Display substrate, manufacturing method thereof and display device

Abstract

This invention provides a display substrate and its manufacturing method, as well as a display device, relating to the field of display technology, and is used to solve the problem of black spots easily appearing on the display screen of display products. The display substrate includes: a display area, a hole area, and an isolation area, with the isolation area located between the hole area and the display area; the isolation area includes: a conductive isolation pillar, an insulating isolation layer, and a cathode layer; the conductive isolation pillar has a notch on its side; the insulating isolation layer is located on the side of the conductive isolation pillar facing away from the display substrate, and the orthographic projection of the conductive isolation pillar on the substrate is located inside the orthographic projection of the insulating isolation layer on the substrate; the cathode layer includes a first cathode portion and a second cathode portion, the first cathode portion is located on the side of the insulating isolation layer facing away from the substrate, at least a portion of the orthographic projection of the second cathode portion on the substrate does not overlap with the orthographic projection of the insulating isolation layer on the substrate, and the first cathode portion and the second cathode portion are disconnected at the notch.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display substrate, its manufacturing method, and a display device. Background Technology

[0002] With the continuous development of display technology, the application fields of display products are becoming increasingly widespread, and correspondingly, people's requirements for display products are also increasing. To better achieve full-screen display, related technologies often place the camera within the display area of ​​the display product, forming a through-hole within the display area and placing the camera inside the through-hole. While this arrangement is beneficial for achieving full-screen display, it easily produces gray dot-in-screen (GDSH) spots on the display screen, reducing the production yield of the display product. Summary of the Invention

[0003] The purpose of this invention is to provide a display substrate and its manufacturing method, as well as a display device, to solve the problem of black spots easily appearing on the display screen of display products.

[0004] To achieve the above objectives, the present invention provides the following technical solution:

[0005] A first aspect of the present invention provides a display substrate, comprising: a display area, an aperture area, and an isolation area, wherein at least a portion of the display area is located around the aperture area, and at least a portion of the isolation area is located between the aperture area and the display area; the isolation area includes:

[0006] A conductive isolation post, wherein the side of the conductive isolation post has a notch;

[0007] An insulating isolation layer is located on the side of the substrate opposite to the conductive isolation pillar, and the orthographic projection of the conductive isolation pillar on the substrate is located inside the orthographic projection of the insulating isolation layer on the substrate.

[0008] The cathode layer includes a first cathode portion and a second cathode portion. The first cathode portion is located on the side of the insulating isolation layer facing away from the substrate. At least a portion of the orthographic projection of the second cathode portion on the substrate does not overlap with the orthographic projection of the insulating isolation layer on the substrate. The first cathode portion and the second cathode portion are disconnected at the notch.

[0009] Optionally, the edge portion of the insulating layer facing the surface of the substrate has a slope angle α, where α > 0°.

[0010] Optionally, the boundary of the orthographic projection of the insulating isolation layer on the substrate at least partially overlaps with the boundary of the orthographic projection of the conductive isolation pillar on the substrate.

[0011] Optionally, the display substrate further includes: at least one functional structure located in the isolation region, and at least a portion of the functional structure 20 is located on the side of the conductive isolation pillar facing the substrate, the functional structure forming a step around its periphery, and the surface of the functional structure facing away from the substrate including a planar portion and a beveled portion.

[0012] The orthographic projection of the boundary of the insulating layer on the substrate overlaps with the orthographic projection of the inclined portion on the substrate.

[0013] Optionally, the orthographic projection of the insulating isolation layer on the substrate at least partially overlaps with the orthographic projection of the planar portion on the substrate.

[0014] Optionally, the orthographic projection of the planar portion on the substrate is located inside the orthographic projection of the insulating layer on the substrate.

[0015] Optionally, the display substrate includes at least two functional structures, with a trench between adjacent functional structures, and at least a portion of the insulating layer is located within the trench.

[0016] Optionally, the conductive isolation pillar includes a first isolation layer, a second isolation layer and a third isolation layer stacked sequentially in a direction away from the substrate, wherein the orthographic projection of the boundary of the first isolation layer on the substrate surrounds the orthographic projection of the second isolation layer on the substrate.

[0017] The orthographic projection of the boundary of the first partition layer on the substrate surrounds the orthographic projection of the third partition layer on the substrate; and / or, the orthographic projection of the second partition layer on the substrate overlaps with the orthographic projection of the third partition layer on the substrate.

[0018] Optionally, the display substrate includes a source / drain metal layer and an organic planarization layer, wherein the conductive isolation pillars are disposed in the same layer and with the same material as the source / drain metal layer, and the insulating isolation layer is disposed in the same layer and with the same material as the organic planarization layer.

[0019] Optionally, the isolation region surrounds the hole region, and the display region surrounds the isolation region; the display substrate further includes: a light-emitting functional layer, which extends from the display region to the isolation region and is disconnected at the notch of the conductive isolation pillar.

[0020] Optionally, the functional structure includes a first insulating layer, a first conductive pattern, a second insulating layer, a second conductive pattern, and a third insulating layer sequentially stacked along a direction away from the substrate.

[0021] The orthographic projection of the second conductive pattern on the substrate is located inside the orthographic projection of the first conductive pattern on the substrate. In a direction parallel to the substrate, the first conductive pattern protrudes from the second conductive pattern by a first distance d, which satisfies: 0.5μm≤d≤2μm.

[0022] Based on the above-described display substrate technical solution, a second aspect of the present invention provides a display device including the above-described display substrate.

[0023] Based on the above-described technical solution for a display substrate, a third aspect of the present invention provides a method for manufacturing a display substrate, used to manufacture the aforementioned display substrate; the display substrate includes: a display area, a hole area, and an isolation area, wherein at least a portion of the display area is located around the hole area, and at least a portion of the isolation area is located between the hole area and the display area; the manufacturing method includes:

[0024] Conductive isolation pillars and insulating isolation layers are fabricated in the isolation area; the side of the conductive isolation pillar has a notch; the insulating isolation layer is located on the side of the conductive isolation pillar facing away from the substrate of the display substrate, and the orthographic projection of the conductive isolation pillar on the substrate is located inside the orthographic projection of the insulating isolation layer on the substrate.

