Workpiece cleaning apparatus and cleaning method

Abstract

A cleaning device (1) includes a support (70) that supports a suspension (10), a first piezoelectric element (31, 32) provided on the suspension (10), a second piezoelectric element (41, 42) provided on the suspension (10), an oscillation signal generator (80), and a gas blowing and sucking unit (72). The oscillation signal generator (80) applies an oscillation signal to at least one of the piezoelectric element (31, 32) and the second piezoelectric element (41, 42). A gas, such as air, is blown onto the suspension (10), and in a state in which at least one piezoelectric element (31, 32) (41, 42) is oscillated by the oscillation signal, the gas around the suspension (10) is sucked by the gas blowing and sucking unit (72).

Description

Technical Field

[0001] This invention relates to a cleaning apparatus for cleaning workpieces requiring cleaning, such as disk drives, and a cleaning method. Background Technology

[0002] Disk drives are used in information processing devices, such as personal computers. A disk drive includes a disk that rotates about a spindle, a carriage that rotates about a pivot, and so on. A disk drive suspension is mounted on the arm of the carriage. The disk drive suspension will be referred to simply as the suspension below.

[0003] The suspension includes a base plate, load beam, and bending elements. A slider is mounted on a universal joint formed near the distal end of the bending element. The slider provides elements for accessing data, specifically for reading or writing data stored on a disk. A piezoelectric actuator element is also known to be mounted on the suspension.

[0004] If contaminants such as particles adhere to the suspension, the disk drive can cause serious problems. For example, if particles attached to the suspension surface are shed and get between the disk and the slider, the disk drive may be damaged. Therefore, it is necessary to thoroughly clean the suspension to maintain cleanliness during the disk drive manufacturing process. Typically, the fluid used for cleaning is a liquid, but in some cases, gas is used.

[0005] A cleaning device disclosed in JP 2009-158004 A (Patent Document 1) uses liquid to clean a disk drive. A cleaning device disclosed in JP 2006-116403 A (Patent Document 2) includes an ultrasonic oscillator disposed in a liquid. The liquid is described as being vibrated by the ultrasonic oscillator to vibrate and clean the target. A cleaning device disclosed in JP 5010875B (Patent Document 3) cleans the target by blowing liquid (gas or liquid) onto it.

[0006] Cleaning devices using liquids, such as those disclosed in Patent Documents 1 and 2, require a cleaning tank to contain the liquid. Furthermore, a process is needed to dry the liquid adhering to the target being cleaned. Therefore, these devices present the problem that the cleaning setup becomes large-scale and the drying process takes time. In the cleaning device disclosed in Patent Document 2, a dedicated ultrasonic oscillator for cleaning needs to be installed in the cleaning tank. Moreover, it may not be able to sufficiently generate ultrasonic oscillations on the specific parts of the target being cleaned.

[0007] In cleaning devices that blow fluid toward a target, such as the one disclosed in Patent Document 3, the target may deform due to the expelled fluid. Therefore, when the target is fine, thin, and complex in shape, it can be difficult to effectively clean particles adhering to it in certain situations. In particular, in disk drive suspensions that mount piezoelectric elements, particles can adhere to the mounting portion of the piezoelectric element. Such suspensions require a high degree of cleanliness.

[0008] One embodiment of the present invention aims to provide a cleaning device and a cleaning method capable of effectively cleaning workpieces requiring high cleanliness, such as disk drive suspensions in gases such as air. Summary of the Invention

[0009] One embodiment relates to a cleaning apparatus for cleaning a workpiece. The cleaning apparatus includes a piezoelectric element mounted on the workpiece and a conductive circuit portion disposed on the workpiece and connected to the piezoelectric element. The cleaning apparatus includes a support member supporting the workpiece, an oscillation signal generator, a power connection unit, and a gas jetting mechanism. The oscillation signal generator outputs an oscillation signal to the piezoelectric element through the conductive circuit portion. The power connection unit electrically connects the oscillation signal generator to the conductive circuit portion. The gas jetting mechanism blows air or other gas onto the workpiece while the piezoelectric element is oscillating in response to the oscillation signal.

