Data line liquid silicone encapsulation device, encapsulation method and device manufacturing method

Abstract

The application discloses a data line liquid silicone encapsulation device, an encapsulation method and a device manufacturing method. The encapsulation device comprises a shell, a temperature control mechanism and a plurality of liquid silicone extrusion mechanisms arranged in the shell in sequence in the vertical direction. The shell has an inner shell cavity and an outer shell cavity. The liquid silicone extrusion mechanism comprises a wire outlet nozzle, an extrusion die and an injection die. The wire outlet nozzle and the extrusion die are fixedly arranged in the inner shell cavity in a clearance fit mode in the vertical direction, and are respectively provided with a wire outlet hole and an extrusion hole. The injection die is arranged in the outer shell cavity and is provided with an injection inlet communicating with the clearance between the wire outlet hole and the extrusion hole. The wire core moves upward from the bottom wire outlet hole, and the encapsulation silicone is gradually solidified on the surface of the wire core through the injection die. The temperature control mechanism comprises a heating element arranged in the inner shell cavity and spaced apart between the plurality of liquid silicone extrusion mechanisms, and a refrigeration unit arranged in the outer shell cavity and spaced apart between the plurality of injection dies, so that a vertical sectional encapsulation structure is formed, and the encapsulation effect is good.

Description

Technical Field

[0001] This invention relates to the field of data cable packaging technology, and in particular to a liquid silicone packaging device, packaging method, and device manufacturing method for data cables. Background Technology

[0002] Liquid silicone, also known as liquid silicone rubber, has advantages over solid high-temperature vulcanized silicone rubber. As a liquid adhesive, it offers better flowability, faster vulcanization, and is safer and more environmentally friendly. Currently, more and more data cables are using liquid silicone as the encapsulation material.

[0003] In existing technologies, most data cables use horizontal packaging. Due to the strong fluidity of liquid silicone during the packaging process, the weight of the silicone itself can easily cause uneven packaging of the data cable, affecting its quality. Summary of the Invention

[0004] This application provides a liquid silicone encapsulation device, encapsulation method, and device manufacturing method for data cables. Through vertical encapsulation technology, the liquid silicone can be more evenly coated on the surface of the data cable core, thereby improving the encapsulation quality of the data cable.

[0005] A first aspect of this application provides a liquid silicone encapsulation device for a data cable, including a housing, a temperature control mechanism, and a plurality of liquid silicone extrusion mechanisms arranged sequentially in the housing along a vertical direction. The housing includes an inner housing and an outer housing, and an outer housing cavity is formed between the inner housing and the outer housing. The inner housing has an inner housing cavity that extends vertically coaxially with the outer housing cavity.

[0006] The liquid silicone extrusion mechanism includes a nozzle, an extrusion die, and an injection die. The nozzle and the extrusion die are fixedly disposed in the inner shell cavity with a clearance fit in the vertical direction, and are respectively provided with a nozzle hole and an extrusion hole extending in the same vertical direction. The injection die is disposed in the outer shell cavity and is provided with an injection port communicating with the gap between the nozzle hole and the extrusion hole for injecting liquid silicone. The diameter of the extrusion hole in the same liquid silicone extrusion mechanism is larger than the diameter of the nozzle hole. In the vertical direction, the diameters of the nozzle hole and the extrusion hole in the liquid silicone extrusion mechanism near the bottom are smaller than the diameters of the nozzle hole and the extrusion hole in the liquid silicone extrusion mechanism near the top, so that the thickness of the encapsulated silicone can gradually increase as the wire core moves vertically upward from the bottom nozzle hole.

[0007] The temperature control mechanism includes a heating element located in the inner cavity and spaced apart between the plurality of liquid silicone extrusion mechanisms to form a heat source around the core or the core covered with silicone, and a cooling unit located in the outer cavity and spaced apart between the injection molds of the plurality of liquid silicone extrusion mechanisms.

[0008] In one possible implementation, the liquid silicone extrusion mechanism has two parts, defined as an upper extrusion mechanism and a lower extrusion mechanism, and the heating element includes a preheating element, a first heating element and a second heating element extending coaxially along the extension direction of the outlet hole, wherein the preheating element is located below the lower extrusion mechanism, the first heating element is located between the lower extrusion mechanism and the lower extrusion mechanism, and the second heating element is located above the upper extrusion mechanism.

