Interlayer heat dissipation microfluid channel for three-dimensional integrated system and preparation method and application thereof

Abstract

The application relates to an interlayer heat dissipation micro flow channel for a three-dimensional integrated system and a preparation method and application thereof, and belongs to the technical field of semiconductors. The problems that the existing micro flow channel cannot fully utilize the interlayer gap and the heat dissipation path is long are solved. The interlayer heat dissipation micro flow channel comprises a micro flow channel layer, a cover plate layer and a micro heat sink; the materials of the micro flow channel layer and the cover plate layer are resin; the micro heat sink is arranged in the micro flow channel layer; the micro flow channel layer, the micro heat sink and the cover plate layer enclose a flow channel for the flow of cooling medium. The interlayer heat dissipation micro flow channel is an independent micro flow channel which can be flexibly arranged in the gap between different structure layers in a package, the interlayer gap is fully utilized, the interlayer heat dissipation micro flow channel is small in size, can be closely integrated with a high-power chip, the heat dissipation path is effectively shortened, and the heat dissipation effect is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to an interlayer heat dissipation microchannel for three-dimensional integrated systems, its fabrication method, and its application. Background Technology

[0002] With the development of semiconductor technology, chip integration and packaging density are constantly increasing, and the size is constantly shrinking, resulting in a sharp increase in the heat generated per unit area. If the heat cannot be dissipated quickly, the internal temperature of the package structure will rise sharply, which will affect chip performance and cause a series of problems such as thermal mismatch, chip burnout, melting of interconnect metal, and even failure of the entire system.

[0003] Microchannel structures have excellent heat dissipation effects. By absorbing the heat generated by the chip through coolant and transferring it to the outside, they can effectively solve the heat dissipation problem of high-power chips.

[0004] One existing microchannel fabrication approach involves fabricating microchannel structures on silicon or diamond substrates. However, this approach results in microchannels located within a single layer of a 3D integrated system or on its surface, failing to fully utilize interlayer space and exhibiting long surface heat dissipation paths. Furthermore, fabricating microchannels on silicon substrates adds a wafer-level process layer and simultaneously requires meeting the demands of high-frequency electrical signal interconnection and channel interconnection, making the process highly complex. Fabrication on diamond substrates involves drilling processes, which are both costly and technically challenging. Another approach is to fabricate microchannels using machining methods. However, these machined microchannels are typically large and located outside the package, resulting in long heat dissipation paths and ineffective heat removal. Summary of the Invention

[0005] In view of the above analysis, the present invention aims to provide an interlayer heat dissipation microchannel for three-dimensional integrated systems, its preparation method and application, in order to solve at least one of the following problems of existing microchannels: (1) the interlayer space cannot be fully utilized and the heat dissipation path is long; (2) the preparation process of ultra-thin heat dissipation microchannels is difficult; (3) the size is large and needs to be arranged outside the package body, and the heat cannot be effectively carried out.

[0006] On one hand, embodiments of the present invention provide an interlayer heat dissipation microchannel for a three-dimensional integrated system, the interlayer heat dissipation microchannel comprising a microchannel layer, a cover plate layer, and a micro heat sink; the material of the microchannel layer and the cover plate layer is resin;

[0007] The micro heat sink is disposed in the microchannel layer, and the microchannel layer, the micro heat sink and the cover plate layer form a flow channel for the cooling medium to flow.

[0008] Preferably, the micro heat sink has multiple fins on the side near the cover plate layer, and the multiple fins are located in the flow channel.

[0009] Preferably, the fins are arranged in a matrix on the side of the micro-heat sink near the cover plate layer.

[0010] Preferably, the connection surface between the micro heat sink and the microfluidic layer is stepped.

[0011] Preferably, the connection surface of the microchannel layer in contact with the microheat sink forms a stepped connection surface that descends like a staircase from the side of the microchannel layer away from the cover plate layer to the side of the microchannel layer closer to the cover plate layer.

[0012] Preferably, the material of the micro heat sink is a copper-based material and / or a silicon-based material.

[0013] Preferably, the overall thickness of the interlayer heat dissipation microchannel is 300-500 μm.

[0014] Preferably, the cover plate layer is provided with at least one cooling medium inlet and at least one cooling medium outlet.