[0010] According to embodiments of the present invention, workpieces requiring high cleanliness can be effectively cleaned, such as disk drive suspensions in gases such as air.

[0011] In the cleaning apparatus of this embodiment, the oscillation signal may have an oscillation frequency that causes ultrasonic oscillations on the piezoelectric element. The gas jet mechanism may include an electrostatic removal device for ionized gas. The cleaning apparatus of this embodiment may include a suction mechanism that draws in air surrounding the workpiece. An example of the workpiece is a disk drive suspension. The piezoelectric element may be disposed on the actuator mounting portion of the suspension.

[0012] According to one embodiment of the cleaning method, a piezoelectric element is attached to a workpiece, and the workpiece to which the piezoelectric element is attached is supported. In this state, an oscillation signal is output to the piezoelectric element, causing the piezoelectric element to oscillate and vibrate together with the workpiece. Gas is blown onto the workpiece while it is oscillating.

[0013] In this cleaning method of this embodiment, ionized gas can be blown onto the workpiece. An example of such a workpiece is a disk drive suspension. A piezoelectric element can be attached to the actuator mounting portion of the suspension. An oscillating signal of ultrasonic waves can be applied to the piezoelectric element. Furthermore, the workpiece can oscillate together, causing ultrasonic waves to oscillate on the piezoelectric element.

[0014] The workpiece to be cleaned may include a first actuator mounting portion and a second actuator mounting portion, the first actuator mounting portion containing a first piezoelectric element and the second actuator mounting portion containing a second piezoelectric element. In this case, both the first and second piezoelectric elements can oscillate. Alternatively, only the first piezoelectric element can oscillate, or only the second piezoelectric element can oscillate.

[0015] Other objects and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and obtained by means of the tools and combinations particularly pointed out below. Attached Figure Description

[0016] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the general description given above and the detailed description of the embodiments given below, serve to explain the principles of the invention.

[0017] Figure 1 This is a schematic perspective view of a cleaning apparatus and a workpiece according to one embodiment.

[0018] Figure 2 yes Figure 1 A cross-sectional view of a portion of the cleaning device and the workpiece shown.

[0019] Figure 3 This is a plan view of a disk drive suspension as an example of a workpiece.

[0020] Figure 4 yes Figure 3 The diagram shows a cross-sectional view of the actuator mounting section of the suspension.

[0021] Figure 5 It is shown schematically. Figure 1 A perspective view of a portion of the cleaning device probe unit and a portion of the suspension shown. Detailed Implementation

[0022] The following will refer to Figures 1 to 5 A cleaning apparatus and cleaning method according to one embodiment are described. An example of the workpiece is a disk drive suspension. In this specification, the disk drive suspension may also be simply referred to as a suspension. The cleaning apparatus of the embodiment is used for cleaning a suspension, which is a workpiece, in the air. However, the workpiece can be an object other than a suspension.

[0023] Figure 1 This is a schematic perspective view showing the cleaning device 1 and the workpiece W. Figure 2 This is a cross-sectional view showing a portion of the cleaning device 1 and a portion of the workpiece W. Figure 3This is a plan view of a disk drive suspension 10, which serves as an example of workpiece W. Figure 3 The double-headed arrow X1 in the diagram indicates the length direction of suspension 10. Figure 3 The double-headed arrow Y1 in the diagram indicates the width direction of suspension 10. Figure 4 This is a cross-sectional view of a portion of suspension 10. Suspension 10 comes in various types. Figure 3 and Figure 4 Only one example is shown.

[0024] The suspension 10 includes a base plate 11, a load beam 12, and a bending member 13. The bending member 13 includes a curved tail portion 13a extending rearward toward the base plate 11. The tail cushion portion 13b (as shown) Figure 1 (As shown) is formed at the end of the curved tail portion 13a. Tail electrode 14 (schematically shown) Figure 5 (As shown in the image) is located on the tail pad portion 13b. The tail electrode 14 is connected to an amplifier for a disk drive, etc.

