical objectives, the present invention provides a method for preparing hydrogenated bisphenol A epoxy resin. The method involves extracting and desalting the bisphenol A epoxy resin, then dissolving it in isopropanol to obtain a bisphenol A epoxy resin solution; and then subjecting the bisphenol A epoxy resin solution to a catalytic hydrogenation reaction using an Rh / L molecular sieve catalyst to obtain the final product.

[0010] The bisphenol A epoxy resin raw material, especially its sodium content, directly affects the benzene ring hydrogenation rate of the prepared hydrogenated bisphenol A epoxy resin. This invention significantly reduces the sodium content in the bisphenol A epoxy resin by pretreating it using the difference in solubility of bisphenol A epoxy resin and sodium ions in organic solvents and water. Secondly, when isopropanol is used for the dissolution and hydrogenation of bisphenol A epoxy resin, isopropanol does not reduce the activity of the hydrogenation catalyst, thus stabilizing the activity of the Rh / L molecular sieve catalyst and ensuring the continuous and efficient catalytic hydrogenation reaction of bisphenol A epoxy resin. Furthermore, the combination of isopropanol and the Rh / L molecular sieve catalyst avoids hydrogenation decomposition. Simultaneously, the Rh in the Rh / L molecular sieve catalyst is an alkali metal, and the electron-rich Rh centers promote the catalytic activity of the L-type molecular sieve, exhibiting a high hydrogenation rate in the catalytic hydrogenation reaction of bisphenol A epoxy resin. In addition, due to the low boiling point of isopropanol, the reaction temperature can be lowered through endothermic reaction. In summary, this invention achieves the effects of low hydrogenation temperature, high benzene ring hydrogenation rate, and low epoxy group decomposition rate through the synergistic effect of extraction desalting, isopropanol solvent dissolution, and Rh / L molecular sieve catalyst.

[0011] As a preferred embodiment, the extraction and desalting process involves dissolving bisphenol A epoxy resin in an organic solvent and then washing it with water until the sodium content in the bisphenol A epoxy resin is less than 1.0 μg / g. The sodium content directly affects the hydrogenation rate of the benzene ring in the catalytic hydrogenation of bisphenol A epoxy resin to prepare hydrogenated bisphenol A epoxy resin. The bisphenol A epoxy resin used in this invention has good solubility in organic solvents but is almost insoluble in water, while sodium ions have the opposite solubility. This invention utilizes the difference in solubility between the two by repeatedly extracting with organic solvents and water, successfully extracting most of the sodium ions from the bisphenol A epoxy resin into the aqueous phase, while the bisphenol A epoxy resin remains in the toluene solution.

[0012] As a preferred embodiment, the organic solvent includes toluene and / or methyl isobutyl ketone. Bisphenol A epoxy resin exhibits good solubility in the selected organic solvents.

[0013] As a preferred embodiment, during the water washing process, the oil-to-water volume ratio is 2-5:1, and the water washing temperature is 60-80℃. If the temperature is too low, the sodium ion residue in the bisphenol A epoxy resin will be high; while if the temperature is too high, it will cause solvent loss.

[0014] As a preferred embodiment, the bisphenol A epoxy resin solution has a mass percentage concentration of 15-25%.

[0015] As a preferred embodiment, the Rh / L molecular sieve catalyst is obtained by impregnation and reduction of an L-type molecular sieve with a rhodium-containing compound solution. The L-type molecular sieve used in this invention is sourced from the Changling Branch of Sinopec Catalyst Company. It is a novel basic molecular sieve with a hexahedral structure and abundant pores. This molecular sieve itself possesses certain aromatization activity. Rh, being an alkali metal, and having electron-rich Rh centers, promotes the catalytic activity of the L-type molecular sieve, further enhancing the hydrogenation rate of the catalyst. This invention successfully loads Rh onto an L-type molecular sieve via impregnation, and further enhances the conversion rate of bisphenol A epoxy resin to hydrogenated bisphenol A epoxy resin through reduction.

[0016] As a preferred embodiment, the rhodium-containing compound includes at least one of RhCl3 and its hydrates.

[0017] As a preferred embodiment, the conditions for the impregnation method are as follows: the liquid-to-solid ratio of L molecular sieve to rhodium-containing compound solution is 0.5–1.5 g / mL, the temperature is 25°C–35°C, and the time is 6–10 h; the concentration of the rhodium-containing compound solution is 0.08–0.3 g / mL.

[0018] As a preferred embodiment, the reduction conditions are as follows: the reducing atmosphere is a hydrogen-containing atmosphere, the temperature is 260–300°C, and the time is 2–3 hours.

