Display panel, display device, and method for manufacturing display panel

Abstract

The present application discloses a display panel, a display device and a method for preparing a display panel, wherein the display panel includes a substrate, an isolation structure, a light-emitting layer and a first encapsulation layer. The isolation structure is arranged on the substrate and encloses a plurality of isolation openings to separate the light-emitting layer to form mutually disconnected light-emitting units. The first encapsulation layer includes encapsulation parts that are spaced apart from each other, and at least part of the encapsulation parts are located in the isolation openings to encapsulate the light-emitting units. The encapsulation part includes a first subsection and a second subsection, and the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the first subsection on the substrate. The second subsection is connected to the periphery of the first subsection and extends to the side of the isolation structure away from the substrate. The first subsection includes a central segment and a peripheral segment located on the periphery of the central segment, the thickness of the central segment is greater than or equal to the thickness of the peripheral segment, and the thickness of the central segment is relatively large, covering the light-emitting unit to provide encapsulation and protection for the light-emitting unit.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] Organic Light Emitting Diodes (OLEDs) and flat-panel display devices based on technologies such as Light Emitting Diodes (LEDs) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, and desktop computers due to their advantages of high image quality, power saving, thin body, and wide range of applications, becoming the mainstream display device.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] The embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel, aiming to improve the performance of OLED display products.

[0005] A first aspect of the present application provides a display panel, comprising: a substrate; an isolation structure located on one side of the substrate, the isolation structure enclosing an isolation opening; a light-emitting layer located on one side of the substrate, the light-emitting layer comprising a light-emitting unit located in the isolation opening; a first encapsulation layer located on the side of the light-emitting layer facing away from the substrate, the first encapsulation layer comprising encapsulation portions spaced apart from each other and used to encapsulate each light-emitting unit, the encapsulation portion comprising a first section located in the isolation opening and a second section connected to a peripheral side of the first section and located on a side of the isolation structure facing away from the substrate, the orthographic projection of the light-emitting unit on the substrate being within the orthographic projection of the first section on the substrate, wherein the first section comprises a central segment and a peripheral segment connected to each other, the peripheral segment being located on a peripheral side of the central segment, and the thickness of the peripheral segment being less than or equal to the thickness of the central segment.

[0006] According to the implementation of the first aspect of the present application, the thickness of the packaging portion is 0.8 μm to 2 μm.

[0007] According to any of the aforementioned embodiments of the first aspect of the present application, the thickness of the central segment is D1, and D1 satisfies 0.8 μm≤D1≤2 μm.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the thickness of the second section is smaller than the thickness of the central section.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the peripheral segment includes a first sub-segment and a second sub-segment connected to each other, the first sub-segment is connected between the central segment and the second sub-segment, and the thickness of the first sub-segment tends to decrease in the direction from the central segment to the second sub-segment.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the second sub-segment is arranged in contact with the side wall of the isolation structure.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the peripheral segment further includes a third subsegment, which is connected between the second subsegment and the second section, and the thickness of the third subsegment tends to increase in the direction of the isolation structure pointing to the isolation opening.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the third subsection is arranged in contact with the isolation structure.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the thickness of the first sub-segment is D2, and D2 satisfies 0.1*D1≤D2≤0.95*D1.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the thickness of the second sub-segment is D3, and D3 satisfies 0.15*D1≤D3≤0.35*D1.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, the thickness of the third subsegment is D4, and D4 satisfies 0.1*D1≤D4≤0.3*D1.

[0016] According to any of the aforementioned embodiments of the first aspect of the present application, the first sub-segment includes a main body segment and a transition segment, the transition segment is connected between the main body segment and the second sub-segment, and the thickness of the second sub-segment is greater than the thickness of the transition segment.

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, the thickness of the main body segment is D5, and D5 satisfies 0.25*D1≤D5≤0.95*D1.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the thickness of the transition section is D6, and D6 satisfies 0.1*D1≤D6≤0.3*D1.

[0019] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first layer and a second layer, and the second layer is located on a side of the first layer facing away from the substrate.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the first layer on the substrate is located within the orthographic projection of the second layer on the substrate.

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, the second sub-segment covers a side of the first layer facing the isolation opening.

[0022] According to any of the aforementioned embodiments of the first aspect of the present application, the third sub-segment covers the side of the second layer facing the substrate.

[0023] According to any of the aforementioned embodiments of the first aspect of the present application, the second layer includes a conductive material or an insulating material.

[0024] According to any of the aforementioned embodiments of the first aspect of the present application, the second layer includes a metal material, and the materials of the first layer and the second layer are different.

[0025] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure further includes a third layer located on the side of the first layer facing the substrate, and the orthographic projection of the first layer on the substrate is located within the orthographic projection of the third layer on the substrate.

[0026] According to any of the aforementioned embodiments of the first aspect of the present application, the second section includes an inclined portion and an extension portion, the inclined portion is connected between the first section and the extension portion, and the orthographic projection of the extension portion on the substrate is located within the orthographic projection of the isolation structure on the substrate.

[0027] According to any of the aforementioned embodiments of the first aspect of the present application, a gap is formed between the extension portion and the isolation structure.

[0028] According to any of the aforementioned embodiments of the first aspect of the present application, the thickness of the inclined portion is D7, and D7 satisfies 0.45*D1≤D7≤0.65*D1.

[0029] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the first encapsulation layer includes an inorganic material.

[0030] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes: a second encapsulation layer located on a side of the first encapsulation layer facing away from the substrate.

[0031] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the second encapsulation layer includes an inorganic material.

[0032] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure is provided with a light-transmitting opening, and the light-transmitting opening is spaced apart from the isolation opening.

[0033] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes: a first electrode layer located between the light-emitting layer and the first encapsulation layer, the first electrode layer including a first electrode located in the isolation opening, and the first electrode is electrically connected to the isolation structure.

[0034] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of each light-emitting unit on the substrate is located within the orthographic projection of each first electrode on the substrate.

[0035] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting unit and the isolation structure are spaced apart.

[0036] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes: a pixel definition layer located on the substrate, the pixel definition layer including a pixel defining portion and a pixel opening formed by the pixel defining portion, the orthographic projection of the pixel opening on the substrate and the orthographic projection of the isolation opening on the substrate at least partially overlap.

[0037] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the central segment on the substrate.

[0038] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes a second electrode, which is located between the substrate and the pixel definition layer, and the orthographic projection of the second electrode on the substrate at least partially overlaps with the orthographic projection of the pixel opening on the substrate.

[0039] According to a second aspect of the present application, there is provided a display panel, comprising: a substrate; an isolation structure located on one side of the substrate, the isolation structure enclosing an isolation opening; a light-emitting layer located on one side of the substrate, the light-emitting layer comprising a light-emitting unit located in the isolation opening; a first encapsulation layer located on the side of the light-emitting layer facing away from the substrate, the first encapsulation layer comprising encapsulation portions spaced apart from each other and used to encapsulate each light-emitting unit, the encapsulation portion comprising a first section located in the isolation opening and a second section connected to a peripheral side of the first section and located on the side of the isolation structure facing away from the substrate, wherein the second section comprises an inclined portion and an extension portion, the inclined portion being connected between the first section and the extension portion, and the orthographic projection of the extension portion on the substrate being within the orthographic projection of the isolation structure on the substrate.

[0040] According to an embodiment of the second aspect of the present application, the material of the first encapsulation layer includes an inorganic material.

[0041] According to any of the aforementioned implementations of the second aspect of the present application, the display panel further includes: a second encapsulation layer located on a side of the first encapsulation layer facing away from the substrate.

[0042] According to any of the aforementioned embodiments of the second aspect of the present application, the material of the second encapsulation layer includes an inorganic material.