[0025] like Figure 3 As shown, the bent member 13 includes a metal base 20 and a conductive circuit portion 21. The conductive circuit portion 21 is disposed along the metal base 20 and is conductive to the tail electrode 14. The metal base 20 is made of stainless steel sheet. The conductive circuit portion 21 includes an insulating layer 22 (partially on...) Figure 4 (shown in the image) and multiple conductors 23 and 24 (partially in the image). Figure 4 (As shown in the image). An insulating layer 22 is formed on a metal base 20. Conductors 23 and 24 are formed on the insulating layer 22.

[0026] A first actuator mounting portion 30 is formed on the base portion side of the load beam 12. A first piezoelectric unit 33, including a pair of first piezoelectric elements 31 and 32, is disposed on the first actuator mounting portion 30. Each of the first piezoelectric elements 31 and 32 is fixed to the first actuator mounting portion 30 by an insulating adhesive. The pair of first piezoelectric elements 31 and 32 have the same configuration.

[0027] Each of the first piezoelectric elements 31 and 32 includes a piezoelectric body, a first electrode, and a second electrode. The piezoelectric body is composed of zirconium titanate (PTZ) or the like. The first piezoelectric elements 31 and 32 can be subjected to voltage through terminals 21a and 21b of the conductive circuit portion 21, respectively.

[0028] When the disk drive is completed and used as a product, a driving voltage is applied to the first piezoelectric elements 31 and 32. When the driving voltage is applied to the first piezoelectric elements 31 and 32, the first piezoelectric elements 31 and 32 expand and contract according to the magnitude and polarity of the voltage. Therefore, the distal end of the load beam 12 can move along the width direction. Figure 3 (The direction indicated by the double-headed arrow Y1).

[0029] A second actuator mounting portion 40 is formed at the distal end of the bent member 13. A second piezoelectric unit 43 is disposed on the second actuator 40. The second piezoelectric unit 43 includes a pair of second piezoelectric elements 41 and 42. Since the second piezoelectric elements 41 and 42 have the same configuration, piezoelectric element 41 will be described as representative in the following description. Figure 4 This is a cross-sectional view of the second actuator mounting portion 40, including the second piezoelectric element 41.

[0030] like Figure 4 As shown, the two ends of the second piezoelectric element 41 are connected to the metal base 20 of the bent member 13 via insulating adhesives 45 and 46, respectively. The second piezoelectric element 41 includes a piezoelectric body 50 formed of PZT or the like, a first electrode 51, and a second electrode 52. The first electrode 51 is electrically connected to the metal base 20 via a conductive member 55 (one of the conductive members) and a conductor 23. The second electrode 52 is connected to a conductor 24 via a conductive member 57, which is another conductive member. Conductors 23 and 24 form part of the conductive circuit section 21.

[0031] When the disk drive is completed and used as a product, a drive voltage is applied to the second piezoelectric elements 41 and 42. When the drive voltage is applied to the second piezoelectric elements 41 and 42, the second piezoelectric elements 41 and 42 expand and contract according to the magnitude and polarity of the voltage. Figure 4 The double-headed arrow X2 indicates the expansion and contraction direction of the second piezoelectric element 41. The distal end of the suspension 10 can be controlled in the sway direction by the expansion and contraction of the second piezoelectric elements 41 and 42 (by...). Figure 3 The double-headed arrow Y2 in the diagram indicates precise movement.

[0032] The suspension 10 in this embodiment includes a first piezoelectric unit 33 and a second piezoelectric unit 43. However, according to suspension specifications, the suspension may include only one of the first piezoelectric unit 33 and the second piezoelectric unit 43. The suspension may also include a third piezoelectric unit.

[0033] The suspension 10 is cleaned during the manufacturing process of the suspension 10. The cleaning device 1 used for cleaning the suspension 10 will be referred to... Figures 1 to 5 As described below, the cleaning device 1 of this embodiment includes first piezoelectric elements 31 and 32 and second piezoelectric elements 41 and 42. The first piezoelectric elements 31 and 32 and the second piezoelectric elements 41 and 42 are mounted on the suspension 10.