[0009] In one possible implementation, the preheating element, the first heating element, and the second heating element are all implemented as heating sleeves with induction heating coils, and the inner diameter of the preheating element is equal to the diameter of the extrusion orifice in the lower extrusion mechanism, the inner diameter of the first heating element is equal to the diameter of the extrusion orifice in the upper extrusion mechanism, and the diameter of the second heating element is larger than the diameter of the first heating element.

[0010] In one possible implementation, the temperature of the preheating element is 175°C to 200°C, and the temperatures of the first heating element and the second heating element are the same, both being 150°C to 170°C.

[0011] In one possible implementation, the injection mold is annularly conical and has an inner end connected to the inner housing and an outer end connected to the outer housing. The bottom end of the outer end is not lower than the top end of the inner end. The outer end has a glue inlet, and the injection port is located at the inner end. The injection port is uniformly connected to the gap between the wire outlet and the extrusion hole in the circumference of the inner housing.

[0012] In one possible implementation, the refrigeration unit includes a first refrigeration chamber, a second refrigeration chamber, and a third refrigeration chamber formed in the outer shell cavity. The first refrigeration chamber is formed by the bottom wall of the injection mold in the lower extrusion mechanism, the inner shell, and the outer shell. The second refrigeration chamber is formed by the top wall of the injection mold in the lower extrusion mechanism, the bottom wall of the injection mold in the upper extrusion mechanism, and the inner shell and the outer shell between them. The third refrigeration chamber is formed by the top wall of the injection mold in the upper extrusion mechanism, the inner shell, and the outer shell. A second heating element extends above the third refrigeration chamber, and a preheating element partially extends into the axial refrigeration range of the first refrigeration chamber.

[0013] In one possible implementation, the top of the outlet nozzle is provided with an adhesive-blocking slope along the circumferential direction away from the outlet hole, and the outer side of the adhesive-blocking slope is lower than the inner side of the adhesive-blocking slope.

[0014] In one possible implementation, the bottom end of the extrusion die is provided with a circumferentially curved surface near the extrusion orifice, and the top end of the extrusion die is provided with a circumferentially curved surface near the extrusion orifice, wherein the inner side of the circumferential curved surface is lower than the outer side of the circumferential curved surface.

[0015] A second aspect of this application provides a packaging method for the aforementioned liquid silicone encapsulation device for data cables, comprising the following steps:

[0016] The core wire is continuously controlled to move upward from the inner cylinder of the preheating element and pass through the second heating element. During this process, the core wire is preheated by the preheating element to form a preheated core wire.

[0017] Liquid silicone is injected into the outer periphery of the preheated wire core through the injection port in the lower extrusion mechanism to initially cure the preheated wire core, and then a second curing is performed through the first heating element to complete the first encapsulation.

[0018] Liquid silicone is injected into the outer periphery of the wire core that has completed one encapsulation through the injection port in the upper extrusion mechanism for secondary preliminary curing, and then cured again through the second heating element to complete the final encapsulation;

[0019] The first cooling chamber, the second cooling chamber, and the third cooling chamber are used to cool the injection mold, so that the liquid silicone inside the injection mold remains in a liquid state.

[0020] A third aspect of this application provides a method for manufacturing the aforementioned liquid silicone encapsulation device for data cables, comprising the following steps:

[0021] The outer shell and the inner shell are fabricated separately. Then, the injection port is opened at a predetermined position in the inner shell, so that the inner shell forms multiple dispersed components. Then, the outlet nozzle and the extrusion die are fixed in the inner shell cavity. The preheating element, the first heating element, and the second heating element are fixed in the inner shell cavity respectively. Then, the injection die is fixed at a predetermined position on the outer side wall of the inner shell. Then, the inner shell is embedded in the outer shell cavity and connected to the inner side wall of the outer shell through the injection die. Finally, a glue injection tube penetrating into the injection die, a coolant injection pipe penetrating into the first cooling cavity, the second cooling cavity, and the third cooling cavity, and a coolant outlet pipe penetrating into the second heating element for supplying power to the second heating element are provided on the side wall of the outer shell.

