Processing methods and equipment

Abstract

This application provides a processing method and a processing device. The processing method includes: moving a test object and a processing device along a first axis in a first relative motion, and performing a first processing on the test object through a first module; the processing device includes a first module and a second module; during the first relative motion of the test object and the processing device along the first axis, moving a second module and the test object along the first axis in a second relative motion, and performing a second processing on the test object through the second module, wherein the relative movement speed of the second module and the test object along the first axis is different from the relative movement speed of the first module and the test object along the first axis. This improves the processing efficiency of the processing device.

Description

Technical Field

[0001] This invention relates to the field of semiconductor testing technology, and more specifically to a processing method and processing equipment. Background Technology

[0002] In the field of testing equipment, testing equipment often comprises multiple working modules, which typically require different operating conditions (e.g., different exposure times or different focusing heights). In related technologies, to ensure that each working module meets its testing requirements, different testing modules are often tested on the analyte at different times. This results in a significant increase in testing time and a decrease in testing efficiency.

[0003] In related technologies, it is difficult to ensure that each detection module can work under optimal conditions when multiple detection modules are working simultaneously. Summary of the Invention

[0004] This application provides a processing method and a processing device for improving the processing efficiency of the processing device.

[0005] The present invention provides a processing method, comprising: causing a test object and a processing device to perform a first relative movement along a first axis and performing a first processing on the test object through a first module; the processing device includes a first module and a second module; during the first relative movement of the test object and the processing device along the first axis, causing a second module and the test object to perform a second relative movement along the first axis and performing a second processing on the test object through the second module, wherein the relative movement speed of the second module and the test object along the first axis is different from the relative movement speed of the first module and the test object along the first axis.

[0006] Optionally, the first module is a full inspection module, which is used to perform a full scan of the surface of the object to be processed; the second module is a re-inspection module; the process of performing a second processing on the object to be processed by the second module includes: obtaining the re-inspection position of the second module based on the processing result of the object to be processed by the first module; determining whether the second module is aligned with the re-inspection position based on the re-inspection position; if aligned, re-inspecting the re-inspection position through the second module, at least during the re-inspection process, the second module moves relative to the object to be processed.

[0007] Optionally, during the first relative movement of the test object and the processing device along the first axis, the second module remains relatively stationary with respect to the test object during the second processing of the test object; the first axis is not perpendicular to the surface of the test object to be processed.

[0008] Optionally, the test object and the processing device are moved relative to each other along the first axis, including: moving the test object along the positive direction of the first axis, while the first module remains fixed along the first axis; during the second processing of the test object, the second module and the test object remain relatively stationary, including: during the second processing of the test object, the second module moves along the positive direction of the first axis, and the moving speed of the second module is the same as the moving speed of the test object.

[0009] Optionally, causing the test object and the processing device to perform a first relative movement along a first axis includes: during the movement of the test object relative to the first module along the positive direction of the first axis, the first module remains fixed along the first axis while performing a first processing on the test object; causing the second module and the test object to perform a second relative movement along the first axis includes: during the second processing on the test object, the second module moves along the positive direction of the first axis; the rate at which the second module moves along the positive direction of the first axis is less than twice the rate at which the test object moves along the first axis; or, causing the second module and the test object to perform a second relative movement along the first axis includes: during the movement of the test object relative to the first module along the positive direction of the first axis, the second module remains fixed along the first axis while performing a second processing on the test object; causing the test object and the processing device to perform a first relative movement along the first axis includes: during the first processing on the test object, the first module moves in the opposite direction of the first axis.

[0010] Optionally, the exposure time of the second module is greater than the exposure time of the first module, or the magnification of the second module is greater than the magnification of the first module; the first axis is not perpendicular to the surface of the object to be processed; during the second processing of the object to be processed by the second module, the speed at which the second module moves along the positive direction of the first axis is less than or equal to (v1+n2 / (m2t2)) and greater than or equal to (v1-n2 / (m2t2)); v1 is less than or equal to n1 / (m1t1); where v1 is the moving speed of the object to be processed; n1 is the size of a pixel in the image captured by the first module, m1 is the magnification of the first module, t1 is the first exposure time of the first module; n2 is the size of a pixel in the image captured by the second module, m2 is the magnification of the second module, and t2 is the second exposure time of the second module.

[0011] Optionally, the exposure time of the second module is greater than the exposure time of the first module, or the magnification of the second module is greater than the magnification of the first module; the first axis is not perpendicular to the surface of the object to be processed; during the first processing of the object to be processed by the first module, the speed at which the first module moves in the opposite direction of the first axis is less than (n1 / (m1t1)-v1), and v1 is less than or equal to n2 / m2t2; where v1 is the moving speed of the object to be processed; n1 is the size of a pixel in the image captured by the first module, m1 is the magnification of the first module, and t1 is the first exposure time of the first module; n2 is the size of a pixel in the image captured by the second module, m2 is the magnification of the second module, and t2 is the second exposure time of the second module.

[0012] Optionally, it further includes: driving the test object and the first module to move relative to each other in a direction parallel to the surface to be processed of the test object, so that the first module scans the surface to be processed, and driving the test object to move along the first axis during the scanning process.

[0013] Optionally, the first axis is perpendicular to the surface of the object to be tested; the defocus distance of the first module in the first processing is different from the defocus distance of the second module in the second processing; the first processing and the second processing are performed synchronously for at least part of the time; the first processing includes focusing the object to be tested; the second processing includes focusing the object to be tested.

[0014] Optionally, the first module and the second module are separated along the second axis in the field of view of the surface to be processed of the test object; causing the test object and the processing device to perform a first relative movement along the first axis includes: driving the test object to move along the first axis according to the test position of the first module along the first axis with a first target height; causing the second module and the test object to perform a second relative movement along the first axis includes: driving the second module to move along the first axis according to the test position of the second module along the first axis with a second target height, wherein the second axis is perpendicular to the first axis.

[0015] Optionally, it further includes: before the first and second processes, obtaining the initial height along the first axis at various positions on the surface of the object to be processed; obtaining the position to be re-inspected by the second module on the object to be processed; and obtaining the second target height based on the initial height and the moving distance of the first module along the first axis.