[0034] Figure 1The cleaning device 1 shown includes a support member 70, a conveying mechanism 71, and an air-blowing and suction unit 72. The support member 70 holds the suspension 10 in a predetermined position. The conveying mechanism 71 moves the support member 70. The air-blowing and suction unit 72 can be moved along the length of the suspension 10 via a motion mechanism 73. The motion mechanism 73 includes a servo motor 74 as a drive source.

[0035] The cleaning device 1 in this embodiment includes an oscillation signal generator 80, a power connection unit 81, a control unit 82, etc. The power connection unit 81 connects the tail electrode 14 (e.g., Figure 5 (As shown) is electrically connected to the oscillation signal generator 80. The control unit 82 includes the circuit configuration for controlling the cleaning device 1, as well as memory, etc.

[0036] like Figure 1 As shown, a workpiece placement surface 70a is formed on the upper surface of the support 70, and the suspension 10 is placed thereon. The workpiece placement surface 70a is substantially flat. A plurality of suspensions 10 are arranged on the workpiece placement surface 70a at a predetermined spacing P1. These suspensions 10 are interconnected by frame portions 10a and form a sheet-like suspension chain blank. The suspension chain blank is composed of a plurality of suspensions 10, which are connected by frame portions 10a.

[0037] The suspension 10 is placed on the support 70. The conveying mechanism 71 moves along the predetermined interval P1. Figure 1 The support 70 moves intermittently in the direction indicated by the middle arrow M1. An example of the conveying mechanism 71 includes a guide 90 and a drive source 91. The guide 90 extends in the direction of movement of the suspension 10, in other words, in the direction in which the suspension 10 is aligned (indicated by arrow M1).

[0038] An example of a drive source 91 is a servo motor controlled by a control unit 82. The servo motor, acting as the drive source 91, intermittently moves the support member 70 via a force transmission mechanism 92, such as a ball screw. The support member 70 moves along a distance P1. Figure 1 The direction indicated by the middle arrow M1 moves intermittently.

[0039] like Figure 2 As shown, a plurality of suction holes 100 are formed in the workpiece placement surface 70a of the support 70. The suction holes 100 are connected to a negative pressure source 102 via suction pipes 101. An example of a negative pressure source 102 is a suction pump. The negative pressure source 102 generates a negative pressure (below atmospheric pressure). The suction holes 100 draw in air through this negative pressure, thus the suspension 10 is adsorbed onto the workpiece placement surface 70a.

[0040] An example of the power connection unit 81 includes a support structure 110, a tail pad support 111, a probe unit 112, and a drive mechanism 113. The tail pad support 111 is disposed at the lower part of the support structure 110. The probe unit 112 is disposed on the upper side of the support structure 110. The drive mechanism 113 moves the probe unit 112 vertically. A plurality of probes 120, 121, and 122 are disposed on the lower surface of the probe unit 112 (a portion of which is shown in the figure). Figure 5 (Middle). Probes 120, 121 and 122 are connected to the oscillation signal generator 80 via wire 125.

[0041] like Figure 1 As shown, the tail pad portion 13b is placed on the tail pad support 111. In this state, the probe unit 112 moves towards the tail pad portion 13b via the drive mechanism 113. When the probe unit 112 reaches its bottom, probes 120 and 121 contact specific tail electrodes 14a and 14b, respectively, as shown. Figure 5 As shown. Therefore, the first piezoelectric elements 31 and 32 or the second piezoelectric elements 41 and 42 are electrically connected to the oscillation signal generator 80.

[0042] The oscillation signal generator 80 outputs an oscillation signal to induce ultrasonic oscillations in the first piezoelectric elements 31 and 32 and the second piezoelectric elements 41 and 42. In other words, the oscillation signal generator 80 outputs the oscillation signal to the tail electrode 14 of the suspension 10 via the power connection unit 81.

