A grinding apparatus for polishing silicon carbide wafers

Abstract

This invention discloses a grinding device for silicon carbide wafer polishing, specifically relating to a base frame in the field of silicon carbide wafer technology. A motor is mounted on the outer wall of the base frame, a belt roller is fixedly connected to the outer wall of a first fixed rod, a bearing bracket is connected to the outer wall of a first transmission rod, and a grinding disc is mounted on the top of a fixed plate. This grinding device for silicon carbide wafer polishing, through the inclusion of a coarse polishing fluid tank, a second belt roller, and a fixed plate, facilitates the simultaneous addition of coarse polishing fluid while polishing the silicon carbide wafer, improving the efficiency of the polishing process. Simultaneously, the inclusion of a crank, a first gear, and a second swing arm facilitates the rotation of the grinding disc while simultaneously causing the mounting plate, after the silicon carbide wafer is attached, to swing via the first and second swing arms, increasing the contact area between the mounting plate and the grinding disc and improving the overall efficiency of the device in polishing the mounting plate.

Description

Technical Field

[0001] This invention relates to the field of silicon carbide wafer technology, specifically to a grinding apparatus for polishing silicon carbide wafers. Background Technology

[0002] The main applications of silicon carbide wafers include LED solid-state lighting and high-frequency devices. This material possesses superior properties, such as bandgap, drift velocity, breakdown voltage, thermal conductivity, and high-temperature resistance, which are several times higher than those of traditional silicon. It has irreplaceable advantages in electronic applications involving high temperature, high pressure, high frequency, high power, optoelectronics, radiation resistance, and microwave resistance, as well as in extreme environments such as aerospace, military, and nuclear energy. As the only domestic supplier of silicon carbide single crystals, we hold an absolute leading position in R&D, technology, market development, and commercial operations. We have successfully mastered the core technology for growing 76mm ultra-large gem-quality SiC2 crystals, reaching the advanced international level of 2001.

[0003] Existing silicon carbide wafer polishing equipment typically employs two methods: coarse grinding and fine polishing. However, these methods require operators to intermittently add different polishing fluids, necessitating real-time monitoring and reducing efficiency. Furthermore, the inability to adjust the height during both grinding and fine polishing affects the final polished wafer quality. Therefore, existing silicon carbide wafer polishing equipment requires improvement. Summary of the Invention

[0004] The purpose of this invention is to provide a polishing apparatus for grinding silicon carbide wafers, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a grinding device for grinding silicon carbide wafers, comprising a base frame, a first fixed frame fixedly connected to the outer wall of the base frame, a coarse grinding liquid tank installed on one side of the first fixed frame, a first infusion pipe penetrating the inner wall of the coarse grinding liquid tank, and a first nozzle installed at the other end of the first infusion pipe, a first motor installed on the outer wall of the base frame, and the output shaft of the first motor connected to a first fixed rod via a coupling, a first stirrer fixedly connected to the outer wall of the first fixed rod, a first belt roller fixedly connected to the outer wall of the first fixed rod, a first conveyor belt provided on the outer wall of the first belt roller, a second belt roller provided on the inner wall of the first conveyor belt, a first transmission rod fixedly connected to the inner wall of the second belt roller, a bearing bracket connected to the outer wall of the first transmission rod, and a fixed plate fixedly connected to the top of the first transmission rod, a grinding disc provided on the top of the fixed plate, and an mounting plate installed on the top of the grinding disc; A crank is fixedly connected to the outer wall of the first transmission rod, and a connecting rod is slidably connected to the inner wall of the crank. A gear is slidably connected to the other end of the connecting rod, and a slide rail is slidably connected to the outer wall of the gear. A gear is meshed with the outer wall of the gear, and a second transmission rod is slidably connected to the inner wall of the gear. A swing arm is installed on the outer wall of the second transmission rod, and a push roller is connected to the inner wall of the first swing arm via a bearing. A positioning rod is penetratingly connected to the top of the first swing arm, and a second swing arm is penetratingly installed on the outer wall of the positioning rod. A push roller is connected to the inner wall of the second swing arm via a bearing. A support frame is fixedly connected to the top of the base frame, and a protective shell is installed at the other end of the support frame. The outer wall of the protective shell is equipped with a No. 2 motor, and the output shaft of the No. 2 motor is connected to a No. 2 fixed rod via a coupling. The outer wall of the No. 2 fixed rod is connected to a fine grinding liquid tank with a bearing. The inner wall of the fine grinding liquid tank is equipped with a No. 2 stirrer. The bottom end of the fine grinding liquid tank is connected to a No. 2 infusion pipe, and one end of the No. 2 infusion pipe is equipped with a No. 2 nozzle. The outer wall of the No. 2 fixed rod is fixedly connected to a No. 3 belt roller, and the outer wall of the No. 3 belt roller is equipped with a No. 2 conveyor belt. The inner wall of the No. 2 conveyor belt is equipped with a No. 4 belt roller, and one side of the No. 4 belt roller is fixedly connected to a fixed ring. One side of the fixed ring is equipped with a telescopic rod, and the bottom end of the telescopic rod is fixedly connected to a mounting bracket. The inner wall of the No. 4 belt roller is connected to a bearing ring, and the top of the bearing ring is equipped with a cylinder. One end of the cylinder is fixedly connected to a push rod.

[0006] Preferably, the first fixing rod forms a rotating structure through the first motor, and the first stirrer forms an integrated structure with the first fixing rod and the first motor. The inner wall of the coarse grinding liquid tank is provided with the first stirrer, and the shape and size of the inner wall of the coarse grinding liquid tank and the outer wall of the first stirrer are matched.

[0007] Preferably, the inner wall of the first conveyor belt is provided with a first belt roller and a second belt roller, and the second belt roller forms an integrated rotating structure with the first belt roller through the first conveyor belt. The outer wall of the first conveyor belt is movably connected to a positioning roller, and the inner wall of the positioning roller is connected to an adjusting frame. The positioning roller forms a compression structure with the first conveyor belt through the adjusting frame.