[0016] The present invention also provides a processing device for executing the processing method of the present invention, comprising: a processing apparatus, the processing apparatus including a first module and a second module, the first module being used to perform a first processing on a test object, and the second module being used to perform a second processing on the test object; and a driving assembly including: a first driving module for driving the test object and the processing apparatus to perform a first relative movement along a first axis; and a second driving module for driving the second module and the test object to perform a second relative movement along the first axis, and causing the relative movement speed of the second module and the test object along the first axis to be different from the relative movement speed of the first module and the test object along the first axis.

[0017] Optionally, it further includes: a fixed stage, the fixed stage being used to fix the object to be tested; the first driving module being used to drive the object to be tested to move along the first axis includes: the first driving module being used to drive the fixed stage to move along the first axis.

[0018] Optionally, the first module is a full inspection module, which is used to perform a full scan of the surface of the object to be processed; the second module is a re-inspection module, which is used to re-inspect the object to be processed based on the processing results of the first module.

[0019] Optionally, both the first module and the second module are imaging devices; the exposure time of the second module is longer than that of the first module, or the magnification of the second module is greater than that of the first module.

[0020] Optionally, the driving component further includes: a third driving module, which drives the test object and the first module to move relative to each other in a direction parallel to the surface to be processed of the test object, so that the first module performs scanning processing on the surface to be processed, and during the scanning processing, the first driving module drives the test object to move along a first axis.

[0021] Optionally, the first module and the second module are separated along the second axis in the field of view of the surface to be processed of the test object; the first driving module is used to drive the test object to move along the first axis according to the test position of the first module along the first axis at a first target height; the second driving module is used to drive the second module to move along the first axis according to the test position of the second module along the first axis at a second target height, the second axis being perpendicular to the first axis.

[0022] Optionally, it further includes: a height detection module, used to obtain the initial height along the first axis at each position of the surface to be processed of the object to be tested before the first processing and the second processing; the processing device further includes: a processing module, the processing module being used to obtain the position to be re-inspected by the second module on the object to be tested, the processing module being further used to obtain the second target height based on the initial height and the moving distance of the first module along the first axis.

[0023] The technical solution of this invention has the following advantages:

[0024] In the processing method provided by this invention, during the first relative movement of the test object and the processing device along a first axis, the second module and the test object undergo a second relative movement along the first axis, and the second module performs a second processing on the test object. This allows for overlap between the first module's first processing of the test object and the second module's second processing of the test object, improving processing efficiency. The relative movement speed of the second module and the test object along the first axis differs from that of the first module and the test object along the first axis. This ensures that the relative movement speed of the second module and the test object along the first axis is suitable for the processing performance of the second module, and vice versa, allowing both the second and first modules to operate under optimal conditions. Attached Figure Description

[0025] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 This is a flowchart illustrating the steps of a processing method according to an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the trajectory of the first module and the second module processing the surface of the object to be tested according to an embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram of the structure of a processing device according to an embodiment of the present invention;

[0029] Figure 4 This is a block diagram of a processing device provided in an embodiment of the present invention. Detailed Implementation

[0030] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0032] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0033] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0034] Example 1

[0035] One embodiment of the present invention provides a processing method, with reference to Figure 1 ,include:

[0036] S1: The test object and the processing device are moved relative to each other along a first axis, and the test object is processed by a first module; the processing device includes a first module and a second module.

[0037] S2: During the first relative movement of the test object and the processing device along the first axis, the second module and the test object are moved in a second relative direction along the first axis, and the test object is processed in a second way by the second module. The relative movement speed of the second module and the test object along the first axis is different from the relative movement speed of the first module and the test object along the first axis.

[0038] In this embodiment, during the first relative movement of the test object and the processing device along the first axis, the second module and the test object undergo a second relative movement along the first axis, and the second module performs a second processing on the test object. This allows for overlap between the first module's first processing of the test object and the second module's second processing of the test object, improving processing efficiency. The relative movement speed of the second module and the test object along the first axis differs from that of the first module and the test object along the first axis. This ensures that the relative movement speed of the second module and the test object along the first axis is suitable for the processing performance of the second module, and vice versa, allowing both the second and first modules to operate under optimal conditions.

[0039] In this embodiment, the first axis is parallel to the test surface of the object to be tested.

[0040] In this embodiment, the object under test is, for example, a wafer. In other embodiments, the object under test may also be a chip, an OLED panel, or a mobile phone glass casing.

[0041] In this embodiment, both the first and second modules are imaging devices. In other embodiments, the first module is a combination of one or more detection and processing modules. The second module is a combination of one or more detection and processing modules. The processing module includes one or more of photolithography, etching, and cutting modules.

[0042] See Figure 2 The processing method further includes: driving the test object and the first module to move relative to each other in a direction parallel to the surface to be processed of the test object, so that the first module scans the surface to be processed, and during the scanning process, moving the test object along the first axis X.

[0043] In this embodiment, moving the test object and the first module relative to each other in a direction parallel to the surface to be processed includes: moving the test object and the first module relative to each other along a first axis X, and moving the test object along a third axis Y so that the first module and the second module step along the third axis Y, wherein the third axis Y is perpendicular to the first axis X. Both the first axis X and the third axis Y are parallel to the surface to be processed of the test object.

[0044] In this embodiment, driving the test object and the first module to move relative to each other in a direction parallel to the surface to be processed includes: driving only the test object to move, or driving only the first module to move, or causing both the test object and the first module 2 to move, but at different speeds.

[0045] In one embodiment, the movement trajectories of the first and second modules are "S"-shaped. In other embodiments, the movement trajectories of the first and second modules include concentric circles, spirals, or straight lines.

[0046] In one embodiment, the process of causing the test object and the processing device to make a first relative movement along a first axis includes: moving the test object along the first axis; and / or moving the processing device along the first axis.

[0047] In one embodiment, the processing method further includes: fixing the object under test with a fixed stage. The first driving module driving the object under test to move along the first axis includes: the first driving module driving the fixed stage to move along the first axis, thereby causing the object under test to move along the first axis by driving the fixed stage to move along the first axis.