[0025] A cathode layer is fabricated, the cathode layer comprising a first cathode portion and a second cathode portion, the first cathode portion being located on the side of the insulating isolation layer facing away from the substrate, at least a portion of the orthogonal projection of the second cathode portion on the substrate not overlapping the orthogonal projection of the insulating isolation layer on the substrate, and the first cathode portion and the second cathode portion being disconnected at the notch.

[0026] Optionally, the steps of fabricating conductive isolation pillars and insulating isolation layers in the isolation region specifically include:

[0027] Create the transition graphic for the isolation column;

[0028] An insulating isolation material layer is fabricated on the side of the isolation pillar transition pattern facing away from the substrate, and the insulating isolation material layer is patterned to form an insulating isolation transition layer.

[0029] Using the insulating isolation transition layer as a mask, the transition pattern of the isolation pillar is patterned to form the conductive isolation pillar and the insulating isolation layer. The edge portion of the insulating isolation layer facing the surface of the substrate has a slope angle α, where α > 0°.

[0030] Optionally, the manufacturing method further includes:

[0031] A conductive material layer is formed on the side of the insulating transition layer opposite to the substrate.

[0032] The steps of constructing the transition pattern of the isolation pillar using the insulating isolation transition layer as a mask specifically include:

[0033] The conductive material layer is etched to form a conductive pattern; simultaneously, over-etching is performed in the same etching process to form the conductive isolation pillars and the insulating isolation layer.

[0034] Optionally, the display substrate includes: at least two functional structures, with a trench between adjacent functional structures, and at least a portion of the insulating layer is located within the trench;

[0035] After the conductive isolation pillars and insulating isolation layers are fabricated in the isolation area, a water washing process is performed.

[0036] In the technical solution provided by this invention, an insulating isolation layer is provided on the side of the conductive isolation pillar facing away from the substrate, and a cathode layer is provided on the side of the insulating isolation layer facing away from the substrate. The cathode layer is divided into a first cathode portion and a second cathode portion at the notch of the conductive isolation pillar. The first cathode portion is located on the side of the insulating isolation layer facing away from the substrate, and at least a portion of the orthographic projection of the second cathode portion on the substrate does not overlap with the orthographic projection of the insulating isolation layer on the substrate. Because the insulating isolation layer is insulating and located between the conductive isolation pillar and the first cathode portion, it can insulate the conductive isolation pillar and the first cathode portion, preventing the first cathode portion and the second cathode portion from being connected via the conductive isolation pillar, and preventing the conductive isolation pillar from receiving electrical signals from the first cathode portion. Therefore, in the technical solution provided by this invention, by setting the isolation area to include the conductive isolation pillar and the insulating isolation layer, the possibility of forming a conductive path between the conductive isolation pillar and the cathode layer transmitting electrical signals is effectively reduced, thereby effectively improving the GDSH problem caused by electrochemical corrosion. Attached Figure Description

[0037] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:

[0038] Figures 1 to 6 This is a schematic diagram of a first manufacturing process for the conductive isolation pillar and the insulating isolation layer provided in an embodiment of the present invention;

[0039] Figures 7 to 12 This is a schematic diagram of a second manufacturing process for the conductive isolation pillar and the insulating isolation layer provided in an embodiment of the present invention;

[0040] Figure 13 This is a planar schematic diagram of the various regions included in the display substrate provided in an embodiment of the present invention. Detailed Implementation

[0041] To further illustrate the display substrate, its manufacturing method, and the display device provided in the embodiments of the present invention, a detailed description is provided below with reference to the accompanying drawings.

[0042] Taking organic light-emitting diode (OLED) display products as an example, in order to prevent the organic light-emitting material layer located near the through hole from becoming a transmission path for water vapor and oxygen to invade the interior of the display product, isolation pillars can be set near the through hole to isolate the organic light-emitting material layer. This disconnects the organic light-emitting material layer near the through hole from the organic light-emitting material layer inside the display area, thus preventing the organic light-emitting material layer from becoming a transmission path for water vapor and oxygen to invade the interior of the display product.

[0043] After the organic light-emitting material layer is fabricated, a full-surface cathode layer is formed. This cathode layer transmits cathode signals, and a portion of it overlaps with an isolation pillar. Since the isolation pillar is conductive, it also carries electrical signals. When moisture and alkaline ions invade and come into contact with the isolation pillar, corrosion occurs due to an electrochemical reaction. This corrosion of the isolation pillar may damage the display product structure in the encapsulation area of ​​the via, further allowing moisture to contact the organic light-emitting material layer inside the screen, ultimately causing black spots on the via.

[0044] Please see Figure 5 , Figure 6 , Figures 11 to 13 This invention provides a display substrate, including: a display area 61, an aperture area 62, and an isolation area 63. At least a portion of the display area 61 is located around the aperture area 62, and at least a portion of the isolation area 63 is located between the aperture area 62 and the display area 61. The isolation area 63 includes:

[0045] A conductive isolation post 30, wherein the side of the conductive isolation post 30 has a notch;

[0046] An insulating isolation layer 40 is located on the side of the conductive isolation pillar 30 that faces away from the substrate 10 of the display substrate. The orthogonal projection of the conductive isolation pillar 30 on the substrate 10 is located inside the orthogonal projection of the insulating isolation layer 40 on the substrate 10.

[0047] The cathode layer 50 includes a first cathode portion 501 and a second cathode portion 502. The first cathode portion 501 is located on the side of the insulating isolation layer 40 facing away from the substrate 10. At least a portion of the orthographic projection of the second cathode portion 502 on the substrate 10 does not overlap with the orthographic projection of the insulating isolation layer 40 on the substrate 10. The first cathode portion 501 and the second cathode portion 502 are disconnected at the notch.