[0022] Beneficial effects: Compared with the prior art, the liquid silicone encapsulation device, encapsulation method and device manufacturing method for data cables provided in this application can make the liquid silicone more uniformly cover the surface of the wire core through the vertical structural design, thereby effectively improving the encapsulation quality of the data cable;

[0023] Under the weight of the liquid silicone, the liquid silicone can be solidified and encapsulated on the surface of the core in stages through the cooperation of multiple liquid silicone extrusion mechanisms, multiple heating elements and multiple cooling units, ultimately resulting in a complete encapsulation structure, which can further improve the encapsulation quality of the data cable.

[0024] The temperature of the preheating element is higher than that of the first heating element and the second heating element. During the process of the wire core moving upward from the preheating element, it first undergoes rapid curing and encapsulation, and then undergoes subsequent steady curing and encapsulation. This allows the liquid silicone near the inside to form a good curing base on the surface of the wire core, which can further improve the encapsulation quality of the data cable.

[0025] The cooling unit not only provides a good low-temperature environment for the liquid silicone injected into the mold, keeping it in a liquid state so that it can be smoothly injected onto the surface of the wire core for encapsulation, but also provides a suitable cold source for the inner shell as the wire core moves upward. In conjunction with the heating element, it keeps the encapsulation silicone on the surface of the wire core in a relatively warm state in the non-insertion section, thereby further improving the encapsulation quality of the data cable.

[0026] The adhesive-blocking slope can impede the flow of liquid silicone from the injection port, allowing the liquid silicone to better coat the surface of the wire core. The adhesive-coated arc surface facilitates smoother and faster passage of the silicone-coated wire core through the inner shell cavity. The return slope allows the liquid silicone to automatically flow back under gravity, preventing excess liquid silicone from adhering to the wire core and causing an uneven surface on the data cable, thus affecting the packaging quality of the data cable.

[0027] These and other objects, features and advantages of the present invention will become fully apparent from the following detailed description. Attached Figure Description

[0028] Figure 1 The diagram shows a front view of the liquid silicone encapsulation device for the data line of this application.

[0029] Figure 2 This application shows Figure 1 A magnified structural diagram of part A in the middle. Detailed Implementation

[0030] The following description is intended to disclose the present invention and enable those skilled in the art to implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the invention.

[0031] Those skilled in the art should understand that, in the disclosure of this specification, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limiting the present invention.

[0032] It is understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple, and the term "a" should not be understood as a limitation on the number.

[0033] refer to Figure 1 and Figure 2 The first aspect of this application provides a liquid silicone encapsulation device for a data cable, including a housing, a temperature control mechanism, and a plurality of liquid silicone extrusion mechanisms 30 arranged sequentially in the housing along a vertical direction. The housing includes an inner housing 10 and an outer housing 20, and an outer housing cavity 201 is formed between the inner housing 10 and the outer housing 20. The inner housing 10 has an inner housing cavity 101 that extends vertically coaxially with the outer housing cavity 201.

[0034] More specifically, the liquid silicone extrusion mechanism 30 includes an outlet nozzle 31, an extrusion die 32, and an injection die 33. The outlet nozzle 31 and the extrusion die 32 are fixedly disposed in the inner shell cavity 101 with a clearance fit in the vertical direction, and are respectively provided with an outlet hole 301 and an extrusion hole 302 extending in the same vertical direction. The injection die 33 is disposed in the outer shell cavity 201 and is provided with an injection port 303 communicating with the gap between the outlet hole 301 and the extrusion hole 302 for injecting liquid silicone. This allows liquid silicone to flow into the gap between the outlet hole 301 and the extrusion hole 302 through the injection port 303 during the process of the wire core moving from the outlet hole 301 to the extrusion hole 302, thereby curing and encapsulating the surface of the wire core.

[0035] Furthermore, the diameter of the extrusion hole 302 in the same liquid silicone extrusion mechanism 30 is larger than the diameter of the outlet hole 301. At the same time, in the vertical direction, the diameters of the outlet hole 301 and the extrusion hole 302 in the liquid silicone extrusion mechanism 30 near the bottom are smaller than the diameters of the outlet hole 301 and the extrusion hole 302 in the liquid silicone extrusion mechanism 30 near the top, so that the thickness of the encapsulating silicone can gradually increase as the wire core moves vertically upward from the bottom outlet hole 301, forming a staged sequential encapsulation molding.