[0048] In one embodiment, the fixed stage is a carrier stage. Fixing the object to be tested using a fixed stage involves placing the object on the carrier surface of the carrier stage. The carrier stage may include a vacuum chuck, an undulating chuck, or an electrostatic chuck.

[0049] In another embodiment, the fixing stage is a clamping member. The clamping member is used to clamp the sidewall of the object to be tested.

[0050] In one embodiment, the first module is a full inspection module, which is used to perform a full scan of the surface of the object to be processed, and the second module is a re-inspection module. During the first processing of the object to be processed along the first axis using the first module, the first module is used to perform full processing of the surface of the object to be processed and periodically capture images of the surface. The process of performing a second processing of the object to be processed by the second module includes: obtaining the re-inspection position of the second module based on the processing result of the first module; if the re-inspection is to be performed on the re-inspection position using the second module, at least during the re-inspection process, the second module is moved relative to the object to be processed.

[0051] In one embodiment, the sensitivity of the second module is higher than that of the first module, which is beneficial to improving the processing efficiency of the analyte.

[0052] In this embodiment, the first module performs a full scan of the surface to be tested. In other embodiments, the first module processes pre-set processing locations.

[0053] In this embodiment, the processing module obtains the re-inspection location of the second module based on the processing result of the first module on the test object. For example, the processing module determines whether there is a defect area on the surface of the test object based on the processing result of the first module, and obtains the location of the defect area on the surface of the test object as the re-inspection location.

[0054] In other implementations, the processing position of the second module can be preset, independent of the processing result of the first module. Alternatively, the second module can perform a full scan of the entire surface under test.

[0055] In this embodiment, the processing module is specifically used to: determine that the surface of the object under test has a defect when at least one of the multiple images captured by the first module has a defect; and extract the corresponding re-inspection position in the object under test based on the location of the defect.

[0056] In one embodiment, during the first relative movement of the test object and the processing device along a first axis, the second module remains relatively stationary relative to the test object during the second processing of the test object; the first axis is not perpendicular to the surface of the test object to be processed. Further, the first relative movement of the test object and the processing device along the first axis includes: moving the test object along the positive direction of the first axis, while the first module remains fixed along the first axis; the second module remaining relatively stationary relative to the test object during the second processing of the test object includes: the second module moving along the positive direction of the first axis during the second processing of the test object, with the moving speed of the second module being the same as the moving speed of the test object.

[0057] During the second processing of the object under test, the second module 3 remains relatively stationary with respect to the object under test. This allows the second module to continuously detect the same position during the exposure time, thereby further improving image quality. In other embodiments, the second module may have a non-zero relative velocity with the object under test during the second processing of the position to be re-inspected on the object under test.

[0058] In one embodiment, moving the test object and the processing device relative to each other along a first axis in a first relative movement includes: during the movement of the test object relative to the first module along the positive direction of the first axis, the first module remains fixed along the first axis while performing a first processing on the test object. Moving the second module and the test object relative to each other along the first axis in a second relative movement includes: during the second processing of the test object, the second module moves along the positive direction of the first axis. Further, the rate at which the second module moves along the positive direction of the first axis is less than twice the rate at which the test object moves along the first axis.

[0059] In this embodiment, the object under test (DUT) is moved relative to the first module along the positive direction of the first axis X. Specifically, the DUT is driven to move along the first axis. In other embodiments, the processing device is driven to move along the first axis, or the processing device and the DUT are driven to move simultaneously.

[0060] In one embodiment, the exposure time of the second module is greater than that of the first module. The relative movement speed between the first module and the object under test (DUT) along the first axis varies with the movement speed of the DUT along the first axis. When the movement speed of the DUT along the positive direction of the first axis is small, the relative movement distance of the first module relative to the DUT within the first exposure time is small (less than one pixel in the image acquired by the first module). The integration of the first module does not produce errors when the movement speed of the DUT changes along the positive direction of the first axis, and the first module can perform complete processing on the DUT while the DUT moves along the positive direction of the first axis. In this case, the second module moves along the positive direction of the first axis during the second processing of the DUT. During this movement, the second module performs a re-inspection on the position of the DUT to be re-inspected. The second module moves along the positive direction of the first axis for the same amount of time, ensuring that its movement rate relative to the test object is less than that of the first module. This reduces the distance the second module travels relative to the test object during the second exposure time, preventing it from exceeding the distance traveled by a single pixel in the image acquired by the second module. This compensates for integration errors caused by excessive movement speed of the second module relative to the test object during the second exposure time, improving the clarity of the image of the defective area captured by the second module. Therefore, the first and second modules can perform detection simultaneously, improving processing quality while maintaining image quality.

[0061] In another embodiment, the magnification of the second module is greater than that of the first module. The magnification of the first module is relatively small, therefore its field of view is large. The magnification of the second module is relatively large, therefore its field of view is smaller than that of the first module. Accordingly, when the object under test moves relative to the first module along the positive direction of the first axis, the first module remains fixed along the first axis during the first processing of the object under test, while the second module moves along the positive direction of the first axis during the second processing of the object under test. In this way, the area of ​​the object under test within the field of view of the second module is kept as long as possible within the exposure time of one frame, compensating for the integration error caused by the small field of view of the second module. The second module can better track the position to be re-inspected acquired by the first module, which is beneficial to improving the accuracy of the processing of the position to be re-inspected of the object under test.

[0062] In one embodiment, the exposure time of the second module is greater than that of the first module, or the magnification of the second module is greater than that of the first module. The first axis is not perpendicular to the surface of the object to be processed. During the second processing of the object to be processed by the second module, the speed at which the second module moves along the positive direction of the first axis is less than or equal to (v1 + n2 / (m2t2)) and greater than or equal to (v1 - n2 / (m2t2)); v1 is less than or equal to n1 / (m1t1). Wherein, v1 is the moving speed of the object to be processed; n1 is the size of a pixel in the image captured by the first module; m1 is the magnification of the first module; t1 is the first exposure time of the first module; n2 is the size of a pixel in the image captured by the second module; m2 is the magnification of the second module; and t2 is the second exposure time of the second module.