[0015] Secondly, the present invention provides a method for fabricating interlayer heat dissipation microchannels for three-dimensional integrated systems, the method comprising:

[0016] Step (a): Form a metal sacrificial layer on one side of the glass substrate;

[0017] Step (b): Attach the other side of the glass substrate to the 3D printing platform;

[0018] Step (c): Combine the micro heat sink with the glass substrate;

[0019] Step (d): Print the microchannel layer and the cover plate layer sequentially;

[0020] Step (e): Separate the glass substrate from the 3D printing platform;

[0021] Step (f): Remove the sacrificial layer to separate the microchannel from the glass substrate and obtain the interlayer heat dissipation microchannel for the three-dimensional integrated system.

[0022] Thirdly, the present invention provides the application of the above-mentioned interlayer heat dissipation microchannels in a three-dimensional integrated system.

[0023] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:

[0024] 1. The interlayer heat dissipation microchannel of the present invention is an independent microchannel that can be flexibly arranged in the gaps between different structural layers in the package, making full use of the interlayer gaps. Moreover, the interlayer heat dissipation microchannel is small in size and can be tightly integrated with high-power chips, effectively shortening the heat dissipation path and improving the heat dissipation effect. The microchannel is made of resin material and can be prepared by 3D printing, which is a simple preparation method.

[0025] 2. This invention combines a micro heat sink structure with a 3D-printed microchannel to better transfer heat from the chip to the cooling medium, thus solving the problem of poor heat dissipation in 3D-printed microchannels.

[0026] 3. The connection surface between the microchannel layer and the microheat sink in this invention is a stepped connection, which improves the sealing between the microheat sink and the microchannel layer.

[0027] 4. This invention increases the heat dissipation area and improves the heat dissipation effect by setting fins on the micro heat sink structure.

[0028] 5. This invention uses 3D printing technology to prepare interlayer heat dissipation microchannels, which has low cost, simple process, high precision, and small microchannel size.

[0029] 6. The interlayer heat dissipation microchannel of the present invention is used between the layers of a three-dimensional integrated system. Unlike existing heat dissipation technologies (such as surface heat dissipation), which utilize space, the interlayer heat dissipation microchannel does not conflict with existing heat dissipation technologies and can be combined with them to jointly improve the heat dissipation effect of the three-dimensional integrated system.

[0030] In this invention, the above-described technical solutions can be combined with each other to achieve more preferred combinations. Other features and advantages of this invention will be set forth in the following description, and some advantages may become apparent from the description or be learned by practicing the invention. The objects and other advantages of this invention can be realized and obtained from what is particularly pointed out in the description and drawings. Attached Figure Description

[0031] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts.

[0032] Figure 1 This is a schematic diagram of the interlayer heat dissipation microchannel structure for a three-dimensional integrated system according to the present invention;

[0033] Figure 2 This is a top perspective view of the interlayer heat dissipation microchannels for a three-dimensional integrated system according to the present invention;

[0034] Figure 3 A bottom view of the micro-heat sink;

[0035] Figure 4 To form a metal sacrificial layer on one side of the glass substrate;

[0036] Figure 5 To combine the other side of the glass substrate with the 3D printing platform;

[0037] Figure 6 To combine the micro heat sink with the glass substrate;

[0038] Figure 7 For printing microchannel layers;

[0039] Figure 8 For printing the cover plate layer;

[0040] Figure 9 To separate the glass substrate from the 3D printing platform;

[0041] Figure 10 To obtain interlayer heat dissipation microchannels for use in three-dimensional integrated systems after removing the sacrificial layer;

[0042] Figure 11 This is a schematic diagram of the structure of a microchannel heat dissipation performance testing device for interlayer heat dissipation.

[0043] Figure label:

[0044] 1-Microchannel layer; 2-Cover plate layer; 3-Micro heat sink; 301-Fin; 4-Flow channel; 5-Cooling medium inlet; 6-Cooling medium outlet; 7-Solder ball placement area;

[0045] 8-Glass carrier; 9-Metal sacrificial layer; 10-3D printing platform; 11-Substrate; 12-Thermal test chip. Detailed Implementation

[0046] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which form part of this application and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention.

[0047] On the one hand, the present invention provides an interlayer heat dissipation microchannel for three-dimensional integrated systems, such as... Figures 1-3 As shown, the interlayer heat dissipation microchannel includes a microchannel layer 1, a cover plate layer 2, and a micro heat sink 3; the materials of the microchannel layer 1 and the cover plate layer 2 are both resin.

