Mechanical-electrical-thermal integrated satellite structure and processing method

Abstract

The application provides a mechatronic satellite structure and a processing method, and belongs to the field of spaceflight. The application solves the problem of low assembly efficiency and the problem of being not conducive to automatic production of satellites caused by overlapping of a large number of manual processes in the assembly of the existing satellites. The application provides a mechatronic satellite structure, which comprises: a heat conduction layer, structure layers symmetrically arranged on two side end faces; a circuit layer connected to the side end face of one side structure layer away from the heat conduction layer; and a surface layer connected to the side end face of the other side structure layer away from the heat conduction layer. The application is mainly used on satellites.

Description

Technical Field

[0001] This invention belongs to the aerospace field, and in particular relates to an electromechanical-thermal integrated satellite structure and its processing method. Background Technology

[0002] With the explosive growth in demand for satellites, satellite production is shifting from single-satellite customization to automated mass production. Currently, satellite structure, unit installation, cable laying, and thermal control implementation belong to different assembly processes, each consisting of numerous overlapping steps, which hinders the efficiency of automated production lines. To adapt to automated equipment, the currently manual processes such as cable laying and heating element attachment need to be integrated into a multi-functional structure to facilitate automated satellite production.

[0003] For example, Chinese patent CN114537719A describes a multifunctional flexible satellite structure. Its main structure is a mounting plate with heat dissipation and heat conduction surfaces. Heat pipes are located inside the mounting plate, and a carbonized graphene film is adhered to the heat conduction surface. A cable network for electrical signal transmission is then attached to the graphene film. This solution can save time in satellite thermal control implementation and cable network laying, enabling rapid mass production of satellites.

[0004] This solution has the following shortcomings:

[0005] 1. The graphene film on the heat-conducting surface is bonded together, which results in a low degree of integration with the structure. Furthermore, a cable mesh needs to be bonded to the graphene film, which has very low strength. This process is not very reliable.

[0006] 2. The heat pipes are pre-embedded inside the mounting plate using traditional technology. The mounting plate needs to be thick enough to accommodate the heat pipes, so it has no advantage in terms of size and weight, and the cost is relatively high.

[0007] 3. Low integration of thermal control technology. Thin-film heating elements and sensors are not integrated into the structure, nor are easily changeable surface properties integrated. Many manual operations still exist, which limits the improvement of efficiency for mass production. Summary of the Invention

[0008] In view of this, the present invention aims to propose an electromechanical and thermal integrated satellite structure and processing method to solve the problem that the existing satellite assembly process involves a large number of overlapping manual processes, resulting in low assembly efficiency and hindering automated satellite production.

[0009] To achieve the above objectives, the present invention adopts the following technical solution: According to one aspect of the present invention, an electromechanical-thermal integrated satellite structure is provided, comprising:

[0010] Thermally conductive layer, with structural layers symmetrically arranged on both end faces;

[0011] The circuit layer is connected to the end face of one side of the structural layer that is away from the heat-conducting layer.

[0012] The surface layer is connected to the end face of the structural layer on the other side away from the heat-conducting layer.

[0013] Furthermore, the structural layer is a 2A12 aluminum alloy layer.

[0014] Furthermore, the thermally conductive layer is a graphite-aluminum composite material.

[0015] Furthermore, the two thermally conductive layers and the structural layer are vacuum sintered to form a sandwich structure.

[0016] Furthermore, the circuit layer is a printed circuit board.

[0017] Furthermore, a bus-type temperature sensor is provided on the circuit layer.

[0018] Furthermore, a resistive heating area is provided on the circuit layer.

[0019] Furthermore, the surface layer consists of a carbon nanofilm and an organic paint film, each occupying a certain proportion of the end face and both facing outwards from the satellite cabin.

[0020] According to another aspect of the present invention, a method for processing an electromechanical-thermal integrated satellite structure as described above is provided, comprising the following steps: placing structural layers on both sides of a thermally conductive layer and sintering them at high temperature to form a sandwich structure; bonding a designed circuit layer to one end face of the sandwich structure; and bonding a surface layer designed according to thermal design requirements to the other end face of the sandwich structure.

[0021] Furthermore, the circuit layer is at 10 -1 The material was bonded to the sandwich structure under vacuum of 140 MPa, temperature of 140°C, and bonding surface pressure of 0.5 MPa for 30 minutes, and the bonding strength was greater than 20 MPa.