[0048] For example, the isolation region 63 surrounds the hole region 62, and the display region 61 surrounds the isolation region 63; the display substrate further includes: a light-emitting functional layer EL, which extends from the display region 61 to the isolation region 63 and is broken at the notch of the conductive isolation post 30.

[0049] For example, the isolation region 63 includes a conductive isolation pillar 30, which may be made of a metallic material, but is not limited thereto. The orthographic projection of the conductive isolation pillar 30 on the substrate 10 at least partially surrounds the orthographic projection of the hole region 62 on the substrate 10; furthermore, the orthographic projection of the conductive isolation pillar 30 on the substrate 10 may be configured to completely surround the orthographic projection of the hole region 62 on the substrate 10.

[0050] For example, the isolation region 63 includes an insulating isolation layer 40, which is made of inorganic or organic insulating material.

[0051] For example, the orthographic projection of the conductive isolation pillar 30 on the substrate 10 coincides with the orthographic projection of the insulating isolation layer 40 on the substrate 10. Alternatively, the orthographic projection of the boundary of the insulating isolation layer 40 on the substrate 10 surrounds the orthographic projection of the conductive isolation pillar 30 on the substrate 10.

[0052] For example, the display substrate includes a cathode layer 50, which includes a portion located in the isolation region 63. This portion includes a first cathode portion 501 and a second cathode portion 502 that are disconnected at the notch. The first cathode portion 501 is located on the surface of the insulating isolation layer 40 facing away from the substrate 10, and the second cathode portion 502 is located around the first cathode portion 501. The second cathode portion 502 is not in contact with the insulating isolation layer 40.

[0053] For example, the display substrate further includes a partition structure, which may be disposed between two adjacent conductive isolation pillars 30. The partition structure is used to isolate the second cathode portion 502 that is respectively coupled to the two adjacent conductive isolation pillars 30. The partition structure may also be disposed between the conductive isolation pillars 30 and the display area, for isolating the second cathode portion 502 that is respectively coupled to the conductive isolation pillars 30 and the portion of the cathode layer located in the display area.

[0054] As can be seen from the specific structure of the display substrate described above, in the display substrate provided in the embodiments of the present invention, an insulating isolation layer 40 is provided on the side of the conductive isolation pillar 30 facing away from the substrate 10, and a cathode layer 50 is provided on the side of the insulating isolation layer 40 facing away from the substrate 10. The cathode layer 50 is divided into a first cathode portion 501 and a second cathode portion 502 at the notch of the conductive isolation pillar 30. The first cathode portion 501 is located on the side of the insulating isolation layer 40 facing away from the substrate 10, and at least a portion of the orthographic projection of the second cathode portion 502 on the substrate 10 does not overlap with the orthographic projection of the insulating isolation layer 40 on the substrate 10.

[0055] Because the insulating isolation layer 40 is insulating and located between the conductive isolation pillar 30 and the first cathode portion 501, it can insulate the conductive isolation pillar 30 and the first cathode portion 501 from each other, preventing the first cathode portion 501 and the second cathode portion 502 from being connected via the conductive isolation pillar 30, and preventing the conductive isolation pillar 30 from receiving electrical signals from the first cathode portion 501. Therefore, in the display substrate provided by this embodiment of the invention, by providing the isolation region 63 including the conductive isolation pillar 30 and the insulating isolation layer 40, the possibility of forming a conductive path between the conductive isolation pillar 30 and the cathode layer 50 that transmits electrical signals is effectively reduced, thereby effectively improving the GDSH problem caused by electrochemical corrosion.

[0056] like Figure 5As shown, in some embodiments, the edge portion of the insulating isolation layer 40 facing the surface of the substrate 10 has a slope angle α, where α satisfies: α > 0°.

[0057] For example, 'a' satisfies: 0° < a < 90°, but it is not limited to this. For instance, 'a' can be further specified to satisfy: 20° < a < 80°, 30° < a < 70°, 40° < a < 70°, etc.

[0058] For example, during the formation of the insulating isolation layer 40, the shape of the surface of the insulating isolation layer 40 facing the substrate 10 is determined by the surface shape of the carrier supporting the insulating isolation layer 40. For instance, if the conductive isolation pillar 30 supports the insulating isolation layer 40, that is, the insulating isolation layer 40 is located on the surface of the conductive isolation pillar 30 facing away from the substrate 10, in this case, the surface shape of the conductive isolation pillar 30 facing away from the substrate 10 determines the shape of the insulating isolation layer 40 facing the surface of the substrate 10.

[0059] For example, the isolation edge portion of the conductive isolation pillar 30 is provided with a slope angle α, and the edge portion of the insulating isolation layer 40 facing the surface of the substrate 10 is located on the isolation edge portion. The edge portion of the insulating isolation layer 40 facing the surface of the substrate 10 can continue the morphology of the isolation edge portion and also has a slope angle α.

[0060] For example, the boundary of the insulating layer 40 is located on the slope formed by its carrier. For instance, the boundary of the insulating layer 40 is located on the slope formed by the conductive insulating pillar 30.

[0061] The aforementioned setting of the edge portion of the insulating isolation layer 40 facing the surface of the substrate 10 has a slope angle α > 0°, such that the boundary of the insulating isolation layer 40 is located on the slope formed by the conductive isolation pillar 30. This helps to increase the thickness of the edge portion of the insulating isolation layer 40, thereby effectively improving the isolation effect of the edge portion of the insulating isolation layer 40 between the conductive isolation pillar 30 and the first cathode portion 501. This better ensures that the conductive isolation pillar 30 and the first cathode portion 501 can be completely insulated, thereby improving the GDSH problem caused by electrochemical corrosion.