[0063] In another embodiment, causing the second module and the test object to perform a second relative movement along the first axis includes: during the process of moving the test object relative to the first module in the positive direction of the first axis, the second module remains fixed along the first axis while performing a second processing on the test object; causing the test object and the processing device to perform a first relative movement along the first axis includes: during the process of the first module performing a first processing on the test object, moving in the opposite direction of the first axis.

[0064] In one embodiment, the exposure time of the second module is greater than that of the first module, or the magnification of the second module is greater than that of the first module; the first axis is not perpendicular to the surface of the object to be tested.

[0065] In one embodiment, the exposure time of the second module is greater than that of the first module. During the movement of the test object relative to the first module along the positive direction of the first axis, the second module remains fixed along the first axis during the second processing of the test object. The integration error of the second module decreases when the movement speed of the test object changes, and the second module can perform a re-inspection of the test object while it moves along the first axis. During the first processing of the test object, the first module moves in the opposite direction of the first axis. The first module performs a full surface inspection of the test object during its movement along the first axis. The movement rate of the first module relative to the test object is greater than that of the second module relative to the test object, thus increasing the processing speed of the first module and improving processing efficiency. Therefore, the first and second modules can process simultaneously, improving processing quality while maintaining processing quality.

[0066] In one embodiment, the magnification of the second module is greater than that of the first module. The first module has a relatively small magnification, therefore its field of view is large. The second module has a relatively large magnification, therefore its field of view is smaller than that of the first module. During the first processing of the object under test along the first axis, the first module moves in the opposite direction of the first axis, which increases the processing speed of the first module and improves processing efficiency.

[0067] In one embodiment, the exposure time of the second module is greater than that of the first module, or the magnification of the second module is greater than that of the first module; the first axis is not perpendicular to the surface of the object to be processed. During the first processing of the object to be processed by the first module, the speed at which the first module moves in the opposite direction of the first axis is less than (n1 / (m1t1)-v1), where v1 is less than or equal to n2 / m2t2; v1 is less than or equal to n2 / m2t2; where v1 is the moving speed of the object to be processed; n1 is the size of a pixel in the image captured by the first module, m1 is the magnification of the first module, and t1 is the first exposure time of the first module; n2 is the size of a pixel in the image captured by the second module, m2 is the magnification of the second module, and t2 is the second exposure time of the second module.

[0068] In one embodiment, the fields of view of the first module and the second module on the surface to be processed of the object under test are separated along a first axis. The processing method further includes: the first module focusing the object under test along a second axis, and the second module focusing the object under test along a second axis. The second axis is perpendicular to the first axis. Further, the second axis is perpendicular to a third axis.

[0069] In one embodiment, when the platform carries the object to be measured, the second axis is perpendicular to the bearing surface of the platform.

[0070] Example 2

[0071] In this embodiment, the differences from the previous embodiment include: the first axis is perpendicular to the surface of the object to be tested; the defocus distance of the first module in the first processing is different from the defocus distance of the second module in the second processing; the first processing and the second processing are performed synchronously for at least part of the time; the first processing includes focusing the object to be tested; the second processing includes focusing the object to be tested.

[0072] In one embodiment, the fields of view of the first module and the second module on the surface to be processed of the test object are separated along a second axis. The second axis is perpendicular to the first axis.

[0073] In this embodiment, causing the test object and the processing device to perform a first relative movement along the first axis includes: driving the test object to move along the first axis according to the test position of the first module along the first axis to a first target height; causing the second module and the test object to perform a second relative movement along the first axis includes: driving the second module to move along the first axis according to the test position of the second module along the first axis to a second target height, wherein the second axis is perpendicular to the first axis.

[0074] In this embodiment, the first process is focusing, and the second process is focusing.

[0075] In this embodiment, the method further includes: before the first and second processes, obtaining the initial height along the first axis at various positions on the surface of the object to be processed; obtaining the position to be re-inspected by the second module on the object to be tested; and obtaining the second target height based on the initial height and the moving distance of the first module along the first axis. This ensures that both the second module and the first module can meet their respective focusing requirements.

[0076] Specifically, before performing the first first treatment and the first second treatment on the test object, the height of the entire test surface of the test object is measured.

[0077] In this embodiment, the first module is further configured to detect, measure, or process the object to be tested after the first processing; the second module is further configured to detect, measure, or process the object to be tested after the first processing. Specifically, the first module is configured to detect the object to be tested; the second module is configured to detect the object to be tested.

[0078] The separation of the fields of view of the first and second modules means that the positions processed by the first and second modules at the same time are different, resulting in different height differences between the processing position and the focusing position of the first and second modules.

[0079] In this embodiment, the relative moving speed of the second module and the object under test along the first axis is different from the relative moving speed of the first module and the object under test along the first axis. After driving the object under test to move along the first axis to the focusing position of the first module, the second module is then driven to move along the first axis to the focusing position of the second module. Alternatively, during the process of driving the object under test to move along the first axis to the focusing position of the first module, the second module is driven to move along the first axis to the focusing position of the second module.

[0080] In one embodiment, the processing method further includes: moving the test object and the first module relative to each other in a direction parallel to the surface to be processed of the test object, so that the first module performs scanning processing on the surface to be processed, and during the scanning processing, moving the test object along a second axis.

[0081] In one embodiment, the processing method further includes: moving the second module relative to the object under test along a direction parallel to the surface to be processed of the object under test, so that the second module scans the surface to be processed, wherein the object under test moves along a second axis during the scanning process. In this embodiment, the relative movement speed of the second module 3 and the object under test along the surface to be processed is different from the relative movement speed of the first module 2 and the object under test along the surface to be processed. In other embodiments, the relative movement speed of the second module 3 and the object under test along the surface to be processed is equal to the relative movement speed of the first module 2 and the object under test along the surface to be processed.

[0082] In other embodiments, the driving component may not include the fourth driving module and / or the third driving module.

[0083] In one embodiment, moving the test object and the first module relative to each other in a direction parallel to the surface to be processed includes: moving the test object and the first module relative to each other along a second axis, and moving the test object along a third axis to cause the first module and the second module to step along the third axis, wherein both the third axis and the second axis are perpendicular to the first axis. Both the second axis and the third axis are parallel to the surface to be processed of the test object. The first axis is perpendicular to the surface to be processed of the test object.

