An electrical connection device and a manufacturing process thereof

Abstract

The application discloses an electric connection device and a manufacturing process thereof, which is used for connecting an electric device with a wire and transmitting electric energy, and comprises a contact part and a connection part which are connected with each other, wherein at least a part of the contact part is a contact area which is connected with the electric device, and at least a part of the connection part is a connection area which is connected with the wire; a plating layer is plated on the surface of the contact area; and an insulating coating is arranged on the electric connection device except the surface of the contact area and the surface of the connection area. Through the technical scheme, the plating layer is locally plated instead of being plated on the whole surface of the device, so that the use amount of noble metal is obviously reduced, and the production cost is effectively reduced.

Description

Technical Field

[0001] This invention relates to the field of electrical connection technology, and more specifically, to an electrical connection device and its manufacturing process. Background Technology

[0002] Before use, electrical connection devices are generally plated with an overall electroplating or chemical plating method to meet the requirements of electrical connection with electrical devices and wires.

[0003] The current conventional method is to apply a plating layer to the entire electrical connection surface. However, this method results in a large area of ​​non-functional areas or areas where plating is not required for the electrical connection device, leading to serious waste of precious metals and high production costs.

[0004] Therefore, a new structure and method are needed to solve the above problems. Summary of the Invention

[0005] One object of the present invention is to provide an electrical connection device for connecting an electrical device to a wire and transmitting electrical energy, comprising a contact portion and a connecting portion connected to each other, wherein at least a portion of the contact portion is a contact area connected to the electrical device, and at least a portion of the connecting portion is a connecting area connected to the wire; the surface of the contact area is provided with a plating layer, and the area of ​​the electrical connection device excluding the surface of the contact area and the surface of the connecting area is provided with an insulating coating.

[0006] Optionally, the melting point of the insulating coating is higher than the ambient temperature during electroplating.

[0007] Optionally, when the plating layer and the insulating coating are located on the same side of the electrical connection device, the surface of the plating layer is higher than the surface of the insulating coating.

[0008] Optionally, an anti-corrosion coating covering the boundary between the plating layer and the insulating coating is further provided in the interface area between the plating layer and the insulating coating.

[0009] Optionally, the contact portion is a plate-shaped structure with a through hole, and the contact area is the inner wall of the through hole and at least a portion of the surface of the contact portion near both ends of the through hole.

[0010] Optionally, the connecting part is a plate-like structure, and the connecting area is the side that contacts the wire or the end that contacts the wire.

[0011] Optionally, the contact portion is a cylindrical structure, and the contact area is at least a portion of the inner wall surface of the cylindrical structure.

[0012] Optionally, the connecting part is a cylindrical structure or a U-shaped structure, and the connecting area is at least a portion of the inner wall surface of the cylindrical structure or at least a portion of the inner surface of the U-shaped structure.

[0013] Optionally, a transition portion is further provided between the contact portion and the connecting portion, and the insulating coating includes a general coating and a heat-resistant coating, wherein the heat-resistant coating is disposed on the surface of the transition portion and / or part of the surface of the connecting portion.

[0014] Optionally, the melting point of the heat-resistant coating is greater than that of the ordinary coating.

[0015] According to a first aspect of the present invention, a manufacturing process for an electrical connection device is also provided, comprising the following steps: S10. A contact area and a connection area are defined on the electrical connection device, and a first shielding layer is provided on the contact area, and a second shielding layer is provided on the connection area. S20. The insulating coating is applied to the surface of the electrical connection device; S30. Remove the first shielding layer to expose the contact area, while retaining the second shielding layer; S40, Electroplating: Electroplating the coating layer onto the surface of the contact area; S50. Remove the second masking layer to expose the connection area.

[0016] Optionally, step S05 is further included before step S10: a pretreatment process, which includes sequential ultrasonic degreasing, alkaline etching, and acid etching of the electrical connection device. Alternatively, the pretreatment process includes sequential ultrasonic degreasing, electrolytic degreasing, and acid etching of the electrical connection device.

[0017] Optionally, if the melting point of the first shielding layer is below 100°C, in step S30, the first shielding layer is removed by immersing the electrical connection device in boiling water.

[0018] Optionally, the melting points of the second shielding layer and the insulating coating are higher than the ambient temperature during electroplating.

[0019] Optionally, if the melting point of the insulating coating is greater than that of the second shielding layer, in step S50, the electrical connection device is placed in an environment with a temperature greater than that of the second shielding layer but less than that of the insulating coating, so that the second shielding layer melts and is removed.

[0020] Optionally, a transition portion is further provided between the contact portion and the connecting portion. In step S10, a third shielding layer is provided on the surface of the transition portion. After step S10, step S15 is further provided: the third shielding layer is removed to expose the surface of the transition portion, and a heat-resistant coating is provided on the surface of the transition portion.