[0062] like Figure 5 , Figure 6 , Figure 11 and Figure 12 As shown, in some embodiments, the boundary of the orthographic projection of the insulating isolation layer 40 onto the substrate 10 at least partially overlaps with the boundary of the orthographic projection of the conductive isolation pillar 30 onto the substrate 10.

[0063] For example, the boundary of the orthographic projection of the insulating isolation layer 40 onto the substrate 10 substantially overlaps with the boundary of the orthographic projection of the conductive isolation pillar 30 onto the substrate 10. It should be noted that the substantial overlap is achieved by trying to make the overlap as close as possible while taking into account process errors.

[0064] When fabricating the display substrate, the insulating isolation layer 40 can be used as a mask to etch and form the conductive isolation pillars 30, so that the boundary of the insulating isolation layer 40 is approximately flush with the boundary of the conductive isolation pillars 30. It should be noted that the phrase "approximately flush" means that the boundaries are made as flush as possible while taking into account process errors.

[0065] like Figure 1 , Figure 5 , Figure 6 , Figure 11 and Figure 12 As shown, in some embodiments, the display substrate further includes: at least one functional structure 20, the functional structure 20 being located in the isolation region 63, and at least a portion of the functional structure 20 being located on the side of the conductive isolation pillar 30 facing the substrate 10, the functional structure 20 forming a step around its periphery, and the surface of the functional structure 20 facing away from the substrate 10 including a planar portion 204 and a beveled portion 205.

[0066] The orthographic projection of the boundary of the insulating isolation layer 40 on the substrate 10 overlaps with the orthographic projection of the inclined portion 205 on the substrate 10.

[0067] For example, the functional structure 20 is arranged around the hole region 62, but is not limited thereto.

[0068] For example, the functional structure 20 includes at least one film layer sequentially stacked along a direction away from the substrate 10. For instance, the functional structure 20 includes a first insulating layer, a first conductive pattern 201, a second insulating layer, a second conductive pattern 202, and a third insulating layer sequentially stacked along a direction away from the substrate 10. The first insulating layer, the first conductive pattern, the second insulating layer, the second conductive pattern, and the third insulating layer can all be formed simultaneously with the corresponding film layer of the display area 61 in the same patterning process, without requiring additional patterning processes. For example, the first conductive pattern can be fabricated in the same layer and with the same material as the first gate metal layer in the display area 61, and the second conductive pattern can be fabricated in the same layer and with the same material as the second gate metal layer in the display area 61. It should be noted that 203 in the drawings represents an insulating layer, including the first insulating layer, the second insulating layer, and the third insulating layer; the boundary of the insulating layer is not shown in the diagram.

[0069] For example, the functional structure 20 is formed as a raised structure, which can generate steps around its perimeter.

[0070] For example, the surface of the functional structure 20 facing away from the substrate 10 includes a planar portion 204 and a sloped portion 205; the orthographic projection of the sloped portion 205 on the substrate 10 surrounds the orthographic projection of the planar portion 204 on the substrate 10, but is not limited thereto.

[0071] For example, the orthographic projection of the boundary of the insulating isolation layer 40 on the substrate 10 overlaps with the orthographic projection of the inclined portion 205 on the substrate 10. For example, the boundary of the insulating isolation layer 40 may be located in the middle region of the inclined portion 205, but is not limited to this.

[0072] In the display substrate provided in the above embodiments, by setting the orthographic projection of the boundary of the insulating isolation layer 40 on the substrate 10 to overlap with the orthographic projection of the inclined portion 205 on the substrate 10, the edge portion of the insulating isolation layer 40 facing the surface of the substrate 10 can have a slope angle, and the slope angle α > 0°, so that the boundary of the insulating isolation layer 40 is located on the slope formed by the conductive isolation pillar 30. This is beneficial to increase the thickness of the edge portion of the insulating isolation layer 40, thereby effectively improving the isolation effect of the edge portion of the insulating isolation layer 40 between the conductive isolation pillar 30 and the first cathode portion 501, thereby better ensuring that the conductive isolation pillar 30 and the first cathode portion 501 can be completely insulated, and thus improving the GDSH problem caused by electrochemical corrosion.

[0073] like Figures 1 to 6 As shown, in some embodiments, the orthographic projection of the insulating isolation layer 40 on the substrate 10 at least partially overlaps with the orthographic projection of the planar portion 204 on the substrate 10.

[0074] For example, the orthographic projection of the planar portion 204 on the substrate 10 is located inside the orthographic projection of the insulating layer 40 on the substrate 10.

[0075] The above-described configuration allows both the conductive isolation pillar 30 and the insulating isolation layer 40 to cover at least a portion of the plane, and to set the boundary on the inclined portion 205. This enables the edge portion of the insulating isolation layer 40 facing the surface of the substrate 10 to have a slope angle, where the slope angle α > 0°. This places the boundary of the insulating isolation layer 40 on the slope formed by the conductive isolation pillar 30, which helps to increase the thickness of the edge portion of the insulating isolation layer 40. This effectively improves the isolation effect of the edge portion of the insulating isolation layer 40 between the conductive isolation pillar 30 and the first cathode portion 501, thereby better ensuring complete insulation between the conductive isolation pillar 30 and the first cathode portion 501, and thus improving the GDSH problem caused by electrochemical corrosion.

[0076] like Figures 1 to 6 As shown, in some embodiments, the functional structure includes a first insulating layer, a first conductive pattern 201, a second insulating layer, a second conductive pattern 202, and a third insulating layer sequentially stacked along a direction away from the substrate 10.

[0077] The orthographic projection of the second conductive pattern 202 on the substrate 10 is located inside the orthographic projection of the first conductive pattern 201 on the substrate 10. In a direction parallel to the substrate 10, the first conductive pattern 201 protrudes from the second conductive pattern 202 by a first distance d, the first distance d satisfying: 0.5μm≤d≤2μm.