[0084] In one embodiment, the first module is a full inspection module, which is used to perform a full scan of the surface of the object to be processed along the second axis; the second module is a re-inspection module. The re-inspection position of the second module is obtained based on the processing results of the full scan of the first module along the second axis; based on the re-inspection position, it is determined whether the second module is aligned with the re-inspection position; if aligned, the re-inspection of the re-inspection position is performed by the second module.

[0085] Example 3

[0086] An embodiment of the present invention also provides a processing device, see below. Figure 2 , Figure 3 and Figure 4 ,include:

[0087] Processing device A, comprising a first module 2 and a second module 3, wherein the first module 2 is used to perform a first processing on the test object and the second module 3 is used to perform a second processing on the test object;

[0088] Drive module B includes a first drive module and a second drive module. The first drive module is used to drive the test object and the processing device A to perform a first relative movement along the first axis X. The second drive module is used to drive the second module 3 and the test object to perform a second relative movement along the first axis X, and to make the relative movement speed of the second module 3 and the test object along the first axis X different from the relative movement speed of the first module 2 and the test object along the first axis X.

[0089] The processing device provided in this embodiment includes a first driving module for driving the test object and processing device A to perform a first relative movement along a first axis X, and a second driving module for driving the second module 3 and the test object to perform a second relative movement along the first axis X. The relative movement speed of the second module 3 and the test object along the first axis X is different from the relative movement speed of the first module 2 and the test object along the first axis X. This allows for an overlap between the first processing of the test object by the first module 2 and the second processing of the test object by the second module 3, improving processing efficiency. The relative movement speed of the second module 3 and the test object along the first axis is different from the relative movement speed of the first module 2 and the test object along the first axis. This ensures that the relative movement speed of the second module 3 and the test object along the first axis is suitable for the processing performance of the second module 3, and the relative movement speed of the first module 2 and the test object along the first axis is suitable for the processing performance of the first module 2, allowing both the second module 3 and the first module 2 to operate under optimal conditions.

[0090] In this embodiment, the first axis is parallel to the test surface of the object to be tested.

[0091] The first driving module is used to drive the test object and the processing device A to perform a first relative movement along a first axis, including: the first driving module is used to drive the test object to move along the first axis; and / or, the first driving module is used to drive the processing device A to move along the first axis X.

[0092] In this embodiment, the processing device further includes: a fixed stage, the fixed stage being used to fix the object to be tested; the first driving module being used to drive the object to be tested to move along the first axis includes: the first driving module being used to drive the fixed stage to move along the first axis.

[0093] In this embodiment, the fixed stage is a support stage 1, which is used to support the object to be tested. The first driving module is used to drive the object to be tested to move along the first axis X, including driving the support stage 1 to move along the first axis X. The support stage includes a vacuum chuck, an undulating chuck, or an electrostatic chuck.

[0094] In another embodiment, the fixed platform is a clamping member used to clamp the side wall of the object to be tested; the first driving module is used to drive the object to be tested to move along the first axis X, including: the first driving module is used to drive the clamping member to move along the first axis X.

[0095] In this embodiment, the first module 2 is an imaging device, and the second module 3 is an imaging device. In other embodiments, the first module is a combination of one or more detection modules and processing modules. The second module is a combination of one or more detection modules and processing modules. The processing module includes one or more of photolithography modules, etching modules, and cutting modules.

[0096] In this embodiment, the exposure time of the second module 3 is greater than the exposure time of the first module 2. The second module 3 has a second exposure time, the first module 2 has a first exposure time, and the second exposure time is greater than the first exposure time; or, the magnification of the second module 3 is greater than the magnification of the first module 2. The first axis is not perpendicular to the surface of the object to be tested.

[0097] In this embodiment, the first module 2 is a full inspection module, used to perform a comprehensive scan of the surface of the object to be processed. The second module 3 is a re-inspection module, used to re-inspect the object to be processed based on the processing results of the first module. During the first processing of the object to be processed along the first axis X using the first module 2, the first module 2 is used to perform comprehensive processing of the surface to be processed and periodically capture images of the surface to be processed. The second module 3 is used to re-inspect the object to be processed based on the processing results of the first module 2. The second module 3 has a higher sensitivity than the first module 2, which is beneficial for improving the processing efficiency of defective areas in the object to be processed.

[0098] In this embodiment, the object under test is, for example, a wafer. In other embodiments, the object under test may also be a chip, an OLED panel, or a mobile phone glass casing.

[0099] In this embodiment, the driving component further includes a third driving module, which drives the test object and the first module 2 to move relative to each other along a direction parallel to the surface to be processed, so that the first module scans the surface to be processed. During the scanning process, the first driving module drives the test object to move along a first axis X. Driving the test object and the first module to move relative to each other along a direction parallel to the surface to be processed includes: moving the test object and the first module relative to each other along the first axis X, and moving the test object along a third axis Y so that the first module and the second module step along the third axis Y, which is perpendicular to the first axis X. Both the first axis X and the third axis Y are parallel to the surface to be processed of the test object.

[0100] The third driving module drives the test object and the first module 2 to move relative to each other in a direction parallel to the surface to be processed, including: the third driving module only drives the test object to move, or the third driving module only drives the first module 2 to move, or the third driving module causes both the test object and the first module 2 to move, but at different speeds.

[0101] In this embodiment, the movement trajectory of the first module 2 and the second module 3 is "S"-shaped. In other embodiments, the movement trajectory of the first module and the second module includes concentric circles, spirals, or straight lines.

[0102] In this embodiment, the first driving module is used to move the object under test relative to the first module 2 along the positive direction of the first axis X. Specifically, the first driving module is used to drive the object under test to move along the first axis. In other embodiments, the first driving module is used to drive the processing device to move along the first axis, or the first driving module is used to drive the processing device and the object under test to move simultaneously.