[0043] An embodiment of a third aspect of the present application provides a display device, which includes a display panel according to any of the above embodiments.

[0044] An embodiment of a fourth aspect of the present application provides a method for manufacturing a display panel, the method comprising:

[0045] preparing an isolation structure on a substrate, wherein the isolation structure encloses an isolation opening, and the isolation opening includes an isolation opening;

[0046] Prepare a light-emitting layer on the substrate, the light-emitting layer including light-emitting units located in the isolation openings;

[0047] A first encapsulation layer is prepared on the side of the light-emitting layer facing away from the substrate. The first encapsulation layer includes encapsulation portions that are spaced apart from each other and used to encapsulate each light-emitting unit. The encapsulation portion includes a first section located at the isolation opening and a second section connected to the peripheral side of the first section and located on the side of the isolation structure facing away from the substrate. The first section includes a central segment and a peripheral segment that are connected to each other. The peripheral segment is located on the peripheral side of the central segment. The orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the central segment on the substrate. The thickness of the peripheral segment is less than or equal to the thickness of the central segment.

[0048] An embodiment of a fifth aspect of the present application provides a method for manufacturing a display panel, the method comprising:

[0049] preparing an isolation structure on a substrate, wherein the isolation structure encloses an isolation opening, and the isolation opening includes an isolation opening;

[0050] Prepare a light-emitting layer on the substrate, the light-emitting layer including light-emitting units located in the isolation openings;

[0051] A first encapsulation layer is prepared on the side of the light-emitting layer facing away from the substrate, the first encapsulation layer includes encapsulation parts that are arranged at intervals and used to encapsulate each light-emitting unit, the encapsulation part includes a first section located at the isolation opening and a second section connected to the peripheral side of the first section and located on the side of the isolation structure facing away from the substrate, wherein the first section includes a third sub-segment connected to the second section, the third sub-segment is at least partially in contact with the isolation structure, and the thickness of the third sub-segment is less than the thickness of the second section.

[0052] According to an embodiment of the present application, a display panel includes a substrate, an isolation structure, a light-emitting layer, and a first encapsulation layer. The isolation structure is disposed on the substrate and encloses a plurality of isolation openings to partition the light-emitting layer into mutually disconnected light-emitting units. This reduces carrier crosstalk within the light-emitting layer, improving the display quality of the display panel. Furthermore, the light-emitting units do not require the use of precision masks, reducing the development and use of precision masks and lowering manufacturing costs. The first encapsulation layer includes spaced-apart encapsulation portions, at least a portion of which is located within the isolation openings to encapsulate the light-emitting units. The encapsulation portion includes a first subsection and a second subsection. The orthographic projection of the light-emitting units on the substrate is located within the orthographic projection of the first subsection on the substrate. In other words, the first subsection covers the light-emitting units to provide encapsulation and protection for the light-emitting units, making it difficult for moisture to penetrate the light-emitting units through the first encapsulation layer, thereby increasing the service life of the light-emitting units. The second subsection is connected to the periphery of the first subsection and extends to the side of the isolation structure facing away from the substrate. This increases the encapsulation area of ​​the encapsulation portion, prolongs the path for water and oxygen intrusion, further reduces the risk of water and oxygen intrusion, and ensures the reliability of the light-emitting units. The first section includes a central segment and peripheral segments located around the central segment. The central segment has a thickness greater than or equal to that of the peripheral segments. The central segment is thicker and covers the light-emitting unit to provide encapsulation and protection for the light-emitting unit. During the preparation of the encapsulation portion, due to the step in the isolation structure, the encapsulation portion climbs the sidewall of the isolation structure, causing the encapsulation portion to stretch, thereby forming a thinner thinning portion. The thinning portion becomes thinner due to stretching, has higher flexibility, and better adheres to the isolation structure and the edge of the light-emitting unit, thereby further improving the encapsulation effect of the encapsulation portion on the light-emitting unit and enhancing the performance of the OLED display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0054] Figure 1 is a partial cross-sectional view of a display panel provided in an embodiment of the present application;

[0055] Figure 2 is a partial cross-sectional view of a display panel in another embodiment;

[0056] Figure 3 is a partial cross-sectional view of a display panel in yet another embodiment;

[0057] Figure 4 yes Figure 3 A partial enlarged view of

[0058] Figure 5 is a partial cross-sectional view of a display panel in yet another embodiment;

[0059] Figure 6 yes Figure 5 A partial enlarged view of

[0060] Figure 7 is a partial cross-sectional view of a display panel in yet another embodiment;

[0061] Figure 8 yes Figure 7 A partial enlarged view of

[0062] Figure 9 is a partial cross-sectional view of a display panel in yet another embodiment;

[0063] Figure 10 is a partial cross-sectional view of a display panel in yet another embodiment;

[0064] Figure 11 yes Figure 10 A partial enlarged view of

[0065] Figure 12 is a partial cross-sectional view of a display panel in yet another embodiment;

[0066] Figure 13 is a partial cross-sectional view of a display panel in yet another embodiment;

[0067] Figure 14 This is a schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present application.

[0068] Description of reference numerals:

[0069] 10. Display panel;

[0070] 100. Substrate;

[0071] 200, isolation structure; 210, first layer; 220, second layer; 230, third layer; 240, isolation opening; 250, light-transmitting opening;

[0072] 300, light-emitting layer; 310, light-emitting unit;

[0073] 400, first encapsulation layer; 401, encapsulation portion; 410, first subsection; 411, central section; 412, peripheral section; 413, first subsection; 414, main section; 415, transition section; 416, second subsection; 417, third subsection; 420, second subsection; 421, inclined portion; 422, extension portion;

[0074] 430, second encapsulation layer;

[0075] 500, first electrode layer; 510, first electrode;

[0076] 600 , pixel definition layer; 610 , pixel defining portion; 620 , pixel opening; 630 , second electrode. DETAILED DESCRIPTION

[0077] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0078] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0079] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or region, it may mean that it is directly on the other layer or region, or that other layers or regions are included between it and the other layer or region. Furthermore, if the component is turned over, the layer or region will be "below" or "beneath" the other layer or region.

[0080] Embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel. Hereinafter, various embodiments of the display panel, the display device, and the method for manufacturing a display panel will be described with reference to the accompanying drawings.

[0081] An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel.

[0082] See also Figure 1 , Figure 1 This is a partial cross-sectional view of a display panel provided in an embodiment of the present application.

[0083] like Figure 1 As shown, the first embodiment of the present application provides a display panel 10, which includes a substrate 100, an isolation structure 200, a light-emitting layer 300 and a first package; the isolation structure 200 is located on one side of the substrate 100, and the isolation structure 200 encloses an isolation opening 240; the light-emitting layer 300 is located on one side of the substrate 100, and the light-emitting layer 300 includes a light-emitting unit 310 located in the isolation opening 240; the first package layer 400 is located on the side of the light-emitting layer 300 away from the substrate 100, and the first package layer 400 includes mutually spaced and used to package each light-emitting unit 310. The packaging portion 401 of the unit 310 includes a first section 410 located at the isolation opening 240 and a second section 420 connected to the periphery of the first section 410 and located on the side of the isolation structure 200 away from the substrate 100. The orthographic projection of the light-emitting unit 310 on the substrate 100 is located within the orthographic projection of the first section 410 on the substrate 100. The first section 410 includes a central segment 411 and a peripheral segment 412 that are interconnected. The peripheral segment 412 is located at the periphery of the central segment 411, and the thickness of the peripheral segment 412 is less than or equal to the thickness of the central segment 411.