[0048] The micro heat sink 3 is disposed in the microchannel layer 1, and the microchannel layer 1, the micro heat sink 3 and the cover plate layer 2 form a flow channel 4 for the flow of cooling medium.

[0049] In practice, the interlayer heat dissipation microchannel is placed in any interlayer gap of the three-dimensional integrated system. The layer that needs heat dissipation is placed on the side of the interlayer heat dissipation microchannel with the micro heat sink 3. Cooling medium (e.g., water) is circulated into the channel 4. The layer that needs heat dissipation transfers heat to the micro heat sink. The micro heat sink comes into contact with the cooling medium, so the cooling medium carries away the heat from the micro heat sink, thereby playing a role in heat dissipation. The microchannel is made of resin and can be prepared by 3D printing. The preparation method is simple.

[0050] Compared with the prior art, the interlayer heat dissipation microchannel of the present invention is an independent microchannel that can be flexibly arranged in the gaps between different structural layers in the package, making full use of the interlayer gaps. Moreover, the interlayer heat dissipation microchannel is small in size (down to the micrometer level), which can be tightly integrated with high-power chips, effectively shortening the heat dissipation path and improving the heat dissipation effect.

[0051] In this invention, the microchannel layer 1 and the cover plate layer 2 can be manufactured by 3D printing. The combination of the 3D printed structure and the micro heat sink structure can better transfer heat from the heat dissipation layer to the cooling medium, thus solving the problem of poor heat dissipation effect of 3D printed microchannels.

[0052] For example, the micro heat sink 3 is provided with a plurality of fins 301 on the side near the cover plate layer 2, and the plurality of fins 301 are located in the flow channel 4. The plurality of fins 301 can increase the contact area between the cooling medium and the micro heat sink, thereby improving the heat dissipation effect.

[0053] For example, such as Figure 3 As shown, the fins 301 are cubic blocks, and the cubic blocks of fins 301 are distributed in a matrix on the side of the micro heat sink 3 near the cover plate layer 2.

[0054] For example, the distance between adjacent fins 301 is 100-400 μm.

[0055] For example, the side length of the cross section of the fin 301 facing the cover plate layer 2 is equal to the distance between adjacent fins 301.

[0056] In this invention, if the thickness of the flow channel 4 is too thin or the fins 301 are too short, it will be detrimental to heat dissipation.

[0057] For example, the length of the fin 301 extending from away from the cover plate layer 2 toward closer to the cover plate layer 2 is 50-200 μm, more preferably 100-200 μm.

[0058] For example, the thickness of the flow channel 4 is 70-220 μm, more preferably 120-200 μm.

[0059] For example, the side of the micro heat sink 3 away from the cover layer 2 is flush with the side of the microchannel layer 1 away from the cover layer 2. This facilitates integration with the heat dissipation layer in a three-dimensional integrated system.

[0060] For example, the connection surface between the micro heat sink 3 and the microchannel layer 1 is stepped. This can improve the sealing between the micro heat sink 3 and the microchannel layer 1.

[0061] For example, the connection surface of the microchannel layer 1 that contacts the micro heat sink 3 forms a stepped connection surface resembling a descending staircase, extending from the side of the microchannel layer 1 away from the cover plate layer 2 towards the side of the microchannel layer 1 closer to the cover plate layer 2. In this embodiment, the large contact area between the micro heat sink 3 and the heat dissipation layer facilitates the transfer of heat from the heat dissipation layer to the micro heat sink 3.

[0062] For example, the material of the micro heat sink 3 is a copper-based material and / or a silicon-based material.

[0063] To improve heat dissipation performance, the material of the micro heat sink 3 is preferably a copper-based material, such as copper, which has high thermal conductivity and good machinability.

[0064] In this invention, the interlayer heat dissipation microchannels can be fabricated by 3D printing, and the overall thickness of the interlayer heat dissipation microchannels is 300-500 μm. Specifically, the cover layer 2 has a thickness of 100-150 μm, and the overall thickness of the microchannel layer 1 and the channel 4 is 150-400 μm.

[0065] For example, at least one cooling medium inlet 5 and at least one cooling medium outlet 6 are provided on the cover plate layer 2. Since the overall thickness of the interlayer heat dissipation microchannel is relatively thin, it is not suitable to set the cooling medium inlet and outlet on both sides of the microchannel. Therefore, the inlet and outlet are set on the cover plate layer 2.