[0103] In one embodiment, when the object under test moves relative to the first module 2 along the positive direction of the first axis, the first driving module is used to keep the first module 2 fixed along the first axis X when performing the first processing on the object under test, and the second driving module is used to move the second module 3 along the positive direction of the first axis X during the second processing on the object under test.

[0104] In one embodiment, when the object under test (DUT) moves relative to the first module 2 along the positive direction of the first axis, the first module 2 remains fixed along the first axis while performing the first processing on the DUT. The relative moving speed between the first module 2 and the DUT along the first axis varies with the moving speed of the DUT along the first axis. When the moving speed of the DUT along the positive direction of the first axis is small, the relative moving distance of the first module 2 relative to the DUT within the first exposure time is small (less than one pixel in the image acquired by the first module 2). Therefore, the integration by the first module 2 will not produce errors when the moving speed of the DUT changes along the positive direction of the first axis. The first module 2 can perform complete processing on the DUT under the condition that the platform or clamp drives the DUT to move along the positive direction of the first axis. In this case, the second module 3 moves along the positive direction of the first axis during the second processing of the DUT. During the movement, the second module 3 performs a re-inspection on the position of the DUT to be re-inspected. The second module 3 moves along the positive direction of the first axis for the same amount of time, making its movement rate relative to the test object less than that of the first module 2. This reduces the distance the second module 3 travels relative to the test object during the second exposure time, preventing its travel distance from exceeding that of a single pixel in the acquired image. This compensates for integration errors caused by excessive movement speed of the second module 3 relative to the test object during the second exposure time, thus improving the clarity of the image of the defective area captured by the second module 3. Therefore, the first and second modules can perform detection simultaneously, improving processing quality while maintaining image quality.

[0105] In another embodiment, the magnification of the second module 3 is greater than that of the first module 2. The magnification of the first module 2 is relatively small, therefore the field of view of the first module 2 is large. The magnification of the second module 3 is relatively large, therefore the field of view of the second module 3 is smaller than that of the first module 2. Accordingly, when the object under test moves relative to the first module 2 along the positive direction of the first axis, the first module 2 remains fixed along the first axis during the first processing of the object under test, while the second module 3 moves along the positive direction of the first axis during the second processing of the object under test. In this way, the area of ​​the object under test within the field of view of the second module 3 is kept as long as possible within the exposure time of one frame, compensating for the integration error caused by the small field of view of the second module 3. The second module 3 can better track the position to be re-inspected acquired by the first module 2, which is beneficial to improving the accuracy of the processing of the position to be re-inspected of the object under test.

[0106] In one embodiment, the exposure time of the second module is greater than that of the first module, or the magnification of the second module is greater than that of the first module. The first axis is not perpendicular to the surface of the object to be processed. During the second processing of the object to be processed by the second module, the speed at which the second module moves along the positive direction of the first axis is less than or equal to (v1 + n2 / (m2t2)) and greater than or equal to (v1 - n2 / (m2t2)); v1 is less than or equal to n1 / (m1t1). Wherein, v1 is the moving speed of the object to be processed; n1 is the size of a pixel in the image captured by the first module; m1 is the magnification of the first module; t1 is the first exposure time of the first module; n2 is the size of a pixel in the image captured by the second module; m2 is the magnification of the second module; and t2 is the second exposure time of the second module.

[0107] In one embodiment, when the object under test moves relative to the first module 2 along the positive direction of the first axis X, the first driving module is used to move along the opposite direction of the first axis X during the first processing of the object under test by the first module 2, and the second driving module is used to keep the second module 3 fixed along the first axis X during the second processing of the object under test.

[0108] In one embodiment, the exposure time of the second module is greater than that of the first module. During the movement of the test object relative to the first module along the positive direction of the first axis, the second module remains fixed along the first axis during the second processing of the test object. The integration error of the second module decreases when the movement speed of the test object changes, and the second module can perform a re-inspection of the test object while it moves along the first axis. During the first processing of the test object, the first module moves in the opposite direction of the first axis. The first module performs a full surface inspection of the test object during its movement along the first axis. The movement rate of the first module relative to the test object is greater than that of the second module relative to the test object, thus increasing the processing speed of the first module and improving processing efficiency. Therefore, the first and second modules can process simultaneously, improving processing quality while maintaining processing quality.

[0109] In one embodiment, the magnification of the second module is greater than that of the first module. The first module has a relatively small magnification, therefore its field of view is large. The second module has a relatively large magnification, therefore its field of view is smaller than that of the first module. During the first processing of the object under test along the first axis, the first module moves in the opposite direction of the first axis, which increases the processing speed of the first module and improves processing efficiency.

[0110] In one embodiment, the exposure time of the second module is greater than that of the first module, or the magnification of the second module is greater than that of the first module; the first axis is not perpendicular to the surface of the object to be processed. During the first processing of the object to be processed by the first module, the speed at which the first module moves in the opposite direction of the first axis is less than (n1 / (m1t1)-v1), where v1 is less than or equal to n2 / m2t2; v1 is less than or equal to n2 / m2t2; where v1 is the moving speed of the object to be processed; n1 is the size of a pixel in the image captured by the first module, m1 is the magnification of the first module, and t1 is the first exposure time of the first module; n2 is the size of a pixel in the image captured by the second module, m2 is the magnification of the second module, and t2 is the second exposure time of the second module.

[0111] Specifically, in this embodiment, during the first relative movement of the test object and the processing device along the first axis X, the second driving module is stationary relative to the test object during the second processing of the test object; the first axis X is not perpendicular to the surface of the test object to be processed.

[0112] The second driving module is used to keep the second module 3 relatively stationary with respect to the test object during the second processing of the test object. This allows the second module 3 to continuously detect the same position during the exposure time during the second processing, thereby further improving image quality. In other embodiments, the second driving module can have a non-zero relative velocity with the test object during the second processing of the position to be re-inspected of the test object.

[0113] In this embodiment, the first module performs a full scan of the surface to be tested. In other embodiments, the first module processes pre-set processing locations.

[0114] In this embodiment, the processing device further includes a processing module, which is used to obtain the re-inspection position of the second module 3 based on the processing result of the first module 2 on the test object. For example, the processing module determines whether there is a defect area on the surface of the test object based on the processing result of the first module 2 on the test object, and obtains the position of the defect area on the surface of the test object as the re-inspection position.