[0043] An oscillation signal input to the tail electrode 14 is applied to the first piezoelectric elements 31 and 32 and the second piezoelectric elements 41 and 42 via the conductive circuit portion 21 of the suspension 10. The first piezoelectric elements 31 and 32 and the second piezoelectric elements 41 and 42 are oscillated by the oscillation signal. When the oscillation signal has an ultrasonic oscillation frequency, ultrasonic oscillations can be induced in the piezoelectric elements 31, 32, 41 and 42.

[0044] The oscillation signal output by the oscillation signal generator 80 is, for example, a sine wave, a square wave, a sawtooth wave, etc. Alternatively, a combination of these oscillation waveforms can be used. For example, the oscillation waveform can be changed according to a sine wave scan. Furthermore, the oscillation waveform can be changed randomly. The oscillation frequencies applied to the first piezoelectric elements 31 and 32 and the oscillation frequencies applied to the second piezoelectric elements 41 and 42 can be different from each other. The oscillation frequencies are, for example, from several kilohertz to several hundred kilohertz, but may differ from this example. Depending on the cleaning purpose, an oscillation signal with a frequency different from that of ultrasonic waves can be used.

[0045] The oscillation frequency can be varied depending on the particle size and the characteristics of the contamination. For example, a low oscillation frequency can be used for relatively large particles, while a high oscillation frequency can be used for fine particles. In the case of the suspension 10, it is preferable to select an oscillation frequency that will not damage the suspension 10.

[0046] like Figure 2 As shown, the air blowing and suction unit 72 includes a gas injection mechanism 130 and a suction mechanism 131. The gas injection mechanism 130 includes a nozzle 140, an air supply source 141, an air inlet pipe 142, a filter 143, and an electrostatic removal device (ion generator) 144. For example, the nozzle 140 ejects a gas such as air. The air supply source 141 supplies compressed air, inert gas, or other gases to the nozzle 140 via the electrostatic removal device 144.

[0047] One example of the electrostatic removal device 144 is to release ions by applying high voltage to a discharge needle. Therefore, ionized gas (e.g., air) is supplied to nozzle 140. That is, gas (e.g., air) supplied from gas supply source 141 is ionized by the electrostatic removal device 144. The gas ionized in this way is ejected from nozzle 140 onto suspension 10. The gas (e.g., air) ejected from nozzle 140 collides with suspension 10 and with reflective workpiece placement surface 70a, such as... Figure 2 As indicated by arrow A in the diagram. The static electricity removal device 144 can be used when static electricity in the suspension 10 does not cause a malfunction.

[0048] The intake mechanism 131 includes an inlet 150, an inlet chamber 151, and an inlet pipe 152. The inlet 150 is formed around the nozzle 140. The inlet chamber 151 is connected to the inlet 150. The inlet pipe 152 is connected to the inlet chamber 151. The inlet pipe 152 is connected to a negative pressure source 102. Gas (e.g., air) drawn in through the inlet 150 enters the negative pressure source 102 through the inlet chamber 151. Gas (e.g., air) entering the negative pressure source 102 is discharged through a filter 153.

[0049] The gas ionized by the electrostatic removal device 144 is sprayed from the nozzle 140 onto the suspension 10. The air blowing and suction unit 72 moves along the length of the suspension 10 while the ionized gas is being sprayed onto the suspension 10. Figure 2 and Figure 3 The double-headed arrow Y3 in the figure indicates the length direction of the suspension 10. The suspension 10 is attracted to the workpiece placement surface 70a by the intake air through the intake hole 100 of the intake workpiece placement surface 70a.

[0050] Ionized gas (e.g., air) is injected from nozzle 140 onto suspension 10 while it is adsorbed onto workpiece placement surface 70a. Simultaneously, the blowing and suction unit 72 moves along the length of suspension 10. Therefore, ionized gas (e.g., air) is continuously blown along the length of suspension 10.