[0078] For example, d can take values ​​such as 0.7μm, 1μm, 1.5μm, 1.7μm, etc., but is not limited to these.

[0079] For example, the boundary of the orthographic projection of the first conductive pattern 201 on the substrate 10 surrounds the orthographic projection of the second conductive pattern 202 on the substrate 10.

[0080] The above setting d satisfies: 0.5μm≤d≤2μm, so that the first conductive pattern 201 can protrude 0.5μm to 2μm in any direction around the second conductive pattern 202. This is beneficial to form a slope around the first conductive pattern 201 and the second conductive pattern 202, so that the surface of the functional structure facing away from the substrate has a sloped portion.

[0081] like Figures 7 to 12 As shown, in some embodiments, the display substrate includes at least two functional structures 20, with a trench 70 between adjacent functional structures 20, and at least a portion of the insulating isolation layer 40 is located within the trench 70.

[0082] The above configuration allows both the conductive isolation pillar 30 and the insulating isolation layer 40 to cover at least a portion of the trench 70, and to set the boundary on the inclined portion 205. This enables the edge portion of the insulating isolation layer 40 facing the surface of the substrate 10 to have a slope angle, where the slope angle α > 0°. This places the boundary of the insulating isolation layer 40 on the slope formed by the conductive isolation pillar 30, which helps to increase the thickness of the edge portion of the insulating isolation layer 40. This effectively improves the isolation effect of the edge portion of the insulating isolation layer 40 between the conductive isolation pillar 30 and the first cathode portion 501, thereby better ensuring complete insulation between the conductive isolation pillar 30 and the first cathode portion 501, and thus improving the GDSH problem caused by electrochemical corrosion.

[0083] like Figures 1 to 6 As shown, in some embodiments, the conductive isolation pillar 30 includes a first isolation layer 301, a second isolation layer 302, and a third isolation layer 303 sequentially stacked along a direction away from the substrate 10. The orthographic projection of the boundary of the first isolation layer 301 on the substrate 10 surrounds the orthographic projection of the second isolation layer 302 on the substrate 10. The orthographic projection of the first isolation layer 301 on the substrate 10 overlaps with the orthographic projection of the third isolation layer 303 on the substrate 10.

[0084] like Figures 7 to 12 As shown, in some embodiments, the conductive isolation pillar 30 includes a first isolation layer 301, a second isolation layer 302 and a third isolation layer 303 stacked sequentially in a direction away from the substrate 10, wherein the orthographic projection of the boundary of the first isolation layer 301 on the substrate 10 surrounds the orthographic projection of the second isolation layer 302 on the substrate 10.

[0085] The orthographic projection of the boundary of the first partition layer 301 on the substrate 10 surrounds the orthographic projection of the third partition layer 303 on the substrate 10; and / or, the orthographic projection of the second partition layer 302 on the substrate 10 overlaps with the orthographic projection of the third partition layer 303 on the substrate 10.

[0086] For example, the first partition layer 301 is made of metal Ti, the second partition layer 302 is made of metal Al, and the third partition layer 303 is made of metal Ti, but it is not limited to this.

[0087] For example, the edges of the first partition layer 301 and / or the third partition layer 303 protrude beyond the edge of the second partition layer 302, forming a notch on the side of the conductive isolation post 30.

[0088] With at least a portion of the insulating isolation layer 40 located within the trench 70, since the third partition layer 303 is attached to the insulating isolation layer 40, and the edge portion of the insulating isolation layer 40 has a slope angle, the edge portion of the third partition layer 303 also has the slope angle and is in an upward-curving state without support below. Thus, during subsequent water washing, the edge portion of the third partition layer 303 will fall off, while the edge portion of the insulating isolation layer 40 will remain. Because the edge portion of the third partition layer 303 protrudes beyond the second partition layer 302, it is still possible to ensure that both the organic light-emitting functional layer EL and the cathode layer 50 are disconnected at this point. Moreover, after the edge portion of the third partition layer 303 falls off, it can better ensure the insulation between the first cathode portion 501 and the conductive isolation pillar 30, thereby better improving the GDSH problem caused by electrochemical corrosion.

[0089] In some embodiments, the display substrate includes a source / drain metal layer and an organic planarization layer, the conductive isolation pillar 30 is disposed in the same layer and with the same material as the source / drain metal layer, and the insulating isolation layer 40 is disposed in the same layer and with the same material as the organic planarization layer.

[0090] The above configuration allows the conductive isolation pillar 30 and the source / drain metal layer to be formed simultaneously in the same patterning process, and the insulating isolation layer 40 and the organic planarization layer to be formed simultaneously in the same patterning process. Therefore, in the display substrate provided by the above embodiment, the conductive isolation pillar 30 and the insulating isolation layer 40 can be formed without increasing the patterning process steps, thereby improving GDSH without affecting production capacity and cost.

[0091] This invention also provides a display device, including the display substrate provided in the above embodiments.

[0092] It should be noted that the display device can be any product or component with display function, such as a television, monitor, digital photo frame, mobile phone, or tablet computer. The display device also includes flexible circuit boards, printed circuit boards, and backplanes.

[0093] In the display substrate provided in the above embodiments, an insulating isolation layer 40 is provided on the side of the conductive isolation pillar 30 facing away from the substrate 10, and a cathode layer 50 is provided on the side of the insulating isolation layer 40 facing away from the substrate 10. The cathode layer 50 is divided into a first cathode portion 501 and a second cathode portion 502 at the notch of the conductive isolation pillar 30. The first cathode portion 501 is located on the side of the insulating isolation layer 40 facing away from the substrate 10, and at least a portion of the orthographic projection of the second cathode portion 502 on the substrate 10 does not overlap with the orthographic projection of the insulating isolation layer 40 on the substrate 10. Since the insulating isolation layer 40 is insulating and is located between the conductive isolation pillar 30 and the first cathode portion 501, the insulating isolation layer 40 can insulate the conductive isolation pillar 30 and the first cathode portion 501 from each other, avoiding communication between the first cathode portion 501 and the second cathode portion 502 through the conductive isolation pillar 30, and preventing the conductive isolation pillar 30 from receiving electrical signals from the first cathode portion 501. Therefore, in the display substrate provided in the above embodiments, by providing the isolation region 63 including the conductive isolation pillar 30 and the insulating isolation layer 40, the possibility of forming a conductive path between the conductive isolation pillar 30 and the cathode layer 50 that transmits electrical signals is effectively reduced, thereby effectively improving the GDSH problem caused by electrochemical corrosion.