[0084] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 200, a light-emitting layer 300, and a first encapsulation layer 400. The isolation structure 200 is provided on the substrate 100 and encloses a plurality of isolation openings 240 to separate the light-emitting layer 300 to form mutually disconnected light-emitting units 310, thereby reducing the crosstalk of carriers within the light-emitting layer 300 and improving the display effect of the display panel 10. In addition, the light-emitting units 310 do not need to be prepared using a precision mask, which can reduce the development and use of precision masks and reduce the preparation cost. The first encapsulation layer 400 includes mutually spaced encapsulation portions 401, at least part of which is located within the isolation openings 240 to encapsulate the light-emitting units 310. The encapsulation portion 401 includes a first subsection 410 and a second subsection 420. The orthographic projection of the light-emitting unit 310 on the substrate 100 is located within the orthographic projection of the first subsection 410 on the substrate 100. That is, the first subsection 410 covers the light-emitting unit 310, providing encapsulation and protection for the light-emitting unit 310. This prevents moisture from entering the light-emitting unit 310 through the first encapsulation layer 400, thereby increasing the service life of the light-emitting unit 310. The second subsection 420 connects to the periphery of the first subsection 410 and extends to the side of the isolation structure 200 facing away from the substrate 100. This increases the encapsulation area of ​​the encapsulation portion 401, prolongs the path for moisture and oxygen intrusion, further reduces the risk of moisture and oxygen intrusion, and ensures the reliability of the light-emitting unit 310. The first subsection 410 includes a central segment 411 and a peripheral segment 412 located around the central segment 411. The thickness of the central segment 411 is greater than or equal to that of the peripheral segment 412. The central segment 411 is thicker and covers the light-emitting unit 310, providing both encapsulation and protection for the light-emitting unit 310. When preparing the packaging part 401, since the isolation structure 200 has a step, the packaging part 401 climbs the side wall of the isolation structure 200, causing the packaging part 401 to stretch, thereby forming a thinning part with a thinner thickness. The thinning part is stretched and thinned, has higher flexibility, and fits better with the isolation structure 200 and the edge of the light-emitting unit 310, so as to further improve the packaging effect of the packaging part 401 on the light-emitting unit 310.

[0085] The specific design of the isolation structure 200 can refer to existing patents, such as application numbers 202310771124.9, 202310740412.8, 202310855866.X, 202311017132.0, 202311124847.6, and 202311091555.7, which record relevant contents of the isolation structure 200.

[0086] Optionally, the thickness of the central segment 411 is not absolutely uniform. When measuring the thickness of each position of the central segment 411, if the measuring instrument has high accuracy, the thickness may be reduced at some positions. For example, the thickness of the central segment 411 may decrease in the direction closer to the isolation structure 200.

[0087] Optionally, the difference between the maximum thickness and the minimum thickness of the central segment 411 is smaller than the difference between the maximum thickness and the minimum thickness of the peripheral segment 412 , and the thickness variation of the central segment 411 is small, and the thickness at each position can be approximately equal.

[0088] In some optional embodiments, the thickness of the packaging portion 401 is 0.8 μm to 2 μm.

[0089] In these optional embodiments, the thickness of the packaging portion 401 is greater than or equal to 0.8 μm, thereby avoiding the problem of poor packaging performance of the packaging portion 401 due to the packaging portion 401 being too thin, which makes it easier for water and oxygen to penetrate the packaging portion 401 and invade the light-emitting unit 310. It can also avoid the problem of poor structural strength of the packaging portion 401 due to the packaging portion 401 being too thin, which can easily cause film damage or film shedding after being impacted. The thickness of the packaging portion 401 is less than or equal to 2 μm, which can avoid the problem of excessive material consumption of the packaging portion 401 due to the packaging portion 401 being too thick, resulting in high material costs, and an increase in the overall film thickness of the display panel 10.

[0090] See also Figure 2 , Figure 2 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0091] like Figure 2 As shown, in some optional embodiments, the thickness of the central segment 411 is D1, and D1 satisfies 0.8 μm≤D1≤2 μm.

[0092] In these optional embodiments, the thickness D1 of the central segment 411 is greater than or equal to 0.8 μm. This avoids the problem of poor packaging performance of the central segment 411 due to a too small thickness of the central segment 411, which makes it easier for water and oxygen to penetrate the central segment 411 and invade the light-emitting unit 310. It also avoids the problem of poor structural strength of the central segment 411 due to a too small thickness of the central segment 411, which can easily cause damage to the film layer or film layer to fall off after being impacted. The thickness D1 of the central segment 411 is less than or equal to 2 μm. This avoids the problem of excessive material consumption for the central segment 411 due to an excessive thickness of the central segment 411, which can increase material costs and increase the overall film thickness of the display panel 10.

[0093] In some optional embodiments, the thickness of the second section 420 is smaller than the thickness of the central section 411 .

[0094] In these optional embodiments, since the central segment 411 covers at least a portion of the light-emitting unit 310, the central segment 411 is relatively thick. This can, on the one hand, improve the packaging performance of the central segment 411 and enhance the reliability of the light-emitting unit 310. On the other hand, it also provides good structural strength, improves the impact resistance of the central segment 411, and achieves better protection for the light-emitting unit 310. The second subsection 420 is relatively thin and has greater flexibility. The second subsection 420 better adheres to the isolation structure 200 and the edges of the light-emitting unit 310, further enhancing the packaging effect of the packaging portion 401 on the light-emitting unit 310.

[0095] Please also refer to Figure 3 and Figure 4 , Figure 3 is a partial cross-sectional view of a display panel in yet another embodiment; Figure 4 yes Figure 3 A partial enlarged view of .

[0096] like Figure 3 and Figure 4 As shown, in some optional embodiments, the peripheral segment 412 includes a first sub-segment 413 and a second sub-segment 416 connected to each other, the first sub-segment 413 is connected between the central segment 411 and the second sub-segment 416, and the thickness of the first sub-segment 413 tends to decrease in the direction from the central segment 411 to the second sub-segment 416.

[0097] In these optional embodiments, the thickness of the first sub-segment 413 gradually decreases in the direction from the center segment 411 to the second sub-segment 416, so that the thickness of the packaging part 401 close to the isolation structure 200 is thinned, thereby having higher flexibility and better fitting with the isolation structure 200 and the edge of the light-emitting unit 310, so as to further improve the packaging effect of the packaging part 401 on the light-emitting unit 310.

[0098] In some optional embodiments, the second sub-segment 416 is disposed in contact with a sidewall of the isolation structure 200 .

[0099] In these optional embodiments, the second sub-segment 416 covers the side wall of the isolation structure 200 to achieve the encapsulation of the isolation structure 200, and the second sub-segment 416 climbs onto the isolation structure 200 to further increase the intrusion path of water and oxygen, thereby improving the encapsulation performance of the encapsulation part 401.

[0100] like Figure 2 and Figure 3 As shown, in some optional embodiments, the thickness of the first sub-segment 413 is D2, and D2 satisfies 0.1*D1≤D2≤0.95*D1.

[0101] In these optional embodiments, the thickness D2 of the first sub-segment 413 is greater than or equal to 0.1 times the thickness D1 of the central segment 411. This avoids the problem of poor packaging performance of the first sub-segment 413 due to a too small thickness of the first sub-segment 413, which allows water and oxygen to more easily penetrate the first sub-segment 413 and invade the light-emitting unit 310. It also avoids the problem of poor structural strength of the first sub-segment 413 due to a too small thickness of the first sub-segment 413, which may easily cause film damage or film shedding after stretching and thinning. The thickness D2 of the first sub-segment 413 is less than or equal to 0.95 times the thickness D1 of the central segment 411. This avoids the problem of poor flexibility of the first sub-segment 413 due to an excessive thickness of the first sub-segment 413, which may lead to poor adhesion between the first sub-segment 413 and the isolation structure 200 at the climbing position of the isolation structure 200, and may easily form air holes or other defects.