[0021] Optionally, the melting point of the third shielding layer is greater than the working ambient temperature during electroplating, but less than the melting point of the heat-resistant coating.

[0022] Optionally, after step S50, step S60 is further included: in the junction area of ​​the plating layer and the insulating coating, an anti-corrosion coating covering the boundary between the plating layer and the insulating coating is also provided.

[0023] The present invention has the following technical effects: By electroplating a surface coating on the contact area of ​​the electrical connection device, the stability of signal and power transmission between the device and the electrical equipment is improved. Applying an insulating coating to areas other than the contact and connection areas effectively prevents electrical short circuits, leakage, and corrosion of the electrical connection device. Using a partial plating method instead of plating the entire surface of the device significantly reduces the amount of precious metals used, effectively lowering production costs. This solves the problem of significant precious metal waste and high production costs associated with overall plating of the electrical connection device surface.

[0024] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with their description, serve to explain the principles of the invention.

[0026] Figure 1 for Figure 1 This is a schematic diagram of the structure of the chip electrical connection device in the embodiments of this disclosure; Figure 2 This is a partial cross-sectional structural diagram of the chip electrical connection device in an embodiment of this disclosure; Figure 3 This is a partial cross-sectional structural schematic diagram of another embodiment of the chip electrical connection device in this disclosure; Figure 4 This is a schematic diagram of the overall structure of the contact portion being a cylindrical structure in an embodiment of this disclosure; Figure 5 This is a partial cross-sectional schematic diagram of the chip electrical connection device in an embodiment of this disclosure; Figure 6 This is a partial cross-sectional schematic diagram of another embodiment of the chip electrical connection device in the present disclosure; Figure 7 for Figure 6 This is a partial cross-sectional schematic diagram of another embodiment of the chip electrical connection device in this disclosure; Figure 8A flowchart of the manufacturing process for electrical connection devices; Figure 9 The manufacturing process flow diagram shows the entire surface of the connection part as the connection area. Figure 10 A flowchart illustrating the manufacturing process of the connecting area, where a portion of the connecting part's surface is the connecting region. Figure 11 A manufacturing process flow diagram for a section with a transition and the entire surface of the connecting part being the connecting area; Figure 12 This is a manufacturing process flow diagram for parts with transition sections and connecting sections where the surface is the connecting area.

[0027] The diagram is marked as follows: 10. Contact part; 20. Connecting part; 30. Connecting hole; 40. Transition part; 3. Coating; 5. Insulating coating; 501. Ordinary coating; 502. Temperature resistant coating; 6. Anti-corrosion coating; 110. Contact area; 210. Connection area. Detailed Implementation

[0028] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0029] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0030] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0031] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0032] like Figures 1-7 The electrical connection device shown has an electrical device and a wire connected to its two ends, respectively, and is used to transmit electrical energy. Specifically, the electrical connection device includes a contact portion 10 and a connecting portion 20 that are connected to each other. At least a portion of the contact portion 10 is a contact area 110 connected to the electrical device, and at least a portion of the connecting portion 20 is a connecting area 210 connected to the wire. The surface of the contact area 110 is provided with a plating layer 3, and the area of ​​the electrical connection device other than the surfaces of the contact area 110 and the connecting area 210 is provided with an insulating coating 5.

[0033] The electrical connection device is generally made of copper or copper alloy, or aluminum or aluminum alloy. The connection between the connection area 210 and the wire can be achieved by welding, crimping, or other methods.

[0034] This invention provides a plating layer 3 only in the contact area 110, which not only ensures the stability of signal and power transmission with electrical devices but also saves costs. Furthermore, an insulating coating 5 is provided on the electrical connection device, excluding the surfaces of the contact area 110 and the connection area 210, to prevent corrosion. The insulating coating 5 is made of epoxy vinyl alcohol resin, which has good insulation properties and mechanical strength. Epoxy vinyl alcohol resin also has good flowability and processability, allowing it to be applied to the electrical connection device through various processes such as spraying and impregnation, simplifying operations and improving work efficiency. The electrical connection device of this invention has good overall conductivity, good corrosion resistance, and is suitable for mass production.

[0035] The typical operating temperature for electroplating is 60-70℃. To prevent the insulating coating 5 from peeling off, the melting point of the insulating coating 5 is set higher than the ambient temperature during electroplating. This ensures that the insulating coating 5 maintains its insulating properties at high temperatures, preventing insulation failure due to temperature increases. Furthermore, the high melting point of the insulating coating 5 provides better durability and stability, reducing equipment maintenance and replacement costs caused by coating 5 failure. It also minimizes process fluctuations caused by temperature changes, improving the stability and reliability of the electroplating process.