[0094] The display device provided in the embodiments of the present invention, when including the above-described display substrate, also has the above-described beneficial effects, which will not be repeated here.

[0095] This invention also provides a method for manufacturing a display substrate, used to manufacture the display substrate provided in the above embodiments; the display substrate includes: a display area 61, an aperture area 62, and an isolation area 63, wherein at least a portion of the display area 61 is located around the aperture area 62, and at least a portion of the isolation area 63 is located between the aperture area 62 and the display area 61; the manufacturing method includes:

[0096] Conductive isolation pillars 30 and insulating isolation layers 40 are fabricated in the isolation region 63; the conductive isolation pillars 30 have notches on their sides; the insulating isolation layer 40 is located on the side of the conductive isolation pillars 30 that faces away from the substrate 10 of the display substrate, and the orthographic projection of the conductive isolation pillars 30 on the substrate 10 is located inside the orthographic projection of the insulating isolation layer 40 on the substrate 10.

[0097] A cathode layer 50 is fabricated, the cathode layer 50 including a first cathode portion 501 and a second cathode portion 502. The first cathode portion 501 is located on the side of the insulating isolation layer 40 facing away from the substrate 10. At least a portion of the orthographic projection of the second cathode portion 502 on the substrate 10 does not overlap with the orthographic projection of the insulating isolation layer 40 on the substrate 10. The first cathode portion 501 and the second cathode portion 502 are disconnected at the notch.

[0098] In the display substrate fabricated using the manufacturing method provided in this embodiment of the invention, an insulating isolation layer 40 is disposed on the side of the conductive isolation pillar 30 facing away from the substrate 10, and a cathode layer 50 is disposed on the side of the insulating isolation layer 40 facing away from the substrate 10. The cathode layer 50 is divided into a first cathode portion 501 and a second cathode portion 502 at the notch of the conductive isolation pillar 30. The first cathode portion 501 is located on the side of the insulating isolation layer 40 facing away from the substrate 10, and at least a portion of the orthographic projection of the second cathode portion 502 on the substrate 10 does not overlap with the orthographic projection of the insulating isolation layer 40 on the substrate 10. Because the insulating isolation layer 40 is insulating and is located between the conductive isolation pillar 30 and the first cathode portion 501, the insulating isolation layer 40 can insulate the conductive isolation pillar 30 and the first cathode portion 501 from each other, preventing the first cathode portion 501 and the second cathode portion 502 from being connected through the conductive isolation pillar 30, and preventing the conductive isolation pillar 30 from receiving electrical signals from the first cathode portion 501. Therefore, in the display substrate manufactured using the manufacturing method provided in the embodiments of the present invention, by setting the isolation region 63 to include the conductive isolation pillar 30 and the insulating isolation layer 40, the possibility of forming a conductive path between the conductive isolation pillar 30 and the cathode layer 50 that transmits electrical signals is effectively reduced, thereby effectively improving the GDSH problem caused by electrochemical corrosion.

[0099] like Figures 1 to 12 As shown, in some embodiments, the steps of fabricating conductive isolation pillars 30 and insulating isolation layers 40 in the isolation region 63 specifically include:

[0100] Create the transition graphic for the isolation column;

[0101] An insulating isolation material layer is fabricated on the side of the isolation pillar transition pattern facing away from the substrate 10, and a patterning process is performed on the insulating isolation material layer to form an insulating isolation transition layer;

[0102] Using the insulating isolation transition layer as a mask, the transition pattern of the isolation pillar is patterned to form the conductive isolation pillar 30 and the insulating isolation layer 40. The edge portion of the insulating isolation layer 40 facing the surface of the substrate 10 has a slope angle α, where α > 0°.

[0103] For example, a source / drain metal material layer is formed, and a patterning process is performed on the source / drain metal material layer to form the isolation pillar transition pattern, as well as the conductive structure in the display substrate that needs to be formed using the source / drain metal material layer. For example, the orthographic projection of the insulating isolation transition layer on the substrate 10 is located inside the orthographic projection of the isolation pillar transition pattern on the substrate 10, and the boundary of the orthographic projection of the isolation pillar transition pattern on the substrate 10 surrounds the orthographic projection of the insulating isolation transition layer on the substrate 10.

[0104] For example, the source / drain metal layer may be a Ti film layer, an Al film layer and a Ti film layer stacked sequentially in a direction away from the substrate 10, but is not limited to this.

[0105] For example, a full-length insulating isolation material layer is formed on the side of the isolation pillar transition pattern facing away from the substrate 10. The insulating isolation material layer is then exposed and developed to form an insulating isolation transition layer. For example, an organic insulating layer material can be used to form the insulating isolation material layer, but it is not limited to this.

[0106] For example, when the insulating isolation transition layer is used as a mask to etch the transition pattern of the isolation pillar to form the conductive isolation pillar 30 and the insulating isolation layer 40, the boundary portion of the insulating isolation transition layer will be etched away due to the etching process, thereby forming the insulating isolation layer 40. Then, the conductive isolation pillar 30 is formed by etching with the insulating isolation layer 40 as a mask.