[0115] In other implementations, the processing position of the second module can be preset, independent of the processing result of the first module. Alternatively, the second module can perform a full scan of the entire surface under test.

[0116] In this embodiment, the processing module is specifically used to: when at least one of the multiple images captured by the first module 2 of the object under test has a defect, determine that there is a defect on the surface of the object under test; and extract the corresponding position to be re-inspected in the object under test according to the position of the defect.

[0117] In this embodiment, the processing module can be a computer. In other embodiments, the processing module can also be other devices with processing functions.

[0118] Example 4

[0119] The differences between this embodiment and Embodiment 3 include: the first axis is perpendicular to the surface of the object to be tested. The fields of view of the first module 2 and the second module 3 on the surface of the object to be tested are separated along the second axis; the first driving module is used to drive the object to be tested to move along the first axis according to the test position of the first module 2 along the first target height; the second driving module is used to drive the second module 3 to move along the first axis according to the test position of the second module 3 along the first axis along the second target height, and the second axis is perpendicular to the first axis.

[0120] The first processing is focusing, and the second processing is focusing.

[0121] In this embodiment, the first driving module drives the object under test to move along the first axis, so that the first module 2 focuses the object under test along the first axis. The second driving module drives the second module 3 to move along the first axis, so that the second module 3 focuses the object under test along the first axis.

[0122] In this embodiment, the processing device further includes: a height detection module 4, which is used to obtain the initial height along the first axis at each position of the surface to be processed of the object to be tested before the first processing and the second processing; the processing device further includes: a processing module, which is used to obtain the position to be re-inspected by the second module on the object to be tested, and the processing module is also used to obtain the second target height based on the initial height and the moving distance of the first module along the first axis.

[0123] Specifically, the height detection module 4 is used to detect the height of the entire surface of the object under test before performing the first first processing and the first second processing. In other embodiments of the present invention, the height detection module 4 includes a first autofocus module for real-time detection of the initial height of the detection position of the first module; and a second autofocus module for real-time detection of the initial height of the detection position of the second module.

[0124] The height detection module can be separated from the first module and the second module; or, the first autofocus module shares a common optical path with the first module; and the second autofocus module shares a common optical path with the second module.

[0125] In this embodiment, the first module is further configured to detect, measure, or process the object to be tested after the first processing; the second module is further configured to detect, measure, or process the object to be tested after the first processing. Specifically, the first module is configured to detect the object to be tested; the second module is configured to detect the object to be tested.

[0126] The separation of the fields of view of the first and second modules means that the positions processed by the first and second modules at the same time are different, resulting in different height differences between the processing position and the focusing position of the first and second modules.

[0127] In a configuration where the relative movement speed of the second module and the object under test along the first axis differs from the relative movement speed of the first module and the object under test along the first axis, the driving component is specifically configured to: after driving the object under test to move along the first axis to the focusing position of the first module via the first driving module, drive the second module to move along the first axis to the focusing position of the second module via the second driving module. Alternatively, during the process of driving the object under test to move along the first axis to the focusing position of the first module via the first driving module, drive the second module to move along the first axis to the focusing position of the second module via the second driving module.

[0128] In this embodiment, the driving module further includes a third driving module, which is used to move the test object and the first module 2 relative to each other in a direction parallel to the surface to be processed of the test object, so that the first module 2 can scan the surface to be processed. During the scanning process, the test object moves along the second axis.

[0129] In this embodiment, the driving component further includes a fourth driving module, which is used to move the second module 3 relative to the surface to be processed along a direction parallel to the surface of the object to be processed, so that the first module 2 can scan the surface to be processed. During the scanning process, the object to be processed moves along the second axis. In this embodiment, the relative movement speed of the second module 3 and the object to be processed along the surface to be processed is different from the relative movement speed of the first module 2 and the object to be processed along the surface to be processed. In other embodiments, the relative movement speed of the second module 3 and the object to be processed along the surface to be processed is equal to the relative movement speed of the first module 2 and the object to be processed along the surface to be processed.

[0130] In other embodiments, the driving component may not include the fourth driving module and / or the third driving module.

[0131] In one embodiment, moving the test object and the first module relative to each other in a direction parallel to the surface to be processed includes: moving the test object and the first module relative to each other along a second axis, and moving the test object along a third axis to cause the first module and the second module to step along the third axis, wherein both the third axis and the second axis are perpendicular to the first axis. Both the second axis and the third axis are parallel to the surface to be processed of the test object. The first axis is perpendicular to the surface to be processed of the test object.

[0132] In this embodiment, the first module is a full inspection module, which is used to perform a full scan of the surface of the object to be processed along the second axis; the second module is a re-inspection module. The re-inspection position of the second module is obtained based on the processing results of the full scan of the first module along the second axis; based on the re-inspection position, it is determined whether the second module is aligned with the re-inspection position; if aligned, the re-inspection of the re-inspection position is performed by the second module.

[0133] In this embodiment, the exposure time of the second module 3 is greater than the exposure time of the first module 2. The second module 3 has a second exposure time, the first module 2 has a first exposure time, and the second exposure time is greater than the first exposure time; or, the magnification of the second module 3 is greater than the magnification of the first module 2.

[0134] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A processing method, characterized in that, include: The test object and the processing device are moved relative to each other along a first axis and the test object is processed by a first module; the processing device includes a first module and a second module; the exposure time of the second module is greater than the exposure time of the first module, or the magnification of the second module is greater than the magnification of the first module; During the first relative movement of the test object and the processing device along a first axis, the second module and the test object undergo a second relative movement along the first axis, and the test object is subjected to a second processing by the second module. The relative movement speed of the second module and the test object along the first axis differs from the relative movement speed of the first module and the test object along the first axis, including: During the process of moving the test object relative to the first module along the positive direction of the first axis, the first module remains fixed along the first axis when performing the first processing on the test object, and the second module moves along the positive direction of the first axis during the process of performing the second processing on the test object. The speed at which the second module moves along the positive direction of the first axis is less than twice the speed at which the test object moves along the first axis. Alternatively, during the movement of the test object relative to the first module along the positive direction of the first axis, the second module keeps the test object fixed along the first axis during the second processing of the test object, while the first module moves along the opposite direction of the first axis during the first processing of the test object.