[0036] like Figures 5-7 As shown, when the plating layer 3 and the insulating coating 5 are located on the same side of the electrical connection device, the thickness of the plating layer 3 can be guaranteed to be the same as the thickness of the insulating coating 5; or, the surface of the plating layer 3 can be made higher than the surface of the insulating coating 5.

[0037] When the height of the plating layer 3 is greater than the height of the insulating coating 5, it ensures a full connection between the contact points of the electrical connection device and the electrical device, thus maintaining efficient electrical conductivity. Furthermore, the greater thickness of the plating layer 3 compared to the insulating coating 5 clearly delineates conductive and non-conductive parts, preventing accidental contact with conductive components and improving work safety for operators and maintenance personnel. It also facilitates easier identification and adjustment of connection points during assembly and debugging, improving work efficiency.

[0038] It should be noted that when stamping the electrical connection device, a boss structure can be designed in the contact area 110 so that the surface of the plating layer 3 can be more accurately made higher than the surface of the insulating coating layer 5 during the plating process.

[0039] In one implementation, such as Figure 2 and Figure 6As shown, the entire surface of the connecting part 20 is the connecting area 210, which is used for electrical connection with the wire. The insulating coating 5 includes a general coating 501, which is applied to the area of ​​the electrical connection device other than the surface of the contact area 110 and the surface of the connecting area 210.

[0040] The material of ordinary coating 501 is epoxy vinyl alcohol resin, and the melting point of epoxy vinyl alcohol is 130-150℃.

[0041] In another implementation, such as Figure 3 and Figure 7 As shown, the insulating coating 5 also includes a heat-resistant coating 502. The connection area 210 is part of the surface of the connection portion 20. After the connection portion 20 is connected to the wire, the heat-resistant coating 502 is provided on the connection portion 20 except for the connection area 210. Based on its good insulation performance and cost-effectiveness, a common coating 501 is used on the contact portion 10 in the area other than the contact area 110.

[0042] The high-temperature resistant coating 502 not only provides basic insulation properties, but also effectively isolates the direct effects of high temperatures on the ordinary coating 501, preventing the ordinary coating 501 from melting and ensuring the insulation of the connection.

[0043] The heat-resistant coating 502 can be made of polytetrafluoroethylene (PTFE), which has high temperature resistance, excellent insulation and corrosion resistance, and a melting point of 327°C. The melting point of the heat-resistant coating 502 is higher than that of the ordinary coating 501.

[0044] In yet another implementation, such as Figure 6 As shown, a transition portion 40 is also provided between the contact portion 10 and the connecting portion 20. When the connecting area 210 is the entire surface of the connecting portion 20, a common coating 501 is provided on the contact portion 10 except for the surface of the contact area 110; a heat-resistant coating 502 is provided on the surface of the transition portion 40.

[0045] Alternatively, a transition portion 40 may be provided between the contact portion 10 and the connecting portion 20, and when the connecting area 210 is part of the surface of the connecting portion 20, a common coating 501 may be provided on the contact portion 10 except for the surface of the contact area 110, and a heat-resistant coating 502 may be provided on the surface of the transition portion 40 and the connecting portion 20 except for the surface of the connecting area 210.

[0046] The above solutions can avoid the high temperatures generated during the welding connection between the wire and the connector 20 affecting the ordinary coating 501 applied to the contact part 10. Simultaneously, in electrical connections, they can provide additional insulation protection, preventing current leakage along inappropriate paths and ensuring the safety and stability of the electrical system.

[0047] Furthermore, such as Figure 6 and Figure 7 As shown, in order to prevent corrosion from occurring at the junction of the plating layer 3 and the insulating coating 5 of the electrical connection device, an anti-corrosion coating 6 is provided in the junction area of ​​the plating layer 3 and the insulating coating 5 to cover the boundary between the plating layer 3 and the insulating coating 5.

[0048] The interface area is often the starting point for coating failure because the physical and chemical properties of the insulating coating 5 and the plating layer 3 may differ. The anti-corrosion coating 6 acts as a "bridge" between the plating layer 3 and the insulating coating 5, reducing interface problems such as peeling and blistering caused by incompatibility between the coating and plating layer 3. Through its good adhesion and compatibility, it enhances the bonding force between the insulating coating 5 and the plating layer 3, making the entire coating system more stable and reliable. Furthermore, the anti-corrosion coating 6 provides an effective protective layer for the plating layer 3 and the insulating coating 5, effectively preventing direct contact between water, oxygen, corrosive gases, and other media and the electrical connection device, thereby slowing down or preventing corrosion. This significantly enhances the corrosion resistance of the entire electrical connection device and extends its service life. In addition, the anti-corrosion coating 6 makes it easier to detect potential problems in the interface area during inspection and maintenance. Once signs of coating damage or corrosion are found, timely repair or replacement can be carried out to prevent the problem from escalating. The presence of the anti-corrosion coating 6 enhances the durability of the entire coating system, thereby extending the replacement cycle of the electrical connection device and reducing maintenance costs.