[0107] It should be noted that the thickness of the boundary portion of the formed insulating isolation layer 40 is greater than the thickness of the boundary portion of the insulating isolation transition layer. Due to the patterning process, the boundary portion of the insulating isolation transition layer is thinner than its adjacent portion, which becomes the boundary portion of the insulating isolation layer 40 after etching. Therefore, the thickness of the boundary portion of the formed insulating isolation layer 40 is greater than the thickness of the boundary portion of the insulating isolation transition layer. It is worth noting that the edge portion of the insulating isolation layer 40 includes the boundary portion of the insulating isolation layer 40.

[0108] For example, after the conductive isolation pillar 30 and the insulating isolation layer 40 are formed, an anode layer is fabricated. During the etching process to form the anode layer, the etching solution will undergo a displacement reaction with the exposed portion of the Al film layer, forming a notch on the side of the conductive isolation pillar 30.

[0109] In the fabrication method provided in the above embodiments, the insulating isolation transition layer is used as a mask to etch the transition pattern of the isolation pillar. A self-alignment technique is adopted so that the boundary of the insulating isolation layer 40 is at least flush with the boundary of the conductive isolation pillar 30, thereby effectively achieving insulation between the conductive isolation pillar 30 and the second cathode portion 502, thereby effectively improving the GDSH problem caused by electrochemical corrosion.

[0110] like Figures 1 to 12 As shown, in some embodiments, the manufacturing method further includes:

[0111] A conductive material layer is formed on the side of the insulating transition layer opposite to the substrate 10.

[0112] The steps of constructing the transition pattern of the isolation pillar using the insulating isolation transition layer as a mask specifically include:

[0113] The conductive material layer is etched to form a conductive pattern; simultaneously, over-etching is performed in the same etching process to form the conductive isolation pillar 30 and the insulating isolation layer 40.

[0114] For example, the conductive material layer may include only the second source / drain metal layer, or it may include both the second source / drain metal layer and the third source / drain metal layer, but it is not limited to this.

[0115] For example, when etching the conductive material layer to form the conductive pattern, the etching time can be extended. While forming the conductive pattern, the insulating isolation transition layer is used as a mask to etch the isolation pillar transition pattern, thereby forming the conductive isolation pillar 30 and the insulating isolation layer 40.

[0116] In the manufacturing method provided in the above embodiments, no additional patterning process is required to form the conductive isolation pillar 30 and the insulating isolation layer 40, so that the boundary of the insulating isolation layer 40 can be at least flush with the boundary of the conductive isolation pillar 30, thereby effectively achieving insulation between the conductive isolation pillar 30 and the second cathode portion 502, thereby effectively improving the GDSH problem caused by electrochemical corrosion.

[0117] like Figures 7 to 12As shown, in some embodiments, the display substrate includes: at least two functional structures 20, with a trench 70 between adjacent functional structures 20, and at least a portion of the insulating isolation layer 40 located within the trench 70;

[0118] After the conductive isolation pillars 30 and the insulating isolation layer 40 are fabricated in the isolation area 63, a water washing process is performed.

[0119] With at least a portion of the insulating isolation layer 40 located within the trench 70, since the third partition layer 303 is attached to the insulating isolation layer 40, and the edge portion of the insulating isolation layer 40 has a slope angle, the edge portion of the third partition layer 303 also has the slope angle and is in an upward-curving state without support below. Thus, during subsequent water washing, the edge portion of the third partition layer 303 will fall off, while the edge portion of the insulating isolation layer 40 will remain. Because the edge portion of the third partition layer 303 protrudes beyond the second partition layer 302, it is still possible to ensure that both the organic light-emitting functional layer EL and the cathode layer 50 are disconnected at this point. Moreover, after the edge portion of the third partition layer 303 falls off, it can better ensure the insulation between the first cathode portion 501 and the conductive isolation pillar 30, thereby better improving the GDSH problem caused by electrochemical corrosion.

[0120] It should be noted that, in the embodiments of the present invention, "same layer" can refer to film layers located on the same structural layer. Alternatively, for example, film layers located on the same layer can be layer structures formed by using the same film deposition process to form a specific pattern, and then patterning the film layer using the same photomask through a single patterning process. Depending on the specific pattern, the single patterning process may include multiple exposure, development, or etching processes, and the specific pattern in the formed layer structure can be continuous or discontinuous. These specific patterns may also be at different heights or have different thicknesses.

[0121] In the various method embodiments of the present invention, the sequence numbers of each step are not intended to limit the order of the steps. For those skilled in the art, any changes in the order of the steps without creative effort are also within the scope of protection of the present invention.

[0122] It should be noted that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the method embodiments are basically similar to the product embodiments, so the description is relatively simple, and the relevant parts can be referred to the description of the product embodiments.

[0123] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connection,” “coupled,” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships; these relative positional relationships may change accordingly when the absolute position of the described object changes.

[0124] It is understandable that when a component such as a layer, film, region, or substrate is referred to as being "above" or "below" another component, the component may be "directly" located "above" or "below" the other component, or there may be intermediate components present.

[0125] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0126] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A display substrate, characterized in that, include: A display area, a hole area, and an isolation area, wherein at least a portion of the display area is located around the hole area, and at least a portion of the isolation area is located between the hole area and the display area; The isolation area includes: A conductive isolation post, wherein the side of the conductive isolation post has a notch; An insulating isolation layer is located on the side of the substrate opposite to the conductive isolation pillar, and the orthographic projection of the conductive isolation pillar on the substrate is located inside the orthographic projection of the insulating isolation layer on the substrate. The cathode layer includes a first cathode portion and a second cathode portion. The first cathode portion is located on the side of the insulating isolation layer facing away from the substrate. At least a portion of the orthographic projection of the second cathode portion on the substrate does not overlap with the orthographic projection of the insulating isolation layer on the substrate. The first cathode portion and the second cathode portion are disconnected at the notch. The edge portion of the insulating layer facing the surface of the substrate has a slope angle α, where α > 0°. The display substrate further includes: at least one functional structure located in the isolation region, and at least a portion of the functional structure located on the side of the conductive isolation pillar facing the substrate, the functional structure forming a step around its periphery, the surface of the functional structure facing away from the substrate including a planar portion and a beveled portion; the orthographic projection of the boundary of the insulating isolation layer on the substrate overlaps with the orthographic projection of the beveled portion on the substrate; the orthographic projection of the beveled portion on the substrate surrounds the orthographic projection of the planar portion on the substrate.