[0008] Preferably, the fixed plate forms a rotating structure with the first transmission rod and the second belt roller, and the fixed plate and the grinding disc are magnetically connected. The crank forms a circular motion with the first transmission rod, and the two ends of the connecting rod are slidably connected to the crank. The rack and crank form a reciprocating telescopic structure with the connecting rod.

[0009] Preferably, the inner bottom wall of the base frame is fixedly connected to a slide rail, and the inner wall of the slide rail matches the shape and size of the outer wall of the rack. The first gear forms a reciprocating rotation structure through the rack, and the second transmission rod forms a reciprocating rotation structure through the first gear.

[0010] Preferably, the first swing arm forms a reciprocating adjustment structure with the second transmission rod and the first gear. The first swing arm and the second swing arm are installed through the outer wall of the positioning rod. The top of the second swing arm is provided with a sliding groove. The inner wall of the sliding groove is slidably connected to the positioning rod. The second swing arm and the first swing arm form a spacing adjustment structure through the positioning rod. The outer walls of the first push roller and the second push roller are engaged with the mounting plate.

[0011] Preferably, a second gear is fixedly connected to the outer wall of the second fixing rod, and the second gear and the second motor form an integrated rotating structure through the second fixing rod. A transmission gear is meshed with the outer wall of the second gear, and a second stirrer is fixedly connected to the inner wall of the transmission gear. The second stirrer and the second gear form an integrated rotating structure through the transmission gear. The shape and size of the outer wall of the second stirrer match the inner wall of the fine grinding liquid tank.

[0012] Preferably, a fine grinding liquid tank and a second nozzle are installed through both ends of the second infusion tube, and the second nozzle and the fine grinding liquid tank form an integrated delivery structure through the second infusion tube. A connecting frame is installed on the outer wall of the second nozzle, and a mounting frame is connected to the inner wall of the connecting frame by a bearing. The second nozzle and the mounting frame form an integrated lifting structure through the connecting frame and the mounting frame.

[0013] Preferably, the fourth belt roller and the third belt roller form a synchronous rotating structure through the second conveyor belt, and the fixing ring forms an integrated structure through the fourth belt roller. The two ends of the telescopic rod are fixedly connected to the fixing ring and the mounting frame, and the mounting frame forms a rotating structure with the first push roller through the telescopic rod. The top of the protective shell is fixedly connected to a second fixing frame, and a cylinder is installed at the bottom of the second fixing frame. The push rod forms a lifting structure through the cylinder, and a mounting frame is connected to the outer wall bearing of the first swing arm. The mounting frame forms a height adjustment structure through the push rod and the cylinder, and a mounting plate is installed at the bottom of the mounting frame. An adjustment groove is opened through the top of the protective shell, and a mounting frame is slidably connected to the inner wall of the adjustment groove.

[0014] To address the aforementioned technical problems, this invention also proposes a grinding apparatus for polishing silicon carbide wafers and a method for using it. The grinding apparatus for polishing silicon carbide wafers includes the following steps: Step 1: First, attach the silicon carbide wafer to be ground to the mounting plate. Then, magnetically attach the grinding disc to the fixing plate. Next, engage the mounting plate with the first push roller. Then, push the second swing arm to adjust the distance between the second and first push rollers. This will cause the positioning rod to slide along the groove on one side of the second swing arm. Finally, fix the adjusted second swing arm with the positioning rod to complete the connection between the second and first push rollers and the mounting plate. Step 2: When it is necessary to grind the silicon carbide wafer, start the No. 1 motor set on the outer wall of the base frame. The No. 1 motor drives the No. 1 fixed rod to rotate, which in turn drives the No. 1 stirrer to rotate along the inner wall of the coarse grinding liquid tank. The No. 1 stirrer stirs the grinding liquid in the coarse grinding liquid tank. At this time, start the No. 1 nozzle to draw the grinding liquid in the coarse grinding liquid tank through the No. 1 infusion pipe and spray the grinding liquid onto the top of the grinding disc. As the first fixed rod rotates, the first belt roller rotates along with it, causing the second belt roller to rotate synchronously with it via the first conveyor belt. By adjusting the position of the adjusting frame, the positioning roller is brought into contact with the first conveyor belt, ensuring the stability of the transmission of the second belt roller via the first conveyor belt. At this time, the second belt roller drives the first transmission rod to rotate synchronously, causing the first transmission rod to rotate along the bearing frame and drive the fixed plate to rotate. This, in turn, causes the grinding disc and the mounting plate to rotate synchronously, thus bringing the silicon carbide wafer into contact with the grinding disc and the grinding fluid. Step 3: While the first transmission rod is rotating, it drives the crank to perform circular motion. Since the inner wall of the connecting rod is slidably connected to the crank and the rack, the rack is reciprocated through the connecting rod and the crank, thereby driving the rack to slide back and forth along the slide rail. In turn, the rack drives the first gear to rotate back and forth. At this time, the first gear drives the first swing arm to swing back and forth through the second transmission rod, so that the first and second swing arms drive the silicon carbide wafer and the mounting plate to swing through the first and second push rollers, thus completing the initial grinding of the silicon carbide wafer. Step 4: When the staff needs to perform secondary fine grinding on the silicon carbide wafer, push the No. 1 swing arm and the No. 2 swing arm to one side, then install the mounting plate and mounting frame after the silicon carbide wafer is attached, and then magnetically connect the replaced grinding disc to the fixing plate. At this time, start the No. 2 motor set on the outer wall of the protective shell so that the No. 2 motor drives the No. 2 fixing rod to rotate. Since the No. 2 gear is meshed with the transmission gear, the transmission gear drives the No. 2 stirrer to rotate along the inner wall of the fine grinding liquid tank, thereby completing the stirring of the fine grinding liquid in the fine grinding liquid tank. Step 5: As the second fixed rod rotates, the third belt roller also rotates, causing the fourth belt roller to rotate synchronously with the third belt roller via the second conveyor belt. This causes the fourth belt roller to drive the fixed ring to rotate, which in turn drives the mounting frame to rotate via the telescopic rod. Since the outer wall of the bearing ring is connected to the inner wall of the fourth belt roller, the stability of the subsequent cylinder lifting and adjusting is ensured. Then, by activating the cylinder installed on one side of the second fixed frame, the cylinder drives the push rod to lift and lower, so that the push rod drives the mounting frame and the mounting plate to lift and lower synchronously. Because the outer wall bearing of the mounting frame is connected to the connecting frame, the connecting frame drives the No. 2 nozzle to move up and down synchronously with the mounting frame. By activating the No. 2 nozzle, the No. 2 nozzle, in conjunction with the No. 2 infusion pipe, sprays the fine grinding fluid in the fine grinding fluid tank. This allows the mounting plate to adhere to the grinding disc for grinding, and with the continuous spraying of fine grinding fluid, the grinding and polishing of the silicon carbide wafer is completed.