[0049] It should be noted that, in this embodiment, the anti-corrosion coating 6 can be made of epoxy resin, which has excellent mechanical properties and adhesion strength to the metal substrate. It can effectively prevent water, oxygen, corrosive gases, and other media from directly contacting the electrical connection device, thereby slowing down or preventing the corrosion process. In other embodiments, isocyanate or silyl ester materials can also be used, depending on actual needs, and no limitations are made here.

[0050] like Figure 1 As shown, the contact portion 10 has a plate-like structure with a through-hole 30. The contact area 110 is the inner wall of the through-hole 30 and at least a portion of the surface of the contact portion 10 near both ends of the through-hole 30. The shape of the contact area 110 can be matched to the shape of the electrical device to which it is connected.

[0051] like Figure 4 As shown, the contact portion 10 is a cylindrical structure, and the contact area 110 is at least a portion of the inner wall surface of the cylindrical structure.

[0052] Regardless of whether the contact part 10 is a plate-shaped structure or a cylindrical structure, its connecting part 20 can be set as a plate-shaped structure according to actual needs. The connecting area 210 of the plate-shaped structure is the side that contacts the wire or the end that contacts the wire. Alternatively, the connecting part 20 may be configured as a cylindrical structure or a U-shaped structure for the contact part 10, depending on actual needs, and the connecting area 210 may be at least a portion of the inner wall surface of the cylindrical structure or at least a portion of the inner surface of the U-shaped structure.

[0053] like Figures 8-12 As shown, the present invention also provides a manufacturing process for an electrical connection device, comprising the following steps: S10. A contact area 110 and a connection area 210 are defined on the electrical connection device, and a first shielding layer is provided on the contact area 110 and a second shielding layer is provided on the connection area 210. S20. The insulating coating 5 is provided on the surface of the electrical connection device; S30. Remove the first shielding layer to expose the contact area 110, while retaining the second shielding layer; S40, electroplating, electroplating the coating 3 on the surface of the contact area 110; S50. Remove the second masking layer to expose the connection area 210.

[0054] In step S10, after determining the contact area 110 and the connection area 210, a first shielding layer and a second shielding layer are respectively set on the contact area 110 and the connection area 210. The setting of the shielding layer can precisely control the application area of ​​the coating 3, avoid unnecessary waste of the coating 3, and at the same time ensure the protection and functional realization of the critical areas.

[0055] In S20, an insulating coating 5 is applied to the entire surface of the electrical connection device (excluding the portion covered by the shielding layer) to protect non-conductive areas, prevent safety hazards such as short circuits and electric shocks, improve the safety of the electrical connection device, and ensure the insulation performance of non-conductive areas.

[0056] In step S30, the first shielding layer on the contact area 110 is removed to expose the area where the plating layer 3 needs to be electroplated. The contact area 110 is then subjected to the next electroplating process to ensure that the plating layer 3 can be directly adhered to the contact area 110. The second shielding layer is retained to prevent the plating layer 3 from forming on the connection area 210, thus avoiding waste.

[0057] In S40, an electroplating process is used to electroplat a layer 3 on the surface of the contact area 110, which can further improve the conductivity, wear resistance and corrosion resistance of the contact area 110 and extend its service life.

[0058] In S50, the second shielding layer on the connection area 210 is removed to expose the area that needs to be connected to the wire, providing a clear connection interface for the connection area 210 and ensuring a reliable connection between the two.

[0059] In S10, a contact area 110 and a connection area 210 are defined on the electrical connection device, and a first shielding layer is provided on the contact area 110 and a second shielding layer is provided on the connection area 210. Based on the connection method with electrical devices and wires, functional zones are made for each part of the electrical connection device, and contact area 110 and connection area 210 are set.

[0060] The first shielding layer is made of paraffin material with a melting point between 47°C and 64°C.

[0061] The coating process for the first masking layer is as follows: (1) Place the electrical connection device into mold A and fix it in place, with only the contact area 110 exposed in the mold; (2) Inject paraffin wax into the mold and coat it on the exposed contact area 110 surface; (3) Cool for 10 minutes to allow the paraffin to cool and solidify; (4) Use a knife to remove the paraffin wax that overflows from the mold so that the first masking layer material (paraffin wax) is evenly covered on the exposed contact area 110 surface. (5) Remove mold A The second shielding layer is made of epoxy ether resin, which has a melting point between 90-110℃.

