A bonding fixture for compensating for bonding deformation

Abstract

A bonding fixture for compensating for bonding deformation is used to assist in the bonding of a compound. The bonding fixture includes an upper fixture and a lower fixture. The upper fixture has a centrally protruding upper working surface with an upper center point at its most convex position. The lower fixture has a centrally protruding lower working surface opposite to the upper working surface with a lower center point at its most convex position. A bonding space is formed between the upper and lower fixtures. When the compound to be bonded is placed in this space, the upper and lower center points respectively align with the two end faces of the compound. The bonding space is surrounded by a compensating bonding space to provide space for deformation of the compound during the bonding process. Therefore, this invention solves the problems of the prior art, effectively compensates for bonding deformation, assists in the bonding of the compound, better reduces warpage and breakage rate, and significantly saves costs.

Description

Technical Field

[0001] This invention relates to a bonding fixture, and more particularly to a bonding fixture for compensating for bonding deformation. Background Technology

[0002] Wafer bonding refers to the bonding between the pixel light-emitting module panel and the wafer module. Please refer to... Figure 1 , Figure 1 This is a schematic diagram of the bonding fixture P1 according to the prior art. Figure 1 As shown, the bonding fixture P1 used in the prior art includes an upper fixture P11, a lower fixture P12, and an intermediate retaining ring P13. The upper fixture P11 has multiple first positioning holes P111, the intermediate retaining ring P13 has multiple second positioning holes P131, and the lower fixture P12 has multiple positioning posts P121. Each first positioning hole P111 corresponds to a corresponding positioning post P121, and each second positioning hole P131 corresponds to a corresponding positioning post P121. Therefore, during assembly, the intermediate retaining ring P13 is positioned between the upper fixture P11 and the lower fixture P12, and the center of the intermediate retaining ring P13 has a bonding space for the wafer to be placed within it. Each positioning post P121 passes through the corresponding first positioning hole P111 and second positioning hole P121.

[0003] Because wafer bonding is performed under high temperature and high pressure conditions, and because the bonding materials (including the substrate and bonding layers) within the wafer have different coefficients of thermal expansion, stress deformation (known in the industry as warpage) occurs on the substrate during or for a period after bonding. Since there is insufficient space within the bonding materials to release this stress deformation, fragmentation occurs when the deformation exceeds the limits the bonding materials can withstand. In existing bonding fixtures, the upper and lower fixtures are parallel flat plates, ensuring a tight fit between the wafer and the fixtures. However, the high warpage of the bonding materials, combined with the tight fit between the wafer and the fixture, results in no space for stress release, leading to a high wafer breakage rate during bonding. Therefore, providing a bonding fixture that compensates for bonding deformation is a crucial research topic and direction. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide a bonding fixture for compensating for bonding deformation. It has a simple structure, is easy to operate, can solve the problems of the prior art, effectively compensate for bonding deformation, assist the desired compound in bonding, and can better reduce warpage and breakage rate, thus significantly saving costs.

[0005] To achieve the above objectives, this invention discloses a bonding fixture for compensating for bonding deformation, used to assist in the bonding of a compound, characterized by comprising:

[0006] An upper fixture having an upper working surface with a central protrusion, the upper working surface having an upper center point located at the most convex position of the central protrusion; and

[0007] A lower fixture has a lower working surface with a central protrusion opposite to the upper working surface, and the lower working surface has a lower center point located at the most convex position of the central protrusion.

[0008] The upper fixture and the lower fixture form a bonding space for the desired composite to be placed in the bonding space. When the desired composite is placed therein, the upper center point and the lower center point will respectively mate with the two end faces of the desired composite. The bonding space is surrounded by a compensating bonding space to provide space for the desired composite to deform during the bonding process.

[0009] It further includes an intermediate retaining ring, which is fitted around the upper fixture and the lower fixture to restrict the relative positions between the upper fixture, the compound to be bonded, and the lower fixture. When assembled, the upper fixture, the intermediate retaining ring, and the lower fixture form a compensation bonding cavity containing the compensation bonding space.