[0102] like Figure 2 and Figure 3 As shown, in some optional embodiments, the thickness of the second sub-segment 416 is D3, and D3 satisfies 0.15*D1≤D3≤0.35*D1.

[0103] In these optional embodiments, the thickness D3 of the second sub-segment 416 is greater than or equal to 0.15 times the thickness D1 of the central segment 411. This avoids the problem of poor packaging performance of the second sub-segment 416 due to a too small thickness of the second sub-segment 416, which allows water and oxygen to more easily penetrate the second sub-segment 416 and invade the light-emitting unit 310. This also avoids the problem of poor structural strength of the second sub-segment 416 due to a too small thickness of the second sub-segment 416, which can easily cause damage or peeling of the film layer of the second sub-segment 416 after the second sub-segment 416 is stretched and thinned by the slope of the isolation structure 200. The thickness D3 of the second sub-segment 416 is less than or equal to 0.35 times the thickness D1 of the central segment 411. This avoids the problem of poor flexibility of the second sub-segment 416 due to an excessive thickness of the second sub-segment 416, which can lead to poor adhesion between the second sub-segment 416 and the isolation structure 200 at the sloped position of the isolation structure 200, and can easily form air holes or other defects.

[0104] Please also refer to Figure 5 and Figure 6 , Figure 5 is a partial cross-sectional view of a display panel in yet another embodiment; Figure 6 yes Figure 5 A partial enlarged view of .

[0105] like Figure 5 and Figure 6 As shown, in some optional embodiments, the peripheral segment 412 further includes a third sub-segment 417, which is connected between the second sub-segment 416 and the second section 420, and the thickness of the third sub-segment 417 tends to increase in the direction from the isolation structure 200 to the isolation opening 240.

[0106] Optionally, the third sub-segment 417 is disposed in contact with the isolation structure 200 .

[0107] In these optional embodiments, the third sub-segment 417 is used to connect the second sub-segment 416 and the second sub-section 420. The third sub-segment 417 covers the isolation structure 200 and is arranged in contact with the isolation structure 200 to achieve the encapsulation of the isolation structure 200, further increase the invasion path of water and oxygen, and improve the encapsulation performance of the encapsulation part 401. After the third sub-segment 417 is attached to the isolation structure 200, an adhesion force is formed between the third sub-segment 417 and the isolation structure 200, so that the third sub-segment 417 further extends to the side of the isolation structure 200 away from the substrate 100 to form the second sub-section 420. Under the action of the above-mentioned adhesion force, the second sub-section 420 is difficult to collapse the third equal-thickness part, thereby ensuring the overall encapsulation performance of the encapsulation part 401. In the direction from the isolation structure 200 to the isolation opening 240, the thickness of the third sub-segment 417 tends to increase to achieve a transition to the second sub-section 420 with a larger thickness.

[0108] like Figure 5 As shown, in some optional embodiments, the thickness of the third sub-segment 417 is D4, and D4 satisfies 0.1*D1≤D4≤0.3*D1.

[0109] In these optional embodiments, the thickness D4 of the third sub-segment 417 is greater than or equal to 0.1 times the thickness D1 of the central segment 411. This avoids the problem of poor packaging performance of the third sub-segment 417 due to a too small thickness of the third sub-segment 417, which makes it easier for water and oxygen to penetrate the third sub-segment 417 and enter the light-emitting unit 310. This also avoids the problem of poor structural strength of the third sub-segment 417 due to a too small thickness of the third sub-segment 417, which can easily cause damage or film shedding of the third sub-segment 417 after being impacted. The thickness D4 of the third sub-segment 417 is less than or equal to 0.3 times the thickness D1 of the central segment 411. This avoids the problem of excessive thickness of the third sub-segment 417, which can cause the third sub-segment 417 to be too heavy, resulting in insufficient adhesion between the third sub-segment 417 and the isolation structure 200, which can easily cause the film shedding of the third sub-segment 417.

[0110] In some optional embodiments, the second subsegment 416 and the third subsegment 417 contact the sidewalls of the isolation structure 200, and the height ratio of the second subsegment 416 to the third subsegment 417 in a direction perpendicular to the substrate 100 is 1:3-9:1. This is to avoid the problem of the third subsegment 417 being too thick, resulting in a large weight of the third subsegment 417, which would make it difficult for the adhesion force between the third subsegment 417 and the isolation structure 200 to adhere to the third subsegment 417, and thus easily causing the film layer of the third subsegment 417 to fall off.

[0111] Please also refer to Figure 7 and Figure 8 , Figure 7 is a partial cross-sectional view of a display panel in yet another embodiment; Figure 8 yes Figure 7 A partial enlarged view of .

[0112] like Figure 7 and Figure 8 As shown, in some optional embodiments, the first sub-segment 413 includes a main body segment 414 and a transition segment 415 , the transition segment 415 is connected between the main body segment 414 and the second sub-segment 416 , and the thickness of the second sub-segment 416 is greater than the thickness of the transition segment 415 .

[0113] In these optional embodiments, the transition section 415 realizes the thickness transition between the thicker main section 414 and the thinner second sub-segment 416. The thickness of the transition section 415 is less than the thickness of the second sub-segment 416, so that the position adjacent to the transition section 415 and the second sub-segment 416 has better flexibility, so that the second sub-segment 416 can climb onto the isolation structure 200 and have a better bonding effect with the isolation structure 200, thereby improving the packaging performance of the packaging part 401.

[0114] like Figure 2 and Figure 7 As shown, in some optional embodiments, the thickness of the main body segment 414 is D5, and D5 satisfies 0.25*D1≤D5≤0.95*D1.

[0115] In these optional embodiments, the thickness D5 of the main segment 414 is greater than or equal to 0.25 times the thickness D1 of the central segment 411. This avoids the problem of poor packaging performance of the main segment 414 due to a too small thickness of the main segment 414, which makes it easier for water and oxygen to penetrate the main segment 414 and invade the light-emitting unit 310. It also avoids the problem of poor structural strength of the main segment 414 due to a too small thickness of the main segment 414, which makes it easy for the main segment 414 to be damaged or detached after being impacted. The thickness D5 of the main segment 414 is less than or equal to 0.95 times the thickness D1 of the central segment 411. This avoids the problem of excessive material consumption for the main segment 414 due to an excessive thickness of the main segment 414, which increases material costs and increases the overall film thickness of the display panel 10.

[0116] like Figure 2 and Figure 7 As shown, in some optional embodiments, the thickness of the transition section 415 is D6, and D6 satisfies 0.1*D1≤D6≤0.3*D1.

[0117] In these optional embodiments, the thickness D6 of the transition section 415 is greater than or equal to 0.1 times the thickness D1 of the central section 411. This avoids the problem of poor packaging performance of the transition section 415 due to the thickness of the transition section 415 being too small, which makes it easier for water and oxygen to penetrate the transition section 415 and invade the light-emitting unit 310. It also avoids the problem of poor structural strength of the transition section 415 due to the thickness of the transition section 415 being too small, which makes it easy for the transition section 415 to be damaged or peeled off after being stretched and thinned. The thickness D6 of the transition section 415 is less than or equal to 0.3 times the thickness D1 of the central section 411. This avoids the problem of poor flexibility at the position adjacent to the second sub-segment 416 due to the thickness of the transition section 415 being too large, which makes it difficult for the second sub-segment 416 to climb onto the isolation structure 200, and the poor bonding effect between the second sub-segment 416 and the isolation structure 200.

[0118] like Figure 1 As shown, in some optional embodiments, the isolation structure 200 includes a first layer 210 and a second layer 220 , and the second layer 220 is located on a side of the first layer 210 facing away from the substrate 100 .

[0119] Optionally, the orthographic projection of the first layer 210 on the substrate 100 is located within the orthographic projection of the second layer 220 on the substrate 100 .