[0015] Compared with the prior art, the beneficial effects of the present invention are: the polishing apparatus for polishing silicon carbide wafers; 1. Through the setup of a coarse grinding slurry tank, a second belt roller, and a fixed plate, the first conveyor belt drives the second belt roller to rotate synchronously with the first belt roller. At the same time, when the fixed plate rotates with the second belt roller via the first transmission rod, the first fixed rod drives the first agitator to stir the coarse grinding slurry in the coarse grinding slurry tank. While the fixed plate, in conjunction with the grinding disc, grinds the silicon carbide wafer after it is attached to the mounting plate, the quality of the coarse grinding slurry in the tank is ensured. This solves the problem that existing silicon carbide wafer grinding devices require intermittent addition of coarse grinding slurry by the operator. This allows the entire device to add coarse grinding slurry while grinding the silicon carbide wafer, improving the efficiency of the operator in grinding the silicon carbide wafer. It also prevents the coarse grinding slurry in the tank from solidifying, thus ensuring the quality of subsequent grinding of the silicon carbide wafer by the coarse grinding slurry. 2. By using a crank, gear number one, and swing arm number two, the spacing of swing arm number two is adjusted so that it drives the spacing between push roller number two and push roller number one. This causes the positioning rod to slide along the groove opened on one side of swing arm number two, and then the positioning rod fixes the adjusted swing arm number two. This makes it easier for workers to grind silicon carbide wafers of different sizes, improves the efficiency of grinding silicon carbide wafers of different sizes, and ensures the stability of grinding silicon carbide wafers of different sizes. Simultaneously, the crank rotates through the first transmission rod, causing the rack to reciprocate through the connecting rod and the crank. This causes the rack to slide reciprocally along the slide rail, which in turn drives the first gear to rotate reciprocally. At this time, the first gear drives the first swing arm to swing reciprocally through the second transmission rod. This facilitates the rotation of the grinding disc while the first and second swing arms drive the mounting plate after the silicon carbide wafer is attached to swing, increasing the contact area between the mounting plate and the grinding disc and improving the overall efficiency of the device in grinding the mounting plate. 3. By using a gear meshing mechanism with a No. 2 motor, a No. 4 belt roller, and a cylinder, the No. 2 agitator rotates via a transmission gear and a No. 2 gear. Simultaneously, the No. 4 belt roller rotates synchronously with the No. 3 belt roller via the No. 2 conveyor belt. This, in turn, drives the fixed ring, telescopic rod, and mounting frame to rotate. Then, by activating the cylinder mounted on one side of the No. 2 fixed frame, the cylinder drives the push rod to rise and fall, causing the push rod to synchronously rise and fall of the mounting frame and mounting plate. This solves the problem that existing silicon carbide wafer grinding devices cannot adjust the height during grinding, thus facilitating the adjustment of the grinding process according to the required thickness of the silicon carbide wafer. This improves the efficiency of grinding silicon carbide wafers to the required thickness, ensures the quality of the ground silicon carbide wafers, and increases the overall practicality of the device. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a side view of the structure of the present invention; Figure 3 This is a schematic diagram of the internal structure of the base frame of the present invention; Figure 4 This is a schematic diagram of the connection structure between the No. 1 stirrer and the fixed plate of the present invention; Figure 5 This is a schematic diagram of the connection structure between the No. 2 belt roller and the No. 2 transmission rod of the present invention; Figure 6 This is a schematic diagram of the connection structure between the first swing arm and the second swing arm of the present invention; Figure 7 This is a schematic diagram of the internal structure of the protective shell and the fine grinding liquid tank of the present invention; Figure 8 This is a schematic diagram of the connection structure between the No. 2 motor and the mounting bracket of the present invention.