[0010] The upper fixture further includes an upper positioning outer ring, which is disposed around the periphery of the upper fixture away from the lower fixture. The thickness of the upper positioning outer ring is less than the thickness of the upper fixture to form an upper positioning step difference with the upper working surface. The lower fixture further includes a lower positioning outer ring, which is disposed around the periphery of the lower fixture away from the upper fixture. The thickness of the lower positioning outer ring is less than the thickness of the lower fixture to form a lower positioning step difference with the lower working surface. During assembly, the intermediate retaining ring is sleeved around the periphery of the upper positioning step difference and the lower positioning step difference, and the intermediate retaining ring is sandwiched between the upper positioning outer ring and the lower positioning outer ring, so that the thickness of the compensating bonding cavity is limited by the thickness of the intermediate retaining ring.

[0011] The thickness of the intermediate retaining ring is greater than the sum of the upper positioning step difference and the lower positioning step difference.

[0012] The upper fixture has an upper positioning flat edge located around the upper working surface, the inner side of the middle retaining ring has a middle positioning flat edge, and the lower fixture has a lower positioning flat edge located around the lower working surface. When assembled, the middle retaining ring is sleeved on the periphery of the upper fixture and the lower fixture, and the upper positioning flat edge and the lower positioning flat edge are in contact with the middle positioning flat edge to limit the relative positions of the upper fixture, the middle retaining ring, and the lower fixture to prevent mutual rotation and misalignment.

[0013] The upper fixture has an upper positioning point, the lower fixture has a lower positioning point, the intermediate retaining ring has a first intermediate positioning point opposite to the upper positioning point, and a second positioning point opposite to the lower positioning point. When assembled, the upper positioning point and the first intermediate positioning point are combined, and the lower positioning point and the second intermediate positioning point are combined to limit the relative positions of the upper fixture, the intermediate retaining ring, and the lower fixture to prevent mutual rotation and misalignment. The upper positioning point and the first intermediate positioning point, and the second intermediate positioning point and the lower positioning point are concave and convex points with corresponding shapes.

[0014] The inner side of the intermediate retaining ring is recessed with a chip removal groove for removing the desired bonding compound placed in the bonding space.

[0015] The upper fixture has a tapered or arc-shaped structure with a continuously decreasing thickness from the upper center point of the upper working surface to the periphery; the lower fixture has a tapered or arc-shaped structure with a continuously decreasing thickness from the lower center point of the lower working surface to the periphery.

[0016] The taper of the upper fixture's conical structure or the curvature of its arc structure are equal to the taper of the lower fixture's conical structure or the curvature of its arc structure.

[0017] The upper fixture further includes an upper positioning ring portion surrounding the upper working surface, and the thickness of the upper positioning ring portion is greater than the thickness of the upper working surface; the lower fixture further includes a lower positioning ring portion surrounding the lower working surface, and the thickness of the lower positioning ring portion is greater than the thickness of the lower working surface; when assembled, the upper positioning ring portion fits into the lower positioning ring portion, and a compensation bonding cavity containing the compensation bonding space is formed between the upper fixture and the lower fixture.

[0018] As described above, existing bonding fixtures, compared to those mentioned in the prior art, cannot compensate for the bonding warpage of the bonding material, leading to a high wafer breakage rate. To address this, the present invention utilizes a compensating bonding cavity formed between the upper and lower fixtures, allowing the bonding material sufficient space to release stress deformation during the bonding process, thereby reducing warpage and the breakage rate. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a bonding fixture based on existing technology.

[0020] Figure 2 This is a structural cross-sectional schematic diagram of a bonding fixture for compensating for bonding deformation according to a first specific embodiment of the present invention.

[0021] Figure 3 According to Figure 2Further structural schematic diagrams of the bonding space and the compensation bonding space are provided.

[0022] Figure 4 This is a structural cross-sectional schematic diagram of a bonding fixture for compensating for bonding deformation according to a second specific embodiment of the present invention.

[0023] Figure 5 This is a structural cross-sectional schematic diagram of a bonding fixture for compensating for bonding deformation according to a third specific embodiment of the present invention.