[0051] An ionized gas (e.g., air) is blown onto the suspension 10. This removes static electricity that could be charged onto the suspension 10. Since the suspension 10 is thin, long, and narrow, a portion of its length may deform in the thickness direction when it is electrostatically charged. However, in this embodiment, the suspension 10 is de-energized by the ionized gas, preventing a portion of the suspension 10 from separating from or warping the workpiece placement surface 70a.

[0052] The operation of the cleaning device 1 in this embodiment will be described below. Here, the cleaning of the disk drive suspension 10 will be described. However, the workpiece to be cleaned can be electronic components and mechanical components other than the suspension. In short, as long as the workpiece is clean enough, it will be fine.

[0053] like Figure 1 As shown, the suspension 10 is placed on the workpiece placement surface 70a. The tail pad portion 13b is mounted on the tail pad support 111 connected to the power supply unit 81. The probe unit 112 moves towards the tail pad portion 13b in this state. Figure 5 As shown, probes 120 and 121 are in contact with specific tail electrodes 14a and 14b. These tail electrodes 14a and 14b, for example, the first piezoelectric elements 31 and 32, are conductive through conductive circuit portion 21. Additionally, another probe, probe 122, is in contact with the metal base 20.

[0054] An oscillation signal that causes ultrasonic oscillations is output from an oscillation signal generator 80 to probes 120 and 121. The oscillation signal is applied via specific tail electrodes 14a and 14b, such as first piezoelectric elements 31 and 32. The oscillation signal is, for example, a sine wave, a square wave, a sawtooth wave, etc. Alternatively, the oscillation signal can be a combination of these oscillation waveforms. Furthermore, the oscillation waveform can be changed according to a sine wave scan. The oscillation waveform can be changed randomly.

[0055] Based on the predicted particle or contaminant count, various oscillation waveforms can be used to effectively remove particles or contaminants. For example, low oscillation frequencies can be applied to relatively large particles, while high oscillation frequencies can be applied to fine particles. Oscillating frequencies that minimize damage to the suspension can be used.

[0056] Cleaning of the suspension 10 can be performed by oscillating the suspension 10. In this case, a smaller oscillation frequency may produce a greater cleaning effect in some situations compared to using a larger oscillation frequency. The first oscillation frequency applied to the first piezoelectric elements 31 and 32 and the second oscillation frequency applied to the second piezoelectric elements 41 and 42 may differ from each other, depending on the predicted particles. One of the first piezoelectric elements 31 and 32 or the second piezoelectric elements 41 and 42 may oscillate.

[0057] As described above, the cleaning method of this embodiment includes the following steps:

[0058] (1) Connect the first piezoelectric elements 31 and 32 to the first actuator mounting portion 30 of the suspension 10;

[0059] (2) Connect the second piezoelectric elements 41 and 42 to the second actuator mounting portion 40 of the suspension;

[0060] (3) Place the suspension 10 on the workpiece placement surface 70a of the support 70;

[0061] (4) The suspension 10 is oscillated by ultrasonic oscillations induced by the oscillation signal generator 80 on at least one of the first piezoelectric elements 31 and 32 or on the second piezoelectric elements 41 and 42.

[0062] (5) When the suspension 10 is oscillating, gas is blown onto the suspension 10 via the gas injection mechanism 130; and

[0063] (6) Air around the suspension 10 is drawn in through the air intake mechanism 131.

[0064] The disk drive suspension requires a high degree of cleanliness. When the cleaning device 1 of this embodiment cleans the suspension, the piezoelectric element provided on the actuator mounting portion of the suspension oscillates. Therefore, particles that can adhere to the actuator mounting portion, the surface of the piezoelectric element, etc., can be effectively cleaned.

[0065] The blowing and suction unit 72 of this embodiment includes a nozzle 140 for injecting gas and an inlet 150 for drawing in gas. By blowing gas from the nozzle 140 onto the workpiece, particles can be peeled off the workpiece. The particles peeled off from the workpiece are drawn into the inlet 150 along with the gas. Therefore, the re-adhesion of the particles peeled off from the workpiece can be prevented.