2. The processing method according to claim 1, characterized in that, The first module is a full inspection module, which is used to perform a full scan of the surface of the object to be tested. The second module is the re-inspection module; The process of performing a second processing on the test object through the second module includes: obtaining the re-inspection position of the second module based on the processing result of the test object by the first module; Based on the position to be re-inspected, determine whether the second module is aligned with the position to be re-inspected. If aligned, re-inspect the position to be re-inspected through the second module, at least during the re-inspection process, by moving the second module relative to the object to be tested.

3. The processing method according to claim 1 or 2, characterized in that, During the first relative movement of the test object and the processing device along the first axis, the second module remains relatively stationary with respect to the test object during the second processing of the test object; the first axis is not perpendicular to the surface of the test object to be processed.

4. The processing method according to claim 3, characterized in that, The first relative movement of the test object and the processing device along the first axis includes: moving the test object along the positive direction of the first axis, while keeping the first module fixed along the first axis; During the second processing of the test object, the second module is relatively stationary with respect to the test object, including: the second module moves along the positive direction of the first axis during the second processing of the test object, and the moving speed of the second module is the same as the moving speed of the test object.

5. The processing method according to claim 1, characterized in that, The first axis is not perpendicular to the surface of the object to be processed; During the second processing of the test object by the second module, the speed at which the second module moves along the positive direction of the first axis is less than or equal to (v1+n2 / (m2t2)) and greater than or equal to (v1-n2 / (m2t2)); v1 is less than or equal to n1 / (m1t1). Where v1 is the moving speed of the object under test; n1 is the size of a pixel in the image captured by the first module; m1 is the magnification of the first module; t1 is the first exposure time of the first module; n2 is the size of a pixel in the image captured by the second module; m2 is the magnification of the second module; and t2 is the second exposure time of the second module.

6. The processing method according to claim 1, characterized in that, The first axis is not perpendicular to the surface of the object to be processed; During the first processing of the object to be tested by the first module, the speed at which the first module moves in the opposite direction of the first axis is less than (n1 / (m1t1)-v1), and v1 is less than or equal to n2 / m2t2. Where v1 is the moving speed of the object under test; n1 is the size of a pixel in the image captured by the first module; m1 is the magnification of the first module; t1 is the first exposure time of the first module; n2 is the size of a pixel in the image captured by the second module; m2 is the magnification of the second module; and t2 is the second exposure time of the second module.

7. The processing method according to claim 1, characterized in that, Also includes: The test object and the first module are driven to move relative to each other in a direction parallel to the surface to be processed of the test object, so that the first module scans the surface to be processed, and during the scanning process, the test object is driven to move along the first axis.

8. The processing method according to claim 1, characterized in that, The first axis is perpendicular to the surface of the object to be tested. In the first processing step, the defocus distance of the first module is different from that of the second module in the second processing step; the first processing step and the second processing step are performed synchronously for at least part of the time; the first processing step includes focusing the object under test; the second processing step includes focusing the object under test.

9. The processing method according to claim 8, characterized in that, The fields of view of the first module and the second module on the surface to be processed of the test object are separated along the second axis; The first relative movement of the test object and the processing device along the first axis includes: driving the test object to move along the first axis according to the test position of the first module along the first axis at a first target height; The second relative movement between the second module and the object under test along the first axis includes: driving the second module to move along the first axis at a second target height along the first axis based on the position of the second module under test, wherein the second axis is perpendicular to the first axis.

10. The processing method according to claim 9, characterized in that, Also includes: Before the first and second processes, the initial height along the first axis at each position on the surface of the object to be processed is obtained; Obtain the re-inspection position of the object to be tested by the second module; obtain the second target height based on the initial height and the moving distance of the first module along the first axis.

11. A processing apparatus, characterized in that, A method for performing the processing method according to any one of claims 1 to 10, comprising: The processing device includes a first module and a second module, wherein the first module is used to perform a first processing on the test object and the second module is used to perform a second processing on the test object. The driving assembly includes: a first driving module for driving the test object and the processing device to perform a first relative movement along a first axis; and a second driving module for driving a second module and the test object to perform a second relative movement along the first axis, and making the relative movement speed of the second module and the test object along the first axis different from the relative movement speed of the first module and the test object along the first axis.

12. The processing apparatus according to claim 11, characterized in that, Also includes: A fixed stage, used to fix the object to be tested; The first driving module is used to drive the object under test to move along the first axis, including: the first driving module is used to drive the fixed stage to move along the first axis.

13. The processing apparatus according to claim 11, characterized in that, The first module is a full inspection module, which is used to perform a full scan of the surface of the object to be processed; the second module is a re-inspection module, which is used to re-inspect the object to be processed based on the processing results of the first module.

14. The processing apparatus according to claim 11, characterized in that, Both the first module and the second module are imaging devices.

15. The processing apparatus according to claim 11, characterized in that, The driving component further includes a third driving module, which is used to drive the test object and the first module to move relative to each other in a direction parallel to the surface to be processed of the test object, so that the first module can scan the surface to be processed, and during the scanning process, the first driving module drives the test object to move along a first axis.

16. The processing apparatus according to claim 11, characterized in that, The fields of view of the first module and the second module on the surface to be processed of the test object are separated along the second axis; The first driving module is used to drive the object under test to move along the first axis according to the first target height along the first axis based on the position to be tested of the first module; the second driving module is used to drive the second module to move along the first axis according to the second target height along the first axis based on the position to be tested of the second module, wherein the second axis is perpendicular to the first axis.

17. The processing apparatus according to claim 16, characterized in that, Also includes: The height detection module is used to obtain the initial height along the first axis at various positions on the surface of the object to be processed before the first and second processes; The processing device further includes a processing module, which is used to obtain the position of the object to be re-inspected by the second module, and the processing module is also used to obtain the second target height based on the initial height and the moving distance of the first module along the first axis.

Images