2. The display substrate according to claim 1, characterized in that, The boundary of the orthographic projection of the insulating isolation layer onto the substrate at least partially overlaps with the boundary of the orthographic projection of the conductive isolation pillar onto the substrate.

3. The display substrate according to claim 1 or 2, characterized in that, The orthographic projection of the insulating isolation layer on the substrate at least partially overlaps with the orthographic projection of the planar portion on the substrate.

4. The display substrate according to claim 3, characterized in that, The orthographic projection of the planar portion onto the substrate lies within the orthographic projection of the insulating layer onto the substrate.

5. The display substrate according to claim 1 or 2, characterized in that, The display substrate includes at least two functional structures, with a trench between adjacent functional structures, and at least a portion of the insulating layer is located within the trench.

6. The display substrate according to claim 5, characterized in that, The conductive isolation pillar includes a first isolation layer, a second isolation layer and a third isolation layer stacked sequentially in a direction away from the substrate, wherein the orthographic projection of the boundary of the first isolation layer on the substrate surrounds the orthographic projection of the second isolation layer on the substrate. The orthographic projection of the boundary of the first partition layer on the substrate surrounds the orthographic projection of the third partition layer on the substrate. And / or, the orthographic projection of the second partition layer on the substrate overlaps with the orthographic projection of the third partition layer on the substrate.

7. The display substrate according to claim 1, characterized in that, The display substrate includes a source / drain metal layer and an organic planarization layer. The conductive isolation pillars are disposed in the same layer and with the same material as the source / drain metal layer, and the insulating isolation layer is disposed in the same layer and with the same material as the organic planarization layer.

8. The display substrate according to claim 1, characterized in that, The isolation area surrounds the hole area, and the display area surrounds the isolation area; The display substrate further includes a light-emitting functional layer that extends from the display area to the isolation area and is broken at the notch of the conductive isolation pillar.

9. The display substrate according to claim 1 or 2, characterized in that, The functional structure includes a first insulating layer, a first conductive pattern, a second insulating layer, a second conductive pattern, and a third insulating layer, which are sequentially stacked along a direction away from the substrate. The orthographic projection of the second conductive pattern on the substrate is located inside the orthographic projection of the first conductive pattern on the substrate. In a direction parallel to the substrate, the first conductive pattern protrudes from the second conductive pattern by a first distance d, which satisfies: 0.5μm≤d≤2μm.

10. A display device, characterized in that, Includes the display substrate as described in any one of claims 1 to 9.

11. A method for manufacturing a display substrate, characterized in that, Used to manufacture a display substrate as described in any one of claims 1 to 9; The display substrate includes: a display area, an aperture area, and an isolation area, wherein at least a portion of the display area is located around the aperture area, and at least a portion of the isolation area is located between the aperture area and the display area; the manufacturing method includes: Conductive isolation pillars and insulating isolation layers are fabricated in the isolation area; the side of the conductive isolation pillar has a notch; the insulating isolation layer is located on the side of the conductive isolation pillar facing away from the substrate of the display substrate, and the orthographic projection of the conductive isolation pillar on the substrate is located inside the orthographic projection of the insulating isolation layer on the substrate. A cathode layer is fabricated, the cathode layer including a first cathode portion and a second cathode portion, the first cathode portion being located on the side of the insulating isolation layer facing away from the substrate, at least a portion of the orthogonal projection of the second cathode portion on the substrate not overlapping with the orthogonal projection of the insulating isolation layer on the substrate, and the first cathode portion and the second cathode portion being disconnected at the notch; The edge portion of the insulating layer facing the surface of the substrate has a slope angle α, where α > 0°. The display substrate further includes: at least one functional structure located in the isolation region, and at least a portion of the functional structure located on the side of the conductive isolation pillar facing the substrate, the functional structure forming a step around its periphery, the surface of the functional structure facing away from the substrate including a planar portion and a beveled portion; the orthographic projection of the boundary of the insulating isolation layer on the substrate overlaps with the orthographic projection of the beveled portion on the substrate; the orthographic projection of the beveled portion on the substrate surrounds the orthographic projection of the planar portion on the substrate.

12. The method for manufacturing a display substrate according to claim 11, characterized in that, The steps of fabricating conductive isolation pillars and insulating isolation layers in the isolation region specifically include: Create the transition graphic for the isolation column; An insulating isolation material layer is fabricated on the side of the isolation pillar transition pattern facing away from the substrate, and the insulating isolation material layer is patterned to form an insulating isolation transition layer. Using the insulating isolation transition layer as a mask, the transition pattern of the isolation pillar is patterned to form the conductive isolation pillar and the insulating isolation layer.

13. The method for manufacturing a display substrate according to claim 12, characterized in that, The manufacturing method further includes: A conductive material layer is formed on the side of the insulating transition layer that faces away from the substrate. The steps of constructing the transition pattern of the isolation pillar using the insulating isolation transition layer as a mask specifically include: The conductive material layer is etched to form a conductive pattern; simultaneously, over-etching is performed in the same etching process to form the conductive isolation pillars and the insulating isolation layer.

14. The method for manufacturing a display substrate according to any one of claims 11 to 13, characterized in that, The display substrate includes at least two functional structures, with a trench between adjacent functional structures, and at least a portion of the insulating layer is located within the trench. After the conductive isolation pillars and insulating isolation layers are fabricated in the isolation area, a water washing process is performed.

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