[0066] Undoubtedly, in carrying out this invention, each element constituting the cleaning device can be modified differently. The workpiece to be cleaned can be a suspension that includes only one of a first piezoelectric element and a second piezoelectric element. In a suspension containing both a first and a second piezoelectric element, only the first piezoelectric element or only the second piezoelectric element can oscillate. Furthermore, the workpiece can be an electronic component other than the suspension. In short, this cleaning device can be applied to workpieces intended for cleaning.

[0067] Additional advantages and modifications will readily occur to those skilled in the art. Therefore, the invention is not limited in its broader aspects to the specific details and representative embodiments shown and described herein. Thus, various modifications can be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

Claims

1. A cleaning apparatus for cleaning a workpiece, the workpiece comprising piezoelectric elements (31, 32) (41, 42) and a conductive circuit portion (21), the conductive circuit portion (21) being conductive to the piezoelectric elements (31, 32) (41, 42), the cleaning apparatus characterized in that it comprises: A support member (70) supports the workpiece; An oscillation signal generator (80) outputs an oscillation signal to the piezoelectric elements (31, 32) (41, 42) through the conductive circuit section (21); A power connection unit (81) electrically connects the oscillation signal generator (80) to the conductive circuit part (21). The power connection unit (81) includes a probe unit (112) which is separated from the conductive circuit part (21) before cleaning the workpiece and contacts the conductive circuit part (21) when the workpiece is cleaned. A drive mechanism (113) moves the probe unit (112) between a position where the probe unit (112) is separated from the conductive circuit portion (21) and another position where the probe unit (112) is in contact with the conductive circuit portion (21), and A gas injection mechanism (130) blows gas onto the workpiece while the piezoelectric elements (31,32) (41,42) are oscillating under the influence of the oscillation signal.

2. The cleaning device according to claim 1, characterized in that, The oscillation signal may have an oscillation frequency that causes ultrasonic oscillations on the piezoelectric elements (31,32) (41,42).

3. The cleaning device according to claim 1, characterized in that, The gas injection mechanism (130) includes an electrostatic removal device (144) for ionized gas.

4. The cleaning device according to claim 1, characterized in that, Also includes: A suction mechanism (131) draws in air around the workpiece.

5. The cleaning device according to claim 1, characterized in that, Also includes: The workpiece is a disk drive suspension, and The piezoelectric elements (31, 32) (41, 42) are mounted on the actuator mounting portion (30) (40) of the suspension.

6. A method for cleaning a workpiece in a gas, the workpiece comprising piezoelectric elements (31, 32) (41, 42) and a conductive circuit portion (21), the conductive circuit portion (21) being conductive to the piezoelectric elements (31, 32) (41, 42), characterized in that, The method includes: The workpiece to which the piezoelectric elements (31,32) (41,42) are attached; Using a probe unit (112), which is separated from the conductive circuit portion (21) before cleaning the workpiece and contacts the conductive circuit portion (21) when the workpiece is cleaned; Before cleaning the workpiece, the probe unit (112) is separated from the conductive circuit section (21) by the drive mechanism (113). When cleaning the workpiece, the probe unit (112) is brought into contact with the conductive circuit part (21) by the drive mechanism (113); By applying an oscillating signal to the piezoelectric elements (31,32) (41,42), the piezoelectric elements (31,32) (41,42) oscillate, and the workpiece oscillates; and Gas is blown onto the workpiece while it is oscillating.

7. The method for cleaning a workpiece in a gas according to claim 6, characterized in that... Ionized gas is blown onto the workpiece.

8. The method for cleaning a workpiece in a gas according to claim 6, characterized in that... The workpiece is a disk drive suspension. The oscillation signal for ultrasonic oscillation is applied to the piezoelectric elements (31, 32) (41, 42) fixed to the actuator mounting portions (30) (40), and The piezoelectric elements (31,32) (41,42) are induced to generate ultrasonic oscillations, and the workpiece oscillates.

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