[0062] The coating process for the second masking layer is as follows: (1) Place the electrical connection device into mold B and fix it in place. Mold B covers the entire contact part 10, leaving the entire connection part 20 exposed. (2) Spray a second masking layer (epoxy ethylene ether resin) onto the exposed part of mold B's connecting portion 20. (3) After the spraying is completed, remove mold B; (4) Set a hanging point at the side rib position of the connecting part 20, and remove the second shielding layer at the hanging point position; (5) Place the electrical connection device in the curing oven, bake at 115°C for 30 minutes, then cool down to 60°C for 1 hour to cure the second masking layer, and finally cool to room temperature.

[0063] It should be noted that before placing the electrical connection device into the curing oven, a mold should be used to protect and fasten the contact area 110 to prevent the first shielding layer from melting and being lost during the melting and curing process of the second shielding layer, thus rendering the first shielding layer ineffective.

[0064] In S20, the insulating coating 5 is provided on the surface of the electrical connection device; specifically, there are four ways to provide the coating on the electrical connection device, so the steps of providing the insulating coating 5 are set as four implementation methods: S21, S22, S23 and S24.

[0065] The insulating coating 5 includes a general coating 501 and a high-temperature resistant coating 502. The general coating 501 is made of epoxy vinyl alcohol resin with a melting point of 130-150℃. The high-temperature resistant coating 502 is made of polytetrafluoroethylene, which has high temperature resistance, excellent insulation and corrosion resistance, and a melting point of 327℃.

[0066] The coating process for insulating coating 5 is as follows: In step S21, as Figure 2 and Figure 9 As shown, a common coating 501 is provided on the area of ​​the contact portion 10 except for the surface of the contact area 110, and the entire connecting portion 20 is the contact area 110 and is electrically connected to the wire.

[0067] (1) Place the electrical connection device coated with the first shielding layer into mold C and fix it in place. The mold shields the entire connection area 210, so that the entire contact part 10 is completely exposed. (2) Apply a common coating 501 to the exposed contact area 10 of mold C; (3) Remove mold C; (4) Place the electrical connection device into mold C, exposing only the contact area 110 to be electroplated, while the ordinary coating 501 on it is exposed. (5) Use a cutting tool to remove the ordinary coating 501 and part of the thickness of the first masking layer on the contact area 110. At this time, there is only the first masking layer on the contact area 110, and the part of the contact portion 10 other than the contact area 110 is the ordinary coating 501. (6) Remove mold C; (7) Place the electrical connection device in the curing oven, bake at 155°C for 30 minutes, then cool down to 60°C for 1 hour to cure the ordinary coating 501, and finally cool to room temperature.

[0068] This completes the application of the standard coating 501.

[0069] It should be noted that before placing the electrical connection device into the curing oven, different molds should be used to protect and fasten the contact area 110 and the connection area 210 respectively, so as to prevent the first and second shielding layers from melting and losing during the melting and curing process of the ordinary coating 501, thus rendering the shielding layer ineffective.

[0070] In S30, the first shielding layer is removed to expose the contact area 110, while the second shielding layer is retained; The process of removing the first masking layer includes: (1) Place the electrical connection device into mold D, exposing only the contact area 110 to be electroplated, while the ordinary coating 501 on it is exposed. (2) Use a cutting tool to remove the ordinary coating 501 material and part of the first masking layer on the contact area 110. At this time, there is only the first masking layer on the contact area 110, and the part of the contact portion 10 other than the contact area 110 is the ordinary coating 501 material. (3) Remove mold D; (4) Melt and desorb the electrical connection device in hot water at 70~80℃; (5) The terminals from which the first shielding layer has been removed are air-dried at room temperature and then dried at 60 degrees Celsius for use in electroplating.

[0071] At this point, the removal of the first shielding layer is complete.

[0072] Setting the melting point of the first shielding layer to below 100°C means that it can be easily removed at slightly higher temperatures. Furthermore, the temperature of hot water is typically well above 65°C, which can quickly and effectively soften and remove the shielding layer, while ensuring that other coatings are not damaged during the removal of the first shielding layer. At the same time, this method does not require complex equipment or chemicals; only a container capable of housing the electrical connection device and being heated to the appropriate temperature is needed, reducing production costs and simplifying the process.

[0073] In one embodiment, the melting point of the second shielding layer and the insulating coating 5 is greater than the ambient temperature during electroplating.