[0017] In the diagram: 1. Base frame; 2. Fixing frame 1; 3. Coarse grinding liquid tank; 4. Infusion pipe 1; 5. No. 1 nozzle; 6. Motor 1; 7. Fixing rod 1; 8. Agitator 1; 9. Belt roller 1; 10. Conveyor belt 1; 11. Positioning roller; 12. Adjusting frame; 13. Belt roller 2; 14. Transmission rod 1; 15. Bearing frame; 16. Fixing plate; 17. Grinding disc; 18. Mounting plate; 19. Crank; 20. Connecting rod; 21. Gear rack; 22. Slide rail; 23. Gear 1; 24. Transmission rod 2; 25. Swing arm 1; 26. Push roller 1; 27. 1. Positioning rod; 28. No. 2 swing arm; 29. ​​Slide groove; 30. No. 2 push roller; 31. Support frame; 32. Protective shell; 33. Adjustment groove; 34. No. 2 motor; 35. No. 2 fixing rod; 36. No. 2 gear; 37. Fine grinding liquid tank; 38. Transmission gear; 39. No. 2 agitator; 40. No. 2 infusion pipe; 41. No. 2 nozzle; 42. Connecting frame; 43. No. 3 belt roller; 44. No. 2 conveyor belt; 45. No. 4 belt roller; 46. Fixing ring; 47. Telescopic rod; 48. Mounting frame; 49. No. 2 fixing frame; 50. Bearing ring; 51. Cylinder; 52. Push rod. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Please see Figure 1-4 This invention provides a technical solution: a grinding device for polishing silicon carbide wafers, comprising a base frame 1, a first fixing frame 2 fixedly connected to the outer wall of the base frame 1, a coarse grinding liquid tank 3 installed on one side of the first fixing frame 2, a first infusion pipe 4 penetrating the inner wall of the coarse grinding liquid tank 3, and a first nozzle 5 installed at the other end of the first infusion pipe 4, a first motor 6 installed on the outer wall of the base frame 1, and the output shaft of the first motor 6 connected to a first fixing rod 7 via a coupling, and a first agitator fixedly connected to the outer wall of the first fixing rod 7. The mixer 8 has a first belt roller 9 fixedly connected to the outer wall of the first fixed rod 7, and a first conveyor belt 10 is provided on the outer wall of the first belt roller 9. A second belt roller 13 is provided on the inner wall of the first conveyor belt 10, and a first transmission rod 14 is fixedly connected to the inner wall of the second belt roller 13. A bearing bracket 15 is connected to the outer wall of the first transmission rod 14, and a fixed plate 16 is fixedly connected to the top of the first transmission rod 14. A grinding disc 17 is provided on the top of the fixed plate 16, and an mounting plate 18 is installed on the top of the grinding disc 17.

[0020] The first fixed rod 7 forms a rotating structure through the first motor 6, and the first stirrer 8 forms an integrated structure with the first fixed rod 7 and the first motor 6. The first stirrer 8 is installed on the inner wall of the coarse grinding liquid tank 3, and the shape and size of the inner wall of the coarse grinding liquid tank 3 and the outer wall of the first stirrer 8 are matched. The inner wall of the first conveyor belt 10 is provided with a first belt roller 9 and a second belt roller 13, and the second belt roller 13 forms an integrated rotating structure with the first conveyor belt 10 and the first belt roller 9. The outer wall of the first conveyor belt 10 is movably connected to a positioning roller 11, and the inner wall of the positioning roller 11 is connected to an adjusting frame 12. The positioning roller 11 forms a pressing structure with the first conveyor belt 10 through the adjusting frame 12. The fixed plate 16 forms a rotating structure with the first transmission rod 14 and the second belt roller 13, and the fixed plate 16 and the grinding disc 17 are magnetically connected. The crank 19 forms a circular motion through the first transmission rod 14, and the two ends of the connecting rod 20 are slidably connected to the crank 19 with the toothed rod 21. The toothed rod 21 forms a reciprocating telescopic structure with the crank 19 through the connecting rod 20.

[0021] The specific implementation method is as follows: Using a coarse grinding slurry tank 3, a second belt roller 13, and a fixed plate 16, a first conveyor belt 10 drives the second belt roller 13 and the first belt roller 9 to rotate synchronously. Simultaneously, the fixed plate 16 rotates with the second belt roller 13 via a first transmission rod 14, causing the first fixed rod 7 to drive the first stirrer 8 to stir the coarse grinding slurry in the coarse grinding slurry tank 3. While the fixed plate 16, in conjunction with the grinding disc 17, grinds the silicon carbide wafer after it is attached to the mounting plate 18, the quality of the coarse grinding slurry transported in the coarse grinding slurry tank 3 is ensured. This solves the problem that existing silicon carbide wafer grinding devices require intermittent addition of coarse grinding slurry by operators. This allows for simultaneous addition of coarse grinding slurry while the entire device grinds the silicon carbide wafer, improving the efficiency of the grinding process and preventing the coarse grinding slurry in the tank 3 from solidifying, thus ensuring the quality of subsequent grinding of the silicon carbide wafer by the coarse grinding slurry.

[0022] Please see Figure 1-6This invention provides a technical solution: a grinding device for grinding silicon carbide wafers, wherein a crank 19 is fixedly connected to the outer wall of a first transmission rod 14, and a connecting rod 20 is slidably connected to the inner wall of the crank 19; a gear 21 is slidably connected to the other end of the connecting rod 20; a slide rail 22 is slidably connected to the outer wall of the gear 21; a first gear 23 is meshed with the outer wall of the gear 21; a second transmission rod 24 is slidably connected to the inner wall of the first gear 23; a first swing arm 25 is installed on the outer wall of the second transmission rod 24; a first push roller 26 is connected to the inner wall of the first swing arm 25 by a bearing; a positioning rod 27 is penetratingly connected to the top of the first swing arm 25; a second swing arm 28 is penetratingly installed on the outer wall of the positioning rod 27; a second push roller 30 is connected to the inner wall of the second swing arm 28 by a bearing; a support frame 31 is fixedly connected to the top of the base frame 1; and a protective shell 32 is installed at the other end of the support frame 31.

[0023] The inner bottom wall of the base frame 1 is fixedly connected to the slide rail 22, and the inner wall of the slide rail 22 matches the shape and size of the outer wall of the rack 21. The first gear 23 forms a reciprocating rotation structure through the rack 21, and the second transmission rod 24 forms a reciprocating rotation structure through the first gear 23. The first swing arm 25 forms a reciprocating adjustment structure with the first gear 23 via the second transmission rod 24. The first swing arm 25 and the second swing arm 28 are installed through the outer wall of the positioning rod 27. The top of the second swing arm 28 is provided with a sliding groove 29. The inner wall of the sliding groove 29 is slidably connected to the positioning rod 27. The second swing arm 28 and the first swing arm 25 form a spacing adjustment structure through the positioning rod 27. The first push roller 26 and the second push roller 30 are engaged with the outer wall of the mounting plate 18.