[0120] In these optional embodiments, the first layer 210 and the second layer 220 are arranged to form the isolation structure 200. The orthographic projection of the first layer 210, which is arranged near the substrate 100, is located within the orthographic projection of the second layer 220 on the substrate 100. The area of ​​the second layer 220 is larger than that of the first layer 210. The second layer 220 covers the surface of the first layer 210 near the second layer 220. In this case, the first layer 210 is recessed relative to the second layer 220 in a direction away from the isolation opening 240. When preparing the light-emitting layer 300, a large drop in height is generated at the edge of the isolation structure 200, and the first layer 210 is recessed relative to the second layer 220. This makes it difficult for the light-emitting layer 300 to connect at the edge of the isolation structure 200, resulting in breakage. The breakage of the light-emitting layer 300 forms disconnected light-emitting units 310.

[0121] Optionally, the second sub-segment 416 covers the side of the first layer 210 facing the isolation opening 240 , so that the second sub-segment 416 encapsulates the side wall of the first layer 210 facing the isolation opening 240 , further improving the water and oxygen extension path and improving the packaging performance of the packaging part 401 .

[0122] Optionally, the second subsegment 416 may not have an absolutely uniform thickness. When measuring the thickness of each location of the second subsegment 416, if the measuring instrument has high precision, the thickness may be reduced at some locations. For example, the thickness of the second subsegment 416 may decrease in the direction closer to the isolation structure 200 and in the direction closer to the substrate 100.

[0123] Optionally, the difference between the maximum thickness and the minimum thickness of the second sub-segment 416 is smaller than the difference between the maximum thickness and the minimum thickness of the peripheral segment 412 , and the thickness variation of the second sub-segment 416 is small, and the thickness at each position can be approximately equal.

[0124] Optionally, the third sub-segment 417 covers the side of the second layer 220 facing the substrate 100, so that the third sub-segment 417 encapsulates the surface of the second layer 220 facing the substrate 100, further improving the water and oxygen extension path and improving the encapsulation performance of the encapsulation part 401.

[0125] In some optional embodiments, the second layer 220 includes a conductive material or an insulating material.

[0126] In these optional embodiments, the second layer 220 includes a conductive material, for example, a non-metallic conductive material or a metallic conductive material. When the second layer 220 is a non-metallic conductive material or an insulating material, the second layer 220 is difficult to etch during wet etching of the first layer 210 using an etching solution, thereby making it easier for the first layer 210 to be concave relative to the second layer 220.

[0127] In some optional embodiments, the second layer 220 includes a metal material, and the first layer 210 and the second layer 220 are made of different materials.

[0128] In these optional embodiments, when both the first layer 210 and the second layer 220 are made of metal materials, an etchant can be used to wet-etch the first layer 210. By configuring the etchant, the etching rate of the second layer 220 can be lower than the etching rate of the first layer 210. Since the etching rate of the first layer 210 is higher, even though the second layer 220 will be etched to some extent during wet etching with the etchant, the first layer 210 will be etched faster, thereby causing the first layer 210 to be recessed relative to the second layer 220.

[0129] See also Figure 9 , Figure 9 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0130] like Figure 9As shown, in some optional embodiments, the isolation structure 200 further includes a third layer 230 located on the side of the first layer 210 facing the substrate 100 , and the orthographic projection of the first layer 210 on the substrate 100 is located within the orthographic projection of the third layer 230 on the substrate 100 .

[0131] In these optional embodiments, to obtain the concave first layer 210, the first layer 210 has a faster etching rate than the second layer 220 and the third layer 230 during the etching process, thereby forming a concave first layer 210. Due to the faster etching rate of the first layer 210, the etching waste generated is more likely to enter other locations of the display panel 10, thereby causing adverse effects. After the third layer 230 is provided, the first layer 210 can be well adhered to the third layer 230, and the generated etching waste falls on the third layer 230, making it easier to clean.

[0132] Please also refer to Figure 10 and Figure 11 , Figure 10 is a partial cross-sectional view of a display panel in yet another embodiment; Figure 11 yes Figure 10 A partial enlarged view of .

[0133] like Figure 10 and Figure 11 As shown, in some optional embodiments, the second section 420 includes an inclined portion 421 and an extension portion 422, the inclined portion 421 is connected between the first section 410 and the extension portion 422, and the orthographic projection of the extension portion 422 on the substrate 100 is located within the orthographic projection of the isolation structure 200 on the substrate 100, wherein the first section includes a third sub-segment connected to the second section, the third sub-segment is at least partially in contact with the isolation structure, and the thickness of the third sub-segment is less than the thickness of the second section.

[0134] In these optional embodiments, the orthographic projection of the extension portion 422 on the substrate 100 is located within the orthographic projection of the isolation structure 200 on the substrate 100. That is, the inclined portion 421 is inclined toward the isolation structure 200, thereby placing the extension portion 422 close to the isolation structure 200. This improves the structural stability of the extension portion 422 and the inclined portion 421. When the second subsection 420 is impacted, the extension portion 422 is less likely to warp or break. Furthermore, the provision of the inclined portion 421 and the extension portion 422 can increase the packaging area of ​​the packaging portion 401, improve the protection of the light-emitting unit 310, and further reduce the path for water and oxygen intrusion, thereby improving the reliability of the light-emitting unit 310.

[0135] Optionally, the extension portion 422 is separated from the isolation structure 200 to form a gap. During the manufacturing process of the display panel 10, a light-emitting material layer is prepared. The light-emitting material layer is separated by the isolation structure 200 to form the light-emitting unit 310 located in the isolation opening 240 and the redundant light-emitting material located on the side of the isolation structure 200 facing away from the substrate 100. Then, the encapsulation portion 401 is prepared. The encapsulation portion 401 covers the light-emitting unit 310 and the redundant light-emitting material. The redundant light-emitting material is subsequently etched and removed, thereby forming a gap between the encapsulation portion 401 and the isolation structure 200, that is, a gap between the extension portion 422 and the isolation structure 200.

[0136] like Figure 10 and Figure 11 As shown, in some optional embodiments, the thickness of the inclined portion 421 is D7, and D7 satisfies 0.45*D1≤D7≤0.65*D1.

[0137] In these optional embodiments, the thickness D7 of the inclined portion 421 is greater than or equal to 0.45 times the thickness D1 of the central segment 411. This avoids the problem of poor packaging performance of the inclined portion 421 due to the thickness of the inclined portion 421 being too small, which makes it easier for water and oxygen to penetrate the inclined portion 421 and invade the light-emitting unit 310. It also avoids the problem of poor structural strength of the inclined portion 421 due to the thickness of the inclined portion 421 being too small, which makes it easy for the second section 420 to be damaged or detached after being impacted. The thickness D7 of the inclined portion 421 is less than or equal to 0.65 times the thickness D1 of the central segment 411. This avoids the problem of excessive thickness of the inclined portion 421 resulting in a large weight of the inclined portion 421, which makes it difficult for the adhesive force between the inclined portion 421 and the isolation structure 200 to adhere the inclined portion 421 to the isolation structure 200, making it easy for the inclined portion 421 to detach.

[0138] Optionally, the material of the first encapsulation layer 400 includes an inorganic material. Inorganic materials have good density and good barrier properties against water vapor and oxygen. Optionally, the display panel 10 only uses the first encapsulation layer 400 of inorganic material to encapsulate the light-emitting unit 310, without the need for coating with organic materials. This reduces the packaging cost of the display panel 10 and can also improve the problem of poor encapsulation caused by the organic material coating when encapsulating.

[0139] See also Figure 12 , Figure 12 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0140] like Figure 12 As shown, in some optional embodiments, the display panel 10 further includes: a second encapsulation layer 430 located on a side of the first encapsulation layer 400 facing away from the substrate 100 .