[0074] During electroplating, the ambient temperature may rise due to factors such as equipment operation and chemical reactions. The typical operating temperature for electroplating is 60-70℃. If the melting point of the second shielding layer is lower than this temperature, it may soften, detach, melt, or even fail, thus failing to effectively protect the connection area 210. Therefore, the second shielding layer can be made of epoxy ether resin with a melting point much higher than the ambient temperature, typically between 90-110℃. This ensures that the second shielding layer can still protect the connection area 210 at high temperatures.

[0075] In S40, the plating layer 3 is electroplated on the surface of the contact area 110; like Figures 5 to 7 As shown, taking a chip electrical connection device as an example, the surface of the contact area 110 is designed with a base layer of 25~30μm Ni (nickel sulfamate) electroplated and a surface layer of 3~6μm silver electroplated; the remaining part is an area without a plating layer 3.

[0076] like Figure 4As shown, taking the charging dock slotted electrical connection device as an example, its inner surface, i.e. the contact area 110, is designed with nickel plating as the base layer and silver plating on the surface. The nickel layer is 3~5μm thick, and the surface is plated with hard silver for 10~15μm. The rest of the part has no plating 3.

[0077] In S50, the second masking layer is removed, exposing the connection area 210.

[0078] The process of removing the second shielding layer includes: (1) Immerse the electrical connection device in boiling water at 100°C; (2) The melting point of the second shielding layer is 90~110℃, so it melts and desorbs in boiling water at 100℃; (3) The electrical connection device with the second shielding layer removed is air-dried at room temperature and then dried at 60°C to obtain the final state electrical connection device.

[0079] At this point, the electrical connection device is complete. Since the melting point of the insulating coating 5 is greater than that of the second shielding layer, in step S50, the electrical connection device is placed in an environment with a temperature greater than the melting point of the second shielding layer but less than the melting point of the insulating coating 5, causing the second shielding layer to melt and be removed.

[0080] By precisely controlling the shielding and electroplating processes described above, the contact area 110 of the electrical connection device can be accurately electroplated. This not only improves the overall performance and reliability of the electrical connection device but also significantly reduces the amount of precious metals used, lowering production costs. This solves the problem of significant precious metal waste and high production costs associated with overall surface plating 3 on the electrical connection device.

[0081] In another implementation, such as Figure 3 and 10 As shown, the coating process for the insulating coating 5 is as follows: In step S22, the connection area 210 of the electrical connection device is part of the surface of the connection portion 20. A general coating 501 is applied to the area of ​​the contact portion 10 excluding the surface of the contact area 110, and a heat-resistant coating 502 is applied to the area of ​​the connection portion 20 excluding the surface of the connection area 210. These coatings are then baked and cured to complete the coverage of the insulating coating 5.

[0082] In yet another implementation, such as Figure 11As shown, the coating process of the insulating coating 5 is as follows: In step S23, when a transition portion 40 is provided between the contact portion 10 and the connecting portion 20, and the connecting area 210 is the entire surface of the connecting portion 20, a normal plating layer 3 is provided on the contact portion 10, excluding the surface of the contact area 110. In step S10, a third shielding layer is also provided on the surface of the transition portion 40; the third shielding layer needs to be provided on the surface of the transition portion 40 before the electroplating layer 3; after step S10, step 15 is also included: removing the third shielding layer to expose the surface of the transition portion 40, and providing a heat-resistant coating 502 on the surface of the transition portion 40.

[0083] Or, in another implementation, such as Figure 12 As shown, the coating process of the insulating coating 5 is as follows: In step S24, when a transition portion 40 is provided between the contact portion 10 and the connecting portion 20, and the connecting area 210 is part of the surface of the connecting portion 20, a common plating layer 3 is provided on the area of ​​the contact portion 10 excluding the surface of the contact area 110. In step S10, a third shielding layer is also provided on the surface of the connecting portion 20 excluding the connecting area 210; after step S10, step 15 is also provided: the third shielding layer is removed to expose the surface of the connecting portion 20 excluding the connecting area 210, and a heat-resistant coating 502 is provided on the transition portion 40 and the surface of the connecting portion 20 excluding the connecting area 210.

[0084] Immediately after removing the third shielding layer, apply a heat-resistant coating 502 to the surface of the transition portion 40 or the surface of the connection portion 20 outside the connection area 210. Ensure that the heat-resistant coating 502 adheres evenly and firmly to its surface and achieves the desired protective effect.

[0085] The melting point of the third shielding layer is higher than the ambient temperature during electroplating but lower than the melting point of the heat-resistant coating 502. This design ensures that the third shielding layer will not melt due to increased ambient temperature during electroplating, thus maintaining its integrity and effectively preventing the penetration of the electroplating solution. Simultaneously, setting the melting point of the third shielding layer to be lower than that of the heat-resistant coating 502 allows for easy removal of the shielding layer in subsequent steps, facilitating further processing or treatment. This ensures the feasibility and efficiency of the removal process.