[0036] The temperature control mechanism includes heating elements located in the inner cavity 101 and spaced apart between the plurality of liquid silicone extrusion mechanisms 30, to form a heat source around the core or the core coated with silicone, thereby allowing the liquid silicone to be cured in batches on the surface of the core during the staged sequential encapsulation process. The temperature control mechanism also includes a cooling unit located in the outer cavity 201 and spaced apart between the injection molds 33 of the plurality of liquid silicone extrusion mechanisms 30, to provide a cold source to the injection molds, keeping the liquid silicone within the injection molds 33 in a liquid state, thereby ensuring that the liquid silicone at different stages can be successfully encapsulated on the surface of the core.

[0037] The liquid silicone encapsulation device for data cables provided in this application changes the previous horizontal encapsulation method. Through the vertical structure design, the liquid silicone can be more uniformly cured and encapsulated on the surface of the wire core, thereby effectively improving the encapsulation quality of the data cable. In addition, the cooperation of multiple liquid silicone extrusion mechanisms 30, multiple heating elements and cooling units can form a staged sequential encapsulation molding, so that the liquid silicone at different positions covers different thicknesses on the surface of the wire core, resulting in better curing effect. This can avoid the problem of unstable internal curing and encapsulation during the single curing molding process, and further improve the encapsulation quality of the data cable.

[0038] In a preferred embodiment, the liquid silicone extrusion mechanism 30 has two parts, defined as an upper extrusion mechanism 34 and a lower extrusion mechanism 35, wherein the upper extrusion mechanism 34 is located directly above the lower extrusion mechanism 35. The heating element includes a preheating element 41, a first heating element 42, and a second heating element 43 extending coaxially along the extension direction of the outlet hole 301. The preheating element 41 is located below the lower extrusion mechanism 35, while the first heating element 42 is located between the lower extrusion mechanism 35 and the lower extrusion mechanism 34, and the second heating element 43 is located above the upper extrusion mechanism 34. The wire core moves from top to top, sequentially passing through the preheating element 41, the outlet hole 301 and extrusion hole 302 of the lower extrusion mechanism 35, the first heating element 42, the outlet hole 301 and extrusion hole 302 of the upper extrusion mechanism 34, and the second heating element 43.

[0039] More preferably, the preheating element 41, the first heating element 42, and the second heating element 43 are all implemented as heating sleeves with induction heating coils. The inner diameter of the preheating element 41 is equal to the diameter of the extrusion hole 302 in the lower extrusion mechanism 35, while the inner diameter of the first heating element 42 is equal to the diameter of the extrusion hole 302 in the upper extrusion mechanism 34. Meanwhile, the diameter of the second heating element 43 is larger than the diameter of the first heating element 42. This ensures that the wire core can move smoothly and that the wire core is heated.

[0040] More preferably, the temperature of the preheating element 41 is 175℃~200℃, while the temperatures of the first heating element 42 and the second heating element 43 are the same, both 150℃~170℃. This creates a temperature difference between the preheating element 41 and the first heating element 42, meaning the temperature of the preheating element 41 is higher than the temperature of the first heating element 42. Simultaneously, the first heating element 42 and the second heating element 43 maintain the same temperature. This allows the preheating element 41 to heat the wire core that has just entered the housing to a higher temperature. When the wire core, maintained at a higher temperature, encounters… When liquid silicone is injected into the injection port 303 of the lower extrusion mechanism 35, the liquid silicone can undergo rapid pre-curing and encapsulation on the surface of the wire core under the action of high temperature, thus laying a good curing foundation for the curing and encapsulation of the data cable. Subsequently, as the wire core continues to move upward, the upper extrusion mechanism 34 can perform secondary curing and encapsulation on the pre-cured wire core. The first heating element 42 and the second heating element 43 mainly play the role of heat preservation for the wire core, ensuring the stability of the liquid silicone curing and encapsulation. Compared with curing and encapsulation at the same temperature, the service life of the data cable can be extended to a certain extent.