[0024] Figure 6 According to Figure 5 A structural decomposition diagram.

[0025] Figure 7 This is a structural cross-sectional schematic diagram of a bonding fixture for compensating bonding deformation according to a fourth specific embodiment of the present invention.

[0026] Figure 8 According to Figure 7 A structural decomposition diagram.

[0027] Figure 9 This is a structural cross-sectional schematic diagram of a bonding fixture for compensating bonding deformation according to a fifth specific embodiment of the present invention. Detailed Implementation

[0028] To make the advantages, spirit, and features of the present invention more readily and clearly understood, detailed descriptions and discussions will follow with reference to the accompanying drawings. It is important to note that these embodiments are merely representative examples of the present invention. However, they can be implemented in many different forms and are not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the present invention more thorough and complete.

[0029] The terminology used in the various embodiments disclosed herein is for the purpose of describing particular embodiments only and is not intended to limit the various embodiments disclosed herein. The singular form used herein also includes the plural form unless the context clearly indicates otherwise. Unless otherwise specified, all terms used in this specification (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the various embodiments disclosed herein pertain. The foregoing terms (such as those defined in commonly used dictionaries) are to be interpreted as having the same meaning as in the context of the same technical field and are not to be interpreted as having an idealized or overly formal meaning unless clearly defined in the various embodiments disclosed herein.

[0030] Please see Figure 2 and Figure 3 , Figure 2This is a schematic cross-sectional view of the bonding fixture 1 for compensating bonding deformation according to a first specific embodiment of the present invention. Figure 3 According to Figure 2 Further structural schematic diagrams of bonding space 13 and compensating bonding space 131 are provided. Figure 2 and Figure 3 As shown, one aspect of the present invention is to provide a bonding fixture 1 for compensating for bonding deformation, in order to solve the problems of the prior art. The bonding fixture 1 for compensating for bonding deformation is used to assist in the bonding of a compound C to be bonded. The bonding fixture 1 of the present invention includes an upper fixture 11 and a lower fixture 12. The upper fixture 11 has an upper working surface 111 with a central protrusion. The upper working surface 111 has an upper center point 112 located at the most convex position of the central protrusion. The lower fixture 12 has a lower working surface 121 with a central protrusion opposite to the upper working surface 111. The lower working surface 121 has a lower center point 122 located at the most convex position of the central protrusion. A bonding space 13 is formed between the upper fixture 11 and the lower fixture 12 (e.g., ...). Figure 3 The space enclosed by the thick dashed line is for the desired bonding compound C to be placed in the bonding space 13. When the desired bonding compound C is placed therein, the upper center point 112 and the lower center point 122 will respectively align with the two end faces of the desired bonding compound C. The bonding space 13 is surrounded by a compensating bonding space 131 (such as...). Figure 3 (The portion represented by squares in the text). Specifically, since the upper working surface 111 and the lower working surface 121 have a centrally convex and peripherally concave structure, the compensating bonding space 131 refers to the space between the concave portion around the upper working surface 111 and the desired bond compound C, and the space between the concave portion around the lower working surface 121 and the desired bond compound C. The compensating bonding space 131 is used to provide space for the desired bond compound C to deform during the bonding process.

[0031] Please see Figure 4 , Figure 4 This is a schematic cross-sectional view of the bonding fixture 1 for compensating bonding deformation according to a second specific embodiment of the present invention. Figure 4As shown, compared to the first embodiment, the bonding fixture 1 in the second embodiment further includes an intermediate retaining ring 14 sleeved around the upper fixture 11 and the lower fixture 12. The intermediate retaining ring 14 is used to restrict the relative positions between the upper fixture 11, the desired bonding compound C, and the lower fixture 12, so as to prevent the upper fixture 11, the desired bonding compound C, and the lower fixture 12 from misaligning during the bonding process, causing the position of the desired bonding compound C to shift. In detail, the intermediate retaining ring 14 ensures that the upper center point 112 of the upper fixture 11 and the lower center point 122 of the lower fixture 12 are located on the same axis. In this way, the upper fixture 11 and the lower fixture 12 will conform to the relative positions of the two end faces of the desired bonding compound C, ensuring that the desired bonding compound C can be horizontally positioned in the bonding space 13. When the desired bonding compound C is horizontally positioned in the bonding space 13, sufficient compensating bonding space 131 can be reserved between the upper fixture 11 and the desired bonding compound C, and between the lower fixture 12 and the desired bonding compound C. Conversely, if the desired bonding compound C is positioned non-horizontally in the bonding space 13, it may cause a portion of the desired bonding compound C to be completely adhered to the upper fixture 11 or the lower fixture 12 without sufficient compensating bonding space 131. During assembly, a closed compensating bonding cavity 15 is formed between the upper fixture 11, the intermediate retaining ring 14, and the lower fixture 12. This compensating bonding cavity 15 contains the compensating bonding space 131.