[0086] It should be understood that, in this embodiment, the third shielding layer can be made of polymer materials (such as polyphenylene sulfide, polyimide, polyetheretherketone, etc.), and the specific material can be selected according to actual needs, without any limitation.

[0087] The third shielding layer prevents electroplating solutions, chemical solvents, or other harmful substances from directly contacting the surface of the transition section 40, thereby avoiding corrosion, pollution, or other adverse effects. The heat-resistant coating 502 is mainly used to isolate the adjacent ordinary coating 501 from damage or melting caused by the high temperature generated during the welding connection between the connector 20 and the wire. It effectively isolates the ordinary coating 501 from the direct effect of high temperature and prevents the ordinary coating 501 from melting.

[0088] In one embodiment, step S05 is provided before step S10: a pretreatment process, which includes sequential ultrasonic degreasing, alkaline etching, and acid etching of the electrical connection device.

[0089] Ultrasonic degreasing utilizes the combined action of alkaline degreasing agents and ultrasonic waves to remove oil stains from terminal surfaces. The alkaline degreasing agent itself can undergo a saponification reaction with the oil stains, removing them chemically. Simultaneously, ultrasonic vibrations generate numerous microbubbles on the product surface and within the degreasing agent. These microbubbles possess strong mechanical force, capable of tearing and detaching the oil stains from the product surface, thereby accelerating the degreasing process and enhancing its effectiveness.

[0090] Taking a plate-type electrical connector as an example, the material of a plate-type electrical connector is generally aluminum or aluminum alloy. Based on the total volume of the electroplating solution, the ultrasonic degreasing plating solution consists of 40-50 g / L sodium carbonate, 40-50 g / L trisodium phosphate, and 20-30 g / L sodium silicate, at a temperature of 50-70℃, using an ultrasonic frequency greater than 26 kHz, and the ultrasonic degreasing time for the electrical connector is 8-16 minutes.

[0091] Alkali etching is used because aluminum is an amphoteric metal, reacting with both acids and alkalis. This process uses a strong alkaline solution (NaOH, KOH, etc.) to dissolve the aluminum oxide and some aluminum on the surface of the electrical connection device, providing a good surface for the electroplating layer 3 and ensuring its adhesion.

[0092] Based on the total volume of the electroplating solution, the alkaline etching solution comprises 50-70 g / L sodium hydroxide, 30-40 g / L trisodium phosphate, 20-30 g / L sodium carbonate, and 5-10 g / L sodium silicate, at a temperature of 60-80℃ and a time of 60-120 s.

[0093] Acid etching, also known as acid immersion etching, has low corrosiveness to aluminum. At the same time, it can remove elements such as iron, manganese, copper, magnesium, and silicon in aluminum alloys that cannot be dissolved in alkaline etching (commonly known as ash). It forms an aluminum-rich layer on the surface of the plated part, which can activate the substrate and improve the adhesion of the coating for electrical connection devices.

[0094] Based on the total volume of the electroplating solution, the acid etching solution consists of 750-800 g / L concentrated nitric acid, 250-300 g / L 40% hydrofluoric acid, at room temperature, for 50-90 seconds.

[0095] or, Before step S10, there is a step S05: a pretreatment process, which includes sequential ultrasonic degreasing, electrolytic degreasing, and acid etching of the electrical connection device. This scheme takes an electrical connection device in the form of a slotted charging base as an example.

[0096] Ultrasonic degreasing method, the same ultrasonic degreasing method for sheet-type electrical connectors.

[0097] Electrolytic degreasing involves immersing the electrical connection device in an alkaline degreasing agent. The electrical connection device acts as the cathode, and the polarization during electrolysis and the generated hydrogen gas tear and desorb the oil stains on the surface of the electrical connection device.

[0098] Based on the total volume of the electroplating solution, the electrolytic degreasing plating solution consists of 10-15 g / L sodium hydroxide, 20-30 g / L sodium carbonate, 50-70 g / L sodium phosphate, and 10-15 g / L sodium silicate, at a temperature of 50-70°C, a current density of 3-8 A / dm², and a time of 10-15 minutes.

[0099] Pickling involves immersing electrical connection devices in a dilute sulfuric acid solution to remove surface oxide scale and activate them.

[0100] Based on the total volume of the electroplating solution, the pickling solution consists of 10%-20% sulfuric acid (by volume) for 60-90 seconds.