[0041] In one embodiment, the injection mold 33 is annularly conical and has an inner end connecting the inner housing 10 and an outer end connecting the outer housing 20. The bottom end of the outer end is not lower than the top end of the inner end. In addition, the outer end has a glue inlet 304 for replenishing liquid silicone into the injection mold 33. Meanwhile, the injection port 303 is opened at the inner end and is uniformly connected to the gap between the wire outlet 301 and the extrusion hole 302 in the circumference of the inner housing 10. This allows the liquid silicone in the injection mold 33 to automatically flow towards the injection port 303 under its own weight, and to be cured and encapsulated synchronously in the circumference of the wire core.

[0042] In one embodiment, the refrigeration unit includes a first refrigeration chamber 501, a second refrigeration chamber 502, and a third refrigeration chamber 503 formed in the outer shell cavity 201. The first refrigeration chamber 501 is formed by the bottom wall of the injection mold 33 in the lower extrusion mechanism 35, the inner shell 10, and the outer shell 20. The second refrigeration chamber 502 is formed by the top wall of the injection mold 33 in the lower extrusion mechanism 35, the bottom wall of the injection mold 33 in the upper extrusion mechanism 34, and the inner shell 10 and the outer shell 20 between them. The third refrigeration chamber 503 is formed by the top wall of the injection mold 33 in the upper extrusion mechanism 34, the inner shell 10, and the outer shell 20, thereby enabling the cooling unit to operate through the first refrigeration chamber 501, the second refrigeration chamber 502, and the third refrigeration chamber 503. The three cooling chambers 503 respectively cool the corresponding injection molds 33, keeping the liquid silicone in the injection molds 33 in a liquid state. This allows the liquid silicone to continuously solidify and encapsulate onto the surface of the wire core. In addition, the first cooling chamber 501, the second cooling chamber 502, and the third cooling chamber 503 also provide cold sources to corresponding positions of the inner shell at different stages. Combined with the heat source of the heating element, the non-insertion section of the inner shell cavity 101 can be kept in a relatively warm temperature environment. This allows the silicone on the surface of the wire core to have a continuous curing effect over a predetermined period of time, rather than a rapid curing at a certain moment. In particular, the effects of the second cooling chamber 502 and the third cooling chamber 503 can improve the curing quality of the encapsulation silicone near the outer layer of the wire core. Combined with the rapid curing encapsulation near the inner layer, the overall encapsulation quality of the data cable can be improved.

[0043] The second heating element 43 extends above the third cooling chamber 503, which can further stabilize and solidify the encapsulated data line. In addition, the preheating element 41 extends into the axial cooling range of the first cooling chamber 501, which can reduce the cooling effect of the first cooling chamber 501 on the inner shell 10, so that the wire core is kept at a higher temperature, so as to facilitate rapid curing and encapsulation at the lower extrusion mechanism 35.

[0044] In one embodiment, the top of the outlet nozzle 31 is provided with a resistive slope 311 along the circumference away from the outlet hole 301. The outer side of the resistive slope 311 is lower than the inner side of the resistive slope 311. In this way, when the liquid silicone flows to the position of the resistive slope 311, the resistive slope 311 will play a certain role in obstructing the flow of liquid silicone, slowing down the flow rate of liquid silicone, reducing the flow volume of liquid silicone, thereby allowing the liquid silicone to more evenly coat the outside of the wire core.

[0045] In one embodiment, the bottom end of the extrusion die 32 is provided with a circumferentially curved surface 321 near the extrusion orifice 302, which allows the silicone-coated wire core to move upward more smoothly and reduces the impact on the outer silicone coating. Furthermore, considering the fluidity of liquid silicone, when the wire core continues to move upward from the extrusion die 32, it will be heated and solidified on the surface of the wire core when it encounters the heating element. If excess liquid silicone on the surface of the wire core is not removed in time within the extrusion die 32, it may solidify on the surface of the wire core under the action of the heating element, causing pits or unevenness on the surface of the wire core. Therefore, the top end of the extrusion die 32 is provided with a circumferentially curved surface 322 near the extrusion orifice 302, wherein the inner side of the circumferential curved surface 322 is lower than the outer side of the circumferential curved surface 322, so that the liquid silicone can flow back to the gap between the extrusion die 32 and the outlet nozzle 31, thereby ensuring the surface quality of the data cable.