[0019] As a preferred embodiment, the Rh / L molecular sieve catalyst contains 3-10% Rh by mass. Rh, as the active center of the Rh / L molecular sieve catalyst, directly affects its catalytic hydrogenation effect. If the Rh content is too low, the benzene ring hydrogenation rate in the hydrogenated bisphenol A epoxy resin product will be low; if the Rh content is too high, since Rh is a precious metal, it will result in high production costs, while the benzene ring hydrogenation rate in the hydrogenated bisphenol A epoxy resin product will not further increase.

[0020] As a preferred embodiment, the amount of Rh / L molecular sieve catalyst added is 1-4 wt% of bisphenol A epoxy resin.

[0021] As a preferred embodiment, the conditions for the catalytic hydrogenation reaction are: temperature 60–100°C, pressure 4–7 MPa, and time 1.5–3 h. If the reaction temperature is too low or the pressure is too low, the activation energy for the reaction will not be reached, and the reaction cannot proceed; while if the reaction temperature is too high or the pressure is too high, the reaction will be too fast and release a large amount of heat, which will increase the epoxy group decomposition rate of the obtained bisphenol A epoxy resin on the one hand, and pose a safety hazard on the other hand.

[0022] As a preferred embodiment, the catalytic hydrogenation reaction is carried out in a batch hydrogenation reaction system, and more preferably in a batch high-pressure hydrogenation reactor.

[0023] Compared with existing technologies, the beneficial technical effects of the present invention are as follows:

[0024] 1) The pretreatment in the preparation method of the present invention can effectively reduce the sodium content in the raw material bisphenol A epoxy resin, laying the foundation for improving the hydrogenation rate of benzene ring in hydrogenated bisphenol A epoxy resin products.

[0025] 2) The Rh / L molecular sieve catalyst used in the preparation method of the present invention has the advantages of high stability, long lifespan and high catalytic activity.

[0026] 3) The solvent isopropanol used in the preparation method of the present invention is low in toxicity, does not oxidize or affect the catalytic activity of the hydrogenation catalyst, and the isopropanol used can be recovered and reused by distillation.

[0027] 4) Under the synergistic effect of pretreatment, isopropanol solvent and Rh / L molecular sieve catalyst, the hydrogenated bisphenol A epoxy resin product prepared at a relatively low hydrogenation temperature can achieve a benzene ring hydrogenation rate of over 97%, an epoxy group decomposition rate of less than 5%, and a total chlorine content of no more than 0.3%. Detailed Implementation

[0028] To facilitate understanding of the present invention, the present invention will be described more fully and in detail below with reference to preferred embodiments, but the scope of protection of the present invention is not limited to the following specific embodiments.

[0029] Unless otherwise defined, all technical terms used herein have the same meaning as commonly understood by those skilled in the art. The technical terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the scope of the invention.

[0030] Unless otherwise specified, all reagents and raw materials used in this invention are commercially available products or products that can be prepared by known methods.

[0031] Example 1

[0032] Catalyst preparation: Weigh 100g of L molecular sieve (Changling Branch of Sinopec Catalyst Company), add an equal volume of RhCl3·3H2O (Rh≥39%) solution with a concentration of 12.9g / 100mL for impregnation, impregnation temperature 30℃, impregnation time 8h, dry the impregnation solution at 120℃ for 24h, grind it into fine powder, and reduce it at 280℃ for 2h under hydrogen atmosphere to obtain a molecular sieve catalyst with a mass percentage content of 5%Rh / L.

[0033] Bisphenol A epoxy resin pretreatment: 1000g of bisphenol A epoxy resin CYD-128 (Sinopec Baling Petrochemical Company, epoxy equivalent 189g / eq) was dissolved in 3000g of toluene, then washed three times with 900g of deionized water at 60℃, and then the toluene in the solution was removed. The sodium content of the treated bisphenol A epoxy resin was 0.08μg / g.

[0034] Catalytic hydrogenation reaction: In a 2L magnetically stirred autoclave, 200g of pretreated bisphenol A epoxy resin, 6g of the 5% Rh / L molecular sieve hydrogenation catalyst prepared in this example, and 800g of isopropanol were added. After sealing, the mixture was purged with nitrogen, followed by hydrogen. Then, the hydrogenation reaction was carried out at 80℃ and 7MPa for 2 hours. After the reaction, the catalyst was removed by filtration, and the isopropanol was recovered by distillation of the filtrate. The solvent was removed at 180℃ and 20kPa to obtain colorless and transparent hydrogenated bisphenol A epoxy resin with a benzene ring hydrogenation rate of 97.8%, an epoxy equivalent of 196g / eq, an epoxy group decomposition rate of 3.7%, and a total chlorine content of 0.25%.