[0066] For example, the flow channel 4 includes a plurality of sub-flow channels extending from the cooling medium inlet 5 to the cooling medium outlet 6, with each sub-flow channel having its two ends connected to the cooling medium inlet 5 and the cooling medium outlet 6, respectively.

[0067] For example, a solder ball placement area 7 is provided in the non-channel region of the interlayer heat dissipation microchannel. The solder ball placement area 7 extends through the upper and lower surfaces of the interlayer heat dissipation microchannel.

[0068] Secondly, the present invention also provides a method for preparing interlayer heat dissipation microchannels for three-dimensional integrated systems, for preparing the aforementioned interlayer heat dissipation microchannels, such as... Figures 4-10 As shown, the preparation method includes:

[0069] Step (a): Form a metal sacrificial layer 9 on one side of the glass substrate 8;

[0070] Step (b): Combine the other side of the glass substrate 8 with the 3D printing platform 10;

[0071] Step (c): Combine the micro heat sink 3 with the glass substrate 8;

[0072] Step (d): Print microchannel layer 1 and cover plate layer 2 sequentially;

[0073] Step (e): Separate the glass substrate 8 from the 3D printing platform 10 by prying it open;

[0074] Step (f): Remove the sacrificial layer 9 to separate the microchannel from the glass substrate 8, and obtain the interlayer heat dissipation microchannel for the three-dimensional integrated system.

[0075] For example, in step (a), a metal sacrificial layer 9 is formed on one side of the glass substrate 8 by FHR magnetron sputtering.

[0076] For example, the metal sacrificial layer 9 is made of Cu and / or Au.

[0077] For example, in step (b), the glass substrate 8 is bonded to the 3D printing platform 10 by adhesive.

[0078] For example, the micro heat sink 3 can be fabricated on a copper-based material by processes such as photolithography, etching, and surface treatment. The specific operation steps are conventional in the field and will not be described in detail here.

[0079] For example, in step (c), the micro heat sink 3 is bonded to the glass carrier plate 8 by adhesive.

[0080] For example, in step (d), when printing the cover plate layer 2, a cooling medium inlet 5 and a cooling medium outlet 6 are reserved.

[0081] When interlayer heat dissipation microchannels are applied to three-dimensional radio frequency microsystems, electrical connections, such as solder balls, are required between different structural layers in the package. Therefore, during 3D printing, a solder ball placement area 7 is reserved in the non-channel area of ​​the interlayer heat dissipation microchannel. Simultaneously, the solder ball placement area 7 must avoid the cooling medium inlet 5 and cooling medium outlet 6, such as... Figure 2 As shown.

[0082] For example, in step (d), the 3D printing includes: using projection micro stereolithography (PμSL) based 3D printing technology. First, a three-dimensional structural model is constructed using modeling software; then, slicing software is used to slice the three-dimensional model with a certain layer thickness to obtain a series of two-dimensional images with specific patterns; then, the PμSL 3D printing system is used to project and expose each layer of the sliced ​​pattern onto the entire surface; the previous step is repeated repeatedly and the layers are stacked to finally form the desired three-dimensional structure.

[0083] For example, in step (f), the microchannels are separated from the glass substrate 8 by ablation of the metal sacrificial layer 9 through the glass substrate 8 using a laser.

[0084] Thirdly, the present invention also provides the application of the interlayer heat dissipation microchannels in a three-dimensional integrated system.

[0085] Specifically, the interlayer heat dissipation microchannel is set in any interlayer gap of the three-dimensional integrated system. The layer that needs heat dissipation is set on the side of the interlayer heat dissipation microchannel with micro heat sink 3. Cooling medium (e.g., water) is circulated into the channel 4. The layer that needs heat dissipation transfers heat to the micro heat sink. The micro heat sink comes into contact with the cooling medium, so the cooling medium carries away the heat from the micro heat sink, thereby playing a role in heat dissipation.

[0086] For example, the three-dimensional integrated system is a three-dimensional radio frequency microsystem.

[0087] Compared to existing microchannel structures fabricated on silicon-based materials or diamond, the interlayer heat dissipation microchannels of this invention can be flexibly arranged in the gaps between different structural layers in the package, making full use of the interlayer gaps. Compared to existing microchannels fabricated using machining methods, these interlayer heat dissipation microchannels are smaller in size, enabling tight integration with high-power chips, effectively shortening the heat dissipation path and improving heat dissipation performance.