[0046] It should be noted that there is a certain gap between the extrusion hole 302 and the wire core or the wire core covered with silicone, but during operation, this gap will be filled with the backflow of liquid silicone.

[0047] A second aspect of this application provides a packaging method for the aforementioned liquid silicone encapsulation device for data cables, comprising the following steps:

[0048] The core wire is continuously controlled to move upward from the inner cylinder of the preheating element and pass through the second heating element. During this process, the core wire is preheated by the preheating element to form a preheated core wire.

[0049] Liquid silicone is injected into the outer periphery of the preheated wire core through the injection port in the lower extrusion mechanism to initially cure the preheated wire core, and then a second curing is performed through the first heating element to complete the first encapsulation.

[0050] Liquid silicone is synchronously injected into the outer periphery of the wire core that has completed one encapsulation through the injection port in the upper extrusion mechanism for secondary preliminary curing, and then cured again through the second heating element to complete the final encapsulation;

[0051] The first cooling chamber, the second cooling chamber, and the third cooling chamber are used to cool the injection mold, so that the liquid silicone inside the injection mold remains in a liquid state.

[0052] A third aspect of this application provides a method for manufacturing the aforementioned liquid silicone encapsulation device for data cables, comprising the following steps:

[0053] The outer shell and the inner shell are fabricated separately. Then, the injection port is opened at a predetermined position in the inner shell, so that the inner shell forms multiple dispersed components. Then, the outlet nozzle and the extrusion die are fixed in the inner shell cavity. The preheating element, the first heating element, and the second heating element are fixed in the inner shell cavity respectively. Then, the injection die is fixed at a predetermined position on the outer side wall of the inner shell. Then, the inner shell is embedded in the outer shell cavity and connected to the inner side wall of the outer shell through the injection die. Finally, a glue injection tube penetrating into the injection die, a coolant injection pipe penetrating into the first cooling cavity, the second cooling cavity, and the third cooling cavity, and a coolant outlet pipe penetrating into the second heating element for supplying power to the second heating element are provided on the side wall of the outer shell.

[0054] It should be noted that the terms "first, second, and third" used in this application are for descriptive purposes only, do not indicate any order, and should not be construed as indicating or implying relative importance. These terms can be interpreted as names.

[0055] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the invention. The advantages of the present invention have been fully and effectively realized. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments; any variations or modifications can be made to the implementation of the present invention without departing from these principles.

Claims

1. A liquid silicone encapsulation device for data cables, characterized in that, The device includes a housing, a temperature control mechanism, and a plurality of liquid silicone extrusion mechanisms arranged sequentially in the housing along a vertical direction. The housing includes an inner housing and an outer housing, and an outer shell cavity is formed between the inner housing and the outer shell. The inner housing has an inner shell cavity that extends vertically coaxially with the outer shell cavity. The liquid silicone extrusion mechanism includes a nozzle, an extrusion die, and an injection die. The nozzle and the extrusion die are fixedly disposed in the inner shell cavity with a clearance fit in the vertical direction, and are respectively provided with a nozzle hole and an extrusion hole extending in the same vertical direction. The injection die is disposed in the outer shell cavity and is provided with an injection port communicating with the gap between the nozzle hole and the extrusion hole for injecting liquid silicone. The diameter of the extrusion hole in the same liquid silicone extrusion mechanism is larger than the diameter of the nozzle hole. In the vertical direction, the diameters of the nozzle hole and the extrusion hole in the liquid silicone extrusion mechanism near the bottom are smaller than the diameters of the nozzle hole and the extrusion hole in the liquid silicone extrusion mechanism near the top, so that the thickness of the encapsulated silicone can gradually increase as the wire core moves vertically upward from the bottom nozzle hole. The temperature control mechanism includes a heating element located in the inner cavity and spaced apart between the plurality of liquid silicone extrusion mechanisms to form a heat source around the core or the core covered with silicone, and a cooling unit located in the outer cavity and spaced apart between the injection molds of the plurality of liquid silicone extrusion mechanisms. The liquid silicone extrusion mechanism has two parts, defined as an upper extrusion mechanism and a lower extrusion mechanism. The heating element includes a preheating element, a first heating element and a second heating element that extend coaxially along the extension direction of the outlet hole. The preheating element is located below the lower extrusion mechanism, the first heating element is located between the lower extrusion mechanism and the upper extrusion mechanism, and the second heating element is located above the upper extrusion mechanism. The preheating element, the first heating element, and the second heating element are all implemented as heating sleeves with induction heating coils. The inner diameter of the preheating element is equal to the diameter of the extrusion hole in the lower extrusion mechanism, the inner diameter of the first heating element is equal to the diameter of the extrusion hole in the upper extrusion mechanism, and the diameter of the second heating element is larger than the diameter of the first heating element. The temperature of the preheating element is 175℃~200℃, and the temperature of the first heating element and the temperature of the second heating element are the same, both being 150℃~170℃. The top of the outlet nozzle is provided with an adhesive-blocking slope along the circumference away from the outlet hole, and the outer side of the adhesive-blocking slope is lower than the inner side of the adhesive-blocking slope. The bottom end of the extrusion die is provided with a circumferential arc surface near the extrusion hole, and the top end of the extrusion die is provided with a circumferential reflux slope near the extrusion hole, with the inner side of the reflux slope being lower than the outer side of the reflux slope.