[0032] Please see Figure 5 and Figure 6 , Figure 5 This is a schematic cross-sectional view of the bonding fixture 1 for compensating bonding deformation according to a third specific embodiment of the present invention. Figure 6 According to Figure 5 A structural decomposition diagram. (See diagram below.) Figure 5 and Figure 6 As shown, compared to the second embodiment, in the third embodiment, the bonding fixture 1 further includes an upper positioning outer ring 113 surrounding the upper fixture 11 away from the lower fixture 12. The thickness of the upper positioning outer ring 113 is less than the thickness of the upper fixture 11 to form an upper positioning step 114 with the upper working surface 111. The lower fixture 12 further includes a lower positioning outer ring 123 surrounding the lower fixture 12 away from the upper fixture 11. The thickness of the lower positioning outer ring 123 is less than the thickness of the lower fixture 12 to form a lower positioning step 124 with the lower working surface 111. During assembly, an intermediate retaining ring 14 is sleeved around the upper positioning step 114 and the lower positioning step 124, and the intermediate retaining ring 14 is clamped between the upper positioning outer ring 113 and the lower positioning outer ring 123, so that the thickness of the bonding cavity 15 is limited and compensated by the thickness of the intermediate retaining ring 14. In this way, it can be ensured that the upper center point 112 and the lower center point 122 are in a state of close contact with the material to be bonded C, thus avoiding the problem of the upper center point 112 and the lower center point 122 clamping the material to be bonded C too tightly and causing fragmentation.

[0033] In practical applications, the thickness of the intermediate retaining ring is greater than the sum of the upper and lower positioning step differences. Furthermore, the thickness of the intermediate retaining ring is greater than or equal to the sum of the upper positioning step difference, the thickness of the desired bond, and the lower positioning step difference.

[0034] Please refer to the following: Figure 6 ,like Figure 6 As shown, the upper fixture 11 further has an upper positioning flat edge 115 located around the upper working surface 111. The inner side of the intermediate retaining ring 14 further has a middle positioning flat edge 141. The lower fixture 12 further has a lower positioning flat edge 125 located around the lower working surface 121. During assembly, the intermediate retaining ring 14 is fitted around the upper fixture 11 and the lower fixture 12, and the upper positioning flat edge 115 and the lower positioning flat edge 125 are in contact with the middle positioning flat edge 141 to restrict the relative positions of the upper fixture 11, the intermediate retaining ring 14, and the lower fixture 12 to prevent mutual rotational misalignment. In this way, during the bonding process, the middle positioning flat edge 141 restricts the position of the upper positioning flat edge 115 and the lower positioning flat edge 125, so that the upper fixture 11 and the lower fixture 12 cannot rotate, thereby avoiding the problem of fragmentation of the compound C to be bonded due to rotational misalignment.

[0035] In addition to the aforementioned method of restricting rotation using upper, middle, and lower positioning flat edges, the method also includes the use of positioning points for restriction. Specifically, the upper fixture has an upper positioning point. The lower fixture has a lower positioning point. The middle retaining ring has a first middle positioning point opposite to the upper positioning point, and a second positioning point opposite to the lower positioning point. During assembly, the upper positioning point combines with the first middle positioning point, and the lower positioning point combines with the second middle positioning point, to restrict the relative positions of the upper fixture, the middle retaining ring, and the lower fixture, preventing mutual rotational misalignment. The upper positioning point and the first middle positioning point, and the second middle positioning point and the lower positioning point, are corresponding concave and convex points. It should be noted that the method of restricting the rotation of the upper and lower fixtures is not limited to this.