[0141] Optionally, the material of the second encapsulation layer 430 includes an inorganic material.

[0142] In these optional embodiments, the light-emitting unit 310 is encapsulated using a first encapsulation layer 400 and a second encapsulation layer 430 of an inorganic material, further improving encapsulation performance. This eliminates the need for coating with organic materials, reduces the packaging cost of the display panel 10, and improves the problem of poor encapsulation caused by the organic material coating that can occur when encapsulating with organic materials.

[0143] See also Figure 13 , Figure 13 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0144] like Figure 13 As shown, in some optional embodiments, the isolation structure 200 is provided with a light-transmitting opening 250 , and the light-transmitting opening 250 is spaced apart from the isolation opening 240 .

[0145] In these optional embodiments, a light-transmitting opening 250 is opened on the isolation structure 200, so that more light can pass through the light-transmitting opening 250 to reach the photosensitive component on the substrate 100 side, that is, the transmittance of the display panel 10 can be improved, thereby improving the photosensitivity of the display panel 10.

[0146] like Figure 1 As shown, in some optional embodiments, the display panel 10 also includes a first electrode layer 500, which is located between the light-emitting layer 300 and the first encapsulation layer 400, and the first electrode layer 500 includes a first electrode 510 located in the isolation opening 240, and the first electrode 510 is electrically connected to the isolation structure 200.

[0147] In these optional embodiments, the isolation structure 200 separates the first electrode layer 500 to form mutually spaced first electrodes 510 , and the mutually spaced first electrodes 510 are electrically connected through the isolation structure 200 to form a full-surface electrode, ensuring normal light emission of the light-emitting unit 310 .

[0148] In some optional embodiments, the orthographic projection of each light-emitting unit 310 on the substrate 100 is located within the orthographic projection of each first electrode 510 on the substrate 100 .

[0149] In these optional embodiments, the orthographic projection of the light-emitting unit 310 on the substrate 100 is located within the orthographic projection of the first electrode 510 on the substrate 100, that is, the first electrode 510 is arranged to cover the light-emitting unit 310 to serve as the electrode of the light-emitting unit 310, thereby ensuring the normal light emission of the light-emitting unit 310 and improving the display effect of the display panel 10.

[0150] Optionally, the light emitting unit 310 is spaced apart from the isolation structure 200. The light emitting layer 300 and the isolation structure 200 are spaced apart, that is, the light emitting units 310 are spaced apart from each other, which reduces the crosstalk of carriers between the light emitting units 310 and improves the cross-color problem of the light emitting units 310.

[0151] like Figure 1 As shown, in some optional embodiments, the display panel 10 further includes a pixel definition layer 600, which is located on the substrate 100. The pixel definition layer 600 includes a pixel defining portion 610 and a pixel opening 620 formed by the pixel defining portion 610. The orthographic projection of the pixel opening 620 on the substrate 100 and the orthographic projection of the isolation opening 240 on the substrate 100 at least partially overlap.

[0152] In these optional embodiments, the pixel defining portion 610 of the pixel definition layer 600 encloses the pixel defining portion 610 to arrange the light-emitting unit 310 and ensure normal light emission of the light-emitting unit 310. In addition, the pixel defining portion 610 defines the arrangement area of ​​each light-emitting unit 310, thereby reducing cross-color defects between the light-emitting units 310.

[0153] Optionally, the orthographic projection of the pixel opening 620 on the substrate 100 is located within the orthographic projection of the central segment 411 on the substrate 100 , so as to encapsulate and protect the light-emitting unit 310 in the pixel opening 620 .

[0154] Optionally, the display panel 10 further includes a second electrode 630, which is located between the substrate 100 and the pixel definition layer 600. The orthographic projection of the second electrode 630 on the substrate 100 at least partially overlaps with the orthographic projection of the pixel opening 620 on the substrate 100. The second electrode 630 is exposed by the pixel opening 620. One of the second electrode 630 and the first electrode 510 serves as the anode of the light-emitting unit 310, and the other serves as the cathode of the light-emitting unit 310. In the embodiment of the present application, the second electrode 630 is used as the anode of the light-emitting unit 310, and the first electrode 510 is used as the cathode of the light-emitting unit 310.

[0155] Optionally, the first electrode 510 includes a first segment, an inclined segment and a second segment, the inclined segment is located between the first segment and the second segment, the orthographic projection of the first segment on the substrate 100 is located within the orthographic projection of the pixel opening 620 on the substrate 100, and the orthographic projection of the inclined segment on the substrate 100 is located within the orthographic projection of the center segment 411 on the substrate 100.

[0156] Optionally, the peripheral segment 412 is located between the isolation structure 200 and the central segment 411 .

[0157] Optionally, the light emitting layer 300 includes an electron injection layer (EIL), an electron transport layer (ETL), a light emitting material layer, a hole injection layer (HIL) and a hole transport layer (HTL).

[0158] like Figure 10 As shown, the second aspect of the present application provides a display panel 10, which includes a substrate 100, an isolation structure 200, a light-emitting layer 300 and a first encapsulation layer 400; the isolation structure 200 is located on one side of the substrate 100, and the isolation structure 200 encloses an isolation opening 240; the light-emitting layer 300 is located on one side of the substrate 100, and the light-emitting layer 300 includes a light-emitting unit 310 located in the isolation opening 240; the first encapsulation layer 400 is located on the side of the light-emitting layer 300 away from the substrate 100, and the first encapsulation layer 400 includes mutually An encapsulation portion 401 is provided for encapsulating each light-emitting unit 310, and the encapsulation portion 401 includes a first section 410 located at the isolation opening 240 and a second section 420 connected to the periphery of the first section 410 and located at the side of the isolation structure 200 away from the substrate 100, wherein the second section 420 includes an inclined portion 421 and an extension portion 422, the inclined portion 421 is connected between the first section 410 and the extension portion 422, and the orthographic projection of the extension portion 422 on the substrate 100 is located within the orthographic projection of the isolation structure 200 on the substrate 100.

[0159] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 200, a light-emitting layer 300, and a first encapsulation layer 400. The isolation structure 200 is provided on the substrate 100 and encloses a plurality of isolation openings 240 to separate the light-emitting layer 300 to form mutually disconnected light-emitting units 310, thereby reducing the crosstalk of carriers within the light-emitting layer 300 and improving the display effect of the display panel 10. In addition, the light-emitting units 310 do not need to be prepared using a precision mask, which can reduce the development and use of precision masks and reduce the preparation cost. The first encapsulation layer 400 includes mutually spaced encapsulation portions 401, at least part of which is located within the isolation openings 240 to encapsulate the light-emitting units 310. The encapsulation portion 401 includes a first subsection 410 and a second subsection 420. The orthographic projection of the light-emitting unit 310 on the substrate 100 is located within the orthographic projection of the first subsection 410 on the substrate 100. That is, the first subsection 410 is provided to cover the light-emitting unit 310, thereby encapsulating and protecting the light-emitting unit 310. This prevents moisture from invading the light-emitting unit 310 through the first encapsulation layer 400, thereby improving the service life of the light-emitting unit 310. The orthographic projection of the extension portion 422 on the substrate 100 is located within the orthographic projection of the isolation structure 200 on the substrate 100. That is, the inclined portion 421 is inclined toward the isolation structure 200, thereby placing the extension portion 422 close to the isolation structure 200. This improves the structural stability of the extension portion 422 and the inclined portion 421. When the second subsection 420 is impacted, the extension portion 422 is less likely to warp or break. Furthermore, the provision of the inclined portion 421 and the extending portion 422 can increase the packaging area of ​​the packaging portion 401 , improve the protection effect on the light-emitting unit 310 , and further increase the water and oxygen intrusion path, thereby improving the reliability of the light-emitting unit 310 .