[0024] The specific implementation method is as follows: By setting the crank 19, the first gear 23 and the second swing arm 28, the spacing of the second swing arm 28 is adjusted so that the second swing arm 28 drives the second push roller 30 and the first push roller 26 to adjust the spacing. This causes the positioning rod 27 to slide along the sliding groove 29 opened through one side of the second swing arm 28. Then, the positioning rod 27 fixes the adjusted second swing arm 28, which facilitates the grinding of silicon carbide wafers of different sizes by the staff, improves the efficiency of grinding silicon carbide wafers of different sizes, and ensures the stability of grinding silicon carbide wafers of different sizes. Simultaneously, the crank 19 rotates via the first transmission rod 14, causing the rack 21 to reciprocate through the connecting rod 20 and the crank 19. This drives the rack 21 to slide reciprocally along the slide rail 22, which in turn drives the first gear 23 to rotate reciprocally. At this time, the first gear 23 drives the first swing arm 25 to swing reciprocally via the second transmission rod 24. This facilitates the rotation of the grinding disc 17 while the first swing arm 25 and the second swing arm 28 drive the mounting plate 18 after the silicon carbide wafer is attached to swing, increasing the contact area between the mounting plate 18 and the grinding disc 17 and improving the overall efficiency of the device in grinding the mounting plate 18.

[0025] Please see Figure 1-8 This invention provides a technical solution: a grinding device for polishing silicon carbide wafers. A second motor 34 is mounted on the outer wall of a protective shell 32, and the output shaft of the second motor 34 is connected to a second fixing rod 35 via a coupling. A fine grinding liquid tank 37 is connected to the outer wall of the second fixing rod 35 via a bearing, and a second stirrer 39 is installed on the inner wall of the fine grinding liquid tank 37. A second infusion pipe 40 is installed through the bottom end of the fine grinding liquid tank 37, and a second nozzle 41 is installed at one end of the second infusion pipe 40. The outer wall of the second fixing rod 35... A third belt roller 43 is fixedly connected, and a second conveyor belt 44 is installed on the outer wall of the third belt roller 43. A fourth belt roller 45 is installed on the inner wall of the second conveyor belt 44. A fixing ring 46 is fixedly connected to one side of the fourth belt roller 45. A telescopic rod 47 is installed on one side of the fixing ring 46. A mounting bracket 48 is fixedly connected to the bottom end of the telescopic rod 47. A bearing ring 50 is connected to the inner wall of the fourth belt roller 45. A cylinder 51 is installed on the top of the bearing ring 50. A push rod 52 is fixedly connected to one end of the cylinder 51.

[0026] The outer wall of the second fixing rod 35 is fixedly connected to the second gear 36, and the second gear 36 forms an integrated rotating structure with the second motor 34 through the second fixing rod 35. The outer wall of the second gear 36 is meshed with the transmission gear 38, and the inner wall of the transmission gear 38 is fixedly connected to the second stirrer 39. The second stirrer 39 forms an integrated rotating structure with the second gear 36 through the transmission gear 38. The outer wall of the second stirrer 39 matches the shape and size of the inner wall of the fine grinding liquid tank 37. The two ends of the No. 2 infusion tube 40 are connected to the fine grinding liquid tank 37 and the No. 2 nozzle 41. The No. 2 nozzle 41 and the fine grinding liquid tank 37 form an integrated conveying structure through the No. 2 infusion tube 40. The outer wall of the No. 2 nozzle 41 is equipped with a connecting frame 42, and the inner wall of the connecting frame 42 is connected to the mounting frame 48 by a bearing. The No. 2 nozzle 41 and the mounting frame 48 form an integrated lifting structure through the connecting frame 42 and the mounting frame 48. The fourth belt roller 45 and the third belt roller 43 form a synchronous rotating structure through the second conveyor belt 44, and the fixed ring 46 forms an integrated structure through the fourth belt roller 45. The two ends of the telescopic rod 47 are fixedly connected to the fixed ring 46 and the mounting frame 48, and the mounting frame 48 forms a rotating structure with the first push roller 26 through the telescopic rod 47. The top of the protective shell 32 is fixedly connected to a second fixing bracket 49, and a cylinder 51 is installed at the bottom of the second fixing bracket 49. The push rod 52 forms a lifting structure through the cylinder 51, and the outer wall bearing of the first swing arm 25 is connected to a mounting bracket 48. The mounting bracket 48 forms a height adjustment structure with the cylinder 51 through the push rod 52, and a mounting plate 18 is installed at the bottom of the mounting bracket 48. An adjustment groove 33 is opened through the top of the protective shell 32, and the mounting bracket 48 is slidably connected to the inner wall of the adjustment groove 33.

[0027] The specific implementation method is as follows: A second motor 34, a fourth belt roller 45, and a cylinder 51 are connected by gears. The second stirrer 39 rotates via transmission gears 38 and 36. Simultaneously, the fourth belt roller 45 rotates synchronously with the third belt roller 43 via the second conveyor belt 44. This drives the fixed ring 46, the telescopic rod 47, and the mounting frame 48 to rotate. Then, the cylinder 51 installed on one side of the second fixed frame 49 is activated. The cylinder 51 drives the push rod 52 to rise and fall, causing the push rod 52 to synchronously raise and lower the mounting frame 48 and the mounting plate 18. This solves the problem that existing silicon carbide wafer grinding devices cannot adjust the height during grinding, thus facilitating grinding adjustments based on the required thickness of the silicon carbide wafer. This improves the efficiency of grinding according to the required thickness, ensures the quality of the ground silicon carbide wafer, and increases the overall practicality of the device.