[0022] Compared with the prior art, the beneficial effects of the present invention are:

[0023] 1. The satellite structure forms a sandwich structure through a heat-conducting layer and a structural layer, and integrates the circuit layer on the satellite structure. It can be designed and optimized in an integrated manner during the satellite design stage and formed in an integrated manner during the manufacturing stage, which minimizes the manual process in the final assembly stage and is conducive to mass automated production.

[0024] 2. The structure of this satellite utilizes graphite aluminum composite material and 2A12 aluminum alloy to form a "sandwich" layer, with an in-plane thermal conductivity of over 600W / m / K. While providing support, it can replace the traditional satellite pre-embedded channel heat pipe solution, resulting in a smaller size and lower cost.

[0025] 3. This satellite structure uses a circuit layer instead of metal wires to braid cables, resulting in lower mass production costs and higher efficiency as no wiring is required during satellite assembly.

[0026] 4. The satellite's structural circuit layer is designed with a heating area and a bus-type temperature sensor, replacing the solution of manually pasting thin film heating elements and sensors, thus improving production efficiency;

[0027] 5. This satellite structure utilizes any combination of carbon nanofilms and organic paint films in the surface layer to adjust the satellite's surface properties, control the amount of heat exchange, reduce the use of multi-layer heat insulation components, lower costs, and improve overall assembly efficiency. Attached Figure Description

[0028] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0029] Figure 1 This is a schematic diagram of the electromechanical-thermal integrated satellite structure described in this invention;

[0030] Figure 2 This is a schematic diagram of the surface layer described in this invention.

[0031] Circuit layer 1; structural layer 2; thermal conductive layer 3; surface layer 4; bus-type temperature sensor 5; resistance heating zone 6. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of the present invention can be combined with each other, and the described embodiments are only some embodiments of the present invention, not all embodiments.

[0033] It should be noted that the descriptions of "left," "right," "left side," "right side," "upper part," "lower part," "top," and "bottom" in this invention are defined based on the orientation or positional relationships shown in the accompanying drawings. They are merely for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the described structure must be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0034] In the description of this invention, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0035] Referring to the accompanying drawings, this embodiment provides an electromechanical-thermal integrated satellite structure, comprising:

[0036] Thermal conductive layer 3, structural layer 2 is symmetrically arranged on both end faces;

[0037] Circuit layer 1 is connected to the end face of one side of structural layer 2 that is away from the heat-conducting layer 3;

[0038] The surface layer 4 is connected to the end face of the other structural layer 2 that is away from the heat-conducting layer 3.

[0039] In this embodiment, the structural layer 2 is a 2A12 aluminum alloy layer. First, the thickness of the main 2A12 material and the thickness of the sandwich graphite aluminum composite material are determined according to the satellite structural design and thermal design, that is, the mechanical load-bearing capacity and temperature uniformity of the structure are determined. Generally, the thickness of the 2A12 material does not exceed 0.75 mm.

[0040] In this embodiment, the thermally conductive layer 3 is a graphite-aluminum composite material. The thickness of the graphite-aluminum material does not exceed 1 mm. The designed sandwich structure was verified using multi-layer anisotropic finite element modeling to confirm that it meets the usage requirements. The in-plane thermal conductivity can reach 600 W / m / K.

[0041] In this embodiment, the two thermally conductive layers 3 and the structural layer 2 are vacuum sintered to form a sandwich structure. After forming, it can be machined to a suitable size as needed. The vacuum sintering method can use existing technology, and will not be elaborated here.

[0042] In this embodiment, circuit layer 1 is a printed circuit board. The circuit layer design is based on the overall satellite circuit design and the layout of the thermal control heating area and temperature measurement points. When laying out the circuit, it is necessary to ensure that the interface dimensions of the printed circuit board and the main structure are consistent, according to the envelope dimensions of the structure.

[0043] In this embodiment, a bus-type temperature sensor 5 is disposed on the circuit layer 1. The bus-type temperature sensor 5 is surface-mounted; the specific sensor model used in this design is DS18B20, with a temperature measurement accuracy of 0.5℃. The bus-type temperature measurement circuit topology is simple, and the number of temperature measurement points can be arbitrarily expanded.