[0036] Please see Figures 5 to 8 , Figure 7 This is a schematic cross-sectional view of the bonding fixture 1 for compensating bonding deformation according to the fourth specific embodiment of the present invention. Figure 8 According to Figure 7 A structural decomposition diagram. (From...) Figure 5 and Figure 6 It can be seen that the upper fixture 11 in the third specific embodiment has a tapered structure with a continuously decreasing thickness from the upper center point 112 of the upper working surface 111 to the periphery, and the lower working surface 121 has a tapered structure with a continuously decreasing thickness from the lower center point 122 of the lower working surface 121 to the periphery. Figure 7 and Figure 8In the fourth specific embodiment, the upper fixture 11 has a continuously decreasing thickness arc-shaped structure from the upper center point 112 of the upper working surface 111 to the periphery, and the lower working surface 121 has a continuously decreasing thickness arc-shaped structure from the lower center point 122 of the lower working surface 121 to the periphery. In practical applications, the taper or arc of the tapered structure of the upper fixture 11 is equal to the taper or arc of the tapered structure of the lower fixture 12. The values ​​of the bending arc and bending taper of the tapered and arc structures are generally very small, and the specific values ​​of the bending arc and bending taper are designed according to the actual production requirements of the desired bonding compound.

[0037] Please see Figure 9 , Figure 9 This is a schematic cross-sectional view of the bonding fixture 1 for compensating bonding deformation according to a fifth embodiment of the present invention. Compared with the previous embodiments, the upper fixture 11 of the bonding fixture 1 in the fifth embodiment further has an upper positioning ring portion 116 surrounding the outer periphery of the upper working surface 111. The thickness of the upper positioning ring portion 116 is greater than the thickness of the upper working surface 111. The lower fixture 12 further has a lower positioning ring portion 126 surrounding the outer periphery of the lower working surface 121. The thickness of the lower positioning ring portion 126 is greater than the thickness of the lower working surface 121. When assembled, the upper positioning ring portion 116 fits against the lower positioning ring portion 126 to form an intermediate retaining ring as shown in the previous embodiments, and a compensating bonding cavity 15 containing a compensating bonding space 131 is formed between the upper fixture 11 and the lower fixture 12.

[0038] It should be noted that the upper fixture, upper positioning outer ring and upper positioning ring part, as well as the lower fixture, lower positioning outer ring and lower positioning ring part mentioned above, can be assembled separately or can be integrally formed, and are not limited thereto.

[0039] In addition, such as Figure 6 and Figure 8 As shown, the inner side of the intermediate retaining ring 14 is recessed with a take-up groove 142 for removing the desired bonding compound C placed in the bonding space 13. It should be noted that the structure used to remove the desired bonding compound C is not limited to this.

[0040] Through the above technical solution, the present invention aims to provide a bonding fixture in the shape of an arc or other curved or conical surfaces. By compensating for the bending deformation of the composite material during the bonding process, it allows the bonding materials sufficient space to release stress deformation, thereby reducing warpage and fragmentation rate. This solves the problem of frequent fragmentation of the composite material and effectively reduces its fragmentation rate.

[0041] The basic working principle of the bonding fixture of this invention is that the desired composite material undergoes a slight deformation during the bonding process, increasing the surface area and volume of the substrate during bonding. This increased surface area and volume provides space for the composite material to undergo bending deformation during bonding, effectively reducing the warpage of the bonded composite material (from the original 500-600 μm to ≤200 μm) and the breakage rate (from the original 20% to ≤2%), thereby significantly saving production and processing costs. Furthermore, after the bonding operation is completed, because the bonded shape of the composite material is slightly curved, it can compensate for the deformation change during recovery, making breakage less likely.

[0042] The detailed description of the specific embodiments above is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the invention to the specific embodiments disclosed above. Rather, the aim is to cover various modifications and equivalent arrangements within the scope of the patent claims made by the present invention.