[0028] Working principle: When using this grinding device for grinding silicon carbide wafers, firstly, the silicon carbide wafer to be ground is attached to the mounting plate 18, and then the grinding disc 17 to be ground is magnetically attached to the fixing plate 16. At this time, the attached mounting plate 18 is engaged with the first push roller 26. Then, by pushing the second swing arm 28, the distance between the second push roller 30 and the first push roller 26 is adjusted, thereby driving the positioning rod 27 to slide along the sliding groove 29 opened through one side of the second swing arm 28. Then, the adjusted second swing arm 28 is fixed by the positioning rod 27, thus completing the connection between the second push roller 30 and the first push roller 26 and the mounting plate 18. When it is necessary to grind the silicon carbide wafer, the No. 6 motor installed on the outer wall of the base frame 1 is started, so that the No. 6 motor drives the No. 7 fixed rod to rotate, and the No. 8 stirrer rotates along the inner wall of the coarse grinding liquid tank 3 through the No. 1 fixed rod 7. The No. 8 stirs the grinding liquid in the coarse grinding liquid tank 3. At this time, the No. 5 nozzle is started, so that the No. 5 nozzle draws the grinding liquid in the coarse grinding liquid tank 3 through the No. 1 infusion pipe 4 and sprays the grinding liquid onto the top of the grinding disc 17. As the first fixed rod 7 rotates, the first belt roller 9 rotates along with it, so that the second belt roller 13 rotates synchronously with the first belt roller 9 via the first conveyor belt 10. Then, by adjusting the position of the adjusting frame 12, the adjusting frame 12 drives the positioning roller 11 to contact the first conveyor belt 10, thereby ensuring the stability of the transmission of the second belt roller 13 via the first conveyor belt 10. At this time, the second belt roller 13 drives the first transmission rod 14 to rotate synchronously, so that the first transmission rod 14 drives the fixed plate 16 to rotate along the bearing frame 15, thereby driving the grinding disc 17 and the mounting plate 18 to rotate synchronously, thereby driving the silicon carbide wafer to contact the grinding disc 17 and the grinding fluid. While the first transmission rod 14 is rotating, it drives the crank 19 to perform circular motion. Since the inner wall of the connecting rod 20 is slidably connected to the crank 19 and the rack 21, the rack 21 is reciprocated and stretched through the connecting rod 20 and the crank 19, thereby driving the rack 21 to slide reciprocally along the slide rail 22. In turn, the rack 21 drives the first gear 23 to rotate reciprocally. At this time, the first gear 23 drives the first swing arm 25 to swing reciprocally through the second transmission rod 24, so that the first swing arm 25 and the second swing arm 28 drive the silicon carbide wafer and the mounting plate 18 to swing through the first push roller 26 and the second push roller 30, thus completing the initial grinding of the silicon carbide wafer. When the staff needs to perform secondary fine grinding on the silicon carbide wafer, the first swing arm 25 and the second swing arm 28 are pushed to one side. Then, the mounting plate 18 and the mounting bracket 48 after the silicon carbide wafer is attached are installed. Next, the replacement grinding disc 17 is magnetically connected to the fixing plate 16. At this time, the second motor 34 set on the outer wall of the protective shell 32 is started, so that the second motor 34 drives the second fixing rod 35 to rotate. Since the second gear 36 is meshed with the transmission gear 38, the second stirrer 39 is driven to rotate along the inner wall of the fine grinding liquid tank 37 through the transmission gear 38, thereby completing the stirring of the fine grinding liquid in the fine grinding liquid tank 37. As the second fixed rod 35 rotates, the third belt roller 43 rotates along with the second fixed rod 35, so that the fourth belt roller 45 rotates synchronously with the third belt roller 43 via the second conveyor belt 44. This causes the fourth belt roller 45 to drive the fixed ring 46 to rotate, and then the fixed ring 46 drives the mounting frame 48 to rotate via the telescopic rod 47. Since the outer wall of the bearing ring 50 is connected to the inner wall of the fourth belt roller 45 bearing, the stability of the subsequent lifting and lowering adjustment of the cylinder 51 is ensured. Then, by activating the cylinder 51 installed on one side of the second fixed frame 49, the cylinder 51 drives the push rod 52 to lift and lower, so that the push rod 52 drives the mounting frame 48 and the mounting plate 18 to lift and lower synchronously. Since the outer wall bearing of the mounting frame 48 is connected to the connecting frame 42, the connecting frame 42 drives the second nozzle 41 to move up and down synchronously with the mounting frame 48. By starting the second nozzle 41, the second nozzle 41, in conjunction with the second infusion pipe 40, sprays the fine polishing liquid in the fine polishing liquid tank 37. This allows the mounting plate 18 to adhere to the polishing disc 17 for polishing, and with the continuous spraying of fine polishing liquid, the polishing and grinding of the silicon carbide wafer is completed.