[0160] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 200, a light-emitting layer 300, and a first encapsulation layer 400. The isolation structure 200 is provided on the substrate 100 and encloses a plurality of isolation openings 240 to separate the light-emitting layer 300 to form mutually disconnected light-emitting units 310, thereby reducing the crosstalk of carriers within the light-emitting layer 300 and improving the display effect of the display panel 10. In addition, the light-emitting units 310 do not need to be prepared using a precision mask, which can reduce the development and use of precision masks and reduce the preparation cost. The first encapsulation layer 400 includes mutually spaced encapsulation portions 401, at least part of which is located within the isolation openings 240 to encapsulate the light-emitting units 310. The packaging portion 401 includes a first section 410 and a second section 420. The orthographic projection of the light-emitting unit 310 on the substrate 100 is located within the orthographic projection of the first section 410 on the substrate 100, that is, the first section 410 is arranged to cover the light-emitting unit 310 to encapsulate and protect the light-emitting unit 310, making it difficult for water vapor to invade the light-emitting unit 310 through the first packaging layer 400, thereby improving the service life of the light-emitting unit 310.

[0161] The structural design in this embodiment can be applied to other display panels 10 , and the specific selection can be made based on actual conditions. This application does not impose any specific restrictions on it.

[0162] The fourth aspect of the present application also provides a display device, including the display panel 10 of any of the above-mentioned embodiments. Since the display device provided by the fourth aspect of the present application includes the display panel 10 of any of the above-mentioned embodiments, the display device provided by the fourth aspect of the present application has the beneficial effects of the display panel 10 of any of the above-mentioned embodiments, which will not be further described here.

[0163] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0164] The fifth embodiment of the present application further provides a method for preparing a display panel 10. The display panel 10 may be the display panel 10 provided in any of the above embodiments. Figure 14 , and see Figures 1 to 13 , Figure 14 : This is a schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present application. The manufacturing method includes:

[0165] Step S01: preparing an isolation structure on a substrate, wherein the isolation structure encloses an isolation opening, and the isolation opening includes an isolation opening.

[0166] Step S02: preparing a light-emitting layer on a substrate, wherein the light-emitting layer includes light-emitting units located in the isolation openings.

[0167] Step S03: Prepare a first encapsulation layer on the side of the light-emitting layer facing away from the substrate, the first encapsulation layer includes encapsulation parts that are spaced apart from each other and used to encapsulate each light-emitting unit, the encapsulation part includes a first section located at the isolation opening and a second section connected to the peripheral side of the first section and located on the side of the isolation structure facing away from the substrate, wherein the first section includes a central segment and a peripheral segment that are connected to each other, the peripheral segment is located on the peripheral side of the central segment, the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the central segment on the substrate, and the thickness of the peripheral segment is less than or equal to the thickness of the central segment.

[0168] According to the preparation method of the embodiment of the fifth aspect of the present application, the isolation structure 200 is prepared by step S01. The light-emitting layer 300 is prepared by step S02. The isolation structure 200 is arranged on the substrate 100 and encloses a plurality of isolation openings 240 to separate the light-emitting layer 300 to form mutually disconnected light-emitting units 310, thereby reducing the crosstalk of carriers in the light-emitting layer 300, improving the display effect of the display panel 10, and preparing the light-emitting unit 310 without the need for a precision mask plate, which can reduce the development and use of precision masks and reduce preparation costs. The first encapsulation layer 400 is prepared by step S03. The first encapsulation layer 400 includes encapsulation portions 401 spaced apart from each other, and at least part of the encapsulation portion 401 is located in the isolation opening 240 to encapsulate the light-emitting unit 310. The encapsulation portion 401 includes a first subsection 410 and a second subsection 420. The orthographic projection of the light-emitting unit 310 on the substrate 100 is located within the orthographic projection of the first subsection 410 on the substrate 100. That is, the first subsection 410 covers the light-emitting unit 310, providing encapsulation and protection for the light-emitting unit 310. This prevents moisture from entering the light-emitting unit 310 through the first encapsulation layer 400, thereby increasing the service life of the light-emitting unit 310. The second subsection 420 connects to the periphery of the first subsection 410 and extends to the side of the isolation structure 200 facing away from the substrate 100. This increases the encapsulation area of ​​the encapsulation portion 401, prolongs the path for moisture and oxygen intrusion, further reduces the risk of moisture and oxygen intrusion, and ensures the reliability of the light-emitting unit 310. The first subsection 410 includes a central segment 411 and a peripheral segment 412 located around the central segment 411. The thickness of the central segment 411 is greater than or equal to that of the peripheral segment 412. The central segment 411 is thicker and covers the light-emitting unit 310, providing both encapsulation and protection for the light-emitting unit 310. When preparing the packaging part 401, since the isolation structure 200 has a step, the packaging part 401 climbs the side wall of the isolation structure 200, causing the packaging part 401 to stretch, thereby forming a thinning part with a thinner thickness. The thinning part is stretched and thinned, has higher flexibility, and fits better with the isolation structure 200 and the edge of the light-emitting unit 310, so as to further improve the packaging effect of the packaging part 401 on the light-emitting unit 310.

[0169] While the embodiments described above are not exhaustive, they do not limit the invention to the specific embodiments described. Clearly, numerous modifications and variations are possible based on the above description. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better utilize the present invention and its modifications. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: include: substrate; An isolation structure, located on one side of the substrate, and the isolation structure encloses an isolation opening; A light-emitting layer, located on one side of the substrate, wherein the light-emitting layer includes a light-emitting unit located in the isolation opening; a first encapsulation layer, located on a side of the light-emitting layer away from the substrate, the first encapsulation layer comprising encapsulation parts spaced apart from each other and used to encapsulate each of the light-emitting units, the encapsulation parts comprising a first sub-part located at the isolation opening and a second sub-part connected to a peripheral side of the first sub-part and located on a side of the isolation structure away from the substrate, the orthographic projection of the light-emitting unit on the substrate being located within the orthographic projection of the first sub-part on the substrate, Wherein, the first section comprises a central segment and a peripheral segment connected to each other, the peripheral segment is located on the peripheral side of the central segment, and the thickness of the peripheral segment is less than or equal to the thickness of the central segment; The peripheral segment includes a first subsegment and a second subsegment connected to each other, the first subsegment is connected between the central segment and the second subsegment, and the thickness of the first subsegment tends to decrease in the direction from the central segment to the second subsegment; The second sub-segment is disposed in contact with a side wall of the isolation structure, and the central segment covers at least a portion of the light-emitting unit; The peripheral segment further includes a third subsegment, the third subsegment is connected between the second subsegment and the second sub-portion, and the thickness of the third subsegment tends to increase in the direction from the isolation structure to the isolation opening; The third subsection is disposed in contact with the isolation structure.

2. The display panel according to claim 1, characterized in that: The thickness of the packaging part is 0.8 μm to 2 μm; The thickness of the central segment is D1, and D1 satisfies 0.8 μm≤D1≤2 μm.

3. The display panel according to claim 1, characterized in that: The second section has a thickness less than a thickness of the central section.

4. The display panel according to claim 1, characterized in that: The thickness of the first sub-segment is D2, and D2 satisfies 0.1*D1≤D2≤0.95*D1; The thickness of the second sub-segment is D3, and D3 satisfies 0.15*D1≤D3≤0.35*D1; The thickness of the third sub-segment is D4, and D4 satisfies 0.1*D1≤D4≤0.3*D1.

5. The display panel according to claim 1, characterized in that: The second sub-segment and the third sub-segment are in contact with a side wall of the isolation structure, and along a direction perpendicular to the substrate, a height ratio between the second sub-segment and the third sub-segment is 1:3-9:

1.