[0088] The following specific embodiments further illustrate the interlayer heat dissipation microchannels for three-dimensional integrated systems and their fabrication methods.

[0089] In the following embodiments, the method for testing heat dissipation performance is as follows: Figure 11 As shown, a substrate 11 is bonded to the side of the microchannel where the microheat sink is located, and a thermal test chip 12 is embedded in the substrate 11. The thermal test chip 12 is in contact with the microheat sink, and the substrate 11 supplies power to the thermal test chip 12. The difference in applied power per unit area required for the thermal test chip 12 to reach the same temperature before and after the addition of the microchannel (cooling medium is water) is detected. This difference is the heat dissipation capacity of the microchannel. This heat dissipation capacity is the heat dissipation capacity of the interlayer heat dissipation microchannel after it is applied to the three-dimensional integrated system.

[0090] Example 1

[0091] This embodiment provides an interlayer heat dissipation microchannel for a three-dimensional integrated system. The interlayer heat dissipation microchannel includes a microchannel layer 1, a cover layer 2, and a micro heat sink 3. Both the microchannel layer 1 and the cover layer 2 are made of resin. The micro heat sink 3 is disposed in the microchannel layer 1. The microchannel layer 1, the micro heat sink 3, and the cover layer 2 form a flow channel 4 for the flow of cooling medium. The microchannel layer 1 and the cover layer 2 are manufactured by 3D printing.

[0092] The micro heat sink 3 has multiple fins 301 on the side near the cover plate layer 2, and the multiple fins 301 are located in the flow channel 4. The fins 301 are cubic blocks, and the cubic blocks of fins 301 are distributed in a matrix on the side of the micro heat sink 3 near the cover plate layer 2.

[0093] The distance between adjacent fins 301 is 300 μm. The side length of the cross section of the fin 301 facing the cover plate layer 2 is equal to the distance between adjacent fins 301. The length of the fin 301 extending from away from the cover plate layer 2 towards the cover plate layer 2 is 120 μm. The thickness of the flow channel 4 is 140 μm.

[0094] The side of the micro heat sink 3 away from the cover plate layer 2 is flush with the side of the microchannel layer 1 away from the cover plate layer 2.

[0095] The connection surface between the micro heat sink 3 and the microchannel layer 1 is stepped. The connection surface between the microchannel layer 1 and the micro heat sink 3 forms a stepped connection surface with a downward staircase from the side of the microchannel layer 1 away from the cover plate layer 2 to the side of the microchannel layer 1 closer to the cover plate layer 2.

[0096] The material of the micro heat sink 3 is copper.

[0097] The overall thickness of the interlayer heat dissipation microchannel is 420 μm. Among them, the thickness of the cover plate layer 2 is 120 μm, and the thickness of the microchannel layer 1 is 160 μm.

[0098] The cover plate layer 2 is provided with a cooling medium inlet 5 and a cooling medium outlet 6. The flow channel 4 includes multiple sub-flow channels extending from the cooling medium inlet 5 to the cooling medium outlet 6, with each sub-flow channel connected to the cooling medium inlet 5 and the cooling medium outlet 6 at both ends, respectively. The non-flow channel area of ​​the interlayer heat dissipation microchannel is provided with a solder ball placement area 7.

[0099] The microchannel heat dissipation capacity of this embodiment is 850W / cm². 2 .

[0100] Example 2

[0101] This embodiment provides a method for fabricating interlayer heat dissipation microchannels for a three-dimensional integrated system, as described in Embodiment 1, including:

[0102] Step (a): A metal sacrificial layer 9 is formed on one side of a glass substrate 8 by FHR magnetron sputtering; the metal sacrificial layer 9 is made of Cu.

[0103] Step (b): Attach the other side of the glass substrate 8 to the 3D printing platform 10 by adhesive.

[0104] Step (c): The micro heat sink 3 is bonded to the glass substrate 8 by adhesive bonding.

[0105] Step (d): Print the microchannel layer 1 and the cover plate layer 2 in sequence; when printing the cover plate layer 2, reserve the cooling medium inlet 5 and the cooling medium outlet 6; during 3D printing, reserve the solder ball placement area 7 in the non-channel area of ​​the interlayer heat dissipation microchannel.