[0035] Example 2

[0036] In this embodiment, the catalyst preparation and bisphenol A epoxy resin pretreatment process are the same as in Example 1.

[0037] Catalytic hydrogenation reaction: In a 2L magnetically stirred autoclave, 250g of pretreated bisphenol A epoxy resin, 10g of the 5% Rh / L molecular sieve hydrogenation catalyst prepared in Example 1, and 750g of isopropanol were added. After sealing, the mixture was purged with nitrogen, followed by hydrogen. The hydrogenation reaction was then carried out at 100°C and 6MPa for 1.5h. After the reaction, the catalyst was removed by filtration, and the isopropanol was recovered by distillation of the filtrate. The solvent was removed at 180°C and 20kPa to obtain a colorless and transparent hydrogenated bisphenol A epoxy resin with a benzene ring hydrogenation rate of 98.5%, an epoxy equivalent of 198g / eq, an epoxy group decomposition rate of 4.8%, and a total chlorine content of 0.25%.

[0038] Example 3

[0039] In this embodiment, the catalyst preparation and bisphenol A epoxy resin pretreatment process are the same as in Example 1.

[0040] Catalytic hydrogenation reaction: In a 2L magnetically stirred autoclave, 150g of pretreated bisphenol A epoxy resin, 1.5g of the 5% Rh / L molecular sieve hydrogenation catalyst prepared in Example 1, and 850g of isopropanol were added. After sealing, the mixture was purged with nitrogen, followed by hydrogen purging. Then, the hydrogenation reaction was carried out at 100°C and 6MPa for 3 hours. After the reaction, the catalyst was removed by filtration, and the isopropanol was recovered by distillation of the filtrate. The solvent was removed at 180°C and 20kPa to obtain a colorless and transparent hydrogenated bisphenol A epoxy resin with a benzene ring hydrogenation rate of 97.6%, an epoxy equivalent of 197g / eq, an epoxy group decomposition rate of 4.3%, and a total chlorine content of 0.25%.

[0041] Example 4

[0042] In this embodiment, the catalyst preparation and bisphenol A epoxy resin pretreatment process are the same as in Example 1.

[0043] Catalytic hydrogenation reaction: In a 2L magnetically stirred autoclave, 200g of pretreated bisphenol A epoxy resin, 5g of the 5% Rh / L molecular sieve hydrogenation catalyst prepared in Example 1, and 800g of isopropanol were added. After sealing, the mixture was purged with nitrogen, followed by hydrogen. Then, the hydrogenation reaction was carried out at 80°C and 5MPa for 2.5h. After the reaction, the catalyst was removed by filtration, and the isopropanol was recovered by distillation of the filtrate. The solvent was removed at 180°C and 20kPa to obtain a colorless and transparent hydrogenated bisphenol A epoxy resin with a benzene ring hydrogenation rate of 97.2%, an epoxy equivalent of 197g / eq, an epoxy group decomposition rate of 4.3%, and a total chlorine content of 0.25%.

[0044] Example 5

[0045] In this embodiment, the catalyst preparation and bisphenol A epoxy resin pretreatment process are the same as in Example 1.

[0046] Catalytic hydrogenation reaction: In a 2L magnetically stirred autoclave, 150g of pretreated bisphenol A epoxy resin, 6g of the 5% Rh / L molecular sieve hydrogenation catalyst prepared in Example 1, and 800g of isopropanol were added. After sealing, nitrogen was used for purging, followed by hydrogen purging. Then, the hydrogenation reaction was carried out at 60°C and 4MPa for 3 hours. After the reaction, the catalyst was removed by filtration, and the isopropanol was recovered by distillation of the filtrate. The solvent was removed at 180°C and 20kPa to obtain colorless and transparent hydrogenated bisphenol A epoxy resin with a benzene ring hydrogenation rate of 97.5%, an epoxy equivalent of 196g / eq, an epoxy group decomposition rate of 3.7%, and a total chlorine content of 0.25%.

[0047] Example 6

[0048] Catalyst preparation: Weigh 100g of L molecular sieve (Sinopec Catalyst Company Changling Branch), add an equal volume of RhCl3·3H2O (Rh≥39%) solution with a concentration of 26g / 100mL for impregnation, impregnation temperature 35℃, impregnation time 6h, dry the impregnation solution at 120℃ for 24h, grind it into fine powder, and reduce it at 280℃ for 3h under hydrogen atmosphere to obtain a molecular sieve catalyst with a mass percentage content of 10% Rh / L.