6. The display panel according to claim 1, characterized in that: The first sub-segment includes a main body segment and a transition segment, wherein the transition segment is connected between the main body segment and the second sub-segment, and the thickness of the second sub-segment is greater than the thickness of the transition segment.

7. The display panel according to claim 6, characterized in that: The thickness of the main body section is D5, and D5 satisfies 0.25*D1≤D5≤0.95*D1; The thickness of the transition section is D6, and D6 satisfies 0.1*D1≤D6≤0.3*D1.

8. The display panel according to claim 1, characterized in that: The isolation structure comprises a first layer and a second layer, wherein the second layer is located on a side of the first layer away from the substrate; The orthographic projection of the first layer on the substrate is located within the orthographic projection of the second layer on the substrate.

9. The display panel according to claim 8, characterized in that: The second subsection covers a side of the first layer facing the isolation opening; The third subsegment covers a side of the second layer facing the substrate.

10. The display panel according to claim 9, characterized in that: The second layer comprises a conductive material or an insulating material; The second layer comprises a metal material, and the first layer and the second layer are made of different materials; The isolation structure further includes a third layer located on a side of the first layer facing the substrate, and an orthographic projection of the first layer on the substrate is located within an orthographic projection of the third layer on the substrate.

11. The display panel according to claim 1, characterized in that: The second section includes an inclined portion and an extending portion, the inclined portion is connected between the first section and the extending portion, and the orthographic projection of the extending portion on the substrate is located within the orthographic projection of the isolation structure on the substrate.

12. The display panel according to claim 11, characterized in that: The extension portion and the isolation structure are spaced apart to form a gap; The thickness of the inclined portion is D7, and D7 satisfies 0.45*D1≤D7≤0.65*D1.

13. The display panel according to claim 1, characterized in that: The material of the first encapsulation layer includes an inorganic material; The display panel further includes: a second encapsulation layer, located on a side of the first encapsulation layer away from the substrate; The material of the second encapsulation layer includes an inorganic material.

14. The display panel according to claim 1, characterized in that: The isolation structure is provided with a light-transmitting opening, and the light-transmitting opening is spaced apart from the isolation opening.

15. The display panel according to claim 1, characterized in that: The display panel further includes: A first electrode layer, located between the light-emitting layer and the first encapsulation layer, the first electrode layer comprising a first electrode located in the isolation opening, the first electrode being electrically connected to the isolation structure; The orthographic projection of each of the light-emitting units on the substrate is located within the orthographic projection of each of the first electrodes on the substrate; The light emitting unit is spaced apart from the isolation structure.

16. The display panel according to claim 15, characterized in that: The display panel further includes: A pixel definition layer is located on the substrate, the pixel definition layer comprises a pixel definition portion and a pixel opening formed by the pixel definition portion, and the orthographic projection of the pixel opening on the substrate and the orthographic projection of the isolation opening on the substrate at least partially overlap; The orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the central segment on the substrate; The display panel further includes a second electrode, which is located between the substrate and the pixel definition layer, and an orthographic projection of the second electrode on the substrate at least partially overlaps with an orthographic projection of the pixel opening on the substrate.

17. A display panel, characterized in that: include: substrate; An isolation structure, located on one side of the substrate, the isolation structure encloses an isolation opening, the isolation structure comprises a first layer and a second layer, the second layer is located on a side of the first layer away from the substrate; The orthographic projection of the first layer on the substrate is located within the orthographic projection of the second layer on the substrate; A light-emitting layer, located on one side of the substrate, wherein the light-emitting layer includes a light-emitting unit located in the isolation opening; a first encapsulation layer, located on a side of the light-emitting layer away from the substrate, the first encapsulation layer comprising encapsulation parts that are spaced apart from each other and used to encapsulate each of the light-emitting units, the encapsulation parts comprising a first sub-part located at the isolation opening and a second sub-part connected to a peripheral side of the first sub-part and located on a side of the isolation structure away from the substrate, The first subsection includes a central segment and a peripheral segment connected to each other, the peripheral segment is located on the peripheral side of the central segment, the peripheral segment includes a first subsection, a second subsection and a third subsection connected to each other, the first subsection is connected between the central segment and the second subsection, the third subsection is connected between the second subsection and the second subsection, the third subsection is at least partially in contact with the isolation structure, the thickness of the third subsection is less than the thickness of the second subsection, and the second subsection covers the side of the first layer facing the isolation opening; The third subsegment covers a side of the second layer facing the substrate, and the thickness of the third subsegment tends to increase in a direction from the isolation structure to the isolation opening.

18. The display panel according to claim 17, characterized in that: The material of the first encapsulation layer includes an inorganic material; The display panel further includes: a second encapsulation layer, located on a side of the first encapsulation layer away from the substrate; The material of the second encapsulation layer includes an inorganic material.

19. A display device, characterized in that: A display panel comprising any one of claims 1-18.

20. A method for preparing a display panel, characterized in that: The method comprises: Preparing an isolation structure on a substrate, wherein the isolation structure encloses an isolation opening; Prepare a light-emitting layer on the substrate, wherein the light-emitting layer includes a light-emitting unit located in the isolation opening; A first encapsulation layer is prepared on a side of the light-emitting layer away from the substrate, the first encapsulation layer includes encapsulation parts that are arranged at intervals and used to encapsulate each of the light-emitting units, the encapsulation part includes a first sub-part located at the isolation opening and a second sub-part connected to the periphery of the first sub-part and located at a side of the isolation structure away from the substrate, and the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the first sub-part on the substrate. Wherein, the first section comprises a central segment and a peripheral segment connected to each other, the peripheral segment is located on the peripheral side of the central segment, and the thickness of the peripheral segment is less than or equal to the thickness of the central segment; The peripheral segment includes a first subsegment and a second subsegment connected to each other, the first subsegment is connected between the central segment and the second subsegment, and the thickness of the first subsegment tends to decrease in the direction from the central segment to the second subsegment; The second sub-segment is disposed in contact with a side wall of the isolation structure, and the central segment covers at least a portion of the light-emitting unit; The peripheral segment further includes a third subsegment, the third subsegment is connected between the second subsegment and the second sub-portion, and the thickness of the third subsegment tends to increase in the direction from the isolation structure to the isolation opening; The third subsection is disposed in contact with the isolation structure.

21. A method for preparing a display panel, characterized in that: The method comprises: Preparing an isolation structure on a substrate, wherein the isolation structure encloses an isolation opening, wherein the isolation opening includes an isolation opening, and the isolation structure includes a first layer and a second layer, wherein the second layer is located on a side of the first layer away from the substrate; The orthographic projection of the first layer on the substrate is located within the orthographic projection of the second layer on the substrate; Prepare a light-emitting layer on the substrate, wherein the light-emitting layer includes a light-emitting unit located in the isolation opening; A first encapsulation layer is prepared on a side of the light-emitting layer away from the substrate, the first encapsulation layer includes encapsulation parts that are spaced apart from each other and used to encapsulate each of the light-emitting units, the encapsulation part includes a first sub-section located at the isolation opening and a second sub-section connected to the periphery of the first sub-section and located at a side of the isolation structure away from the substrate, wherein the first sub-section includes a central segment and a peripheral segment that are connected to each other, the peripheral segment is located at the periphery of the central segment, the peripheral segment includes a first sub-segment, a second sub-segment and a third sub-segment that are connected to each other, the first sub-segment is connected between the central segment and the second sub-segment, the third sub-segment is connected between the second sub-segment and the second sub-section, the third sub-segment is at least partially in contact with the isolation structure, the thickness of the third sub-segment is less than the thickness of the second sub-section, and the second sub-segment covers a side of the first layer facing the isolation opening; The third subsegment covers a side of the second layer facing the substrate, and the thickness of the third subsegment tends to increase in a direction from the isolation structure to the isolation opening.

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