[0029] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A grinding apparatus for polishing silicon carbide wafers, comprising a base frame (1), characterized in that: A fixed bracket (2) is fixedly connected to the outer wall of the base frame (1), and a coarse grinding liquid tank (3) is installed on one side of the fixed bracket (2). A delivery pipe (4) is connected through the inner wall of the coarse grinding liquid tank (3), and a nozzle (5) is installed at the other end of the delivery pipe (4). A motor (6) is installed on the outer wall of the base frame (1), and the output shaft of the motor (6) is connected to a fixed rod (7) through a coupling. A stirrer (8) is fixedly connected to the outer wall of the fixed rod (7). A first belt roller (9) is connected, and a first conveyor belt (10) is provided on the outer wall of the first belt roller (9). A second belt roller (13) is provided on the inner wall of the first conveyor belt (10), and a first transmission rod (14) is fixedly connected to the inner wall of the second belt roller (13). A bearing bracket (15) is connected to the outer wall of the first transmission rod (14), and a fixing plate (16) is fixedly connected to the top of the first transmission rod (14). A grinding disc (17) is provided on the top of the fixing plate (16), and an installation plate (18) is provided on the top of the grinding disc (17). A crank (19) is fixedly connected to the outer wall of the first transmission rod (14), and a connecting rod (20) is slidably connected to the inner wall of the crank (19). A rack (21) is slidably connected to the other end of the connecting rod (20), and a slide rail (22) is slidably connected to the outer wall of the rack (21). A gear (23) is meshed with the outer wall of the rack (21), and a second transmission rod (24) is slidably connected to the inner wall of the gear (23). The outer wall of the second transmission rod (24) is fitted with... A first swing arm (25) is connected, and a first push roller (26) is connected to the inner wall bearing of the first swing arm (25). A positioning rod (27) is connected through the top of the first swing arm (25), and a second swing arm (28) is installed through the outer wall of the positioning rod (27). A second push roller (30) is connected to the inner wall bearing of the second swing arm (28). A support frame (31) is fixedly connected to the top of the base frame (1), and a protective shell (32) is installed at the other end of the support frame (31). The outer wall of the protective shell (32) is equipped with a No. 2 motor (34), and the output shaft of the No. 2 motor (34) is connected to a No. 2 fixing rod (35) via a coupling. The outer wall of the No. 2 fixing rod (35) is connected to a fine grinding liquid tank (37), and the inner wall of the fine grinding liquid tank (37) is equipped with a No. 2 stirrer (39). The bottom end of the fine grinding liquid tank (37) is connected to a No. 2 infusion pipe (40), and one end of the No. 2 infusion pipe (40) is equipped with a No. 2 nozzle (41). The outer wall of the No. 2 fixing rod (35) is fixedly connected to a No. 3 belt roller (43), and the No. 3... The outer wall of the belt roller (43) is provided with a second conveyor belt (44), the inner wall of the second conveyor belt (44) is provided with a fourth belt roller (45), and a fixed ring (46) is fixedly connected to one side of the fourth belt roller (45). A telescopic rod (47) is provided to one side of the fixed ring (46), and a mounting bracket (48) is fixedly connected to the bottom end of the telescopic rod (47). A bearing ring (50) is connected to the inner wall of the fourth belt roller (45), and a cylinder (51) is provided at the top of the bearing ring (50). A push rod (52) is fixedly connected to one end of the cylinder (51).

2. The grinding apparatus for polishing silicon carbide wafers according to claim 1, characterized in that, The first fixing rod (7) forms a rotating structure through the first motor (6), and the first stirrer (8) forms an integrated structure with the first fixing rod (7) and the first motor (6). The inner wall of the coarse grinding liquid tank (3) is provided with the first stirrer (8), and the inner wall of the coarse grinding liquid tank (3) and the outer wall of the first stirrer (8) are matched in shape and size.

3. The grinding apparatus for polishing silicon carbide wafers according to claim 1, characterized in that, The inner wall of the first conveyor belt (10) is provided with a first belt roller (9) and a second belt roller (13), and the second belt roller (13) forms an integrated rotating structure with the first belt roller (9) through the first conveyor belt (10). The outer wall of the first conveyor belt (10) is movably connected with a positioning roller (11), and the inner wall of the positioning roller (11) is connected with an adjusting frame (12). The positioning roller (11) forms a pressing structure with the first conveyor belt (10) through the adjusting frame (12).

4. The grinding apparatus for polishing silicon carbide wafers according to claim 1, characterized in that, The fixed plate (16) forms a rotating structure with the first transmission rod (14) and the second belt roller (13), and the fixed plate (16) and the grinding disc (17) are magnetically connected. The crank (19) forms a circular motion through the first transmission rod (14), and the two ends of the connecting rod (20) are slidably connected with the toothed rod (21) and the crank (19). The toothed rod (21) forms a reciprocating telescopic structure with the crank (19) through the connecting rod (20).

5. The grinding apparatus for polishing silicon carbide wafers according to claim 4, characterized in that, The inner bottom wall of the base frame (1) is fixedly connected to a slide rail (22), and the inner wall of the slide rail (22) and the outer wall of the rack (21) are matched in shape and size. The first gear (23) forms a reciprocating rotation structure through the rack (21), and the second transmission rod (24) forms a reciprocating rotation structure through the first gear (23).

6. The grinding apparatus for polishing silicon carbide wafers according to claim 1, characterized in that, The first swing arm (25) forms a reciprocating adjustment structure with the first gear (23) via the second transmission rod (24). The first swing arm (25) and the second swing arm (28) are installed through the outer wall of the positioning rod (27). The top of the second swing arm (28) is provided with a sliding groove (29). The inner wall of the sliding groove (29) is slidably connected to the positioning rod (27). The second swing arm (28) and the first swing arm (25) form a spacing adjustment structure through the positioning rod (27). The outer walls of the first push roller (26) and the second push roller (30) are engaged with the mounting plate (18).

7. The grinding apparatus for polishing silicon carbide wafers according to claim 6, characterized in that, The outer wall of the second fixed rod (35) is fixedly connected to the second gear (36), and the second gear (36) forms an integrated rotating structure with the second motor (34) through the second fixed rod (35). The outer wall of the second gear (36) is meshed with the transmission gear (38), and the inner wall of the transmission gear (38) is fixedly connected to the second stirrer (39). The second stirrer (39) forms an integrated rotating structure with the second gear (36) through the transmission gear (38). The outer wall of the second stirrer (39) matches the shape and size of the inner wall of the fine grinding liquid tank (37).

8. The grinding apparatus for polishing silicon carbide wafers according to claim 1, characterized in that, The two ends of the No. 2 infusion pipe (40) are connected to a fine grinding liquid tank (37) and a No. 2 nozzle (41). The No. 2 nozzle (41) and the fine grinding liquid tank (37) form an integrated conveying structure through the No. 2 infusion pipe (40). A connecting frame (42) is installed on the outer wall of the No. 2 nozzle (41), and a mounting frame (48) is connected to the inner wall bearing of the connecting frame (42). The No. 2 nozzle (41) and the mounting frame (48) form an integrated lifting structure through the connecting frame (42) and the mounting frame (48).