[0049] Bisphenol A epoxy resin pretreatment: 1000g of bisphenol A epoxy resin CYD-128 (Sinopec Baling Petrochemical Company, epoxy equivalent 189g / eq) was dissolved in 3000g of toluene, then washed three times with 900g of deionized water at 80℃, and then the toluene in the solution was removed. The sodium content of the treated bisphenol A epoxy resin was 0.07μg / g.

[0050] Catalytic hydrogenation reaction: In a 2L magnetically stirred autoclave, 200g of pretreated bisphenol A epoxy resin, 4g of the 10% Rh / L molecular sieve hydrogenation catalyst prepared in this example, and 800g of isopropanol were added. After sealing, nitrogen purging was performed, followed by hydrogen purging. Then, the hydrogenation reaction was carried out at 80℃ and 7MPa pressure for 1.5h. After the reaction, the catalyst was removed by filtration, and the isopropanol was recovered by distillation of the filtrate. The solvent was removed at 180℃ and 20kPa pressure to obtain colorless and transparent hydrogenated bisphenol A epoxy resin with a benzene ring hydrogenation rate of 98.1%, an epoxy equivalent of 195g / eq, an epoxy group decomposition rate of 3.2%, and a total chlorine content of 0.25%.

[0051] Example 7

[0052] Catalyst preparation: Weigh 100g of L molecular sieve (Changling Branch of Sinopec Catalyst Company), add an equal volume of RhCl3·3H2O (Rh≥39%) solution with a concentration of 8g / 100mL for impregnation, impregnation temperature 25℃, impregnation time 8h, dry the impregnation solution at 120℃ for 24h, grind it into fine powder, and reduce it at 280℃ for 2h under hydrogen atmosphere to obtain a molecular sieve catalyst with a mass percentage content of 3%Rh / L.

[0053] Bisphenol A epoxy resin pretreatment: 1000g of bisphenol A epoxy resin CYD-128 (Sinopec Baling Petrochemical Company, epoxy equivalent 189g / eq) was dissolved in 3000g of toluene, then washed three times with 900g of deionized water at 70℃, and then the toluene in the solution was removed. The sodium content of the treated bisphenol A epoxy resin was 0.08μg / g.

[0054] Catalytic hydrogenation reaction: In a 2L magnetically stirred autoclave, 200g of pretreated bisphenol A epoxy resin, 8g of the 3% Rh / L molecular sieve hydrogenation catalyst prepared in this example, and 800g of isopropanol were added. After sealing, nitrogen purging was performed, followed by hydrogen purging. Then, the hydrogenation reaction was carried out at 80℃ and 7MPa pressure for 2 hours. After the reaction, the catalyst was removed by filtration, and the isopropanol was recovered by distillation of the filtrate. The solvent was removed at 180℃ and 20kPa pressure to obtain colorless and transparent hydrogenated bisphenol A epoxy resin with a benzene ring hydrogenation rate of 97.6%, an epoxy equivalent of 196g / eq, an epoxy group decomposition rate of 3.7%, and a total chlorine content of 0.25%.

[0055] Comparative Example 1

[0056] In this embodiment, the catalyst preparation and bisphenol A epoxy resin pretreatment process are the same as in Example 1.

[0057] Catalytic hydrogenation reaction: In a 2L magnetically stirred autoclave, 200g of pretreated bisphenol A epoxy resin, 6g of 5% Rh / L molecular sieve hydrogenation catalyst, and 800g of tetrahydrofuran were added. After sealing, nitrogen purging was performed, followed by hydrogen purging. Then, the hydrogenation reaction was carried out at 80℃ and 7MPa for 2 hours. After the reaction, the catalyst was removed by filtration, and the tetrahydrofuran was recovered by distillation of the filtrate. The solvent was removed at 180℃ and 20kPa. The resulting epoxy resin had a benzene ring hydrogenation rate of 46.7%, an epoxy equivalent of 203g / eq, an epoxy group decomposition rate of 7.5%, and a total chlorine content of 0.25%.

[0058] Comparative Example 2

[0059] In this embodiment, the catalyst preparation and bisphenol A epoxy resin pretreatment process are the same as in Example 1.