[0106] Step (e): Separate the glass substrate 8 from the 3D printing platform 10;

[0107] Step (f): The microchannels are separated from the glass substrate 8 by ablation of the metal sacrificial layer 9 through the glass substrate 8 with a laser, thus obtaining the interlayer heat dissipation microchannels for the three-dimensional integrated system.

[0108] Example 3

[0109] This embodiment provides an interlayer heat dissipation microchannel similar to that in Embodiment 1, except that the connection surface between the micro heat sink 3 and the microchannel layer 1 is planar.

[0110] The microchannel water tightness of this embodiment is less than that of Embodiment 1.

[0111] Example 4

[0112] This embodiment provides an interlayer heat dissipation microchannel similar to that in Embodiment 1. The difference is that the connection surface of the microchannel layer in contact with the micro heat sink forms a stepped connection surface that goes up a staircase from the side of the microchannel layer away from the cover plate layer to the side of the microchannel layer closer to the cover plate layer.

[0113] The microchannel heat dissipation capacity of this embodiment is 734W / cm². 2 .

[0114] Example 5

[0115] This embodiment provides an interlayer heat dissipation microchannel similar to that in Embodiment 1, except that the length of the fins is 80 μm.

[0116] The microchannel heat dissipation capacity of this embodiment is 698W / cm². 2 .

[0117] Example 6

[0118] This embodiment provides an interlayer heat dissipation microchannel similar to that in Embodiment 1, except that the length of the fins is 50 μm and the thickness of the channel 4 is 70 μm.

[0119] The microchannel heat dissipation capacity of this embodiment is 557W / cm². 2 .

[0120] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A microchannel for interlayer heat dissipation in a three-dimensional integrated system, characterized in that, The interlayer heat dissipation microchannel includes a microchannel layer, a cover plate layer, and a micro heat sink; Both the microchannel layer and the cover plate layer are made of resin. The micro heat sink is disposed in the microchannel layer, and the microchannel layer, the micro heat sink and the cover plate layer form a flow channel for the cooling medium to flow. The connection surface between the micro heat sink and the microchannel layer is stepped; the connection surface between the microchannel layer and the micro heat sink forms a stepped connection surface with a downward staircase from the side of the microchannel layer away from the cover plate layer to the side of the microchannel layer closer to the cover plate layer. The interlayer heat dissipation microchannels are independent microchannels that can be arranged in the gaps between different structural layers in the package. The overall thickness of the interlayer heat dissipation microchannel is 300-500μm; The micro heat sink has multiple fins on the side near the cover plate layer, and the multiple fins are located in the flow channel; the fins are distributed in a matrix on the side of the micro heat sink near the cover plate layer. The length of the fins extending from the direction away from the cover plate to the direction closer to the cover plate is 50-200 μm; The distance between adjacent fins is 100-400 μm; The side length of the cross section of the fin facing the cover plate layer is equal to the distance between adjacent fins; The thickness of the flow channel is 70-220 μm; The side of the micro heat sink away from the cover plate layer is flush with the side of the microchannel layer away from the cover plate layer; The non-channel area of ​​the interlayer heat dissipation microchannel is provided with a solder ball placement area, which penetrates the upper and lower surfaces of the interlayer heat dissipation microchannel.

2. The interlayer heat dissipation microchannel according to claim 1, characterized in that, The material of the micro heat sink is a copper-based material and / or a silicon-based material.

3. The interlayer heat dissipation microchannel according to claim 1, characterized in that, The cover plate layer is provided with at least one cooling medium inlet and at least one cooling medium outlet.

4. A method for fabricating interlayer heat dissipation microchannels for three-dimensional integrated systems, used to fabricate the interlayer heat dissipation microchannels according to any one of claims 1-3, characterized in that, The preparation method includes: Step (a): Form a metal sacrificial layer on one side of the glass substrate; Step (b): Combine the other side of the glass substrate with the 3D printing platform; Step (c): Combine the micro heat sink with the glass substrate; Step (d): Print the microchannel layer and the cover plate layer sequentially; Step (e): Separate the glass substrate from the 3D printing platform; Step (f): Remove the sacrificial layer to separate the microchannel from the glass substrate and obtain the interlayer heat dissipation microchannel for the three-dimensional integrated system.

5. The application of the interlayer heat dissipation microchannel as described in any one of claims 1-3 in a three-dimensional integrated system.

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