9. The grinding apparatus for polishing silicon carbide wafers according to claim 1, characterized in that, The fourth belt roller (45) and the third belt roller (43) are connected by the second conveyor belt (44) to form a synchronous rotation structure, and the fixed ring (46) and the fourth belt roller (45) form an integrated structure. The two ends of the telescopic rod (47) are fixedly connected to the fixed ring (46) and the mounting frame (48) respectively. The bottom of the mounting frame (48) is connected to the mounting plate (18) through the connecting frame (42). The top of the protective shell (32) is fixedly connected to a second fixing frame (49), and a cylinder (51) is installed at the bottom of the second fixing frame (49). The push rod (52) forms a lifting structure through the cylinder (51). An adjustment groove (33) is opened through the top of the protective shell (32), and an installation frame (48) is slidably connected to the inner wall of the adjustment groove (33).

10. A method of using a grinding apparatus for polishing silicon carbide wafers, for use in the grinding apparatus for polishing silicon carbide wafers according to any one of claims 1-9, characterized in that, Includes the following steps: Step 1: First, attach the silicon carbide wafer to be ground to the mounting plate (18), then attach the grinding disc (17) to the fixing plate (16) with magnetic attraction. At this time, attach the mounting plate (18) to the first push roller (26) and then push the second swing arm (28) to adjust the distance between the second push roller (30) and the first push roller (26), thereby driving the positioning rod (27) to slide along the groove (29) opened through one side of the second swing arm (28). Then, fix the adjusted second swing arm (28) through the positioning rod (27) to complete the connection between the second push roller (30) and the first push roller (26) and the mounting plate (18). Step 2: When it is necessary to grind the silicon carbide wafer, start the No. 1 motor (6) set on the outer wall of the base frame (1) so that the No. 1 motor (6) drives the No. 1 fixed rod (7) to rotate, thereby driving the No. 1 stirrer (8) to rotate along the inner wall of the coarse grinding liquid tank (3) through the No. 1 fixed rod (7), and then stir the grinding liquid in the coarse grinding liquid tank (3) through the No. 1 stirrer (8). At this time, start the No. 1 nozzle (5) so that the No. 1 nozzle (5) draws the grinding liquid in the coarse grinding liquid tank (3) through the No. 1 infusion pipe (4) and sprays the grinding liquid onto the top of the grinding disc (17). While the first fixed rod (7) rotates, the first belt roller (9) rotates along with the first fixed rod (7), so that the second belt roller (13) rotates synchronously with the first belt roller (9) through the first conveyor belt (10). Then, by adjusting the position of the adjusting frame (12), the adjusting frame (12) drives the positioning roller (11) to contact the first conveyor belt (10), thereby ensuring the stability of the transmission of the second belt roller (13) through the first conveyor belt (10). At this time, the second belt roller (13) drives the first transmission rod (14) to rotate synchronously, so that the first transmission rod (14) drives the fixed plate (16) to rotate along the bearing frame (15), thereby driving the grinding disc (17) and the mounting plate (18) to rotate synchronously through the fixed plate (16), thereby driving the silicon carbide wafer to contact the grinding disc (17) and the grinding liquid. Step 3: While the first transmission rod (14) is rotating, the first transmission rod (14) drives the crank (19) to perform circular motion. Since the inner wall of the connecting rod (20) is slidably connected to the crank (19) and the rack (21), the rack (21) is stretched back and forth through the connecting rod (20) and the crank (19), thereby driving the rack (21) to slide back and forth along the slide rail (22), and then driving the first gear (23) to rotate back and forth through the rack (21). At this time, the first gear (23) drives the first swing arm (25) to swing back and forth through the second transmission rod (24), so that the first swing arm (25) and the second swing arm (28) drive the silicon carbide wafer and the mounting plate (18) to swing through the first push roller (26) and the second push roller (30), thus completing the initial grinding of the silicon carbide wafer; Step 4: When the staff needs to perform secondary fine grinding on the silicon carbide wafer, push the first swing arm (25) and the second swing arm (28) to one side, and then install the mounting plate (18) and the mounting bracket (48) after the silicon carbide wafer is attached. Then, magnetically connect the replaced grinding disc (17) and the fixing plate (16). At this time, start the second motor (34) set on the outer wall of the protective shell (32) so that the second motor (34) drives the second fixing rod (35) to rotate. Since the second gear (36) and the transmission gear (38) are meshed, the second stirrer (39) is driven by the transmission gear (38) to rotate along the inner wall of the fine grinding liquid tank (37), thereby completing the stirring of the fine grinding liquid in the fine grinding liquid tank (37). Step 5: When the second fixed rod (35) rotates, the third belt roller (43) rotates with the second fixed rod (35), so that the fourth belt roller (45) rotates synchronously with the third belt roller (43) through the second conveyor belt (44), thereby driving the fixed ring (46) to rotate through the fourth belt roller (45), and then the fixed ring (46) drives the mounting frame (48) to rotate through the telescopic rod (47). Since the outer wall of the bearing ring (50) is connected to the inner wall of the fourth belt roller (45) bearing, the stability of the subsequent cylinder (51) lifting and adjusting is ensured. Then, by starting the cylinder (51) installed on one side of the second fixed frame (49), the cylinder (51) drives the push rod (52) to lift and lower, so that the push rod (52) drives the mounting frame (48) and the mounting plate (18) to lift and lower synchronously. Since the outer wall bearing of the mounting frame (48) is connected to the connecting frame (42), the connecting frame (42) drives the second nozzle (41) to move up and down synchronously with the mounting frame (48). By starting the second nozzle (41), the second nozzle (41) and the second infusion pipe (40) spray the fine polishing liquid in the fine polishing liquid tank (37), so that the mounting plate (18) and the polishing disc (17) are in contact and polished, and the fine polishing liquid is continuously sprayed to complete the polishing and grinding of the silicon carbide wafer.

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