Claims

1. A bonding fixture for compensating for bonding deformation, used to assist in the bonding of a compound, characterized in that... Include: An upper fixture having an upper working surface with a central protrusion, the upper working surface having an upper center point located at the most convex position of the central protrusion; and A lower fixture has a lower working surface with a central protrusion opposite to the upper working surface, and the lower working surface has a lower center point located at the most convex position of the central protrusion. The upper fixture and the lower fixture form a bonding space for the desired composite to be placed in the bonding space. When the desired composite is placed therein, the upper center point and the lower center point will respectively mate with the two end faces of the desired composite. The bonding space is surrounded by a compensating bonding space to provide space for the desired composite to deform during the bonding process. The bonding fixture further includes an intermediate retaining ring, which is sleeved around the upper fixture and the lower fixture to limit the relative positions between the upper fixture, the compound to be bonded, and the lower fixture. When assembled, the upper fixture, the intermediate retaining ring, and the lower fixture form a compensating bonding cavity containing the compensating bonding space. The upper fixture further includes an upper positioning outer ring, which is disposed around the periphery of the upper fixture away from the lower fixture. The thickness of the upper positioning outer ring is less than the thickness of the upper fixture to form an upper positioning step difference with the upper working surface. The lower fixture further includes a lower positioning outer ring, which is disposed around the periphery of the lower fixture away from the upper fixture. The thickness of the lower positioning outer ring is less than the thickness of the lower fixture to form a lower positioning step difference with the lower working surface. During assembly, the intermediate retaining ring is sleeved around the periphery of the upper positioning step difference and the lower positioning step difference, and the intermediate retaining ring is sandwiched between the upper positioning outer ring and the lower positioning outer ring, so that the thickness of the compensating bonding cavity is limited by the thickness of the intermediate retaining ring. The thickness of the intermediate retaining ring is greater than the sum of the upper positioning step difference and the lower positioning step difference.

2. The bonding fixture for compensating for bonding deformation as described in claim 1, characterized in that, The upper fixture has an upper positioning flat edge located around the upper working surface, the inner side of the intermediate retaining ring has a middle positioning flat edge, and the lower fixture has a lower positioning flat edge located around the lower working surface. When assembled, the intermediate retaining ring is sleeved on the periphery of the upper fixture and the lower fixture, and the upper positioning flat edge and the lower positioning flat edge are in contact with the middle positioning flat edge to limit the relative positions of the upper fixture, the intermediate retaining ring and the lower fixture to avoid mutual rotation and misalignment.

3. The bonding fixture for compensating for bonding deformation as described in claim 1, characterized in that, The upper fixture has an upper positioning point, the lower fixture has a lower positioning point, and the intermediate retaining ring has a first intermediate positioning point opposite to the upper positioning point and a second intermediate positioning point opposite to the lower positioning point. When assembled, the upper positioning point and the first intermediate positioning point are combined, and the lower positioning point and the second intermediate positioning point are combined to limit the relative positions of the upper fixture, the intermediate retaining ring and the lower fixture to prevent mutual rotation and misalignment. The upper positioning point and the first intermediate positioning point, and the second intermediate positioning point and the lower positioning point are concave and convex points with corresponding shapes.

4. The bonding fixture for compensating for bonding deformation as described in claim 1, characterized in that, The inner side of the intermediate retaining ring is recessed with a chip removal groove for removing the desired bonding compound placed in the bonding space.

5. The bonding fixture for compensating bonding deformation as described in claim 1, characterized in that, The upper fixture has a tapered or arc-shaped structure with a continuously decreasing thickness from the upper center point of the upper working surface to the periphery; the lower fixture has a tapered or arc-shaped structure with a continuously decreasing thickness from the lower center point of the lower working surface to the periphery.

6. The bonding fixture for compensating bonding deformation as described in claim 5, characterized in that, The taper of the upper fixture's tapered structure or the curvature of its arc-shaped structure is equal to the taper of the lower fixture's tapered structure or the curvature of its arc-shaped structure.

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