2. The liquid silicone encapsulation device for data cables as described in claim 1, characterized in that, The injection mold is annular and conical, and has an inner end connected to the inner shell and an outer end connected to the outer shell. The bottom end of the outer end is not lower than the top end of the inner end. The outer end has a glue inlet, and the injection port is located at the inner end. The injection port is uniformly connected to the gap between the wire outlet and the extrusion hole in the circumference of the inner shell.

3. The liquid silicone encapsulation device for data cables as described in claim 2, characterized in that, The refrigeration unit includes a first refrigeration chamber, a second refrigeration chamber, and a third refrigeration chamber formed in the outer shell cavity. The first refrigeration chamber is formed by the bottom wall of the injection mold in the lower extrusion mechanism, the inner shell, and the outer shell. The second refrigeration chamber is formed by the top wall of the injection mold in the lower extrusion mechanism, the bottom wall of the injection mold in the upper extrusion mechanism, and the inner shell and the outer shell between them. The third refrigeration chamber is formed by the top wall of the injection mold in the upper extrusion mechanism, the inner shell, and the outer shell. The second heating element extends above the third refrigeration chamber, and the preheating element partially extends into the axial refrigeration range of the first refrigeration chamber.

4. The packaging method of the liquid silicone encapsulation device for data cables as described in claim 3, characterized in that, The steps are as follows: The core wire is continuously controlled to move upward from the inner cylinder of the preheating element and pass through the second heating element. During this process, the core wire is preheated by the preheating element to form a preheated core wire. Liquid silicone is injected into the outer periphery of the preheated wire core through the injection port in the lower extrusion mechanism to initially cure the preheated wire core, and then a second curing is performed through the first heating element to complete the first encapsulation. Liquid silicone is injected into the outer periphery of the wire core that has completed one encapsulation through the injection port in the upper extrusion mechanism for secondary preliminary curing, and then cured again through the second heating element to complete the final encapsulation; The first cooling chamber, the second cooling chamber, and the third cooling chamber are used to cool the injection mold, so that the liquid silicone inside the injection mold remains in a liquid state.

5. The manufacturing method of the liquid silicone encapsulation device for data cables as described in claim 3, characterized in that, Includes the following steps: The outer shell and the inner shell are fabricated separately. Then, the injection port is opened at a predetermined position in the inner shell, so that the inner shell forms multiple dispersed components. Then, the outlet nozzle and the extrusion die are fixed in the inner shell cavity. The preheating element, the first heating element, and the second heating element are fixed in the inner shell cavity respectively. Then, the injection die is fixed at a predetermined position on the outer side wall of the inner shell. Then, the inner shell is embedded in the outer shell cavity and connected to the inner side wall of the outer shell through the injection die. Finally, a glue injection tube penetrating into the injection die, a coolant injection pipe penetrating into the first cooling cavity, the second cooling cavity, and the third cooling cavity, and a coolant outlet pipe penetrating into the second heating element for supplying power to the second heating element are provided on the side wall of the outer shell.

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