[0044] In this embodiment, a resistive heating region 6 is provided on the circuit layer 1. The resistance value of the heating region is designed according to its power and size, and the resistance is formed by winding resistance wire. In this embodiment, the resistance density is generally between 1 and 5 Ω / cm. 2 After the printed circuit board (PCB) is fabricated, interface verification is required to ensure installability. Generally, the thickness of the PCB does not exceed 1mm. A conductive solid adhesive film is used to bond the circuit layer to the sandwich structure. In this embodiment, the bonding conditions are: 10... -1 Under a vacuum of 140°C and a bonding surface pressure of 0.5 MPa for 30 minutes, the bond strength is greater than 20 MPa, and it can withstand thermal stress caused by the different coefficients of thermal expansion of different materials. In this embodiment, the circuit plane faces the interior of the satellite compartment and can be used as the mounting surface for single-unit equipment.

[0045] In this embodiment, the surface layer 4 consists of a carbon nanofilm and an organic paint film, each occupying a certain proportion of the end face and both facing outwards from the satellite compartment. Finally, based on thermal design requirements, the combination of surface layer 4 is selected. In this embodiment, the surface layer is composed of a carbon nanofilm with an absorptivity of 0.96 and an emissivity of 0.89, and an organic paint film with an absorptivity of 0.14 and an emissivity of 0.89. According to the thermal design scheme, the surface state is set to an absorptivity of 0.55, so the carbon nanofilm and the organic paint film each occupy 1 / 2 of the area, are bonded with acrylic adhesive, and face outwards from the satellite compartment. The surface layer thickness does not exceed 300 μm. Specifically, the surface layer refers to a surface whose thermo-optical properties are easily adjustable. The surface layer is composed of a high absorptivity, high emissivity carbon nanofilm and a low absorptivity, high emissivity organic paint film; the specific combination is calculated by the thermal control design. The surface layer is bonded to the structure with acrylic adhesive and can withstand alternating temperatures from -60 to 150°C. The surface layer generally faces outwards from the satellite compartment. High absorptivity and high emissivity carbon nanofilms have a solar absorptivity of no less than 0.96 and an infrared emissivity of no less than 0.89; low absorptivity and high emissivity organic coatings have a solar absorptivity of no more than 0.14 and an infrared emissivity of no less than 0.89. By combining these two materials in a certain proportion, a surface with an adjustable solar absorptivity of 0.14 to 0.96 can be formed. This surface can be used to adjust the intensity of heat transfer on the satellite surface, thereby controlling the internal temperature of the satellite.

[0046] According to another aspect of the present invention, a method for processing an electromechanical-thermal integrated satellite structure as described above is provided, comprising the following steps: placing structural layers 2 on both sides of a thermally conductive layer 3 and sintering them at high temperature to form a sandwich structure; bonding a designed circuit layer 1 to one end face of the sandwich structure; and bonding a surface layer 4 designed according to thermal design requirements to the other end face of the sandwich structure.

[0047] The embodiments of the present invention disclosed above are merely illustrative of the invention. These embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention.

Claims

1. An electromechanical-thermal integrated satellite structure, characterized in that, include: Thermal conductive layer (3), structural layers (2) are symmetrically arranged on both ends; The circuit layer (1) is connected to the end face of the structural layer (2) on one side away from the heat-conducting layer (3); The surface layer (4) is connected to the end face of the other structural layer (2) away from the heat-conducting layer (3); The structural layer (2) is a 2A12 aluminum alloy layer; The thermally conductive layer (3) is a graphite-aluminum composite material; The two thermally conductive layers (3) and the structural layer (2) are vacuum sintered to form a sandwich structure; The surface layer (4) consists of a carbon nanofilm and an organic paint film, each occupying a certain proportion of the end face and both facing outwards from the satellite cabin. The method for processing the electromechanical-thermal integrated satellite structure includes the following steps: placing structural layers (2) on both sides of the heat-conducting layer (3) and sintering at high temperature to form a sandwich structure; bonding the designed circuit layer (1) on one side of the sandwich structure; and bonding the surface layer (4) designed according to the thermal design requirements on the other side of the sandwich structure. The circuit layer (1) is at 10 -1 The material was bonded to the sandwich structure under vacuum of 140 MPa, temperature of 140°C, and bonding surface pressure of 0.5 MPa for 30 minutes, and the bonding strength was greater than 20 MPa.

2. The electromechanical-thermal integrated satellite structure according to claim 1, characterized in that: The circuit layer (1) is a printed circuit board.

3. The electromechanical-thermal integrated satellite structure according to claim 1, characterized in that: A bus-type temperature sensor (5) is provided on the circuit layer (1).

4. The electromechanical-thermal integrated satellite structure according to claim 1, characterized in that: A resistance heating zone (6) is provided on the circuit layer (1).

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