[0101] Following step S50, step 60 is further included: An anti-corrosion coating 6 is provided at the interface between the plating layer 3 and the insulating coating 5, covering the boundary between the plating layer 3 and the insulating coating 5. This prevents the interface between the surface plating layer 3 and the insulating coating 5 of the electrical connection device from being exposed, avoiding corrosion of the electrical connection device at exposed locations, extending the service life of the entire component or product, and further improving the overall performance of the product.

[0102] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A manufacturing process for an electrical connection device, the electrical connection device being used to connect an electrical device and a wire and transmit electrical energy, comprising a contact portion and a connecting portion interconnected thereto, wherein at least a portion of the contact portion is a contact area connected to the electrical device, and at least a portion of the connecting portion is a connecting area connected to the wire; the surface of the contact area is provided with a plating layer, and the area of ​​the electrical connection device excluding the surfaces of the contact area and the connecting area is provided with an insulating coating, characterized in that... Includes the following steps: S10. A contact area and a connection area are defined on the electrical connection device, and a first shielding layer is provided on the contact area, and a second shielding layer is provided on the connection area. S20. The insulating coating is applied to the surface of the electrical connection device; S30. Remove the first shielding layer to expose the contact area, while retaining the second shielding layer; S40, Electroplating: Electroplating the coating onto the surface of the contact area; S50. Remove the second masking layer to expose the connection area.

2. The manufacturing process of the electrical connection device according to claim 1, characterized in that, Before step S10, there is a step S05: a pretreatment process, which includes sequential ultrasonic degreasing, alkaline etching, and acid etching of the electrical connection device; or, the pretreatment process includes sequential ultrasonic degreasing, electrolytic degreasing, and acid etching of the electrical connection device.

3. The manufacturing process of the electrical connection device according to claim 1, characterized in that, The first shielding layer has a melting point below 100°C. In step S30, the first shielding layer is removed by immersing the electrical connection device in boiling water.

4. The manufacturing process of the electrical connection device according to claim 1, characterized in that, The melting points of the second shielding layer and the insulating coating are higher than the ambient temperature during electroplating.

5. The manufacturing process of the electrical connection device according to claim 1, characterized in that, The melting point of the insulating coating is greater than that of the second shielding layer. In step S50, the electrical connection device is placed in an environment with a temperature greater than that of the second shielding layer but less than that of the insulating coating, so that the second shielding layer melts and is removed.

6. The manufacturing process of the electrical connection device according to claim 1, characterized in that, A transition portion is also provided between the contact portion and the connecting portion. In step S10, a third shielding layer is provided on the surface of the transition portion. After step S10, step S15 is also provided: the third shielding layer is removed to expose the surface of the transition portion, and a heat-resistant coating is provided on the surface of the transition portion.

7. The manufacturing process of the electrical connection device according to claim 6, characterized in that, The melting point of the third shielding layer is greater than the working environment temperature during electroplating, but less than the melting point of the heat-resistant coating.

8. The manufacturing process of the electrical connection device according to claim 1, characterized in that, After step S50, step S60 is also included: an anti-corrosion coating is further provided in the junction area of ​​the plating layer and the insulating coating to cover the boundary between the plating layer and the insulating coating.

9. The manufacturing process of the electrical connection device according to claim 1, characterized in that, The melting point of the insulating coating is higher than the working environment temperature during electroplating.

10. The manufacturing process of the electrical connection device according to claim 1, characterized in that, When the plating layer and the insulating coating are located on the same side of the electrical connection device, the surface of the plating layer is higher than the surface of the insulating coating.

11. The manufacturing process of the electrical connection device according to claim 1, characterized in that, The contact portion is a plate-shaped structure with a through hole. The contact area is the inner wall of the through hole and at least part of the surface of the contact portion near both ends of the through hole.

12. The manufacturing process of the electrical connection device according to claim 1, characterized in that, The connecting part has a plate-like structure, and the connecting area is either the side that contacts the wire or the end that contacts the wire.

13. The manufacturing process of the electrical connection device according to claim 1, characterized in that, The contact portion is a cylindrical structure, and the contact area is at least a portion of the inner wall surface of the cylindrical structure.

14. The manufacturing process of the electrical connection device according to claim 1, characterized in that, The connecting part is a cylindrical structure or a U-shaped structure, and the connecting area is at least a portion of the inner wall surface of the cylindrical structure or at least a portion of the inner surface of the U-shaped structure.

15. The manufacturing process of the electrical connection device according to claim 1, characterized in that, A transition portion is further provided between the contact portion and the connecting portion. The insulating coating includes a general coating and a heat-resistant coating. The heat-resistant coating is disposed on the surface of the transition portion and / or part of the surface of the connecting portion.

16. The manufacturing process of the electrical connection device according to claim 15, characterized in that, The melting point of the heat-resistant coating is greater than that of the ordinary coating.

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