[0060] Catalytic hydrogenation reaction: In a 2L magnetically stirred autoclave, 200g of pretreated bisphenol A epoxy resin, 6g of 5% Rh / L molecular sieve hydrogenation catalyst, and 800g of tetrahydrofuran were added. After sealing, the mixture was purged with nitrogen, followed by hydrogen. The hydrogenation reaction was then carried out at 120℃ and 7MPa for 6 hours. After the reaction, the catalyst was removed by filtration, and the tetrahydrofuran was recovered by distillation of the filtrate. The solvent was removed at 180℃ and 20kPa. The resulting epoxy resin had a benzene ring hydrogenation rate of 62.3%, an epoxy equivalent of 205g / eq, an epoxy group decomposition rate of 8.5%, and a total chlorine content of 0.25%.

[0061] Comparative Example 3

[0062] In this embodiment, the catalyst preparation and bisphenol A epoxy resin pretreatment process are the same as in Example 1.

[0063] Catalytic hydrogenation reaction: In a 2L magnetically stirred autoclave, 200g of pretreated bisphenol A epoxy resin, 6g of the 5% Rh / L molecular sieve hydrogenation catalyst prepared in Example 1, and 800g of ethyl acetate were added. After sealing, the mixture was purged with nitrogen, followed by hydrogen purging. Then, the hydrogenation reaction was carried out at 80°C and 7MPa for 5 hours. After the reaction, the catalyst was removed by filtration, and the ethyl acetate was recovered by distillation of the filtrate. The solvent was removed at 180°C and 20kPa. The resulting epoxy resin had a benzene ring hydrogenation rate of 58.3%, an epoxy equivalent of 203g / eq, an epoxy group decomposition rate of 7.4%, and a total chlorine content of 0.25%.

[0064] Comparative Example 4

[0065] The only difference between this comparative example and Example 1 is that the bisphenol A epoxy resin was not pretreated; all other conditions were the same. The resulting epoxy resin had a benzene ring hydrogenation rate of 87.8%, an epoxy equivalent of 201 g / eq, an epoxy group decomposition rate of 6.3%, and a total chlorine content of 0.25%.

[0066] Comparative Example 5

[0067] The only difference between this comparative example and Example 1 is the use of n-butanol as a solvent; all other conditions are the same. The resulting epoxy resin has a benzene ring hydrogenation rate of 77.8%, an epoxy equivalent of 198 g / eq, an epoxy group decomposition rate of 4.8%, and a total chlorine content of 0.25%.

Claims

1. A method for preparing hydrogenated bisphenol A epoxy resin, characterized in that: Bisphenol A epoxy resin was extracted and desalted, then dissolved in isopropanol to obtain a bisphenol A epoxy resin solution; the bisphenol A epoxy resin solution was then subjected to catalytic hydrogenation using an Rh / L molecular sieve catalyst to obtain the final product. The extraction and desalting process is as follows: Bisphenol A epoxy resin is dissolved in an organic solvent and then washed with water until the sodium content in the bisphenol A epoxy resin is less than 1.0 μg / g; The Rh / L molecular sieve catalyst was obtained by impregnation and reduction of L molecular sieve with a rhodium-containing compound solution. The Rh / L molecular sieve catalyst contains 3-10% Rh by mass. The amount of Rh / L molecular sieve catalyst added is 1-4 wt% of bisphenol A epoxy resin; The conditions for the catalytic hydrogenation reaction are: temperature of 60–100℃, pressure of 4–7 MPa, and time of 1.5–3 h.

2. The method for preparing hydrogenated bisphenol A epoxy resin according to claim 1, characterized in that: The organic solvents include toluene and / or methyl isobutyl ketone.

3. The method for preparing hydrogenated bisphenol A epoxy resin according to claim 2, characterized in that: During the water washing process, the oil-to-water volume ratio is 2-5:1, and the temperature is 60-80℃.

4. The method for preparing hydrogenated bisphenol A epoxy resin according to claim 1, characterized in that: The mass percentage concentration of the bisphenol A epoxy resin solution is 15-25%.

5. The method for preparing hydrogenated bisphenol A epoxy resin according to claim 4, characterized in that: The rhodium-containing compound includes at least one of RhCl3 and its hydrate.

6. The method for preparing hydrogenated bisphenol A epoxy resin according to claim 4, characterized in that: The conditions for the impregnation method are as follows: the liquid-to-solid ratio of L molecular sieve to rhodium-containing compound solution is 0.5~1.5 g / mL, the temperature is 25℃~35℃, and the time is 6~10 h; the concentration of the rhodium-containing compound solution is 0.08~0.3 g / mL.

7. The method for preparing hydrogenated bisphenol A epoxy resin according to claim 4, characterized in that: The reduction conditions are as follows: the reducing atmosphere is an atmosphere containing hydrogen, the temperature is 260~300℃, and the time is 2~3h.